Organic light emitting element and display device including the same

Abstract

An organic light-emitting element (OLED) and a display device including the OLED are provided. The OLED includes a substrate. The OLED further includes a first electrode disposed on the substrate. The OLED also includes a hole-assist layer disposed on the first electrode. The OLED further includes at least one organic light-emitting layer disposed on the hole-assist layer. The OLED further includes an electron-assist layer disposed on the organic light-emitting layer. The OLED further includes at least one adhesive disposed in the organic light-emitting layer and including functional groups secondary-bonded to the organic light-emitting layer. The OLED also includes a second electrode disposed on the electron-assist layer.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0187919, filed on December 17, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This specification relates to organic light-emitting elements and display devices including such organic light-emitting elements. Background Technology

[0004] Display devices that visually display electrical information signals are rapidly developing in response to the information age. Various research efforts are underway to develop thinner, lighter, lower-power display devices with improved performance.

[0005] Representative display devices include liquid crystal displays (LCDs), field emission displays (FEDs), electrowetting displays (EVDs), and organic light-emitting displays (OLEDs).

[0006] Electroluminescent displays, as a representative type of organic light-emitting display device, refer to display devices that emit light autonomously. Unlike liquid crystal displays, electroluminescent displays do not require a separate light source, and therefore can be manufactured into lightweight and thin display devices.

[0007] Furthermore, electroluminescent display devices are advantageous in terms of power consumption because they operate at low voltages. In addition, because electroluminescent display devices excel in color reproduction, response speed, viewing angle, and contrast ratio (CR), they are expected to be used in a variety of fields. Summary of the Invention

[0008] The purpose of this specification is to provide an organic light-emitting element with improved light-emitting characteristics and a display device including the organic light-emitting element.

[0009] Another objective of this specification is to provide an organic light-emitting element that can operate at high temperatures and has thermal stability, as well as a display device including the organic light-emitting element.

[0010] Another objective of this specification is to provide an organic light-emitting element capable of suppressing excessive light leakage current (LLC) and a display device including the organic light-emitting element.

[0011] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not mentioned above will be clearly understood by those skilled in the art from the following description.

[0012] According to one aspect of this disclosure, an organic light-emitting element (OLED) is provided. The OLED includes a substrate. The OLED further includes a first electrode disposed on the substrate. The OLED also includes a hole-assist layer disposed on the first electrode. The OLED further includes at least one organic light-emitting layer disposed on the hole-assist layer. The OLED further includes an electron-assist layer disposed on the organic light-emitting layer. The OLED further includes at least one adhesive disposed in the organic light-emitting layer and including functional groups secondary-bonded to the organic light-emitting layer. The OLED further includes a second electrode disposed on the electron-assist layer.

[0013] According to another aspect of this disclosure, a display device is provided. The display device includes a substrate, the substrate including a display area comprising a plurality of sub-pixels. The display device further includes an organic light-emitting element disposed on the substrate in the display area, the organic light-emitting element including a first electrode, an organic light-emitting portion disposed on the first electrode, and a second electrode disposed on the organic light-emitting portion. The display device further includes a dam disposed on the substrate and including an opening configured to expose the first electrode. The display device further includes at least one adhesive, the at least one adhesive being disposed in the opening and including functional groups of a light-emitting layer secondary bonded to the organic light-emitting portion.

[0014] Further details of the exemplary embodiments are included in the detailed embodiments and the accompanying drawings.

[0015] According to this specification, at least one adhesive may be provided in the organic light-emitting part, thereby improving the light-emitting properties by suppressing initial over-aggregation during the deposition of each layer of the organic light-emitting part.

[0016] According to this specification, an adhesive comprising functional groups capable of secondary bonding (or hydrogen bonding) with the material of the organic light-emitting layer can be provided in the organic light-emitting part, thereby increasing the glass transition temperature (Tg) of the organic light-emitting layer.

[0017] According to this specification, the high thermal stability of the organic light-emitting layer can be ensured, thereby enabling stable operation at high temperatures.

[0018] According to this specification, an organic binder including non-conductive materials can be disposed in the organic light-emitting layer to suppress excessive leakage current flowing along the boundary between organic light-emitting elements.

[0019] According to this specification, the adhesive can be configured to protrude more than the organic light-emitting part, and the top surface of the electrode on the organic light-emitting part can be made uneven, thereby changing the path of light emitted from the organic light-emitting part and suppressing the deterioration of light extraction efficiency.

[0020] According to this specification, the luminous efficiency of organic light-emitting elements can be improved, enabling the organic light-emitting elements to operate with low power consumption.

[0021] The effects described herein are not limited to those described above, and many more effects are included in this disclosure. Attached Figure Description

[0022] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0023] Figure 1 This is a block diagram of a display device according to an embodiment of this specification;

[0024] Figure 2 This is a circuit diagram of the driving circuit of the sub-pixels of a display device according to an embodiment of this specification;

[0025] Figure 3 It is along Figure 1 A cross-sectional view taken from line I-I' in the diagram;

[0026] Figure 4 This is a cross-sectional view of an organic light-emitting element according to an embodiment of this specification;

[0027] Figure 5A This is a top view illustrating an example of the arrangement structure of the adhesive for an organic light-emitting element according to an embodiment of this specification.

[0028] Figure 5B This is a top view illustrating another example of the arrangement structure of the adhesive for an organic light-emitting element according to an embodiment of this specification.

[0029] Figure 5C This is a top view illustrating yet another example of the arrangement structure of the adhesive for an organic light-emitting element according to an embodiment of this specification.

[0030] Figure 6 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification;

[0031] Figure 7This is a cross-sectional view of an organic light-emitting element according to yet another embodiment of this specification;

[0032] Figure 8 This is a cross-sectional view of an organic light-emitting element according to yet another embodiment of this specification;

[0033] Figure 9 This is a cross-sectional view of an organic light-emitting element according to yet another embodiment of this specification;

[0034] Figure 10 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification;

[0035] Figure 11 This is a cross-sectional view of an organic light-emitting element according to yet another embodiment of this specification; and

[0036] Figure 12 This is a cross-sectional view of a sub-pixel of a display device according to another embodiment of this specification. Detailed Implementation

[0037] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become apparent from the exemplary embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided by way of example only so that those skilled in the art can fully understand the disclosure and scope of this disclosure.

[0038] The shapes, dimensions, ratios, angles, quantities, etc., shown in the accompanying drawings used to describe exemplary embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “consisting of” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0039] Even without explicit explanation, components are interpreted as including the normal tolerance range.

[0040] When using terms such as “on top of,” “above,” “below,” and “beside,” to describe the positional relationship between two parts, one or more parts may be located between the two parts, unless these terms are used with the terms “immediately following” or “directly.”

[0041] When an element or layer is placed "on" another element or layer, the other layer or element can be directly inserted on or between the other element.

[0042] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from others. Therefore, the first component referred to below may be the second component in the technical concept of this disclosure.

[0043] Throughout the specification, the same reference numerals generally denote the same elements.

[0044] For ease of description, the dimensions and thickness of each component shown in the accompanying drawings are illustrated, and this disclosure is not limited to the dimensions and thickness of the components shown.

[0045] Features of various embodiments of this disclosure may be combined or integrated with each other in part or in whole, and may be interlocked and operated in various technical ways, and the embodiments may be performed independently or in association with each other.

[0046] In the following, a display device according to an exemplary embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0047] Figure 1 This is a block diagram of a display device according to an embodiment of this specification.

[0048] Figure 2 This is a circuit diagram of the driving circuit for the sub-pixels of a display device according to an embodiment of this specification.

[0049] Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I' in the diagram.

[0050] refer to Figure 1 The display device 100 according to the embodiments of this specification may include an image processor 151, a timing controller 152, a data driver 153, a gate driver 154, and a display panel 110.

[0051] The image processor 151 can output externally provided data signals such as DATA and data enable signals such as DE. In addition to the data enable signal DE, the image processor 151 can also output one or more of the following: a vertical synchronization signal, a horizontal synchronization signal, and a clock signal.

[0052] The timing controller 152 receives a data enable signal DE or a drive signal including a vertical synchronization signal, a horizontal synchronization signal, and a clock signal, as well as a data signal DATA from the image processor 151. Based on the drive signal, the timing controller 152 can output a gate timing control signal GDC for controlling the operating timing of the gate driver 154, and output a data timing control signal DDC for controlling the operating timing of the data driver 153.

[0053] In response to the data timing control signal DDC provided from the timing controller 152, the data driver 153 can sample and latch the data signal DATA provided from the timing controller 152, convert the data signal DATA into a gamma reference voltage, and output the gamma reference voltage. The data driver 153 can output the data signal DATA through data lines DL1 to DLn. The data driver 153 can be provided in the form of an integrated circuit (IC).

[0054] The gate driver 154 can output a gate signal in response to a gate timing control signal GDC supplied from the timing controller 152, while simultaneously shifting the level of the gate voltage. The gate driver 154 can output the gate signal through gate lines GL1 to GLm. The gate driver 154 can be provided as an integrated circuit (IC) or formed on the display panel 110 as a gate in panel (GIP).

[0055] Meanwhile, the data driver 153 and the gate driver 154 can each be implemented as one or more integrated circuits. From the viewpoint of electrical connection with the display panel 110, the data driver 153 and the gate driver 154 can each be implemented as a chip-on-glass (COG) type, a chip-on-film (COF) type, or a tape carrier package (TCP) type.

[0056] The display panel 110 includes a plurality of pixels P, and each of the plurality of pixels P emits light in response to data signals and gate signals supplied from the data driver 153 and the gate driver 154, while displaying an image.

[0057] Let's refer to each other. Figure 1 and Figure 3 In the display device 100 according to an embodiment of this specification, the display panel 110 includes a substrate 111, and a plurality of pixels P are disposed on the substrate 111. In this case, a pixel P may include a plurality of sub-pixels SP_R, SP_G, and SP_B. Figure 1An example is shown where a pixel P includes three sub-pixels SP_R, SP_G, and SP_B configured to emit light beams of different colors. For example, in a display device 100 according to an embodiment of this specification, a pixel P may include a sub-pixel SP_R configured to emit red light, a sub-pixel SP_G configured to emit green light, and a sub-pixel SP_B configured to emit blue light. However, the number of sub-pixels included in a pixel P is not limited thereto. For example, in addition to the sub-pixels configured to emit red, green, and blue light, a pixel P may also include a sub-pixel configured to emit white light.

[0058] The substrate 111 is configured to support various components included in the display device 100. The substrate 111 may be made of an insulating material. Alternatively, the substrate 111 may be made of a flexible, bendable material. Furthermore, the substrate 111 may be made of a transparent material. For example, the substrate 111 may be made of a plastic material such as polyimide. However, this specification is not limited to these.

[0059] Multiple gate lines GL extending in a first direction and multiple data lines DL extending in a second direction different from the first direction are disposed on substrate 111 and intersect each other. In this case, pixel P is defined at the intersection of the multiple gate lines GL and the multiple data lines DL on substrate 111.

[0060] Also refer to Figure 1 and Figure 3 The area on the substrate 111 of the display panel 110 that has a plurality of pixels P configured to realize an image can be defined as the display area AA, and the area located on the outer periphery of the display area AA that does not have a plurality of pixels P can be defined as the non-display area NA.

[0061] A display portion for displaying images can be formed in the display area AA, and a circuit portion for operating the display portion can also be formed in the display area AA. For example, the display device 100 according to an embodiment of this specification can be an organic light-emitting display device. In this case, the display portion can include an organic light-emitting element. That is, the display portion can include an anode, a light-emitting layer on the anode, and a cathode on the light-emitting layer. For example, the organic light-emitting layer can include a hole transport layer, a hole injection layer, an organic light-emitting layer, an electron injection layer, and an electron transport layer. However, this specification is not limited thereto.

[0062] Circuit components may include various transistors, capacitors, and wiring for operating the light-emitting element. Specifically, circuit components may include various constituent elements such as drive transistors, switching transistors, storage capacitors, gate lines, and data lines. However, this specification is not limited thereto.

[0063] For example, the sub-pixels SP_R, SP-G, and SP_B of the display device 100 according to embodiments of this specification may each include a switching transistor, a driving transistor, a capacitor, and a light-emitting element.

[0064] Reference Figure 2 According to the embodiments of this specification, the sub-pixels SP_R, SP_G, and SP_B of the display device 100 may each include a switching transistor ST, a driving transistor DT, a compensation circuit 155, and a light-emitting element 140. Furthermore, each sub-pixel may include wiring connected to a power supply for operating the pixel.

[0065] The light-emitting element 140 can be operated to emit light according to the drive current generated by the drive transistor DT.

[0066] The switching transistor ST can perform a switching operation, such that in response to the gate signal provided through the gate line GL, the data signal provided through the data line DL is stored as a data voltage in the capacitor Cst.

[0067] The driving transistor DT can be operated such that a predetermined driving current flows between the high-potential power line VDD and the low-potential power line GND, and this predetermined driving current corresponds to the data voltage stored in the capacitor Cst.

[0068] The driving circuit for each of the sub-pixels SP_R, SP_G, and SP_B, as described above according to embodiments of this specification, has a 2T (transistor) 1C (capacitor) structure including a switching transistor, a driving transistor, and a capacitor in the display device 100.

[0069] In another example, the driving circuit for each of the sub-pixels SP_R, SP_G, and SP_B of the display device 100 according to an embodiment of this specification may further include a compensation circuit 155. The compensation circuit 155 is a circuit for compensating for the threshold voltage, etc., of the driving transistor. The compensation circuit 155 may include one or more compensation thin-film transistors and one or more compensation capacitors. In this case, the configuration and structure of the compensation thin-film transistors and compensation capacitors are not limited thereto, but can be implemented in various ways depending on the compensation method. For example, when a compensation circuit is added to a sub-pixel, the pixel may have various structures, such as 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, or 7T2C.

[0070] refer to Figure 1 The non-display area NA is the area in which no image is displayed. The non-display area NA is an area where various wiring, circuits, etc., are provided for operating the display unit located in the display area AA.

[0071] The non-display area NA can be defined as the area surrounding the display area AA. However, this specification is not limited to this. For example, the non-display area NA can be defined as the area extending from the display area AA. Furthermore, the non-display area NA can also be defined as extending from multiple sides of the display area AA.

[0072] The non-display area NA may include a pad area configured to receive data drive signals from an external power source, or to send touch signals to or receive touch signals from an external power source. External modules (e.g., driver ICs such as data driver integrated circuits (ICs) or gate driver ICs) may be located in the pad area.

[0073] The driver IC located in the pad area can be connected to multiple wirings, and through these wirings, to multiple data lines DL or multiple gate lines GL located in the display area AA. In other words, the driver IC located in the pad area can be electrically connected to multiple pixels P respectively.

[0074] Reference Figure 3 The description includes a display device with an organic light-emitting element according to embodiments of this specification. Figure 3 A top-emitting light-emitting display device 100 according to an embodiment of this specification is shown. However, this specification is not limited thereto.

[0075] The display device 100 according to the embodiments of this specification includes a substrate 111, a buffer layer 131, a thin film transistor 120, a planarization layer 134, a dam 135, and an organic light-emitting element 140.

[0076] The substrate 111 is used to support and protect the components of the display device disposed on the substrate 111. The substrate 111 can be a rigid substrate or a flexible substrate that can be bent, folded or rolled.

[0077] When the substrate 111 is made of a flexible plastic material, the substrate 110 can be made of, for example, polyimide (PI). When the substrate 111 is made of polyimide (PI), the process of manufacturing the display device 100 can be performed with a support substrate made of glass disposed below the substrate 111, and the support substrate can be released after the process of manufacturing the display device 100 is completed.

[0078] When the substrate 111 is made of polyimide (PI), it can be made of a dipolyimide (PI) material to prevent moisture from penetrating the polyimide (PI) substrate 111 and seeping into the thin-film transistor 120 or the light-emitting element 140, thus preventing performance degradation of the display device 100. The substrate 111 may also include an inorganic film disposed between the dipolyimide (PI) materials. Therefore, the charge on the underlying polyimide (PI) can be blocked, thereby improving product reliability.

[0079] A buffer layer 131 is disposed on the substrate 111. The buffer layer 131 may be a multilayer buffer layer comprising multiple inorganic films.

[0080] The semiconductor layer 121 of the thin-film transistor 120 can be disposed on the buffer layer 131, and the buffer layer 131 can be configured to protect the semiconductor layer 121 and increase the interfacial bonding force of the semiconductor layer 121.

[0081] The display device 100 according to the embodiments of this specification may further include a metal layer disposed beneath any of the multiple layers of the buffer layer 131. This metal layer may be used as a light shield.

[0082] Thin-film transistor 120 is disposed on buffer layer 131.

[0083] The thin-film transistor 120 may include a semiconductor layer 121, a gate electrode 122, a source electrode 123, and a drain electrode 124. Depending on the design of the pixel driving circuit, the source electrode 123 may be the drain electrode, and the drain electrode 124 may be the source electrode.

[0084] The semiconductor layer 121 may include a channel region configured to overlap with the gate electrode 122, and a first region and a second region located on two opposite sides of the channel region and connected to the source electrode 123 and the drain electrode 124, respectively.

[0085] A gate insulating layer 132 is disposed on the semiconductor layer 121 and insulates the semiconductor layer 121 from the gate electrode 122.

[0086] A gate insulating layer 132 can be formed on the entire surface of the display area AA, while simultaneously covering the semiconductor layer 121. The gate insulating layer 132 can be made of an inorganic insulating material, such as silicon dioxide (SiO2), silicon nitride (SiNx), or silicon oxynitride (SiO2). N (or multiple layers thereof. However, this specification is not limited thereto.)

[0087] The gate electrode 122 is disposed on the gate insulating layer 132, and the gate electrode 122 and the semiconductor layer 121 overlap each other, wherein the gate insulating layer 132 is inserted therebetween.

[0088] For example, the gate electrode 122 may be configured as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys. However, this specification is not limited thereto.

[0089] An interlayer insulating layer 133 is disposed on the gate electrode 122.

[0090] Interlayer insulating layer 133 may be formed on the entire surface of display area AA, while covering gate electrode 122. Interlayer insulating layer 133 may be made of the same inorganic insulating material as gate insulating layer 132, such as silicon dioxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), or multiples thereof. However, this specification is not limited thereto.

[0091] The source electrode 123 and the drain electrode 124 are disposed on the interlayer insulating layer 133 and spaced apart from each other.

[0092] The source electrode 123 and the drain electrode 124 are electrically connected to the semiconductor layer 121 through contact holes formed through the interlayer insulating layer 133 and the gate insulating layer 132.

[0093] Figure 3 An example of a thin-film transistor 120 formed in a top-gate configuration is shown, wherein the gate electrode 122 is located above the semiconductor layer 121. However, this specification is not limited thereto. That is, the thin-film transistor 120 may be formed in a bottom-gate configuration, wherein the gate electrode 122 is located below the semiconductor layer 121. Alternatively, the thin-film transistor 120 may be formed in a dual-gate configuration, wherein the two gate electrodes 122 are located above and below the semiconductor layer 121, respectively.

[0094] also, Figure 3 A thin-film transistor 120 corresponding to a sub-pixel is shown. However, the number and type of thin-film transistors 120 corresponding to a sub-pixel are not limited thereto. For example, Figure 3 Only the driving transistor for operating the organic light-emitting element 140, which is a thin-film transistor 120, is shown. However, the sub-pixel may also include a switching transistor corresponding to the light-emitting element.

[0095] A planarization layer 134 may be disposed on the thin-film transistor 120 and on the entire surface of the display area AA. An organic light-emitting element 140 and a dam 135 are disposed on the planarization layer 134. The first electrode 141 of the organic light-emitting element 140 is connected to the drain electrode 124 of the thin-film transistor 120 through a contact hole formed through the planarization layer 134.

[0096] The planarization layer 134 can be configured to arrange the first electrode 141 of the light-emitting element 140 separated by the embankment 135 flatly. For example, the planarization layer 134 can be made of a resin such as photoacrylic acid and polyimide (PI).

[0097] The light-emitting element 140 disposed on the planarization layer 134 can be configured by sequentially stacking a first electrode 141, an organic light-emitting part 142, an adhesive 144 (which is disposed in the organic light-emitting part 142), and a second electrode 143.

[0098] An example will be described in which the display device 100 according to an embodiment of this specification is a top-emitting display device, wherein the emitted light propagates toward a position above a substrate 111 on which a light-emitting element 140 is disposed. In this case, the first electrode (i.e., the anode electrode) 141 of the light-emitting element 140 may further include a transparent conductive layer and a reflective layer on the transparent conductive layer. For example, the transparent conductive layer may be made of a transparent conductive oxide such as ITO or IZO. For example, the reflective layer may be made of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), or alloys thereof.

[0099] The following will refer to Figures 4 to 5C This specification describes in detail the configuration and structure of the organic light-emitting element 140 of the display device 100 according to embodiments thereof.

[0100] In addition, the embankment 135 is disposed on the planarization layer 134 and separates multiple sub-pixels SP_R, SP_G and SP_B.

[0101] The embankment 135 includes an opening portion disposed in the region (i.e., the light-emitting region) that overlaps with the light-emitting element 140 of each of the sub-pixels SP_R, SP_G and SP_B, such that a portion of the first electrode 141 of the light-emitting element 140 is exposed.

[0102] Meanwhile, in the display device 100 according to the embodiment of this specification, an encapsulation layer may be disposed on the light-emitting element 140 and the dam 135. The encapsulation layer may be disposed on the entire surface of the display area AA, while covering the light-emitting element 140. In the display device 100 according to the embodiment of this specification, the organic light-emitting portion 142 of the light-emitting element 140 may be positioned in the opening portion of the dam 135, and the second electrode 143 of the light-emitting element 140 may be positioned in the opening portion of the dam 135, disposed outside the opening portion, and configured to cover the upper part of the dam 135. However, the second electrode 143 of the light-emitting element 140 may have a structure disposed outside the opening portion so as to overlap only a portion of the dam 135. In this case, the encapsulation layer may be configured to directly adjoin the dam 135 and the light-emitting element 140.

[0103] In the display device 100 according to the embodiments of this specification, the color filter layer may be further disposed on the encapsulation layer.

[0104] The color filter layer may include a light-blocking layer and a color filter.

[0105] The light-blocking layer overlaps with the embankment 135 and includes a plurality of openings that overlap with the openings of the embankment 135. For example, the width of the light-blocking layer may be less than the width of the embankment 135, and the width of the openings of the light-blocking layer may be greater than the width of the openings of the embankment 135 that overlap with the openings of the light-blocking layer.

[0106] A light-blocking layer suppresses external light introduced from the outside from being reflected by wiring or other components of the display device 100 and visually perceived by the viewer's eyes. The light-blocking layer can be positioned to overlap with the edge of the area where a light-emitting element is disposed (i.e., the light-emitting area), and the light-blocking layer can absorb the introduced external light and reduce the amount of external light entering the light-emitting area. For example, the light-blocking layer can be a black matrix comprising a black material.

[0107] The color filter can be located on the light-blocking layer, with most of the color filter overlapping an opening in the light-blocking layer, and a portion of the color filter also overlapping the light-blocking layer. For example, the color filter can be configured to have a shape that fills an opening in the light-blocking layer.

[0108] The color filter reduces the degree to which external light introduced from the outside is introduced into the embankment 135, reflected, and visually recognized. Because the color filter does not completely block light, it can suppress the visual recognition of reflected external light without reducing the efficiency of light emitted from the light-emitting layer of the organic light-emitting element 140.

[0109] In the case where the plurality of sub-pixels of the display device 100 according to the embodiments of this specification include an organic light-emitting element 140 configured to output white light, the color filters corresponding to the plurality of sub-pixels SP_R, SP_G and SP_B respectively may be a red color filter configured to convert white light into red light, a blue color filter configured to convert white light into blue light, and a green color filter configured to convert white light into green light.

[0110] In the following text, reference will be made to Figures 4 to 5A The organic light-emitting element 140 of the display device 100 according to the embodiments of this specification is described in detail.

[0111] Figure 4 This is a cross-sectional view of an organic light-emitting element according to an embodiment of this specification.

[0112] refer to Figure 4According to an embodiment of this specification, the organic light-emitting element 140 includes a first electrode 141 and a second electrode 143 configured to face each other, an organic light-emitting portion 142 located between the first electrode 141 and the second electrode 143, and an adhesive 144 disposed in the organic light-emitting portion 142.

[0113] The first electrode 141 may be made of a conductive material having a relatively large work function value. The first electrode 141 may be an anode. The first electrode 141 may include a transparent conductive layer and a reflective layer on the transparent conductive layer. For example, the first electrode 141 may be made of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), indium copper oxide (ICO), or aluminum:zinc oxide (Al:ZnO; AZO). However, this specification is not limited thereto. For example, the reflective layer may be made of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr), alloys thereof, etc.

[0114] The second electrode 143 can be made of a conductive material with a relatively small work function value. The second electrode 143 can be a cathode. For example, the second electrode 143 can be made of aluminum (Al), magnesium (Mg), calcium (Ca), silver (Ag), ytterbium (Yb), or alloys thereof.

[0115] The organic light-emitting unit 142 includes: a hole-assisted layer comprising a hole injection layer HIL and a hole transport layer HTL; an organic light-emitting layer EML comprising a light-emitting material layer; and an electron-assisted layer comprising an electron transport layer ETL and an electron injection layer EIL. However, this specification is not limited thereto.

[0116] The hole injection layer HIL is located between the first electrode 141 and the organic light-emitting layer EML, and the hole transport layer HTL is located between the hole injection layer HIL and the organic light-emitting layer EML.

[0117] The hole injection layer HIL improves the interface properties between the first electrode 141, made of inorganic material, and the hole transport layer HTL, made of organic material. The hole injection layer HIL is disposed on the first electrode 141 and is used to facilitate hole injection.

[0118] For example, the hole injection layer (HIL) can be made of any material selected from the group consisting of: 4,4',4"-tris(3-methylphenylphenylamino)triphenylamine (MTDATA), copper phthalocyanine (CuPc), tris(4-carbazole-9-ylphenyl)amine (TCTA), N,N'-diphenyl-N,N'-bis(1-naphthyl)-1,1'-biphenyl-4,4"-diamine (NPB; NPD), 1,4,5,8,9,11-hexaaza Triphenylhexacyano (HATCN), 1,3,5-tris[4-(diphenylamino)phenyl]benzene (TDAPB), poly(3,4-ethylenedioxythiophene), polystyrene sulfonic acid (PEDOT / PSS), 2,3,5,6-tetrafluoro-7,7,8,8-tetracyano-p-quinone dimethyl ether (F4TCNQ) and / or N-(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazol-3-yl)phenyl)-9H-fluorene-2-amine.

[0119] The hole transport layer HTL is located adjacent to the organic light-emitting layer EML, and the hole transport layer HTL is disposed on the hole injection layer HIL and is used to smoothly transport holes to the organic light-emitting layer EML.

[0120] Hole transport layers (HTLs) can be formed by doping hole transport hosts with organic compounds. Suitable hole transport hosts for HTLs can be materials with high triplet energies. For example, the hole transport host can be a monoamine-based organic material with excellent thermal stability, substituted with a fused aromatic ring. However, this specification is not limited to this.

[0121] For example, the monoamine-based organic material that can be used as the hole transport host in a hole transport layer (HTL) may be selected from the group consisting of: TCTA, tris(trifluorovinyl ether)-tris(4-carbazole-9-ylphenyl)amine (TFV-TCTA), tris[4-(diethylamino)phenyl]amine, -(biphenyl-4-yl)-9,9-dimethyl-N-(4-(9-phenyl-9H-carbazole-3-yl)phenyl)-9H-fluorene-2-amine, tri-p-tolylamine, and / or N-[1,1'-biphenyl]-4-yl-9,9-dimethyl-N-[4-(9-phenyl-9H-carbazole-3-yl)phenyl]amine. However, this specification is not limited thereto.

[0122] The luminescent material layer of an organic light-emitting layer (EML) can be formed by doping a dopant into the host material. For example, in the case where the luminescent material layer emits blue light, the luminescent material layer can be formed by doping a fluorescent dopant into at least one fluorescent host material selected from the group consisting of anthracene derivatives, pyrene derivatives, and perylene derivatives. For example, the blue fluorescent host material may include 4,4'-bis(2,2'-stilbene)-1,1'-biphenyl (DPVBi), 9,10-bis(2-naphthyl)anthracene (ADN), 2,5,8,11-tetratert-butylperylene (TBADN), 2-tert-butyl-9,10-bis(2-naphthyl)anthracene, 2-methyl-9,10-bis(2-naphthyl)anthracene (MADN), and / or 2,2',2"-(1,3,5-phenyltriyl)-tris(1-phenyl-1-H-benzimidazole) (TBPi). However, this specification is not limited thereto.

[0123] In addition, 4,4'-bis(9-ethyl-3-carbazolevinyl)-1,1'-biphenyl (BCzVBi) and / or diphenyl-[4-(2-[1,1;4,1]tetraphenyl-4-yl-vinyl)-phenyl]-amine (BD-1) can be used as blue fluorescent dopant materials.

[0124] Furthermore, in the case where the luminescent material layer emits green light, the luminescent material layer can be formed by doping a phosphorescent dopant made of a metal complex (e.g., dp Ir(acac), op Ir(acac), etc.) into a phosphorescent host material made of a carbazole-based compound.

[0125] Furthermore, in the case where the luminescent material layer emits red light, the luminescent material layer can be formed by doping a phosphorescent dopant made of a metal complex (e.g., Btp Ir(acac) etc.) into a phosphorescent host material made of a carbazole-based compound.

[0126] The electron transport layer ETL is located between the organic light-emitting layer EML and the second electrode 143, and the electron injection layer EIL is located between the electron transport layer ETL and the second electrode 143.

[0127] Electron transport layer (ETL) can be a derivative made from oxadiazole, triazole, benzo[a]phenanthrene, benzo[a]oxazole, benzo[a]thiazole, benzo[a]imidazole, triazine, etc. For example, the electron transport layer (ETL) can be made of electron transport materials such as tris(8-hydroxyquinoline)aluminum (Alq3), 2-biphenyl-4-yl-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (PBD), Spiro-PBD, lithium quinoline (Liq), 2-[4-(9,10-di(2-naphthyl)-2-anthrayl)phenyl]-1-phenyl-1H-benzimidazole, 3-(biphenyl-4-yl)-5-(4-tert-butylphenyl)-4-phenyl-4H-1,2,4-triazole (TAZ), 4,7-diphenyl-1,10-benzophenanthrene (Bphen), tris(benzoxazine) (TPQ), and 1,3,5-tris(N-phenylbenzimidazol-2-yl)benzene (TPBI). However, this specification is not limited thereto.

[0128] An electron transport layer (ETL) can be formed by doping the aforementioned organic materials with metals such as alkali metals and / or alkaline earth metals. Based on the aforementioned organic compounds, alkali metals or alkaline earth metals can be added in a proportion of approximately 1 to 20% by weight. However, this specification is not limited thereto. Alkali metal components that can be used as dopants in an ETL may include alkali metals such as lithium (Li), sodium (Na), potassium (K), and cesium (Cs), and / or alkaline earth metals such as magnesium (Mg), strontium (Sr), barium (Ba), and radium (Ra). However, this specification is not limited thereto. When desired, the ETL can be configured as a two- or more-layered structure instead of a single-layer structure.

[0129] An electron injection layer (EIL) is used to facilitate the injection of electrons from the second electrode 143. Depending on the structure and characteristics of the display device, an EIL may be excluded.

[0130] Alkali metal halide-based materials (e.g., LiF, CsF, NaF, and BaF2) and / or organometallic-based materials (e.g., lithium quinoline (Liq), lithium benzoate, and sodium stearate) can be used as materials for the electron injection layer (EIL). However, this specification is not limited thereto.

[0131] Furthermore, the organic light-emitting element 140 according to embodiments of this specification may include an organic light-emitting layer (EML) made of aromatic hydrocarbons as the main material. In the case of an EML, the organic light-emitting element is exposed to heat generated when the organic light-emitting element is used, or to a high-temperature environment having a glass transition temperature equal to or higher than that of the light-emitting material. Therefore, molecular vibrations, recrystallization, self-aggregation, etc., may occur, which may degrade the performance of the organic light-emitting element 140.

[0132] To suppress this situation, in the organic light-emitting element 140 according to the embodiments of this specification, at least one adhesive 144 may be provided in the organic light-emitting portion 142, the adhesive 144 including functional groups (or functional groups) that are secondary bonded to the organic light-emitting layer EML.

[0133] For example, at least one adhesive 144 may be made of a non-conductive material and may include organic compounds. However, this specification is not limited thereto.

[0134] According to embodiments of this specification, the adhesive 144 may extend in the thickness direction of the organic light-emitting portion 142. For example, the adhesive 144 may be configured to extend from the first electrode 141 in a vertical direction (i.e., the Z direction). However, this specification is not limited thereto.

[0135] Reference Figure 4 At least one adhesive 144 may have a bottom surface adjacent to the first electrode 141 and is configured to penetrate all hole auxiliary layers HIL and HTL, organic light-emitting layer EML, and electron auxiliary layers ETL and EIL.

[0136] In the display device 100 according to an embodiment of this specification, an adhesive 144 may be disposed in an organic light-emitting portion 142, which is disposed on an opening portion of a dam 135. For example, during the manufacturing process of the display device 100, a first electrode 141 and a dam 135 are disposed on a planarization layer 134, at least one adhesive 144 is disposed on the first electrode 141 exposed through an opening portion of the dam 135, the HTL, EML, ETL, and EIL of the organic light-emitting portion 142 are sequentially deposited on the first electrode 141, and then a second electrode 143 is disposed to cover the adhesive 144 and the organic light-emitting portion 142, thereby enabling the implementation of an organic light-emitting element 140. For example, multiple adhesives 144 may be disposed by applying an organic compound material to the first electrode 141 using a coating process and performing ashing treatment at equal intervals based on the center of the sub-pixels. The process method is not limited to this.

[0137] For example, such as Figure 4 As shown, when viewed along the horizontal direction (i.e., the X direction), the first adhesive 144_C can be disposed at the center of the organic light-emitting part 142. Furthermore, a plurality of second adhesives 144_L1, 144_R1, 144_L2, and 144_R2 can be disposed in the organic light-emitting part 142, symmetrically disposed on two opposite sides based on the first adhesive 144_C, and spaced apart from each other. Figure 4An example is shown in which second adhesives 144_L1 and 144_R1 are disposed on two opposite sides based on first adhesive 144_C, and second adhesives 144_L2 and 144_R2 are disposed on two opposite sides based on first adhesive 144_C and disposed outside of second adhesives 144_L1 and 144_R1 (i.e., adjacent to the transverse portion of the embankment 135). The number of second adhesives disposed on the two opposite sides based on first adhesive 144_C is not limited. Figure 4 An example is shown in which multiple adhesives 144_C, 144_L1, 144_R1, 144_L2, and 144_R2 are uniformly arranged such that the distances d1 to d4 between the multiple adhesives 144_C, 144_L1, 144_R1, 144_L2, and 144_R2 are equal. However, this specification is not limited thereto.

[0138] As described above, at least one adhesive 144 is distributed and disposed in the organic light-emitting portion 142, such that when the layer included in the organic light-emitting portion 142 is deposited, the layer of the organic light-emitting portion 142 can be uniformly distributed and disposed by the adhesive 144. Therefore, the initial stress applied to the surface on which the organic light-emitting portion 142 is deposited can be reduced, excessive aggregation can be suppressed, and the light-emitting characteristics can be improved.

[0139] Furthermore, at least one binder 144 may include at least one functional group (e.g., -OH, -F, and CONH) capable of bonding with aromatic hydrogens (a type of secondary bonding). However, this specification is not limited thereto. Compared to the case where no binder 144 is provided in the organic light-emitting portion 142, the molecular vibrational motion of the organic light-emitting layer EML can be suppressed, and when the binder 144 containing functional groups secondary bonded to the organic light-emitting layer EML is provided in the organic light-emitting portion 142, the glass transition temperature (Tg) can be increased. Therefore, recrystallization of the organic light-emitting layer EML can be suppressed, thereby ensuring high thermal stability of the organic light-emitting element 140 and achieving stable high-temperature operation.

[0140] Furthermore, an adhesive 144 made of a non-conductive material is distributed and disposed in the organic light-emitting portion 142, allowing the organic light-emitting layer (EML) to be divided into multiple parts. Therefore, leakage current (LLC) that may flow along the organic light-emitting portion 142 to adjacent sub-pixels can be suppressed.

[0141] Reference Figures 5A to 5C Various examples are described in which at least one adhesive 144 is disposed in an organic light-emitting element 140 according to an embodiment of this specification.

[0142] Figure 5AThis is a top plan view illustrating an example of the arrangement structure of the adhesive for an organic light-emitting element according to an embodiment of this specification.

[0143] Please refer to Figure 5A In any sub-pixel SP, an organic light-emitting part 142 may be disposed on a first electrode 141, and a plurality of adhesives 144 may be disposed in the organic light-emitting part 142 and spaced apart from each other in a first direction (i.e., the Y direction) and a second direction (i.e., the X direction) intersecting the first direction.

[0144] For example, in a subpixel SP, multiple adhesives 144 can be arranged in a dot shape in a planar view. However, this specification is not limited to this. Furthermore, Figure 5A An example is shown in which the adhesive 144 has a cylindrical shape with a circular horizontal cross-section. However, the shape of the horizontal cross-section of the adhesive 144 is not limited to this. For example, the horizontal cross-section of the adhesive 144 can have a polygonal shape. Multiple adhesives 144 are arranged in a dotted pattern as described above, thereby more effectively ensuring the light-emitting area.

[0145] Figure 5B This is a top plan view illustrating another example of the arrangement structure of the adhesive for an organic light-emitting element according to an embodiment of this specification.

[0146] Please refer to Figure 5B In any sub-pixel SP, an organic light-emitting portion 142 may be disposed on a first electrode 141, and a plurality of adhesives 144 may be disposed in the organic light-emitting portion 142, extending integrally in a first direction (i.e., the Y direction) and spaced apart from each other in a second direction (i.e., the X direction) intersecting the first direction. For example, a plurality of adhesives 144, each having a stripe shape in a plan view, may be arranged in a stripe shape in a sub-pixel SP. However, this specification is not limited thereto. Therefore, compared with reference to the... Figure 5A Compared to the described example, when depositing an organic light-emitting layer, the adhesive 144 can further improve the effects of suppressing initial over-aggregation, ensuring thermal stability, and suppressing leakage current.

[0147] Figure 5C This is a top view illustrating yet another example of the arrangement structure of the adhesive for an organic light-emitting element according to an embodiment of this specification.

[0148] Please refer to Figure 5CIn any sub-pixel SP, an organic light-emitting portion 142 is disposed on a first electrode 141. An adhesive 144 may be disposed in the organic light-emitting portion 142 and includes at least one row portion integrally extending in a first direction (i.e., the Y direction) and at least one column portion integrally extending in a second direction (i.e., the X direction) intersecting the first direction. For example, in a sub-pixel SP, the adhesive 144 may be arranged in a grid shape in a plan view. However, this specification is not limited thereto. Therefore, with reference to... Figure 5A and Figure 5B Compared to the described example, when depositing an organic light-emitting layer, the adhesive 144 can further improve the effects of suppressing initial over-aggregation, ensuring thermal stability, and suppressing leakage current.

[0149] In the following text, reference will be made to Figures 6 to 8 The structure of the organic light-emitting element of the display device according to various other embodiments of this specification is described in detail. Apart from the adhesive arrangement structure, refer to... Figures 6 to 8 The organic light-emitting elements of the display devices described in various embodiments according to this specification are configured similarly to those referenced above. Figures 1 to 5C The organic light-emitting element 140 of the display device 100 described according to the embodiments of this specification is substantially the same or similar. Therefore, for ease of description, repeated descriptions will be omitted.

[0150] Figure 6 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification.

[0151] Reference Figure 6 According to another embodiment of this specification, at least one adhesive 144-1 may be provided in the organic light-emitting element 140-1, and the at least one adhesive 144-1 may be provided in the edge region of the organic light-emitting portion 142. For example, a first adhesive 144-L may be provided in one side edge region of the organic light-emitting portion 142, and a second adhesive 144-R may be provided in the other side edge region of the organic light-emitting portion 142. Furthermore, the adhesive may not be provided in areas of the organic light-emitting element 140-1 other than the edge regions.

[0152] For example, the two opposing side edge regions of the organic light-emitting portion 142, where the first adhesive 144_L and the second adhesive 144_R are disposed, can be regions adjacent to the lateral portion of the embankment 135. Furthermore, as... Figure 6As shown, the first adhesive 144_L and the second adhesive 144_R may have a bottom surface adjacent to the first electrode 141 and are configured to penetrate all hole-assisted layers HIL and HTL, organic light-emitting layer EML, and electron-assisted layers ETL and EIL. Therefore, leakage current (LLC) that may flow along the organic light-emitting portion 142 to adjacent sub-pixels can be suppressed. Furthermore, the area occupied by the adhesive 144-1 in the organic light-emitting portion 142 can be minimized, thereby ensuring the light-emitting area of ​​the organic light-emitting element 140-1 and improving luminous efficiency.

[0153] Figure 7 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification.

[0154] Reference Figure 7 In another embodiment of the organic light-emitting element 140-2 according to this specification, at least one adhesive 144-2 may be provided only in the organic light-emitting layer EML of the organic light-emitting part 142.

[0155] For example, such as Figure 7 As shown, at least one adhesive 144-2 may have a bottom surface adjacent to the top surface of the hole transport layer HTL, penetrate the organic light-emitting layer EML, and have a top surface adjacent to the bottom surface of the electron transport layer ETL.

[0156] For example, in the process of manufacturing the display device 100, a first electrode 141 and a dam 135 are disposed on a planarization layer 134, hole auxiliary layers HIL and HTL are deposited on the first electrode 141 exposed through the opening portion of the dam 135, at least one adhesive 144-2 is disposed on the hole auxiliary layers HIL and HTL, the remaining layers EML, ETL and EIL of the organic light-emitting portion 142 are sequentially deposited on the hole auxiliary layers HIL and HTL, and then a second electrode 143 is disposed to cover the adhesive 144-2 and the organic light-emitting portion 142, so that the organic light-emitting element 140-2 can be implemented.

[0157] For example, such as Figure 7 As shown, when viewed in the horizontal direction, the first adhesive 144_C' can be disposed at the center of the organic light-emitting layer EML. Furthermore, a plurality of second adhesives 144_L1', 144_R1', 144_L2', and 144_R2' can be disposed in the organic light-emitting layer EML, symmetrically disposed on two opposite sides based on the first adhesive 144_C', and spaced apart from each other. Figure 7An example is shown in which second adhesives 144_L1' and 144_R1' are disposed on two opposite sides based on first adhesive 144_C', and second adhesives 144_L2' and 144_R2' are disposed on two opposite sides based on first adhesive 144_C' and disposed outside of second adhesives 144_L1' and 144_R1' (i.e., adjacent to the transverse portion of embankment 135). The number of second adhesives disposed on the two opposite sides based on first adhesive 144_C' is not limited.

[0158] As described above, at least one adhesive 144-2 is distributed and disposed in the organic light-emitting layer EML, such that when the layer included in the organic light-emitting portion 142 is deposited, the layer of the organic light-emitting portion 142 can be uniformly distributed through the adhesive 144-2. Therefore, the initial stress applied to the surface on which the organic light-emitting portion 142 is deposited can be reduced, excessive aggregation can be suppressed, and the light-emitting characteristics can be improved.

[0159] Furthermore, the influence of the adhesive on the easily deteriorated organic light-emitting layer (EML) can be ensured, and the resistance caused by the adhesive, which is made of non-conductive material, in the organic light-emitting part 142 can be minimized, thereby improving the luminous efficiency.

[0160] Figure 8 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification.

[0161] refer to Figure 8 According to another embodiment of this specification, at least one adhesive 144-3 may be disposed in the edge region of the organic light-emitting element 140-3. In this case, at least one adhesive 144-3 may be disposed only in the organic light-emitting layer (EML) of the organic light-emitting portion 142.

[0162] For example, in the organic light-emitting element 140-3, the first adhesive 144_L' may be disposed in one side edge region of the organic light-emitting portion 142, and the second adhesive 144_R' may be disposed in the other side edge region of the organic light-emitting portion 142. Alternatively, the adhesive may not be disposed in any region of the organic light-emitting element 140-3 other than the edge region.

[0163] For example, the two opposing side edge regions of the organic light-emitting portion 142, where the first adhesive 144_L' and the second adhesive 144_R' are disposed, can be regions adjacent to the lateral portion of the embankment 135. Furthermore, as... Figure 8 As shown, the first adhesive 144_L' and the second adhesive 144_R' may have a bottom surface adjacent to the top surface of the hole transport layer HTL, penetrate the organic light-emitting layer EML, and have a top surface adjacent to the bottom surface of the electron transport layer ETL.

[0164] Therefore, leakage current (LLC) that may flow along the organic light-emitting portion 142 to adjacent sub-pixels can be suppressed. Furthermore, the light-emitting area of ​​the organic light-emitting element 140-3 can be ensured and luminous efficiency improved. Additionally, the influence of the adhesive on the easily degraded organic light-emitting layer EML can be minimized, and the resistance caused by the adhesive, made of non-conductive material, in the organic light-emitting portion 142 is reduced, thereby improving luminous efficiency.

[0165] In the following text, reference will be made to Figure 9 and Figure 10 The structure of the organic light-emitting element of the display device according to various other embodiments of this specification is described in detail. Apart from the structure of the organic light-emitting portion, refer to... Figure 9 and Figure 10 The organic light-emitting elements described in the various embodiments according to this specification are configured similarly to those referenced above. Figures 4 to 8 Various examples of organic light-emitting elements in the display device 100 according to embodiments of this specification are substantially the same or similar. Therefore, repeated descriptions will be omitted for ease of description.

[0166] The above has been referenced to Figure 4 to 4. Figure 8 An example of an organic light-emitting element having a single-stacked structure including an organic light-emitting part is described. Instead, refer to... Figure 9 and 10 An example is described in which the organic light-emitting element has a series structure configured by stacking two or more organic light-emitting parts.

[0167] Figure 9 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification.

[0168] Reference Figure 9 According to another embodiment of this specification, the organic light-emitting part 142 of the organic light-emitting element 140-4 may include a first organic light-emitting part, a second organic light-emitting part, and a charge generating layer disposed between the first organic light-emitting part and the second organic light-emitting part.

[0169] For example, the first organic light-emitting portion of the organic light-emitting element 140-4 includes: a first hole auxiliary layer including a hole injection layer HIL and a first hole transport layer HTL1; a first organic light-emitting layer EML1 including a luminescent material layer; and a first electron auxiliary layer including a first electron transport layer ETL1. However, this specification is not limited thereto. Furthermore, the second organic light-emitting portion of the organic light-emitting element 140-4 includes: a second hole auxiliary layer including a second hole transport layer HTL2; a second organic light-emitting layer EML2 including a luminescent material layer; and a second electron auxiliary layer including a second electron transport layer ETL1 and an electron injection layer EIL. However, this specification is not limited thereto. For example, the first organic light-emitting layer EML1 and the second organic light-emitting layer EML2 may include luminescent material layers configured to emit light beams of the same color. However, this specification is not limited thereto. For example, the first organic light-emitting layer EML1 and the second organic light-emitting layer EML2 may include luminescent material layers configured to emit light beams of different colors. Furthermore, Figure 9 An example of an organic light-emitting element 140-4 with a structure in which a first organic light-emitting portion and a second organic light-emitting portion are stacked is shown. However, this specification is not limited thereto. For example, the organic light-emitting element 140-4 may have a series structure in which two or more organic light-emitting portions are stacked. At least some of the two or more organic light-emitting portions may include an organic light-emitting layer configured to emit light beams of the same or different colors.

[0170] Furthermore, in order to achieve improved light emission by connecting multiple organic light-emitting units, a charge generation layer (CGL) can be provided between the first and second organic light-emitting units of the organic light-emitting element 140-4. For example... Figure 9 As shown, charge generation layers n-CGL and p-CGL can be disposed above the first electron transport layer ETL1 of the first organic light-emitting portion, and the second hole transport layer HTL2 of the second organic light-emitting portion can be disposed above the charge generation layers n-CGL and p-CGL. However, this specification is not limited thereto. For example, only one n-type charge generation layer n-CGL or p-type charge generation layer p-CGL can be provided as the charge generation layer.

[0171] For example, an n-type charge generation layer n-CGL can be configured as an organic layer made by doping a hole injection layer with materials such as F4-TCNQ (2,3,5,6-tetrafluoro-7,7,8,8-tetracyano-p-quinone dimethane), FeCl, FeF, or SbCl. Similarly, a p-type charge generation layer p-CGL can be configured as an organic layer made by doping an electron transport layer with materials such as alkali metals (e.g., lithium (Li), sodium (Na), potassium (K), or cesium (Cs)) or alkaline earth metals (e.g., magnesium (Mg), strontium (Sr), barium (Ba), or radium (Ra)).

[0172] like Figure 9 As shown, in another embodiment of the organic light-emitting element 140-4 according to this specification, at least one adhesive 144-4 may have a bottom surface adjacent to the first electrode 141 and is configured to penetrate all the first hole auxiliary layers HIL and HTL1, the first organic light-emitting layer EML1, the first electron auxiliary layer ETL11, the charge generation layers n-CGL and p-CGL, the second hole auxiliary layer HTL2, the second organic light-emitting layer EML2, and the second electron auxiliary layers ETL2 and EIL.

[0173] For example, when viewed in a horizontal direction, the first adhesive 144_C' can be disposed at the center of the organic light-emitting part 142. Furthermore, a plurality of second adhesives 144_L1'', 144_R1'', 144_L2'', and 144_R2'' can be disposed in the organic light-emitting part 142, symmetrically disposed on two opposite sides based on the first adhesive 144_C', and spaced apart from each other. Figure 9 An example is shown in which second adhesives 144_L1'' and 144_R1'' are disposed on two opposite sides based on first adhesive 144_C', and second adhesives 144_L2'' and 144_R2'' are disposed on two opposite sides based on first adhesive 144_C' and disposed outside of second adhesives 144_L1'' and 144_R1'' (i.e., disposed adjacent to the transverse portion of embankment 135). The number of second adhesives disposed on two opposite sides based on first adhesive 144_C' is not limited.

[0174] In another example, similar to the reference above. Figure 6 In the described structure, in the organic light-emitting element 140-4, at least one adhesive 144-4 may be disposed in the edge region of the organic light-emitting portion 142, and the adhesive may not be disposed in the region of the organic light-emitting element 140-4 other than the edge region.

[0175] Figure 10 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification.

[0176] refer to Figure 10 According to another embodiment of this specification, the organic light-emitting part 412 of the organic light-emitting element 140-5 may include a first organic light-emitting part, a second organic light-emitting part, and a charge-generating layer disposed between the first organic light-emitting part and the second organic light-emitting part.

[0177] In another embodiment of the organic light-emitting element 140-5 according to this specification, at least one adhesive 144-5 may be provided only in the organic light-emitting layer of the first organic light-emitting part and the second organic light-emitting part.

[0178] For example, at least one adhesive 144-2 may include a first adhesive portion disposed in the first organic light-emitting layer of the first organic light-emitting portion and a second adhesive portion disposed in the second organic light-emitting layer of the second organic light-emitting portion.

[0179] Reference Figure 10 The first adhesive portions 144_BL2, 144_BL1, 144_BC, 144_BR1, and 144_BR2 may have a bottom surface adjacent to the top surface of the first hole transport layer HTL1, penetrate the first organic light-emitting layer EML1, and have a top surface adjacent to the bottom surface of the first electron transport layer ETL1. The second adhesive portions 144_TL2, 144_TL1, 144_TC, 144_TR1, and 144_TR2 may have a bottom surface adjacent to the top surface of the second hole transport layer HTL2, penetrate the second organic light-emitting layer EML2, and have a top surface adjacent to the bottom surface of the second electron transport layer ETL2. The first adhesive portions 144_BL2, 144_BL1, 144_BC, 144_BR1 and 144_BR2 can be referred to as the lower adhesive, and the second adhesive portions 144_TL2, 144_TL1, 144_TC, 144_TR1 and 144_TR2 can be referred to as the upper adhesive.

[0180] For example, when viewed in the horizontal direction, in the lower adhesive, the first lower adhesive 144_BC can be disposed at the center of the first organic light-emitting layer EML1. Furthermore, in the lower adhesive, a plurality of second lower adhesives 144_BL1, 144_BR1, 144_BL2, and 144_BR2 can be disposed in the first organic light-emitting layer EML, symmetrically disposed on two opposite sides based on the first lower adhesive 144_BC, and spaced apart from each other. Figure 10 An example is shown in which second lower adhesives 144_BL1 and 144_BR1 are disposed on two opposite sides based on first lower adhesive 144_BC, and second lower adhesives 144_BL2 and 144_BR2 are disposed on two opposite sides based on first lower adhesive 144_BC and disposed outside of second lower adhesives 144_BL1 and 144_BR1 (i.e., adjacent to the transverse portion of embankment 135). The number of second lower adhesives disposed on two opposite sides based on first lower adhesive 144_BC is not limited.

[0181] Furthermore, when viewed horizontally, the first upper adhesive 144_TC can be disposed at the center of the second organic light-emitting layer EML2. Additionally, multiple second upper adhesives 144_TL1, 144_TR1, 144_TL2, and 144_TR2 can be disposed within the second organic light-emitting layer EML2, symmetrically disposed on two opposite sides based on the first upper adhesive 144_TC, and spaced apart from each other. Figure 10 An example is shown in which second upper adhesives 144_TL1 and 144_TR1 are disposed on two opposite sides based on first upper adhesive 144_TC, and second upper adhesives 144_TL2 and 144_TR2 are disposed on two opposite sides based on first upper adhesive 144_TC and disposed outside of second upper adhesives 144_TL1 and 144_TR1 (i.e., adjacent to the transverse portion of embankment 135). The number of second upper adhesives disposed on two opposite sides based on first upper adhesive 144_TC is not limited.

[0182] In another example, similar to the reference above. Figure 6 In the described structure, in the organic light-emitting element 140-5, at least one adhesive 144-5 may be disposed in the edge region of the organic light-emitting portion 142, and the adhesive may not be disposed in the region of the organic light-emitting element 140-5 other than the edge region.

[0183] In the following text, reference will be made to Figure 11 This specification describes in detail the structure of an organic light-emitting element in a display device according to another embodiment of the present specification. Except for the partial structure of the adhesive and the second electrode, see reference... Figure 11 The organic light-emitting element described according to another embodiment of this specification is configured similarly to the one referenced above. Figures 4 to 10 The various examples of organic light-emitting elements described according to embodiments of this specification are substantially the same or similar. Therefore, for ease of description, repeated descriptions will be omitted.

[0184] Figure 11 This is a cross-sectional view of an organic light-emitting element according to another embodiment of this specification.

[0185] Reference Figure 11In another embodiment of the organic light-emitting element 140-6 according to this specification, at least one adhesive 144-6 is disposed in the organic light-emitting portion 142, and one end of the adhesive 144-6 protrudes further toward the second electrode 143 than the organic light-emitting portion 142. Using at least one adhesive 144-6, the top surface of the second electrode 143 can have a non-planar structure. The height of at least one adhesive 144-6, measured from the first electrode 141, can be greater than the height of the electron auxiliary layer (ETL) and the electron interlayer (EIL), measured from the first electrode 141. In this case, the region of the top surface of the second electrode 143 overlapping with at least one adhesive 144-6 and the region of the top surface of the second electrode 143 not overlapping with at least one adhesive 144-6 can have different heights.

[0186] For example, such as Figure 11 As shown, the top surface of the second electrode 143 may have a protrusion 143p in the region overlapping with a protruding end of the adhesive 144-6. Therefore, the path of a portion of the light emitted from the organic light-emitting unit 142 can be altered by the protruding regions of the multiple second electrodes 143, thereby improving light extraction efficiency. For example, the propagation path of light emitted from the organic light-emitting unit 142 can be guided to the light-emitting surface, and light totally reflected in the organic light-emitting unit 142 can be emitted towards the light-emitting surface, thereby suppressing or minimizing the degradation of light extraction efficiency caused by light trapped in the organic light-emitting unit 142.

[0187] Reference Figure 11 In another embodiment of the organic light-emitting element 140-6 according to this specification, at least one adhesive 144-6 may have a bottom surface adjacent to the first electrode 141, penetrating all hole auxiliary layers HIL and HTL, organic light-emitting layer EML, and electron auxiliary layers ETL and EIL, and a top surface adjacent to the second electrode 143 and protruding further beyond the electron auxiliary layers ETL and EIL.

[0188] For example, when viewed in a horizontal direction, the first adhesive 144_PC can be disposed at the center of the organic light-emitting part 142. In addition, a plurality of second adhesives 144_PL1, 144_PR1, 144_PL2 and 144_PR2 can be disposed in the organic light-emitting part 142, symmetrically disposed on two opposite sides based on the first adhesive 144_PC, and spaced apart from each other. Figure 10An example is shown in which second adhesives 144_PL1 and 144_PR1 are disposed on two opposite sides based on first adhesive 144_PC, and second adhesives 144_PL2 and 144_PR2 are disposed on two opposite sides based on first adhesive 144_PC and disposed outside of second adhesives 144_PL1 and 144_PR1 (i.e., adjacent to the transverse portion of the embankment 135). The number of second adhesives disposed on the two opposite sides based on first adhesive 144_PC is not limited.

[0189] In another example, similar to the reference above. Figure 6 In the described structure, in the organic light-emitting element 140-6, at least one adhesive 144-6 may be disposed in the edge region of the organic light-emitting portion 142, and the adhesive may not be disposed in the region of the organic light-emitting element 140-6 other than the edge region.

[0190] In yet another example, similar to the reference above. Figure 9 and Figure 10 The described structure indicates that the organic light-emitting portion 412 of the organic light-emitting element 140-6 may include a first organic light-emitting portion, a second organic light-emitting portion, and a charge-generating layer disposed between the first organic light-emitting portion and the second organic light-emitting portion.

[0191] In the following text, reference will be made to Figure 12 This specification describes a display device according to another embodiment of the present specification. Except for a portion of the structure of the organic light-emitting element 140', see reference ... Figure 12 The display device described according to another embodiment of this specification is configured similarly to the one referenced above. Figures 1 to 11 The display devices described according to the embodiments of this specification are substantially the same or similar. Therefore, for ease of description, repeated descriptions will be omitted.

[0192] Figure 12 This is a cross-sectional view of a sub-pixel of a display device according to another embodiment of this specification.

[0193] Figure 12 A cross-section of a portion of a display panel according to another embodiment of the display device of this specification is shown, and a cross-section is shown in relation to the above reference. Figures 1 to 3 This describes an example of the structure of a subpixel SP_R' that is the same as the subpixel SP_R emitting red light among multiple subpixels SP_R, SP_G, and SP_B included in a pixel P. However, the type of subpixel is not limited to this.

[0194] Reference Figure 12In another embodiment of the organic light-emitting element 140' according to this specification, the organic light-emitting portion 142' can fill the opening of the dam portion 135 and is configured to cover the sides and top of the dam portion 135, and the second electrode 143 can be disposed on the organic light-emitting portion 142'. Furthermore, at least one adhesive 144 can be disposed on the opening of the dam portion 135 and in the organic light-emitting portion 142'.

[0195] For example, at least one adhesive 144 may have a bottom surface adjacent to the first electrode 141, penetrating the hole-assisted layer, the organic light-emitting layer and the electron-assisted layer, and a top surface adjacent to the second electrode 143.

[0196] At least one adhesive 144 may be disposed in at least one of the two opposite side edge regions of the organic light-emitting portion 142', and in a region adjacent to the lateral portion of the embankment 135. Therefore, even with a structure where the organic light-emitting element 142' is disposed above the embankment 135, leakage current (LLC) that may flow along the organic light-emitting portion 142 to adjacent sub-pixels can be suppressed. Furthermore, the light-emitting area of ​​the organic light-emitting element 140-1 can be ensured and the luminous efficiency improved.

[0197] Exemplary embodiments of this disclosure can also be described as follows:

[0198] According to one aspect of this disclosure, an organic light-emitting element (OLED) is provided. The OLED includes a substrate. The OLED further includes a first electrode disposed on the substrate. The OLED also includes a hole-assist layer disposed on the first electrode. The OLED further includes at least one organic light-emitting layer disposed on the hole-assist layer. The OLED further includes an electron-assist layer disposed on the organic light-emitting layer. The OLED further includes at least one adhesive disposed in the organic light-emitting layer and containing functional groups tiered with the organic light-emitting layer. The OLED also includes a second electrode disposed on the electron-assist layer.

[0199] At least one adhesive may be disposed from the first electrode in a vertical direction.

[0200] At least one adhesive may have a bottom surface adjacent to the first electrode and may penetrate the hole-assisted layer, the organic light-emitting layer and the electron-assisted layer.

[0201] At least one adhesive may include a first adhesive disposed at the center of the organic light-emitting layer.

[0202] The at least one adhesive may also include a plurality of second adhesives, which are symmetrically disposed on two opposite sides and spaced apart from each other based on the first adhesive.

[0203] At least one adhesive may be at a height greater than that of the electronic auxiliary layer measured from the first electrode.

[0204] The area on the top surface of the second electrode that overlaps with at least one adhesive and the area on the top surface of the second electrode that does not overlap with at least one adhesive may have different heights.

[0205] At least one adhesive may include: a first adhesive disposed in one side edge region of the organic light-emitting layer, and a second adhesive disposed in the other side edge region of the organic light-emitting layer.

[0206] At least one adhesive may have a bottom surface adjacent to the top surface of the hole-assisting layer, penetrate the organic light-emitting layer, and have a top surface adjacent to the bottom surface of the electron-assisting layer.

[0207] At least one adhesive may include a first adhesive disposed at the center of the organic light-emitting layer.

[0208] At least one adhesive may also include a plurality of second adhesives, which are symmetrically disposed on two opposite sides and spaced apart from each other based on the first adhesive.

[0209] The at least one adhesive may include: a first adhesive disposed in one side edge region of the organic light-emitting layer, and a second adhesive disposed in the other side edge region of the organic light-emitting layer.

[0210] At least one adhesive may include a plurality of first adhesives, the plurality of first adhesives being spaced apart from each other in a first direction and a second direction intersecting the first direction in a plan view.

[0211] The at least one adhesive may include a plurality of first adhesives that extend integrally in a first direction in a plan view and are spaced apart from each other in a second direction intersecting the first direction.

[0212] In a plan view, at least one adhesive may be arranged in a grid shape.

[0213] According to another aspect of this disclosure, a display device is provided. The display device includes a substrate, the substrate including a display area. The display area includes a plurality of sub-pixels. The display device further includes an organic light-emitting element disposed on the substrate in the display area and including a first electrode, an organic light-emitting portion disposed on the first electrode, and a second electrode disposed on the organic light-emitting portion. The display device further includes a dam disposed on the substrate and including an opening configured to expose the first electrode. The display device further includes at least one adhesive disposed in the opening and including functional groups of a light-emitting layer secondary bonded to the organic light-emitting portion.

[0214] The organic light-emitting portion may include a hole-assisting layer disposed on a first electrode, at least one organic light-emitting layer disposed on the hole-assisting layer, and an electron-assisting layer disposed on the organic light-emitting layer. The at least one adhesive may have a bottom surface adjacent to the first electrode and a side surface adjacent to the hole-assisting layer, the organic light-emitting layer, and the electron-assisting layer.

[0215] The organic light-emitting portion may include a hole-assisting layer disposed on a first electrode, at least one organic light-emitting layer disposed on the hole-assisting layer, and an electron-assisting layer disposed on the organic light-emitting layer. At least one adhesive may have a bottom surface adjacent to the top surface of the hole-assisting layer, a side surface adjacent to the organic light-emitting layer, and a top surface adjacent to the bottom surface of the electron-assisting layer.

[0216] The organic light-emitting part can fill the opening of the embankment and cover the lateral part and the upper part of the embankment.

[0217] At least one adhesive may comprise a non-conductive material and is disposed in the opening at an edge adjacent to the lateral portion of the embankment.

[0218] Although exemplary embodiments of this disclosure have been described in detail with reference to the accompanying drawings, this disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of this disclosure. Therefore, the exemplary embodiments of this disclosure are for illustrative purposes only and are not intended to limit the technical concept of this disclosure. The scope of the technical concept of this disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit this disclosure.

Claims

1. An organic light-emitting element, comprising: substrate; A first electrode disposed on the substrate; A hole-assisted layer disposed on the first electrode; At least one organic light-emitting layer is disposed on the hole auxiliary layer; An electronic auxiliary layer disposed on the organic light-emitting layer; At least one adhesive, said at least one adhesive being disposed in said organic light-emitting layer and comprising functional groups bonded to said organic light-emitting layer; and The second electrode is disposed on the electronic auxiliary layer.

2. The organic light-emitting element according to claim 1, wherein the at least one adhesive is configured to extend from the first electrode in a vertical direction.

3. The organic light-emitting element of claim 1, wherein the at least one adhesive has a bottom surface adjacent to the first electrode and penetrates the hole-assisted layer, the organic light-emitting layer and the electron-assisted layer.

4. The organic light-emitting element according to claim 3, wherein the at least one adhesive comprises a first adhesive disposed at the center of the organic light-emitting layer.

5. The organic light-emitting element according to claim 4, wherein the at least one adhesive further comprises a plurality of second adhesives, the plurality of second adhesives being symmetrically disposed on two opposite sides and spaced apart from each other based on the first adhesive.

6. The organic light-emitting element according to claim 5, wherein the height of the at least one adhesive, measured from the first electrode, is greater than the height of the electronic auxiliary layer, measured from the first electrode. The area where the top surface of the second electrode overlaps with the at least one adhesive and the area where the top surface of the second electrode does not overlap with the at least one adhesive have different heights.

7. The organic light-emitting element according to claim 6, wherein the top surface of the second electrode has a raised portion in the region overlapping with the at least one adhesive.

8. The organic light-emitting element according to claim 3, wherein the at least one adhesive comprises: A first adhesive is disposed in a side edge region of the organic light-emitting layer; as well as A second adhesive is disposed in the edge region on the other side of the organic light-emitting layer.

9. The organic light-emitting element according to claim 1, wherein the at least one adhesive has a bottom surface adjacent to the top surface of the hole-assisting layer, penetrates the organic light-emitting layer, and has a top surface adjacent to the bottom surface of the electron-assisting layer. The at least one adhesive includes a first adhesive disposed at the center of the organic light-emitting layer.

10. The organic light-emitting element according to claim 1, wherein the at least one adhesive has a bottom surface adjacent to the top surface of the hole-assisting layer, penetrates the organic light-emitting layer, and has a top surface adjacent to the bottom surface of the electron-assisting layer, and The at least one adhesive comprises a first adhesive and a plurality of second adhesives, the plurality of second adhesives being symmetrically disposed on two opposite sides based on the first adhesive and spaced apart from each other.

11. The organic light-emitting element according to claim 1, wherein the at least one adhesive has a bottom surface adjacent to the top surface of the hole-assisting layer, penetrates the organic light-emitting layer, and has a top surface adjacent to the bottom surface of the electron-assisting layer. The at least one adhesive comprises: A first adhesive is disposed in a side edge region of the organic light-emitting layer; as well as A second adhesive is disposed in the edge region on the other side of the organic light-emitting layer.

12. The organic light-emitting element of claim 1, wherein the at least one adhesive comprises a plurality of first adhesives, the plurality of first adhesives being arranged to be spaced apart from each other in a first direction and a second direction intersecting the first direction in a plan view.

13. The organic light-emitting element of claim 1, wherein the at least one adhesive comprises a plurality of first adhesives, the plurality of first adhesives extending integrally in a first direction in a plan view and spaced apart from each other in a second direction intersecting the first direction.

14. The organic light-emitting element according to claim 1, wherein the at least one adhesive is arranged in a grid shape in a plan view.

15. A display device, comprising: A substrate, the substrate including a display area, the display area including a plurality of sub-pixels; An organic light-emitting element is disposed on the substrate in the display area, and includes a first electrode, an organic light-emitting portion disposed on the first electrode, and a second electrode disposed on the organic light-emitting portion; A dam portion disposed on the substrate and including an opening configured to expose the first electrode; and At least one adhesive, the at least one adhesive being disposed in the opening and comprising functional groups bonded to the luminescent hierarchy of the organic light-emitting portion.

16. The display device according to claim 15, wherein the organic light-emitting portion comprises: A hole-assisted layer disposed on the first electrode; At least one organic light-emitting layer is disposed on the hole auxiliary layer; as well as An electronic auxiliary layer is disposed on the organic light-emitting layer, and The at least one adhesive has a bottom surface adjacent to the first electrode and a side surface adjacent to the hole-assisting layer, the organic light-emitting layer and the electron-assisting layer.

17. The display device according to claim 15, wherein the organic light-emitting portion comprises: A hole-assisted layer disposed on the first electrode; At least one organic light-emitting layer is disposed on the hole auxiliary layer; as well as An electronic auxiliary layer is disposed on the organic light-emitting layer, and The at least one adhesive has a bottom surface adjacent to the top surface of the hole-assisting layer, a side surface adjacent to the organic light-emitting layer, and a top surface adjacent to the bottom surface of the electron-assisting layer.

18. The display device of claim 15, wherein the organic light-emitting portion fills the opening of the embankment and covers the lateral portion and the upper portion of the embankment. The at least one adhesive comprises a non-conductive material and is disposed in the opening at an edge adjacent to the lateral portion of the embankment.

19. The display device of claim 15, wherein a plurality of said organic light-emitting portions are stacked between the first electrode and the second electrode, and The display device further includes a charge-generating layer disposed between adjacent organic light-emitting portions. The at least one adhesive has a bottom surface adjacent to the first electrode and extends through all layers of the plurality of organic light-emitting portions and the charge-generating layer.

20. The display device of claim 15, wherein a plurality of said organic light-emitting portions are stacked on top of each other between the first electrode and the second electrode. The display device further includes a charge-generating layer disposed between adjacent organic light-emitting portions. Each of the plurality of organic light-emitting units includes: Hole auxiliary layer; At least one organic light-emitting layer is disposed on the hole auxiliary layer; as well as An electronic auxiliary layer is disposed on the organic light-emitting layer, and The at least one adhesive is disposed only in the organic light-emitting layer of the plurality of organic light-emitting parts, penetrates the organic light-emitting layer, and does not penetrate the other layers of the plurality of organic light-emitting parts.

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