Baffle device for picking and placing chips

Abstract

A baffle device for picking up and placing chips adjusts the gap between a first baffle and a second baffle via a motor, a rotating shaft, a drive wheel, a first bearing, a first connecting rod, a first slider and a first connecting post, a second bearing, a second connecting rod, a second slider, and a second connecting post. When the gap between the first and second baffles is at its maximum value and remains constant, a control device controls a robotic arm to remove the chip from the chip slot of a chip carrier and place it into a detection device for inspection. When the gap between the first and second baffles is slightly larger than the chip size and remains constant, the control device controls the robotic arm to remove the chip, which has been detected as a good chip, and place it back into the chip slot of the chip carrier. When the gap between the first and second baffles is at its minimum value and remains constant, the first and second baffles prevent the chip from falling out of the chip slot of the chip carrier.

Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, and in particular relates to a baffle device for picking up and placing chips. Background Technology

[0002] In the manufacturing process of electronic products containing chips, multiple chips are typically stored one by one in spaced chip slots on a long, strip-shaped chip carrier. When it is necessary to inspect the chips in the chip slots of the chip carrier, firstly, the control device controls a robotic arm to remove the chip from the chip slot; then, the chip is placed in an inspection device for testing. If the chip is detected as good, the control device controls the robotic arm to place the chip back into the chip slot; if the chip is detected as defective, the control device controls the robotic arm to place the defective chip into a scrap box, and then the control device controls the robotic arm to remove good chips from a spare chip carrier and place them back into the chip slot, thus ensuring that all chips on the chip carrier are good chips.

[0003] During the process of the control device guiding the robotic arm to place good chips into the chip slots of the chip carrier, it is difficult to accurately place the chips into the chip slots. In addition, when chip picking is not required, chips in the chip slots of the chip carrier are prone to falling out of the slots. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a baffle device for picking up and placing chips, which ensures that the robot can accurately place good chips into the chip slot of the chip carrier, and that the chips will not fall out of the chip slot of the chip carrier when it is not necessary to pick up or place chips.

[0005] The present invention is implemented as follows: a baffle device for picking up and placing chips includes a first mounting plate and a second mounting plate arranged horizontally and at intervals, the first mounting plate being located above the second mounting plate, and one end of the first mounting plate being fixedly connected to one end of the second mounting plate through a vertically arranged connecting plate. A slide rail is fixedly provided at the middle position of the lower surface of the first mounting plate along its length direction, and a first slider and a second slider are horizontally and spaced apart on the slide rail; The first slider is fixed on a first fixed block. The upper surface of the first fixed block is fixedly connected to a horizontally arranged first baffle through two vertically arranged and spaced-apart first connecting posts. The two first connecting posts are located in front of and behind the first mounting plate, respectively. The first baffle is located above the first mounting plate. The lower surface of the first fixed block is fixedly connected to the inner ring of a horizontally arranged first bearing through a vertically arranged first connecting rod. The second slider is fixed on a second fixed block. The first fixed block and the second fixed block are connected by at least one horizontally arranged spring. The upper surface of the second fixed block is fixedly connected to a horizontally arranged second baffle by two vertically arranged and spaced-apart second connecting posts. The two second connecting posts are located in front of and behind the first mounting plate, respectively. The second baffle is located above the first mounting plate. The lower surface of the second fixed block is fixedly connected to the inner ring of a horizontally arranged second bearing by a vertically arranged second connecting rod. The maximum value of the gap between the first baffle and the second baffle is greater than the size of the chip, and the minimum value of the gap between the first baffle and the second baffle is less than the size of the chip. A motor is fixedly mounted on the lower surface of the second mounting plate. The motor's shaft is vertically upward and passes through the second mounting plate. It is fixedly connected to a horizontally positioned elliptical drive wheel. The drive wheel is located between the first bearing and the second bearing. The left and right sides of the drive wheel abut against the outer rings of the first bearing and the second bearing, respectively.

[0006] Specifically, the first baffle has two spaced-apart first waist-shaped grooves, and the first baffle is fixedly connected to the first connecting post by a first screw passing through the first waist-shaped groove.

[0007] Specifically, the second baffle has two spaced-apart second waist-shaped grooves, and the second baffle is fixedly connected to the second connecting post by a second screw passing through the second waist-shaped groove.

[0008] The present invention adjusts the gap between the first baffle and the second baffle by means of a motor, a rotating shaft, a drive wheel, a first bearing, a first connecting rod, a first slider and a first connecting column, a second bearing, a second connecting rod, a second slider and a second connecting column.

[0009] When the gap between the first baffle and the second baffle is at its maximum value and remains constant, since the maximum gap between the first baffle and the second baffle is greater than the size of the chip, the robot arm controlled by the control device can remove the chip from the chip slot of the chip carrier and then place the chip into the detection device for detection.

[0010] When the gap between the first baffle and the second baffle is slightly larger than the size of the chip and remains unchanged, the control device controls the robot arm to take out the chip that has been detected as a good product by the detection device and put it back into the chip slot of the chip carrier. The first baffle and the second baffle play a guiding role when putting the chip back, ensuring that the chip is accurately placed into the chip slot.

[0011] When the gap between the first baffle and the second baffle is at its minimum and remains constant, there is no need to pick up or put down the chip. Since the minimum gap between the first baffle and the second baffle is smaller than the size of the chip, the chip will not fall out of the chip slot of the chip carrier under the blocking effect of the first baffle and the second baffle. Attached Figure Description

[0012] To more clearly illustrate the technical solution of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a three-dimensional assembly diagram of a baffle device for picking up and placing chips provided in an embodiment of the present invention.

[0014] Figure 2 yes Figure 1 A three-dimensional assembly diagram from another perspective.

[0015] Figure 3 yes Figure 1 A schematic diagram of its breakdown.

[0016] Figure 4 yes Figure 1 A schematic diagram of the elliptical drive wheel. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0018] like Figures 1-4 As shown in the figure, the present invention provides a baffle device for picking up and placing chips, including a first mounting plate 1 and a second mounting plate 2 arranged horizontally and at intervals. The first mounting plate 1 is located above the second mounting plate 2, and one end of the first mounting plate 1 is fixedly connected to one end of the second mounting plate 2 through a vertically arranged connecting plate 3. A slide rail 13 is fixedly provided at the middle position of the lower surface of the first mounting plate 1 along its length direction. A first slider 11 and a second slider 12 are horizontally and spaced apart on the slide rail 13. The first slider 11 is fixed on a first fixed block 111. The upper surface of the first fixed block 111 is fixedly connected to a horizontally arranged first baffle 113 through two vertically arranged and spaced-apart first connecting posts 112. The two first connecting posts 112 are located in front of and behind the first mounting plate 1, respectively. The first baffle 113 is located above the first mounting plate 1. The lower surface of the first fixed block 111 is fixedly connected to the inner ring of a horizontally arranged first bearing 115 through a vertically arranged first connecting rod 114. The second slider 12 is fixed on a second fixed block 121. The first fixed block 111 and the second fixed block 121 are connected by at least one horizontally arranged spring 116. The upper surface of the second fixed block 121 is fixedly connected to a horizontally arranged second baffle 123 by two vertically arranged and spaced-apart second connecting posts 122. The two second connecting posts 122 are located in front of and behind the first mounting plate 1, respectively. The second baffle 123 is located above the first mounting plate 1. The lower surface of the second fixed block 121 is fixedly connected to the inner ring of a horizontally arranged second bearing 125 by a vertically arranged second connecting rod 124. A motor 21 is fixedly mounted on the lower surface of the second mounting plate 2. The rotating shaft 22 of the motor 21 is vertically upward. The rotating shaft 22 passes through the second mounting plate 2 and is fixedly connected to a horizontally arranged elliptical drive wheel 23. The drive wheel 23 is located between the first bearing 115 and the second bearing 125. The left and right sides of the drive wheel 23 abut against the outer ring of the first bearing 115 and the outer ring of the second bearing 125, respectively.

[0019] The working principle of the baffle device for picking up and placing chips provided by this invention is as follows: (1) Start the motor 21. The shaft 22 of the motor 21 begins to rotate. The shaft 22 drives the drive wheel 23 to rotate accordingly. When the drive wheel 23 is in the initial position, the minimum radius on the left and right sides of the drive wheel 23 abuts against the outer ring of the first bearing 115 and the outer ring of the second bearing 125, respectively. Gradually, the maximum radius on the front and rear sides of the drive wheel 23 abuts against the outer ring of the first bearing 115 and the outer ring of the second bearing 125, respectively. During this process, the drive wheel 23 drives the first bearing 115 to move to the left along the slide rail 13. At the same time, the drive wheel 23 drives the second bearing 125 to move to the right along the slide rail 13. The first bearing 115 simultaneously drives the first baffle 113 to move to the left along the slide rail 13 through the first connecting rod 114, the first fixed block 111, the first slider 11, and the first connecting column 112. The second bearing 214 simultaneously drives the first baffle 113 to move to the left along the slide rail 13 through the second connecting rod 114, the first fixed block 111, the first slider 11, and the first connecting column 112. Rod 124, second fixed block 121, second slider 12, and second connecting column 122 drive the second baffle 123 to move to the right along slide rail 13, thereby gradually increasing the gap between the first baffle 113 and the second baffle 123, and stretching the spring 116 between the first fixed block 111 and the second fixed block 121; when the maximum radius of the front and rear sides of the drive wheel 23 abuts against the outer ring of the first bearing 115 and the outer ring of the second bearing 125 respectively, the control device shuts off the motor 21, and the gap between the first baffle 113 and the second baffle 123 reaches its maximum value and remains unchanged. Since the maximum value of the gap between the first baffle 113 and the second baffle 123 is greater than the size of the chip, the control device controls the robot arm to remove the chip from the chip slot of the chip carrier, and then place the chip into the detection device for detection;

[0020] (2) When the maximum radius of the front and rear sides of the drive wheel 23 abuts against the outer ring of the first bearing 115 and the outer ring of the second bearing 125 respectively, and gradually the minimum radius of the left and right sides of the drive wheel 23 abuts against the outer ring of the first bearing 115 and the outer ring of the second bearing 125 respectively, the first slider 11 and the second slider 12 gradually approach each other under the pulling force of the spring 116. When the gap between the first baffle 113 and the second baffle 123 gradually decreases from the maximum value to slightly larger than the size of the chip, the control device shuts off the motor 21. The gap between the first baffle 113 and the second baffle 123 remains unchanged. At this time, the control device controls the robot to take out the chip that the detection device has detected as good and put it back into the chip slot of the chip carrier. The first baffle 113 and the second baffle 123 play a guiding role when putting the chip back, ensuring that the chip is accurately put into the chip slot.

[0021] (3) When it is not necessary to pick up or put down the chip, the control device controls the minimum radius of the drive wheel 23 on the left and right sides to abut against the outer ring of the first bearing 115 and the outer ring of the second bearing 125 respectively and return to the initial position. At this time, the control device shuts off the motor 21, and the gap between the first baffle 113 and the second baffle 123 is the minimum value and remains unchanged. Since the minimum value of the gap between the first baffle 113 and the second baffle 123 is smaller than the size of the chip, the chip will not fall out of the chip slot of the chip carrier when the chip carrier moves due to the blocking effect of the first baffle 113 and the second baffle 123.

[0022] In summary, the present invention uses a motor 21, a rotating shaft 22, a drive wheel 23, a first bearing 115, a first connecting rod 114, a first slider 11 and a first connecting column 112, a second bearing 125, a second connecting rod 124, a second slider 12 and a second connecting column 122 to adjust the gap between the first baffle 113 and the second baffle 123.

[0023] When the gap between the first baffle 113 and the second baffle 123 is at its maximum value and remains unchanged, since the maximum value of the gap between the first baffle 113 and the second baffle 123 is greater than the size of the chip, the robot arm controlled by the control device can remove the chip from the chip slot of the chip carrier and then place the chip into the detection device for detection.

[0024] When the gap between the first baffle 113 and the second baffle 123 is slightly larger than the size of the chip and remains unchanged, the control device controls the robot arm to take out the chip that has been detected as a good product by the detection device and put it back into the chip slot of the chip carrier. The first baffle 113 and the second baffle 123 play a guiding role when the chip is put back, ensuring that the chip is accurately placed into the chip slot.

[0025] When the gap between the first baffle 113 and the second baffle 123 is at its minimum and remains constant, there is no need to pick up or put down the chip. Since the minimum gap between the first baffle 113 and the second baffle 123 is smaller than the size of the chip, the chip will not fall out of the chip slot of the chip carrier under the blocking effect of the first baffle 113 and the second baffle 123.

[0026] like Figure 1-3 As shown, specifically, the first baffle 113 has two spaced-apart first waist-shaped grooves 1131, and the first baffle 113 is fixedly connected to the first connecting post 112 by a first screw (not shown) passing through the first waist-shaped groove 1131; the second baffle 123 has two spaced-apart second waist-shaped grooves 1231, and the second baffle 123 is fixedly connected to the second connecting post 122 by a second screw (not shown) passing through the second waist-shaped groove 1231. Since the first screw can move within the first waist-shaped groove 1131 and the second screw can move within the second waist-shaped groove 1231, the minimum gap between the first baffle 113 and the second baffle 123 can be adjusted to accommodate chips of different sizes.

[0027] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A baffle device for picking up and placing chips, characterized in that, It includes a first mounting plate (1) and a second mounting plate (2) arranged horizontally and at intervals. The first mounting plate (1) is located above the second mounting plate (2). One end of the first mounting plate (1) is fixedly connected to one end of the second mounting plate (2) through a vertically arranged connecting plate (3). A slide rail (13) is fixedly provided at the middle position of the lower surface of the first mounting plate (1) along its length direction. A first slider (11) and a second slider (12) are horizontally and spaced apart on the slide rail (13). The first slider (11) is fixed on a first fixed block (111). The upper surface of the first fixed block (111) is fixedly connected to a horizontally arranged first baffle (113) through two vertically arranged and spaced first connecting posts (112). The two first connecting posts (112) are located in front of and behind the first mounting plate (1) respectively. The first baffle (113) is located above the first mounting plate (1). The lower surface of the first fixed block (111) is fixedly connected to the inner ring of a horizontally arranged first bearing (115) through a vertically arranged first connecting rod (114). The second slider (12) is fixed on a second fixed block (121). The first fixed block (111) and the second fixed block (121) are connected by at least one horizontally arranged spring (116). The upper surface of the second fixed block (121) is fixedly connected to a horizontally arranged second baffle (123) by two vertically arranged and spaced second connecting posts (122). The two second connecting posts (122) are located in front of and behind the first mounting plate (1), respectively. The second baffle (123) is located above the first mounting plate (1). The lower surface of the second fixed block (121) is fixedly connected to the inner ring of a horizontally arranged second bearing (125) by a vertically arranged second connecting rod (124). The maximum value of the gap between the first baffle (113) and the second baffle (123) is greater than the size of the chip, and the minimum value of the gap between the first baffle (113) and the second baffle (123) is less than the size of the chip. A motor (21) is fixedly mounted on the lower surface of the second mounting plate (2). The rotating shaft (22) of the motor (21) is vertically upward. The rotating shaft (22) passes through the second mounting plate (2) and is fixedly connected to a horizontally arranged elliptical drive wheel (23). The drive wheel (23) is located between the first bearing (115) and the second bearing (125). The left and right sides of the drive wheel (23) abut against the outer ring of the first bearing (115) and the outer ring of the second bearing (125), respectively.

2. The baffle device for picking up and placing chips as described in claim 1, characterized in that, The first baffle (113) has two spaced-apart first waist-shaped grooves (1131), and the first baffle (113) is fixedly connected to the first connecting post (112) by a first screw passing through the first waist-shaped groove (1131).

3. The baffle device for picking up and placing chips as described in claim 1, characterized in that, The second baffle (123) has two spaced second waist-shaped grooves (1231), and the second baffle (123) is fixedly connected to the second connecting post (122) by a second screw passing through the second waist-shaped groove (1231).

Images