An alignment device for a semiconductor device

Abstract

This invention discloses an alignment device for a semiconductor device. It includes a controller and two imaging units arranged opposite each other along the thickness direction of the semiconductor device. A first light beam emitted from a first light source of the first imaging unit passes through a first alignment mark of the first semiconductor device and a third alignment mark of the second semiconductor device before being incident on a first image sensor. The first image sensor of the first imaging unit determines images of the first and third alignment marks based on the first light beam. A second light beam emitted from a second light source of the second imaging unit passes through a second alignment mark and a fourth alignment mark to be aligned before being incident on a second image sensor. The second image sensor of the second imaging unit determines images of the second and fourth alignment marks based on the second light beam. The controller is communicatively connected to both image sensors and controls the alignment of the corresponding alignment marks based on the four alignment mark images. This invention improves the alignment accuracy of the semiconductor device alignment device.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and more particularly to an alignment device for semiconductor devices. Background Technology

[0002] Because the distance between two alignment marks on small-sized semiconductor devices is short, existing alignment devices cannot observe the alignment marks on small-sized semiconductor devices due to the size limitations of the imaging system, and therefore cannot perform alignment.

[0003] To address the aforementioned issues, existing technologies often involve adding a reflector in front of the imaging system. However, this results in a loss of imaging accuracy after reflection, which in turn affects alignment accuracy. The loss of imaging accuracy is mainly due to the following two reasons: 1. The surface accuracy of the reflector affects the imaging accuracy; 2. When observing extremely small samples, it is necessary to be very close to the edge of the reflector, but the high-precision reflection area of ​​the reflector is usually only the central part (less than 90%), while the accuracy of the edge area cannot be guaranteed. Summary of the Invention

[0004] This invention provides an alignment device for semiconductor devices to solve the problem of low alignment accuracy in existing semiconductor device alignment devices.

[0005] This invention provides an alignment apparatus for a semiconductor device, the semiconductor device including a first semiconductor device and a second semiconductor device; the first semiconductor device includes a first alignment mark and a second alignment mark; the second semiconductor device includes a third alignment mark and a fourth alignment mark; The alignment device includes a controller and a first imaging unit and a second imaging unit disposed opposite to each other along the thickness direction of the semiconductor device. The first imaging unit includes a first light source and a first image sensor; the second imaging unit includes a second light source and a second image sensor. The first light source is used to emit a first light beam; the first light beam is incident on the first image sensor after passing through the first alignment mark and the third alignment mark; the first image sensor is used to determine the first alignment mark image and the third alignment mark image based on the acquired first light beam; The second light source is used to emit a second light beam; the second light beam is incident on the second image sensor after passing through the fourth alignment mark and the second alignment mark; the second image sensor is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired second light beam; The controller is communicatively connected to the first image sensor and the second image sensor, respectively, and is used to control the alignment of the first alignment mark and the third alignment mark, and the alignment of the second alignment mark and the fourth alignment mark, according to the first alignment mark image, the third alignment mark image, the second alignment mark image and the fourth alignment mark image, so as to align the first semiconductor device and the second semiconductor device.

[0006] Optionally, the first imaging unit further includes a first light source shaping lens, a first beam splitter, a first objective lens, and a first sleeve lens; The first beam passes sequentially through the first light source shaping lens, the first beam splitter, the first objective lens, the first alignment mark, the third alignment mark, the first alignment mark, the first objective lens, the first beam splitter, and the first sleeve lens before entering the first image sensor. The second imaging unit also includes a second light source shaping lens, a second beam splitter, a second objective lens, and a second sleeve lens; The second beam passes sequentially through the second light source shaping lens, the second beam splitter, the second objective lens, the fourth alignment mark, the second alignment mark, the fourth alignment mark, the second objective lens, the second beam splitter, and the second sleeve lens before entering the second image sensor.

[0007] Optionally, the alignment device further includes a third imaging unit disposed opposite to the first imaging unit along the thickness direction of the semiconductor device; The third imaging unit includes a third light source; The third light source is used to emit a third beam; the third beam passes through the third alignment mark and the first alignment mark and then enters the first image sensor; the first image sensor is used to determine the first alignment mark image and the third alignment mark image based on the acquired third beam.

[0008] Optionally, the third imaging unit further includes a third light source shaping mirror, a first reflecting mirror, and a second reflecting mirror; The third beam passes sequentially through the third light source shaping mirror, the first reflector, the second reflector, the third alignment mark, and the first alignment mark before entering the first image sensor.

[0009] Optionally, the alignment device further includes a fourth imaging unit disposed opposite to the second imaging unit along the thickness direction of the semiconductor device; The fourth imaging unit includes a fourth light source; The fourth light source is used to emit a fourth beam; the fourth beam passes through the second alignment mark and the fourth alignment mark before entering the second image sensor; the second image sensor is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired fourth beam.

[0010] Optionally, the fourth imaging unit further includes a fourth light source shaping mirror, a third reflecting mirror, and a fourth reflecting mirror; The fourth beam passes sequentially through the fourth light source shaping mirror, the third reflector, the fourth reflector, the second alignment mark, and the fourth alignment mark before entering the second image sensor.

[0011] Optionally, the alignment device further includes a first stage and a second stage; The first stage is used to support the first semiconductor device; the first alignment mark and the second alignment mark are located on the side surface of the first semiconductor device away from the first stage; The second stage is used to support the second semiconductor device; the third alignment mark and the fourth alignment mark are located on the side surface of the second semiconductor device away from the second stage.

[0012] Optionally, the alignment device further includes a motion platform; The first platform is connected to the motion platform; The controller is communicatively connected to the motion platform and is used to control the motion platform to move according to the first alignment mark image, the third alignment mark image, the second alignment mark image, and the fourth alignment mark image, so that the first alignment mark and the third alignment mark are aligned, and the second alignment mark and the fourth alignment mark are aligned.

[0013] Optionally, the alignment device further includes a motion platform; The second platform is connected to the motion platform; The controller is communicatively connected to the motion platform and is used to control the motion platform to move according to the first alignment mark image, the third alignment mark image, the second alignment mark image, and the fourth alignment mark image, so that the first alignment mark and the third alignment mark are aligned, and the second alignment mark and the fourth alignment mark are aligned.

[0014] Optionally, the first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark are all located within the range of the first beam, and the first beam is incident on the second image sensor after passing through the second alignment mark and the fourth alignment mark; the second image sensor is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired first beam; The first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark are all within the range of the second beam. The second beam is incident on the first image sensor after passing through the third alignment mark and the first alignment mark. The first image sensor is used to determine the first alignment mark image and the third alignment mark image based on the acquired second beam.

[0015] The technical solution of this invention, by setting the first imaging unit and the second imaging unit to be arranged opposite each other along the thickness direction of the semiconductor device, can achieve the alignment of small-sized semiconductor devices without being limited by the volume of the imaging unit itself, and does not require the addition of a reflector, which is beneficial to improving the alignment accuracy.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an alignment device for a semiconductor device provided in an embodiment of the present invention; Figure 2 A schematic diagram of the structure of an alignment device for another semiconductor device provided in an embodiment of the present invention; Figure 3 A schematic diagram of the structure of an alignment device for a semiconductor device provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of another alignment device for a semiconductor device provided in an embodiment of the present invention. Detailed Implementation

[0019] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0020] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices. The terms "upper," "lower," "left," "right," etc., indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings and are only used to describe the relative positional relationships between components or constituent parts, and do not specifically limit the specific installation orientation of each component or constituent part.

[0021] Figure 1 This is a schematic diagram of the structure of an alignment device for a semiconductor device provided in an embodiment of the present invention, with reference to... Figure 1The semiconductor device 200 in this embodiment includes a first semiconductor device 200A and a second semiconductor device 200B; the first semiconductor device 200A includes a first alignment mark A1 and a second alignment mark A2; the second semiconductor device 200B includes a third alignment mark B1 and a fourth alignment mark B2; the alignment device includes a controller (not shown) and a first imaging unit 10 and a second imaging unit 20 disposed opposite to each other along the thickness direction of the semiconductor device 200; the first imaging unit 10 includes a first light source 11 and a first image sensor 12; the second imaging unit 20 includes a second light source 21 and a second image sensor 22; the first light source 11 is used to emit a first light beam; the first light beam is incident on the first image sensor 12 after passing through the first alignment mark A1 and the third alignment mark B1; the first image... Sensor 12 is used to determine a first alignment mark image and a third alignment mark image based on the acquired first beam; a second light source 21 is used to emit a second beam; the second beam is incident on a second image sensor 22 after passing through a fourth alignment mark B2 and a second alignment mark A2; the second image sensor 22 is used to determine a second alignment mark image and a fourth alignment mark image based on the acquired second beam; a controller is communicatively connected to the first image sensor 12 and the second image sensor 22 respectively, and is used to control the alignment of the first alignment mark A1 and the third alignment mark B1 and the second alignment mark A2 and the fourth alignment mark B2 based on the first alignment mark image, the third alignment mark image, the second alignment mark image and the fourth alignment mark image, so as to align the first semiconductor device 200A and the second semiconductor device 200B.

[0022] For example, the first alignment mark A1 and the third alignment mark B1 can be two nested images, such as the first alignment mark A1 being a ring and the third alignment mark B1 being a dot; the second alignment mark A2 and the fourth alignment mark B2 can also be two complementary images, such as the second alignment mark A2 being a ring and the fourth alignment mark B2 being a dot.

[0023] It should be noted that the first semiconductor device 200A in the embodiments of the present invention can be a wafer or a chip; the second semiconductor device 200B can be a wafer or a chip; the embodiments of the present invention do not limit the types of the first semiconductor device 200A and the second semiconductor device 200B that need to be aligned, and those skilled in the art can make their own settings.

[0024] This embodiment of the invention uses a first semiconductor device 200A as a wafer and a second semiconductor device 200B as a chip as an example. Because the chip is smaller, the distance between the third alignment mark B1 and the fourth alignment mark B2 used for alignment on the second semiconductor device 200B will be closer. Consequently, the distance between the first alignment mark A1 and the second alignment mark A2 used for alignment on the first semiconductor device 200A will also be closer. In this case, if the first imaging unit 10 and the second imaging unit 20 are both located on the same side, the first imaging unit 10 will not observe the first alignment mark A1 and the third alignment mark B1, the second imaging unit 20 will not observe the second alignment mark A2 and the fourth alignment mark B2, the accuracy of the first and third alignment mark images observed by the first imaging unit 10 will be low, and the accuracy of the second and fourth alignment mark images observed by the second imaging unit 20 will also be low. To achieve accurate imaging of all alignment marks, this embodiment of the invention sets the first imaging unit 10 and the second imaging unit 20 to be positioned opposite each other along the thickness direction of the semiconductor device 200.

[0025] Before the first light beam emitted by the first light source 11 of the first imaging unit 10 is incident on the first image sensor 12, it may carry only the information of the first alignment mark A1, only the information of the third alignment mark B1, or both the first alignment mark A1 and the third alignment mark B1. Regardless of the method, the first image sensor 12 will ultimately determine the first alignment mark image based on the first light beam carrying the first alignment mark information, and the third alignment mark image based on the first light beam carrying the third alignment mark information. The controller, which is communicatively connected to the first image sensor 12, can acquire the first alignment mark image and the third alignment mark image from the first image sensor 12. It can then determine the positional relationship between the first alignment mark A1 and the third alignment mark B1 to be aligned based on the first alignment mark image and the third alignment mark image. Furthermore, it can control the first semiconductor device 200A and / or the second semiconductor device 200B to move based on the positional relationship between the first alignment mark A1 and the third alignment mark B1, so that the center of the first alignment mark A1 is aligned with the center of the third alignment mark B1.

[0026] Before the second beam emitted by the second light source 21 of the second imaging unit 20 is incident on the second image sensor 22, it may carry only the information of the second alignment mark A2, only the information of the fourth alignment mark B2, or both the second alignment mark A2 and the fourth alignment mark B2. Regardless of the method, the second image sensor 22 will ultimately determine the second alignment mark image based on the second beam carrying the second alignment mark information, and the fourth alignment mark image based on the second beam carrying the fourth alignment mark information. The controller, communicatively connected to the second image sensor 22, can acquire the second and fourth alignment mark images from the second image sensor 22. It can then determine the positional relationship between the second alignment mark A2 and the fourth alignment mark B2 to be aligned based on these images. Furthermore, it can control the movement of the first semiconductor device 200A and / or the second semiconductor device 200B based on the positional relationship between the second alignment mark A2 and the fourth alignment mark B2, so that the center of the second alignment mark A2 is aligned with the center of the fourth alignment mark B2.

[0027] It should be noted that the alignment of the first alignment mark A1 and the third alignment mark B1 means that the center of the first alignment mark A1 is aligned with the center of the third alignment mark B1 along the thickness direction of the semiconductor device 200; the alignment of the second alignment mark A2 and the fourth alignment mark B2 means that the center of the second alignment mark A2 is aligned with the center of the fourth alignment mark B2 along the thickness direction of the semiconductor device 200; when the first alignment mark A1 and the third alignment mark B1, as well as the second alignment mark A2 and the fourth alignment mark B2 are all aligned, the first semiconductor device 200A and the second semiconductor device 200B can be aligned in three dimensions.

[0028] In this embodiment of the invention, by setting the first imaging unit 10 and the second imaging unit 20 to be arranged opposite each other along the thickness direction of the semiconductor device 200, the alignment of the small-sized semiconductor device 200 can be achieved without being limited by the volume of the imaging unit itself, and no additional reflector is required, which is beneficial to improving the alignment accuracy.

[0029] For details, please refer to Figure 1In this embodiment of the invention, the first imaging unit 10 further includes a first light source shaping lens 13, a first beam splitter 14, a first objective lens 15, and a first sleeve lens 16; the first light beam passes sequentially through the first light source shaping lens 13, the first beam splitter 14, the first objective lens 15, the first alignment mark A1, the third alignment mark B1, the first alignment mark A1, the first objective lens 15, the first beam splitter 14, and the first sleeve lens 16 before being incident on the first image sensor 12; the second imaging unit 20 further includes a second light source shaping lens 23, a second beam splitter 24, a second objective lens 25, and a second sleeve lens 26; the second light beam passes sequentially through the second light source shaping lens 23, the second beam splitter 24, the second objective lens 25, the fourth alignment mark B2, the second alignment mark A2, the fourth alignment mark B2, the second objective lens 25, the second beam splitter 24, and the second sleeve lens 26 before being incident on the second image sensor 22.

[0030] It should be noted that whether the first beam carries only the information of the first alignment mark A1, only the information of the third alignment mark B1, or both the first alignment mark A1 and the third alignment mark B1 before it is incident on the first image sensor 12 is determined by the distance between the first alignment mark A1 and the third alignment mark B1 in the thickness direction of the semiconductor device 200, as well as the focal length and depth of field of the first objective lens 15. If the distance between the first alignment mark A1 and the third alignment mark B1 in the thickness direction of the semiconductor device 200 is not within the depth of field, the first image sensor 12 can only acquire the information of the first alignment mark A1 and the third alignment mark B1 sequentially by adjusting the position of the first imaging unit 10 in the thickness direction of the semiconductor device 200. If the distance between the first alignment mark A1 and the third alignment mark B1 in the thickness direction of the semiconductor device 200 is within the depth of field, the first image sensor 12 can acquire the information of the first alignment mark A1 and the third alignment mark B1 simultaneously by adjusting the position of the first imaging unit 10 in the thickness direction of the semiconductor device 200.

[0031] Similarly, whether the second beam carries only the information of the second alignment mark A2, only the information of the fourth alignment mark B2, or both the information of the second alignment mark A2 and the fourth alignment mark B2 before it is incident on the second image sensor 22 is determined by the distance between the second alignment mark A2 and the fourth alignment mark B2 in the thickness direction of the semiconductor device 200, as well as the focal length and depth of field of the second objective lens 25. If the distance between the second alignment mark A2 and the fourth alignment mark B2 in the thickness direction of the semiconductor device 200 is not within the depth of field, the second image sensor 22 can only acquire the information of the second alignment mark A2 and the fourth alignment mark B2 sequentially by adjusting the position of the second imaging unit 20 in the thickness direction of the semiconductor device 200. If the distance between the second alignment mark A2 and the fourth alignment mark B2 in the thickness direction of the semiconductor device 200 is within the depth of field, the second image sensor 22 can acquire the information of the second alignment mark A2 and the fourth alignment mark B2 simultaneously by adjusting the position of the second imaging unit 20 in the thickness direction of the semiconductor device 200.

[0032] The present invention is illustrated by the example that the first light beam carries information of the first alignment mark A1 and the third alignment mark B1 before it is incident on the first image sensor 12, and the second light beam carries information of the second alignment mark A2 and the fourth alignment mark B2 before it is incident on the second image sensor 22.

[0033] For example, the first beam emitted by the first light source 11 is shaped by the first light source shaping lens 13, reflected by the first beam splitter 14, collimated and focused by the first objective lens 15, diffracted, reflected and transmitted by the first alignment mark A1, diffracted, reflected and transmitted by the third alignment mark B1, diffracted, reflected and transmitted by the first alignment mark A1, collimated by the first objective lens 15, transmitted by the first beam splitter 14, and converged by the first sleeve lens 16. After this process, the beam carries the information of the first alignment mark A1 and the information of the third alignment mark B1 and is incident on the first image sensor 12.

[0034] The second beam emitted by the second light source 21 is shaped by the second light source shaping lens 23, reflected by the second beam splitter 24, collimated and focused by the second objective lens 25, diffracted, reflected and transmitted by the fourth alignment mark B2, diffracted, reflected and transmitted by the second alignment mark A2, diffracted, reflected and transmitted by the fourth alignment mark B2, collimated by the second objective lens 25, transmitted by the second beam splitter 24, and converged by the second sleeve lens 26. After this process, the beam carries the information of the second alignment mark A2 and the fourth alignment mark B2 and is incident on the second image sensor 22.

[0035] Figure 2 This is a schematic diagram of the structure of an alignment device for another semiconductor device provided in an embodiment of the present invention, with reference to... Figure 2The alignment device in this embodiment of the invention further includes a third imaging unit 30 disposed opposite to the first imaging unit 10 along the thickness direction of the semiconductor device 200; the third imaging unit 30 includes a third light source 31; the third light source 31 is used to emit a third beam; the third beam is incident on the first image sensor 12 after passing through the third alignment mark B1 and the first alignment mark A1; the first image sensor 12 is used to determine the first alignment mark image and the third alignment mark image based on the acquired third beam.

[0036] For example, the first alignment mark image and the third alignment mark image in the embodiments of the present invention can also be obtained in another way. Specifically, after the light beam emitted by the third light source 31 passes through the third alignment mark B1 and the first alignment mark A1 in sequence, it will carry the information of the third alignment mark B1 and the first alignment mark A1 and be incident on the first image sensor 12. Then, the first image sensor 12 can determine the first alignment mark image based on the third light beam carrying the first alignment mark information and determine the third alignment mark image based on the third light beam carrying the third alignment mark information.

[0037] For details, please refer to Figure 2 The third imaging unit 30 in this embodiment of the invention further includes a third light source shaping mirror 32, a first reflecting mirror 33, and a second reflecting mirror 34; the third light beam is incident on the first image sensor 12 after passing through the third light source shaping mirror 32, the first reflecting mirror 33, the second reflecting mirror 34, the third alignment mark B1, and the first alignment mark A1 in sequence.

[0038] For example, the third beam emitted by the third light source 31 is shaped, collimated and focused by the third light source shaping mirror 32 in sequence, reflected by the first reflecting mirror 33, reflected by the second reflecting mirror 34, diffracted and transmitted by the third alignment mark B1, and diffracted and transmitted by the first alignment mark A1. After that, it carries the information of the first alignment mark A1 and the information of the third alignment mark B1 and is incident on the first image sensor 12.

[0039] Figure 3 This is a schematic diagram of the structure of an alignment device for a semiconductor device provided in an embodiment of the present invention, with reference to... Figure 3 The alignment device in this embodiment of the invention further includes a fourth imaging unit 40 disposed opposite to the second imaging unit 20 along the thickness direction of the semiconductor device 200; the fourth imaging unit 40 includes a fourth light source 41; the fourth light source 41 is used to emit a fourth light beam; the fourth light beam is incident on the second image sensor 22 after passing through the second alignment mark A2 and the fourth alignment mark B2; the second image sensor 22 is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired fourth light beam.

[0040] In this embodiment of the invention, the second alignment mark image and the fourth alignment mark image can also be obtained in another way. Specifically, after the light beam emitted by the fourth light source 41 passes through the second alignment mark A2 and the fourth alignment mark B2 in sequence, it will carry the information of the second alignment mark A2 and the fourth alignment mark B2 and be incident on the second image sensor 22. Then, the second image sensor 22 can determine the second alignment mark image based on the fourth light beam carrying the second alignment mark information, and determine the fourth alignment mark image based on the fourth light beam carrying the fourth alignment mark information.

[0041] For details, please refer to Figure 3 The fourth imaging unit 40 in this embodiment of the invention further includes a fourth light source shaping lens 42, a third reflector 43 and a fourth reflector 44; the fourth light beam is incident on the second image sensor 22 after passing through the fourth light source shaping lens 42, the third reflector 43, the fourth reflector 44, the second alignment mark A2 and the fourth alignment mark B2 in sequence.

[0042] For example, the fourth beam emitted by the fourth light source 41 is shaped, collimated and focused by the fourth light source shaping lens 42 in sequence, reflected by the third reflecting mirror 43, reflected by the fourth reflecting mirror 44, diffracted and transmitted by the second alignment mark A2, and diffracted and transmitted by the fourth alignment mark B2. After that, it carries the information of the second alignment mark A2 and the information of the fourth alignment mark B2 and is incident on the second image sensor 22.

[0043] Figure 4 This is a schematic diagram of the structure of an alignment device for a semiconductor device provided in an embodiment of the present invention, with reference to... Figure 4 The alignment device in this embodiment of the invention includes the third imaging unit 30 disposed opposite to the first imaging unit 10 along the thickness direction of the semiconductor device 200, and also includes the fourth imaging unit 40 disposed opposite to the second imaging unit 20 along the thickness direction of the semiconductor device 200.

[0044] It should be noted that the first light source 11, the second light source 21, the third light source 31 and the fourth light source 41 in the embodiments of the present invention can be infrared light sources, and the semiconductor device 200 can be made of silicon or other non-metallic materials that can be penetrated by infrared light.

[0045] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The alignment device in this embodiment of the invention further includes a first stage 50 and a second stage 60; the first stage 50 is used to support a first semiconductor device 200A; the first alignment mark A1 and the second alignment mark A2 are located on the side surface of the first semiconductor device 200A away from the first stage 50; the second stage 60 is used to support a second semiconductor device 200B; the third alignment mark B1 and the fourth alignment mark B2 are located on the side surface of the second semiconductor device 200B away from the second stage 60.

[0046] It should be noted that the materials of the first stage 50 and the second stage 60 in the embodiments of the present invention can be quartz or opaque metal / non-metal materials. If they are opaque materials, it is only necessary to open holes in the areas of the first stage 50 corresponding to the first alignment mark A1 and the second alignment mark A2, and in the areas of the second stage 60 corresponding to the third alignment mark B1 and the fourth alignment mark B2, so as not to affect the imaging of each alignment mark.

[0047] In one feasible embodiment, the alignment device in this invention further includes a motion platform (not shown in the figure); a first stage 50 is connected to the motion platform; a controller is communicatively connected to the motion platform and is used to control the motion platform to move according to the first alignment mark image, the third alignment mark image, the second alignment mark image and the fourth alignment mark image, so that the first alignment mark A1 and the third alignment mark B1 are aligned and the second alignment mark A2 and the fourth alignment mark B2 are aligned.

[0048] For example, the controller can determine the positional relationship between the first alignment mark A1 and the third alignment mark B1 to be aligned based on the first alignment mark image and the third alignment mark image, and then control the movement of the motion platform based on the positional relationship between the first alignment mark A1 and the third alignment mark B1 so that the center of the first alignment mark A1 is aligned with the center of the third alignment mark B1; it can also determine the positional relationship between the second alignment mark A2 and the fourth alignment mark B2 to be aligned based on the second alignment mark image and the fourth alignment mark image, and then control the movement of the motion platform based on the positional relationship between the second alignment mark A2 and the fourth alignment mark B2 so that the center of the first alignment mark A1 is aligned with the center of the third alignment mark B1.

[0049] It should be noted that in the embodiments of the present invention, the motion platform is connected to the first platform 50, and the first semiconductor device 200A is adsorbed on the first platform 50. Therefore, during the movement of the motion platform, the first platform 50 and the first semiconductor device 200A will also move with the motion platform.

[0050] In one feasible embodiment, the alignment device in this invention further includes a motion platform (not shown in the figure); a second stage 60 is connected to the motion platform; and a controller is communicatively connected to the motion platform to control the motion platform to move according to the first alignment mark image, the third alignment mark image, the second alignment mark image, and the fourth alignment mark image, so that the first alignment mark A1 and the third alignment mark B1 are aligned and the second alignment mark A2 and the fourth alignment mark B2 are aligned.

[0051] For example, the controller can determine the positional relationship between the first alignment mark A1 and the third alignment mark B1 to be aligned based on the first alignment mark image and the third alignment mark image, and then control the movement of the motion platform based on the positional relationship between the first alignment mark A1 and the third alignment mark B1 so that the center of the first alignment mark A1 is aligned with the center of the third alignment mark B1; it can also determine the positional relationship between the second alignment mark A2 and the fourth alignment mark B2 to be aligned based on the second alignment mark image and the fourth alignment mark image, and then control the movement of the motion platform based on the positional relationship between the second alignment mark A2 and the fourth alignment mark B2 so that the center of the first alignment mark A1 is aligned with the center of the third alignment mark B1.

[0052] It should be noted that in this embodiment of the invention, the motion platform is connected to the second stage 60, and the second semiconductor device 200B is adsorbed onto the second stage 60. Therefore, during the movement of the motion platform, the second stage 60 and the second semiconductor device 200B will also move with the motion platform.

[0053] In other feasible implementations, two mobile platforms can be set up, one mobile platform is connected to the first platform 50 and the other mobile platform is connected to the second platform 60. The controller is communicatively connected to the two motion platforms respectively, and is used to control the movement of the two motion platforms according to the first alignment mark image, the third alignment mark image, the second alignment mark image and the fourth alignment mark image, so that the first alignment mark A1 and the third alignment mark B1 are aligned and the second alignment mark A2 and the fourth alignment mark B2 are aligned.

[0054] Understandably, before aligning the first semiconductor device 200A and the second semiconductor device 200B, it is usually necessary to level them to ensure their parallelism. When two moving platforms are used, if alignment is performed by controlling one moving platform, leveling can be performed by controlling the other moving platform.

[0055] Based on the above embodiments, the first alignment mark A1, the second alignment mark A2, the third alignment mark B1, and the fourth alignment mark B2 are all located within the range of the first beam. The first beam passes through the second alignment mark A2 and the fourth alignment mark B2 before being incident on the second image sensor 22. The second image sensor 22 is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired first beam. The first alignment mark A1, the second alignment mark A2, the third alignment mark B1, and the fourth alignment mark B2 are all located within the range of the second beam. The second beam passes through the third alignment mark B1 and the first alignment mark A1 before being incident on the first image sensor 12. The first image sensor 12 is used to determine the first alignment mark image and the third alignment mark image based on the acquired second beam.

[0056] For example, when the distance between the first alignment mark A1 and the third alignment mark B1 and the distance between the second alignment mark A2 and the fourth alignment mark B2 are close enough, that is, when they are all within the range of the first beam, the fourth light source 41 in the fourth imaging system can be turned off. At this time, part of the first beam will pass through the second alignment mark A2, the fourth alignment mark B2, the second objective lens 25, the second beam splitter 24, and the second sleeve lens 26 in sequence before entering the second image sensor 22 to form an image, so as to obtain the second alignment mark image and the fourth alignment mark image.

[0057] When the distance between the first alignment mark A1 and the third alignment mark B1, and the distance between the second alignment mark A2 and the fourth alignment mark B2 are close enough, i.e. they are all within the range of the second beam, the third light source 31 in the third imaging system can be turned off. At this time, part of the second beam will pass through the third alignment mark B1, the first alignment mark A1, the first objective lens 15, the first beam splitter 14, and the first sleeve lens 16 in sequence before entering the first image sensor 12 to form an image of the first alignment mark and the third alignment mark.

[0058] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An alignment apparatus for a semiconductor device, characterized in that, The semiconductor device includes a first semiconductor device and a second semiconductor device; the first semiconductor device includes a first alignment mark and a second alignment mark; the second semiconductor device includes a third alignment mark and a fourth alignment mark; The alignment device includes a controller and a first imaging unit and a second imaging unit disposed opposite to each other along the thickness direction of the semiconductor device. The first imaging unit includes a first light source and a first image sensor; the second imaging unit includes a second light source and a second image sensor. The first light source is used to emit a first light beam; the first light beam is incident on the first image sensor after passing through the first alignment mark and the third alignment mark; the first image sensor is used to determine the first alignment mark image and the third alignment mark image based on the acquired first light beam; The second light source is used to emit a second light beam; the second light beam is incident on the second image sensor after passing through the fourth alignment mark and the second alignment mark; the second image sensor is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired second light beam; The controller is communicatively connected to the first image sensor and the second image sensor, respectively, and is used to control the alignment of the first alignment mark and the third alignment mark, and the alignment of the second alignment mark and the fourth alignment mark, according to the first alignment mark image, the third alignment mark image, the second alignment mark image and the fourth alignment mark image, so as to align the first semiconductor device and the second semiconductor device.

2. The alignment device according to claim 1, characterized in that, The first imaging unit further includes a first light source shaping lens, a first beam splitter, a first objective lens, and a first sleeve lens; The first beam passes sequentially through the first light source shaping lens, the first beam splitter, the first objective lens, the first alignment mark, the third alignment mark, the first alignment mark, the first objective lens, the first beam splitter, and the first sleeve lens before entering the first image sensor. The second imaging unit also includes a second light source shaping lens, a second beam splitter, a second objective lens, and a second sleeve lens; The second beam passes sequentially through the second light source shaping lens, the second beam splitter, the second objective lens, the fourth alignment mark, the second alignment mark, the fourth alignment mark, the second objective lens, the second beam splitter, and the second sleeve lens before entering the second image sensor.

3. The alignment device according to claim 1, characterized in that, The alignment device further includes a third imaging unit disposed opposite to the first imaging unit along the thickness direction of the semiconductor device; The third imaging unit includes a third light source; The third light source is used to emit a third beam; the third beam passes through the third alignment mark and the first alignment mark and then enters the first image sensor; the first image sensor is used to determine the first alignment mark image and the third alignment mark image based on the acquired third beam.

4. The alignment device according to claim 3, characterized in that, The third imaging unit also includes a third light source shaping mirror, a first reflecting mirror, and a second reflecting mirror; The third beam passes sequentially through the third light source shaping mirror, the first reflector, the second reflector, the third alignment mark, and the first alignment mark before entering the first image sensor.

5. The alignment device according to claim 1, characterized in that, The alignment device further includes a fourth imaging unit disposed opposite to the second imaging unit along the thickness direction of the semiconductor device; The fourth imaging unit includes a fourth light source; The fourth light source is used to emit a fourth beam; the fourth beam passes through the second alignment mark and the fourth alignment mark before entering the second image sensor; the second image sensor is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired fourth beam.

6. The alignment device according to claim 5, characterized in that, The fourth imaging unit also includes a fourth light source shaping mirror, a third reflecting mirror, and a fourth reflecting mirror; The fourth beam passes sequentially through the fourth light source shaping mirror, the third reflector, the fourth reflector, the second alignment mark, and the fourth alignment mark before entering the second image sensor.

7. The alignment device according to claim 1, characterized in that, The alignment device further includes a first stage and a second stage; The first stage is used to support the first semiconductor device; the first alignment mark and the second alignment mark are located on the side surface of the first semiconductor device away from the first stage; The second stage is used to support the second semiconductor device; The third alignment mark and the fourth alignment mark are located on the side surface of the second semiconductor device away from the second stage.

8. The alignment device according to claim 7, characterized in that, The alignment device also includes a motion platform; The first platform is connected to the motion platform; The controller is communicatively connected to the motion platform and is used to control the motion platform to move according to the first alignment mark image, the third alignment mark image, the second alignment mark image, and the fourth alignment mark image, so that the first alignment mark and the third alignment mark are aligned, and the second alignment mark and the fourth alignment mark are aligned.

9. The alignment device according to claim 7, characterized in that, The alignment device also includes a motion platform; The second platform is connected to the motion platform; The controller is communicatively connected to the motion platform and is used to control the motion platform to move according to the first alignment mark image, the third alignment mark image, the second alignment mark image, and the fourth alignment mark image, so that the first alignment mark and the third alignment mark are aligned, and the second alignment mark and the fourth alignment mark are aligned.

10. The alignment device according to claim 1, characterized in that, The first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark are all within the range of the first beam. The first beam passes through the second alignment mark and the fourth alignment mark before entering the second image sensor. The second image sensor is used to determine the second alignment mark image and the fourth alignment mark image based on the acquired first beam. The first alignment mark, the second alignment mark, the third alignment mark, and the fourth alignment mark are all within the range of the second beam. The second beam is incident on the first image sensor after passing through the third alignment mark and the first alignment mark. The first image sensor is used to determine the first alignment mark image and the third alignment mark image based on the acquired second beam.

Images