Wafer production and processing equipment

Abstract

This invention discloses a wafer fabrication and processing equipment, belonging to the field of wafer processing. The equipment includes a processing base with a rotating disk rotatably connected to its top, and a workstation disk. The rotating disk has multiple sets of workstation slots evenly spaced on it, and multiple sets of positioning frames are fixedly connected to its bottom. The workstation disk is rotatably connected to the positioning frames, with its top extending through the workstation slots above the rotating disk. This invention achieves simultaneous processing at multiple workstations through the rotation of the rotating disk, improving wafer cleaning efficiency. Furthermore, with the rotation of the workstation disk, as the wafer passes through different workstations, it undergoes alkaline washing, acid washing, and air drying in stages. Combined with the centrifugal force generated by the rotating workstation disk, various residues on the wafer surface are effectively removed, achieving comprehensive cleaning of the wafer surface, improving its cleanliness, and ensuring the quality of subsequent processing.

Description

Technical Field

[0001] This invention relates to the field of wafer fabrication technology, and more particularly to a wafer production and processing equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, the requirements for integrated circuit performance are becoming increasingly stringent. As the basic material for manufacturing integrated circuits, the surface cleanliness of wafers has a decisive impact on the quality and reliability of the final product. Therefore, the cleaning step has become a crucial part of the wafer processing and manufacturing process.

[0003] In existing wafer cleaning processes, wet cleaning processes such as standard cleaning methods are mainly used, which use specific proportions of alkaline and acidic solutions to remove organic contaminants, particulate matter, and metallic impurities from the wafer surface.

[0004] Currently, after alkaline and acid washing of wafers, they need to be removed and dried, which reduces the efficiency of the cleaning process. Moreover, after the traditional alkaline and acid washing methods are completed, a certain amount of residue may still adhere to the wafer surface, resulting in the wafer surface cleanliness not meeting the standards, which in turn affects the quality of subsequent processing. Therefore, a wafer production and processing equipment is proposed. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of low efficiency and poor cleaning effect of the step-by-step cleaning process in the prior art, which may result in residue adhesion, leading to substandard cleanliness of the wafer surface and affecting the quality of subsequent processing. Therefore, a wafer production and processing equipment is proposed.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A wafer fabrication and processing equipment includes a processing base with a rotating disk rotatably connected to its top. It also includes: a workstation plate, on which multiple workstation slots are equally spaced, and multiple positioning frames are fixedly connected to the bottom of the rotating disk. The workstation plate is rotatably connected to the positioning frames, wherein the top of the workstation plate extends through the workstation slots to above the rotating disk, and a drive unit is provided within the processing base to drive the multiple workstation plates to rotate simultaneously; an alkaline washing tank and an acid washing tank, both fixed to the top of the processing base, wherein the bottom ends of the output pipes of both the alkaline washing tank and the acid washing tank are fixed and connected to a spray box, and spray holes are equally spaced at the bottom of the spray box. An air-filling unit is provided on the processing base to accelerate the spraying of liquid from the spray box; and a drying assembly, disposed on the processing base, used to dry the wafer surface after alkaline washing and acid washing.

[0008] To improve the rinsing effect, preferably, the drive unit includes a drive motor, which is fixedly connected to the bottom of the rotating disk. The output shaft of the drive motor is fixedly connected to a drive wheel, and the bottom of the rotating shaft of each set of workstation disks is fixedly connected to a driven disk. The drive wheel and multiple sets of driven disks are connected by belt drive.

[0009] To improve the stability of the wafer during cleaning, preferably, the driven turntable has a negative pressure groove connected to the inner cavity of the workstation tray. The top of the workstation tray has multiple sets of adsorption holes. A moving magnetic plate is slidably connected in the negative pressure groove. A return spring is fixedly connected between the top of the moving magnetic plate and the top of the negative pressure groove. A magnetic ring is fixedly connected to the bottom of the processing seat. The driven turntable rotates along the top arc surface of the magnetic ring. The magnetic ring and the moving magnetic plate are magnetically attracted to each other, and the magnetic ring is provided with a decompression break.

[0010] To improve the rinsing effect, preferably, the inflation unit includes a pivot shaft rotatably connected inside the processing seat. The pivot shaft passes through the center of the rotating disk and is fixedly connected thereto. A pivot motor is fixedly connected to the top of the processing seat, and the output shaft of the pivot motor is fixedly connected to the top of the pivot shaft. An inflation box is fixedly connected to the bottom of the processing seat. A piston plate is slidably connected inside the inflation box. A push-pull rod is rotatably connected to the outer wall of the piston plate. The pivot shaft passes through to the bottom of the processing seat and is fixedly connected to a push-pull plate. The other end of the push-pull rod is rotatably connected to the bottom of the push-pull rod. A pressurization pipe is fixedly connected and communicates between the tops of the alkaline washing tank and the acid washing tank. An inflation pipe is fixedly connected and communicates with the side wall of the inflation box. The other end of the inflation pipe is connected to the pressurization pipe.

[0011] Furthermore, a one-way valve is installed inside the air filling pipe, and a solenoid valve is installed inside the output pipes of both the alkaline washing tank and the acid washing tank.

[0012] To facilitate the discharge of waste liquid, preferably, a liquid collection chamber is fixedly connected to the inner wall of the processing base, and multiple sets of liquid collection pipes are equally spaced at the bottom of the rotating disk. The input end of the liquid collection pipe extends through to the top of the rotating disk, and the output end of the liquid collection pipe is located directly above the liquid collection chamber. A drain pipe is fixedly connected to the outer wall of the processing base, and the input end of the drain pipe is connected to the bottom of the inner cavity of the liquid collection chamber.

[0013] To further improve wafer stability, preferably, a sealing ring is fixedly connected to the side wall of the liquid collection chamber, a rotating ring is rotatably connected inside the sealing ring, a connecting rod is fixedly connected between the side wall of the rotating ring and the driven turntable, and the two ends of the inner cavity of the connecting rod are respectively connected to the sealing ring and the inner cavity of the negative pressure groove. A negative pressure pipe is fixedly connected to the side wall of the inflation box, the other end of the negative pressure pipe is connected to the inner cavity of the sealing ring, and a one-way valve is provided inside the negative pressure pipe.

[0014] To facilitate drying of the rinsed wafers, preferably, an air collection box is fixedly connected to the top of the processing base, the output end of the air collection box is fixed and connected to an air blowing box, and air blowing holes are evenly spaced at the bottom of the air blowing box.

[0015] Furthermore, the drying assembly includes an air guide box, a linkage shaft is rotatably connected inside the air guide box, an air guide blade is fixedly connected to the bottom end of the linkage shaft, the top end of the linkage shaft extends through into the processing seat and is fixedly connected to a friction ring, and the friction ring is in contact with the outer wall of the driven turntable, the top of the air guide box is connected to the inner cavity of the processing seat, the bottom of the air guide box is fixed and connected to an air guide pipe, and the other end of the air guide pipe is connected to the inner cavity of the air collecting box.

[0016] To facilitate loading and unloading and thus improve processing efficiency, preferably, a material picking groove is provided on one side of the processing seat, and the bottom of the material picking groove is higher than the rotating disk.

[0017] Compared with the prior art, the present invention provides a wafer fabrication and processing equipment, which has the following beneficial effects:

[0018] 1. This wafer manufacturing and processing equipment achieves simultaneous processing at multiple stations through the rotation of a rotary table, improving the efficiency of wafer cleaning and processing. In conjunction with the rotation of the station tables, as the wafer passes through different stations, it undergoes alkaline washing, acid washing, and air drying in stages. Combined with the centrifugal force generated by the rotation of the station tables, various residues on the wafer surface are effectively removed, achieving comprehensive cleaning of the wafer surface, improving the cleanliness of the wafer surface, and ensuring the quality of subsequent processing.

[0019] 2. This wafer manufacturing equipment, through the attraction between the magnetic ring and the moving magnetic plate, and in conjunction with the reset spring, can generate negative pressure attraction in the negative pressure tanks located at the second, third, and fourth stations, thereby achieving the adsorption and fixation of the wafer and improving the stability during wafer cleaning; and can automatically release the adsorption of the wafer at the first station, making it easy to remove the wafer and improving the convenience of cleaning and processing.

[0020] 3. This wafer manufacturing equipment, through the cooperation of the push-pull plate and push-pull rod, causes the piston plate to slide back and forth in the gas filling box when the indexing shaft rotates. First, it compresses the gas and fills the alkaline washing tank and acid washing tank, so that the alkaline or acidic cleaning agent is accelerated to flush the wafer surface, thereby cleaning stubborn stains and improving the cleaning effect of the wafer surface. Secondly, it increases the negative pressure suction effect generated in the negative pressure tank, further improving the stability of the wafer during the rotation cleaning process. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a wafer fabrication equipment proposed in this invention. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the overall structure of a wafer fabrication equipment proposed in this invention. Figure 2 ;

[0023] Figure 3 This is a schematic diagram of a half-section structure of a wafer fabrication equipment proposed in this invention. Figure 1 ;

[0024] Figure 4 This invention provides a wafer fabrication and processing equipment. Figure 3 Enlarged structural diagram of region A in the middle;

[0025] Figure 5 This is a schematic diagram of a half-section structure of a wafer fabrication equipment proposed in this invention. Figure 2 ;

[0026] Figure 6 This invention provides a wafer fabrication and processing equipment. Figure 5 Enlarged structural diagram of region B in the middle;

[0027] Figure 7 This invention provides a wafer fabrication and processing equipment. Figure 5 Enlarged structural diagram of region C in the middle;

[0028] Figure 8 This invention provides a wafer fabrication and processing equipment. Figure 5 A magnified structural diagram of region D in the middle;

[0029] Figure 9 This is a schematic diagram of the internal structure of the processing base of a wafer manufacturing equipment proposed in this invention.

[0030] In the diagram: 1. Machining base; 2. Rotary disk; 21. Workstation slot; 22. Positioning frame; 3. Workstation disk; 31. Drive motor; 311. Driving rotary wheel; 32. Driven rotary disk; 33. Negative pressure tank; 331. Moving magnetic plate; 332. Return spring; 34. Adsorption hole; 35. Magnetic ring; 351. Decompression break; 4. Alkali washing tank; 41. Acid washing tank; 42. Spray box; 421. Spray hole; 5. Indexing shaft; 51. Indexing motor; 52. Filling... 53. Air box; 54. Piston plate; 55. Push-pull rod; 56. Push-pull plate; 57. Pressurization pipe; 58. Air filling pipe; 69. Liquid collection tank; 60. Liquid collection pipe; 61. Liquid discharge pipe; 62. Sealing ring; 63. Rotating ring; 63. Connecting rod; 64. Negative pressure pipe; 70. Air collection box; 71. Air blowing box; 71. Air blowing hole; 72. Air guide box; 73. Linkage shaft; 74. Air guide blade; 75. Friction ring; 76. Air guide pipe; 8. Material receiving trough. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0032] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] Example:

[0034] Reference Figures 1-9 A wafer fabrication and processing equipment includes a processing base 1, a rotating disk 2 rotatably connected to the top of the processing base 1, and a workstation disk 3. The rotating disk 2 has multiple workstation slots 21 evenly spaced on it, and multiple positioning frames 22 are fixedly connected to the bottom of the rotating disk 2. The workstation disk 3 is rotatably connected to the positioning frames 22. The top of the workstation disk 3 extends through the workstation slots 21 to the top of the rotating disk 2, and the processing base 1 is equipped with a drive unit for simultaneously rotating the multiple workstation disks 3. An alkaline washing tank 4 and an acid washing tank 41 are both fixed to the top of the processing base 1. The bottom ends of the output pipes of the alkaline washing tank 4 and the acid washing tank 41 are fixed and connected to a spray box 42. The bottom of the spray box 42 has spray holes 421 evenly spaced on it, and the processing base 1 is equipped with an air-filling unit to accelerate the spraying of liquid in the spray box 42. A drying assembly is mounted on the processing base 1 and is used to dry the wafer surface after alkaline washing and acid washing.

[0035] Reference Figure 1 , Figure 2 The processing base 1 has a material loading slot 8 on one side, and the bottom of the material loading slot 8 is higher than the rotating disk 2. The material loading slot 8 is the first station, used for loading and unloading; the area below the alkaline washing tank 4 is the second station, used for alkaline washing of the wafer; the area below the acid washing tank 41 is the third station, used for acid washing of the wafer; and the last one is the fourth station, used for drying the washed wafer. By switching between the above four stations, the processing can be carried out step by step, which effectively improves the wafer processing efficiency.

[0036] Reference Figures 1-5The inflation unit includes a pivot shaft 5, which is rotatably connected inside the machining base 1. The pivot shaft 5 passes through the center of the rotary disk 2 and is fixedly connected thereto. A pivot motor 51 is fixedly connected to the top of the machining base 1, and the output shaft of the pivot motor 51 is fixedly connected to the top of the pivot shaft 5. An inflation box 52 is fixedly connected to the bottom of the machining base 1. A piston plate 53 is slidably connected inside the inflation box 52. A push-pull rod 531 is rotatably connected to the outer wall of the piston plate 53. The pivot shaft 5 passes through to the bottom of the machining base 1 and is fixedly connected to a push-pull plate 54. The other end of the push-pull rod 531 is rotatably connected to the bottom of the push-pull rod 531. The alkaline washing tank 4 and the acid washing tank 4 are also connected. A pressurizing pipe 55 is fixed and connected between the tops of tanks 41, and an inflation pipe 551 is fixed and connected to the side wall of the inflation box 52. The other end of the inflation pipe 551 is connected to the pressurizing pipe 55. A one-way valve is installed inside the inflation pipe 551, and a solenoid valve is installed in the output pipes of both the alkaline washing tank 4 and the acid washing tank 41. The drive unit includes a drive motor 31, which is fixedly connected to the bottom of the rotating disk 2. A drive wheel 311 is fixedly connected to the end of the output shaft of the drive motor 31. A driven disk 32 is fixedly connected to the bottom of the rotating shaft of each set of workstation disks 3. The drive wheel 311 and multiple sets of driven disks 32 are connected by belt drive.

[0037] It should be noted that the one-way valve in the air filling pipe 551 can only allow the gas in the air filling box 52 to enter the alkaline washing tank 4 and the acid washing tank 41.

[0038] With the above-described structure, the wafer is placed into the workstation tray 3 from the first station. Then, the indexing motor 51 is activated, causing the indexing shaft 5 to rotate the rotating disk 2 90 degrees, moving the wafer to the second station. Next, the drive motor 31 is activated, and through the transmission between the driving wheel 311 and the driven disk 32, the workstation tray 3 rotates. Simultaneously, the solenoid valve in the output pipe of the alkaline washing tank 4 is opened, allowing alkaline cleaning agent to drip onto the wafer surface. With the rotation of the workstation tray 3, a comprehensive acid wash is achieved on the wafer surface. Then, the solenoid valve in the output pipe of the alkaline washing tank 4 is closed. Under the centrifugal force of the rotating workstation tray 3, the residual alkaline cleaning agent and adhering substances on the wafer surface are removed, significantly improving the cleanliness of the wafer surface. The wafer then moves to the third station, where the same principle as alkaline washing is applied for another acid wash. This synergistic effect of alkaline and acid washing effectively removes various residues from the wafer surface, achieving comprehensive cleaning and improving the cleanliness of the wafer surface.

[0039] In addition, when the indexing shaft 5 rotates, the piston plate 53 can be driven to slide back and forth in the gas filling box 52 by the setting of the push-pull plate 54 and the push-pull rod 531. When the piston plate 53 slides to the side closer to the input end of the gas filling pipe 551, it will compress the gas in the gas filling box 52 and open the one-way valve in the gas filling pipe 551, so that the compressed gas is filled into the alkaline washing tank 4 and the acid washing tank 41, thereby increasing the air pressure at the top of the inner cavity of the alkaline washing tank 4 and the acid washing tank 41. When the corresponding solenoid valve is opened, the alkaline or acidic cleaning agent will accelerate to flush the wafer surface, thereby better cleaning stubborn stains and improving the cleaning effect of the wafer surface.

[0040] Reference Figure 3 , Figure 5 , Figure 6 and Figure 9 The driven turntable 32 has a negative pressure groove 33, which is connected to the inner cavity of the work station 3. The top of the work station 3 has multiple sets of adsorption holes 34. A moving magnetic plate 331 is slidably connected in the negative pressure groove 33. A return spring 332 is fixedly connected between the top of the moving magnetic plate 331 and the top of the negative pressure groove 33. A magnetic ring 35 is fixedly connected to the bottom of the processing seat 1. The driven turntable 32 rotates along the top arc surface of the magnetic ring 35. The magnetic ring 35 and the moving magnetic plate 331 are magnetically attracted to each other. The magnetic ring 35 is provided with a decompression break 351, which is located at the first work station.

[0041] With the above structure, the magnetic ring 35 and the moving magnetic plate 331 attract each other, causing the moving magnetic plate 331 at the second, third, and fourth stations to slide towards the side of the tension return spring 332. This generates a negative pressure attraction in the negative pressure groove 33. When the wafer is placed on top of the work station 3, a negative pressure attraction is generated at the bottom of the wafer, causing the wafer to be attracted and fixed on top of the work station 3, thereby improving the stability of the wafer during the rotation cleaning process. When the work station 3 moves to the first work station, the moving magnetic plate 331 moves above the decompression break 351. At this time, the magnetic attraction disappears, and under the rebound action of the return spring 332, the moving magnetic plate 331 will return and slide, thereby releasing the negative pressure attraction in the negative pressure groove 33 so that the wafer can be removed. This self-fixation and defixation of the wafer improves the convenience of processing.

[0042] Reference Figure 3 , Figure 5 The processing base 1 has a liquid collection chamber 6 fixedly connected to its inner wall. The bottom of the rotating disk 2 is provided with multiple sets of liquid collection pipes 61 at equal intervals. The input end of the liquid collection pipe 61 extends through to the top of the rotating disk 2, and the output end of the liquid collection pipe 61 is located directly above the liquid collection chamber 6. The processing base 1 has a drain pipe 62 fixedly connected to its outer wall. The input end of the drain pipe 62 is connected to the bottom of the inner cavity of the liquid collection chamber 6.

[0043] With the above-mentioned structure, the waste liquid after alkaline washing and acid washing is thrown to the input end of the collection pipe 61 by the centrifugal force generated by the rotation of the rotating disk 2. Then, it drips down along the collection pipe 61 into the collection chamber 6 and is finally discharged by the drain pipe 62. This achieves the collection and discharge of waste liquid, improves the cleanliness of the cleaning area of ​​the rotating disk 2, avoids secondary pollution of the wafer by residual alkaline and acid washing waste, and ensures the cleaning effect of the wafer.

[0044] Reference Figure 3 , Figure 5 and Figure 6 The liquid collection chamber 6 has a sealing ring 63 fixedly connected to its side wall, and a rotating ring 631 is rotatably connected inside the sealing ring 63. A connecting rod 632 is fixedly connected between the side wall of the rotating ring 631 and the driven turntable 32. The two ends of the inner cavity of the connecting rod 632 are respectively connected to the inner cavity of the sealing ring 63 and the inner cavity of the negative pressure groove 33. The side wall of the air filling box 52 is fixed and connected to a negative pressure pipe 64. The other end of the negative pressure pipe 64 is connected to the inner cavity of the sealing ring 63, and a one-way valve is installed inside the negative pressure pipe 64.

[0045] It should be noted that the one-way valve in the negative pressure pipe 64 can only allow the gas in the negative pressure tank 33 to enter the inflation box 52.

[0046] With the above structure, when the rotating disk 2 rotates, the rotating ring 631 will rotate inside the sealing ring 63. When the piston plate 53 slides away from the output end of the negative pressure pipe 64, a negative pressure suction force will be generated in the inflation box 52, and the one-way valve in the negative pressure pipe 64 will be opened, so that the gas in the negative pressure groove 33 is sucked into the inflation box 52 along the connecting rod 632, the sealing ring 63 and the negative pressure pipe 64, thereby further increasing the negative pressure suction force in the negative pressure groove 33 and further improving the adsorption and fixation effect on the wafer.

[0047] Reference Figure 5 , Figure 6 The processing base 1 is fixedly connected to the top of an air collecting box 7. The output end of the air collecting box 7 is fixed and connected to an air blowing box 71. Air blowing holes 711 are opened at equal intervals at the bottom of the air blowing box 71. The drying assembly includes an air guide box 72. A linkage shaft 73 is rotatably connected inside the air guide box 72. An air guide blade 74 is fixedly connected to the bottom of the linkage shaft 73. The top of the linkage shaft 73 passes through the processing base 1 and is fixedly connected to a friction ring 75. The friction ring 75 is in contact with the outer wall of the driven turntable 32. The top of the air guide box 72 is connected to the inner cavity of the processing base 1. The bottom of the air guide box 72 is fixed and connected to an air guide pipe 76. The other end of the air guide pipe 76 is connected to the inner cavity of the air collecting box 7.

[0048] With the above-described structure, when the driven turntable 32 rotates at the fourth station, the friction force will drive the friction ring 75 to rotate, thereby causing the air guide vanes 74 to rotate rapidly within the air guide box 72. This allows the airflow within the air guide box 72 to quickly enter the air collection box 7 along the air guide pipe 76, and finally be blown onto the rotating wafer surface at the fourth station through the air blowing hole 711. This provides the final drying treatment for the wafer surface, avoiding the residue of rinsing liquid and further ensuring the cleanliness of the wafer surface. Furthermore, the airflow entering the air guide box 72 from the processing seat 1 can carry away the heat generated by friction within the processing seat 1, achieving effective heat dissipation within the processing seat 1 and transferring the heat to the wafer surface, thereby accelerating the drying speed of the wafer surface and improving the cleaning process efficiency.

[0049] Reference Figures 1-9 In this invention, during use, the wafer is placed into the worktable 3 from the first workstation. Then, the indexing motor 51 is turned on, causing the indexing shaft 5 to rotate the rotating disk 2 90 degrees, moving the wafer to the second workstation. Next, the drive motor 31 is turned on, and through the transmission between the driving wheel 311 and the driven disk 32, the worktable 3 rotates. Simultaneously, the solenoid valve in the output pipe of the alkaline washing tank 4 is opened, allowing alkaline cleaning agent to drip onto the wafer surface. With the rotation of the worktable 3, a comprehensive acid wash is achieved on the wafer surface. Then, the solenoid valve in the output pipe of the alkaline washing tank 4 is closed. Under the centrifugal force of the rotating worktable 3, the residual alkaline cleaning agent and adhering substances on the wafer surface are removed, significantly improving the cleanliness of the wafer surface. The wafer then moves to the third workstation, where the same principle as alkaline washing is applied for another acid wash. This utilizes the synergistic effect of alkaline washing and acid washing to effectively remove various residues from the wafer surface, achieving comprehensive cleaning and improving the cleanliness of the wafer surface. The wafer then moves to the fourth station. As the driven turntable 32 rotates, friction causes the friction ring 75 to rotate, which in turn drives the air guide vanes 74 to rotate rapidly within the air guide box 72. This allows the airflow within the air guide box 72 to quickly enter the air collection box 7 along the air guide duct 76, and finally be blown through the air outlet 711 onto the rotating wafer surface at the fourth station. This provides the final drying treatment to the wafer surface, preventing any residue from the rinsing liquid and further ensuring the cleanliness of the wafer surface. After cleaning, the wafer rotates back to the first station, where it can be removed and a new wafer placed. All four stations can operate simultaneously, enabling continuous cleaning of multiple wafers and effectively improving processing efficiency.

[0050] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A wafer fabrication and processing equipment, comprising a processing stand (1), characterized in that, The top of the processing base (1) is rotatably connected to a rotating disk (2), and also includes: The workstation disk (3) has multiple sets of workstation slots (21) evenly spaced on the rotating disk (2). Multiple sets of positioning frames (22) are fixedly connected to the bottom of the rotating disk (2). The workstation disk (3) is rotatably connected to the positioning frames (22). The top of the workstation disk (3) extends through the workstation slot (21) to the top of the rotary disk (2), and the processing base (1) is provided with a drive unit that drives multiple workstation disks (3) to rotate simultaneously. Alkali washing tank (4) and acid washing tank (41) are both fixed on the top of the processing base (1). The bottom ends of the output pipes of the alkaline washing tank (4) and the acid washing tank (41) are fixed and connected to the spray box (42). The bottom of the spray box (42) is provided with spray holes (421) at equal intervals. The processing seat (1) is provided with an air-filling part to accelerate the spraying of liquid in the spray box (42). The drying assembly is disposed on the processing base (1) and is used to dry the wafer surface after alkaline washing and acid washing.

2. The wafer fabrication equipment according to claim 1, characterized in that, The drive unit includes a drive motor (31), which is fixedly connected to the bottom of the rotating disk (2). The output shaft end of the drive motor (31) is fixedly connected to a drive wheel (311). The bottom end of the rotating shaft of each set of workstation disks (3) is fixedly connected to a driven disk (32). The drive wheel (311) and multiple sets of driven disks (32) are connected by belt drive.

3. The wafer fabrication equipment according to claim 2, characterized in that, The driven turntable (32) is provided with a negative pressure groove (33), which is connected to the inner cavity of the work station plate (3). The top of the work station plate (3) is provided with multiple sets of adsorption holes (34). A moving magnetic plate (331) is slidably connected in the negative pressure groove (33). A reset spring (332) is fixedly connected between the top of the moving magnetic plate (331) and the top of the negative pressure groove (33). A magnetic ring (35) is fixedly connected to the bottom of the processing seat (1). The driven turntable (32) rotates along the top arc surface of the magnetic ring (35). The magnetic ring (35) and the moving magnetic plate (331) are magnetically attracted to each other. A decompression break (351) is provided on the magnetic ring (35).

4. The wafer fabrication equipment according to claim 3, characterized in that, The inflation unit includes a pivot shaft (5), which is rotatably connected inside the machining base (1). The pivot shaft (5) passes through the center of the rotary disk (2) and is fixedly connected thereto. A pivot motor (51) is fixedly connected to the top of the machining base (1), and the output shaft of the pivot motor (51) is fixedly connected to the top of the pivot shaft (5). An inflation box (52) is fixedly connected to the bottom of the machining base (1), and a piston plate (53) is slidably connected inside the inflation box (52). A push-pull rod (531) is rotatably connected to the outer wall. The indexing shaft (5) passes through to the bottom of the processing seat (1) and is fixedly connected to a push-pull plate (54). The other end of the push-pull rod (531) is rotatably connected to the bottom of the push-pull rod (531). A pressurizing pipe (55) is fixed and connected between the top of the alkaline washing tank (4) and the acid washing tank (41). An air filling box (52) is fixed and connected to the side wall with an air filling pipe (551). The other end of the air filling pipe (551) is connected to the pressurizing pipe (55).

5. The wafer fabrication equipment according to claim 4, characterized in that, A one-way valve is installed inside the air filling pipe (551), and a solenoid valve is installed inside the output pipes of the alkaline washing tank (4) and the acid washing tank (41).

6. The wafer fabrication equipment according to claim 4, characterized in that, The inner wall of the processing base (1) is fixedly connected to a liquid collection chamber (6). Multiple sets of liquid collection pipes (61) are evenly spaced at the bottom of the rotating disk (2). The input end of the liquid collection pipe (61) extends through to the top of the rotating disk (2), and the output end of the liquid collection pipe (61) is located directly above the liquid collection chamber (6). A drain pipe (62) is fixedly connected to the outer wall of the processing base (1). The input end of the drain pipe (62) is connected to the bottom of the inner cavity of the liquid collection chamber (6).

7. The wafer fabrication equipment according to claim 6, characterized in that, A sealing ring (63) is fixedly connected to the side wall of the liquid collection tank (6). A rotating ring (631) is rotatably connected inside the sealing ring (63). A connecting rod (632) is fixedly connected between the side wall of the rotating ring (631) and the driven turntable (32). The two ends of the inner cavity of the connecting rod (632) are respectively connected to the inner cavity of the sealing ring (63) and the inner cavity of the negative pressure groove (33). A negative pressure pipe (64) is fixedly connected to the side wall of the air filling box (52). The other end of the negative pressure pipe (64) is connected to the inner cavity of the sealing ring (63). A one-way valve is provided inside the negative pressure pipe (64).

8. The wafer fabrication equipment according to claim 2, characterized in that, The processing base (1) is fixedly connected to the top of the air collecting box (7), the output end of the air collecting box (7) is fixed and connected to the air blowing box (71), and the bottom end of the air blowing box (71) is provided with air blowing holes (711) at equal intervals.

9. A wafer fabrication and processing equipment according to claim 8, characterized in that, The drying assembly includes an air guide box (72), a linkage shaft (73) is rotatably connected inside the air guide box (72), an air guide blade (74) is fixedly connected to the bottom end of the linkage shaft (73), the top end of the linkage shaft (73) extends into the processing seat (1) and is fixedly connected to a friction ring (75), and the friction ring (75) is in contact with the outer wall of the driven turntable (32), the top of the air guide box (72) is connected to the inner cavity of the processing seat (1), the bottom of the air guide box (72) is fixed and connected to an air guide pipe (76), and the other end of the air guide pipe (76) is connected to the inner cavity of the air collecting box (7).

10. A wafer fabrication and processing equipment according to claim 1, characterized in that, The processing seat (1) has a material picking groove (8) on one side, and the bottom of the material picking groove (8) is higher than the rotating disk (2).

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