Wafer chucking tooling carrier mechanism and wafer bonding apparatus

By using the three-point positioning and axial limiting of the wafer fixture bearing mechanism, the problem of wobbling and offset of the wafer fixture during the clamping process is solved, and high-precision alignment and high-yield wafer bonding are achieved.

CN122249020APending Publication Date: 2026-06-19天津中科晶禾电子科技有限责任公司
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
天津中科晶禾电子科技有限责任公司
Filing Date
2026-05-09
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In the existing technology, wafer fixtures are prone to shaking and displacement during clamping, resulting in wafer alignment deviation, which affects clamping and positioning accuracy and production yield, making it difficult to meet high-precision alignment requirements.

Method used

A wafer fixture support mechanism is provided, which employs a positioning component and a clamping component. Through three-point positioning and axial limiting, the positional accuracy and stability of the wafer fixture are ensured. The mechanism includes a first positioning block, a second positioning block, a third positioning block, and a clamping component. The wafer fixture is fixed by using a driving component and a clamping component.

Benefits of technology

It improves the positional accuracy and stability of wafer fixtures, enhances wafer bonding quality and product yield, and ensures the accuracy and stability of wafer alignment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122249020A_ABST
    Figure CN122249020A_ABST
Patent Text Reader

Abstract

This invention relates to the field of wafer bonding technology, and discloses a wafer fixture support mechanism and wafer bonding equipment. The wafer fixture support mechanism has a stage with a support station for supporting the wafer fixture. A first positioning block, a second positioning block, and a positioning component are circumferentially spaced around the support station. The positioning component includes a drive member and a third positioning block. The drive member is driven and connected to the third positioning block, and is configured to drive the third positioning block to push the wafer fixture against the first and second positioning blocks. A clamping component is disposed on the stage and located on one side of the support station, and is used to clamp the wafer fixture onto the stage. This invention achieves the positioning of the wafer fixture; achieves circumferential and axial limiting of the wafer fixture, improving the stability of the wafer fixture; improves the wafer bonding quality, and increases product yield.
Need to check novelty before this filing date? Find Prior Art