Two-dimensional material transfer method based on non-covalent bonding layer and multi-component synergistic support layer

Abstract

This invention provides a method for transferring two-dimensional materials based on a non-covalent adhesive layer and a multi-component synergistic support layer. The method includes: sequentially coating a non-covalent adhesive layer and a multi-component synergistic support layer onto the surface of a two-dimensional material; releasing the two-dimensional material from the original substrate through physical peeling to obtain a composite film, which is then attached to a target substrate; removing the multi-component synergistic support layer and the non-covalent adhesive layer to obtain a two-dimensional material / target substrate structure. The non-covalent adhesive layer contains aromatic anchoring groups capable of non-covalently interacting with the surface of the two-dimensional material to form a non-covalent bond, and also contains compatible or reactive groups compatible with the multi-component synergistic support layer. The multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent. This invention can solve the technical problems of weak interfacial bonding, insufficient shear strength, and easy wrinkling and cracking between the two-dimensional material and the support layer during the transfer process.

Description

Technical Field

[0001] This invention relates to the field of two-dimensional material preparation and transfer technology, specifically to a two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer. Background Technology

[0002] Two-dimensional materials (such as graphene, hexagonal boron nitride, and transition metal chalcogenides) have excellent electrical, thermal, mechanical, and optical properties, and therefore have broad application prospects in electronic devices, optoelectronic devices, flexible sensing, and membrane separation. Chemical vapor deposition is the main method for preparing large-area two-dimensional materials, but the obtained two-dimensional materials are usually located on the surface of the original substrate such as copper foil or nickel foil, and must be transferred to the target substrate through a transfer step before they can be used.

[0003] Existing two-dimensional material transfer technologies mostly employ a single polymer support layer such as PMMA (polymethyl methacrylate). While the process is simple, it suffers from problems such as significant polymer residue, a soft and wrinkle-prone support layer, susceptibility to cracking and wrinkling during transfer, high interfacial stress, and incomplete removal. In recent years, transfer schemes utilizing porous membranes, self-supporting membranes, or tape systems have emerged. These schemes typically focus on achieving self-support in air or minimizing water surface exposure through membrane structures; however, the core of these schemes remains primarily the membrane structure itself, failing to specifically address interfacial wetting, interfacial shear strength, and separation stability between the two-dimensional material and the support layer.

[0004] Therefore, developing a composite support system that can enhance the interface matching between two-dimensional materials and the support layer, while also taking into account mechanical support, drying and leveling, and subsequent removability, is of great significance for improving the integrity of two-dimensional material transfer, reducing wrinkles and cracks, and minimizing residues. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention proposes a two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer. This method aims to solve the technical problems in existing technologies, such as weak interfacial bonding between the two-dimensional material and the support layer during the transfer process, insufficient interfacial shear strength, and easy wrinkling and cracking during the transfer process.

[0006] The technical solution adopted in this invention is as follows: In a first aspect, a two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer is provided, comprising the following steps: A non-covalent bonding layer is coated on the surface of a two-dimensional material grown on a primary substrate and then dried to form a non-covalent bonding layer structure / two-dimensional material / primary substrate structure. A multi-component synergistic support layer is coated and cured on a non-covalent adhesive layer to form a multi-component synergistic support layer / non-covalent adhesive layer / two-dimensional material / original substrate structure; The two-dimensional material was released from the original substrate by physical peeling, resulting in a composite film with a structure of multi-component synergistic support layer / non-covalent bonding layer / two-dimensional material; The composite film is attached to the target substrate, and the multi-component synergistic support layer and non-covalent bonding layer in the composite film are removed to obtain a two-dimensional material / target substrate structure.

[0007] Furthermore, the two-dimensional material includes graphene, graphene oxide, hexagonal boron nitride, or transition metal chalcogenides; the target substrate includes silicon wafers, glass, quartz, sapphire, PI, PET, PDMS, or other flexible and rigid substrates.

[0008] Furthermore, the non-covalent adhesive layer is used to interact non-covalently with the surface of the two-dimensional material to form a non-covalent bond, and is also used to improve the wettability, adhesion and interfacial shear strength between the multi-component synergistic support layer and the non-covalent adhesive layer.

[0009] Furthermore, the non-covalent bonding layer includes an aromatic anchoring layer and a compatibility transition layer. The aromatic anchoring layer is formed by coating and drying a solution containing aromatic anchoring groups. The compatibility transition layer is formed by coating and drying a solution containing compatibility groups compatible with the multi-component synergistic support layer. During coating, the aromatic anchoring layer and the compatibility transition layer are sequentially coated on the surface of the two-dimensional material. The aromatic anchoring group is used to interact non-covalently with the surface of the two-dimensional material and form a non-covalent bond. The compatibility groups are used to undergo addition, ring-opening, condensation, or free radical polymerization reactions with functional groups in adjacent layers under heating, light, or curing conditions, thereby improving the wettability, adhesion, and interfacial shear strength between adjacent layers.

[0010] Furthermore, the aromatic anchoring group includes one or more of 1-pyrene butyric acid, pyrene, biphenyl, naphthalene, anthracene, phenanthrene or their derivatives, or is a molecule, oligomer or polymer with an aromatic anchoring group end group; The compatibility groups include one or more of the following: carboxyl, hydroxyl, amino, epoxy, isocyanate, acrylate, amide, ester, urethane, nitrocellulose compatibility groups, and cellulose acetate butyrate compatibility groups.

[0011] Furthermore, the non-covalent adhesive layer is formed by preparing a solution of a polymer with pyrene or biphenyl end groups and whose main chain or side chain contains groups compatible with cellulose, resin or polyurethane, and then coating and drying it.

[0012] Furthermore, the multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent; wherein the film-forming agent includes one or more of cellulose acetate butyrate, nitrocellulose, acrylic resin, and polyurethane; the plasticizer includes one or more of acetylated tributyl citrate, camphor, and phthalates; the fast-drying solvent includes one or more of ethyl acetate and acetone; and the slow-drying solvent includes one or more of butyl acetate, propylene glycol methyl ether acetate, and cyclohexanone.

[0013] Furthermore, the multi-component synergistic support layer and non-covalent adhesive layer in the composite membrane are removed by solvent immersion, wherein the solvent includes acetone, ethyl acetate, butyl acetate, aromatic hydrocarbon solvents, ketone solvents or ester solvents.

[0014] In a second aspect, a composite support system for two-dimensional material transfer is provided. This composite support system is used to implement the two-dimensional material transfer method described in the first aspect, which is based on a non-covalent adhesive layer and a multi-component synergistic support layer. The composite support system includes a non-covalent adhesive layer and a multi-component synergistic support layer. The non-covalent adhesive layer contains aromatic anchoring groups capable of non-covalently interacting with the surface of the two-dimensional material to form a non-covalent bond, and also contains compatible or reactive groups compatible with the multi-component synergistic support layer. The multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent.

[0015] Thirdly, a two-dimensional material / target substrate structure is provided, characterized in that it is prepared by the two-dimensional material transfer method based on a non-covalent bonding layer and a multi-component synergistic support layer as described in the first aspect.

[0016] As can be seen from the above technical solution, the beneficial technical effects of the present invention are as follows: When transferring two-dimensional materials, it can balance film strength, flexibility, leveling, and subsequent removability. The composite design of "interfacial primer with non-covalent adhesive layer + multi-component support layer" utilizes aromatic anchoring groups to bond with the surface of two-dimensional materials. Stacking enhances the wettability and adhesion of the support layer on the surface of two-dimensional materials, eliminating the need for covalent drilling or bond breaking, and is less likely to damage the lattice integrity of two-dimensional materials than covalent surface modification; the overall mechanical integrity of the composite film is improved through a compatible undercoating layer, making it more suitable for physical peeling processes; the support layer, through the synergistic effect of multiple components, regulates hardness, toughness, and drying rate, which helps to reduce wrinkles, cracks, and residues during the transfer process. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0018] Figure 1 This is a schematic diagram of the process for two-dimensional material transfer based on a non-covalent adhesive layer and a multi-component synergistic support layer in an embodiment of the present invention; Figure 2 The image shows the optical characterization of the graphene / silicon wafer obtained using the two-dimensional material transfer method provided in this embodiment. Figure 3 The image shows the Raman surface scan of graphene obtained using the two-dimensional material transfer method provided in this embodiment. Figure 4 The images show the Raman spectra of graphene / silicon wafers transferred using different transfer methods. Detailed Implementation

[0019] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0020] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application should have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0021] Example This embodiment provides a two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer. The transfer method is as follows: Figure 1 As shown, it includes the following steps: S1. A non-covalent bonding layer is coated onto the surface of the two-dimensional material grown on the original substrate and dried to form a non-covalent bonding layer structure / two-dimensional material / original substrate structure. In this embodiment, the two-dimensional material includes graphene, graphene oxide, hexagonal boron nitride, or transition metal chalcogenides (such as molybdenum disulfide or tungsten diselenide); the material of the original substrate is not limited and may be copper foil, nickel foil, cobalt foil, or alloys thereof.

[0022] The non-covalent adhesive layer comprises an aromatic anchoring layer and a compatible transition layer. The aromatic anchoring layer is formed by coating and drying a solution containing aromatic anchoring groups. The compatible transition layer is formed by coating and drying a solution containing compatible groups compatible with the multi-component synergistic support layer. In a specific embodiment, the aromatic anchoring layer and the compatible transition layer are sequentially coated on the surface of a two-dimensional material to form a non-covalent adhesive layer, resulting in a two-dimensional material / non-covalent adhesive layer structure.

[0023] For the formed two-dimensional material / non-covalent adhesive layer structure, one side of the aromatic anchoring layer is bonded to the two-dimensional material, and the other side of the aromatic anchoring layer is bonded to the compatible transition layer. The aromatic anchoring layer contains aromatic anchoring groups that interact non-covalently with the surface of the two-dimensional material. The compatible transition layer contains compatible or reactive groups that are compatible with the multi-component synergistic support layer. "Reactive" means that the compatible groups can undergo addition, ring-opening, condensation, or free radical polymerization reactions with functional groups in adjacent layers under heating, light, or curing conditions to improve the wettability, adhesion, and interfacial shear strength between adjacent layers, and enhance the interfacial bonding stability between the aromatic anchoring layer, the compatible transition layer, and the multi-component synergistic support layer.

[0024] In some embodiments, the aromatic anchoring group includes one or more of 1-pyrene butyric acid, pyrene, biphenyl, naphthalene, anthracene, phenanthrene, or their derivatives, or is a molecule, oligomer, or polymer with an aromatic anchoring group end group. The aromatic anchoring group is used to generate non-covalent interactions with the surface of two-dimensional materials (especially...). Stacking), without significant damage Under the premise of lattice, the surface energy, wettability and interfacial bonding behavior can be changed.

[0025] In some embodiments, the compatibility groups include one or more of carboxyl, hydroxyl, amino, epoxy, isocyanate, acrylate, amide, ester, urethane, nitrocellulose compatibility groups, and cellulose acetate butyrate compatibility groups. The compatibility groups are used to improve the wettability, adhesion, and interfacial shear strength between the non-covalent adhesive layer and the multi-component synergistic support layer; the compatibility transition layer is responsible for transferring stress between the aromatic anchoring layer and the multi-component synergistic support layer, improving spreading, and inhibiting interfacial delamination.

[0026] The method of coating the aromatic anchoring layer and the compatible transition layer is not limited and can be implemented by any feasible method in the prior art, including spin coating, dip coating, spray coating, blade coating, printing, or self-assembly adsorption. The drying temperature is 90-110°C, preferably 100°C.

[0027] For covalent adhesive layers, in some embodiments, preferably, polymers with pyrene or biphenyl end groups and whose main chain or side chains contain groups compatible with cellulose, resin, or polyurethane can also be selected. These polymers are prepared into solutions using suitable solvents and then coated onto the surface of a two-dimensional material by dip coating, spraying, blade coating, or self-assembly adsorption, followed by drying, to directly form a non-covalent adhesive layer on the surface of the two-dimensional material. This type of non-covalent adhesive layer no longer distinguishes between aromatic anchoring layers and compatible transition layers. While maintaining the non-covalent anchoring effect, its end-group polymers can further improve compatibility with the support layer and film stability. Its derived compatible groups are used to improve wetting and bonding with the multi-component synergistic support layer in subsequent steps.

[0028] S2. Coat a multi-component synergistic support layer onto the non-covalent adhesive layer and cure it to form a multi-component synergistic support layer / non-covalent adhesive layer / two-dimensional material / original substrate structure. The multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent. The film-forming agent includes one or more of cellulose acetate butyrate, nitrocellulose, acrylic resin, and polyurethane; the plasticizer includes one or more of acetylated tributyl citrate, camphor, and phthalates; the fast-drying solvent includes one or more of ethyl acetate and acetone; and the slow-drying solvent includes one or more of butyl acetate, propylene glycol methyl ether acetate, and cyclohexanone.

[0029] A multi-component synergistic support layer is coated onto the non-covalent adhesive layer. The coating method is not limited and can be implemented by any feasible method in the prior art, including spin coating, brush coating, spray coating, dip coating, or blade coating. The curing temperature is 110-130℃, preferably 120℃.

[0030] The multi-component synergistic support layer is responsible for mechanical support, flexibility, drying behavior, and subsequent removability. Using the multi-component synergistic support layer prepared in this step for the transfer of two-dimensional materials can improve the stress transfer uniformity and separation integrity at the interface between the support layer and graphene.

[0031] S3. The two-dimensional material is released from the original substrate by physical peeling to obtain a composite film with a structure of multi-component synergistic support layer / non-covalent bonding layer / two-dimensional material. The physical peeling method utilizes the enhanced adsorption effect of the non-covalent adhesive layer on the interface of the two-dimensional material to directly tear or peel off the composite film of the multi-component synergistic support layer / non-covalent adhesive layer / two-dimensional material from the original substrate. In specific embodiments, the physical peeling method is not limited and can be implemented in any feasible manner in the prior art.

[0032] S4. Attach the composite film to the target substrate. In this embodiment, the target substrate includes a silicon wafer ( The composite film can be applied to the target substrate using various substrates, including glass, quartz, sapphire, PI (polyimide), PET (polyethylene terephthalate), PDMS (polydimethylsiloxane), or other flexible or rigid substrates. The composite film is then attached to the surface of the target substrate and subjected to pressure, heating, or static drying to ensure full adhesion.

[0033] S5. Remove the multi-component synergistic support layer and non-covalent bonding layer from the composite film to obtain the two-dimensional material / target substrate structure. The multi-component synergistic support layer and non-covalent bonding layer in the composite film are removed by solvent, heating, or a combination thereof to obtain a two-dimensional material / target substrate structure, thus completing the transfer of the two-dimensional material.

[0034] In specific embodiments, the removal method is preferably solvent immersion or solvent heating immersion. Solvents include acetone, ethyl acetate, butyl acetate, aromatic hydrocarbon solvents, ketone solvents, ester solvents, or a mixture of one or more of the above solvents. Solvent immersion can be carried out at room temperature, while solvent heating immersion is performed at a temperature of 30-200℃ (preferably 60-80℃) for 5-60 min (preferably 5-20 min), which can be adjusted according to the thickness of the multi-component synergistic support layer, the composition of the non-covalent adhesive layer, and the tolerance of the target two-dimensional material.

[0035] The two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer described above in this embodiment will be illustrated below with examples of some of the raw materials described therein: The two-dimensional material used is graphene, the primary substrate is copper foil, and the target substrate is a silicon wafer.

[0036] First, an aromatic anchoring layer is coated on the graphene surface. The aromatic anchoring group is 1-pyrene butyric acid, which is dissolved in a suitable solvent to prepare an aromatic anchoring group solution of 0.01-20 mg / mL (preferably 0.1-10 mg / mL). Suitable solvents include ethanol, isopropanol, acetone, tetrahydrofuran, N,N-dimethylformamide, dimethyl sulfoxide, ethyl acetate, butyl acetate, chloroform, dichloromethane, or mixtures thereof, preferably ethanol, isopropanol, tetrahydrofuran, or a mixture of ethanol and tetrahydrofuran. The graphene sample grown on copper foil is fixed on a spin coater, and the aromatic anchoring group solution is added dropwise and spin-coated at 500-3000 rpm for 10-60 s, followed by drying at 100°C. The pyrene group plane is then aligned with the graphene surface. Stacked adsorption forms an ultrathin non-covalent bond on the graphene surface. Next, liquid nitrocellulose, acrylic resin, polyurethane, or UV-curable adhesive is coated onto the surface of the aromatic anchoring layer (the side away from the graphene) and spin-coated at 500-3000 rpm for 10-60 s, followed by drying at 100°C. The thickness of the compatibility transition layer is tens to hundreds of nanometers. The non-covalent bond layer obtained by the above method, comprising the aromatic anchoring layer and the compatibility transition layer, has a total thickness of 5-500 nm, preferably 10-200 nm.

[0037] For non-covalent bonding layers that do not distinguish between aromatic anchoring layers and compatible transition layers, MPEG-pyrene butyric acid can be dissolved in a suitable solvent to prepare a solution of 0.1-1.0 mg / mL. This solution is then coated onto the graphene surface via dip coating, spraying, blade coating, or self-assembly adsorption and dried to form a non-covalent bonding layer on the graphene surface. The thickness of this layer is 5-500 nm, preferably 10-200 nm. Suitable solvents for preparing the solution include tetrahydrofuran, acetone, ethyl acetate, butyl acetate, N,N-dimethylformamide, dimethyl sulfoxide, chloroform, dichloromethane, toluene, xylene, or mixtures thereof. For end-group polymers containing ester groups, acrylic segments, or cellulose ester compatible segments, tetrahydrofuran, ethyl acetate, butyl acetate, or mixtures thereof are preferred. For end-group polymers with strong aromaticity and high hydrophobicity, toluene, xylene, chloroform, or dichloromethane can also be used as solvents.

[0038] Then, a multi-component synergistic support layer solution was coated onto the surface of the non-covalent bonding layer (the side away from graphene) by spin coating at 500-3000 rpm for 10-60 s, followed by curing at 120℃ to obtain a multi-component synergistic support layer / non-covalent bonding layer / graphene / copper foil structure. The multi-component synergistic support layer solution was prepared as follows: 8 mL of ethyl acetate, 5.4 mL of butyl acetate, and 0.8 mL of tributyl acetate citrate were weighed, and 2.16 g of cellulose acetate butyrate was weighed; the above components were added to a beaker and mixed and stirred, and then alternately heated in a 70℃ water bath for 5 min and ultrasonically dispersed for 20 min until the solid was completely dissolved. After standing for at least 12 h, the multi-component synergistic support layer solution was obtained.

[0039] After drying pretreatment, the sample with the multi-component synergistic support layer / non-covalent adhesive layer / graphene / copper foil structure is then peeled off from the edge by applying a peeling force, so that the composite film of the multi-component synergistic support layer / non-covalent adhesive layer / graphene is directly peeled off from the surface of the copper foil.

[0040] Then, the composite film is attached to the surface of the target substrate silicon wafer, and physical pressure is applied to make the composite film fully adhere to the silicon wafer.

[0041] Finally, acetone was used to remove the multi-component synergistic support layer and non-covalent bonding layer from the composite film by immersion, resulting in a graphene / silicon wafer structure.

[0042] This invention employs a two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer. This method balances film strength, flexibility, leveling, and subsequent removability. Compared to transferring two-dimensional materials using a single polymer support layer, this invention utilizes a composite design of "interfacial primer with a non-covalent adhesive layer + multi-component support layer," leveraging aromatic anchoring groups on the surface of the two-dimensional material. Stacking enhances the wettability and adhesion of the support layer on the surface of two-dimensional materials, eliminating the need for covalent drilling or bond breaking, and is less likely to damage the lattice integrity of two-dimensional materials than covalent surface modification; the overall mechanical integrity of the composite film is improved through a compatible undercoating layer, making it more suitable for physical peeling processes; the support layer, through the synergistic effect of multiple components, regulates hardness, toughness, and drying rate, which helps to reduce wrinkles, cracks, and residues during the transfer process.

[0043] To illustrate the effectiveness of the transfer method described in this application, the following comparative examples and experimental data are used: Using the transfer method of this embodiment, the transferred monolayer graphene film is continuous and intact under light magnification, as shown in the example. Figure 2 As shown. Raman characterization , Raman spectroscopy calculations show that the p-type doping level reaches 0.952. The Van der Berg-Hall measurement characterizes mobility. ,like Figure 3 As shown.

[0044] As a comparative example, monolayer graphene obtained by transfer using conventional PMMA as a support layer was characterized by Raman spectroscopy. , Raman spectroscopy calculations show that the p-type doping reaches 1.020. The Van der Berg-Hall measurement characterizes mobility. ,like Figure 4 As shown in the above experiments, the graphene obtained by transferring two-dimensional materials using the method described in this embodiment is of significantly better quality than that obtained by existing transfer methods.

[0045] Regarding the transfer method provided in this application, those skilled in the art should understand that any adjustments or substitutions made to the type of non-covalent binder, the type of aromatic anchoring group and compatible group, the solvent system, the type of film-forming agent, the release method and the removal method without departing from the concept of this invention should fall within the protection scope defined by the claims of this invention.

[0046] In some embodiments, a composite support system for two-dimensional material transfer is also provided. This composite support system is used to implement the two-dimensional material transfer method described above based on a non-covalent adhesive layer and a multi-component synergistic support layer. The composite support system includes a non-covalent adhesive layer and a multi-component synergistic support layer. The non-covalent adhesive layer contains aromatic anchoring groups capable of non-covalently interacting with the surface of the two-dimensional material to form a non-covalent bond, and also contains compatible or reactive groups compatible with the multi-component synergistic support layer. The multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent.

[0047] In some embodiments, a two-dimensional material / target substrate structure is also provided, which is prepared using the two-dimensional material transfer method described above based on a non-covalent bonding layer and a multi-component synergistic support layer.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. A two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer, characterized in that, Includes the following steps: A non-covalent bonding layer is coated on the surface of a two-dimensional material grown on a primary substrate and then dried to form a non-covalent bonding layer structure / two-dimensional material / primary substrate structure. A multi-component synergistic support layer is coated and cured on a non-covalent adhesive layer to form a multi-component synergistic support layer / non-covalent adhesive layer / two-dimensional material / original substrate structure; The two-dimensional material was released from the original substrate by physical peeling, resulting in a composite film with a structure of multi-component synergistic support layer / non-covalent bonding layer / two-dimensional material; The composite film is attached to the target substrate, and the multi-component synergistic support layer and non-covalent bonding layer in the composite film are removed to obtain a two-dimensional material / target substrate structure.

2. The two-dimensional material transfer method according to claim 1, characterized in that, The two-dimensional material includes graphene, graphene oxide, hexagonal boron nitride, or transition metal chalcogenides; the target substrate includes silicon wafers, glass, quartz, sapphire, PI, PET, PDMS, or other flexible and rigid substrates.

3. The two-dimensional material transfer method according to claim 1, characterized in that, The non-covalent adhesive layer is used to interact non-covalently with the surface of the two-dimensional material and form a non-covalent bond. It is also used to improve the wettability, adhesion and interfacial shear strength between the non-covalent adhesive layer and the multi-component synergistic support layer.

4. The two-dimensional material transfer method according to claim 3, characterized in that, The non-covalent bonding layer includes an aromatic anchoring layer and a compatibility transition layer. The aromatic anchoring layer is formed by coating and drying a solution containing aromatic anchoring groups. The compatibility transition layer is formed by coating and drying a solution containing compatibility groups compatible with the multi-component synergistic support layer. During coating, the aromatic anchoring layer and the compatibility transition layer are sequentially coated on the surface of the two-dimensional material. The aromatic anchoring group is used to interact non-covalently with the surface of the two-dimensional material and form a non-covalent bond. The compatibility groups are used to undergo addition, ring-opening, condensation, or free radical polymerization reactions with functional groups in adjacent layers under heating, light, or curing conditions, thereby improving the wettability, adhesion, and interfacial shear strength between adjacent layers.

5. The two-dimensional material transfer method according to claim 3, characterized in that, The aromatic anchoring group includes one or more of 1-pyrene butyric acid, pyrene, biphenyl, naphthalene, anthracene, phenanthrene or their derivatives, or is a molecule, oligomer or polymer with an aromatic anchoring group end group; The compatibility groups include one or more of the following: carboxyl, hydroxyl, amino, epoxy, isocyanate, acrylate, amide, ester, urethane, nitrocellulose compatibility groups, and cellulose acetate butyrate compatibility groups.

6. The two-dimensional material transfer method according to claim 3, characterized in that, The non-covalent adhesive layer is formed by preparing a solution of a polymer with pyrene or biphenyl end groups and whose main chain or side chain contains groups compatible with cellulose, resin or polyurethane, and then coating and drying it.

7. The two-dimensional material transfer method according to claim 1, characterized in that, The multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent; wherein the film-forming agent includes one or more of cellulose acetate butyrate, nitrocellulose, acrylic resin, and polyurethane; the plasticizer includes one or more of acetylated tributyl citrate, camphor, and phthalates; the fast-drying solvent includes one or more of ethyl acetate and acetone; and the slow-drying solvent includes one or more of butyl acetate, propylene glycol methyl ether acetate, and cyclohexanone.

8. The two-dimensional material transfer method according to claim 1, characterized in that, The multi-component synergistic support layer and non-covalent adhesive layer in the composite membrane are removed by solvent immersion, wherein the solvent includes acetone, ethyl acetate, butyl acetate, aromatic hydrocarbon solvents, ketone solvents or ester solvents.

9. A composite support system for two-dimensional material transfer, characterized in that, The composite support system is used to realize the two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer as described in any one of claims 1-8. The composite support system includes a non-covalent adhesive layer and a multi-component synergistic support layer. The non-covalent adhesive layer contains aromatic anchoring groups that can interact non-covalently with the surface of the two-dimensional material to form a non-covalent bond, and also contains compatible or reactive groups that are compatible with the multi-component synergistic support layer. The multi-component synergistic support layer is prepared based on a film-forming agent, a plasticizer, a fast-drying solvent, and a slow-drying solvent.

10. A two-dimensional material / target substrate structure, characterized in that, It was prepared using the two-dimensional material transfer method based on a non-covalent adhesive layer and a multi-component synergistic support layer as described in any one of claims 1-8.

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