Electronic device and method of manufacturing an electronic device

By employing a module-substrate coupling structure in electronic packaging, combined with metal structures and thermal interface materials, the problems of high cost, low reliability, and warpage in existing technologies are solved, achieving more efficient thermal performance and mechanical stability.

CN122249048APending Publication Date: 2026-06-19AMKOR TECH SINGAPORE HLDG PTE LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
AMKOR TECH SINGAPORE HLDG PTE LTD
Filing Date
2025-12-10
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing electronic packaging methods result in high costs, low reliability, low performance, or excessively large package sizes, and are prone to warping or denting under thermal changes.

Method used

By employing a coupling structure between module substrates, combining a metal structure and thermal interface materials, the thermal expansion difference is offset by CTE matching of the metal structure, reducing warpage and dents, and improving thermal performance by reducing the use of thermal interface materials.

Benefits of technology

It reduces the cost of electronic packaging, improves reliability and thermal performance, while reducing warpage and denting issues and enhancing mechanical stability.

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Abstract

Electronic device and method of manufacturing electronic device. In one example, an electronic device includes a module comprising electronic components and a first encapsulation disposed around a lateral side of the electronic components. A substrate is coupled to the module. A metal structure is coupled to one side of the module opposite the substrate, and the metal structure is coupled to the back side of the electronic components. A thermal interface material is coupled to the metal structure. A cap is coupled to the thermal interface material. Other examples and related methods are also disclosed herein.
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