Wavy manifold counterflow microchannel heat sink and electronic device cooling assembly

By designing a wave-shaped manifold layer with staggered flow channels in the microchannel heat sink, the complete counter-current flow of the cooling medium is achieved, solving the problem of uneven heat exchange in the compact structure of the microchannel heat sink, and improving heat dissipation efficiency and chip reliability.

CN122249050APending Publication Date: 2026-06-19UNIV OF SCI & TECH OF CHINA
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
UNIV OF SCI & TECH OF CHINA
Filing Date
2026-03-17
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing microchannel heat sinks struggle to achieve efficient and uniform countercurrent heat transfer within a compact structure, leading to issues such as localized hot spots, chip warping, and thermal failure.

Method used

A wave-shaped manifold counterflow microchannel heat sink is designed. By alternately arranging inlet and outlet channels on the parallel plate microchannel heat sink layer, the cooling medium can achieve complete counterflow within the microchannel. Combined with silicon-based etching process, a highly hermetic package is manufactured.

Benefits of technology

It significantly reduces the local hot spot temperature on the heat source surface, improves the uniformity of temperature distribution, prevents chip warping and thermal failure, and enhances chip reliability and lifespan.

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Abstract

This invention discloses a corrugated manifold counter-current microchannel heat sink and an electronic device cooling assembly, belonging to the field of electronic device heat dissipation technology. The heat sink comprises a cover plate layer, a corrugated manifold layer, and a parallel plate microchannel heat sink layer, stacked and sealed from top to bottom. The corrugated manifold layer contains multiple parallel corrugated channels with their openings alternately located on opposite sides, forming inlet and outlet channels. The parallel plate microchannel heat sink layer contains multiple parallel microchannels, with the inlet and outlet channels connected to them. The cooling medium enters the microchannel through the inlet channel, flows along the length of the microchannel towards both ends, and exits through the outlet channel, thus forming a complete counter-current flow within adjacent microchannels. This invention achieves complete counter-current heat exchange in the microchannel layer through a single-layer corrugated manifold design, significantly improving heat dissipation efficiency, effectively suppressing local hot spots, and ensuring the reliable operation of high-power electronic devices.
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