2.5d bridge package method and 2.5d bridge package structure

By filling the space between the adapter board and the bridging section with an insulator, using high dielectric constant organic materials and an independent wiring layer design, the problems of inductance and parasitic effects in 2.5D packaging are solved, improving transmission efficiency and reliability.

CN122249060APending Publication Date: 2026-06-19FOREHOPE SEMICONDUCTOR (NINGBO) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
FOREHOPE SEMICONDUCTOR (NINGBO) CO LTD
Filing Date
2026-05-22
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In existing 2.5D packaging technology, the inductive and parasitic effects between wiring layers lead to high transmission loss and serious leakage, and the low dielectric constant of the silicon interposer causes short circuit and overheating problems.

Method used

An insulator is used to fill the gap between the adapter board and the bridging section. An organic material with a high dielectric constant is used as the dielectric layer. The wiring layers of the adapter board and the bridging section are set independently, and electrical connection is achieved through conductive posts to avoid direct connection.

Benefits of technology

It reduces inductance and parasitic effects between wiring layers, lowers transmission loss, improves transmission efficiency and package reliability, and avoids short circuits and overheating.

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Abstract

This application provides a 2.5D bridging packaging method and a 2.5D bridging packaging structure, relating to the field of semiconductor technology. In this 2.5D bridging packaging structure, the adapter board has a first surface and a second surface disposed opposite to each other. The first surface has a first connection terminal, and the second surface has a second connection terminal. The bridging portion has a third surface and a fourth surface disposed opposite to each other. The third surface has a third connection terminal, and the fourth surface has a fourth connection terminal. A first chip bridges the adapter board and the bridging portion, and the first chip is electrically connected to both the first and third connection terminals. A functional component is connected to the fourth connection terminal. An insulator fills the gap between the adapter board and the bridging portion. A dielectric layer has a fifth connection terminal, and the second connection terminal is electrically connected to the fifth connection terminal. The dielectric layer is disposed on the surface of the insulator or on the side of the adapter board away from the insulator. This structure helps to mitigate leakage caused by parasitic inductance, which can lead to short circuits and overheating between wiring layers.
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