Chip soldering method, apparatus, medium, device, and product

Abstract

This application discloses a chip welding method, apparatus, medium, equipment, and product, relating to the field of electronic technology, for improving the efficiency of chip welding operations. The method includes: acquiring the distribution of multiple chips to be welded on a substrate; adjusting the parameters of a target laser based on the distribution of the multiple chips to be welded on the substrate to obtain multiple laser beams; one chip to be welded corresponding to one or more laser beams; and emitting one or more corresponding laser beams to each of the multiple chips to be welded, for welding the multiple chips to be welded onto the substrate.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a chip welding method, apparatus, medium, equipment and product. Background Technology

[0002] To repair faulty chips, each chip can be removed individually, and the entire substrate containing the chip can be heated and soldered. However, heating and soldering the entire substrate may cause short circuits between the chips, creating new faulty chips.

[0003] For example, faulty chips can be removed one by one, replaced with new chips, and then each individual chip can be laser-welded. However, this method of removing and welding each chip individually is time-consuming and inefficient. Summary of the Invention

[0004] This application provides a chip soldering method, apparatus, medium, equipment, and product for improving the efficiency of chip soldering operations.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, a chip bonding method is provided, the method comprising: acquiring the distribution of multiple chips to be bonded on a substrate; adjusting the parameters of a target laser according to the distribution of the multiple chips to be bonded on the substrate to obtain multiple laser beams; one chip to be bonded corresponds to one or more laser beams; and emitting one or more corresponding laser beams to the multiple chips to be bonded for bonding the multiple chips to be bonded onto the substrate.

[0007] Optionally, one or more laser beams corresponding to each of the multiple chips to be soldered can be emitted, including: emitting multiple laser beams corresponding to each of the multiple chips to be soldered based on the positive electrode position and the negative electrode position of the chip to be soldered; and one laser beam corresponding to the positive electrode position and the negative electrode position of one chip to be soldered.

[0008] Optionally, the laser parameters include the number of lasers. Based on the distribution of multiple chips to be welded on the substrate, the laser parameters are adjusted to obtain multiple laser beams. This includes: determining a first number of lasers required to weld multiple chips based on the distribution of the multiple chips to be welded; determining the arrangement of liquid crystal molecules in different regions of the spatial light modulator based on the first number; and splitting the target laser beam according to the arrangement of liquid crystal molecules in different regions of the spatial light modulator to obtain multiple laser beams. The spatial light modulator is located between the laser emitting device and the substrate.

[0009] Optionally, the laser parameters include the spot size. Based on the distribution of multiple chips to be welded on the substrate, the laser parameters are adjusted to obtain multiple laser beams, including: determining the spot size of the laser required for welding multiple chips based on the distribution of multiple chips to be welded; adjusting the phase of the target laser based on the spot size of the laser required for welding multiple chips; splitting the target laser into multiple split laser beams based on the phase of the target laser.

[0010] Optionally, the method further includes: for each laser beam, obtaining the focusing temperature of the laser's focal point; adjusting the output power of the target laser based on the focusing temperature and a preset standard temperature; and ensuring that the adjusted output power corresponds to the same focusing temperature as the preset standard temperature.

[0011] Optionally, the preset standard temperature varies at different times during the welding process.

[0012] Optionally, the method further includes: removing the faulty chip from the substrate; transferring multiple chips to be soldered from the temporary carrier to the substrate based on the alignment and fastening operation between the substrate and the temporary carrier; the temporary carrier and the substrate have the same size, and the position coordinates of the multiple chips to be soldered on the temporary carrier are the same as the position coordinates of the faulty chip on the substrate.

[0013] Based on the technical solution provided in this application, the parameters of the target laser are adjusted according to the distribution of multiple chips to be welded on the substrate to obtain multiple laser beams. One or more corresponding laser beams are then emitted towards each of the multiple chips to be welded, thereby welding the chips onto the substrate. Since each chip to be welded corresponds to one or more laser beams, multiple laser beams can simultaneously weld chips at different locations. This allows for selective mass welding of large-area, densely packed chips, significantly improving welding efficiency while ensuring welding quality, and without affecting other normal chips.

[0014] Secondly, a chip bonding apparatus is provided, comprising: an acquisition unit and a processing unit; the acquisition unit is used to acquire the distribution of multiple chips to be bonded on a substrate; the processing unit is used to adjust the parameters of a target laser according to the distribution of the multiple chips to be bonded on the substrate to obtain multiple laser beams; one chip to be bonded corresponds to one or more laser beams; the processing unit is also used to emit one or more corresponding laser beams to the multiple chips to be bonded, for bonding the multiple chips to be bonded onto the substrate.

[0015] Optionally, the processing unit is specifically used to: emit multiple laser beams corresponding to each of the multiple chips to be welded based on the positive electrode position and the negative electrode position of the chip to be welded; the positive electrode position and the negative electrode position of one chip to be welded each correspond to one laser beam.

[0016] Optionally, the laser parameters include the number of lasers and the coordinate information of the laser focal point. The processing unit is specifically used to: determine the first number of lasers required to weld multiple chips and the coordinate information of the focal points of different lasers based on the distribution of multiple chips to be welded; determine the arrangement of liquid crystal molecules in different regions of the spatial light modulator according to the first number and coordinate information, and split the target laser into multiple laser beams according to the arrangement of liquid crystal molecules in different regions of the spatial light modulator; the spatial light modulator is located between the laser emitting device and the substrate.

[0017] Optionally, the laser parameters include the spot size and processing unit, and are specifically used to: determine the laser spot size required for welding multiple chips based on the distribution of multiple chips to be welded; and adjust the phase of the target laser according to the laser spot size required for welding multiple chips to obtain multiple split laser beams.

[0018] Optionally, the acquisition unit is also used to acquire the focusing temperature of the focal point of each laser beam; the processing unit is also used to adjust the output power of the target laser based on the focusing temperature and a preset standard temperature; the adjusted output power corresponds to the same focusing temperature as the preset standard temperature.

[0019] Optionally, the preset standard temperature varies at different times during the welding process.

[0020] Optionally, the processing unit is also used to remove faulty chips from the substrate; the processing unit is also used to transfer multiple chips to be soldered from the temporary carrier to the substrate based on the alignment and fastening operation between the substrate and the temporary carrier; the temporary carrier and the substrate have the same size, and the distribution of multiple chips to be soldered on the temporary carrier is the same as the distribution of faulty chips on the substrate.

[0021] Thirdly, a chip bonding apparatus is provided, which can realize the functions performed by the chip bonding apparatus in the above aspects or possible designs. The functions can be implemented by hardware. For example, in one possible design, the chip bonding apparatus may include a processor and a communication interface. The processor can be used to support the chip bonding apparatus in realizing the functions involved in the first aspect or any possible design of the first aspect.

[0022] In another possible design, the chip bonding apparatus may further include a memory for storing necessary computer execution instructions and data. When the chip bonding apparatus is in operation, the processor executes the computer execution instructions stored in the memory to cause the chip bonding apparatus to perform the first aspect or any of the possible chip bonding methods described above.

[0023] Fourthly, a computer-readable storage medium is provided, which may be a readable non-volatile storage medium storing computer instructions or programs that, when executed on a computer, enable the computer to perform the chip bonding method described in the first aspect or any of the possible chip bonding methods described above.

[0024] Fifthly, a computer program product containing instructions is provided, which, when run on a computer, enables the computer to execute the chip bonding method of the first aspect or any possible design of the above aspects.

[0025] In a sixth aspect, an electronic device is provided, comprising one or more processors and one or more memories. The one or more memories are coupled to the one or more processors, and the one or more memories are used to store computer program code, including computer instructions, which, when executed by the one or more processors, cause the electronic device to perform a chip bonding method as described in the first aspect or any possible design of the first aspect.

[0026] In a seventh aspect, a chip system is provided, comprising a processor and a communication interface, which can be used to implement the functions performed by the chip bonding apparatus in the first aspect or any possible design of the first aspect. In one possible design, the chip system further includes a memory for storing program instructions and / or data. The chip system may be composed of chips or may include chips and other discrete devices, without limitation. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a chip bonding system provided in an embodiment of this application;

[0028] Figure 2 A schematic diagram of a chip bonding apparatus provided in an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of another chip bonding system provided in an embodiment of this application;

[0030] Figure 4 This is a schematic diagram of the structure of a chip bonding apparatus provided in an embodiment of this application;

[0031] Figure 5 A schematic flowchart of a chip bonding method provided in an embodiment of this application;

[0032] Figure 6 A schematic diagram of laser welding provided for an embodiment of this application;

[0033] Figure 7A schematic diagram illustrating a preset standard temperature provided in an embodiment of this application;

[0034] Figure 8 A schematic diagram of a temporary carrier plate provided in an embodiment of this application;

[0035] Figure 9 A schematic diagram of a substrate provided in an embodiment of this application;

[0036] Figure 10 A schematic flowchart illustrating another chip bonding method provided in this application embodiment;

[0037] Figure 11 This is a schematic diagram of another chip bonding apparatus provided in an embodiment of this application. Detailed Implementation

[0038] To enable those skilled in the art to better understand the technical solutions of this disclosure, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0039] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the embodiments of this application as detailed in the appended claims.

[0040] It should also be understood that the term "comprising" indicates the presence of the described feature, whole, step, operation, element and / or component, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements and / or components.

[0041] In industries such as electronics processing and display panel manufacturing, a certain percentage of defects occur during the production of micro light-emitting diode (Micro LED) displays after each soldering step. Due to the sheer number of Micro LEDs in a display panel, even with a high soldering yield, the number of defective chips is extremely large. For example, in a 50*50mm panel with 30*30um chip sizes, a 20um pitch, and 1 million chips, even with a 99.99% yield, there will still be 100 defective chips.

[0042] To repair faulty chips, each chip can be removed individually, and the entire substrate containing the chip can be heated and soldered. However, heating and soldering the entire substrate may cause short circuits between the chips, creating new faulty chips.

[0043] For example, faulty chips can be removed one by one, replaced with new chips, and then each individual chip can be laser-welded. However, this method of removing and welding each chip individually is time-consuming and inefficient.

[0044] In view of this, embodiments of this application provide a chip welding method, including: obtaining the position coordinates of a plurality of chips to be welded in a substrate; welding the chips to be welded based on the position coordinates and a plurality of split laser beams obtained by splitting a laser beam; the plurality of split laser beams are the same number as the plurality of chips to be welded, and each split laser beam is focused on the chip to be welded corresponding to a different position coordinate.

[0045] The methods provided in the embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0046] It should be noted that the network system described in the embodiments of this application is for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and does not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the evolution of network systems and the emergence of other network systems, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0047] Figure 1 The diagram shown is a structural schematic of a chip bonding system 10 provided in an embodiment of this application. Figure 1 As shown, the chip bonding system 10 may include a chip bonding device 11 and a substrate 12.

[0048] The substrate 12 is placed on the motion table of the chip welding device 11.

[0049] The substrate 12 involved in the embodiments of this application can also be referred to as a panel, display panel, etc. Micro LED chips are arranged on the surface of the substrate 12.

[0050] In the embodiments of this application, the chip welding apparatus 11 is used to weld the Micro LED chips in the substrate 12 so that the Micro LED chips can be fixed to the substrate 12. The embodiments of this application do not limit the specific technology, quantity, or form of the chip welding apparatus 11.

[0051] The chip bonding apparatus 11 may include multiple systems. For example, such as Figure 2As shown, the chip bonding apparatus may include a control system, a laser system, a spatial light modulator, an infrared temperature measurement system, an imaging system, and an external optical path system.

[0052] In this system, the laser emitted by the laser system passes through the spatial optical path and is incident on the densely packed unit in the working area of ​​the spatial light modulator. The densely packed unit of the spatial light modulator can be controlled independently to adjust parameters such as the phase of the incident laser, change the direction of laser transmission in space, and obtain a new projected light spot after passing through the projection lens in the optical path.

[0053] The control system can control the spatial light modulator to edit the transmission direction, energy magnitude, and distribution of the laser beam. Based on the location coordinates of the failed chip, and in conjunction with the optical path system, the laser beam is divided into a corresponding number of laser sub-beams. After the control algorithm is optimized, the focused laser sub-beams can accurately illuminate the chip to be soldered. The optimized laser focal point size is slightly larger than the chip (other adjustments can be made according to the process), and the energy is evenly distributed at the laser focal point.

[0054] The infrared detection system has a coaxial optical path with the laser optical path, and the detection area is the same as the laser's action area. The control system can set the position of the detection area according to the position of the laser's action area to ensure that the detected temperature is the actual working area temperature. Multi-area measurement and comprehensive feedback avoid interference from external factors on micro-area temperature measurement, resulting in higher temperature measurement accuracy.

[0055] The control system can adjust the laser output power in real time according to the difference between the working area temperature and the set temperature curve, so as to realize closed-loop control of the working area temperature.

[0056] The imaging system is coaxial with the laser optical path. During the processing, the control system can receive images transmitted by the camera to observe and analyze real-time processing data.

[0057] Figure 3 This diagram illustrates the structure of another chip bonding system 10 provided in an embodiment of this application. Figure 3 As shown, the chip welding system 10 may include a control system 1, a laser system 2, a spatial light modulator 3, an infrared temperature measurement system 4, an imaging system 5, and an optical path system 6.

[0058] Laser system 2 can be used to emit a laser beam to heat the chip to be soldered on the substrate.

[0059] The spatial light modulator 3 can be used in conjunction with the control system to arbitrarily edit the laser beam emitted by the laser. In conjunction with the focusing system, it can obtain focused light spots of any number, position, energy distribution, and energy distribution.

[0060] Infrared temperature measurement system 4 can be used to acquire temperature data across the entire laser range. The temperature measurement range of the infrared temperature measurement system is the same as the maximum processable range of the laser, and the control system collects temperature data at the corresponding locations according to the algorithm requirements.

[0061] Imaging system 5 can be used to acquire images of the selected work area and upload them to the control system.

[0062] Optical path system 6 can be used to connect laser system 2, spatial light modulator 3, infrared temperature measurement system 4, and imaging system 5.

[0063] The optical path system includes reflectors 61, 62, and 63; dichroic mirrors 64 and 65; collimating lens group 66; focusing lens group 67; and illumination source 68.

[0064] The optical path system structure is as follows:

[0065] The laser emitted by the laser system 2 is transmitted through optical fiber, collimated by collimating lens 66, and enters reflectors 61 and 62. Reflectors 61 and 62 accurately reflect the laser onto the working surface of the spatial light modulator 3. After being edited by the spatial light modulator 3, the laser is transmitted to reflector 63. Reflector 63 reflects the laser onto focusing lens group 67. After the laser is focused, the focal point falls on the surface of substrate 7 (also known as the panel to be repaired).

[0066] The optical paths of the infrared temperature measurement system 4 and the imaging system 5 are combined at the dichroic mirror 64, and then combined with the laser optical path at the dichroic mirror 65, forming a coaxial optical path for the laser, infrared temperature measurement, and camera optical paths.

[0067] The illumination source 68 is used to provide supplemental illumination for the imaging system.

[0068] In the case of chip removal or chip soldering, the moving substrate 9 can carry the substrate 7 to the working area of ​​the chip soldering system to remove or solder the substrate chip in the substrate 7.

[0069] In practical implementation, Figure 1 Each device in the process can be adopted Figure 4 The shown composition structure, or including Figure 4 The components shown. Figure 4 This is a schematic diagram of a chip bonding apparatus 200 provided in an embodiment of this application. The chip bonding apparatus 200 can be a network device, or it can be a chip or system-on-a-chip within a network device. Figure 4 As shown, the chip bonding apparatus 200 includes a processor 201, a communication interface 202, and a communication line 203.

[0070] Furthermore, the chip bonding apparatus 200 may also include a memory 204. The processor 201, memory 204, and communication interface 202 can be connected via a communication line 203.

[0071] The processor 201 can be a CPU, a general-purpose processor, a network processor (NP), a digital signal processor (DSP), a microprocessor, a microcontroller, a programmable logic device (PLD), or any combination thereof. The processor 201 can also be other devices with processing capabilities, such as circuits, devices, or software modules, without limitation.

[0072] Communication interface 202 is used to communicate with other devices or other communication networks. Communication interface 202 can be a module, circuit, communication interface, or any device capable of enabling communication.

[0073] Communication line 203 is used to transmit information between the components included in the chip bonding apparatus 200.

[0074] Memory 204 is used to store instructions. These instructions can be computer programs.

[0075] The memory 204 can be a read-only memory (ROM) or other type of static storage device that can store static information and / or instructions; it can also be a random access memory (RAM) or other type of dynamic storage device that can store information and / or instructions; it can also be an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, etc., without limitation.

[0076] It should be noted that the memory 204 can exist independently of the processor 201 or can be integrated with the processor 201. The memory 204 can be used to store instructions, program code, or some data, etc. The memory 204 can be located inside or outside the chip bonding apparatus 200, without limitation. The processor 201 is used to execute the instructions stored in the memory 204 to implement the chip bonding method provided in the following embodiments of this application.

[0077] In one example, processor 201 may include one or more CPUs, for example, Figure 4 CPU0 and CPU1 in the CPU.

[0078] As an optional implementation, the chip bonding apparatus 200 includes multiple processors, for example, besides Figure 4 In addition to processor 201, it may also include processor 205.

[0079] It should be pointed out that, Figure 4 The composition shown does not constitute a basis for this. Figure 1 The limitations of each device in the process, except Figure 4 In addition to the components shown, Figure 1 The various devices in can include compared to Figure 4 More or fewer components, or combinations of certain components, or different arrangements of components.

[0080] In this embodiment of the application, the chip system may be composed of chips or may include chips and other discrete devices.

[0081] Furthermore, the actions, terms, etc., involved in the various embodiments of this application can be referenced interchangeably without limitation. The message names or parameter names in the messages exchanged between the various devices in the embodiments of this application are merely examples, and other names may be used in specific implementations without limitation.

[0082] To facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0083] It should be noted that, in this application, the terms "exemplary" or "for example" are used to indicate that something is being described as an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0084] In this application, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0085] The following is combined Figure 3 The chip bonding system shown herein describes the chip bonding method provided in the embodiments of this application.

[0086] Figure 5 This is a schematic flowchart of a chip bonding method provided in an embodiment of this application, as shown below. Figure 5 As shown, the method includes the following steps S301-S303:

[0087] S301. Obtain the distribution of multiple chips to be soldered on the substrate.

[0088] The distribution can refer to the coordinate positions of the chips to be soldered. Multiple chips are arranged on the substrate. These chips are arranged in an array on the substrate. For example, one pixel can correspond to one chip. Alternatively, multiple pixels can correspond to one chip. The chips are connected to the substrate by soldering. The chips to be soldered are those that have not yet undergone soldering.

[0089] The chip can be a light-emitting chip, such as a Micro LED chip. This allows control over the light-emitting state of different pixels.

[0090] In one example, with a substrate size of 50*50mm, a chip size of 30*30um, and a chip spacing of 20um, the number of chips can be 1 million.

[0091] As one possible implementation, the chip bonding apparatus can detect the position coordinates of a faulty chip in the substrate, remove the faulty chip, place a new chip as the chip to be bonded on the substrate, and determine the position coordinates of the faulty chip as the position coordinates of multiple chips to be bonded.

[0092] It should be noted that the position coordinates can refer to the chip's position within the substrate array. For example, if the chip to be soldered is located in the second row and second column, its position coordinates can be represented as (2, 2).

[0093] As another possible implementation, the chip bonding device can obtain the position coordinates of multiple chips to be bonded in the substrate in response to the input instructions of the operator.

[0094] It should be noted that input instructions can refer to instructions generated in response to the operator's control operations. For example, input instructions can be instructions entered by the operator through the input device (such as a keyboard) of the chip bonding equipment, or control instructions entered by the operator through physical buttons provided on the chip bonding equipment.

[0095] S302. Based on the distribution of multiple chips to be welded on the substrate, the laser parameters are adjusted to obtain multiple laser beams.

[0096] The parameters of the laser can include the number of laser beams, their position, and the size of the laser spot. One chip to be soldered corresponds to one or more laser beams.

[0097] As one possible implementation, the chip bonding device can adjust the modulation parameters of the spatial light modulator by adjusting the distribution of multiple chips to be bonded on the substrate, thereby adjusting the parameters of the laser and obtaining multiple laser beams.

[0098] It should be noted that the spatial light modulator is located between the laser emitting device and the substrate.

[0099] As another possible implementation, the laser emitting device is equipped with a parameter adjustment function. The chip welding device can send control commands to the laser emitting device to control the laser emitting device to adjust the laser parameters and obtain multiple laser beams.

[0100] It should be noted that the control commands are used to adjust the laser parameters of the laser emitting device to the target laser parameters. The control commands include the target laser parameters.

[0101] In one example, the target laser parameters can be the number of lasers, the irradiation position, the spot size, etc.

[0102] S303: Emit one or more laser beams corresponding to each of the multiple chips to be soldered, so as to solder the multiple chips to be soldered onto the substrate.

[0103] As one possible implementation, the chip bonding apparatus can emit a laser beam covering each of the multiple chips to be bonded, and stop emitting the laser after a preset duration, in order to bond the multiple chips to a substrate.

[0104] It should be noted that the coverage area of ​​each laser beam is larger than the area of ​​the corresponding chip to be soldered. The preset duration can be set as needed. For example, it can be 5 seconds, 10 seconds, 15 seconds, etc.

[0105] In one example, Figure 6 A schematic diagram of laser welding is shown, such as... Figure 6 As shown, the welding process, which involves emitting one or more laser beams to multiple chips to be welded, can be performed as follows: Figure 6 As shown.

[0106] As one possible implementation, the chip bonding device can emit multiple laser beams, each covering a specific chip, to multiple chips to be bonded.

[0107] For example, a chip bonding apparatus can emit multiple laser beams corresponding to the positive and negative electrode positions of multiple chips to be bonded. Each positive and negative electrode position of a chip to be bonded corresponds to one laser beam.

[0108] In some embodiments, when the substrate size exceeds the area that the laser system can irradiate, the chip bonding apparatus can perform bonding in sections at a time.

[0109] In one example, combining Figure 3 The process of welding a chip to be welded using one or more laser beams may include the following S1-S6.

[0110] S1. Control system 1 controls spatial light modulator 3 to adjust the modulation parameters to the target modulation parameters.

[0111] The target modulation parameters can be used to adjust the arrangement of liquid crystal molecules in different regions of the spatial light modulator.

[0112] In one example, the control system 1 can control the electric field intensity in different regions of the spatial light modulator in order to control the arrangement of liquid crystal molecules in different regions.

[0113] For example, control system 1 can control the arrangement of liquid crystal molecules in the area corresponding to the position coordinates of the chip to be soldered to be horizontal, and control the arrangement of liquid crystal molecules in other areas of the substrate outside the position coordinates of the chip to be soldered to be vertical.

[0114] S2, Control System 1 controls laser emitting device 2 to emit laser beams.

[0115] S3. After being collimated by collimating lens group 66, the laser beam reaches spatial light modulator 3 via reflector 61 and reflector 62.

[0116] S4, the spatial light modulator 3 splits the laser beam to obtain multiple split beams, and then emits the split beams to the substrate through the reflector 63, the dichroic mirror 65, and the focusing lens group 67.

[0117] In some embodiments, the control system 1 can also control the infrared temperature measurement system 4 to detect the temperature at the chip to be soldered via the dichroic mirror 64, the dichroic mirror 65 and the focusing lens group 67.

[0118] In some embodiments, the imaging system 5 can record video data at the substrate 7 via the dichroic mirror 64, the dichroic mirror 65 and the focusing lens group 67, and send the video data to the control system 1 in real time.

[0119] Based on the technical solution provided in this application, the parameters of the target laser are adjusted according to the distribution of multiple chips to be welded on the substrate to obtain multiple laser beams. One or more corresponding laser beams are then emitted towards each of the multiple chips to be welded, thereby welding the chips onto the substrate. Since each chip to be welded corresponds to one or more laser beams, multiple laser beams can simultaneously weld chips at different locations. This allows for selective mass welding of large-area, densely packed chips, significantly improving welding efficiency while ensuring welding quality, and without affecting other normal chips.

[0120] In one possible embodiment, the laser parameters include the number of laser beams and coordinate information. To adjust the laser parameters to obtain multiple laser beams, this application may further include the following steps S401-S402.

[0121] S401. Based on the distribution of multiple chips to be welded, determine the first quantity of lasers required for welding multiple chips and the coordinate information of the laser focus point.

[0122] As one possible implementation, the chip welding device can determine the number of chips to be welded, the number of lasers, and the coordinate information based on the distribution of multiple chips to be welded. The number of chips to be welded is determined as the first number of lasers required to weld the multiple chips, and the coordinate information of the multiple chips to be welded is determined as the coordinate information of the laser focal point.

[0123] As another possible implementation, the chip welding device can determine the sum of the number of positive electrodes and negative electrodes of the multiple chips to be welded based on the distribution of the multiple chips to be welded, and determine the sum of the number of positive electrodes and negative electrodes of the multiple chips to be welded as the first number of lasers required to weld the multiple chips to be welded, and determine the coordinate information of the positive electrode and negative electrode of the multiple chips to be welded as the coordinate information of the focal point of different lasers.

[0124] S402. Based on the first quantity and coordinate information, determine the arrangement of liquid crystal molecules in different regions of the spatial light modulator, and split the target laser beam according to the arrangement of liquid crystal molecules in different regions of the spatial light modulator to obtain multiple laser beams; the spatial light modulator is located between the laser emitting device and the substrate.

[0125] The spatial light modulator is located between the laser emitting device and the substrate. The spatial light modulator contains closely packed independent control units, each of which can independently receive control signals and change its own optical properties according to these signals, thereby modulating the laser light illuminating it.

[0126] As one possible implementation, the chip bonding device can control the electric field intensity in different regions of the spatial light modulator to control the alignment of liquid crystal molecules in those regions. Based on the alignment of the liquid crystal molecules in different regions of the spatial light modulator, the target laser beam is split to obtain multiple laser beams.

[0127] For example, a chip bonding apparatus can control the arrangement of liquid crystal molecules in the spatial light modulator corresponding to the position coordinates of the chip to be bonded to be horizontal, and control the arrangement of liquid crystal molecules in other areas of the substrate outside the position coordinates of the chip to be bonded to be vertical.

[0128] In this way, the liquid crystal molecules in the area corresponding to the position coordinates of the chip to be welded are arranged horizontally. Part of the target laser can be emitted from the area corresponding to the horizontal arrangement of the liquid crystal molecules, while the area corresponding to the vertical arrangement of the liquid crystal molecules blocks the target laser, thereby splitting the target laser into multiple laser beams.

[0129] In one possible embodiment, the laser parameters include the spot size. To adjust the laser parameters to obtain multiple laser beams, this application may further include the following steps S501-S502.

[0130] S501. Based on the distribution of multiple chips to be welded, determine the laser spot size required for welding multiple chips.

[0131] The spot size refers to the size of the laser beam that appears on the substrate.

[0132] As one possible implementation, the chip welding device can determine the size of the chips to be welded at different positions based on the distribution of multiple chips to be welded, and then determine the laser spot size required to weld multiple chips based on the size of the chips to be welded at different positions.

[0133] S502. Adjust the phase of the target laser according to the laser spot size required for welding multiple chips to be welded, so as to obtain multiple split laser beams.

[0134] As one possible implementation, the chip bonding apparatus can determine the phase that has a mapping relationship with the required laser spot size from the first mapping relationship, and determine the phase with the mapping relationship as the phase of the target laser to obtain multiple split laser beams.

[0135] The first mapping relationship includes the mapping relationship between different spot sizes and different laser phases.

[0136] In this way, by adjusting the phase of the target laser and the size of the laser spot, it is possible to ensure that the laser covers the chip to be soldered, avoid incomplete soldering of the chip, and improve the soldering quality of the chip.

[0137] In some embodiments, the chip welding apparatus can also adjust the distance between the spatial light modulator and the laser emitting device according to the laser spot size required for welding multiple chips to be welded, so as to obtain multiple split laser beams.

[0138] For example, a chip bonding device can determine the interval distance that has a mapping relationship with the required laser spot size from the second mapping relationship, and determine the interval distance with the mapping relationship as the interval distance between the spatial light modulator and the laser emitting device, thereby splitting the target laser into multiple split laser beams.

[0139] In this way, for different failed panels, the laser focus can be re-edited by adjusting the phase of the target laser, thus achieving efficient repair of different panels. Existing refractive and diffractive lens techniques produce fixed spots after spot reshaping, which cannot adapt to chip welding work of different sizes, positions, and numbers; compared with existing spot reshaping methods, spatial light modulators have better adaptability.

[0140] In one possible embodiment, this application may also include the following S601-S602.

[0141] S601. For each laser beam, obtain the focusing temperature of the laser's focal point.

[0142] As one possible implementation, the chip bonding device can randomly collect the focal temperature of a laser's focal point based on an infrared detection device, and determine the focal temperature of the randomly selected laser focal point as the focal temperature of the laser's focal point.

[0143] As another possible implementation, the chip bonding device can collect the focal temperature of each laser's focal point based on an infrared detection device, and determine the average temperature of the focal temperatures of the multiple laser focal points as the focal temperature of the laser's focal point.

[0144] It should be noted that the infrared detection equipment is coaxial with the laser optical path.

[0145] In this way, the detection area of ​​the infrared detection device is the same as the laser's effective area. By setting the position of the detection area according to the location of the laser's effective area, the detected temperature can be guaranteed to be the actual working area temperature. Multi-point measurement and comprehensive feedback can avoid interference from external factors on micro-area temperature measurement and improve temperature measurement accuracy.

[0146] S602. Adjust the output power of the target laser based on the focusing temperature and the preset standard temperature.

[0147] The adjusted output power corresponds to the same focusing temperature as the preset standard temperature.

[0148] The preset standard temperature can be different at different times during the welding process. Alternatively, the preset standard temperature can be the same at different times during the welding process.

[0149] In one example, Figure 7 A schematic diagram of a preset standard temperature is shown. (For example...) Figure 7 As shown, during the time interval 0-t1, the preset standard temperature can be between temperatures T1 and T2. During the time interval t1-t2, the preset standard temperature can be T2. During the time interval t2-t3, the preset standard temperature can be between T2 and T3.

[0150] As one possible implementation, the chip bonding apparatus can increase the output power of the target laser when the focusing temperature is lower than the preset standard temperature, until the focusing temperature reaches the preset standard temperature. When the focusing temperature is higher than the preset standard temperature, the output power of the target laser can be decreased until the focusing temperature reaches the preset standard temperature. When the focusing temperature is equal to the preset standard temperature, the output power of the target laser can be kept constant.

[0151] In one possible embodiment, the chip bonding method of this application may further include the following S701-S702.

[0152] S701, Remove the faulty chip from the substrate.

[0153] As one possible implementation, the chip bonding device can emit one or more laser beams of target wavelengths at each faulty chip to remove the faulty chip from the substrate.

[0154] The target wavelength is shorter than the laser wavelength used for welding.

[0155] Because lasers with shorter wavelengths have higher energy, they can effectively remove faulty chips from the substrate.

[0156] As another possible implementation, the chip bonding device can emit one or more laser beams of target wavelengths to each faulty chip, and then blow side-blowing gas to the location of the faulty chip to remove the faulty chip from the substrate.

[0157] In this way, after the faulty chip is loosened by laser irradiation, it can be easily separated from the substrate by side-blowing gas. This improves the efficiency of removing faulty chips from the substrate.

[0158] S702. Based on the alignment and fastening operation between the substrate and the temporary carrier, multiple chips to be soldered in the temporary carrier are transferred to the substrate.

[0159] The temporary carrier board is the same size as the substrate, and the distribution of multiple chips to be soldered on the temporary carrier board is the same as the distribution of faulty chips on the substrate.

[0160] In one example, a temporary carrier board can be as follows: Figure 8 As shown, the substrate can be as follows Figure 9 As shown.

[0161] In one possible implementation, the substrate carrier is equipped with a first alignment wheel, and the temporary carrier is equipped with a second alignment wheel. The first and second alignment wheels are aligned with each other. The chip bonding apparatus can align the substrate and the temporary carrier based on the first and second alignment wheels, and after the substrate and the temporary carrier are aligned, the substrate and the temporary carrier are fastened together, transferring multiple chips to be bonded from the temporary carrier to the substrate.

[0162] In practical applications, multiple chips to be soldered in a temporary carrier board can be fixed to the temporary carrier board by adhesive bonding. After the substrate and the temporary carrier board are aligned and fastened, the chip soldering device can emit a laser towards the temporary carrier board to transfer the multiple chips to be soldered from the temporary carrier board to the substrate.

[0163] Figure 10 This is a schematic flowchart of a chip bonding method provided in an embodiment of this application, as shown below. Figure 10 As shown, the method includes the following S11-S16:

[0164] S11. Determine the distribution of the faulty chip on the substrate.

[0165] The distribution of faulty chips can include the number and coordinates of the faulty chips.

[0166] As one possible implementation, the chip inspection device is connected in communication with an automated optical inspection (AOI) device. After the AOI device inspects the distribution of faulty chips in the substrate, it can send faulty chip information to the chip inspection device, which can then determine the distribution of faulty chips in the substrate based on the faulty chip information.

[0167] The faulty chip information includes the distribution of the faulty chips on the substrate.

[0168] S12, Remove the faulty chip from the substrate.

[0169] The specific process of this step can be found in the description of S701, and will not be repeated here.

[0170] S13. Based on the alignment and fastening operation between the substrate and the temporary carrier, multiple chips to be soldered in the temporary carrier are transferred to the substrate.

[0171] The specific process of this step can be found in the description of S702, and will not be repeated here.

[0172] S14. Based on the distribution of multiple chips to be welded on the substrate, adjust the parameters of the target laser to obtain multiple laser beams, and emit one or more corresponding laser beams to the multiple chips to be welded.

[0173] The specific process of this step can be found in the descriptions of S302-S303, and will not be repeated here.

[0174] S15. For each laser beam, obtain the focusing temperature of the laser's focal point.

[0175] The specific process of this step can be found in the description of S601, and will not be repeated here.

[0176] S16. Adjust the output power of the target laser based on the focusing temperature of the laser's focal point and the preset standard temperature.

[0177] The specific process of this step can be found in the description of S602, and will not be repeated here.

[0178] This application embodiment can divide the chip bonding apparatus into functional modules or functional units according to the above method example. For example, each function can be divided into a separate functional module or functional unit, or two or more functions can be integrated into one processing module. The integrated module can be implemented in hardware or in software functional modules or functional units. The module or unit division in this application embodiment is illustrative and only represents one logical functional division; other division methods may be used in actual implementation.

[0179] When dividing each function into modules according to its corresponding function. Figure 11 A schematic diagram of a chip bonding apparatus 800 is shown. This chip bonding apparatus can be a chip bonding device itself, or it can be a chip, processor, etc., applied within the chip bonding apparatus. This chip bonding apparatus 800 can be used to perform the functions of the chip bonding apparatus described in the above embodiments. Figure 11 The chip welding apparatus 800 shown may include: an acquisition unit 801 and a processing unit 802; the acquisition unit 801 is used to acquire the distribution of multiple chips to be welded on a substrate; the processing unit 802 is used to adjust the parameters of the target laser according to the distribution of the multiple chips to be welded on the substrate to obtain multiple laser beams; one chip to be welded corresponds to one or more laser beams; the processing unit 802 is also used to emit one or more corresponding laser beams to the multiple chips to be welded, for welding the multiple chips to be welded onto the substrate.

[0180] Optionally, the processing unit 802 is specifically used to: emit multiple laser beams corresponding to each of the multiple chips to be welded based on the positive electrode position and the negative electrode position of the chip to be welded; the positive electrode position and the negative electrode position of one chip to be welded each correspond to one laser beam.

[0181] Optionally, the laser parameters include the number of lasers and the coordinate information of the laser focal point. The processing unit 802 is specifically used to: determine the first number of lasers required to weld multiple chips and the coordinate information of the focal points of different lasers based on the distribution of multiple chips to be welded; determine the arrangement of liquid crystal molecules in different regions of the spatial light modulator according to the first number and coordinate information, and split the target laser into multiple laser beams according to the arrangement of liquid crystal molecules in different regions of the spatial light modulator; the spatial light modulator is located between the laser emitting device and the substrate.

[0182] Optionally, the laser parameters include the spot size. The processing unit 802 is further used to: determine the laser spot size required for welding multiple chips based on the distribution of multiple chips to be welded; and adjust the phase of the target laser according to the laser spot size required for welding multiple chips to be welded, so as to obtain multiple split laser beams.

[0183] Optionally, the acquisition unit 801 is further configured to acquire the focusing temperature of the focal point of each laser beam; the processing unit 802 is further configured to adjust the output power of the target laser based on the focusing temperature and a preset standard temperature; the adjusted output power corresponds to the same focusing temperature as the preset standard temperature.

[0184] Optionally, the preset standard temperature varies at different times during the welding process.

[0185] Optionally, the processing unit 802 is also used to remove faulty chips from the substrate; the processing unit 802 is also used to transfer multiple chips to be soldered from the temporary carrier to the substrate based on the alignment and fastening operation between the substrate and the temporary carrier; the temporary carrier and the substrate have the same size, and the distribution of multiple chips to be soldered on the temporary carrier is the same as the distribution of faulty chips on the substrate.

[0186] This application also provides a computer-readable storage medium. All or part of the processes in the above method embodiments can be executed by a computer program instructing related hardware. This program can be stored in the computer-readable storage medium, and when executed, it can include the processes of the above method embodiments. The computer-readable storage medium can be an internal storage unit of the chip bonding apparatus (including a data transmitter and / or a data receiver) of any of the foregoing embodiments, such as the hard disk or memory of the chip bonding apparatus. The computer-readable storage medium can also be an external storage device of the terminal device, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the terminal device. Further, the computer-readable storage medium can include both the internal storage unit of the chip bonding apparatus and an external storage device. The computer-readable storage medium is used to store the computer program and other programs and data required by the chip bonding apparatus. The computer-readable storage medium can also be used to temporarily store data that has been output or will be output.

[0187] It should be noted that the terms "first" and "second," etc., in the specification, claims, and drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0188] It should be understood that in this application, "at least one (item)" means one or more, "more than one" means two or more, "at least two (items)" means two or three or more, and "and / or" is used to describe the relationship between related objects, indicating that there can be three relationships. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the related objects before and after are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0189] Through the above description of the embodiments, those skilled in the art can clearly understand that, for the sake of convenience and brevity, only the division of the above functional modules is used as an example. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0190] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another apparatus, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0191] The units described as separate components may or may not be physically separate. A component shown as a unit can be one or more physical units; that is, it can be located in one place or distributed in multiple different locations. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0192] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0193] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on this understanding, the technical solutions of the embodiments of this application, essentially, or the parts that contribute to the prior art, or all or part of the technical solutions, can be embodied in the form of a software product. This software product is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0194] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip bonding method, characterized in that, The method includes: Obtain the distribution of multiple chips to be soldered on the substrate; Based on the distribution of the multiple chips to be welded on the substrate, the parameters of the target laser are adjusted to obtain multiple laser beams; one chip to be welded corresponds to one or more laser beams. One or more laser beams are emitted toward the plurality of chips to be soldered, respectively, to solder the plurality of chips to the substrate.

2. The method according to claim 1, characterized in that, The step of emitting one or more laser beams corresponding to each of the plurality of chips to be soldered includes: Based on the positive and negative electrode positions of the chips to be soldered, multiple laser beams corresponding to each chip are emitted to the multiple chips to be soldered; one laser beam corresponds to each positive and negative electrode position of a chip to be soldered.

3. The method according to claim 1 or 2, characterized in that, The laser parameters include the number of laser beams and the coordinates of the laser focal point. The laser parameters are adjusted according to the distribution of the multiple chips to be welded on the substrate to obtain multiple laser beams, including: Based on the distribution of the multiple chips to be welded, determine the first number of lasers required to weld the multiple chips and the coordinate information of the focal points of different lasers; Based on the first quantity and the coordinate information, the arrangement of liquid crystal molecules in different regions of the spatial light modulator is determined, and the target laser is split into multiple laser beams based on the arrangement of liquid crystal molecules in different regions of the spatial light modulator; the spatial light modulator is located between the laser emitting device and the substrate.

4. The method according to claim 1 or 2, characterized in that, The laser parameters include the spot size. The laser parameters are adjusted according to the distribution of the multiple chips to be welded on the substrate to obtain multiple laser beams, including: Based on the distribution of the multiple chips to be welded, the laser spot size required for welding the multiple chips to be welded is determined; Based on the laser spot size required for welding the multiple chips to be welded, the phase of the target laser is adjusted to obtain the multiple split laser beams.

5. The method according to claim 1, characterized in that, The method further includes: For each laser beam, obtain the focusing temperature of the focal point of the laser beam; Based on the focusing temperature and the preset standard temperature, the output power of the target laser is adjusted; the focusing temperature corresponding to the adjusted output power is the same as the preset standard temperature.

6. The method according to claim 5, characterized in that, The preset standard temperature varies at different times during the welding process.

7. The method according to claim 1, characterized in that, The method further includes: Remove the faulty chip from the substrate; Based on the alignment and fastening operation between the substrate and the temporary carrier, a plurality of chips to be soldered in the temporary carrier are transferred to the substrate; the temporary carrier and the substrate have the same size, and the distribution of the plurality of chips to be soldered in the temporary carrier is the same as the distribution of the faulty chips in the substrate.

8. A chip bonding apparatus, characterized in that, The device includes: an acquisition unit and a processing unit; The acquisition unit is used to acquire the distribution of multiple chips to be welded on the substrate; The processing unit is used to adjust the parameters of the target laser according to the distribution of the multiple chips to be welded on the substrate to obtain multiple laser beams; one chip to be welded corresponds to one or more laser beams. The processing unit is also used to emit one or more laser beams corresponding to each of the plurality of chips to be soldered, for soldering the plurality of chips to be soldered onto the substrate.

9. A computer-readable storage medium, characterized in that, The readable storage medium stores instructions that, when executed, implement the method as described in any one of claims 1-7.

10. An electronic device, characterized in that, include: The electronic device includes a processor, memory, and a communication interface; wherein the communication interface is used for communication between the electronic device and other devices or networks. The memory is used to store one or more programs, the one or more programs including computer-executable instructions, which, when the electronic device is running, are executed by the processor to execute the computer-executable instructions stored in the memory to cause the electronic device to perform the method of any one of claims 1-7.

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