FCBGA product cover bonding tool and cover bonding process

Abstract

This invention provides an FCBGA product capping fixture and a capping process. The FCBGA product capping fixture of this invention is applicable to FCBGA products including a substrate, a chip, a metal cap, a first adhesive layer, and a second adhesive layer. The metal cap is disposed on the substrate, defining a receiving cavity between the metal cap and the substrate. The chip is disposed within the receiving cavity and is located on the upper surface of the substrate. The first adhesive layer is disposed between the metal cap and the substrate, and the second adhesive layer is disposed between the chip and the metal cap. The FCBGA product capping fixture of this invention includes a positioning base, a positioning frame, and a pressure plate. The positioning base has a positioning groove for positioning the substrate. The positioning frame is disposed on the positioning base and has a positioning channel corresponding to the positioning groove. The positioning channel extends through the positioning frame along its thickness direction and is used to position the metal cap. The pressure plate can move vertically to press the metal cap together.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to an FCBGA product cover mounting fixture and cover mounting process. Background Technology

[0002] As a key product form in the chip packaging field, Flip Ball Grid Array (FCBGA) requires a capping process after chip soldering to achieve packaging protection. The capping structure not only provides physical protection for the core area of ​​the chip, avoiding damage to the chip from external impacts, dust and other factors, but also assists in chip heat dissipation and ensures stable operation of the chip under complex working conditions. Therefore, the capping process is an indispensable key link in the FCBGA product manufacturing process.

[0003] In the current technological system, the capping operation of FCBGA products mostly relies on fully automated capping equipment. To meet the requirements of precision packaging, such equipment generally integrates a high-precision vision alignment system, a micron-level precision motion control system, and a highly stable vacuum pickup system. This enables precise matching and stable placement of the cap and chip during the capping process, effectively ensuring capping yield and packaging consistency, and demonstrating significant advantages in the mass production of standardized FCBGA products.

[0004] However, the high integration and precision of fully automated capping equipment also present significant drawbacks: extremely high manufacturing and maintenance costs, placing stringent demands on the capital investment of manufacturing companies. For companies whose main business is small-batch, multi-variety FCBGA products, the cost-effectiveness disadvantage of such equipment is particularly pronounced—on the one hand, small-batch production cannot fully utilize the equipment's capacity advantages, resulting in low equipment utilization; on the other hand, frequent equipment parameter adjustments during the production of multi-variety products further increase time costs and operational complexity, ultimately significantly increasing the company's unit production cost and making it difficult to adapt to their production model requirements.

[0005] Therefore, there is a lack of capping equipment in the existing technology that can balance capping accuracy and cost-effectiveness, and is suitable for small-batch, multi-variety FCBGA product production scenarios. Summary of the Invention

[0006] This invention provides a tooling for attaching caps to FCBGA products.

[0007] The FCBGA product mounting fixture of this invention is applicable to an FCBGA product including a substrate, a chip, a metal cap, a first adhesive layer and a second adhesive layer. The metal cap is disposed on the substrate, and the metal cap and the substrate define a receiving cavity. The chip is disposed in the receiving cavity and is disposed on the upper end face of the substrate. The first adhesive layer is disposed between the metal cap and the substrate, and the second adhesive layer is disposed between the chip and the metal cap. The FCBGA product capping fixture includes: A positioning base is provided with a positioning groove, which is used to position the substrate; A positioning frame is provided on the positioning base, and the positioning frame is provided with a positioning channel corresponding to the positioning groove. The positioning channel passes through the positioning frame along the thickness direction and is used to position the metal cover. A pressure plate that can move vertically to press the metal cover together.

[0008] During the cover application process, the substrate with the chip is placed in the positioning groove of the positioning base. The inner circumferential surface of the positioning groove abuts against the outer circumferential surface of the substrate, which can achieve the effect of positioning the substrate. The positioning frame is then placed on the base so that the positioning channel of the positioning frame corresponds to the positioning groove. Then, the corresponding chip of the metal cover is placed on the substrate. At this time, the outer peripheral wall of the metal cover abuts against the inner peripheral wall of the positioning channel, which can achieve the effect of positioning the metal cover.

[0009] Finally, the pressure plate is pressed onto the metal cover to press and fix the metal cover in place, making it easier for subsequent processes.

[0010] It is understood that the FCBGA product cover mounting fixture of this invention includes a positioning base, a positioning frame, and a pressure plate. The positioning base is used to position the substrate, the positioning frame is used to position the metal cover, and the pressure plate is used to press and fix the metal cover. The structure is simple, easy to operate, and low in cost, making it very suitable for the cover mounting needs of small batches of FCBGA products. At the same time, different specifications of positioning grooves and positioning channels can be made according to different specifications of FCBGA products to meet the cover mounting needs of multiple varieties of FCBGA products.

[0011] Therefore, the FCBGA product capping fixture of this invention can adapt to the capping needs of small batches and multiple varieties of FCBGA products, and has the characteristics of simple structure, easy operation and low cost.

[0012] In some embodiments, the base is provided with a guide post; the positioning frame is provided with a first guide hole corresponding to the guide post, and the positioning frame is slidably disposed on the first guide post through the first guide hole; the pressure plate is provided with a second guide hole corresponding to the guide post, and the pressure plate is slidably disposed on the second guide post through the second guide hole.

[0013] In some embodiments, the positioning base is provided with a heating module, which is used to heat the positioning base.

[0014] In some embodiments, the positioning base is provided with a first magnetic attractor, and the pressure plate is provided with a second magnetic attractor corresponding to the first magnetic attractor. The first magnetic attractor and the second magnetic attractor attract each other.

[0015] In some embodiments, the thickness of the first adhesive layer is 30-80 μm; and / or the thickness of the second adhesive layer is 30-80 μm.

[0016] The present invention also provides an FCBGA product capping process using the FCBGA product capping fixture described in the above embodiments.

[0017] The FCBGA product capping process of this invention includes the following operations: The substrate containing the chip is placed in the positioning groove of the positioning base; Set the positioning frame on the positioning base; A first adhesive layer is provided at the position of the metal cover corresponding to the substrate, and a second adhesive layer is provided at the position of the metal cover corresponding to the chip, wherein the first adhesive layer and the second adhesive layer use the same adhesive. A metal cover is placed on the substrate through a positioning channel, and the metal cover covers the chip so that the chip is placed in the receiving cavity defined by the metal cover and the substrate. The metal cover is pressed and fixed using a pressure plate; The tooling containing the FCBGA product was transferred to a curing oven and cured according to the curing curves of the first and second adhesive layers.

[0018] In some embodiments, after the substrate with the chip is placed in the positioning groove of the positioning base, the substrate with the chip is preheated.

[0019] In some embodiments, when preheating the substrate on which the chip is located, the preheating temperature is 100-150°C and the preheating time is 30-90 seconds.

[0020] In some embodiments, when the positioning frame is placed on the positioning base, the guide post passes through the first guide hole.

[0021] In some embodiments, when the metal cover is pressed and fixed using a pressure plate, the guide post is passed through the second guide hole. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the FCBGA product cover fitting tool according to an embodiment of the present invention.

[0024] In the picture: 1. Substrate; 2. Chip; 3. Metal cap; 4. First adhesive layer; 5. Second adhesive layer; 6. Positioning base; 7. Positioning frame; 701. First guide hole; 8. Pressure plate; 801. Second guide hole; 9. First magnetic chuck; 10. Second magnetic chuck; 11. Heating module; 12. Guide column. Detailed Implementation

[0025] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0026] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal encapsulation of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] This invention provides a tooling for attaching caps to FCBGA products.

[0029] The FCBGA product mounting fixture of this embodiment of the invention is applicable to an FCBGA product including a substrate 1, a chip 2, a metal cover 3, a first adhesive layer 4 and a second adhesive layer 5. The metal cover 3 is disposed on the substrate 1, and the metal cover 3 and the substrate 1 define a receiving cavity. The chip 2 is disposed in the receiving cavity and is disposed on the upper end surface of the substrate 1. The first adhesive layer 4 is disposed between the metal cover 3 and the substrate 1, and the second adhesive layer 5 is disposed between the chip 2 and the metal cover 3. The FCBGA product cover fitting tooling of this invention includes a positioning base 6, a positioning frame 7, and a pressure plate 8.

[0030] The positioning base 6 is provided with a positioning groove, which is used to position the substrate 1. The positioning frame 7 is located on the positioning base 6, and the positioning frame 7 is provided with a positioning channel corresponding to the positioning groove. The positioning channel passes through the positioning frame 7 along the thickness direction and is used to position the metal cover 3. The pressure plate 8 can move in the vertical direction to press the metal cover 3.

[0031] During the cover application process, the substrate 1 with chip 2 is placed in the positioning groove of the positioning base 6. The inner circumferential surface of the positioning groove abuts against the outer circumferential surface of the substrate 1, which can achieve the positioning effect of the substrate 1. Then, the positioning frame 7 is placed on the base so that the positioning channel of the positioning frame 7 corresponds to the positioning groove. Then, the metal cover 3 corresponding to the chip 2 is placed on the substrate 1. At this time, the outer peripheral wall of the metal cover 3 abuts against the inner peripheral wall of the positioning channel, which can achieve the effect of positioning the metal cover 3.

[0032] Finally, the pressure plate 8 is pressed onto the metal cover 3 to press and fix the metal cover 3, which facilitates subsequent processes.

[0033] It is understood that the FCBGA product cover fitting tooling of the present invention includes a positioning base 6, a positioning frame 7, and a pressure plate 8. The positioning base 6 is used to position the substrate 1, the positioning frame 7 is used to position the metal cover 3, and the pressure plate 8 is used to press and fix the metal cover 3. The structure is simple, easy to operate, and low in cost, making it very suitable for the cover fitting needs of small batches of FCBGA products. At the same time, different specifications of positioning grooves and positioning channels can be made according to different specifications of FCBGA products to meet the cover fitting needs of multiple varieties of FCBGA products.

[0034] Therefore, the FCBGA product capping fixture of this invention can adapt to the capping needs of small batches and multiple varieties of FCBGA products, and has the characteristics of simple structure, easy operation and low cost.

[0035] In some embodiments, a guide post 12 is provided on the base; a first guide hole 701 is provided on the positioning frame 7 corresponding to the guide post 12, and the positioning frame 7 is slidably disposed on the first guide post 12 through the first guide hole 701; a second guide hole 801 is provided on the pressure plate 8 corresponding to the guide post 12, and the pressure plate 8 is slidably disposed on the second guide post 12 through the second guide hole 801.

[0036] It is understandable that by setting guide posts 12 on the base, when the positioning frame 7 and the pressure plate 8 are placed, the first guide hole 701 and the second guide hole 801 respectively cooperate with the guide posts 12, so that the positioning frame 7 and the pressure plate 8 can slide precisely along the guide posts 12, which can ensure the stability of the positioning frame 7 and the pressure plate 8 during the movement and avoid deviation or shaking. At the same time, the position of the guide posts 12 relative to the positioning base 6 is fixed, which facilitates the positioning of the positioning frame 7 and the positioning base 6, and further facilitates the positioning of the metal cover 3 by the positioning frame 7.

[0037] This design not only improves the accuracy of the capping process, but also simplifies the operation and reduces errors that may be caused by manual intervention.

[0038] In addition, the cooperation between the guide post 12 and the guide hole can enhance the overall structural integrity to a certain extent, providing a more reliable guarantee for the capping process.

[0039] In some embodiments, the positioning base 6 is provided with a heating module 11, which is used to heat the positioning base 6.

[0040] It is understandable that the chip 2 is usually fixed to the substrate 1 by soldering. The substrate 1 after soldering usually has the problem of edge warping. After the substrate 1 is placed in the positioning groove of the positioning base 6, the heating module 11 can be activated to heat the positioning base 6, so that the positioning base 6 heats the substrate 1. After the substrate 1 is heated, under the influence of its own weight, the warped part will return to a straight state, thereby improving the yield of the substrate 1.

[0041] In some embodiments, a first magnetic attractor 9 is provided on the positioning base 6, and a second magnetic attractor 10 is provided on the pressure plate 8 corresponding to the first magnetic attractor 9, and the first magnetic attractor 9 and the second magnetic attractor 10 attract each other.

[0042] It is understandable that when the pressure plate 8 is pressed onto the metal cover 3, the first magnetic 9 and the second magnetic 10 on the positioning base 6 attract each other, which can initially fix the pressure plate 8 and prevent the pressure plate 8 from moving during the transfer process, thereby ensuring the stability of the metal cover 3 during the bonding process.

[0043] In other words, the combination of the first magnetic chuck 9 and the second magnetic chuck 10 not only improves operational convenience but also further reduces bonding deviations caused by external interference. Simultaneously, the attraction between the first magnetic chuck 9 and the second magnetic chuck 10 can be adjusted according to actual needs to accommodate different specifications of metal caps 3 and pressure plates 8, enhancing the equipment's versatility. This configuration also effectively reduces the frequency of manual intervention, improves production efficiency, and reduces quality problems caused by human error, providing additional assurance for the stability and consistency of the cap-applying process.

[0044] In some embodiments, the thickness of the first adhesive layer 4 is 30-80 μm; and / or the thickness of the second adhesive layer 5 is 30-80 μm.

[0045] Preferably, the thickness of the first adhesive layer 4 is 30μm, 40μm, 50μm, 60μm, 70μm, or 80μm.

[0046] Preferably, the thickness of the second adhesive layer 5 is 30μm, 40μm, 50μm, 60μm, 70μm, or 80μm.

[0047] It is understandable that the first adhesive layer 4 is disposed between the metal cover 3 and the substrate 1 to bond and seal the metal cover 3 and the substrate 1, and the second adhesive layer 5 is disposed between the metal cover 3 and the chip 2 to bond and fix the metal cover 3 and the chip 2.

[0048] If the thickness of the first adhesive layer 4 and the second adhesive layer 5 is too small, it will affect the bonding effect between the metal cover 3 and the substrate 1, as well as between the metal cover 3 and the substrate 1. If the thickness of the first adhesive layer 4 and the second adhesive layer 5 is too large, the adhesive layer will easily overflow during the subsequent pressing process, and the processing cost will also increase.

[0049] Therefore, by setting the first adhesive layer 4 and the second adhesive layer 5 to the above range, it is possible to meet the sealing requirements between the metal cover and the substrate and between the metal cover and the chip, while avoiding the problem of adhesive layer overflow during subsequent pressing, and also saving costs.

[0050] The present invention also provides an FCBGA product capping process using the FCBGA product capping fixture described in the above embodiments.

[0051] The FCBGA product capping process of this invention includes the following operations: The substrate 1 with chip 2 is placed in the positioning groove of the positioning base 6; Positioning frame 7 is placed on positioning base 6; A first adhesive layer 4 is provided at the position of the metal cover 3 corresponding to the substrate 1, and a second adhesive layer 5 is provided at the position of the metal cover 3 corresponding to the chip 2, wherein the adhesive used for the first adhesive layer 4 and the first adhesive layer 5 is the same. The metal cover 3 is placed on the substrate 1 through the positioning channel, and the metal cover 3 covers the chip 2 so that the chip 2 is placed in the receiving cavity defined by the metal cover 3 and the substrate 1. The metal cover 3 is pressed and fixed using the pressure plate 8; The tooling containing the FCBGA product was transferred to a curing oven and cured according to the curing curves of the first adhesive layer 4 and the second adhesive layer 5.

[0052] The first adhesive layer 4 and the second adhesive layer 5 use the same adhesive, that is, the curing curves of the first adhesive layer 4 and the second adhesive layer 5 are the same, which makes it easy to cure them in a curing oven.

[0053] In other words, during the cover application process, the substrate 1 with chip 2 is placed in the positioning groove of the positioning base 6, and the inner circumferential surface of the positioning groove abuts against the outer circumferential surface of the substrate 1, which can achieve the effect of positioning the substrate 1. Then, the positioning frame 7 is placed on the base so that the positioning channel of the positioning frame 7 corresponds to the positioning groove. Then, the metal cover 3 corresponding to the chip 2 is placed on the substrate 1. At this time, the outer peripheral wall of the metal cover 3 abuts against the inner peripheral wall of the positioning channel, which can achieve the effect of positioning the metal cover 3.

[0054] Subsequently, the first adhesive layer 4 and the second adhesive layer 5 can be cured using a curing oven, so that the metal cover 3 can be completely fixed on the substrate 1. At the same time, the curing curves are the inherent characteristics of the first adhesive layer 4 and the second adhesive layer 5, which are existing technologies and can be obtained by consulting relevant materials, so they will not be elaborated here.

[0055] It is understood that the FCBGA product capping process of this embodiment utilizes the FCBGA product capping fixture described in the above embodiment to cap the FCBGA product. The positioning base 6 is used to position the substrate 1, the positioning frame 7 is used to position the metal cap 3, and the pressure plate 8 is used to press and fix the metal cap 3. It has the characteristics of simple operation and is very suitable for the capping needs of small batches of FCBGA products. At the same time, different specifications of positioning grooves and positioning channels can be used according to different specifications of FCBGA products to meet the capping needs of multiple varieties of FCBGA products.

[0056] Therefore, the FCBGA product capping process of this invention is simple to operate and can adapt to the capping needs of small batches and multiple varieties of FCBGA products.

[0057] In some embodiments, after the substrate 1 with chip 2 is placed in the positioning groove of the positioning base 6, the substrate 1 with chip 2 is preheated.

[0058] It is understandable that the chip 2 is usually fixed to the substrate 1 by soldering. The substrate 1 after soldering usually has the problem of edge warping. After the substrate 1 is placed in the positioning groove of the positioning base 6, the heating module 11 can be activated to heat the positioning base 6, so that the positioning base 6 heats the substrate 1. After the substrate 1 is heated, under the influence of its own weight, the warped part will return to a straight state, thereby improving the yield of the substrate 1.

[0059] In some embodiments, when preheating the substrate 1 on which the chip 2 is provided, the preheating temperature is 100-150°C and the preheating time is 30-90s.

[0060] Preferably, the preheating temperature is 100℃, 110℃, 120℃, 130℃, 140℃, or 150℃. Preferably, the preheating time is 30s, 40s, 50s, 60s, 70s, 80s, or 90s.

[0061] It is understandable that by setting the preheating temperature and preheating time within the aforementioned range, thermal damage to substrate 1 caused by excessively high temperature or prolonged time can be effectively avoided, while also ensuring that substrate 1 is sufficiently heated to eliminate warping. In actual operation, the preheating temperature and preheating time can be flexibly adjusted within the aforementioned range according to the specific material and size of substrate 1 and the soldering status of chip 2, thereby achieving the best preheating effect.

[0062] In some embodiments, when the positioning frame 7 is placed on the positioning base 6, the guide post 12 passes through the first guide hole 701.

[0063] After the guide post 12 passes through the first guide hole 701, it ensures precise alignment between the positioning frame 7 and the positioning base 6. In this way, inaccurate capping caused by positional misalignment can be effectively avoided. In addition, the design of the guide post 12 can also enhance the stability of the overall structure to a certain extent, making the positioning frame 7 less prone to shaking or tilting during subsequent operations, thereby further improving the reliability and accuracy of the capping process.

[0064] In some embodiments, when the metal cover 3 is pressed and fixed using the pressure plate 8, the guide post 12 passes through the second guide hole 801.

[0065] After the guide post 12 passes through the second guide hole 801, it can further ensure the precise alignment between the pressure plate 8 and the metal cover 3. In addition, the design of the guide post 12 can also enhance the stability of the overall structure to a certain extent, making it less likely for the pressure plate 8 to shake or tilt during subsequent operations, thereby further improving the reliability and accuracy of the cover application process.

[0066] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A tooling for attaching caps to FCBGA products, characterized in that, The FCBGA product includes a substrate (1), a chip (2), a metal cover (3), a first adhesive layer (4), and a second adhesive layer (5). The metal cover (3) is disposed on the substrate (1), and the metal cover (3) and the substrate (1) define a receiving cavity. The chip (2) is disposed in the receiving cavity and is disposed on the upper surface of the substrate (1). The first adhesive layer (4) is disposed between the metal cover (3) and the substrate (1), and the second adhesive layer (5) is disposed between the chip (2) and the metal cover (3). The FCBGA product capping fixture includes: A positioning base (6) is provided with a positioning groove, which is used to position the substrate (1). Positioning frame (7), the positioning frame (7) is provided on the positioning base (6), and the positioning frame (7) is provided with a positioning channel corresponding to the positioning groove. The positioning channel passes through the positioning frame (7) along the thickness direction of the positioning frame (7). The positioning channel is used to position the metal cover (3). Pressure plate (8), which can move in the vertical direction to press the metal cover (3).

2. The FCBGA product capping fixture according to claim 1, characterized in that, The base is provided with a guide post (12); the positioning frame (7) is provided with a first guide hole (701) corresponding to the guide post (12), and the positioning frame (7) is slidably disposed on the first guide post (12) through the first guide hole (701); the pressure plate (8) is provided with a second guide hole (801) corresponding to the guide post (12), and the pressure plate (8) is slidably disposed on the second guide post (12) through the second guide hole (801).

3. The FCBGA product capping fixture according to claim 1, characterized in that, The positioning base (6) is provided with a heating module (11), which is used to heat the positioning base (6).

4. The FCBGA product capping fixture according to claim 1, characterized in that, The positioning base (6) is provided with a first magnetic suction element (9), and the pressure plate (8) is provided with a second magnetic suction element (10) corresponding to the first magnetic suction element (9). The second magnetic suction element (10) and the first magnetic suction element (9) and the second magnetic suction element (10) attract each other.

5. The FCBGA product capping fixture according to claim 1, characterized in that, The thickness of the first adhesive layer (4) is 30-80 μm; and / or the thickness of the second adhesive layer (5) is 30-80 μm.

6. An FCBGA product capping process utilizing the FCBGA product capping fixture as described in any one of claims 1-5, characterized in that, This includes the following operations: The substrate (1) with chip (2) is placed in the positioning groove of the positioning base (6); Place the positioning frame (7) on the positioning base (6); A first adhesive layer (4) is provided at the position of the metal cover (3) corresponding to the substrate (1), and a second adhesive layer (5) is provided at the position of the metal cover (3) corresponding to the chip (2), wherein the adhesive used for the first adhesive layer (4) and the first adhesive layer (5) is the same; The metal cover (3) is placed on the substrate (1) through the positioning channel, and the metal cover (3) covers the chip (2) so that the chip (2) is placed in the receiving cavity defined by the metal cover (3) and the substrate (1); The metal cover (3) is pressed and fixed using the pressure plate (8); The tooling containing the FCBGA product was transferred to the curing oven and cured according to the curing curves of the first adhesive layer (4) and the second adhesive layer (5).

7. The FCBGA product capping process according to claim 6, characterized in that, After placing the substrate (1) with chip (2) in the positioning groove of the positioning base (6), the substrate (1) with chip (2) is preheated.

8. The FCBGA product capping process according to claim 7, characterized in that, When preheating the substrate (1) with chip (2), the preheating temperature is 100-150℃ and the preheating time is 30-90s.

9. The FCBGA product capping process according to claim 6, characterized in that, When the positioning frame (7) is placed on the positioning base (6), the guide post (12) is passed through the first guide hole (701).

10. The FCBGA product capping process according to claim 6, characterized in that, When the metal cover (3) is pressed and fixed using the pressure plate (8), the guide post (12) is passed through the second guide hole (801).

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