Low dielectric polyimide film using monomer having ester group and method for manufacturing the same

Abstract

This invention provides a polyimide film comprising a polyimide containing dianhydride monomers and a diamine monomer as polymerization units. The dianhydride monomers include a first dianhydride monomer with ester groups and a second dianhydride monomer without ester groups. The diamine monomers include a first diamine monomer with ester groups and a second diamine monomer without ester groups. After being placed at room temperature (20~25°C) and indoor humidity (40~60%) for 24 hours, the dielectric constant (D0) is [not specified]. k (@10GHz) is below 3.6. After being placed for 24 hours under room temperature (20~25℃) and indoor humidity (40~60%) conditions, the dielectric loss factor (D) is... f (@10GHz) is less than 0.0020.

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