Lighting device
By using vibration-damping components to cover the expanded diameter of the terminals and sockets in the light source unit of the lighting device, the loosening problem caused by vibration was solved, and the device was able to be installed stably and operate normally.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DENKA CO LTD
- Filing Date
- 2024-12-04
- Publication Date
- 2026-06-19
AI Technical Summary
In a vibrating environment, the connections of lighting devices are easily affected by vibration, leading to loosening and instability.
The expanded diameter of the terminals and sockets of the light source unit is covered by a vibration damping component, which is fastened by a tapered part and a covering part to reduce the impact of vibration. An air exchange fan is installed inside the frame to maintain stability.
It effectively suppressed the impact of vibration on the connection parts of the lighting device, ensuring the stable installation and normal operation of the light source unit.
Smart Images
Figure CN122249672A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a lighting device. Background Technology
[0002] Fluorescent lamps, high-pressure mercury lamps, metal halide lamps, sodium lamps, and other types of lamps are widely used as lighting devices in lanes and other areas.
[0003] Patent Document 1 describes a road lighting device comprising: a plurality of LED elements; a sub-lens that focuses a diffused beam from the LED elements toward the width of the road and emits a fan-shaped focused beam that diffuses along the long side of the road; and a main lens disposed below the sub-lens that emits the focused beam focused by the sub-lens toward the lighting area, and refracts a portion of the focused beam along the long side of the road toward the far end of the lighting area.
[0004] Patent Document 1: Japanese Patent Application Publication No. 2009-99492 Summary of the Invention
[0005] The inventors' research revealed that when lighting devices are installed in environments that generate vibration, such as roads, the vibration affects the connections of the lighting devices. One example of the object of this invention is to provide a lighting device capable of suppressing the effects of vibration on the connections.
[0006] According to the present invention, the following lighting device is provided. [1]
[0008] A lighting device comprising:
[0009] The light source unit includes a light-emitting module and terminals electrically connected to the light-emitting module.
[0010] A socket, which is connected to and receives the terminal; and
[0011] Vibration damping components cover the terminals and the socket.
[0012] The light source unit has an enlarged diameter portion in the region between the terminal and the light-emitting module, or on the terminal, which increases in diameter as it approaches the light-emitting module.
[0013] The vibration damping component covers at least a portion of the expanded diameter section. [2]
[0015] The lighting device according to [1] further comprises a frame that houses the light-emitting module and has the enlarged diameter portion.
[0016] The frame has a first opening.
[0017] The vibration damping component does not cover at least a portion of the first opening. [3]
[0019] According to the lighting device described in [2], wherein,
[0020] The first opening is provided in the enlarged diameter portion.
[0021] The vibration damping component has a second opening that overlaps with at least a portion of the first opening. [4]
[0023] According to the lighting device described in [2] or [3], wherein,
[0024] The frame also has a ventilation fan for ventilating the interior of the frame. [5]
[0026] According to the lighting device described in [1] or [2], wherein,
[0027] The vibration damping component contains silicone rubber. [6]
[0029] According to the lighting device described in [1] or [2], wherein,
[0030] The light source unit comprises a CSP (Chip Scale Package) assembled with LEDs and packaged in a chip-sized form. [7]
[0032] The lighting device described in [1] or [2] is installed on the highway.
[0033] According to the present invention, a lighting device capable of suppressing the effect of vibration on the connecting part is provided. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of the lighting device involved in this embodiment.
[0035] Figure 2 yes Figure 1 AA' section view.
[0036] Figure 3 This is a plan view of the lighting device involved in this embodiment, viewed from above.
[0037] Figure 4 This is a side view of the lighting device involved in this embodiment.
[0038] Figure 5 This is a perspective view of the light source unit involved in this embodiment.
[0039] Figure 6This is a three-dimensional view of the light source unit with the light distribution adjustment section removed.
[0040] Figure 7 yes Figure 5 BB' sectional view.
[0041] Figure 8 This is an enlarged view of the torso from the terminal side.
[0042] Figure 9 This diagram shows the state in which terminals are screwed onto a socket.
[0043] Figure 10 This is a diagram showing an example of a vibration damping component viewed from the side.
[0044] Figure 11 This is a diagram showing an example of a vibration damping component as viewed from the socket side.
[0045] Figure 12 This is a diagram showing the connection between terminals and sockets with vibration damping components.
[0046] Figure 13 Figure 1 shows a modified example of a vibration damping component.
[0047] Figure 14 Figure 2 shows a modified example of a vibration damping component.
[0048] Figure 15 This is a schematic diagram showing the relationship between opening 1 and opening 2.
[0049] Figure 16 Figure 1 shows the installation method of the vibration damping components.
[0050] Figure 17 This is Figure 2, which shows the installation method of the vibration damping components.
[0051] Figure 18 Figure 3 shows the installation method of the vibration damping components.
[0052] Figure 19 Figure 4 shows the installation method of the vibration damping components.
[0053] Figure 20 This is a plan view of the light-emitting module viewed from a right-angle direction.
[0054] Figure 21 This is a schematic diagram of a phosphor substrate.
[0055] Figure 22 This is a diagram illustrating the light-emitting action of the light-emitting module. Detailed Implementation
[0056] Hereinafter, embodiments of the present invention will be described using the accompanying drawings. Furthermore, in all the drawings, the same reference numerals are used to denote the same constituent elements, and descriptions are omitted where appropriate.
[0057] The lighting device 100 according to this embodiment will be described using the accompanying drawings. Figure 1 This is an example of a plan view of the lighting device 100 according to this embodiment, viewed from below. Furthermore, Figure 2 yes Figure 1 AA' section view. Figure 3 This is a plan view of the lighting device 100 as viewed from above. Figure 4 This is a side view of the lighting device 100. The lighting device 100 is installed, for example, on a road. An example of such a road is a highway or other road dedicated to automobiles, but it is not limited to this.
[0058] like Figure 1 As shown, the lighting device 100 includes a frame and a light source unit 10 housed within the frame.
[0059] like Figures 1 to 4 As shown, the frame has a lower main body shell 101 and an upper main body shell 102. By combining them, as... Figure 2 As shown, a space a is formed inside to accommodate the light source unit 10. Figure 3 and Figure 4 As shown, the upper main body housing 102 also has a first housing portion 102a located on the front side in the direction of light emission and a second housing portion 102b located on the rear side. Figure 1 In the lighting device 100, the left side faces the road side. Furthermore, a support joint 103 for connecting with a support post is provided on the right side of the lighting device 100.
[0060] like Figure 1 and Figure 2 As shown, a window 104 is provided on the lower surface 101b of the lower main housing 101. This allows light from the light source unit 10 to illuminate the road surface. The window 104 can be made of a light-transmitting material such as glass or resin. Here, light transmittance refers to allowing light emitted by the light source unit 10 to pass through. Multiple heat dissipation grooves 101a are formed on the side of the lower main housing 101.
[0061] The following is a detailed description of each structure of the lighting device 100.
[0062] [Light Source Unit 10]
[0063] Figure 5 This is a three-dimensional view of the light source unit 10. Furthermore, Figure 6 This is a perspective view of the light source unit 10 and the light distribution adjustment section 14 after the light distribution adjustment section 14 has been removed. Furthermore, Figure 7yes Figure 5 A BB' sectional view. (e.g.) Figure 5 and Figure 6 As shown, the light source unit 10 includes a light-emitting module 12, a frame 11 housing the light-emitting module 12, and a light distribution adjustment section 14 detachably mounted on the frame 11. The light distribution adjustment section 14 mounted on the frame 11 is generally cylindrical in shape. However, this shape is not limited to cylindrical. Furthermore, the frame 11 includes a body 18 and an ventilation fan 19 disposed at one end of the body 18. In order to ensure the airflow based on the ventilation fan 19, i.e., to control the airflow, the ventilation fan 19 is usually covered by a cover (not shown). Furthermore, the light source unit 10 includes a terminal 18a for electrically connecting the light-emitting module 12 to the other end of the body 18. As an example, the weight of the light source unit is 200g or more and 1000g or less.
[0064] [Torso 18]
[0065] like Figure 5 and Figure 6 As shown, the body 18 is shaped by removing a portion corresponding to the light distribution adjustment section 14 from a generally cylindrical shape, and has a radially inwardly recessed portion at its central part along its long side. The bottom surface of the recessed portion forms a plane, and the light-emitting module 12 is mounted (fixed) on this bottom surface. Furthermore, the length of the body 18 is, for example, 100 mm or more and 250 mm or less, and the width W of the recessed portion is, for example, 60 mm or more and 150 mm or less. This recessed portion is covered by the light distribution adjustment section 14.
[0066] The torso 18 has internal space, such as Figure 7 As shown, a heat sink 16 is provided in its internal space. The heat sink 16 has multiple fins that are in contact with the phosphor substrate of the light-emitting module 12. Moreover, a power drive circuit or a temperature sensor is provided in this internal space. By driving and controlling the ventilation fan 19 through the drive circuit, the internal temperature of the light source unit 10 can be controlled within the desired temperature range.
[0067] The driving circuit includes an LED driver IC or capacitors, and uses PWM (Pulse Width Modulation) to control the on-time (off-time) of the driving element Q through switching actions, thereby controlling the current flowing through the LED chip to the desired value.
[0068] In addition, the torso 18 can be made of resin or metal.
[0069] [Light Distribution Adjustment Unit 14]
[0070] The light distribution adjustment section 14 is mounted to cover the light-emitting module 12 and has a shape that protrudes outward from the side of the light-emitting module 12. That is, the outer surface of the light distribution adjustment section 14 has a shape that protrudes outward from the side of the light-emitting module 12. The relationship between the outer surface and the inner surface of the light distribution adjustment section 14 is arbitrary, but it is preferably a so-called concave lens shape. As a result, the emitted light from the light-emitting module 12 can be diffused and emitted outward (irradiated).
[0071] The shape of the light distribution adjustment section 14 can be a dome shape, a cylindrical shape, a Fresnel lens shape, or a curved shape.
[0072] The light distribution adjustment section 14 receives the emitted light from the light-emitting module 12 and emits the received light to the outside. Examples of light distribution adjustment sections 14 include transparent covers and transparent lenses. The light distribution adjustment section 14 can be made of a material that is transparent to the emission wavelength of the light-emitting diode element (LED, etc.). Examples of such transparent materials include thermoplastic resins, thermosetting resins, and glass; preferably, materials with high heat resistance are preferred to withstand the temperature rise inside the light source unit 10 caused by the heat generated by the light-emitting diode element.
[0073] Furthermore, the light distribution adjustment unit 14 can be attached to and detached from the frame 11 of the light source unit 10. As a specific method for configuring the light distribution adjustment unit 14 to be detachable, for example, a claw portion (not shown) can be provided on the light distribution adjustment unit 14, and an engaging portion (not shown) composed of a notch, a recess, or a protrusion can be provided on the body 18 of the light source unit 10.
[0074] Furthermore, from the viewpoint of moldability and processability, the light distribution adjustment section 14 is preferably a thermoplastic resin or a thermosetting resin, such as polycarbonate, polyimide, polyacrylate, polysulfone, polyarylsulfone, aromatic polyamide, aromatic polyetheramide, polyphenylene sulfide, polyaryl ether ketone, polyamide-imide, liquid crystal polyester, polytetrafluoroethylene, etc. The light distribution adjustment section 14 may contain a diffusing agent, an ultraviolet absorber, an antioxidant, etc.
[0075] When the light distribution adjustment section 14 is made of resin, it can be manufactured by injection molding, compression molding, transfer molding, casting molding, etc.
[0076] [Terminal 18a]
[0077] Terminal 18a has a threaded tooth 3 on its side, which allows it to be screwed into a threaded hole in a socket 200 located on the side of the support joint 103 inside the lower main housing 101. In this way, the light source unit 10 can be detachably mounted to the lower main housing 101, and then the screwed terminal 18a is electrically connected to the light-emitting module 12.
[0078] Figure 8 The diagram shows an enlarged view of the torso 18 on the side of terminal 18a. (See diagram below.) Figure 8 As shown, a diameter-enlarging portion 18b is provided in the region between the terminal 18a of the body 18 and the light-emitting module 12, which increases in diameter as it approaches the light-emitting module 12. The angle θ1 between the side of the diameter-enlarging portion 18b and the long side direction of the body 18 is preferably, for example, 60° or more and 80° or less, or 30° or more and 70° or less. Furthermore, as... Figure 8 As shown, the expanded diameter portion 18b may have a first opening 1 for ventilating the interior of the frame 11. Furthermore, the first openings 1 may be arranged at equal intervals or irregularly in the circumferential direction of the expanded diameter portion 18b. From the viewpoint of ventilating the interior of the frame 11, the area of the first opening 1 is preferably large; however, considering the mechanical strength of the frame 11, it is preferably 50% to 90% of the total area of the expanded diameter portion 18b.
[0079] Figure 9 The diagram shows the state in which terminal 18a is screwed into socket 200. Socket 200 is provided, for example, in a state of being connected to a power source, on the support joint 103 side of the lower main body housing 101. Furthermore, socket 200 has a concave shape, and inside the concave shape is a threaded hole for engaging with the threaded teeth 3 of terminal 18a, and is electrically connected to the screwed terminal 18a.
[0080] Thus, power is supplied to the light-emitting module 12. However, as... Figure 9 As shown, the connection is made solely by screwing the terminal 18a into the socket 200, making it prone to loosening due to external vibrations. The lighting device 100 of this embodiment solves this problem by having a vibration damping member 300, which is described below.
[0081] [Vibration damping component 300]
[0082] Figure 10 This is an example of the vibration damping component 300 viewed from the side. Furthermore, Figure 11 This is a diagram showing the vibration damping component 300 as viewed from the socket 200 side. (See diagram below.) Figure 10 As shown, the vibration damping component 300 may have a socket cover 300a, a tapered portion 300b, and a body cover 300c. The socket cover 300a covers at least a portion of the socket 200, the tapered portion 300b covers at least a portion of the expanded diameter portion 18b, and the body cover 300c covers at least a portion of the body 18. The socket cover 300a and the body cover 300c are generally cylindrical. Furthermore, the inner diameter of the socket cover 300a is smaller than the inner diameter of the body cover 300c. The tapered portion 300b, which connects them, has a tapered shape. Additionally, as... Figure 10As shown, when viewed from the side, the edge of the tapered portion 300b can be either a curve or a straight line.
[0083] The shape of the vibration damping component 300 is designed according to the size of the torso 18, the expanded diameter portion 18b, and the socket 200. The inner diameter W1 of the socket cover portion 300a is designed, for example, to be 0.7 times or more and 0.9 times or less the width of the socket 200, and the inner diameter W2 of the torso cover portion 300c is designed, for example, to be 0.7 times or more and 0.9 times or less the width of the torso 18. Thus, the vibration damping component 300 can securely and tightly install the torso 18, the expanded diameter portion 18b, and the socket 200. Furthermore, the length T3 of the torso cover portion 300c is preferably designed to be a length that does not overlap with the light distribution adjustment portion 14 when the vibration damping component 300 is installed. Specifically, for example, the length T1 of the socket cover portion 300a is 30 mm or more and 80 mm or less, and the length T3 of the torso cover portion 300c is 10 mm or more and 30 mm or less. Furthermore, when viewed from the side, the angle θ2 at the center of the tapered portion 300b in the height direction toward the horizontal direction is, for example, 25° or more and 80° or less.
[0084] Figure 12 The diagram shows the connection between terminal 18a and socket 200, which includes a vibration damping member 300. The lighting device 100 according to this embodiment, by including the vibration damping member 300, can suppress the loosening of the screw connection between terminal 18a and socket 200 caused by vibration. Furthermore, Figure 12 The outline of the vibration damping component 300 is shown. Preferably, the socket cover 300a fits tightly with the socket 200, and preferably, the torso cover 300c also fits tightly with the torso 18. Furthermore, the tapered portion 300b may also fit tightly with at least a portion of the enlarged diameter portion 18b.
[0085] Furthermore, the thickness of the vibration damping component 300 is, for example, 2mm or more and 6mm or less. And, as... Figure 10 As shown, the edge portions of the socket cover portion 300a and the torso cover portion 300c may be thicker than the other areas.
[0086] then, Figure 13 , 14 The diagram shows a modified example of the vibration damping component 300. Figure 13 The vibration damping component 300 shown does not include the torso cover 300c. Furthermore, the vibration damping component 300 only covers a portion of the enlarged diameter portion 18b and does not cover at least a portion of the first opening portion 1. As a result, loosening of the screw connection between the terminal 18a and the socket 200 can be suppressed, and ventilation of the interior of the frame 11 can be effectively achieved.
[0087] Figure 14The vibration damping component 300 shown has a second opening 2 and a connecting portion 4 connecting the body 18 and the terminal 18a. Furthermore, by having at least a portion of the second opening 2 of the vibration damping component 300 overlap with at least a portion of the first opening 1 of the expanded diameter portion 18b, loosening of the screw thread between the terminal 18a and the socket 200 can be suppressed, and ventilation of the interior of the frame 11 can be effectively achieved. Preferably, the entire area of the first opening 1 of the expanded diameter portion 18b overlaps with the second opening 2 of the vibration damping component 300, but from the viewpoint of the mechanical strength of the vibration damping component 300, it is also possible to design the connecting portion 4 to overlap with a portion of the first opening 1. For example, the area of the second opening 2 of the vibration damping component 300 is designed to be at least 0.8 times and less than 1.2 times the area of the connecting portion 4.
[0088] Figure 15 It means Figure 14 A schematic diagram showing the relationship between the first opening 1 and the second opening 2 in the enlarged diameter portion 18b. Figure 15 In the example shown, both the first opening 1 and the second opening 2 are trapezoidal. Furthermore, the maximum circumferential length T21 of the second opening 2 is longer than the maximum circumferential length T11 of the first opening 1, and the radial length T12 of the first opening 1 is longer than the radial length T22 of the second opening 2. However, it is also possible that length T11 is longer than length T21, and it is also possible that length T22 is longer than length T12. Furthermore, it is more preferable to set the number of second openings 2 corresponding to each first opening 1 to the same number as the number of first openings 1.
[0089] Furthermore, the material constituting the vibration damping component 300 is not particularly limited as long as it is flexible, such as an elastomer like fluororubber or silicone rubber.
[0090] Furthermore, the vibration damping component 300 can be manufactured by molding the aforementioned material using, for example, transfer molding or molding methods based on 3D printing, RIM molding, injection molding, etc.
[0091] [Installation of vibration damping component 300]
[0092] Next, use Figures 16 to 19 The installation method of the vibration damping component 300 will be explained. First, as... Figure 16 As shown, the socket 300 is configured such that the socket cover portion 300a of the vibration damping component 300 covers the socket 300.
[0093] Next, as Figure 17As shown, the vibration damping member 300 is folded towards the socket 300 so that the inner surface of the vibration damping member 300 faces outward. For example, the portion of the vibration damping member 300 located in the conical portion 300b is bent outward and folded so that the inner surface of the torso cover portion 300c faces outward. Furthermore, Figure 17 The slashed part in the figure represents the inner surface of the vibration damping component 300.
[0094] Next, as Figure 18 As shown, the thread 3 of terminal 18a is screwed into the threaded hole of socket 300. Then, as... Figure 19 As shown, the folded portion is reset, thereby enabling the installation of the vibration damping component 300.
[0095] [Light-emitting module 12]
[0096] The light-emitting module 12 is not particularly limited as long as it can emit light, and can use fluorescent lamps, high-pressure mercury lamps, metal halide lamps, sodium lamps, etc. It is preferably composed of a phosphor substrate 20 and a plurality of light-emitting elements (LED chips) 30 mounted on the phosphor substrate 20. In the following description, the light-emitting module 12 is described as being composed of a phosphor substrate 20 and a plurality of light-emitting elements (LED chips) 30 mounted on the phosphor substrate 20.
[0097] Figure 20 This is a plan view of the light-emitting module 12 viewed from a right-angle direction. Figure 21 yes Figure 20 The DD' section view in the image. (e.g.) Figure 20 As shown, in the light-emitting module 12, a plurality of light-emitting elements 30 are arranged in a grid pattern on the phosphor substrate 20. However, the arrangement of the light-emitting elements 30 is not limited to a grid pattern.
[0098] [Phosphor substrate 20]
[0099] A plurality of light-emitting elements 30 are disposed on a phosphor substrate 20. The phosphor substrate 20 serves to hold them. Furthermore, as... Figure 21 As shown, the phosphor substrate 20 includes a phosphor layer 21, a circuit pattern layer 22, an insulating layer 23, and a back pattern layer 24. These layers are stacked sequentially from the side where the light-emitting element 30 is disposed. The phosphor layer 21 is made of phosphor material and functions to emit light by using the light emitted by the light-emitting element 30 as excitation light. Furthermore, the circuit pattern layer 22 and the back pattern layer 24 are provided for supplying power to the light-emitting element 30. The insulating layer 23 is made of insulating material, maintaining the above-described structure and preventing short circuits between the circuit pattern layer 22 and the back pattern layer 24.
[0100] <Fluorescent Layer 21>
[0101] The phosphor layer 21 is formed to cover the circuit pattern layer 22. The phosphor layer 21 is formed, for example, in at least a portion of the area of the circuit pattern layer 22 other than the area where the light-emitting element 30 is disposed. In other words, the phosphor layer 21 is formed in the area surrounding the area of the circuit pattern layer 22 where the light-emitting element 30 is disposed. Preferably, the phosphor layer 21 is formed in most of the aforementioned area.
[0102] As an example, the phosphor layer 21 is composed of a phosphor and an adhesive, as described later. The phosphor contained in the phosphor layer 21 consists of microparticles that are held in a dispersed state in the adhesive and have the property of being excited by the light emission of the light-emitting element 30 as excitation light. In addition, the adhesive can be, for example, epoxy-based, acrylate-based, silicone-based, etc., and has the same insulating properties as the adhesive contained in the solder resist.
[0103] As an example, the phosphor included in the phosphor layer 21 of this embodiment can be one or a combination of two or more selected from Eu-containing α-type silon phosphors, Eu-containing β-type silon phosphors, Eu-containing CASN phosphors, and Eu-containing SCASN phosphors. Alternatively, it can also include other visible light-excited phosphors such as YAG, LuAG, and BOS.
[0104] Eu-containing α-type cylon phosphors are derived from the general formula: M x Eu y Si 12-（m+n） Al （m+n） O n N 16-n In the above general formula, M is an element selected from the group consisting of Li, Mg, Ca, Y and lanthanide elements (excluding La and Ce) that contains at least one Ca. When the valence of M is set to a, ax + 2y = m, x is 0 < x ≤ 1.5, and 0.3 ≤ m < 4.5 and 0 < n < 2.25.
[0105] β-type silon phosphors containing Eu are made by adding divalent europium (Eu) 2+ ) as the luminescent center, dissolved in the general formula: Si 6- z Al z O z N 8-z (z=0.005~1) represents the phosphor obtained from β-type silane.
[0106] Furthermore, examples of nitride phosphors include CASN phosphors containing Eu and SCASN phosphors containing Eu.
[0107] CASN phosphors containing Eu (an example of nitride phosphors) refer, for example, to phosphors composed of the formula CaAlSiN3:Eu.2+ It means that Eu 2+ As an activator, it is a red phosphor based on crystals composed of alkaline earth silicon nitrides. Furthermore, in the definition of Eu-containing CASN phosphors in this specification, Eu-containing SCASN phosphors are excluded.
[0108] SCASN phosphors containing Eu (an example of nitride phosphors) refer, for example, to phosphors composed of the formula (Sr,Ca)AlSiN3:Eu. 2+ It means that Eu 2+ A red phosphor with a matrix of alkaline earth silicon nitrides as the activator.
[0109] <Circuit pattern layer 22, back pattern layer 24>
[0110] In this embodiment, the circuit pattern layer 22 is a conductive layer formed on the surface side of the insulating layer 23, and the back pattern layer 24 is a conductive layer disposed on the back side of the insulating layer 23. The materials constituting the circuit pattern layer 22 and the back pattern layer 24 are not particularly limited as long as they are conductive; for example, copper.
[0111] In addition, the area on the surface of the insulating layer 23 where the circuit pattern layer 22 is disposed is, for example, more than 60% of the surface area of the insulating layer 23.
[0112] <Insulation Layer 23>
[0113] The insulating layer 23 in this embodiment serves to maintain the various structures and prevent short circuits in the circuit pattern layers 22 and the back pattern layers 24. The material constituting the insulating layer 23 is not particularly limited as long as it has insulating properties; for example, insulating materials such as prepregs made by impregnating a fiber substrate such as glass cloth with a resin such as bismaleimide resin can be used.
[0114] [Light-emitting element 30]
[0115] The light-emitting element 30 includes general light-emitting elements such as fluorescent lamps or LEDs, but is particularly preferably a CSP (Chip Scale Package) assembled with flip-chip LEDs 32 (hereinafter referred to as LED32). Figure 21 ).like Figure 21 As shown, as a CSP, preferably, the entire periphery (5 sides) of the LED 32, except for the bottom surface, is covered by a phosphor sealing layer 31 containing phosphors. When covered by the phosphor sealing layer 31, the light from the LED 32 is color-converted by the phosphors in the phosphor sealing layer 31 and then illuminates the outside.
[0116] [Light-emitting module 12's light-emitting action]
[0117] Next, refer to Figure 22 The light-emitting operation of the plant cultivation lighting device 10 of this embodiment will be explained.
[0118] First, when the operating switch (not shown) that enables the multiple light-emitting elements 30 to operate is turned on, power is supplied to the circuit pattern layer 22 from an external power source (not shown) via a connector (not shown), thereby causing the multiple light-emitting elements 30 to emit light L radially, a portion of which reaches the phosphor layer 21 of the phosphor substrate 20. Hereinafter, the behavior of the emitted light L will be explained by distinguishing the direction of travel of the emitted light L.
[0119] A portion of the light L emitted from each light-emitting element 30 does not incident on the phosphor layer 21 but is emitted to the outside. In this case, the wavelength of the light L remains the same as the wavelength of the light L emitted from each light-emitting element 30.
[0120] Furthermore, a portion of the light L emitted from the light-emitting element 30 is incident on the phosphor layer 21. Here, "a portion of the light L" includes light that has not undergone color conversion by the phosphor (phosphor sealing layer 31) of the light-emitting element 30, i.e., the light of the LED 32 itself (for example, blue light with a wavelength around 470 nm). Moreover, if a portion of the light L emitted from the light-emitting element 30 collides with the phosphor dispersed in the phosphor layer 21, the phosphor is excited and emits light. Consequently, a portion of the energy of the light L is used for the excitation of the phosphor, resulting in a loss of some of the energy of the light L. As a result, the wavelength of the light L is converted (wavelength conversion occurs). For example, depending on the type of phosphor in the phosphor layer 21 (for example, in the case of using red CASN as the phosphor), the wavelength of the light L will become longer (e.g., 650 nm, etc.). Furthermore, of the light emitted by the excitation of the phosphor layer 21, some light is emitted directly from the phosphor layer 21, but some light is directed towards the underlying circuit pattern layer 22. Moreover, some light is reflected by the circuit pattern layer 22 and emitted to the outside. As described above, when the wavelength of the light emitted by the excitation of the phosphor in phosphor layer 21 is 600 nm or more, a reflection effect can be expected even if the circuit pattern layer 22 is Cu. Furthermore, depending on the type of phosphor in phosphor layer 21, the wavelength of light L may differ from the examples described above, but wavelength conversion of light L is performed in all cases. For example, when the wavelength of the light emitted by the excitation of phosphor layer 21 is less than 600 nm, a reflection effect can be expected by making the circuit pattern layer 22 or its surface, for example, Ag (gold plating). Alternatively, the same effect can be expected by providing a white reflective layer on the underside of phosphor layer 21 (on the insulating layer 23 side). The reflective layer is formed, for example, by a white coating such as titanium dioxide filler.
[0121] Through the above actions, the light emitted from the light-emitting module 12 is irradiated from the lighting device 100 via the light distribution adjustment unit 14.
[0122] The embodiments of the present invention have been described above with reference to the accompanying drawings, but these are merely examples of the present invention, and various other structures may also be employed.
[0123] As described above, the lighting device 100 according to this embodiment has a vibration damping member 300 at the connection between the threaded portion 18a and the socket 200, thus suppressing the influence of vibration on the connection.
[0124] Example
[0125] The present invention will now be described in detail with reference to the embodiments, but the present invention is not limited to any of the embodiments described herein.
[0126] [Manufacturing of vibration damping component 300]
[0127] Silicone rubber was molded using a 3D printer to create... Figure 11 The vibration damping component 300 is shown. Additionally, the dimensions are as follows.
[0128] T1: 34.5
[0129] ·T2:37
[0130] T3: 21.5
[0131] W1:53
[0132] W2: 82
[0133] Average thickness: 2-3mm
[0134] [evaluate]
[0135] Next, components were prepared. In the comparative example, an LED lamp (manufactured by CS Inc., Retro Fit LED Lamp) was directly mounted to the socket. In the embodiment, the LED lamp was mounted to the socket using the manufactured vibration damping component 300. Then, for both the embodiment and the comparative example, with the socket fixed, vibration at a frequency of 800 times / minute and an amplitude of 3mm was applied for 5 minutes, and the loosening of the screw connection between the LED lamp and the socket was checked. As a result, in the comparative example, the LED lamp rotated approximately 90 degrees, while in the embodiment, no loosening of the screw connection was detected. Furthermore, in the embodiment, it was confirmed that there was no abnormal lighting after the vibration was applied.
[0136] As confirmed above, according to the present invention, a lighting device capable of suppressing the effect of vibration on the connecting part can be provided.
[0137] In addition, embodiments and examples of the present invention have been described with reference to the accompanying drawings, but these are merely examples of the present invention, and various other structures may also be employed.
[0138] This application claims priority based on Japanese Patent Application No. 2023-205484, filed on December 5, 2023, the entire contents of which are incorporated herein by reference. Explanation of reference numerals in the attached figures
[0139] 100 - Lighting device; 101 - Lower main body housing; 101a - Groove; 102 - Upper main body housing; 102a - First housing part; 102b - Second housing part; 103 - Support joint; 104 - Window part; 10 - Light source unit; 11 - Main body; 12 - Light-emitting module; 14 - Light distribution adjustment part; 14a - Light-receiving surface; 14b - Emission surface; 16 - Heat sink; 18 - Body; 18a - Threaded part; 19 - Ventilation fan; 20 - Phosphor substrate; 21 - Phosphor layer; 22 - Circuit pattern layer; 23 - Insulating layer; 24 - Back pattern layer; 30 - Light-emitting element; 32 - LED.
Claims
1. A lighting device comprising: The light source unit includes a light-emitting module and terminals electrically connected to the light-emitting module. A socket, which is connected to and receives the terminal; and Vibration damping components cover the terminals and the socket. The light source unit has an enlarged diameter portion in the region between the terminal and the light-emitting module, or on the terminal, which increases in diameter as it approaches the light-emitting module. The vibration damping component covers at least a portion of the expanded diameter section.
2. The lighting device according to claim 1, further comprising a frame accommodating the light-emitting module and having the expanded diameter portion, The frame has a first opening. The vibration damping component does not cover at least a portion of the first opening.
3. The lighting device according to claim 2, wherein, The first opening is provided in the enlarged diameter portion. The vibration damping component has a second opening that overlaps with at least a portion of the first opening.
4. The lighting device according to claim 2 or 3, wherein, The frame also has a ventilation fan for ventilating the interior of the frame.
5. The lighting device according to claim 1 or 2, wherein, The vibration damping component contains silicone rubber.
6. The lighting device according to claim 1 or 2, wherein, The light source unit comprises a CSP (Chip Scale Package) assembled with LEDs and packaged in a chip-sized form.
7. The lighting device according to claim 1 or 2, which is installed on a highway.