Heat dissipation apparatus employing a heat transfer chamber having openings to improve heat sink airflow and heat dissipation and related assembly methods

Abstract

A heat dissipation device employing an open heat transfer chamber to improve airflow and heat dissipation in a radiator, and a related assembly method for the heat dissipation device, are disclosed. The heat dissipation device is thermally coupled to a heat-generating electronic device (e.g., an integrated circuit (IC) chip) to dissipate heat. The heat dissipation device includes a fan and a radiator configured to be thermally coupled to an external heat-generating device. The heat dissipation device also includes a heat transfer chamber for efficiently transferring heat to the radiator. To mitigate interference of the heat transfer chamber with the airflow path between the fan and the radiator, an opening is provided in the heat transfer chamber that is transverse to the airflow path through the radiator. This opening in the heat transfer chamber provides a more direct airflow path between the fan and the heat-generating device.

Description

Technical Field

[0001] The field of this disclosure relates to heat sinks including cooling fins that can be thermally coupled to an integrated circuit (IC) chip to dissipate heat; and more specifically to heat sinks employing fans to increase airflow through the cooling fins to dissipate heat. Background Technology

[0002] Integrated circuits (ICs) are the cornerstone of electronic devices. ICs are packaged in IC packages, also known as "semiconductor chips" or "IC chips." Electronic devices may include one or more IC chips mounted on and electrically coupled to a substrate (such as a printed circuit board (PCB)) to provide physical support and electrical interfaces to the IC chip. For example, a type of IC chip typically used in higher-power devices is a System-on-a-Chip (SoC), which includes a processor and other supporting circuitry within a single IC chip. Other types of IC chips also include high-power circuitry. IC chips generate heat by dissipating energy when their circuitry is powered on. As the circuitry within IC chips becomes more powerful and faster in terms of functionality and size, and as their dimensions become more compact, the heat generated by the IC chip increases due to the high-speed flow of electrons. Excessive heat can raise the junction temperature of the IC chip and reduce its performance and reliability, and in extreme cases, can cause the circuitry within the IC chip to fail due to exceeding its thermal limits. IC chips may also have operating temperature thermal limits based on their circuit performance standards (e.g., the circuit will have a thermal limit at which performance begins to decline) to extend battery life and / or keep the temperature within the “skin limit”.

[0003] Therefore, it is important to provide technologies that utilize the heat generated by the IC chip to keep the junction temperature of the IC chip within desired limits. For example, one way to keep the IC chip within the desired junction temperature is to provide a heat sink thermally coupled to the IC chip to dissipate heat. For instance, the heat sink can be provided as a metal block including metal cooling fins, which has a higher thermal conductivity than ambient air, thereby enhancing heat dissipation. The heat sink dissipates heat by conducting it away from the heat source (such as the IC chip) and distributing it throughout the heat sink. The heat is then transferred from the solid surface to the fluid or gas via convection from the surrounding air. The air in contact with the hot surface of the heat sink becomes hotter, less dense, and rises, causing cooler ambient air to replace the rising hot air, creating a continuous airflow over the heat sink. This convective airflow carries heat away from the heat sink and into the surrounding environment for heat dissipation. Fans can also be used to increase the airflow through the heat sink to increase the rate of heat dissipation, thereby keeping the temperature of the IC chip within the desired temperature limits.

[0004] Even when heat sinks are used to dissipate heat from IC chips, heat dissipation becomes increasingly challenging, especially for handheld or mobile devices where mechanical space is limited for providing heat sinks and heat dissipation. There is a need for more efficient ways to dissipate heat from the IC package and IC chip environment. Summary of the Invention

[0005] The aspects disclosed in the detailed description include a heat dissipation device employing a heat transfer chamber with an opening to improve airflow and heat dissipation from a heat sink. Related methods for assembling the heat dissipation device are also disclosed. As an example, the heat dissipation device may be thermally coupled to electronic devices, such as printed circuit boards (PCBs) and / or IC chips mounted on the circuit boards, to dissipate heat generated by energized circuitry. The heat dissipation device includes a heat sink (e.g., a metal heat sink) configured to be thermally coupled to an external heat-generating device (e.g., electronic devices and / or IC chips) to dissipate heat. To improve heat dissipation, the heat dissipation device also includes a fan thermally coupled to the heat sink to increase airflow across the heat sink. To further improve heat dissipation, the heat dissipation device also includes a heat transfer chamber (e.g., a steam chamber or heat pipe) thermally coupled to the heat sink. The heat transfer chamber is configured to be thermally coupled to an external heat-generating device to improve heat transfer from the heat-generating device and the heat sink. The heat transfer chamber comprises a liquid configured to absorb heat from a first side near the heat-generating device, causing the liquid to evaporate into vapor and travel to a second, cooler side of the heat transfer chamber near the radiator. The vapor releases heat to efficiently transfer heat to the radiator and condenses back into liquid. However, the heat transfer chamber, located between the heat-generating device and the fan, interferes with the direct airflow path between the fan and the heat-generating device, thus reducing airflow across the radiator. In an exemplary aspect, to mitigate the interference of the heat transfer chamber with the airflow path between the fan and the heat-generating device, one or more openings are provided in the heat transfer chamber transverse to the airflow path through the radiator. In this way, the heat transfer chamber can still be used to improve heat transfer between the heat-generating device and the radiator. However, the openings in the heat transfer chamber also provide a more direct airflow path between the fan and the heat-generating device, thereby directing air blown by the fan to the heat-generating device to cool heated air around the electronic device, thus cooling the electronic device, or drawing heated air away from the electronic device and directing it to the heat transfer chamber and the radiator to cool the electronic device. This reduces the amount of heat transfer required from the vapor chamber to the radiator, thereby improving heat dissipation.

[0006] In this regard, in one exemplary aspect, a heat dissipation device is disclosed. The heat dissipation device includes a first heat transfer chamber. The first heat transfer chamber includes a first surface extending in a first direction. The first heat transfer chamber includes a second surface extending in the first direction and opposite to the first surface in a second direction orthogonal to the first direction. The first heat transfer chamber also includes a first internal cavity in the second direction between the first surface and the second surface. The first heat transfer chamber also includes one or more first openings extending through the first heat transfer chamber in the second direction. The heat dissipation device also includes a heat sink coupled to the first surface of the first heat transfer chamber.

[0007] In another exemplary aspect, a method of assembling a heat dissipation device is provided. The method includes providing a first heat transfer chamber including: a first surface extending in a first direction; a second surface extending in the first direction and opposite to the first surface in the second direction orthogonal to the first direction; a first internal cavity between the first surface and the second surface in the second direction; and one or more first openings extending through the first heat transfer chamber in the second direction. The method further includes coupling the first surface of the first heat transfer chamber to a heat sink. Attached Figure Description

[0008] Figure 1 This is a perspective view of an exemplary heat-generating electronic device in the form of a circuit board, which includes an integrated circuit (IC) chip mounted on the circuit board;

[0009] Figure 2A and Figure 2B The images are a side view and an exploded front perspective view of an exemplary heat dissipation device, which includes a fan and a heat sink configured to be thermally coupled to a circuit board of a heat-generating electronic device to dissipate heat. The heat dissipation device also includes a heat transfer chamber in the form of a vapor chamber having one or more openings to provide a direct airflow path between the fan and the heat-generating device.

[0010] Figure 3A This is an example Figure 2A and Figure 2B An air particle flow diagram of a side perspective view of a heat dissipation device, illustrating air blown by a fan passing through a radiator and through an opening in a steam chamber to reach the heat-generating device.

[0011] Figure 3B and Figure 3C They are Figure 3A Top perspective and top view of the steam chamber in the heat dissipation device;

[0012] Figure 4A This is a side perspective view of an air particle flow diagram illustrating another heat dissipation device, similar to... Figure 2A and Figure 2B The heat dissipation device is located in the heat transfer chamber, but there is no opening in the heat transfer chamber.

[0013] Figure 4B yes Figure 4A Top perspective view of the steam chamber in the heat dissipation device;

[0014] Figure 5A This is an example Figures 2A to 3B A diagram illustrating an exemplary temperature gradient of the junction temperature of a heat dissipation device having an opening in its steam chamber;

[0015] Figure 5B This is an example Figure 4A and Figure 4B A diagram illustrating an exemplary temperature gradient of the junction temperature of a heat dissipation device that has no openings in its steam chamber.

[0016] Figure 6 yes Figures 2A to 3B Exploded front perspective view of a heat dissipation device with an opening, including a radiator and a steam chamber.

[0017] Figure 7A yes Figure 6 Top view of the bottom cover of the central steam chamber;

[0018] Figure 7B This is a top perspective view of the base of a steam chamber without a metal core;

[0019] Figure 7C This is a top perspective view of the metal core, which is configured to support... Figure 6 Inside the bottom cover of the steam chamber;

[0020] Figure 7D This is a top perspective view of the bottom cover of the steam chamber with a metal core inserted.

[0021] Figures 8A to 8E Other exemplary steam chambers with different exemplary opening patterns can serve as... Figures 2A to 3B The heat is supplied by the heat transfer chamber in the heat dissipation equipment;

[0022] Figure 9A This is a bottom perspective view of another exemplary heat dissipation device, which includes a first vapor chamber having an opening and coupled to a radiator, and includes a second vapor chamber coupled to the radiator within a recessed portion;

[0023] Figure 9B yes Figure 9A Bottom perspective view of the heat dissipation device in the middle;

[0024] Figure 9C yes Figure 9A Bottom view of the heat dissipation equipment and steam chamber in the middle;

[0025] Figure 9D yes Figure 9A A top view of the heat dissipation equipment in the middle;

[0026] Figure 10A This is a bottom perspective view of another exemplary heat dissipation device, which includes a first vapor chamber having an opening and coupled to a radiator, and includes a second vapor chamber coupled to the radiator within a recessed portion;

[0027] Figure 10B yes Figure 10A Bottom perspective view of the heat dissipation device in the middle;

[0028] Figure 10C yes Figure 10A Bottom view of the heat dissipation equipment in the middle;

[0029] Figure 10D yes Figure 10A A top view of the heat dissipation equipment in the middle;

[0030] Figure 11 This is a flowchart illustrating an exemplary assembly process for assembling a heat dissipation device, which includes a fan and a heat sink configured to be thermally coupled to a circuit board of a heat-generating electronic device to dissipate heat. The heat dissipation device also includes a heat transfer chamber in the form of a vapor chamber having one or more openings to provide a direct airflow path between the fan and the heat-generating device, including but not limited to... Figures 2A to 3B Heat dissipation devices, including but not limited to Figures 2A to 3B and Figures 6 to 10D The radiators and steam chambers in the middle;

[0031] Figures 12A to 12C This is a flowchart illustrating another exemplary assembly process for assembling a heat dissipation device, which includes a fan and a heat sink configured to be thermally coupled to a circuit board of a heat-generating electronic device to dissipate heat. The heat dissipation device also includes a heat transfer chamber in the form of a vapor chamber having one or more openings to provide a direct airflow path between the fan and the heat-generating device, including but not limited to... Figures 2A to 3B Heat dissipation devices, including but not limited to Figures 2A to 3B and Figures 6 to 10D The radiators and steam chambers in the middle;

[0032] Figures 13A to 13E It is based on Figures 12A to 12C An exemplary assembly phase during the assembly of a heat dissipation device;

[0033] Figure 14A and Figure 14BThe images are a side view and a front perspective view of an exemplary heat dissipation device, which includes a fan and a heat sink configured to be thermally coupled to a circuit board of a heat-generating electronic device to dissipate heat. The heat dissipation device also includes a heat transfer chamber in the form of a heat pipe having one or more openings to provide a direct airflow path between the fan and the heat-generating device.

[0034] Figure 15A yes Figure 14A and Figure 14B A top view of the heat pipes coupled to the radiator in the heat dissipation device.

[0035] Figure 15B yes Figure 14A and Figure 14B Top perspective view of the heat pipe in the heat dissipation device;

[0036] Figure 15C yes Figure 14A and Figure 14B Bottom view of the heat pipes coupled to the radiator in the heat dissipation device;

[0037] Figure 15D yes Figure 14A and Figure 14B A top view of the heat pipes coupled to the radiator in the heat dissipation device.

[0038] Figure 15E This is a bottom view of a heat pipe coupled to another exemplary radiator, which may be included in... Figure 14A and Figure 14B In the heat dissipation equipment;

[0039] Figure 15F yes Figure 15E A top view of the heat pipes coupled to the radiator;

[0040] Figure 16 This is a block diagram of an exemplary wireless communication device that includes radio frequency (RF) components and may include an exemplary heat dissipation device. The heat dissipation device includes a heat sink configured to thermally couple to a circuit board and / or RF components of the wireless communication device to dissipate heat. The heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and the circuit board and / or RF components of the wireless communication device, including but not limited to... Figures 2A to 3A , Figure 13D and Figures 14A to 14B Heat dissipation equipment in, and Figures 2A to 3B , Figures 6 to 10D , Figure 13E and Figures 14A to 15F The heat sink and heat transfer chamber are included, and the heat dissipation device may be included in, but is not limited to, its heat dissipation chamber. Figures 11 to 12CThe assembly process in the assembly process; and

[0041] Figure 17 This is a block diagram of an exemplary processor-based system that may include an exemplary heat dissipation device. The heat dissipation device includes a heat sink configured to thermally couple to a circuit board and / or RF components of a wireless communication device to dissipate heat. The heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and the heat-generating device, including but not limited to... Figures 2A to 3A , Figure 13D and Figures 14A to 14B Heat dissipation equipment in, and Figures 2A to 3B , Figures 6 to 10D , Figure 13E and Figures 14A to 15F The heat sink and heat transfer chamber are included, and the heat dissipation device may be included in, but is not limited to, its heat dissipation chamber. Figures 11 to 12C The assembly process in the assembly process. Detailed Implementation

[0042] Several exemplary aspects of this disclosure will now be described with reference to the accompanying drawings. The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects.

[0043] The aspects disclosed in the detailed description include a heat dissipation device employing a heat transfer chamber with an opening to improve airflow and heat dissipation from a heat sink. Related methods for assembling the heat dissipation device are also disclosed. As an example, the heat dissipation device may be thermally coupled to electronic devices, such as printed circuit boards (PCBs) and / or IC chips mounted on the circuit boards, to dissipate heat generated by energized circuitry. The heat dissipation device includes a heat sink (e.g., a metal heat sink) configured to be thermally coupled to an external heat-generating device (e.g., electronic devices and / or IC chips) to dissipate heat. To improve heat dissipation, the heat dissipation device also includes a fan thermally coupled to the heat sink to increase airflow across the heat sink. To further improve heat dissipation, the heat dissipation device also includes a heat transfer chamber (e.g., a steam chamber or heat pipe) thermally coupled to the heat sink. The heat transfer chamber is configured to be thermally coupled to an external heat-generating device to improve heat transfer from the heat-generating device and the heat sink. The heat transfer chamber comprises a liquid configured to absorb heat from a first side near the heat-generating device, causing the liquid to evaporate into vapor and travel to a second, cooler side of the heat transfer chamber near the radiator. The vapor releases heat to efficiently transfer heat to the radiator and condenses back into liquid. However, the heat transfer chamber, located between the heat-generating device and the fan, interferes with the direct airflow path between the fan and the heat-generating device, thus reducing airflow across the radiator. In an exemplary aspect, to mitigate the interference of the heat transfer chamber with the airflow path between the fan and the heat-generating device, one or more openings are provided in the heat transfer chamber transverse to the airflow path through the radiator. In this way, the heat transfer chamber can still be used to improve heat transfer between the heat-generating device and the radiator. However, the openings in the heat transfer chamber also provide a more direct airflow path between the fan and the heat-generating device, thereby directing air blown by the fan to the heat-generating device to cool heated air around the electronic device, thus cooling the electronic device, or drawing heated air away from the electronic device and directing it to the heat transfer chamber and the radiator to cool the electronic device. This reduces the amount of heat transfer required from the vapor chamber to the radiator, thereby improving heat dissipation.

[0044] In this regard, Figure 1This is a perspective view of an exemplary heat-generating electronic device 100, which includes a circuit board 102 and integrated circuit (IC) chips 104, 104(1) to 104(4) mounted to the circuit board 102. The circuitry in the IC chips 104, 104(1) to 104(4) generates energy loss during energized operation, thus generating heat. As the circuitry in the IC chip 104 becomes more powerful and faster in terms of functionality and operating speed, and becomes more compact in size, the heat generated by the IC chip 104 increases due to the high-speed flow of electrons. Excessive heat can raise the junction temperature of the IC chip 104 and reduce its performance and reliability, and in extreme cases, can cause the circuitry in the IC chip 104 to fail due to exceeding its thermal limit. The IC chip 104 in the electronic device 100 may also have an operating temperature thermal limit based on its circuit performance criteria (e.g., the circuit will have a thermal limit at which performance begins to decline) to extend battery life and / or keep the temperature within the “skin limit”. Therefore, it is important to provide a technique for keeping the junction temperature of these IC chips within the desired limits based on the heat generated by IC chips 104(1), 104(1) to 104(4).

[0045] In this regard, Figure 2A and Figure 2B These are, respectively, a side view and an exploded front perspective view of an exemplary heat dissipation device 200, which can be thermally coupled to a heat-generating device to dissipate heat generated by the heat-generating device. For example, Figure 2A and Figure 2B The heating device in the middle can be Figure 1 The electronic device 100 includes a plurality of IC chips 104, 104(1) to 104(4) mounted on a circuit board 102. Figure 2A and Figure 2BAs shown and discussed in more detail below, in this example, the heat dissipation device 200 includes a heat transfer chamber 202 in the form of a vapor chamber 204. The second bottom surface 206 of the vapor chamber 204, extending in a first horizontal direction (X-axis and Y-axis directions), is thermally coupled to an IC chip 104 in the electronic device 100, thereby efficiently conducting the heat generated by the IC chip 104 to the heat dissipation device 200. Optional thermal pads 208, 208(1) to 208(4) are coupled to the IC chips 104, 104(1) to 104(4), and the second bottom surface 206 of the vapor chamber 204 is coupled to the thermal pads 208, 208(1) to 208(4) to provide thermal coupling between the IC chips 104, 104(1) to 104(4) and the vapor chamber 204 and the heat dissipation device 200. The first top surface 210 of the vapor chamber 204 (which also extends in a first horizontal direction (X-axis and / or Y-axis direction) and is opposite to the second bottom surface 206 in a second vertical direction (Z-axis direction) orthogonal to the first horizontal direction (X-axis and / or Y-axis direction)) is coupled to the first bottom surface 212 of the heat sink 214 to dissipate heat generated by the IC chip 104, which is thermally transferred from the vapor chamber 204 to the heat sink 214. For example, the first bottom surface 212 of the heat sink 214 may be connected (e.g., soldered) to the first top surface 210 of the vapor chamber 204.

[0046] As discussed in more detail below, including Figure 2A and Figure 2B The heat transfer chamber 202 of the steam chamber 204 is a device that includes an internal cavity or chamber containing a liquid configured to absorb heat by conduction and then convert the heat into steam to improve heat transfer from a heat-generating device, such as electronic device 100. Figure 2A and Figure 2BThe vapor chamber 204 includes an internal cavity 220 or internal chamber to improve heat transfer from the electronic device 100 to the radiator 214. The internal cavity 220 is disposed within the vapor chamber 204 in a second vertical direction (Z-axis direction) between a second bottom surface 206 and a first top surface 210. The internal cavity 220 of the vapor chamber 204 includes a liquid configured to absorb heat from the bottom first surface 206 of the vapor chamber 204 near the electronic device 100, causing the liquid in the internal cavity 220 to evaporate into vapor and travel to the first cooler top surface 210 of the vapor chamber 204 near the radiator 214. The vapor releases heat to efficiently transfer heat to the radiator 214, then condenses back into liquid, returning to the internal cavity 220 by gravity and coming into fluid contact with the second bottom surface 206. The repeated process of liquid being converted into steam and then back into liquid within the internal cavity 220 of the steam chamber 204 is an efficient mechanism for transferring the heat generated by the electronic device 100 and its IC chips 104, 104(1) to 104(4) to the heat sink 214.

[0047] To further improve heat dissipation of the heat dissipation device 200, a fan 216 is included in the heat dissipation device 200 and is configured adjacent to and / or coupled to the second top surface 218 of the heat sink 214. When activated in a first operating mode, the fan 216 blows air toward and across the heat sink 214 to increase airflow through the heat sink 214, thereby improving heat dissipation. In an alternative operating mode, the fan 216 can be configured or controlled to draw air toward the vapor chamber 204 and the heat sink 214 when activated to improve heat dissipation. In this example, the heat sink 214 includes a plurality of metal fins 222, each metal fin extending parallel to each other in a first horizontal direction (Y-axis direction). Figure 2A As shown, each metal fin 222 is spaced apart from its adjacent metal fin 222 by a distance D1 to form a plurality of airflow channels 224. These airflow channels extend in a first horizontal direction (Y-axis direction) and a second vertical direction (Z-axis direction), leading to the first top surface 210 of the vapor chamber 204 and to the fan 216. In this way, air can enter the airflow channels 224 of the radiator 214 adjacent to the metal fins 222 for heat dissipation. In addition, the fan 216 is fluidly coupled to the airflow channels 224 of the radiator 214, guiding air into the airflow channels 224 of the radiator 214 to increase the airflow through the metal fins 222, thereby improving heat dissipation.

[0048] However, as Figure 2A and Figure 2BAs shown, the steam chamber 204 is located between the electronic device 100 and the fan 216 in the second vertical direction (Z-axis direction), which interferes with the direct airflow path between the fan 216 and the electronic device 100 in the second vertical direction (Z-axis direction), thereby reducing the airflow from the fan 216 to the electronic device 100. Therefore, in an exemplary aspect, in order to improve the thermal coupling and heat transfer between the electronic device 100 and the heat sink 214 by using the steam chamber 204 in the heat dissipation device 200, while reducing the interference of the steam chamber 204 on the airflow path from the fan 216 to the electronic device 100, one or more openings 226, 226(1) to 226(2) are provided in the steam chamber 204, such as Figure 2B As shown. Figure 2B As shown and discussed in more detail below, openings 226, 226(1) to 226(2) extend through the steam chamber 204 in a second vertical direction (Z-axis direction) from the second bottom surface 206 of the steam chamber 204 to the first top surface 210 of the steam chamber 204, which is adjacent to and in contact with the first bottom surface 212 of the radiator 214. In this example, openings 226, 226(1) to 226(2) extend in a first direction (X-axis and / or Y-axis direction) which is transverse to the airflow passage 224 in the second vertical direction (Z-axis direction). Figure 2B As shown, in this example, openings 226, 226(1) to 226(2) at least partially intersect one or more airflow channels 224 in the heat sink 214 in the second vertical direction (Z-axis direction), such that openings 226, 226(1) to 226(2) at least partially extend the airflow path downward from the intersecting airflow channels 224 to the electronic device 100 in the second vertical direction (Z-axis direction). For example, as Figure 2B As shown, airflow passage 224(1) partially intersects opening 226(1) in the second vertical direction (Z-axis direction), and airflow passage 224(2) partially intersects opening 226(2) in the second vertical direction (Z-axis direction). This facilitates a more direct airflow path from fan 216 to electronic device 100 through openings 226, 226(1) to 226(2) in steam chamber 204.

[0049] In this way, the steam chamber 204 in the heat dissipation device 200 can still be used to improve heat transfer and conduction to the radiator 214. However, the opening 226 in the steam chamber 204 also provides a more direct airflow path between the fan 216 and the electronic device 100 to blow air onto the electronic device 100 and away from the steam chamber 204, or to draw air away from the electronic device 100 and through the steam chamber 204 and the radiator 214 to improve heat dissipation.

[0050] To further illustrate the opening 226 in the steam chamber 204 and how this affects the passage through the fan 216 Figure 2A and Figure 2B The airflow in the steam chamber 204 of the heat dissipation device 200 provides Figures 3A to 3C . Figure 3A This is an example Figure 2A and Figure 2B The side perspective view of the heat dissipation device 200 in the figure illustrates an air particle flow diagram, which shows that the airflow 300 blown by the fan 216 enters the airflow channel 224 of the radiator 214 and passes through the openings 226, 226(1) to 226(4) in the steam chamber 204 to reach the electronic device 100. Figure 3B and Figure 3C They are respectively with Figures 2A to 3A Top perspective and top view of the heat dissipation device 200 and the steam chamber 204 coupled to the radiator 214.

[0051] like Figure 3A As shown, in this example, airflow 300 illustrates that air blown by fan 216 enters the airflow channel 224 between adjacent metal fins 222 in radiator 214 through radiator 214, and exits the airflow channel 224 laterally in a first horizontal direction (Y-axis direction). Some air blown by fan 216 is guided and blocked by the first top surface 210 of vapor chamber 204 in a second vertical direction (Z-axis direction). This air can exit through the airflow channel 224 in radiator 214. However, due to... Figure 3A as well as Figures 3B to 3C As shown, openings 226, 226(1) to 226(4) are now also formed in the steam chamber 204, so the air blown out by the fan 216 that intersects with the openings 226, 226(1) to 226(4) in the steam chamber 204 in the second vertical direction (Z-axis direction) can pass through the openings 226, 226(1) to 226(4) and be directly guided to the electronic device 100 in the second vertical direction (Z-axis direction). This is also due to Figure 3A The airflow 300 is shown. This provides cooling to the air surrounding the electronic device 100 to reduce the heat in the air conducted by the vapor chamber 204. In this example, as... Figure 3B and Figure 3C As shown, the steam chamber 204 includes four (4) openings 226 (1) to 226 (4), which are in the form of cut-out sections formed on each of its sides 228 (1) to 228 (4). Other designs and patterns for forming openings in the heat transfer chamber including the steam chamber 204 may also be formed, as discussed in more detail below, to facilitate improved airflow.

[0052] For the purpose of comparison, Figure 4AThis is an air particle flow diagram, illustrated by a side perspective view of another heat dissipation device 400, which is similar to... Figure 2A and Figure 2B The heat dissipation device 200 in the middle, but its steam chamber 404 does not have the same Figures 2A to 3C The openings in the steam chamber 204 are like openings 226(1) to 226(4); Figure 4B yes Figure 4A Top perspective view of the steam chamber 404 in the heat dissipation device 400. (See image) Figure 4A As shown, airflow 402 illustrates air blown by fan 216 passing through radiator 214 and the second top surface 410 of vapor chamber 404. The second top surface 410 prevents air in the second vertical direction (Z-axis direction) from being directly directed to electronic device 100. Because there is no [unclear text - possibly a continuation of the previous sentence] in vapor chamber 404... Figures 2A to 3C The openings 226(1) to 226(4) in the steam chamber 404 do not provide an airflow path through the steam chamber 204, thus preventing the air blown out by the fan 216 from being directly directed to the electronic device 100.

[0053] It should be noted that, as discussed above, in alternative operating modes, fan 216 may be configured or controlled to draw air toward steam chamber 204 and radiator 214 when activated to improve heat dissipation, rather than blowing air toward radiator 214 and through openings 226(1) to 226(4) to reach electronic device 100.

[0054] Figure 5A This is an example Figures 2A to 3A Figure 500A shows an exemplary temperature gradient 502A of the junction temperature of IC chips 104(1) to 104(4) of a heat dissipation device 200, which has an opening 226 in its vapor chamber 204. Figure 5B This is an example Figure 4A and Figure 4B Figure 500B shows an exemplary temperature gradient 502B of the junction temperatures of IC chips 104(1) to 104(4) in a heat dissipation device 400, which has no opening in its vapor chamber 404. Figure 5A As shown, Figures 2A to 3B The junction temperature of the IC chips 104(1) to 104(4) of the heat dissipation device 200 with opening 226 in the steam chamber 404 is lower than that of the IC chips 104(1) to 104(4). Figure 4A and Figure 4B The junction temperature of the IC chip in the heat dissipation device 400, excluding the opening, is located in the steam chamber 204.

[0055] Since it has already been introduced and described Figures 2A to 3B An exemplary heat dissipation device 200 having an opening 226 in its steam chamber 204 will now be discussed regarding Figures 6 to 10CExemplary details and options for the steam chamber 204 and the radiator 214 are described.

[0056] In this regard, Figure 6 yes Figures 2A to 3B An exploded front perspective view of an exemplary steam chamber 204 and radiator 214 of a heat dissipation device 200. As shown therein, in this example, the steam chamber 204 includes a first top cover 600 having a first top surface 210. The first top cover 600 may be made of a metallic material to provide good thermal conductivity when coupled to the radiator 214. The first top cover 600 has second openings 604(1) to 604(4), each second opening being disposed on a corresponding side 606(1) to 606(4) of the first top cover 600. In this example, the second openings 604(1) to 604(4) are rectangular cut-out sections extending to the periphery 608 of the steam chamber 204. The periphery 608 of the steam chamber 204 is formed at the intersection where the first top cover 600 and the second bottom cover 602 are joined, thereby forming an internal cavity 220 between the first top cover 600 and the second bottom cover 602. The second bottom cover 602 may be made of a metallic material, thus providing good thermal conductivity when thermally coupled to electronic devices such as IC chips or thermal pads. In this example, each of the second openings 604(1) to 604(4) extends to the periphery 608 of the steam chamber 204, but this is not necessary. Some or all of the openings provided in the steam chamber 204 may be provided inside the periphery 608 of the steam chamber 204. Also as Figure 6 As shown, the second bottom cover 602 also includes third openings 612(1) to 612(4), each third opening being disposed on a corresponding side 614(1) to 614(4) of the second bottom cover 602. In this example, the third openings 612(1) to 612(4) also have the same shape as the second openings 604(1) to 604(4) and also extend to the periphery 608 of the steam chamber 204 formed at the intersection where the first top cover 600 and the second bottom cover 602 are connected. The second openings 604(1) to 604(4) in the first top cover 600 are designed to align with the corresponding third openings 612(1) to 612(4) in the second bottom cover 602 in the second vertical direction (Z-axis direction) when the first top cover 600 is connected to the second bottom cover 602. Combined, aligned corresponding second openings 604(1) to 604(4) and third openings 612(1) to 612(4) form openings 226(1) to 226(4) in the steam chamber 204, which extend from the first top surface 210 of the first top cover 600 to the second bottom surface 206 of the second bottom cover 602.

[0057] Continue to refer to Figure 6The second bottom cover 602 has an inner chamber 616 that forms part of the inner cavity 220 of the steam chamber 204 when the first top cover 600 is attached to the second bottom cover 602. In this example, the inner chamber 616 has a general shape of the second bottom cover 602, as the inner cavity 220 of the steam chamber 204 is formed by recesses in the second bottom cover 602 adjacent to its respective sides 614(1) to 614(4). The inner chamber 616 also supports the placement of an optional metal core 618 in the inner cavity 220 of the steam chamber 204 to promote uniform distribution of liquid within the inner cavity 220 of the steam chamber 204. In this example, the metal core 618 is a wire mesh made of a metallic material. In this example, the metal core 618 has a general shape of the inner chamber 616. This also... Figure 7A and Figure 7B As shown, these two figures are a top view and a top perspective view of the second bottom cover 602 of the steam chamber 204 without the metal core 618 installed; and also... Figure 7C and Figure 7D As shown, these two figures are top perspective views of the metal core 618 and its installation in the inner chamber 616 of the second bottom cover 602.

[0058] Figures 8A to 8E Other exemplary steam chambers and / or covers with different exemplary opening patterns can serve as... Figures 2A to 3B The heat dissipation device 200 is provided by a steam chamber 204 and / or its first top cover 600 and second bottom cover 602. For example, Figure 8A Another exemplary steam chamber 804A is illustrated, which includes trapezoidal openings 812(1) to 812(4) disposed in respective sides 814(1) to 814(4) and each extending to the periphery 818 of the steam chamber 804A formed by the sides 814(1) to 814(4). Figure 8B Another exemplary steam chamber 804B is illustrated, which includes semi-circular openings 822(1) to 822(4) disposed in respective sides 824(1) to 824(4) and each extending to the periphery 828 of the steam chamber 804B formed by the sides 824(1) to 824(4). Figure 8C Another exemplary steam chamber 804C is illustrated, which includes rectangular openings 832(1) to 832(5) that are fully disposed in the steam chamber 804C and do not extend to the periphery 838 of the steam chamber 804C formed by its sides 834(1) to 834(4). Figure 8D Another exemplary steam chamber 804D is illustrated, which includes circular openings 842(1) to 842(6) that are fully disposed in the steam chamber 804D and do not extend to the periphery 848 of the steam chamber 804D formed by its sides 844(1) to 844(4). Figure 8EAnother exemplary steam chamber 804E is illustrated, which includes hexagonal openings 852(1) to 852(11) that are fully disposed in the steam chamber 804E and do not extend to the periphery 858 of the steam chamber 804E formed by its sides 854(1) to 854(4).

[0059] It may be desirable to couple a heat dissipation device with open heat transfer chambers to multiple electronic components (e.g., PCBs, stacked PCBs, IC chips) that are not coplanar with each other. Therefore, it may be advantageous to design a heat dissipation device that supports multiple heat transfer chambers at different planar levels within a heat sink, such that when the heat dissipation device is coupled to electronic components, the coupling surfaces of the heat transfer chambers will couple to the multiple electronic components at different heights and planarities. In this regard, Figure 9A This is a bottom perspective view of another heat dissipation device 900, which includes two steam chambers: a first steam chamber 904 (1) and a second steam chamber 904 (2), which are coupled to different surfaces of a radiator 915. These surfaces are not coplanar, so the steam chambers 904 (1) and 904 (2) will be at different heights offset from the coupled electronic devices. Figure 9B yes Figure 9A Bottom perspective view of the heat dissipation device 900 in the middle. Figure 9C yes Figure 9A Bottom view of the heat dissipation device 900 in the middle. Figure 9D yes Figure 9A A top view of the heat dissipation device 900 in the image. (See image for reference.) Figures 9A to 9D As shown, the second steam chamber 904 (2) is surrounded by the first steam chamber 904 (1) when coupled to the radiator 915.

[0060] The first steam chamber 904(1) can be similar to Figures 2A to 3B The steam chamber 204 in the heat dissipation device 200 includes an internal cavity 920 and may include a metal core within the internal cavity 920. The first steam chamber 904(1) may be formed by coupling a top cover to a bottom cover, similar to... Figures 2A to 3B The steam chamber 204 is located in the first steam chamber 904(1). The first steam chamber 904(1) has openings 914(1) to 914(4), each opening being disposed on a corresponding side 916(1) to 916(4) of the first steam chamber 904(1). In this example, the openings 914(1) to 914(4) are rectangular cut-out sections extending to the periphery 908 of the first steam chamber 904(1). A first top surface 910(1) opposite to the second bottom surface 906(1) of the first steam chamber 904(1) in the second vertical direction (Z-axis direction) is coupled to a radiator 915.

[0061] The second steam chamber 904(2) can be similar to Figures 2A to 3BThe steam chamber 204 in the heat dissipation device 200 includes an internal cavity 930 and may include a metal core within the internal cavity 930. A second steam chamber 904 (2) may be formed by coupling a top cover to a bottom cover, similar to... Figures 2A to 3B The second steam chamber 904 (2) has openings 924 (1) to 924 (4), each opening being disposed on a corresponding side 926 (1) to 926 (4) of the second steam chamber 904 (2). In this example, openings 924 (1) to 912 (4) are rectangular cut-out sections extending to the periphery 918 of the second steam chamber 904 (2). The first top surface 910 (2) of the second steam chamber 904 (2), which is opposite to the second bottom surface 906 (2) of the second steam chamber 904 (2) in the second vertical direction (Z-axis direction), is coupled to the radiator 915. In this example, the openings 914(1) to 914(4), 924(1) to 924(4) in the corresponding first steam chamber 904(1) and second steam chamber 904(2) extend to the corresponding peripheries 908, 918 of the corresponding first steam chamber 904(1) and second steam chamber 904(2), but this is not necessary.

[0062] like Figure 9B As shown, the heat sink 915 in this example includes a first surface 912(1) formed by the coplanar surfaces 912(1) of the metal fins 922 in the heat sink 915, and a second surface 912(2) formed by the coplanar surfaces 912(2) of the metal fins 922 in the heat sink 915. The second surface 912(2) is recessed and not coplanar with the first surface 912(1). In this way, the second vapor chamber 904(2) is coupled to the second surface 912(2), and the first vapor chamber 904(1) is coupled to the first surface 912(1). This design may be useful if the heat dissipation device 900 needs to be thermally coupled to an IC chip or other electronic component with different heights or offsets, such that the first vapor chamber 904(1) and the second vapor chamber 904(2) are offset in a second vertical direction (Z-axis direction) to couple to electronic components with different heights or offsets. In this example, the second steam chamber 904 (2) is contained within the first steam chamber 904 (1) and its periphery 908, but this is not necessary.

[0063] Figure 10A This is a bottom perspective view of another heat dissipation device 1000, which includes two vapor chambers: a first vapor chamber 1004(1) and a second vapor chamber 1004(2), which are coupled to different surfaces of a radiator 915. These surfaces are not coplanar, so the vapor chambers 1004(1) and 1004(2) will be at different heights offset from the coupled electronic devices. In this example, the two vapor chambers 1004(1) and 1004(2) are arranged adjacent to each other on the radiator 1015. Figure 10Byes Figure 10A Bottom perspective view of the heat dissipation device 1000 in the middle. Figure 10C yes Figure 10A Bottom view of the heat dissipation device 1000 in the middle. Figure 10D yes Figure 10A A top view of the heat dissipation device 1000 in the middle.

[0064] The first steam chamber 1004(1) can be similar to Figures 2A to 3B The steam chamber 204 in the heat dissipation device 200 includes an internal cavity 1020 and may include a metal core within the internal cavity 1020. The first steam chamber 1004 (1) may be formed by coupling a top cover to a bottom cover, similar to... Figures 2A to 3B The first steam chamber 1004 (1) has openings 1014 (1) to 1014 (4), each opening being disposed on a corresponding side 1016 (1) to 1016 (4) of the first steam chamber 1004 (1). In this example, openings 1014 (1) to 1014 (4) are rectangular cut-out sections, wherein openings 1014 (1) to 1014 (3) extend to the periphery 1008 of the first steam chamber 1004 (1). A first top surface 1010 (1) opposite to the second bottom surface 1006 (1) of the first steam chamber 1004 (1) in a second vertical direction (Z-axis direction) is coupled to a radiator 1015.

[0065] The second steam chamber 1004(2) can be similar to Figures 2A to 3B The steam chamber 204 in the heat dissipation device 200 includes an internal cavity 1030 and may include a metal core within the internal cavity 1030. A second steam chamber 1004 (2) may be formed by coupling a top cover to a bottom cover, similar to... Figures 2A to 3B The second steam chamber 1004 (2) has openings 1024 (1) to 1024 (6), each opening being disposed on the side surfaces 1026 (1) to 1026 (4) of the second steam chamber 1004 (2). In this example, openings 1024 (1) to 1024 (4) are rectangular cut-out sections extending to the periphery 1018 of the second steam chamber 1004 (2). The first top surface 1010 (2) of the second steam chamber 1004 (2), which is opposite to the second bottom surface 1006 (2) of the second steam chamber 1004 (2) in the second vertical direction (Z-axis direction), is coupled to the radiator 1015. In this example, the openings 1014(1) to 1014(4), 1024(1) to 1024(6) in the corresponding first steam chamber 1004(1) and second steam chamber 1004(2) extend to the corresponding peripheries 1008, 1018 of the corresponding first steam chamber 1004(1) and second steam chamber 1004(2), but this is not necessary.

[0066] like Figure 10B As shown, the heat sink 1015 in this example includes a first surface 1012(1) formed by the coplanar surfaces 1012(1) of the metal fins 1022 in the heat sink 1015, and a second surface 1012(2) formed by the coplanar surfaces 1012(2) of the metal fins 1022 in the heat sink 1015. The second surface 1012(2) is recessed and not coplanar with the first surface 1012(1). In this way, the second vapor chamber 1004(2) is coupled to the second surface 1012(2), and the first vapor chamber 1004(1) is coupled to the first surface 1012(1). This design may be useful if the heat dissipation device 1000 needs to be thermally coupled to an IC chip or other electronic component with different heights or offsets, such that the first vapor chamber 1004(1) and the second vapor chamber 1004(2) are offset in a second vertical direction (Z-axis direction) to couple to the electronic component with different heights or offsets. In this example, the second steam chamber 1004 (2) is located adjacent to the first steam chamber 1004 (1), but this is not necessary.

[0067] A heat dissipation device can be assembled during the assembly process. This heat dissipation device includes a heat sink configured to thermally couple to an electronic device to dissipate heat. The heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and the circuit board and / or RF components of a wireless communication device. These openings include, but are not limited to, those provided in the original text. Figures 2A to 3A , Figures 9A to 9D and Figures 10A to 10D The heat dissipation devices 200, 900, 1000, and their radiators 214, 915, 1015 and / or as ... 214, 915, 1015 and / or as heat dissipation devices 200, 900, 1000, and 214, 915, 1015 and / or as heat dissipation devices 214, 915, 1015 and / or as heat dissipation devices 214, 915, 1015 and / or as heat dissipation devices 214, 915, 1015 and / or as heat diss Figures 2A to 3B and Figures 6 to 10D The heat transfer chambers are provided by the steam chambers 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), and 1004(2).

[0068] In this regard, Figure 11 This is a flowchart illustrating an exemplary assembly process 1100 for manufacturing a heat dissipation device, which includes a heat sink configured to thermally couple to an electronic device to dissipate heat, and wherein the heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and a circuit board and / or RF components of a wireless communication device, including but not limited to... Figures 2A to 3A , Figures 9A to 9D and Figures 10A to 10D The heat dissipation devices 200, 900, 1000, and their radiators 214, 915, 1015 and / or as ... 214, 915, 1015 and / or as heat dissipation devices 200, 900, 1000, and 214, 915, 1015 and / or as heat dissipation devices 214, 915, 1015 and / or as heat dissipation devices 214, 915, 1015 and / or as heat dissipation devices 214, 915, 1015 and / or as heat diss Figures 2A to 3B and Figures 6 to 10DThe heat transfer chamber is provided by the steam chambers 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), and 1004(2), and the heat dissipation device can be assembled during the assembly process. Figure 11 The assembly process 1100 will be in Figures 2A to 3B The discussion will take the heat dissipation device 200 as an example, but this is not limiting.

[0069] In this regard, the first step of the assembly process 1100 may be to provide a first heat transfer chamber 202, which in this example is a steam chamber 204. Figure 11 (Frame 1102 in the middle). The heat transfer chamber 202 includes a first surface 210 extending in a first direction (X-axis and / or Y-axis direction). Figure 11 The frame 1102 (1) in the middle, and the second surface 206 ( ) extending in the first direction (X-axis and / or Y-axis direction) and opposite to the first surface 210 in the second direction (Z-axis direction) orthogonal to the first direction (X-axis and / or Y-axis direction). Figure 11 The frame 1102 (2) in the middle, and the first internal cavity 220 between the first surface 210 and the second surface 206 in the second direction (Z-axis direction) Figure 11 The frame 1102 (3) in the middle and one or more first openings 226 extending through the first heat transfer chamber 202 in the second direction (Z-axis direction) Figure 11 In the frame 1102 (4)). Assembly process 1100 also includes coupling the first surface 210 of the first heat transfer chamber 202 to the heat sink 214 ( Figure 11 (Box 1104 in the middle).

[0070] Other manufacturing processes can also be used to assemble the heat dissipation device, which includes a heat sink configured to thermally couple to electronic equipment to dissipate heat, and wherein the heat dissipation device further includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and the circuit board and / or RF components of a wireless communication device, including but not limited to... Figures 2A to 3A , Figures 9A to 9D and Figures 10A to 10D The heat dissipation devices 200, 900, 1000, and their radiators 214, 915, 1015 and / or heat transfer chambers, such as Figures 2A to 3B and Figures 6 to 10D The steam chambers 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), and 1004(2) are included, and the heat dissipation device can be assembled during the assembly process.

[0071] In this regard, Figures 12A to 12CThis is a flowchart illustrating another exemplary assembly process 1200 for assembling a heat dissipation device, which includes a heat sink configured to thermally couple to an electronic device to dissipate heat, and wherein the heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and a circuit board and / or RF components of a wireless communication device, including but not limited to... Figures 2A to 3A , Figures 9A to 9D and Figures 10A to 10D The heat dissipation devices 200, 900, 1000, and their radiators 214, 915, 1015 and / or heat transfer chambers, such as Figures 2A to 3B and Figures 6 to 10D Steam chambers 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), and 1004(2) are included. Figures 13A to 13E It is based on Figures 12A to 12C The exemplary assembly stages 1300A to 1300E during the assembly process 1200 of the heat dissipation device. Figures 13A to 13E Assembly stages 1300A to 1300E are shown in the assembly process reference 1200. Figures 2A to 3C The heat dissipation device 200, and more specifically refer to Figures 6 to 7D The heat dissipation device is included, but it should be noted that another heat dissipation device can be manufactured using assembly process 1200, including but not limited to... Figures 9A to 9D and Figures 10A to 10D The heat dissipation devices 900, 1000, and their radiators 915, 1015 and / or heat transfer chambers, such as those shown in Figures 8 to 1015, are included. Figure 10D Steam chambers 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), and 1004(2) are included.

[0072] In this regard, such as Figure 13A As shown in assembly stage 1300A, the first exemplary step in assembly process 1200 is to provide a second bottom cover 602 having an inner chamber 610 and third openings 612(1) to 612(2) disposed in respective sides 614(1) to 614(2). Figure 12A (e.g., frame 1202). For example, the second bottom cover 602 can be made of a metallic material and formed by a metal molding process. Figure 13B As shown in manufacturing stage 1300B, the next exemplary step in assembly process 1200 is to provide a first top cover 600 having second openings 604(1) to 604(2) disposed in respective sides 606(1) to 606(2). Figure 12B(Frame 1204 in the middle). For example, the first top cover 600 may be made of a metallic material and formed by a metal molding process. Then, as... Figure 13C As shown in manufacturing stage 1300C, the next exemplary step in assembly process 1200 is to couple the bottom surface 212 of the heat sink 214 to the first top surface 210 of the first top cover 600. Figure 12B (See frame 1206 in the image). For example, the bottom surface 212 of the heat sink 214 may be welded to the first top surface 210 of the first top cover 600 to provide a good thermal connection with high thermal conductivity.

[0073] Then, as Figure 13D As shown in manufacturing stage 1300D, the next exemplary step in assembly process 1200 is to prepare to couple the first top cover 600 to the second bottom cover 602 to form the vapor chamber 204. Before doing so, a metal core 618 is inserted into the inner chamber 610 of the second bottom cover 602. Figure 12B (Frame 1208 in the middle). Liquid 1302 may also be disposed in the inner chamber 610 to fill the inner chamber 610, wherein the metal core 618 is immersed in liquid 1302. Then, as Figure 13E As shown in manufacturing stage 1300E, the next exemplary step in assembly process 1200 is to couple the first top cover 600 to the second bottom cover 602 to form a vapor chamber 204, which is coupled to the radiator 214 to assemble the heat dissipation device 200. Figure 12C (Box 1210 in the middle). Figure 13C As shown in manufacturing stage 1300C, radiator 214 was previously in Figure 12B The first top surface 210 of the first top cover 600 coupled to the steam chamber 204 in frame 1206. It should be noted that, as previously discussed, when the first top cover 600 is coupled to the second bottom cover 602, the corresponding second openings 604(1) to 604(4) and third openings 612(1) to 612(4) are aligned in the second vertical direction (Z-axis direction), thereby providing openings 226(1) to 226(4) in the steam chamber 204, for example as... Figure 2B and Figure 6 As shown. From Figure 13E The side view of the heat dissipation device 200 shows that the second opening 604 (1) in the first top cover 600 is aligned with the third opening 612 (1) in the second bottom cover 602, thereby forming an opening 226 (1) in the steam chamber 204.

[0074] Other types of open heat transfer chambers can be used in heat dissipation devices to facilitate direct airflow paths to electronic equipment, thereby improving heat dissipation. In this regard, Figure 14A and Figure 14BThese are, respectively, a side view and an exploded front perspective view of another exemplary heat dissipation device 1400, which is thermally coupled to a heat-generating device to dissipate heat generated by the heat-generating device. For example, Figure 14A and Figure 14B The heat dissipation device 1400 in the middle can be Figure 1 The electronic device 100 includes a plurality of IC chips 104, 104(1) to 104(4) mounted on a circuit board 102. Figure 14A and Figure 14B As shown, and discussed in more detail below, in this example, the heat dissipation device 1400 includes a heat transfer chamber 1402 in the form of a heat pipe 1404. The heat pipe may be a metal coil of metallic material, comprising an internal cavity or chamber containing a liquid configured to absorb heat through conduction and then convert the heat into vapor to improve heat transfer from a heat-generating device, such as electronic device 100. Figure 14A As shown, the second bottom surface 1406 of the heat pipe 1404 extending in the first horizontal direction (X-axis and Y-axis directions) is thermally coupled to the IC chip 104 in the electronic device 100, thereby efficiently conducting the heat generated by the IC chip 104 to the heat dissipation device 1400. Optional thermal pads 208 are coupled to the IC chips 104, 104(1) to 104(2), and the second bottom surface 1406 of the heat pipe 1404 is coupled to the thermal pads 208 to provide thermal coupling between the IC chips 104, 104(1) to 104(2) and the heat pipe 1404 in the heat dissipation device 1400. A first top surface 1410 of heat pipe 1404 (which also extends in a first horizontal direction (X-axis and / or Y-axis direction) and is opposite to a second bottom surface 1406 in a second vertical direction (Z-axis direction) orthogonal to the first horizontal direction (X-axis and / or Y-axis direction)) is coupled to a first bottom surface 1412 of heat sink 1414 to dissipate heat generated by IC chip 104, which is transferred from heat pipe 1404 to heat sink 1414. For example, the first bottom surface 1412 of heat sink 1414 may be connected (e.g., soldered) to the first top surface 1410 of heat pipe 1404.

[0075] To further illustrate and discuss exemplary details of the heat dissipation device 1400 having heat pipe 1404, the following are provided: Figures 15A to 15D . Figure 15A yes Figure 14A and Figure 14B A top view of the heat pipe 1404 coupled to the heat sink 1414 in the heat dissipation device 1400. Figure 15B yes Figure 14A and Figure 14B Top perspective view of heat pipe 1404 in heat dissipation device 1400. Figure 15C yes Figure 14A and Figure 14BBottom view of heat pipe 1404 coupled to heat sink 1414 in heat dissipation device 1400. Figure 15D yes Figure 14A and Figure 14B A top view of the heat pipe 1404 coupled to the heat sink 1414 in the heat dissipation device 1400. (See diagram) Figures 15A to 15D As shown, the heat pipe 1404 includes an internal cavity 1420 or internal chamber to improve heat transfer from the electronic device 100 to the heat sink 1414. The internal cavity 1420 is disposed within the heat pipe 1404 in a second vertical direction (Z-axis direction) between a second bottom surface 1406 and a second top surface 1410 of the vapor chamber 204. The internal cavity 1420 of the heat pipe 1404 includes a liquid configured to absorb heat from the bottom first surface 1406 of the heat pipe 1404 near the electronic device 100, causing the liquid in the internal cavity 1420 to evaporate into vapor and travel to the second top cooler surface 1410 of the vapor chamber near the heat sink 1414. In this example, as... Figures 15A to 15D As shown, heat pipe 1404 also includes a metal pad 1405 to provide a flatter coupling surface between heat pipe 1404 and electronic components or devices. Vapor releases heat to efficiently transfer heat to radiator 1414, then condenses back into liquid, returning by gravity to the internal cavity 1420 and fluidly contacting the bottom first surface 1406. This repeated process of liquid turning into vapor and then back into liquid within the internal cavity 1420 of heat pipe 1404 is an efficient mechanism for transferring heat generated by electronic device 100 and its IC chips 104, 104(1) to 104(2) to radiator 1414.

[0076] To further improve the heat dissipation of the heat dissipation device 1400, such as Figure 14A and Figure 14B As shown, a fan 1416 is included in the heat dissipation device 1400 and is configured to be adjacent to and / or coupled to the second top surface 1418 of the heat sink 1414. The fan 1416 can be controlled to blow air toward the heat sink 1414 when activated to increase airflow through the heat sink 1414, thereby improving heat dissipation. In an alternative operating mode, the fan 1416 can be configured or controlled to draw air toward the heat pipe 1404 and the heat sink 1414 when activated to improve heat dissipation, instead of blowing air toward the heat sink 1414 and reaching the electronic device 100 through the opening 1426. In this example, the heat sink 1414 includes a plurality of metal fins 1422, each metal fin extending parallel to each other in a first horizontal direction (Y-axis direction). Each metal fin 1422 is spaced apart from adjacent metal fins 1422 as follows: Figure 15DThe distance D1 shown forms a plurality of airflow channels 1424, which extend in a first horizontal direction (Y-axis direction) and a second vertical direction (Z-axis direction), leading to the first top surface 1410 of the heat pipe 1404 and to the fan 1416, as shown. Figures 14A to 14B , Figure 15A and Figure 15D As shown, the metal pad 1405 is adjacent to the top surface 1410 of the heat pipe 1404. In this way, air can enter the airflow channel 1424 of the heat sink 1414 adjacent to the metal fins 1422 for heat dissipation. Additionally, the fan 1416, fluidly coupled to the airflow channel 1424 of the heat sink 1414, can guide air into the airflow channel 1424 of the heat sink 1414 to increase airflow through the metal fins 1422, thereby improving heat dissipation.

[0077] like Figures 15A to 15D As shown, in order to improve the thermal coupling and heat transfer between the electronic device 100 and the heat sink 1414 by using a heat pipe 1404 in the heat dissipation device 1400, while reducing the interference of the heat pipe 1404 on the airflow path from the fan 1416 to the electronic device 100, the heat pipe 1404 includes coil sections 1425(1) and 1425(2) that are adjacent to each other and overlap each other in a first direction (X-axis and / or Y-axis direction). An opening 1426 is provided in the space between the adjacent coil sections 1425(1) and 1425(2). The opening 1426 passes through the heat pipe 1404 in a second vertical direction (Z-axis direction) and extends from the second bottom surface 1406 of the heat pipe 1404 to the first top surface 1410 of the heat pipe 1404, which is adjacent to and in contact with the first bottom surface 1412 of the heat sink 1414. In this example, the opening 1426 intersects at least partially with one or more airflow channels 1424 in the heat sink 1414 in the second vertical direction (Z-axis direction), such that the opening 1426 extends the airflow path at least partially downward from the intersecting airflow channels 1424 to the electronic device 100 in the second vertical direction (Z-axis direction) (see...). Figure 14A and Figure 14B This facilitates a more direct airflow path from the fan 1416 to the electronic equipment 100 through the opening 1426 in the steam chamber 204.

[0078] In this way, the heat pipe 1404 in the heat dissipation device 1400 can still be used to improve heat transfer and conduction to the heat sink 1414. However, the opening 1426 in the heat pipe 1404 also provides a more direct airflow path from the fan 1416 to the electronic device 100, blowing air onto the electronic device 100 and away from the heat pipe 1404, thereby improving heat dissipation. In an alternative operating mode, the fan 1416 can be configured or controlled to draw air towards the heat pipe 1404 and the heat sink 1414 when activated to improve heat dissipation, instead of blowing air towards the heat sink 1414 and through the opening 1426 to the electronic device 100.

[0079] Figure 15E This is a bottom view of a heat pipe 1404 coupled to another exemplary heat sink 1414, which may be included in... Figure 14A and Figure 14B Among the heat dissipation devices in 1400, such as... Figure 15E As shown, the heat sink 1414 in this example is similar to Figures 15A to 15D The heat sink 1414 is shown in the image. However, the heat sink 1414 has metal fins 1444, with openings 1442 between the fins, thus forming two non-coplanar bottom surfaces 1452(1) and 1452(2). For example... Figures 15A to 15D As shown, the second bottom surface 1452 (2) formed in the metal fin 1444 is recessed from the first bottom surface 1452 (1) formed in the metal fin 1444 in the shape of the heat pipe 1404. In this way, the first top surface 1410 of the heat pipe 1404 can be disposed on the second bottom surface 1452 (2) to provide improved thermal coupling between the heat pipe 1404 and the heat sink 1434. Figure 15F yes Figure 15E A top view of heat pipe 1404 coupled to heat sink 1444.

[0080] It should be noted that the terms “upper” and “top” as used herein are relative terms and do not imply a limitation or implication that an element referenced “top” must always be strictly oriented above an element referenced “bottom”, or vice versa. Similarly, the terms “lower” and “bottom” as used herein are relative terms and do not imply a limitation or implication that an element referenced “bottom” or “lower” must always be strictly oriented below an element referenced “top” or “upper”, or vice versa. Furthermore, it should be noted that the terms “above” and “below” as used herein are relative terms and do not imply a limitation or implication that an element referred to as “above” another referenced element must always be oriented relative to another referenced element, or an element referred to as “below” another referenced element must always be oriented relative to another referenced element.

[0081] As discussed herein, the term "adjacent" refers to an object being next to or adjacent to another object. Adjacent objects may not be directly physically coupled to each other. Objects may be directly adjacent to another object, meaning that such an object is directly next to or adjacent to another object, without any other object or layer situated between the directly adjacent objects. Objects may be indirectly or indirectly adjacent to another object, meaning that such objects are not directly next to or directly close to each other, but rather with an intermediate object or layer situated between the non-directly adjacent objects.

[0082] A heat dissipation device includes a heat sink configured to thermally couple to an electronic device to dissipate heat, and wherein the heat dissipation device further includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and a circuit board and / or RF components of a wireless communication device, including but not limited to... Figures 2A to 3A , Figure 13D and Figures 14A to 14B The heat dissipation devices 200 and 1400, and Figures 2A to 3B , Figures 6 to 10D , Figure 13E , Figures 14A to 15F The heat sinks and heat transfer chambers in the 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), 1004(2), and 1404, and the heat dissipation device can be used in, but is not limited to, Figures 11 to 12C The assembly process is carried out during the assembly process and, according to the aspects disclosed herein, can be set up or integrated into any processor-based device or wireless device. Examples, without limitation, include: set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, Global Positioning System (GPS) devices, mobile phones, cellular phones, smartphones, Session Initiation Protocol (SIP) phones, tablet devices, tablet phones, servers, computers, portable computers, mobile computing devices, wearable computing devices (e.g., smartwatches, health or fitness trackers, glasses, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, and avionics systems.

[0083] In this regard, Figure 16An exemplary wireless communication device 1600 is illustrated, comprising a radio frequency (RF) component formed by one or more ICs 1602. The wireless communication device 1600 may include heat dissipation devices 1603(1), 1603(2), each including a heat sink configured to be thermally coupled to a circuit board and / or RF component or IC 1602 of the wireless communication device 1600 to dissipate heat. The heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and the circuit board and / or RF component of the wireless communication device, including but not limited to... Figures 2A to 3A , Figure 13D and Figures 14A to 14B The heat dissipation devices 200 and 1400, and Figures 2A to 3B , Figures 6 to 10D , Figure 13E , Figures 14A to 15F The heat sink and heat transfer chambers 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), 1004(2), 1404, are disclosed in any of the above-described devices. As an example, the wireless communication device 1600 may include or be incorporated in any of the aforementioned devices. Figure 16 As shown, the wireless communication device 1600 includes a transceiver 1604 and a data processor 1606. The data processor 1606 may include memory for storing data and program code. The transceiver 1604 includes a transmitter 1608 and a receiver 1610 supporting bidirectional communication. Generally, the wireless communication device 1600 may include any number of transmitters 1608 and / or receivers 1610 for any number of communication systems and frequency bands. All or part of the transceiver 1604 may be implemented on one or more analog ICs, RF ICs (RFICs), mixed-signal ICs, etc.

[0084] The transmitter 1608 or receiver 1610 can be implemented using either a superheterodyne architecture or a direct conversion architecture. In a superheterodyne architecture, the signal undergoes multi-stage frequency conversion between RF and baseband. For example, in the receiver 1610, the signal is converted from RF to intermediate frequency (IF) in one stage, and then from IF to baseband in another stage. In a direct conversion architecture, the signal is converted between RF and baseband in a single stage. Superheterodyne and direct conversion architectures can use different circuit blocks and / or have different requirements. Figure 16 In the wireless communication device 1600, the transmitter 1608 and receiver 1610 are implemented using a direct frequency conversion architecture.

[0085] In the transmission path, data processor 1606 processes the data to be transmitted and provides I and Q analog output signals to transmitter 1608. In the exemplary wireless communication device 1600, data processor 1606 includes digital-to-analog converters (DACs) 1612(1) and 1612(2) to convert digital signals generated by data processor 1606 into I and Q analog output signals (e.g., I and Q output currents) for further processing.

[0086] Within transmitter 1608, low-pass filters 1614(1) and 1614(2) filter the I and Q analog output signals, respectively, to remove unwanted signals caused by the previous digital-to-analog conversion. Amplifiers (AMPs) 1616(1) and 1616(2) amplify the signals from low-pass filters 1614(1) and 1614(2), respectively, and provide I and Q baseband signals. Upconverter 1618 upconverts the I and Q baseband signals using the I and Q TX LO signals from transmit (TX) local oscillator (LO) signal generator 1622 via mixers 1620(1) and 1620(2) to provide upconverted signal 1624. Filter 1626 filters upconverted signal 1624 to remove unwanted signals caused by upconversion and noise in the receive band. The power amplifier (PA) 1628 amplifies the up-converted signal 1624 from the filter 1626 to obtain the desired output power level and provide a transmit RF signal. The transmit RF signal is routed through a duplexer or switch 1630 and transmitted via antenna 1632.

[0087] In the receiving path, antenna 1632 receives signals transmitted by the base station and provides the received RF signal, which is routed through duplexer or switch 1630 and provided to low-noise amplifier (LNA) 1634. Duplexer or switch 1630 is designed to operate using a specific receive (RX) to TX duplexer frequency separation, such that the RX signal is isolated from the TX signal. The received RF signal is amplified by LNA 1634 and filtered by filter 1636 to obtain the desired RF input signal. Downconversion mixers 1638(1) and 1638(2) mix the output of filter 1636 with the I and Q RX LO signals (i.e., LO_I and LO_Q) from RX LO signal generator 1640 to generate I and Q baseband signals. The I and Q baseband signals are amplified by AMPs 1642(1) and 1642(2) and further filtered by low-pass filters 1644(1) and 1644(2) to obtain I and Q analog input signals, which are provided to data processor 1606. In this example, data processor 1606 includes analog-to-digital converters (ADCs) 1646(1) and 1646(2) to convert the analog input signals into digital signals to be further processed by data processor 1606.

[0088] exist Figure 16 In the wireless communication device 1600, a TX LO signal generator 1622 generates I and Q TXLO signals for up-conversion, while an RX LO signal generator 1640 generates I and Q RX LO signals for down-conversion. Each LO signal is a periodic signal with a specific base frequency. A TX phase-locked loop (PLL) circuit 1648 receives timing information from a data processor 1606 and generates control signals for adjusting the frequency and / or phase of the TX LO signals from the TX LO signal generator 1622. Similarly, an RX PLL circuit 1650 receives timing information from a data processor 1606 and generates control signals for adjusting the frequency and / or phase of the RX LO signals from the RX LO signal generator 1640.

[0089] Regarding exemplary processor-based devices, Figure 17 An example of a processor-based system 1700 is illustrated. The processor-based system 1700 may include one or more heat dissipation devices 1701, 1701(1) to 1701(8), each including a heat sink configured to thermally couple to a circuit board and / or RF component or IC of a wireless communication device to dissipate heat. The heat dissipation device also includes a heat transfer chamber having one or more openings to provide a direct airflow path between a fan and the circuit board and / or RF component of the wireless communication device, including but not limited to... Figures 2A to 3A , Figure 13E and Figures 14A to 14B The heat dissipation devices 200 and 1400, and Figures 2A to 3B , Figures 6 to 10D , Figure 13E , Figures 14A to 15F The heat sinks and heat transfer chambers of the 204, 804A, 804B, 804C, 804D, 804E, 904(1), 904(2), 1004(1), 1004(2), and 1404 are disclosed in any way.

[0090] In this example, the processor-based system 1700 may be formed as IC 1704 in IC package 1702 and as a system-on-a-chip (SoC) 1706. In this example, the processor-based system 1700 may be provided as or include the system-on-a-chip (SoC) 1706. The processor-based system 1700 includes a CPU 1708, which includes one or more processors 1710, which may also be referred to as a CPU core or processor core. The CPU 1708 may include a heat dissipation device 1701 (1) to dissipate heat. The CPU 1708 may have a cache memory 1712 coupled to the CPU 1708 for fast access to temporarily stored data. The CPU 1708 is coupled to a system bus 1714 and may be coupled to master and slave devices included in the processor-based system 1700. As is well known, the CPU 1708 communicates with these other devices by exchanging address, control, and data information via the system bus 1714. For example, CPU 1708 can communicate bus transaction requests to memory controller 1716, which is an example of a slave device. Although in Figure 17 Not illustrated, but multiple system buses 1714 may be provided, each of which constitutes a different architecture.

[0091] Other master and slave devices can be connected to system bus 1714. For example... Figure 17As illustrated, by way of example, these devices may include a memory system 1720, one or more input devices 1722, one or more output devices 1724, one or more network interface devices 1726, and one or more display controllers 1728, the memory system including a memory controller 1716 and a memory array 1718. The memory system 1720 may include a heat dissipation device 1701 (2) to dissipate heat. The network interface device 1726 may include a heat dissipation device 1701 (3) to dissipate heat. Each of the memory system 1720, one or more input devices 1722, one or more output devices 1724, one or more network interface devices 1726, and one or more display controllers 1728 may be housed in the same or different circuit packages. Input devices 1722 and / or output devices 1724 may include heat dissipation devices 1701 (4), 1701 (5) to dissipate heat. Input device 1722 may include any type of input device, including but not limited to input keys, switches, voice processors, etc. Output device 1724 may include any type of output device, including but not limited to audio, video, and other visual indicators. Network interface device 1726 may be any device configured to allow the exchange of data to and from network 1730. Network 1730 may be any type of network, including but not limited to wired or wireless networks, private or public networks, local area networks (LANs), wireless local area networks (WLANs), wide area networks (WANs), and Bluetooth. ™ Networks and the Internet. The network interface device 1726 can be configured to support any type of communication protocol desired.

[0092] CPU 1708 may also be configured to access display controller 1728 via system bus 1714 to control information transmitted to one or more displays 1732. Display 1732 may include heat dissipation device 1701 (6) to dissipate heat. Display controller 1728 transmits information to be displayed to display 1732 via one or more video processors 1734, which process the information to be displayed into a format suitable for display 1732. As an example, display controller 1728 and video processor 1734 may include heat dissipation devices 1701 (7), 1701 (8) to dissipate heat and are disposed in the same or different circuit packages, and in the same or different circuit packages containing CPU 1708. Display 1732 may include any type of display, including but not limited to cathode ray tube (CRT), liquid crystal display (LCD), plasma display, light-emitting diode (LED) display, etc.

[0093] Those skilled in the art will further understand that the various exemplary logic blocks, modules, circuits, and algorithms described in connection with the aspects disclosed herein can be implemented as electronic hardware, stored in memory or another computer-readable medium and executed by a processor or other processing device, or a combination of both. The memory disclosed herein can be of any type and size and can be configured to store any type of information desired. To clearly illustrate this interchangeability, the functionality of the various exemplary components, blocks, modules, circuits, and steps has been generally described above. How such functionality is implemented depends on the specific application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such specific implementation decisions should not be construed as departing from the scope of this disclosure.

[0094] The various exemplary logic blocks, modules, and circuits described in conjunction with the aspects disclosed herein may be implemented or executed using a processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic unit, discrete hardware component, or any combination thereof, designed to perform the functions described herein. The processor may be a microprocessor, but in alternative embodiments, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors cooperating with a DSP core, or any other such configuration).

[0095] The aspects disclosed herein may be embodied in hardware and instructions stored in the hardware, and may reside in, for example, random access memory (RAM), flash memory, read-only memory (ROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of computer-readable medium known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Alternatively, the storage medium may be integral with the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a remote station. Alternatively, the processor and storage medium may reside as discrete components in a remote station, base station, or server.

[0096] It should also be noted that the operational steps described in any of the exemplary aspects of this document are described for the purpose of providing examples and discussion. The described operations may be performed in many different orders other than the order illustrated. Furthermore, the operations described in a single operational step may actually be performed in multiple different steps. In addition, one or more operational steps discussed in the exemplary aspects may be combined. It should be understood that, as will be apparent to those skilled in the art, many different modifications may be made to the operational steps illustrated in the flowcharts. Those skilled in the art will also understand that any of a variety of different techniques and arts can be used to represent information and signals. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be mentioned throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or optical particles, or any combination thereof.

[0097] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein can be applied to other variations. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0098] Specific implementation examples are described in the following numbered clauses: 1. A heat dissipation device, the heat dissipation device comprising: A first heat transfer chamber, comprising: A first surface extending in a first direction; A second surface that extends in the first direction and is opposite to the first surface in a second direction orthogonal to the first direction; A first internal cavity between the first surface and the second surface in the second direction; and One or more first openings extending through the first heat transfer chamber in the second direction; and A heat sink coupled to the first surface of the first heat transfer chamber. 2. The heat dissipation device according to Clause 1, wherein: The heat sink includes multiple metal fins, each extending parallel to each other in the first direction. Each of the plurality of metal fins is spaced apart from its adjacent metal fins in a third direction orthogonal to the first and second directions, so as to form a plurality of airflow channels extending in the second direction in the heat sink. 3. The heat dissipation device according to Clause 2, wherein the one or more first openings in the first heat transfer chamber intersect at least partially with one or more of the plurality of airflow channels in the second direction. 4. The heat dissipation equipment as described in Clause 2 or 3, in: Each of the plurality of metal fins has a third surface and a fourth surface opposite to the third surface in the second direction; and Each third surface of the plurality of metal fins is coupled to the first surface of the first heat transfer chamber; and The heat dissipation device also includes: A fan adjacent to the fourth surface of the plurality of metal fins. 5. The heat dissipation device according to any one of clauses 1 to 4, wherein the heat dissipation device further comprises: The second heat transfer chamber includes: The third surface extending in the first direction; A fourth surface extending in the first direction and opposite to the third surface in a second direction orthogonal to the first direction; A second internal cavity between the third surface and the fourth surface in the second direction; and One or more second openings extending through the second heat transfer chamber in the second direction; and The heat sink is coupled to the third surface of the second heat transfer chamber. 6. The heat dissipation device according to Clause 5, wherein: The heat sink includes: The fifth surface extending in the first direction; and A sixth surface extending in the second direction, wherein the sixth surface is not coplanar with the fifth surface in the second direction; The fifth surface of the heat sink is coupled to the first surface of the first heat transfer chamber; and The sixth surface of the radiator is coupled to the third surface of the second heat transfer chamber. 7. The heat dissipation device according to any one of clauses 1 to 6, wherein: The first heat transfer chamber includes: A first steam chamber, the first steam chamber comprising: A first cover, the first cover including a first surface having one or more second openings; and A second cover, the second cover including a second surface having one or more third openings; The first cover is coupled to the second cover to form the first internal cavity; and Each of the one or more first openings includes a second opening among the one or more second openings that is aligned with a third opening among the one or more third openings in the second direction. 8. The heat dissipation device according to Clause 7, wherein the first steam chamber further comprises a first metal core in the first internal cavity. 9. The heat dissipation device according to clause 7 or 8, wherein: The heat sink includes multiple metal fins, each extending parallel to each other in the first direction. Each of the plurality of metal fins is spaced apart from adjacent metal fins in a third direction orthogonal to the first and second directions, thereby forming a plurality of airflow channels extending in the second direction in the heat sink; and The one or more first openings in the first steam chamber intersect at least partially with one or more of the plurality of airflow channels in the second direction. 10. The heat dissipation device according to any one of clauses 7 to 9, wherein the heat dissipation device further comprises: A second steam chamber, the second steam chamber comprising: A third cover, the third cover including a third surface extending in the first direction, the third surface including one or more fourth openings; A fourth cover, the fourth cover including a fourth surface extending in the first direction and opposite the third surface in a second direction orthogonal to the first direction, the fourth surface including one or more fifth openings; The third cover, coupled to the fourth cover, forms a second internal cavity in the second direction between the third surface and the fourth surface; and One or more sixth openings extending through the second steam chamber in the second direction. The one or more sixth openings extend from the first surface to the second surface in the second direction, and each includes a fourth opening of the one or more fourth openings aligned in the second direction with a fifth opening of the one or more fifth openings; and The heat sink includes: The fifth surface; and A sixth surface that is not coplanar with the fifth surface in the second direction; in: The first surface of the first steam chamber is coupled to the fifth surface of the radiator; and The third surface of the second vapor chamber is coupled to the sixth surface of the radiator. 11. The heat dissipation device according to Clause 10, wherein the radiator comprises: The fifth surface of the heat sink includes a seventh surface of each of a plurality of first metal fins that are coplanar with each other in the second direction; and The sixth surface of the heat sink includes an eighth surface of each of a plurality of second metal fins that are coplanar with each other in the second direction and not coplanar with the fifth surface in the second direction. 12. The heat dissipation device according to any one of clauses 7 to 11, wherein: The first heat transfer chamber is located around the intersection of the couplings of the first cover and the second cover; and At least one of the one or more first openings extends into the periphery. 13. The heat dissipation device according to Clause 12, wherein each of the one or more first openings extends to the periphery. 14. The heat dissipation device according to any one of clauses 7 to 11, wherein at least one of the one or more first openings is completely disposed in the first cover and the second cover. 15. The heat dissipation device according to Clause 14, wherein each of the one or more first openings is completely disposed within the first cover and the second cover. 16. The heat dissipation device according to any one of Clauses 7 to 15, wherein at least one of the one or more first openings is rectangular. 17. The heat dissipation device according to any one of Clauses 7 to 15, wherein at least one of the one or more first openings is trapezoidal. 18. The heat dissipation device according to any one of Clauses 7 to 15, wherein at least one of the one or more first openings is semi-circular. 19. The heat dissipation device according to any one of clauses 1 to 6, wherein the first heat transfer chamber includes a heat pipe, the heat pipe including the first surface, the second surface and the first internal cavity. 20. The heat dissipation device according to Clause 19, wherein: The heat pipe includes a metal coil, and the metal coil includes a first surface, a second surface, and a first internal cavity; The metal coil includes multiple coil segments, each coil segment being adjacent to another coil segment among the multiple coil segments in a first direction; and The one or more first openings include one or more first openings in the second direction between each of the plurality of coil segments and its adjacent coil segment in the plurality of coil segments. 21. The heat dissipation device according to Clause 20, wherein: The heat sink includes multiple metal fins, each extending parallel to each other in the first direction. Each of the plurality of metal fins is spaced apart from adjacent metal fins in a third direction orthogonal to the first and second directions, thereby forming a plurality of airflow channels extending in the second direction in the heat sink; and The one or more first openings in the heat pipe intersect at least partially with one or more of the plurality of airflow channels in the second direction. 22. The heat dissipation device according to clause 20 or 21, wherein the heat pipe further comprises a metal pad coupled to the metal coil and adjacent to the second surface of the metal coil. 23. The heat dissipation device according to any one of clauses 20 to 22, wherein: The heat sink includes: The third surface; and A fourth surface that is not coplanar with the third surface in the second direction; and The first surface of the metal coil is coupled to the third surface of the heat sink. 24. The heat dissipation device according to Clause 23, wherein: The third surface of the heat sink includes a fifth surface of each of a plurality of first metal fins that are coplanar with each other in the second direction; and The fourth surface of the heat sink includes a sixth surface of each of a plurality of second metal fins that are coplanar with each other in the second direction and not coplanar with the third surface in the second direction. 25. A method for assembling a heat dissipation device, the method comprising: A first heat transfer chamber is provided, the first heat transfer chamber comprising: A first surface extending in a first direction; A second surface that extends in the first direction and is opposite to the first surface in a second direction orthogonal to the first direction; A first internal cavity between the first surface and the second surface in the second direction; and One or more first openings extending through the first heat transfer chamber in the second direction; and The first surface of the first heat transfer chamber is coupled to the heat sink. 26. The method according to clause 25, wherein the heat sink includes a third surface and a fourth surface opposite to the third surface in the second direction, and The method includes coupling the first surface of the first heat transfer chamber to the third surface of the heat sink; and The method also includes coupling a fan to the vicinity of the fourth surface of the heat sink. 27. The method according to clause 25 or 26, further comprising: A second heat transfer chamber is provided, the second heat transfer chamber comprising: The third surface extending in the first direction; A fourth surface extending in the first direction and opposite to the third surface in a second direction orthogonal to the first direction; A second internal cavity between the third surface and the fourth surface in the second direction; and One or more second openings extending through the second heat transfer chamber in the second direction; and The heat sink is coupled to the third surface of the second heat transfer chamber. 28. The method according to any one of clauses 25 to 27, wherein providing the first heat transfer chamber comprises providing a first steam chamber, including: A first cover is provided, the first cover including a first surface having one or more second openings; and A second cover is provided, the second cover including the first internal cavity and including a second surface having one or more third openings; The first cover is coupled to the second cover to form the first internal cavity, and each of the one or more second openings is aligned with the third opening of the one or more third openings in the second direction. 29. The method according to Clause 28, the method further comprising inserting a first metal core into the first internal cavity prior to coupling the first cover to the second cover. 30. The method according to any one of Clauses 25 to 27, wherein providing the first heat transfer chamber comprises providing a heat pipe, the heat pipe comprising the first surface, the second surface, and the first internal cavity.

Claims

1. A heat dissipation device, the heat dissipation device comprising: A first heat transfer chamber, comprising: A first surface extending in a first direction; A second surface that extends in the first direction and is opposite to the first surface in a second direction orthogonal to the first direction; A first internal cavity between the first surface and the second surface in the second direction; and One or more first openings extending through the first heat transfer chamber in the second direction; and A heat sink coupled to the first surface of the first heat transfer chamber.

2. The heat dissipation device according to claim 1, wherein: The heat sink includes a plurality of metal fins, each of which extends parallel to each other in the first direction. Each of the plurality of metal fins is spaced apart from its adjacent metal fins in a third direction orthogonal to the first and second directions, so as to form a plurality of airflow channels extending in the second direction in the heat sink.

3. The heat dissipation device according to claim 2, wherein the one or more first openings in the first heat transfer chamber intersect at least partially with one or more of the plurality of airflow channels in the second direction.

4. The heat dissipation device according to claim 2, in: Each of the plurality of metal fins has a third surface and a fourth surface opposite to the third surface in the second direction; and Each third surface of the plurality of metal fins is coupled to the first surface of the first heat transfer chamber; and The heat dissipation device also includes: A fan adjacent to the fourth surface of the plurality of metal fins.

5. The heat dissipation device according to claim 1, further comprising: The second heat transfer chamber includes: The third surface extending in the first direction; A fourth surface extending in the first direction and opposite to the third surface in a second direction orthogonal to the first direction; A second internal cavity between the third surface and the fourth surface in the second direction; and One or more second openings extending through the second heat transfer chamber in the second direction; and The heat sink coupled to the third surface of the second heat transfer chamber.

6. The heat dissipation device according to claim 5, wherein: The heat sink includes: The fifth surface extending in the first direction; and A sixth surface extending in the second direction, wherein the sixth surface is not coplanar with the fifth surface in the second direction; The fifth surface of the heat sink is coupled to the first surface of the first heat transfer chamber; and The sixth surface of the radiator is coupled to the third surface of the second heat transfer chamber.

7. The heat dissipation device according to claim 1, wherein: The first heat transfer chamber includes: A first steam chamber, the first steam chamber comprising: A first cover, the first cover including a first surface having one or more second openings; and A second cover, the second cover including a second surface having one or more third openings; The first cover is coupled to the second cover to form the first internal cavity; and Each of the one or more first openings includes a second opening among the one or more second openings that is aligned with a third opening among the one or more third openings in the second direction.

8. The heat dissipation device according to claim 7, wherein the first steam chamber further includes a first metal core in the first internal cavity.

9. The heat dissipation device according to claim 7, wherein: The heat sink includes a plurality of metal fins, each of which extends parallel to each other in the first direction. Each of the plurality of metal fins is spaced apart from adjacent metal fins in a third direction orthogonal to the first and second directions, so as to form a plurality of airflow channels extending in the second direction in the heat sink. and The one or more first openings in the first steam chamber intersect at least partially with one or more of the plurality of airflow channels in the second direction.

10. The heat dissipation device according to claim 7, further comprising: A second steam chamber, the second steam chamber comprising: A third cover, the third cover including a third surface extending in the first direction, the third surface including one or more fourth openings; A fourth cover, the fourth cover including a fourth surface extending in the first direction and opposite the third surface in a second direction orthogonal to the first direction, the fourth surface including one or more fifth openings; The third cover, coupled to the fourth cover, forms a second internal cavity between the third surface and the fourth surface in the second direction; and One or more sixth openings extending through the second steam chamber in the second direction. The one or more sixth openings extend from the first surface to the second surface in the second direction, and each includes a fourth opening of the one or more fourth openings aligned in the second direction with a fifth opening of the one or more fifth openings; and The heat sink includes: The fifth surface; and A sixth surface that is not coplanar with the fifth surface in the second direction; in: The first surface of the first steam chamber is coupled to the fifth surface of the radiator; and The third surface of the second vapor chamber is coupled to the sixth surface of the radiator.

11. The heat dissipation device according to claim 10, wherein the heat sink comprises: The fifth surface of the heat sink includes a seventh surface of each of a plurality of first metal fins that are coplanar with each other in the second direction; and The sixth surface of the heat sink includes an eighth surface of each of a plurality of second metal fins that are coplanar with each other in the second direction and not coplanar with the fifth surface in the second direction.

12. The heat dissipation device according to claim 7, wherein: The first heat transfer chamber is located around the intersection of the couplings of the first cover and the second cover; and At least one of the one or more first openings extends into the periphery.

13. The heat dissipation device of claim 12, wherein each of the one or more first openings extends to the periphery.

14. The heat dissipation device of claim 7, wherein at least one of the one or more first openings is completely disposed in the first cover and the second cover.

15. The heat dissipation device of claim 14, wherein each of the one or more first openings is completely disposed within the first cover and the second cover.

16. The heat dissipation device of claim 7, wherein at least one of the one or more first openings is rectangular.

17. The heat dissipation device according to claim 7, wherein at least one of the one or more first openings is trapezoidal.

18. The heat dissipation device according to claim 7, wherein at least one of the one or more first openings is semi-circular.

19. The heat dissipation device according to claim 1, wherein the first heat transfer chamber includes a heat pipe, the heat pipe including the first surface, the second surface and the first internal cavity.

20. The heat dissipation device according to claim 19, wherein: The heat pipe includes a metal coil, and the metal coil includes a first surface, a second surface, and a first internal cavity; The metal coil includes multiple coil segments, each coil segment being adjacent to another coil segment among the multiple coil segments in a first direction; and The one or more first openings include one or more first openings in the second direction between each of the plurality of coil segments and its adjacent coil segment in the plurality of coil segments.

21. The heat dissipation device according to claim 20, wherein: The heat sink includes a plurality of metal fins, each of which extends parallel to each other in the first direction. Each of the plurality of metal fins is spaced apart from adjacent metal fins in a third direction orthogonal to the first and second directions, so as to form a plurality of airflow channels extending in the second direction in the heat sink. and The one or more first openings in the heat pipe intersect at least partially with one or more of the plurality of airflow channels in the second direction.

22. The heat dissipation device of claim 20, wherein the heat pipe further comprises a metal pad coupled to the metal coil and adjacent to the second surface of the metal coil.

23. The heat dissipation device according to claim 20, wherein: The heat sink includes: The third surface; and A fourth surface that is not coplanar with the third surface in the second direction; and The first surface of the metal coil is coupled to the third surface of the heat sink.

24. The heat dissipation device according to claim 23, wherein: The third surface of the heat sink includes a fifth surface of each of a plurality of first metal fins that are coplanar with each other in the second direction; and The fourth surface of the heat sink includes a sixth surface of each of a plurality of second metal fins that are coplanar with each other in the second direction and not coplanar with the third surface in the second direction.

25. A method for assembling a heat dissipation device, the method comprising: A first heat transfer chamber is provided, the first heat transfer chamber comprising: A first surface extending in a first direction; A second surface that extends in the first direction and is opposite to the first surface in a second direction orthogonal to the first direction; A first internal cavity between the first surface and the second surface in the second direction; and One or more first openings extending through the first heat transfer chamber in the second direction; and The first surface of the first heat transfer chamber is coupled to the heat sink.

26. The method of claim 25, wherein the heat sink comprises a third surface and a fourth surface opposite to the third surface in the second direction, and The method includes coupling the first surface of the first heat transfer chamber to the third surface of the heat sink; and The method also includes coupling a fan to the vicinity of the fourth surface of the heat sink.

27. The method of claim 25, further comprising: A second heat transfer chamber is provided, the second heat transfer chamber comprising: The third surface extending in the first direction; A fourth surface extending in the first direction and opposite to the third surface in a second direction orthogonal to the first direction; A second internal cavity between the third surface and the fourth surface in the second direction; and One or more second openings extending through the second heat transfer chamber in the second direction; and The heat sink is coupled to the third surface of the second heat transfer chamber.

28. The method of claim 25, wherein providing the first heat transfer chamber comprises providing a first steam chamber, the method comprising: A first cover is provided, the first cover including a first surface having one or more second openings; as well as A second cover is provided, the second cover including the first internal cavity and including a second surface having one or more third openings; The first cover is coupled to the second cover to form the first internal cavity, and each of the one or more second openings is aligned with the third opening of the one or more third openings in the second direction.

29. The method of claim 28, further comprising inserting a first metal core into the first internal cavity before coupling the first cover to the second cover.

30. The method of claim 25, wherein providing the first heat transfer chamber comprises providing a heat pipe, the heat pipe comprising the first surface, the second surface, and the first internal cavity.

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