Mapping device
By configuring an imager in the mapping device to avoid the influence of reflected light from the inner wall surface of the container, and by utilizing a combination of multiple cameras and a decision-maker, the problem of incorrect determination of the substrate containment status is solved, achieving more reliable and detailed determination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SINFONIA TECHNOLOGY CO LTD
- Filing Date
- 2024-11-13
- Publication Date
- 2026-06-19
AI Technical Summary
In existing mapping equipment, the strong reflected light from the inner wall surface of the container is difficult to distinguish from the reflected light from the substrate, resulting in a high risk of incorrect determination of the substrate's containment status.
By configuring the imager so that its imaging area intersects with the non-opposite surface, the imaging of the opposite surface is avoided as a background. Multiple cameras are used to image different areas of the substrate respectively, and the information of the non-opposite surface is used by the decision-maker to make a determination.
It effectively suppresses erroneous determination of substrate occupancy status, improves the reliability and detail of determination, and is particularly effective in the configuration of multiple detection target points.
Smart Images

Figure CN122250211A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a mapping device. Background Technology
[0002] Patent Document 1 discloses a loading port (mapping device) equipped with a mapping sensor (detection unit). The detection unit is configured to detect the loading state of multiple semiconductor wafers (substrates) arranged vertically in a container with an opening on one side surface. More specifically, the detection unit includes a light-emitting unit and an imaging unit arranged close to the opening. Light emitted from the light-emitting unit and reflected by the substrate is detected by the imaging unit. Thus, an image for determining the loading state of each substrate is acquired.
[0003] In this situation, if the reflected light from the container is strong and detected by the imaging unit, it may be difficult to distinguish this reflected light from the light reflected by the substrate, potentially leading to incorrect determinations about the substrate's containment status. In particular, reflected light from the inner wall surface of the container (hereinafter referred to as the opposing surface), located on the opposite side of the container's center at the opening, is a major cause of false detection. Therefore, the detection of this reflected light is suppressed by tilting the imaging axis of the imaging unit towards the opposite side of the light-emitting unit's optical axis.
[0004] Existing technical documents
[0005] Patent documents
[0006] Patent Document 1: Japanese Patent No. 7346839 Summary of the Invention
[0007] The problem the invention aims to solve
[0008] Even if the above configuration is applied to the detection unit, if strongly reflected light from the opposing surface is directed towards the imaging unit, the strongly reflected light will still be detected by the imaging unit. Therefore, there is still a risk of incorrectly determining the substrate containment state. However, applying anti-reflective treatment to the opposing surfaces of all the already assigned containers is impractical.
[0009] This disclosure aims to reliably suppress erroneous determinations regarding the containment state of the substrate through simple means.
[0010] Problem Solving Methods
[0011] According to a first invention, a mapping device for detecting the containment state of a substrate contained in a container having an opening on its side surface includes: a light emitter configured to emit light at least toward the interior of the container; and an imager configured to sense reflected light emitted from the light emitter and reflected at least by the substrate toward the opening, and to image an imaging region including predetermined detection target points pre-set to detect the substrate, wherein the imager is arranged such that when the imaging region is imaged, an imaginary straight line passing through a predetermined light receiving point and the detection target points intersects a non-opposing surface, the predetermined light receiving point being pre-determined by a light receiver of the imager configured to receive the reflected light, and the non-opposing surface being a surface on the inner wall surface of the container that is different from an opposing surface facing the opening.
[0012] By utilizing this arrangement of the imager, the opposing surface can be minimized from being imaged as background in and around the detection target point. Therefore, the influence of reflected light from the opposing surface can be suppressed as much as possible. Furthermore, compared to reflected light from the opposing surface, reflected light emitted from the light emitter and reflected by the non-opposing surface is less likely to directly reach the imager. Therefore, erroneous determinations regarding the substrate's containment state at the detection target point can be minimized. Thus, erroneous determinations regarding the substrate's containment state can be suppressed more reliably through simple means.
[0013] According to the second invention, the mapping device of the first invention further includes: a determiner configured to determine the accommodating state of a substrate by using determination information included in imaging information, the imaging information being information obtained by imaging an imaging region using an imager, wherein the determiner uses information containing non-opposite surfaces as determination information, the information containing non-opposite surfaces excluding information about regions related to opposing surfaces in the imaging region, but including information about regions related to both non-opposite surfaces in the imaging region and detection target points.
[0014] According to this disclosure, information about the region in the imaging region that is imaged using the opposing surface as a background can be excluded from the determination target performed by the determiner. Therefore, erroneous determinations about the substrate's containment state can be effectively suppressed.
[0015] According to the third invention, in the mapping device of the first or second invention, the imager images a region including a plurality of detection target points associated with a substrate.
[0016] In configurations where multiple detection target points on a specific substrate need to be determined, even a single incorrect determination can lead to incorrect determinations for all substrates. Therefore, the present disclosure, which can more reliably suppress incorrect determinations, is particularly effective in such configurations.
[0017] According to the fourth invention, in the mapping device of the third invention, the imager includes: a first camera configured to image a first imaging region including two or more detection target points from a plurality of detection target points; and a second camera disposed separately from the first camera and configured to image a second imaging region to detect the thickness of a substrate, the second imaging region including detection target points from a plurality of detection target points that are different from the two or more detection target points.
[0018] According to this disclosure, the so-called cross-state can be determined by at least a first camera (see details of the embodiment). Furthermore, the so-called dual state can be determined by a second camera (see details of the embodiment). Therefore, the substrate's containment state can be determined in more detail.
[0019] According to the fifth invention, in the mapping apparatus of the first or second invention, the imager is configured to image at least the end surface of the substrate, wherein the non-opposite surface is a side surface different from the opposite surface.
[0020] Depending on the substrate material, light can be irradiated toward the substrate from either above or below it. However, generally, in the light reflected from the substrate, the light reflected from the end surfaces is stronger than the light reflected from parts other than the end surfaces. Therefore, to more reliably detect reflected light from the substrate, it is preferable to configure the imager to image at least the end surfaces of the substrate, as described in this disclosure. In this case, the side surfaces of the inner wall surface of the container can be imaged by the imager. Reflected light reflected from a side surface different from the opposing surface and traveling directly toward the imager is significantly weaker than reflected light traveling directly from the opposing surface to the imager. This can effectively suppress erroneous determinations about the presence or absence of the substrate at the detection target point. Attached Figure Description
[0021] Figure 1 This is a schematic plan view of an EFEM equipped with a loading port according to this embodiment and its surrounding environment.
[0022] Figure 2 This is the right-hand view of the loading port.
[0023] Figure 3 It is a diagram that schematically shows the positional relationship between the substrate and the camera.
[0024] Figure 4 (a) and (b) are diagrams illustrating the operation of the loading port.
[0025] Figure 5 (a) and (b) are diagrams illustrating the operation of the loading port.
[0026] Figure 6 This is a diagram showing the imaging area captured by the camera.
[0027] Figure 7 This is a flowchart illustrating the overall mapping process.
[0028] Figure 8 This is a flowchart illustrating the determination process for each substrate.
[0029] Figure 9 (a) to (d) are diagrams explaining the determination of the substrate's containment state.
[0030] Figure 10 (a) to (f) are diagrams explaining the determination of the substrate's containment state in the variant. Detailed Implementation
[0031] Embodiments of this disclosure will be described. For ease of description, Figure 1 The directions shown are defined as front-back and left-right. More specifically, the orientation of EFEM 1 (described later) and processing device 6 (described later) is defined as the front-back direction (predetermined direction). In the front-back direction, the side closer to EFEM 1 is defined as the front side. In the front-back direction, the side closer to processing device 6 is defined as the rear side. The orientation of the multiple loading ports 4 (orthogonal to the front-back direction) is defined as the left-right direction. The direction orthogonal to both the front-back and left-right directions is defined as the up-down direction. The up-down direction is parallel to the vertical direction of gravity.
[0032] (Overall configuration of the loading port and its surroundings)
[0033] Reference Figure 1 The schematic configuration of the loading port 4 (the mapping device of this disclosure) and its surroundings according to this embodiment is described. Figure 1 This is a schematic diagram of EFEM 1 equipped with multiple loading ports 4 and its surroundings. "EFEM" is an abbreviation for "Equipment Front End Module". EFEM 1 is a device configured to transfer substrate S between the FOUP 100 (the container in this disclosure) mounted on each loading port 4 and the processing device 6. For example, a semiconductor circuit (not shown) is formed on the substrate S. Examples of substrate S types include known semiconductor substrates (including wafers), glass substrates, and glass epoxy substrates. For example, when viewed in the vertical direction, substrate S is generally rectangular. Substrate S has, for example, an end surface SE extending along the vertical direction (see...). Figure 2 ).
[0034] like Figure 1As shown, EFEM 1 includes a housing 2, a transfer robot 3, multiple loading ports 4, and a control unit 5. The processing equipment 6 is located at the rear of EFEM 1.
[0035] EFEM 1 is installed at a predetermined location, for example, in a semiconductor factory. EFEM 1 uses a transfer robot 3 arranged in the transfer space 9 of housing 2 to transfer substrates S between FOUP 100, which is mounted on loading port 4, and processing equipment 6. "FOUP" is an abbreviation for "Front-Opening Unified Pod". FOUP 100 is a container capable of holding multiple substrates S arranged vertically. For example, FOUP 100 is transferred by a FOUP transfer device (not shown). FOUP 100 is transferred between the FOUP transfer device and loading port 4.
[0036] The housing 2 is a box-shaped component with a transfer space 9 in which the substrate S is transferred. The transfer space 9 is separate from the space outside the housing 2 (external space). Multiple loading ports 4 are connected to the front end of the housing 2. The load locking chamber 7 of the processing device 6 is connected to the rear end of the housing 2. The transfer robot 3 transfers the substrate S between the FOUP 100 and the load locking chamber 7.
[0037] Multiple loading ports 4 are arranged, for example, in a left-right direction. Multiple loading ports 4 are attached to the front end of the housing 2. Each loading port 4 is configured such that the FOUP 100 is mounted thereon. Each loading port 4 is configured to allow the cover 102 (see...) to... Figure 2 ) FOUP body 101 attached to FOUP 100 (see Figure 2 The cover 102 is removed from the FOUP body 101 of the FOUP 100. Each loading port 4 is configured to perform mapping of multiple substrates S housed in the FOUP body 101.
[0038] Control unit 5 is electrically connected to the control unit (not shown) of transfer robot 3, the loading port (LP) control unit 46 (described later) of loading port 4, and the control unit (not shown) of processing device 6. Control unit 5 is configured to communicate with these control units. Control unit 5 may be electrically connected to host computer HC.
[0039] The processing apparatus 6 is an apparatus for performing predetermined processes on the substrate S, such as sputtering or dry etching. The processing apparatus 6 includes, for example, a load-locking chamber 7 configured to allow the substrate S to be temporarily stored therein, and a processing chamber 8 configured to perform predetermined processes on the substrate S.
[0040] (Loading port)
[0041] Reference Figure 2 and Figure 3Describe the configuration of port 4. Figure 2 This is the right-hand view of port 4. Figure 3 This is a diagram schematically showing the positional relationship between the substrate S and the plurality of cameras 61 described below (this positional relationship will be described later).
[0042] Loading port 4 is configured to remove the cover 102 of FOUP 100 from FOUP body 101 and perform mapping of the plurality of substrates S housed in FOUP body 101. Figure 2 As shown, the loading port 4 includes, for example, a base 41, a door mechanism 42, a support frame 43, a mounting section 44, a scanner section 45, and an LP control device 46 (see [link]). Figure 1 ).
[0043] The base 41 is a generally flat, plate-like member. When viewed in the front-rear direction, the base 41 has a generally rectangular shape. The base 41 is arranged to extend in the vertical direction. The base 41 is fixed to EFEM 1. The base 41 is part of a partition wall separating the transfer space 9 from the external space. The base 41 has a generally rectangular opening 41a. The opening 41a is arranged in the upper part of the base 41. The opening 41a has dimensions that allow the cover 102 of FOUP 100 to pass through in the front-rear direction. The opening 41a is opened and closed by the door body 50 described below.
[0044] The door mechanism 42 is configured to attach the cover 102 to and remove it from the FOUP body 101. Figure 2 As shown, the door mechanism 42 includes, for example, a door body 50, a door support 53, a guide rail 54, a lifting block 55, a guide rail 56, a motor 57, and a motor 58.
[0045] The door body 50 is a plate-like member. When viewed in the front-rear direction, the door body 50 has a generally rectangular shape. The door body 50 is supported by, for example, a door support 53. The door body 50 is provided with, for example, an attraction and retention part (not shown) and a latch key (not shown). The attraction and retention part attracts and retains the cover 102 on the front surface of the door body 50. The cover 102 can be secured to the FOUP body 101 by a locking mechanism (not shown). The locking mechanism is operated by using the latch key to unlock and lock the cover 102 of the FOUP 100.
[0046] The door support 53 is a component that supports the door body 50. The door support 53 is supported by a guide rail 54 so that it can move in the front-to-back direction. The door support 53 is driven by a motor 57 to move in the front-to-back direction. The door support 53 moves in the front-to-back direction to bring the door body 50 to the closed position (see [link]). Figure 4 (b) and opening position (see Figure 5(a) The closed position is the position where the door body 50 closes the opening 41a of the base 41. The open position is the position after the closed position and is the position where the door body 50 opens the opening 41a. The guide rail 54 is a member that guides the door support 53 in the front-rear direction. The guide rail 54 is mounted on the lifting block 55. The lifting block 55 is a member configured to move the door body 50 in the vertical direction. The lifting block 55 supports the door support 53 so that it can move in the front-rear direction. The lifting block 55 is guided in the vertical direction along the guide rail 56. The lifting block 55 is driven by the motor 58 to move in the vertical direction. The lifting block 55 moves in the vertical direction so that the door body 50 is in the above-mentioned open position (see Figure 5 (a) and the retracted position below the open position (see Figure 5 (b) The guide rail 56 is a component that guides the lifting block 55 in the vertical direction. For example, the guide rail 56 is attached to the base 41. The guide rail 56 extends in the vertical direction.
[0047] Motor 57 is configured to drive door support 53 in the front-rear direction. Motor 57 is, for example, a known stepper motor driven by a pulse signal. Motor 57 is configured to be controllable by LP control device 46 to control the position of door support 53 in the front-rear direction.
[0048] Motor 58 is configured to drive lifting block 55 to move in the vertical direction. Motor 58 is, for example, a known stepper motor driven by a pulse signal. Motor 58 is configured to be controllable by LP control device 46 to control the position of door support 53 in the vertical direction.
[0049] The support frame 43 is a component configured to support the mounting portion 44. The support frame 43 is fixed to the base 41. The support frame 43 is arranged to project forward from the middle portion of the base 41 in the vertical direction. The mounting portion 44 is a platform-like component on which the FOUP 100 is mounted. The mounting portion 44 is supported by the support frame 43. The mounting portion 44 is configured to be movable relative to the support frame 43 in the longitudinal direction. The mounting portion 44 is configured to be able to be moved by a drive mechanism (not shown) to a predetermined junction position (see [link to relevant documentation]). Figure 4 (a) The cover opening / closing position behind the junction (see Figure 4 (b)) can move between. The handover position is the position where the mounting part 44 can hand over FOUP 100 to the FOUP conveyor (not shown) and hand over FOUP 100 from the FOUP conveyor.
[0050] The scanner unit 45 is configured to detect multiple substrates S in the FOUP 100. The scanner unit 45 is arranged, for example, in the transport space 9. The scanner unit 45 can be fixed to, for example, the door body 50. This allows the scanner unit 45 to be driven by the motor 58 to move vertically together with the door body 50. Figure 3 As shown, the scanner unit 45 includes a plurality of cameras 61, an illumination device 62 (a light emitter in this disclosure), a trigger sensor 65, and a controller 66 (a determiner in this disclosure).
[0051] Each of the plurality of cameras 61 is an apparatus configured to acquire imaging data (imaging information in this disclosure) of a plurality of substrates S. For example, each camera 61 is configured and arranged to image a plurality of substrates S at a time. The plurality of substrates S referred to herein means, for example, some of the substrates S housed in all the substrates S in FOUP 100. Alternatively, each camera 61 may image a plurality of substrates S one by one. Furthermore, in this embodiment, “imaging” refers to an image of an object recorded (i.e., captured) by each camera 61. Each camera 61 is configured and arranged to image a portion of the substrate S in the left-right direction. Each camera 61 is configured to image at least a portion of the end surface SE (more specifically, the rear end surface of the substrate S) of the substrate S. The plurality of cameras may be arranged, for example, on the upper side of the door body 50 and arranged in the left-right direction. Each camera 61 is electrically connected to a controller 66. Each camera 61 includes, for example, a light receiving lens 61a (a light receiver in this disclosure) and an imaging element not shown. The light receiving lens 61a is a light collecting member configured to receive light and focus it onto the imaging element. The surface of the light-receiving lens 61a faces, for example, the front-facing side (FOUP). The imaging element is, for example, a known device, such as a CCD. The imaging element detects light, converts the light into an electrical signal, and transmits the electrical signal to the controller 66. A combination of multiple cameras 61 constitutes the imager of this disclosure. In other words, in this embodiment, the imager of this disclosure includes multiple cameras 61.
[0052] The lighting device 62 is, for example, a device configured to illuminate the interior of the FOUP 100 substantially uniformly in the left-right direction. The lighting device 62 includes, for example, a plurality of LED elements (not shown). The plurality of LED elements (not shown) are arranged to form a substantially straight row, for example, extending in the left-right direction. Furthermore, it is preferable to arrange multiple rows of such LED elements in the up-down direction. Alternatively, the lighting device 62 may include one or more LED elements (not shown) and a diffuser plate (not shown) arranged in front of the one or more LED elements (on the FOUP 100 side in the front-back direction). With the above configuration, light (illumination light) having various directional components in the left-right and front-back directions illuminates from the lighting device 62 at least toward the interior of the FOUP 100. Although in Figure 3 Multiple lighting devices 62 are shown, but the number of lighting devices 62 can be one.
[0053] A portion of the illumination light emitted from the illumination device 62 and traveling forward is reflected backward by the substrate S or the inner wall surface 113 described below (reflected light). Specifically, the reflected light, mirror-reflected by the end surface SE (rear end surface) of the substrate S towards the rear (the side closer to the opening in this disclosure), is used to detect the substrate S. A portion of the illumination light (see...) Figure 3 The reflected light (the dashed line in the image) is reflected by the mirror surface of the end surface SE and then sensed by one of the multiple cameras 61. The imaging element of each camera 61 can sense the reflected light to image a portion of the rear end surface of the substrate S in the left-right direction and its background portion, thereby obtaining imaging data. The imaging data obtained by the imaging element is transmitted to the controller 66.
[0054] The trigger sensor 65 is a sensor used to determine the start time of imaging by the multiple cameras 61. More specifically, the trigger sensor 65 is configured to detect movement of the door support 53 when a portion of the door support 53 moves in the vertical direction. The trigger sensor 65 can be, for example, a known light interruptor. A light interruptor includes a light emitter and a light receiver (not shown), and detects light (transmitted light) emitted from the light emitter by using the light receiver. Figure 2 As shown, the trigger sensor 65 is arranged, for example, inside the support frame 43 and immediately in front of the base 41. That is, when the door body 50 is at least in the open position, the trigger sensor 65 is located near the door support 53 and is configured, for example, to detect the door support 53. The door support 53 includes, for example, a light-blocking portion (not shown) that can move between a position that blocks light emitted from the light emitter of the trigger sensor 65 and a position that does not block light. For example, when transmitted light is blocked by the light-blocking portion, the trigger sensor 65 can send a signal (trigger signal) to the controller 66 indicating that the door support 53 has been detected. For example, when the trigger sensor 65 detects transmitted light that is no longer blocked due to the downward movement of the door support 53, the trigger sensor 65 can also send a signal to the controller 66 indicating that the door support 53 is no longer detected.
[0055] The trigger sensor 65 may include, for example, a light reflector (reflective light sensor) instead of a light interruptor. Alternatively, the trigger sensor 65 may not be provided. In this case, the imaging start timing may be determined by the LP control unit 46 based on, for example, the number of pulse signals (steps) sent from the LP control unit 46 to the motor 58.
[0056] Controller 66 is configured to perform the mapping process described below. Controller 66 includes a CPU, ROM, and RAM (memory), not shown. Controller 66 performs calculations for the mapping process using the CPU according to a program stored in the ROM. Controller 66 is electrically connected to LP control unit 46, multiple cameras 61, and trigger sensor 65. Controller 66 may include known internal storage devices, such as NAND flash memory, HDD, or SSD, not shown.
[0057] The LP control unit 46 includes a CPU, ROM, and RAM (memory), not shown. The LP control unit 46 controls each mechanism of the loading port 4 via the CPU according to a program stored in the ROM. The LP control unit 46 also communicates with the control unit 5 of EFEM 1, the host computer HC, etc. The LP control unit 46 also sends information related to mapping processing to the controller 66 (described later).
[0058] (FOUP)
[0059] Next, we will refer to Figure 2 and Figure 3 An example describing a more specific configuration of FOUP 100. When the opening 114 described later faces the rear, Figure 3 The front, back, left, and right directions shown are for ease of explanation.
[0060] FOUP 100 is a container with a generally rectangular parallelepiped shape. FOUP 100 is configured to accommodate multiple substrates S arranged vertically. Figure 2 and Figure 3 As shown, FOUP 100 includes a FOUP body 101 and a cover 102. The FOUP body 101 is a component having a generally cuboid shape. The FOUP body 101 can be supported by a mounting portion 44. The FOUP body 101 includes, for example, a wall portion 111, an opening portion 112, and a plurality of rods P.
[0061] The wall portion 111 is a generally cuboid member arranged to surround the interior space of the FOUP 100. For example, the wall portion 111 is formed by securing multiple generally flat, plate-like members (such as acrylic plates) together using a fastening tool (not shown). The wall portion 111 has multiple inner wall surfaces 113 (see...). Figure 2 and Figure 3 The opening 112 is located, for example, at the rear end (side surface) of the FOUP body 101. The opening 112 has an opening 114 that is approximately rectangular when viewed in the front-rear direction.
[0062] Each of the plurality of inner wall surfaces 113 is arranged to face the interior of FOUP 100. Each inner wall surface 113 is, for example, generally rectangular. The plurality of inner wall surfaces 113 includes a back surface 113B (opposite surface in this disclosure), an upper surface 113U (see [reference]), and a lower surface 113U. Figure 2 ), lower surface 113D (see Figure 2 ), left side surface 113L (see Figure 3 ) and right surface 113R (see Figure 3 The back surface 113B is the inner wall surface 113 arranged at the foremost position among a plurality of inner wall surfaces 113. Figure 3 In the FOUP body 101, the back surface 113B faces rearward (i.e., the side closest to the opening 114 in the front-rear direction). The back surface 113B extends in both the vertical and horizontal directions. The back surface 113B is positioned opposite the opening 114, separated from the center of the FOUP body 101 in the front-rear direction. The upper surface 113U is connected to the upper end of the back surface 113B and extends in the front-rear direction to the rear end of the FOUP body 101. The upper surface 113U faces downward. The lower surface 113D is connected to the lower end of the back surface 113B and extends in the front-rear direction to the rear end of the FOUP body 101. The lower surface 113D faces upward. The left side surface 113L is connected to the left end of the back surface 113B, the left end of the upper surface 113U, and the left end of the lower surface 113D, respectively, and extends in the front-rear direction to the rear end of the FOUP body 101. The left side surface 113L faces right. The right side surface 113R is connected to the right end of the back surface 113B, the right end of the upper surface 113U, and the right end of the lower surface 113D, and extends to the rear end of the FOUP body 101 in the front-rear direction. The right side surface 113R faces left.
[0063] Multiple rods P are configured to support multiple substrates S substantially horizontally. The multiple rods P are arranged within a generally cuboid space surrounded by the FOUP body 101. Each of the multiple rods P is a generally rod-shaped member, for example, extending in a front-rear direction. Each of the multiple rods P is fixed to, for example, a back surface 113B. A portion of the substrate S is placed on any one of the rods P. Figure 2 As shown, multiple rods P are arranged vertically to correspond to multiple substrates S. Furthermore, as... Figure 3As shown, multiple rods P are arranged in the left-right direction. In other words, the multiple rods P include multiple first rods P1, multiple second rods P2, and multiple third rods P3. The multiple first rods P1 are arranged, for example, adjacent to the left side of the right side surface 113R, and arranged in the up-down direction. The multiple second rods P2 are arranged, for example, at approximately the center of the FOUP body 101 in the left-right direction, and arranged in the up-down direction. The multiple third rods P3 are arranged, for example, near the left side surface 113L, and arranged in the up-down direction. The number of first rods P1, the number of second rods P2, and the number of third rods P3 are the same. One first rod P1, one second rod P2, and one third rod P3 are installed for each substrate S. A set of first rods P1, second rods P2, and third rods P3 are arranged in approximately equal positions in the up-down direction to support a substrate S. The space used to support a substrate S is called a slot. In other words, the FOUP 100 has multiple slots arranged in the up-down direction.
[0064] The cover 102 is configured to open and close the opening 114. The cover 102 is attached to and removed from the FOUP body 101 via the loading port 4. The cover 102 includes a locking mechanism (not shown) that can change the state of the cover 102 between a state where the cover 102 is secured to the FOUP body 101 and a state where the cover 102 is released from the FOUP body 101. The locking mechanism is unlocked and locked by a latch key (not shown).
[0065] (Basic operations for loading ports)
[0066] Reference Figure 4 (a) to Figure 5 (b) Describe the basic operation of loading port 4. Figure 4 (a) to Figure 5 (b) is a right-side view of loading port 4 during operation.
[0067] First, install FOUP 100 on mounting section 44 (see...). Figure 4 (a)). The LP control device 46 moves the mounting part 44 from the handover position (see...). Figure 4 (a) Move the lid to the open / closed position (see Figure 4 (b) Next, the LP control device 46 causes the cover 102 to be attracted and held by the attraction and holding part of the door body 50, and unlocks the locking mechanism of the cover 102 with the latch key. Furthermore, the LP control device 46 controls the motor 57 to move the door support 53 backward (see...). Figure 5 (The right arrow in (a)). Therefore, the door body 50 moves from the predetermined closed position (see...) Figure 4 (b) Move to the open position (see Figure 5 (a) Therefore, the cover 102 is removed from the FOUP body 101.
[0068] Next, the LP control unit 46 controls the motor 58 to move the door body 50 from the open position (see...). Figure 5 (a) Move to the retracted position (see Figure 5 (b) Therefore, the plurality of cameras 61 of the scanner unit 45 move downward together with the door body 50. In response to a command from the controller 66, the plurality of cameras 61 are positioned at predetermined positions in the vertical direction to image a predetermined area 200 (see below) of the predetermined imaging area 200, which will be described later. Figure 6 The system performs imaging and acquires imaging data. The controller 66 performs mapping processing based on the imaging data acquired by the multiple cameras 61. The mapping processing includes determining the containment state of each of the multiple substrates S. Details of the mapping processing will be described later.
[0069] After the mapping process is completed, the transfer robot 3 begins transferring the substrates S between the FOUP 100 and the processing device 6. The processing device 6 sequentially performs predetermined processing on some or all of the substrates S. The processed substrates S are returned to the FOUP 100 by the transfer robot 3. After all the substrates S have returned to the FOUP 100, the LP control device 46 causes the door mechanism 42, etc., to perform the operation opposite to opening the cover 102, and installs the cover 102 onto the FOUP body 101. In this way, a series of processes are performed from when the FOUP 100 is transferred to the loading port 4 until the FOUP 100 can be unloaded.
[0070] Here, when the intensity of reflected light from the inner wall surface 113 of FOUP 100 is high and this reflected light is detected by the camera 61, it is difficult to distinguish this reflected light from the light reflected by the substrate S, which may lead to incorrect judgments about the mounting state of the substrate. In particular, reflected light from the mirror reflection of the back surface 113B may be the main cause of the incorrect judgment. More specifically, since the back surface 113B is approximately perpendicular to the front-back direction, the angle of incidence of the light with front-back components in the illumination light on the back surface 113B is small. As a result, a large amount of light is mirror-reflected by the back surface 113B and directed toward the camera 61. Therefore, reflected light from the back surface 113B may be incorrectly identified as reflected light from the substrate S. Therefore, in order to more reliably suppress incorrect judgments about the mounting state of the substrate S by simple means, the loading port 4 has the following configuration. In particular, multiple cameras 61 are arranged as follows.
[0071] (Detailed camera layout, etc.)
[0072] Reference Figure 3 and Figure 6 Describe the detailed layout of camera 61. Figure 3 The positional relationship between the multiple cameras 61 and the FOUP 100 is shown when the multiple cameras 61 image the substrate S. Figure 6 This diagram illustrates multiple imaging regions 200 (first imaging region 201 and second imaging region 202). As described above, the scanner unit 45 includes multiple cameras 61 and an illumination device 62. Figure 3 As shown, the plurality of cameras 61 include, for example, a first camera 63 and a second camera 64.
[0073] The first camera 63 is, for example, a low-magnification camera with a large horizontal field of view. Preferably, the horizontal field of view of the first camera 63 is, for example, 100 degrees or more. More specifically, the horizontal field of view is preferably 100 degrees or more and 150 degrees or less. The resolution of the first camera 63 is, for example, 1.2 million pixels. The imaging axis of the first camera 63 is, for example, generally parallel to the front-back direction (i.e., generally horizontal). The orientation of the horizontal field of view, resolution, and imaging axis of the first camera 63 is not limited thereto. Figure 3 As shown, a first camera 63 is arranged, for example, between a first rod P1 and a second rod P2 in a left-right direction. The first camera 63 is positioned such that reflected light from the end surface SE near the first rod P1 and reflected light from the end surface SE near the second rod P2 travel towards the first camera 63. The distance between the first camera 63 and the first rod P1 in the left-right direction is preferably smaller than, for example, the distance between the first camera 63 and the second rod P2 in the left-right direction. The first camera 63 is configured and arranged to image a first imaging region 201, which is one of the imaging regions 200 (see...). Figure 6 (To perform imaging.) For example... Figure 6 As shown, the first imaging region 201 is longer in the vertical direction than the length obtained by, for example, adding the diameter of the rod P and the thickness of the substrate S. The first imaging region 201 extends in the horizontal direction from, for example, to the right side of the first rod P1 and to the left side of the second rod P2.
[0074] Data associated with the determination regions 210 (first determination region 211 and second determination region 212), which are part of the first imaging region 201, are used as determination data to determine the containment state of the substrate S. The first determination region 211 is the region near the first rod P1. The second determination region 212 is the region near the second rod P2. In the following text, for ease of explanation, the determination data associated with the first determination region 211 is referred to as first determination data. The determination data associated with the second determination region 212 is referred to as second determination data. The first determination data and the second determination data correspond to the determination information in this disclosure. In this embodiment, the first determination data and the second determination data are collectively referred to as low-magnification data.
[0075] The second camera 64 is, for example, a high-magnification camera with a smaller horizontal field of view compared to the first camera 63. The horizontal field of view of the second camera 64 is preferably, for example, 30 degrees or more and 35 degrees or less. Particularly preferred is a horizontal field of view of 34 degrees or more. The resolution of the second camera 64 is, for example, 1.2 megapixels. The imaging axis of the second camera 64 is, for example, substantially parallel to the front-back direction (i.e., substantially horizontal). The horizontal field of view, resolution, and orientation of the imaging axis of the second camera 64 are not limited thereto. Figure 3 As shown, for example, a second camera 64 is arranged in the left-right direction between the second rod P2 and the third rod P3. The second camera 64 is positioned such that reflected light from the mirror surface SE located near the end surface of the third rod P3 travels toward the second camera 64. For example, the distance between the second camera 64 and the third rod P3 in the left-right direction is preferably shorter than the distance between the second camera 64 and the second rod P2 in the left-right direction. The second camera 64 is configured and arranged to image a second imaging region 202, which is one of the imaging regions 200 (see...). Figure 6 (To perform imaging.) For example... Figure 6 As shown, the second imaging region 202 is longer in the vertical direction than, for example, by adding the diameter of the rod P and the thickness of the substrate S. More specifically, the second imaging region 202 is longer in the vertical direction than, for example, by adding the diameter of the rod P and the thickness of the two substrates S. For example, the second imaging region 202 extends from the right side of the third rod P3 to the left side of the third rod P3 in the horizontal direction.
[0076] Data associated with the determination region 210 (third determination region 213), which is part of the second imaging region 202, is used as determination data to determine the containment state of the substrate S. The third determination region 213 is the region near the third rod P3. In the following text, for ease of explanation, the determination data associated with the third determination region 213 will be referred to as third determination data. Like the first and second determination data, the third determination data corresponds to the determination information in this disclosure. In this embodiment, the third determination data is also referred to as high-magnification data.
[0077] Reference Figure 3 and Figure 6 Describe the details of the position of the corresponding camera 61. For example... Figure 3As shown, when camera 61 images the imaging area 200, camera 61 focuses reflected light using a light-receiving lens 61a. Typically, the principal points (front principal point and rear principal point), focal points (front focal point and rear focal point), and nodal points (front nodal point and rear nodal point) of the lens are predetermined according to the lens specifications. Although not shown in the figures, for ease of explanation in this embodiment, for example, the front nodal point (the center point of the surface of light-receiving lens 61a on the substrate S side) of light-receiving lens 61a is defined as the light-receiving point RP. The light-receiving point RP associated with the first camera 63 is referred to as the first light-receiving point RP1. The light-receiving point RP associated with the second camera 64 is referred to as the second light-receiving point RP2.
[0078] In addition, such as Figure 6 As shown, for ease of explanation, the predetermined point included in each determination region 210 and included in the end surface SE is referred to as the detection target point SP (see [reference]). Figure 3 and Figure 6 The positions of the detection target point SP in the left-right and front-back directions are preset, for example, according to the specifications of FOUP 100, the specifications of the substrate S, the arrangement of the lighting device 62, and the configuration and arrangement of the camera 61. The detection target point SP included in the first determination area 211 is referred to as the first detection target point SP1. Figure 3 As shown, the first detection target point SP1 can be located, for example, to the left of the first rod P1 (i.e., inside the first rod P1 in the left-right direction). The detection target point SP included in the second determination area 212 is referred to as the second detection target point SP2. Figure 3 As shown, the second detection target point SP2 can, for example, be located at approximately the same position as the center of the second rod P2 in the left-right direction. The detection target point SP included in the third determination area 213 is referred to as the third detection target point SP3. Figure 3 As shown, the third detection target point SP3 can be located, for example, to the right of the third rod P3 (i.e., inside the third rod P3 in the left-right direction). The positions of each detection target point SP are not limited to this. For example, one or more detection target points SP can be set directly above the corresponding rod P.
[0079] The first camera 63 pairs of imaging regions 200 (first imaging region 201) including the first detection target point SP1 and the second detection target point SP2 (see...). Figure 6 The second camera 64 performs imaging on the imaging region 200 (second imaging region 202) including the third detection target point SP3 (see...). Figure 6 Imaging is performed. In this way, multiple (two) cameras 61 image the region associated with each substrate S, which includes multiple (three in total) detection target points SP.
[0080] like Figure 3 As shown, for ease of explanation, the imaginary straight line passing through the predetermined light receiving point RP and the predetermined detection target point SP is called the imaginary straight line VL. More specifically, the imaginary straight line VL passing through the first light receiving point RP1 and the first detection target point SP1 is called the first imaginary straight line VL1. The imaginary straight line VL passing through the first light receiving point RP1 and the second detection target point SP2 is called the second imaginary straight line VL2. The imaginary straight line VL passing through the second light receiving point RP2 and the third detection target point SP3 is called the third imaginary straight line VL3. The first imaginary straight line VL1 intersects, for example, the right side surface 113R of FOUP 100. The second imaginary straight line VL2 and the third imaginary straight line VL3 intersect, for example, the left side surface 113L of FOUP 100. The right side surface 113R and the left side surface 113L are side surfaces of the inner wall surface 113 that are different from the back surface 113B (opposite surface). In the following text, for the sake of explanation, the right surface 113R and the left surface 113L are collectively referred to as non-opposite surfaces.
[0081] Using this arrangement, each camera 61 can image the region (i.e., the decision region 210) near the detection target point SP by using one of the non-opposing surfaces (and rod P) as a background. In other words, the inclusion of imaging data associated with the back surface 113B in the imaging data associated with each decision region 210 can be suppressed as much as possible. Since the non-opposing surfaces are approximately parallel to the front-back direction, the amount of illumination light reflected backward from the non-opposing surfaces and traveling directly toward the camera 61 is very small compared to the amount of light reflected from the back surface 113B and traveling toward the camera 61. Therefore, the inclusion of light that could lead to erroneous detection of the substrate S in the imaging data associated with the decision region 210 can be suppressed as much as possible.
[0082] (Mapping Processing)
[0083] Next, we will mainly refer to Figure 7 This describes an example of mapping processing performed by load port 4. Figure 7 This is a flowchart illustrating the entire mapping process.
[0084] The initial state is as follows. The FOUP 100, containing multiple substrates S, is mounted on the mounting section 44. The mounting section 44 is in the cover open / closed position. The cover 102 of the FOUP 100 is opened via the door mechanism 42. The door body 50 is in the open position (see...). Figure 5 (a)).
[0085] First, the LP control device 46 transmits information (planning information) related to the imaging plan executed by the camera 61 to the controller 66. Information related to the imaging plan includes, for example, the specifications of the FOUP 100, the number of substrates S that can be stored in the FOUP 100, the position of the uppermost slot among the multiple slots of the FOUP 100, and the setting value of the descent speed of the door body 50. The planning information is sent in advance from the control unit (not shown) of the processing device 6 to the LP control device 46. In addition to the planning information, for example, the setting value of the thickness of the substrates S (information used to perform the dual determination described later) is also sent in advance from the control unit of the processing device 6 to the LP control device 46. The controller 66 receives the planning information from the LP control device 46. Figure 7 (See step S101). The controller 66 calculates the imaging plan based on the planning information (step S102). The imaging plan is a plan for when the camera 61 will perform imaging after a certain amount of time has elapsed after the controller 66 receives the predetermined trigger signal.
[0086] Next, the LP control device 46 controls the motor 58 of the door mechanism 42 to begin lowering the scanner unit 45 together with the door body 50 (and the door support unit 53) (step S103). At this time, the trigger sensor 65 detects the start of movement of the door support unit 53 and sends a detection signal to the controller 66. The controller 66 receives the detection signal as a trigger signal (step S104). Then, the controller 66 causes each camera 61 to perform imaging based on the imaging plan, for example, in the following procedure.
[0087] The controller 66 sets the counter to an initial value, which is configured to count (determine) the substrates S housed in the FOUP 100 one by one from top to bottom. More specifically, the controller 66 inputs 1 to a predetermined variable N, for example (step S105).
[0088] Next, the controller 66 determines, based on the imaging plan, whether the time has come to image the Nth substrate S (step S106). If the time has not yet come to image the Nth substrate S (step S106: No), the scanner unit 45 continues to be lowered by the LP control device 46. When the time has come to image the Nth substrate S (step S106: Yes), the controller 66 controls multiple cameras 61 to image the imaging area 200 associated with the Nth substrate S and obtains imaging data associated with that substrate S (step S107). More specifically, the controller 66 causes the first camera 63 to image the first imaging area 201 and the second camera 64 to image the second imaging area 202. The controller 66 temporarily stores the imaging data obtained by these cameras 61 in, for example, a memory. The controller 66 may also store the imaging data in, for example, the aforementioned internal storage device (not shown).
[0089] Next, the controller 66 determines the containment state of the Nth substrate S based on the determination data included in the imaging data (determination process, step S108). Details will be described later.
[0090] Next, controller 66 determines whether the determination process for all substrates S has been completed (step S109). If controller 66 determines that there are any substrates S that have not yet undergone determination process (step S109: No), controller 66 increments variable N by 1 (step S110) and returns to step S106. When the determination process for all substrates S has been completed (step S109: Yes), controller 66 terminates the mapping process.
[0091] (Judgment and processing)
[0092] Reference Figures 8 to 9 (d) An example of the process for determining the containment state of each substrate S. Figure 8 This is a flowchart illustrating the determination process for each substrate S. Figure 9 (a) to (d) are diagrams used to explain the determination of the containment state of substrate S. In summary, controller 66 determines whether the containment state of the Nth substrate S is a dual state or a cross state, whether the Nth substrate S does not exist, or whether the Nth substrate S is normally contained.
[0093] In the following determination process, controller 66 uses data including the non-opposing surface (information on the non-opposing surface in this disclosure) as determination data. Data including the non-opposing surface is data that excludes the area associated with the back surface 113B in imaging region 200 but includes data related to both the non-opposing surface and the detection target point SP. In other words, controller 66 uses data associated with determination region 210, in which the back surface 113B is not imaged as background, while the left surface 113L or the right surface 113R is imaged as background.
[0094] First, the controller 66 determines whether the containment state of the Nth substrate S is a dual state (dual determination); Figure 8 The step S201 shown is a dual state. Figure 9 (a) shows a state in which two (or more) substrates S are vertically overlapped in a slot. Controller 66 detects the thickness of the Nth substrate S based on, for example, third determination data. If the detected thickness exceeds a set value for the thickness of one substrate S, controller 66 determines that the accommodating state of the Nth substrate S is in a dual state (i.e., a dual state is detected). If the detected thickness is approximately the same as the set value for the thickness of one substrate S, controller 66 determines that the Nth substrate S is not in a dual state.
[0095] When a dual state is detected (step S202: Yes), the controller 66 stores information indicating that the containment state of the Nth substrate S is a dual state in the memory (step S203). Then, the controller 66 terminates the determination regarding the Nth substrate S.
[0096] When no dual state is detected (step S202: No), controller 66 determines whether the accommodating state of the Nth substrate S is a cross state (cross determination). For example, as Figure 9 (b) or Figure 9 As shown in (c), the cross state is a state in which a part of the substrate S is placed on a part of a set of rods P arranged in the left-right direction and another part of the substrate S is located below the set of rods P.
[0097] As part of the cross-determination procedure, firstly, the controller 66 determines whether the accommodation state of the Nth substrate S is in a cross-state based on, for example, low-magnification data (step S204). More specifically, the controller 66 compares the vertical position of the substrate S detected based on the first determination data (hereinafter referred to as the first substrate position) with the vertical set position (hereinafter referred to as the first set position) of the first lever P1 corresponding to the substrate S. The vertical set position of each lever P is pre-stored in the memory of the controller 66. Since the position of each lever P is allowed to have design tolerances, there may be a difference between the designed position and the actual position of each lever P in the vertical direction. In this case, the controller 66 can detect the actual position of each lever P, for example, by pattern matching. For example, when the first substrate position is lower than the first set position, the controller 66 determines that the accommodation state of the Nth substrate S is in a cross-state (i.e., a cross-state is detected).
[0098] The controller 66 also compares the vertical position of the substrate S detected based on the second determination data (hereinafter referred to as the second substrate position) with the vertical set position of the second rod P2 corresponding to the substrate S (hereinafter referred to as the second set position). The second set position can be set to a position common to the first set position in the vertical direction, for example, or it can be set independently of the first set position. For example, when the second substrate position is lower than the second set position, the controller 66 determines that the accommodation state of the Nth substrate S is a cross state (i.e., a cross state is detected). When a cross state is detected (step S205: Yes), the controller 66 stores the information indicating that the accommodation state of the Nth substrate S is a cross state in the memory (step S206). Then, the controller 66 terminates the determination regarding the Nth substrate S.
[0099] When no crossover state is detected based on low-magnification data (step S205: No), the controller 66 performs a crossover determination by considering high-magnification data (step S207). The controller 66 compares the vertical position of the substrate S detected based on the third determination data (hereinafter referred to as the third substrate position) with the vertical set position of the third rod P3 corresponding to the substrate S (hereinafter referred to as the third set position). The third set position may be a position shared with the first set position and / or the second set position in the vertical direction, or it may be set independently of the first set position and the second set position. For example, when the third substrate position is lower than the third set position, the controller 66 determines that the accommodation state of the Nth substrate S is a crossover state (i.e., a crossover state is detected). When a crossover state is detected (step S208: Yes), the controller 66 executes the above step S206 and terminates the determination regarding the Nth substrate S.
[0100] When no crossover is detected even when considering high-magnification data (step S208: No), the controller 66 determines whether substrate S is present (step S209). More specifically, the controller 66 determines whether substrate S is detected in any of the first determination region 211, the second determination region 212, and the third determination region 213 based on the determination data. When substrate S is not detected in any of the determination regions 210 (see...), Figure 9 (d) The controller 66 determines that the Nth substrate S has not been preset (step S210: No). In this case, the controller 66 stores the information indicating that the Nth substrate S has not been preset in the memory (step S211). Then, the controller 66 terminates the determination regarding the Nth substrate S. When substrate S is detected in any determination area 210, the controller 66 determines that the Nth substrate S has been preset (i.e., correctly stored) (step S211: No). In this case, the controller 66 terminates the determination regarding the Nth substrate S as is. In this way, the determination process for the Nth substrate S is completed.
[0101] As described above, when imaging the imaging area 200, the corresponding camera 61 is arranged as follows. An imaginary straight line VL passing through each light receiving point RP and the detection target point SP corresponding to each light receiving point RP intersects with a non-opposing surface (left surface 113L or right surface 113R), which is a surface different from the back surface 113B of the FOUP 100. With this arrangement of the camera 61, the back surface 113B can be minimized from being imaged as background at and near the detection target point SP. Therefore, the influence of reflected light from the back surface 113B can be suppressed as much as possible. Furthermore, compared to reflected light from the back surface 113B, reflected light emitted from the illumination device 62 and reflected by the non-opposing surface is suppressed from directly reaching the camera 61. Therefore, erroneous determinations regarding the containment state of the substrate S at the detection target point SP can be minimized as much as possible. Therefore, erroneous determinations regarding the containment state of the substrate S can be suppressed more reliably by simple means.
[0102] Furthermore, the controller 66 uses data including the non-opposing surface as decision data. Therefore, data from the region in the imaging region 200 that is imaged using the back surface 113B as a background can be excluded from the decision target performed by the controller 66. Thus, erroneous determinations regarding the accommodating state of the substrate S can be effectively suppressed.
[0103] Furthermore, multiple cameras 61 (imagers) image the area of each substrate S including multiple detection target points SP. In a configuration where multiple detection target points SP of each substrate S need to be determined, even if a single erroneous determination occurs, erroneous determinations will occur for all substrates S. Therefore, the scanner unit 45 of this embodiment, which can more reliably suppress erroneous determinations, is particularly effective in this configuration.
[0104] Furthermore, cross-determination can be performed using the first camera 63 (and the second camera 64). Dual determination can be performed using the second camera 64. Therefore, the containment state of the substrate S can be determined in more detail.
[0105] Furthermore, generally, in the light reflected by the substrate S, the light reflected from the end surface SE is stronger than the light reflected from parts other than the end surface SE. Therefore, in order to more reliably detect the reflected light from the substrate S, it is preferable to configure the imager to image at least the end surfaces of the substrate, as in this embodiment. In this case, the side surfaces (left side surface 113L or right side surface 113R) of the inner wall surface 113 of the FOUP 100 can be imaged by the camera 61. The reflected light reflected from the side surface, which is different from the back surface 113B, and traveling directly toward the camera 61 is significantly weaker than the reflected light traveling directly from the back surface 113B to the camera 61. This can effectively suppress erroneous determinations about the presence or absence of the substrate S at the detection target point SP.
[0106] Next, variations of the above embodiments will be described. Components identical to those in the above embodiments will be indicated by the same reference numerals, and their descriptions will be omitted as appropriate.
[0107] (1) The controller 66 may also be able to determine other cross states that are different from the cross states shown in the above embodiments (see Figure 10 (a) to (f)). That is, even if the substrate S is not detected in a portion (one or both) of the first determination region 211, the second determination region 212, and the third determination region 213, the controller 66 can determine that the containment state of the substrate S is a cross-state. For example, this may happen when a substrate S that may be bent due to reasons such as being very thin is contained in the FOUP 100 and a portion of the substrate S is unintentionally positioned below the rod P, causing that portion to sag significantly due to gravity.
[0108] (2) In the above embodiments, it is assumed that the imaging axis of each camera 61 is substantially horizontal, and each camera 61 is arranged to image the end surface SE of the substrate S. However, this disclosure is not limited thereto. The camera 61 can be configured to image the substrate S from, for example, a lower rear side or an upper rear side. For example, in the case where the substrate S is a glass epoxy resin substrate, the portion near the end surface SE is slightly rounded when viewed in, for example, a left-right direction. Since such a substrate S can specularly reflect the irradiated light in all directions, the probability of detecting the substrate S is high even when the camera 61 is arranged as described above. When the camera 61 is arranged to image the substrate S from a lower rear side, the upper surface 113U is included in the non-opposing surface of this disclosure. When the camera 61 is arranged to image the substrate S from an upper rear side, the lower surface 113D is included in the non-opposing surface of this disclosure.
[0109] (3) In the above embodiments, the plurality of cameras 61 includes a first camera 63 and a second camera 64 with different performance characteristics (e.g., at least one of resolution, magnification, or field of view). However, this disclosure is not limited thereto. The plurality of cameras 61 may include two cameras (not shown) having the same performance characteristics. One camera may perform imaging for cross-determination. Another camera or both cameras may perform imaging for dual-determination. When dual-determination is performed based on imaging data acquired by two cameras, the accuracy of dual-determination can be further improved.
[0110] (4) In the above embodiments, the imager includes two cameras 61. However, this disclosure is not limited thereto. The imager may include three or more cameras 61. Alternatively, the imager may include only one camera 61. In a configuration with only one camera 61, the horizontal field of view of the camera 61 may be larger than, for example, the horizontal field of view of the first camera 63. Therefore, cross-detection can be performed by using a small number of cameras 61. Furthermore, despite the large horizontal field of view (i.e., low magnification), the resolution of the camera 61 can be high enough to perform dual detection. In addition, in the above embodiments, the imager images a region including multiple detection target points SP. However, this disclosure is not limited thereto. In a configuration with only one camera 61, the camera 61 may be configured to image a region including only one detection target point SP. That is, the controller 66 may use the camera 61 to determine, for example, the presence or absence of the substrate S.
[0111] (5) In the above embodiment, the controller 66 uses data including the non-opposite surface as decision data. However, this disclosure is not limited thereto. The controller 66 may also use data in which the back surface 113B is slightly included as a background as decision data. Even in this case, since the imaginary straight line VL intersects with the non-opposite surface, the proportion of data related to the back surface 113B in the decision data can be effectively reduced. Therefore, the influence of reflected light from the back surface 113B can be effectively suppressed.
[0112] (6) In the above embodiment, a detection target point SP is set in each determination region 210. However, this disclosure is not limited thereto. Multiple detection target points SP can be set in each determination region 210. Alternatively, the controller 66 can be configured to detect the entire area in each determination region 210 where light is specularly reflected as part of the end surface SE.
[0113] (7) In the above embodiment, the front node of the light-receiving lens 61a of the camera 61 is defined as the light-receiving point RP. However, this disclosure is not limited thereto. The front principal point of the light-receiving lens 61a or a predetermined point on the front surface of the light-receiving lens 61a can be defined as the light-receiving point RP. Alternatively, for example, if the front focal point of the light-receiving lens 61a is located inside the light-receiving lens 61a, the front focal point can be defined as the light-receiving point RP. Alternatively, the rear principal point or rear node can be defined as the light-receiving point RP.
[0114] (8) The number of rods P supporting each substrate S is not limited to three. The substrate S may be supported by support members (not shown) other than the rods P. Alternatively, for example, the two ends of the substrate S in the left and right directions may be supported by support portions (not shown) formed by cutting off the inner surface of the FOUP body 101. The type of container is not limited to FOUP 100. This disclosure can also be applied to containers (not shown) other than FOUP 100 that have openings, opposing surfaces, and non-opposing surfaces.
[0115] (9) When viewed in the vertical direction, the shape of the substrate S can be other than a generally rectangular shape. The substrate S can be, for example, a generally circular plate shape.
[0116] (10) In the above embodiment, the scanner unit 45 is fixed to, for example, the door body 50 (i.e., driven by the motor 58 to move in the vertical direction together with the door body 50). However, this disclosure is not limited thereto. For example, the scanner unit 45 may be configured to move in the front-rear direction relative to the door body 50. Alternatively, the scanner unit 45 may be driven by a drive source (not shown) other than the motor 58 to move in the vertical direction independently of the door body 50. Alternatively, the scanner unit 45 may also be attached to a structure within the EFEM 1, in addition to the transfer robot 3.
[0117] (11) In the above embodiment, the controller 66 causes each camera 61 to perform imaging based on an imaging plan. However, this disclosure is not limited thereto. The controller 66 can cause each camera 61 to perform imaging while determining, for example, the position of the scanner unit 45 in the vertical direction. For example, the receiving setting position of each substrate S in the vertical direction can be pre-stored in the memory (RAM) of the controller 66. The position of the scanner unit 45 in the vertical direction can be determined based on the number of steps of the motor 58, such as a stepper motor. When it is determined that the position of the scanner unit 45 in the vertical direction has reached the receiving setting position of each substrate S in the vertical direction, the controller 66 can cause each camera 61 to perform imaging.
[0118] (12) In the above embodiments, the LP control device 46 and the controller 66 are provided separately. However, this disclosure is not limited thereto. For example, the LP control device 46 may be equipped with the controller 66. Alternatively, instead of the controller 66, the LP control device 46 may have the function of controlling each camera 61. When the LP control device 46 has this function, the LP control device 46 corresponds to the determiner of this disclosure. Alternatively, for example, the control device 5 of EFEM 1 may control the loading port 4. In this case, the control device 5 corresponds to the determiner of this disclosure.
[0119] (13) Loading port 4 can be installed on any device other than EFEM 1.
[0120] (14) This disclosure can be applied to mapping devices other than loading port 4.
[0121] Explanation of reference numerals in the attached figures
[0122] 4: Loading port (mapping device), 61: Camera (imager), 61a: Light receiving lens (light receiver), 62: Illumination device (light emitter), 66: Controller (determiner), 100: FOUP (container), 113: Inner wall surface, 113B: Back surface (opposite surface), 113L: Left side surface (non-opposite surface or side surface), 113R: Right side surface (non-opposite surface or side surface), 114: Opening, 200: Imaging area, 201: First imaging area, 202: Second imaging area, RP: Light receiving point, S: Substrate, SE: End surface, SP: Detection target point, VL: Imaginary straight line
Claims
1. A mapping device for detecting the containment state of a substrate contained in a container, the container having an opening on its side surface, the mapping device comprising: A light emitter configured to emit light at least toward the interior of the container; as well as An imager is configured to sense reflected light emitted from the light emitter and reflected at least by the substrate toward the opening, and to image an imaging region including predetermined detection target points pre-defined for detecting the substrate. The imager is arranged such that when imaging the imaging area, an imaginary straight line passing through a predetermined light receiving point and the detection target point intersects a non-opposing surface, the predetermined light receiving point being pre-determined by a light receiver of the imager configured to receive the reflected light, and the non-opposing surface being a surface on the inner wall surface of the container that is different from the opposing surface facing the opening.
2. The mapping device according to claim 1, further comprising: A determiner is configured to determine the accommodating state of the substrate by using determination information included in imaging information, the imaging information being obtained by imaging the imaging area using the imager. The determiner uses information containing non-opposite surfaces as the determination information. The information containing non-opposite surfaces does not include region information related to the opposing surface in the imaging region, but includes region information related to both the non-opposite surface in the imaging region and the detection target point.
3. The mapping device according to claim 1 or 2, wherein the imager images a region including a plurality of the detection target points associated with the substrate.
4. The mapping device according to claim 3, wherein the imager comprises: A first camera is configured to image a first imaging region, the first imaging region including two or more of the plurality of detection target points; as well as A second camera, which is separately disposed from the first camera, is configured to image a second imaging region to detect the thickness of the substrate. The second imaging region includes a detection target point that is different from two or more of the detection target points.
5. The mapping apparatus according to claim 1 or 2, wherein the imager is configured to image at least the end surface of the substrate, and The non-opposite surface is a side surface that is different from the opposite surface.