Semiconductor package water-washing solder paste and preparation method thereof

Abstract

The application discloses a kind of semiconductor packaging water washing soldering paste and preparation method thereof, belong to semiconductor packaging welding material technical field.The water washing soldering paste is by 38%-48% modified rosin resin, 10%-14% water-soluble activator, 22%-32% water-soluble solvent, 2%-4% thixotropic agent, 0.8%-2.5% corrosion inhibitor, 0.5%-1.8% surfactant, 0.3%-1.2% antioxidant and 0.2%-0.8% cavity inhibitor according to percentage by weight, the sum of weight percentage of each component is 100%.Wherein the modified rosin resin is imidazole rosin salt.The application is compounded by specific component, especially the synergistic effect of imidazole rosin salt and nano alumina cavity inhibitor, so that the soldering paste has high soldering activity, low soldering point cavity rate, excellent water washing performance and thixotropy;After welding, special cleaning fluid is not needed, and normal temperature deionized water can be directly used for cleaning.

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