Two-component ms epoxy hybrid sealant and preparation method and application thereof

By compounding components A and B in a specific formulation, a stable island structure is formed, which solves the problem of insufficient modulus of two-component MS epoxy hybrid sealant in the whole temperature range, and achieves high strength and good low temperature toughness, making it suitable for power battery sealing.

CN122255918APending Publication Date: 2026-06-23GUANGZHOU JOINTAS CHEM
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGZHOU JOINTAS CHEM
Filing Date
2026-04-02
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Existing two-component MS epoxy hybrid sealant has insufficient modulus at different temperatures, resulting in a decrease in the structural stiffness of the battery pack and making it difficult to maintain high strength and good low-temperature toughness across the entire temperature range.

Method used

A specific formulation is used to combine components A and B. Component A contains epoxy resin I, epoxy resin II, diluent, reinforcing filler I, and catalyst, while component B contains MS resin I, MS resin II, MS resin III, reinforcing filler II, and epoxy curing agent. By combining the island structure and specific composition, the curing speed and compatibility are controlled to form a stable two-phase system.

Benefits of technology

It maintains a high modulus across the entire temperature range (-40~80℃), while also ensuring high strength and good low-temperature toughness, thus guaranteeing the structural stability and bonding effect of the battery pack at different temperatures.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a two-component MS epoxy hybrid sealant, its preparation method, and its application. The two-component MS epoxy hybrid sealant comprises component A and component B. By weight, component A comprises 50-70 parts epoxy resin I, 5-7 parts epoxy resin II, 5-15 parts diluent, 10-30 parts reinforcing filler I, 1-2 parts accelerator, 1-5 parts hydrophobic fumed silica I, and 1-2 parts catalyst. By weight, component B comprises 30-35 parts MS resin I, 15-20 parts MS resin II, 15-25 parts MS resin III, 10-20 parts reinforcing filler II, 2-5 parts adhesion accelerator, 5-20 parts epoxy curing agent, and 1-5 parts hydrophobic fumed silica II. The two-component MS epoxy hybrid sealant exhibits high modulus across the entire temperature range, while also possessing high strength and good low-temperature toughness.
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