A boundary scan test apparatus for integrated circuit testing
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN LIJING TECH CO LTD
- Filing Date
- 2026-03-25
- Publication Date
- 2026-06-23
AI Technical Summary
In existing integrated circuit testing equipment, the tension of the probes is difficult to adjust quickly and synchronously, leading to poor contact or physical damage. Furthermore, the equipment has limited functionality, cannot automatically adjust the probe height, angle, and spacing, and lacks an effective cleaning mechanism, which affects testing efficiency and reliability.
It adopts a two-stage pressure regulation mechanism, which uses a micro motor to drive a bevel gear and a threaded rod to achieve synchronous adjustment, combined with a one-way lead screw to achieve independent fine adjustment. With the ball design and automatic cleaning mechanism, it can achieve multi-angle adaptive contact and automatic cleaning of the probe.
It achieves optimal contact pressure adjustment of the probe, avoiding circuit board damage and poor contact, improving the accuracy and efficiency of testing, and realizing automatic probe cleaning, ensuring the reliability of testing and the service life of the probe.
Smart Images

Figure CN122260077A_ABST