A boundary scan test apparatus for integrated circuit testing

CN122260077APending Publication Date: 2026-06-23DONGGUAN LIJING TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
DONGGUAN LIJING TECH CO LTD
Filing Date
2026-03-25
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

In existing integrated circuit testing equipment, the tension of the probes is difficult to adjust quickly and synchronously, leading to poor contact or physical damage. Furthermore, the equipment has limited functionality, cannot automatically adjust the probe height, angle, and spacing, and lacks an effective cleaning mechanism, which affects testing efficiency and reliability.

Method used

It adopts a two-stage pressure regulation mechanism, which uses a micro motor to drive a bevel gear and a threaded rod to achieve synchronous adjustment, combined with a one-way lead screw to achieve independent fine adjustment. With the ball design and automatic cleaning mechanism, it can achieve multi-angle adaptive contact and automatic cleaning of the probe.

Benefits of technology

It achieves optimal contact pressure adjustment of the probe, avoiding circuit board damage and poor contact, improving the accuracy and efficiency of testing, and realizing automatic probe cleaning, ensuring the reliability of testing and the service life of the probe.

✦ Generated by Eureka AI based on patent content.

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    Figure CN122260077A_ABST
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Abstract

The application discloses a boundary scan test device for integrated circuit test and relates to the technical field of integrated circuit test, which comprises two symmetrically arranged fixing frames, four groups of uniformly arranged pressure compensation mechanisms are arranged in each fixing frame, the pressure compensation mechanism comprises a connecting cylinder, a connecting disc and a sliding disc which are fixedly connected to the inside of the fixing frame and are slidably connected, and a spring is fixedly connected between the connecting disc and the sliding disc. The micro motor three and the one-way screw rod drive the push rod, the independent fine adjustment of the tension of the single probe spring can be realized, meanwhile, the micro motor one drives the bevel gear set and the threaded rod, the tension of all the springs can be synchronously adjusted, the double adjustment mechanism can cope with the unevenness of the circuit board surface, realize the optimal contact pressure of each probe, quickly adapt to the circuit boards with different thickness or change the overall pre-tightening force, and effectively avoid the problems that the circuit board is damaged due to excessive pressure or the contact is poor due to insufficient pressure.
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