A liquid crystal panel manufacturing method, a liquid crystal panel, and a display device

Abstract

The application relates to a liquid crystal panel manufacturing method, a liquid crystal panel and a display device. The method comprises the following steps: providing a first substrate and a second substrate; the first substrate comprises a plurality of circuit units which are arranged at intervals; the second substrate comprises a transparent conductive film; continuously coating a frame glue along a target frame glue path on the first substrate to form a plurality of closed frame glues, each closed frame glue surrounds a corresponding circuit unit; the frame glue at an injection port of each closed frame glue is connected with an adjacent closed frame glue to form a closure; aligning and adhering the first substrate on which the closed frame glues are formed and the second substrate; the transparent conductive film corresponds to the first substrate; performing a splitting treatment on the first substrate and the second substrate between the injection port and the closure of each closed frame glue, so that each closed frame glue forms an opening at the injection port, and the opening is used for crystal pouring to obtain a plurality of liquid crystal panels. The method can improve the production efficiency of the liquid crystal panel.

Description

Technical Field

[0001] This application relates to the field of device fabrication technology, and in particular to a method for manufacturing a liquid crystal panel, a liquid crystal panel, and a display device. Background Technology

[0002] In recent years, with the continuous development of semiconductor technology and electronic circuit technology, new types of displays with obvious advantages have emerged. For example, LCoS liquid crystal displays made based on silicon-based liquid crystal LCoS (Liquid Crystal on Silicon) technology have advantages such as high resolution, high transmittance, and high brightness.

[0003] LCoS liquid crystal displays are made by directly bonding a silicon substrate to ITO glass of the same size. Multiple identical independent circuit units are fabricated on the silicon wafer, and these units are separated through a dicing process to form individual LCoS liquid crystal display devices. However, due to the immaturity of the fabrication process, inconsistencies in the amount of adhesive applied to different independent circuit units can occur, affecting the production efficiency and yield of LCoS liquid crystal display devices. Summary of the Invention

[0004] Therefore, it is necessary to provide a liquid crystal panel manufacturing method, liquid crystal panel, display device, liquid crystal panel manufacturing system, liquid crystal panel manufacturing apparatus, computer equipment, computer-readable storage medium, and computer program product that can improve the production efficiency of liquid crystal panels, in response to the above-mentioned technical problems.

[0005] Firstly, this application provides a method for manufacturing a liquid crystal panel. The method includes:

[0006] A first substrate and a second substrate are provided; the first substrate includes a plurality of spaced-apart circuit units; the second substrate includes a transparent conductive film.

[0007] A frame adhesive is continuously applied along the target frame adhesive path on the first substrate to form multiple closed frame adhesives, each of which surrounds the corresponding circuit unit; the frame adhesive at each closed frame adhesive injection port is connected to the adjacent closed frame adhesive to form a closure.

[0008] The first substrate and the second substrate, which form the encapsulated frame adhesive, are aligned and bonded together; the transparent conductive film corresponds to the first substrate.

[0009] The first and second substrates are split between the injection port and the closed position of each sealed frame sealant, so that each sealed frame sealant forms an opening at the injection port, and crystal is poured through the opening to obtain multiple liquid crystal panels.

[0010] Secondly, this application also provides a liquid crystal panel. The liquid crystal panel is obtained through some or all of the steps of the liquid crystal panel manufacturing method described in any of the method embodiments of the first aspect of this application.

[0011] Thirdly, this application also provides a display device. The display device includes a plurality of liquid crystal panels as described in the second aspect of the embodiments of this application.

[0012] Fourthly, embodiments of this application provide a liquid crystal panel manufacturing system, including: a processor, a memory, and a communication interface. The memory stores one or more programs, and the processor executes the one or more programs. The programs include instructions for performing some or all of the steps as described in the embodiments of the liquid crystal panel manufacturing method.

[0013] Fifthly, embodiments of this application provide a liquid crystal panel manufacturing apparatus, applied to a liquid crystal panel manufacturing system. The liquid crystal panel manufacturing system is used to manufacture liquid crystal panels. The liquid crystal panel manufacturing apparatus includes a processing unit and a communication unit.

[0014] The processing unit is used to perform some or all of the steps of a liquid crystal panel manufacturing method as described in the first aspect above.

[0015] The communication unit is used to receive data input to the liquid crystal panel manufacturing apparatus from the outside and send the data to the processing unit, so that the processing unit can execute some or all of the steps of the liquid crystal panel manufacturing method described above.

[0016] Sixthly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, which, when executed by the processor, causes the processor to perform the steps in the liquid crystal panel manufacturing method described in the embodiments of this application.

[0017] Seventhly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, causes the processor to perform the steps in the liquid crystal panel manufacturing method described in the embodiments of this application.

[0018] Eighthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, causes the processor to perform the steps in the liquid crystal panel manufacturing method described in the embodiments of this application.

[0019] The aforementioned liquid crystal panel manufacturing method, liquid crystal panel, display device, liquid crystal panel manufacturing system, liquid crystal panel manufacturing apparatus, computer equipment, computer-readable storage medium, and computer program product provide a first substrate and a second substrate. The first substrate includes a plurality of spaced-apart circuit units. The second substrate includes a transparent conductive film. A frame adhesive is continuously coated on the first substrate along a target frame adhesive path to form a plurality of closed frame adhesives, each closed frame adhesive surrounding a corresponding circuit unit. The frame adhesive at each closed frame adhesive injection port is connected to an adjacent closed frame adhesive to form a closure. The first substrate and the second substrate, which form each closed frame adhesive, are aligned and bonded. The transparent conductive film corresponds to the first substrate. The first substrate and the second substrate are cleaved between the injection port and the closure position of each closed frame adhesive, so that each closed frame adhesive forms an opening at the injection port, and crystal is poured through the opening to obtain a plurality of liquid crystal panels. The liquid crystal panel manufacturing method provided in this application continuously applies the frame adhesive along the target frame adhesive path. On the one hand, this avoids the uneven adhesive application caused by repeatedly lifting the needle during the frame adhesive application process. On the other hand, it allows each sealed frame adhesive to form an opening at the injection port after the wafer splitting process, thereby improving the production efficiency of the liquid crystal panel. Attached Figure Description

[0020] Figure 1 This is a flowchart illustrating a method for manufacturing a liquid crystal panel in one embodiment;

[0021] Figure 2 This is a schematic diagram of the enclosed frame adhesive corresponding to each circuit unit in one embodiment;

[0022] Figure 3 This is a schematic diagram of the target frame adhesive path in one embodiment;

[0023] Figure 4 This is a schematic diagram of the target frame adhesive path in another embodiment;

[0024] Figure 5 This is a structural block diagram of a liquid crystal panel manufacturing system in one embodiment;

[0025] Figure 6 This is a structural block diagram of a liquid crystal panel manufacturing apparatus in one embodiment;

[0026] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0028] It should be noted that in the following description, the terms "first, second, and third" are used only to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, and third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0029] The liquid crystal panel manufacturing method provided in this application can be applied to a liquid crystal panel manufacturing system. In one embodiment, such as Figure 1 As shown, a method for manufacturing a liquid crystal panel is provided. Taking the execution of this method by a liquid crystal panel manufacturing system as an example, the method includes the following steps:

[0030] Step 102: Provide a first substrate and a second substrate; the first substrate includes a plurality of spaced-apart circuit units; the second substrate includes a transparent conductive film.

[0031] The first substrate and the second substrate can be different types of substrates, such as the first substrate having higher conductivity than the second substrate and the second substrate having higher light transmittance than the first substrate.

[0032] Optionally, the multiple circuit units included in the first substrate may be multiple circuit units that perform the same function, and the multiple circuit units may be functional circuits corresponding to the liquid crystal panel; the spacing between each circuit unit included in the circuit area is the same.

[0033] Specifically, the spacing between multiple circuit units refers to the fact that the distance between multiple circuit units is the same.

[0034] Specifically, the second substrate includes a transparent conductive film, which is used to improve the conductivity of the second substrate while ensuring that the light transmittance of the second substrate is not affected.

[0035] Step 104: Frame adhesive is continuously applied along the target frame adhesive path on the first substrate to form multiple closed frame adhesives, each of which surrounds the corresponding circuit unit; the frame adhesive at the injection port of each closed frame adhesive is connected to the adjacent closed frame adhesive to form a closure.

[0036] Among them, continuous frame adhesive coating means that the frame adhesive coating is continuous and uninterrupted. That is to say, the frame adhesive coating equipment moves along the target frame adhesive path in one continuous stroke during the continuous frame adhesive coating process. The needle will not be lifted to stop the frame adhesive coating when the moving path of the frame adhesive coating equipment does not match the target frame adhesive path. In other words, the needle will only be lifted to stop the frame adhesive coating when the frame adhesive coating is completed along the target frame adhesive path.

[0037] Specifically, during the continuous application of frame adhesive along the target frame adhesive path on the first substrate, the amount of adhesive applied remains constant, meaning that the amount of frame adhesive applied at each location point on the target frame adhesive path is the same, except for the intersection points.

[0038] Specifically, since multiple closed-type frame adhesives are formed by continuous application of frame adhesive along the target frame adhesive path, the frame adhesive at each closed-type frame adhesive injection port is connected with the adjacent closed-type frame adhesive to form a closed loop, which refers to the continuous path formed by the connection of each closed-type frame adhesive to form a closed loop.

[0039] Specifically, the liquid crystal panel manufacturing system used in the liquid crystal panel manufacturing method provided in this application embodiment includes a frame adhesive coating device. The liquid crystal panel manufacturing system pre-sets a target frame adhesive path for the frame adhesive coating device, so that the frame adhesive coating device moves along the target frame adhesive path on the first substrate while continuously coating the frame adhesive.

[0040] Specifically, during the continuous coating of frame adhesive along the target frame adhesive path on the first substrate, the angle of each corner is greater than or equal to 0. Let R represent the corner angle during the continuous coating of frame adhesive, then R≥0.

[0041] Specifically, the injection port serves to guide the liquid crystal into the sealant during the crystal filling process after the opening is formed. The first side of the injection port is close to its corresponding circuit unit, and the second side of the injection port is away from its corresponding circuit unit but close to its adjacent circuit unit. In other words, the second side of the injection port is close to the closure formed by connecting with the adjacent closed sealant.

[0042] Optionally, before continuously coating the frame adhesive along the target frame adhesive path on the first substrate, a first alignment film and a second alignment film may be respectively disposed on the first substrate and the second substrate, and the first alignment film and the second alignment film may be aligned respectively, and then the frame adhesive may be continuously coated along the target frame adhesive path on the first alignment film after alignment treatment; furthermore, the first alignment film and the second alignment film may be polyimide film or silicon dioxide film.

[0043] Specifically, the frame adhesive is continuously applied along the target frame adhesive path on the first substrate to form multiple closed frame adhesives, thereby avoiding the need for repeated needle lifting during the frame adhesive application process, thus avoiding uneven adhesive application. This improves both the production efficiency and yield of the LCD panel.

[0044] Step 106: Align and bond the first substrate and the second substrate to form the sealed frame adhesive; the transparent conductive film corresponds to the first substrate.

[0045] The first substrate can have the same size as the second substrate, which makes it easier to ensure that the positions of the first substrate and the second substrate correspond perfectly when they are aligned and bonded together.

[0046] Specifically, the transparent conductive film corresponds to the first substrate, meaning that the transparent conductive film is disposed on the side of the second substrate that is closer to the first substrate.

[0047] Step 108: The first substrate and the second substrate are split between the injection port and the closed position of each sealed frame adhesive, so that each sealed frame adhesive forms an opening at the injection port, and crystal is poured through the opening to obtain multiple liquid crystal panels.

[0048] The position where the first substrate and the second substrate are split is located between the injection port of each closed frame adhesive and the closing position, and the splitting position and the closing position are located at different positions, so that after the splitting process, each closed frame adhesive can form an opening at the injection port, and the side of the closed frame adhesive adjacent to each closed frame adhesive away from the injection port remains closed.

[0049] Optionally, the position for cleaving the first substrate and the second substrate can be a position at a preset distance from the closed intersection point in the direction from the injection port.

[0050] Specifically, each liquid crystal panel includes a first substrate subunit and a second substrate subunit that are arranged opposite to and spaced apart, and a liquid crystal layer disposed between the first substrate and the second substrate. Each circuit unit is correspondingly disposed on the first substrate subunit of each liquid crystal panel.

[0051] In the above-described liquid crystal panel manufacturing method, a first substrate and a second substrate are provided. The first substrate includes a plurality of spaced-apart circuit units. The second substrate includes a transparent conductive film. A sealant is continuously coated onto the first substrate along a target sealant path to form a plurality of closed sealants, each closed sealant surrounding a corresponding circuit unit. The sealant at the injection port of each closed sealant is connected to the adjacent closed sealant to form a closure. The first substrate and the second substrate, which form the closed sealants, are aligned and bonded. The transparent conductive film corresponds to the first substrate. The first and second substrates are split between the injection port and the closure position of each closed sealant, so that each closed sealant forms an opening at the injection port, and crystal is poured through the opening to obtain a plurality of liquid crystal panels. The liquid crystal panel manufacturing method provided in this application, by continuously coating the sealant along the target sealant path, avoids the uneven sealant application caused by repeated needle lifting during the sealant coating process. Furthermore, after the splitting process, each closed sealant forms an opening at the injection port, thereby improving the production efficiency of the liquid crystal panel.

[0052] In one embodiment, a first dicing line along a first direction and a second dicing line along a second direction are formed on the first substrate. The first dicing line and the second dicing line intersect, and each circuit unit is surrounded in the target area formed by the first dicing line and the second dicing line. The second dicing line is located between the injection port and the closed position of each closed frame adhesive.

[0053] The first and second substrates are split between the injection port and the closed position of each sealed frame adhesive, including:

[0054] The first substrate and the second substrate are cut and split based on the first cutting line and the second cutting line.

[0055] The first direction can be from left to right or from right to left, meaning the first direction is the row direction; similarly, the second direction can be from top to bottom or from bottom to top, meaning the second direction is the column direction.

[0056] Specifically, the target regions formed by the first and second cutting lines are similar in shape to the circuit units, and the area of ​​the target region is larger than the area of ​​the circuit unit. When the spacing between the circuit units is the same, the spacing between the first cutting lines is the same, and similarly, the spacing between the second cutting lines is also the same.

[0057] For example, such as Figure 2 As shown, a first dicing line along a first direction and a second dicing line along a second direction are formed on the first substrate; the first substrate includes a plurality of circuit units, and each circuit unit is surrounded by a target area formed by the first dicing line and the second dicing line; the second dicing line is located between the injection port and the closed position of each closed frame adhesive.

[0058] Optionally, the second cutting line is located between the injection port of each closed frame adhesive and the closed position. This can mean that the second cutting line is located between the first side of the injection port of each closed frame adhesive and the closed position, or it can mean that the second side of the injection port of each closed frame adhesive crosses the first side of the nearest second cutting line and intersects with the adjacent closed frame adhesive to form a closure.

[0059] Obviously, since the openings of each sealed frame adhesive are formed at the second cutting line position only after the cleaving process, the process of cutting the first and second substrates based on the first and second cutting lines can avoid the phenomenon of moisture entering the cutting gaps and causing a decrease in the production yield of the LCD panel. In addition, by placing the second cutting line between the injection port and the closed position of each sealed frame adhesive, not only can the cleaving be carried out using the second cutting line, but the injection port of the frame adhesive can also be set using the second cutting line, so as to reduce the number of cuttings and reduce the occurrence of edge chipping during multiple cutting processes, optimize the cutting steps, and improve cutting efficiency and product yield.

[0060] Optionally, the parallel line corresponding to the extension direction of the injection port of each closed frame adhesive can be perpendicular to the second cutting line.

[0061] Specifically, one side of the circuit unit away from its injection port is parallel to the second cutting line.

[0062] Specifically, since the second cutting line is located between the injection port and the closed position of each enclosed frame adhesive, when the first substrate is cut based on the second cutting line, each enclosed frame adhesive will be cut open at the second cutting line position, thereby forming an opening in each enclosed frame adhesive at the second cutting line position.

[0063] Specifically, the openings formed by each closed frame adhesive at the second cutting line position intersect with the second cutting line, and there are two intersection points.

[0064] Optionally, the target frame adhesive path is such that the openings formed by each closed frame adhesive at the second cutting line position are of the same size.

[0065] Optionally, the first cutting line and the second cutting line intersect, or the first cutting line may be perpendicular to the second cutting line.

[0066] Optionally, the position for cleaving the first substrate and the second substrate can be a position located at a predetermined distance away from the closed intersection point along the first direction.

[0067] In this embodiment, a first cutting line along a first direction and a second cutting line along a second direction are formed on the first substrate. Each circuit unit is surrounded in the target area formed by the first and second cutting lines. The second cutting line is located between the injection port and the closed position of each enclosed frame adhesive. Thus, the first substrate and the second substrate are subjected to a slitting process. Specifically, the first substrate and the second substrate are cut and slitting based on the first and second cutting lines. After the cutting and slitting process, each enclosed frame adhesive can form an opening at the injection port, which significantly improves the production efficiency of the liquid crystal panel.

[0068] In one embodiment, before or after aligning and bonding the first substrate and the second substrate to form the respective closed-frame adhesive, the method further includes:

[0069] A first dicing line along a first direction and a second dicing line along a second direction are formed on a first substrate.

[0070] Optionally, forming a first cutting line along a first direction and a second cutting line along a second direction on the first substrate can be done before aligning and bonding the first substrate forming each enclosed frame adhesive with the second substrate, or it can be done after aligning and bonding the first substrate forming each enclosed frame adhesive with the second substrate.

[0071] In this embodiment, by forming a first cutting line along a first direction and a second cutting line along a second direction on the first substrate before or after aligning and bonding the first substrate and the second substrate to form each encapsulated frame adhesive, it is possible to form an opening at the injection port of each encapsulated frame adhesive based on the first cutting line and the second cutting line, thereby significantly improving the production efficiency of the liquid crystal panel.

[0072] Preferably, before the first substrate and the second substrate that form the sealing frame adhesive are aligned and bonded, and before the sealing frame adhesive is applied, a first cutting line along the first direction and a second cutting line along the second direction are formed on the first substrate. This ensures the integrity of the sealing frame adhesive when it is applied later, and further avoids the risk of moisture seepage during the cutting and splitting process.

[0073] In one embodiment, two connected frame adhesive traces are formed at the closed intersection between two adjacent closed frame adhesives, wherein at least one frame adhesive trace is partially curved, arc-shaped, or straight.

[0074] In one embodiment, the plurality of circuit units are arranged along a first direction, and sealant is continuously applied to the first substrate along a target sealant path to form a closed sealant for each circuit unit, including:

[0075] In the first direction, the frame adhesive is continuously applied to the injection port position of the first circuit unit along the first direction. When the adhesive is applied to the side of the last circuit unit away from the injection port in the first direction, the frame adhesive is continuously applied in the opposite direction of the first direction until the injection port position is reached, so that the frame adhesive surrounds each circuit unit and the frame adhesive corresponding to two adjacent circuit units forms a closure.

[0076] In this context, the first-end circuit unit in the first direction refers to the circuit unit with the maximum distance between the injection port and other circuit units; the last-end circuit unit in the first direction refers to the circuit unit with the maximum distance between itself and the first-end circuit unit in the first direction.

[0077] Specifically, during the continuous application of frame adhesive in the opposite direction of the first direction, the injection port corresponding to each closed frame adhesive crosses the first side of the second cutting line closest to it and intersects with the adjacent closed frame adhesive to form a closure, thereby forming a closure between the frame adhesives corresponding to two adjacent circuit units.

[0078] Specifically, the frame adhesive is placed around each circuit unit, meaning that each circuit unit is enclosed in a closed frame adhesive.

[0079] Optionally, the injection port of the first-end circuit unit in the first direction may or may not be closed, and no restriction is imposed here.

[0080] In one embodiment, when the injection port of the first-end circuit unit in the first direction is not closed, a closure is formed between the frame adhesives corresponding to two adjacent circuit units, including: a closure is formed between the frame adhesives corresponding to two other adjacent circuit units besides the first-end circuit in the first direction.

[0081] In this embodiment, continuous frame adhesive coating is performed on the first substrate along a target frame adhesive path. Specifically, frame adhesive is first continuously coated along the first direction at the injection port position of the first circuit unit. When coating reaches the side of the last circuit unit away from the injection port in the first direction, frame adhesive is continuously coated in the opposite direction until the injection port position is reached, thereby forming closed frame adhesives surrounding each circuit unit. By setting a target frame adhesive path and first continuously coating frame adhesive along the first direction, and then continuously coating frame adhesive in the opposite direction, the production efficiency and yield of the liquid crystal panel are improved while ensuring a short target frame adhesive path.

[0082] In one embodiment, during the continuous coating process of the frame adhesive, the frame adhesive is continuously coated along a first direction on the first side and the second side of two adjacent circuit units, and the frame adhesive is continuously coated in the opposite direction of the first direction on the first side and the second side of two adjacent circuit units, wherein the first side and the second side of the circuit unit are opposite to each other.

[0083] The first side and the second side of the circuit unit are based on the second direction. For example, the first side of the circuit unit can be the upper side or the lower side of the circuit unit. When the first side of the circuit unit is the upper side of the circuit unit, the second side of the circuit unit is the lower side of the circuit unit, and vice versa. This will not be elaborated here.

[0084] For example, the first side of the circuit unit is the lower side of the circuit unit, the first direction is from right to left, and the opposite direction of the first direction is from left to right, such as... Figure 3 As shown, the first circuit unit in the first direction is circuit unit 1, and the last circuit unit in the first direction is circuit unit 5. Between circuit unit 1 and circuit unit 5 are circuit units 2, 3, and 4. At the injection port position on the lower side of circuit unit 1, the sealant is continuously applied from right to left, then applied to the upper side of circuit unit 2, then to the lower side of circuit unit 3, and so on. When applying to the side of circuit unit 5 away from the injection port, the sealant is continuously applied from left to right to cover the upper side of circuit unit 5, then applied to the lower side of circuit unit 4, then to the upper side of circuit unit 3, and so on, until the injection port position on the upper side of circuit unit 1 is reached. At this point, the continuous application of sealant along the target sealant path is completed, forming a closed sealant corresponding to the distribution of circuit units 1-5.

[0085] Based on the above, Figure 3 As can be seen from the exemplary embodiment shown, the target frame adhesive path presents a cross-movement path. Specifically, the target frame adhesive path presents a cross-movement path with alternating first and second sides (i.e., one up and one down or one down and one up). That is to say, during the continuous coating of the frame adhesive, the closed frame adhesive of two adjacent circuit units is continuously coated by a unidirectional different side mode. When the number of circuit units is odd, the coating direction of the first circuit unit and the last circuit unit in the first direction is the same. Conversely, when the number of circuit units is even, the coating direction of the first circuit unit and the last circuit unit in the first direction is opposite.

[0086] In this embodiment, during the continuous coating process of the frame adhesive, the frame adhesive is continuously coated along the first direction on the first side and the second side of two adjacent circuit units, and also continuously coated along the opposite direction of the first direction on the first side and the second side of two adjacent circuit units. That is to say, the target frame adhesive path is a cross-moving path that alternates between the first side and the second side. This ensures that the continuous coating of the frame adhesive avoids repeated needle lifting by the frame adhesive coating equipment, while also ensuring that the closed frame adhesive can surround each circuit unit. In turn, this improves the production efficiency and yield of the LCD panel while ensuring that the target frame adhesive path is short.

[0087] In one embodiment, during the continuous coating process of the frame adhesive, the frame adhesive is continuously coated on the first side of each circuit unit along a first direction, and on the second side of each circuit unit in the opposite direction to the first direction.

[0088] Specifically, during the continuous application of sealant on the second side of each circuit unit in the opposite direction to the first direction, the sealant applied to the second side of each circuit unit intersects with the sealant applied to the first side of each circuit unit; furthermore, the sealant applied to the second side of each circuit unit intersects with the sealant applied to the first side of each circuit unit at the first side of the second cutting line closest to its injection port, and intersects with the adjacent closed sealant located on the first side of the second cutting line to form a closure.

[0089] For example, the first side of the circuit unit is the lower side of the circuit unit, the first direction is from right to left, and the opposite direction of the first direction is from left to right, such as... Figure 4 As shown, the first circuit unit in the first direction is circuit unit 1, and the last circuit unit in the first direction is circuit unit 5. Between circuit unit 1 and circuit unit 5 are circuit units 2, 3, and 4. At the injection port position on the lower side of circuit unit 1, the sealant is continuously applied from right to left, then applied to the lower side of circuit unit 2, then to the lower side of circuit unit 3, and so on. When the sealant is applied to the side of circuit unit 5 away from the injection port, the sealant application to the lower side of all circuit units is completed. Therefore, the sealant is continuously applied from left to right to cover the upper side of circuit unit 5, then to the upper side of circuit unit 4, then to the upper side of circuit unit 3, and so on, until the injection port position on the upper side of circuit unit 1 is reached. At this point, the sealant application to the upper side of all circuit units is completed. Thus, the continuous application of sealant along the target sealant path is completed, forming a closed sealant corresponding to the distribution of circuit units 1-5.

[0090] Based on the above, Figure 4 As can be seen from the exemplary embodiment shown, during the continuous coating process of the sealant, the sealant of adjacent circuit units is continuously coated in a unidirectional, same-side mode. Therefore, based on the above... Figure 3 The exemplary embodiments shown and as described above Figure 4 As can be seen from the exemplary embodiment shown, during the continuous coating process of the frame adhesive, the closed frame adhesive of two adjacent circuit units is continuously coated by a unidirectional different side mode or a unidirectional same side mode.

[0091] In this embodiment, during the continuous coating process of the frame adhesive, the frame adhesive is continuously coated on the first side of each circuit unit along the first direction, and on the second side of each circuit unit along the opposite direction of the first direction. That is to say, the target frame adhesive path is a unidirectional same-side movement path. This ensures that the continuous coating of the frame adhesive avoids repeated needle lifting of the frame adhesive coating equipment, while also ensuring that the closed frame adhesive can surround each circuit unit. In turn, while ensuring that the target frame adhesive path is short, the production efficiency and yield of the LCD panel are improved.

[0092] In one embodiment, the injection ports of each closed frame adhesive are oriented in the same direction.

[0093] Optionally, the orientation of the injection ports corresponding to each closed frame adhesive can be uniformly horizontal to the right or uniformly horizontal to the left; there is no restriction here.

[0094] In this embodiment, the injection ports of each closed frame adhesive are oriented in the same direction. Thus, the shortness of the target frame adhesive path is ensured by the regular arrangement of the closed frame adhesives. This not only improves the production efficiency of the LCD panel, but also significantly reduces the amount of adhesive applied in the continuous coating process.

[0095] In one embodiment, the alignment and bonding of the first substrate and the second substrate forming the sealed frame adhesive includes:

[0096] Under vacuum conditions, the first substrate and the second substrate, which form the sealed frame adhesive, are aligned and bonded together.

[0097] In this embodiment, the alignment and bonding of the first substrate and the second substrate forming each sealing frame adhesive is carried out under vacuum conditions. By completely eliminating air gas, the gas expansion phenomenon during the thermal curing of the sealing frame adhesive after the first substrate and the second substrate forming each sealing frame adhesive are bonded can be avoided, which would lead to the collapse of the sealing frame adhesive, thereby ensuring the production yield of the LCD panel.

[0098] In one embodiment, the first substrate is a silicon substrate, the second substrate is an ITO glass substrate, and the circuit unit is a circuit unit included in the LCoS liquid crystal panel.

[0099] ITO stands for Indium tin oxide, which is an N-type oxide semiconductor.

[0100] Specifically, the second substrate includes an ITO film, which typically has low resistivity and high transmittance.

[0101] In this embodiment, the first substrate is a silicon substrate including multiple circuit units, and the second substrate is an ITO glass substrate with an ITO thin film formed on its first surface. Since the silicon substrate includes multiple circuit units and the ITO glass substrate has an ITO thin film formed on it, the resulting multiple LCoS liquid crystal panels are thus ensured to have good conductivity.

[0102] In one embodiment, the thickness of the first substrate is 0.1-0.8 mm.

[0103] In one embodiment, the thickness of the second substrate is 0.1-1.1 mm.

[0104] In one embodiment, the aforementioned sealing adhesive is at least one of a UV-curable adhesive and a thermosetting adhesive.

[0105] The main component of UV-cured adhesive is acrylic resin, while the main component of thermosetting adhesive is epoxy resin.

[0106] The application process of the above-mentioned liquid crystal panel manufacturing method is illustrated below with a detailed embodiment. Assuming that the first substrate is a silicon substrate and the second substrate is an ITO glass substrate, the first substrate includes multiple circuit units arranged along a first direction. The specific application process is as follows:

[0107] A first substrate and a second substrate are provided; a first dicing line along a first direction and a second dicing line along a second direction are formed on the first substrate; the first substrate includes a plurality of circuit units, and each circuit unit is surrounded in a target area formed by the first dicing line and the second dicing line; the second substrate includes a transparent conductive film.

[0108] In the first direction, the sealant is continuously applied to the injection port of the first circuit unit along the first direction. When the sealant is applied to the side of the last circuit unit away from the injection port in the first direction, the sealant is continuously applied in the opposite direction until the injection port is reached, so that the sealant surrounds each circuit unit and the sealant corresponding to two adjacent circuit units forms a closure. The second cutting line is located between the injection port and the closure position of each closed sealant. That is to say, the injection port corresponding to each closed sealant crosses the first side of the second cutting line closest to it and intersects with the adjacent closed sealant to form a closure. The injection ports corresponding to each closed sealant have the same orientation.

[0109] In the continuous coating process of the frame adhesive, the frame adhesive is continuously coated on the first side and the second side of two adjacent circuit units along the first direction, and on the first side and the second side of two adjacent circuit units in the opposite direction of the first direction, with the first side and the second side of the circuit unit facing each other; or, in the continuous coating process of the frame adhesive, the frame adhesive is continuously coated on the first side of each circuit unit along the first direction, and on the second side of each circuit unit in the opposite direction of the first direction.

[0110] Under vacuum conditions, the first substrate and the second substrate, which form the sealed frame adhesives, are aligned and bonded together; the transparent conductive film corresponds to the first substrate.

[0111] Based on the first and second cutting lines, the first and second substrates are cut and split, so that each enclosed frame adhesive forms an opening at the second cutting line position, and crystal is poured through the opening to obtain multiple LCoS liquid crystal panels.

[0112] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0113] In one embodiment, a liquid crystal panel is provided, which is obtained by some or all of the steps of the liquid crystal panel manufacturing method described in any method embodiment of the present application.

[0114] In one embodiment, a display device is provided, the display device including a plurality of liquid crystal panels as described in the embodiments of this application.

[0115] like Figure 5 As shown, in one embodiment, a liquid crystal panel manufacturing system is provided, including: a processor, a memory, and a communication interface. The memory stores one or more programs, which are executed by the processor. The programs include instructions for performing some or all of the steps of the liquid crystal panel manufacturing method as described in any method embodiment of this application.

[0116] like Figure 6 As shown, in one embodiment, a liquid crystal panel manufacturing apparatus is provided, applied to a liquid crystal panel manufacturing system. The liquid crystal panel manufacturing system is used to manufacture liquid crystal panels. The liquid crystal panel manufacturing apparatus includes a processing unit and a communication unit.

[0117] The processing unit is used to execute some or all of the steps of the liquid crystal panel manufacturing method described in any of the method embodiments of this application; the communication unit is used to receive data input to the liquid crystal panel manufacturing apparatus from the outside and send the data to the processing unit, so that the processing unit executes some or all of the steps of the liquid crystal panel manufacturing method described in any of the method embodiments; further, the liquid crystal panel manufacturing apparatus may also include a storage unit, which is used to store the program code and data of the terminal. The processing unit may be a processor, the communication unit may be a transceiver or a touch screen, and the storage unit may be a memory.

[0118] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 7 As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage medium. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a method for manufacturing a liquid crystal panel. The display unit of the computer device is used to form a visually visible image. It can be a display screen, a projection device, or a virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0119] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0120] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.

[0121] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0122] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.

[0123] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

[0124] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0125] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0126] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for manufacturing a liquid crystal panel, characterized in that, The method includes: A first substrate and a second substrate are provided; the first substrate includes a plurality of spaced-apart circuit units; the second substrate includes a transparent conductive film. A frame adhesive is continuously applied along the target frame adhesive path on the first substrate to form a plurality of closed frame adhesives, each of which surrounds a corresponding circuit unit; the frame adhesive at the injection port of each closed frame adhesive is connected to the adjacent closed frame adhesive to form a closure. The first substrate and the second substrate, which form the closed frame adhesive, are aligned and bonded together; the transparent conductive film corresponds to the first substrate. The first substrate and the second substrate are split between the injection port and the closed position of each of the sealed frame adhesives, so that each of the sealed frame adhesives forms an opening at the injection port, and crystal is poured through the opening to obtain multiple liquid crystal panels.

2. The method according to claim 1, characterized in that, A first cutting line along a first direction and a second cutting line along a second direction are formed on the first substrate. The first cutting line and the second cutting line intersect. Each of the circuit units is surrounded in the target area formed by the first cutting line and the second cutting line. The second cutting line is located between the injection port and the closed position of each of the closed frame adhesives. The step of performing a slicing process on the first substrate and the second substrate between the injection port and the closed position of each of the closed frame adhesives includes: Based on the first cutting line and the second cutting line, the first substrate and the second substrate are cut and diced.

3. The method according to claim 2, characterized in that, Before aligning and bonding the first substrate and the second substrate, which form the respective closed-frame adhesives, the method further includes: A first dicing line along a first direction and a second dicing line along a second direction are formed on the first substrate.

4. The method according to claim 1, characterized in that, Two connected frame adhesive traces are formed at the closed intersection between two adjacent closed frame adhesives, wherein at least one of the frame adhesive traces is a curve, an arc, or a straight line.

5. The method according to claim 1, characterized in that, The plurality of circuit units are arranged along a first direction, and the continuous application of sealant along the target sealant path on the first substrate to form a plurality of closed sealants includes: In the first direction, the frame adhesive is continuously applied to the injection port position of the first circuit unit along the first direction. When the adhesive is applied to the side of the last circuit unit away from the injection port in the first direction, the frame adhesive is continuously applied in the opposite direction of the first direction until the injection port position is reached, so that the frame adhesive surrounds each circuit unit and the frame adhesive corresponding to two adjacent circuit units forms a closure.

6. The method according to claim 5, characterized in that, During the continuous coating process of the frame adhesive, the frame adhesive is continuously coated on the first side and the second side of two adjacent circuit units along the first direction, and on the first side and the second side of two adjacent circuit units in the opposite direction of the first direction, wherein the first side and the second side of the circuit unit are opposite to each other.

7. The method according to claim 5, characterized in that, During the continuous coating process of the frame adhesive, the frame adhesive is continuously coated on the first side of each circuit unit along the first direction, and on the second side of each circuit unit along the opposite direction of the first direction.

8. The method according to any one of claims 1-7, characterized in that, The first substrate is a silicon substrate, and the second substrate is an ITO glass substrate; the circuit unit is a circuit unit included in the LCoS liquid crystal panel.

9. A liquid crystal panel, characterized in that, The liquid crystal panel is obtained by the liquid crystal panel manufacturing method as described in any one of claims 1-8.

10. A display device, characterized in that, The display device includes a plurality of liquid crystal panels as described in claim 9.

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