Solid state relay and circuit system
By implementing solid-state relays using electromagnetic isolation technology, the limitations of existing solid-state relay applications have been solved. This enables reliable and efficient electromagnetic coupling transmission of signals, reduces costs and applicability, and improves the overall performance of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SESATA SCI & TECH CHANGZHOU CO LTD
- Filing Date
- 2024-12-19
- Publication Date
- 2026-06-23
Smart Images
Figure CN122268339A_ABST
Abstract
Description
Technical Field
[0001] This application generally relates to the field of solid-state relays, and in particular to a solid-state relay and circuit system. Background Technology
[0002] Various known mechanical switches exist for connecting and disconnecting power supply circuits from a power source to a load. These mechanical switches, such as electromagnetic relays, are typically operated manually to perform switching operations. In recent years, solid-state relays (SSRs) have become increasingly popular in industry. Solid-state relays operate by controlling the switching states of semiconductor switching devices to turn circuits on and off. Therefore, compared to traditional mechanical switches, solid-state relays offer higher performance and / or reliability.
[0003] Currently, known solid-state relays use optocoupler technology to achieve signal isolation transmission. However, optocoupler-based isolation has a series of drawbacks: First, the LEDs in the optocoupler will experience light decay over time, leading to a decrease in output signal strength and affecting the overall performance of the product; second, the performance of the optocoupler is affected by temperature, and its transmission efficiency and response speed may decrease in high or low temperature environments; third, the cost of optocouplers is high, resulting in a higher manufacturing cost for solid-state relays; fourth, different types of optocouplers and circuit topologies are required for DC and AC applications, limiting the applicability of optocouplers.
[0004] Therefore, there is an urgent need for a new solid-state relay to overcome the shortcomings and deficiencies of existing technologies. Furthermore, it is also desirable to maintain the good switching performance of solid-state relays. Summary of the Invention
[0005] Therefore, the purpose of this application is to provide a solid-state relay and circuit system that can overcome at least one defect and deficiency in the prior art, thereby realizing a solid-state relay based on electromagnetic isolation while maintaining good switching performance.
[0006] According to a first aspect of the present invention, a solid-state relay is provided, characterized in that the solid-state relay comprises: an input-side circuit including a carrier generator and a modulator; an output-side circuit including a demodulator and a semiconductor switch; and an isolation converter module configured to electromagnetically isolate the input-side circuit and the output-side circuit, wherein the modulator is configured to receive a control signal and modulate a carrier generated by the carrier generator by means of the control signal to generate a modulated signal and transmit the modulated signal to the isolation converter module, wherein the demodulator is configured to receive the modulated signal output by the isolation converter module and demodulate the control signal from the modulated signal so as to control the switching state of the semiconductor switch based on the control signal.
[0007] In some embodiments, the isolation converter module includes an input-side converter, an isolation transformer, and an output-side converter.
[0008] In some embodiments, the input-side converter is configured as a DC / AC converter, which is configured to receive a control signal and convert the control signal into a first AC signal and transmit the first AC signal to the primary side of an isolation transformer.
[0009] In some embodiments, the isolation transformer is configured to transform a first AC signal on the primary side into a second AC signal on the secondary side of the isolation transformer.
[0010] In some embodiments, the output-side converter is configured as an AC / DC converter, which is configured to receive a second AC signal and convert the second AC signal into a DC signal.
[0011] In some embodiments, the input-side converter is provided with a first control unit, which is configured to apply a switching signal to the semiconductor switch of the input-side converter.
[0012] In some embodiments, the output-side converter is provided with a second control unit, which is configured to apply a switching signal to the semiconductor switch of the output-side converter.
[0013] In some embodiments, the first control unit is configured to adjust the frequency and / or duty cycle of the switching signal in order to regulate the generated first AC signal.
[0014] In some embodiments, the second control unit is configured to adjust the frequency and / or duty cycle of the switching signal in order to regulate the generated DC signal.
[0015] In some embodiments, the modulator is electrically connected to the primary side of the isolation transformer and is configured to transmit a modulated signal to the primary side of the isolation transformer.
[0016] In some embodiments, the isolation transformer is configured to transform a modulated signal on the primary side into a modulated signal on the secondary side.
[0017] In some embodiments, the secondary side of the isolation transformer is electrically connected to the demodulator and is configured to transmit the modulated signal to the demodulator.
[0018] In some embodiments, the isolation converter module has a first input interface for receiving a modulated signal from a modulator, the first input interface being connected to the primary side of an isolation transformer without passing through an input-side converter within the scope of the isolation converter module.
[0019] In some embodiments, the isolation converter module has a first output interface for outputting a modulated signal on the secondary side, which is connected to the secondary side of the isolation transformer without passing through an output-side converter within the scope of the isolation converter module, so as to transmit the modulated signal on the secondary side to the demodulator.
[0020] In some embodiments, the input-side circuitry includes an input processing module, which includes a first shaping circuit configured to shape the input signal into a desired control signal.
[0021] In some embodiments, the first shaping circuit includes one or more of an amplifier circuit, a rectifier circuit, a filter circuit, a limiting circuit, a waveform correction circuit, an overcurrent protection circuit, an undervoltage protection circuit, and an overtemperature protection circuit.
[0022] In some embodiments, the solid-state relay includes an output processing module electrically connected to the output-side converter, demodulator, and semiconductor switch of the isolation converter module. The output processing module is configured to generate an output signal in response to a DC signal fed from the output-side converter and a demodulated control signal from the demodulator, for applying the output signal to the semiconductor switch.
[0023] In some embodiments, the output processing module includes a second shaping circuit configured to shape the control signal demodulated from the demodulator into a desired output signal.
[0024] In some embodiments, the first shaping circuit includes one or more of an amplifier circuit, a filter circuit, a limiting circuit, a waveform correction circuit, an overcurrent protection circuit, an undervoltage protection circuit, and an overtemperature protection circuit.
[0025] In some embodiments, the control signal is configured as a square wave pulse signal.
[0026] In some embodiments, the falling edge time of the control signal demodulated by the demodulator is between tens of nanoseconds and tens of microseconds.
[0027] In some embodiments, the semiconductor switch is configured as a MOSFET, IGBT, BJT, SCR, or Triac.
[0028] According to a second aspect of the present invention, a circuit system is provided, characterized in that the circuit system includes a load circuit, the load circuit including a load and a power supply for supplying power to the load, wherein the load circuit further includes a solid-state relay according to some embodiments of the present application, wherein a semiconductor switch of the solid-state relay is connected in the load circuit to close or disconnect the load circuit. Attached Figure Description
[0029] The present application will now be described in more detail with reference to the accompanying drawings and specific embodiments. The schematic drawings are briefly described below:
[0030] Figure 1 A schematic block diagram of a solid-state relay according to some embodiments of this application is shown;
[0031] Figure 2 It shows Figure 1 A schematic circuit topology diagram of a solid-state relay;
[0032] Figure 3 A schematic block diagram of a solid-state relay according to some embodiments of this application is shown. Detailed Implementation
[0033] The present application will now be described with reference to the accompanying drawings, which illustrate several embodiments of the present application. However, it should be understood that the present application can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure of the present application more complete and to fully illustrate the scope of protection of the present application to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide more additional embodiments.
[0034] In the various embodiments described, the same reference numerals or element names are used for the same elements, and the disclosure contained throughout the specification can be applied semantically to elements with the same reference numerals or element names. Furthermore, in the various embodiments, the number, implementation, and / or arrangement of elements are not limited to the examples shown, but other numbers, implementations, and / or arrangements can be selected according to actual needs.
[0035] In this document, spatial relation terms such as "up," "down," "left," "right," "front," "back," "high," and "low" are used to describe the relationship between one feature and another in the accompanying drawings. It should be understood that spatial relation terms include not only the orientation shown in the drawings but also different orientations of the device during use or operation. For example, when the device in the drawings is inverted, a feature previously described as "below" other features can now be described as "above" other features. The device can also be oriented in other ways (rotated 90 degrees or in other orientations), in which case the relative spatial relationships will be interpreted accordingly.
[0036] In this document, the term “A or B” includes both “A and B” and “A or B”, rather than exclusively including only “A” or only “B”, unless otherwise specified.
[0037] In this document, the terms "illustrative" or "exemplary" mean "used as an example, instance, or illustration," and not as a "model" to be precisely copied. Any implementation described herein by example is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, this application is not limited to any stated or implied theory given in the foregoing technical field, background art, summary of the invention, or detailed description.
[0038] In this document, the term “substantially” means any minor variation caused by defects in design or manufacturing, tolerances of devices or components, environmental influences and / or other factors.
[0039] In this article, the term "part" can refer to any proportion. For example, it can be greater than 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, or 90%.
[0040] Additionally, terms such as “first,” “second,” etc., may be used in this document for reference purposes only and are not intended to be limiting. For example, unless the context clearly indicates otherwise, the words “first,” “second,” and other such numerical terms relating to structures or elements do not imply order or sequence.
[0041] This application proposes a solid-state relay based on electromagnetic isolation, thereby allowing signal and energy transmission via electromagnetic coupling. The following describes some exemplary embodiments of this application in detail with reference to the accompanying drawings.
[0042] Reference Figure 1 and 2 The diagram shows a schematic block diagram of a solid-state relay 100 according to some embodiments of the present application. The solid-state relay 100 can be deployed in a circuit system 200, which may include a load circuit, which may include a load LD, a power supply V for supplying power to the load LD, and the solid-state relay 100, wherein a semiconductor switch S1 of the solid-state relay 100 may be connected in the load circuit to close or disconnect the load circuit.
[0043] like Figure 1 As shown, the solid-state relay 100 may include an input-side circuit 10, an isolation converter module 30, and an output-side circuit 20. The isolation converter module 30 may be configured to isolate the input-side circuit 10 and the output-side circuit 20 from each other by electromagnetic isolation and to transmit signals and energy between the input-side circuit 10 and the output-side circuit 20 by electromagnetic coupling.
[0044] The input-side circuit 10 can receive an input signal IS from the outside, which indicates the switching state of the solid-state relay 100, that is, the semiconductor switch S1 of the solid-state relay 100 should be turned on or off to close or disconnect the load circuit. In some embodiments, the input signal IS can be transmitted to the input-side circuit 10 of the solid-state relay 100 via a communication line through a host control device. In some embodiments, the input signal IS can be transmitted to the input-side circuit 10 of the solid-state relay 100 by manual operation.
[0045] In some improved embodiments, the input-side circuitry 10 may further include an input processing module 13, which may be configured to receive an input signal IS and process it into a control signal CS. To allow reliable signal transmission within the solid-state relay 100, the input processing module 13 may include a first shaping circuit configured to shape the input signal IS into the desired control signal CS. In some embodiments, the shaped control signal CS may be configured as a DC signal, for example, a square wave pulse signal, conforming to predetermined parameters in terms of signal amplitude, rise time, and / or fall time. It should be understood that the input processing module 13, or the first shaping circuit, is not essential. Especially when the input signal IS already conforms to the specified parameters, the control signal CS may substantially correspond to the input signal IS.
[0046] The first shaping circuit is a type of circuit used to process or change the waveform of a signal, primarily to transform the signal into a form more suitable for subsequent processing or transmission. In some embodiments, the first shaping circuit may include an amplifier circuit to increase the amplitude of the signal for easier subsequent processing, and common amplifier circuits include common-emitter amplifiers, common-base amplifiers, and common-collector amplifiers. Alternatively or additionally, the first shaping circuit may include a rectifier circuit to convert AC signals into DC signals, and may include, for example, half-wave rectifier circuits and full-wave rectifier circuits, commonly implemented with diodes. Alternatively or additionally, the first shaping circuit may include a filter circuit to remove unwanted frequency components and retain the desired signal, such as low-pass filters, high-pass filters, band-pass filters, and band-stop filters. Alternatively or additionally, the first shaping circuit may include a limiting circuit to limit the amplitude of the signal to a certain range, preventing the signal from exceeding the desired maximum value, typically implemented using diodes. Alternatively or additionally, the first shaping circuit may include a waveform correction circuit to make the signal waveform more ideal, commonly used for shaping pulse signals to improve the rise time and / or fall time of the signal. Additionally or alternatively, the first shaping circuit may include an overcurrent protection circuit, an undervoltage protection circuit, and / or an overtemperature protection circuit to protect / shut down the circuit when the current is too high or below the voltage threshold or above the temperature threshold.
[0047] In some embodiments, when the input signal IS is a DC signal, the input processing module 13 can be configured to process the input signal IS into a substantially square wave pulse signal as a control signal CS. In some embodiments, when the input signal IS is an AC signal, the input processing module 13 may further include a rectifier circuit configured to convert the AC signal into a DC signal, such as a substantially square wave pulse signal, as the control signal CS.
[0048] like Figure 1 and 2 As shown, the input-side circuit 10 may include a carrier generator 11 and a modulator 12. The carrier generator 11 may be configured to generate a high-frequency carrier. The carrier frequency generated by the carrier generator 11 may be, for example, between several megahertz and several gigahertz. The modulator 12 may be configured to receive a control signal CS on one hand and a carrier ZS on the other. In some embodiments, the carrier generator 11 and the modulator 12 may be integrated together. The modulator 12 can thus modulate the carrier ZS with the control signal CS to generate a modulated signal DS. Therefore, this application reliably and efficiently transmits the control signal CS, which is originally a DC signal, from the input-side circuit 10 to the output-side circuit 20 via electromagnetic coupling through modulation and demodulation. The modulator 12 may be electrically connected to the isolation converter module 30 to transmit the generated modulated signal DS to the isolation converter module 30.
[0049] Reference Figure 2 This illustrates an exemplary implementation of the isolation converter module 30. For example... Figure 2 As shown, the isolation converter module 30 may include an input-side converter 31, an isolation transformer 32, and an output-side converter 33. It should be understood that the isolation converter module 30 may be configured as an integrated isolation chip, which integrates the input-side converter 31, the isolation transformer 32, and the output-side converter 33. In other embodiments, the isolation converter module 30 may also be composed of multiple individual functional units.
[0050] The modulator 12 of the input-side circuit 10 can be electrically connected to the primary side of the isolation transformer 32 and configured to provide the modulated signal DS to the primary side of the isolation transformer 32. For this purpose, the isolation converter module 30 can have a first input interface for receiving the modulated signal DS from the modulator 12, which can be connected to the primary side of the isolation transformer 32 within the scope of the isolation converter module 30 without passing through the input-side converter 31. The isolation transformer 32 can be configured to convert the modulated signal DS on the primary side into a modulated signal DS on the secondary side via electromagnetic coupling. The isolation converter module 30 can have a first output interface for outputting the modulated signal DS on the secondary side, which can be connected to the secondary side of the isolation transformer 32 within the scope of the isolation converter module 30 without passing through the output-side converter 33, so as to output the modulated signal DS on the secondary side to the downstream output-side circuit 20, more specifically, the demodulator 21 of the output-side circuit 20.
[0051] In some embodiments, the input-side converter 31 can be configured as a DC / AC converter, which can be configured to receive a control signal CS or an input signal IS and convert the control signal CS or the input signal IS into a first AC signal and transmit the first AC signal to the primary side of the isolation transformer 32. For this purpose, the isolation converter module 30 can have a second input interface for receiving the control signal CS or the input signal IS, and the second input interface can be connected to the input-side converter 31. Figure 2 As shown, the input-side converter 31 can be configured as a full-bridge converter, which may have four semiconductor switches. By applying corresponding switching signals to these four semiconductor switches, the DC control signal CS on the input side can be converted into a first AC signal. In other embodiments, the input-side converter 31 can be configured as a push-pull converter, a half-bridge converter, a flyback converter, a forward converter, or a feedforward converter. These will not be shown in detail here.
[0052] The input-side converter 31 may be equipped with a first control unit 41. In some embodiments, the first control unit 41 may be integrated within the isolation converter module 30. The first control unit 41 may be communicatively connected to a host control device to receive control commands from the host control device in real time. In some embodiments, the first control unit 41 may also be implemented in the host control device and transmit switching signals to the isolation converter module 30 via a communication line. The first control unit 41 may be configured to apply switching signals to the semiconductor switches of the input-side converter 31. These switching signals may be configured to switch the switching state of the semiconductor switches of the input-side converter 31 at a switching frequency of, for example, several kilohertz to several hundred kilohertz. Thus, the first control unit 41 may be configured to adjust, especially in real time, the frequency and / or duty cycle of the switching signals to regulate the first AC signal. By adjusting the frequency and / or duty cycle of the switching signals, the waveform of the first AC signal, such as its amplitude and / or frequency, can be flexibly adjusted to optimize signal and energy supply.
[0053] The input-side converter 31 can output a first AC signal to the primary side of the isolation transformer 32. The isolation transformer 32 can therefore be configured to convert the first AC signal on the primary side into a second AC signal on the secondary side of the isolation transformer 32 via electromagnetic coupling. The conversion of the second AC signal relative to the first AC signal can depend on the configuration of the isolation transformer 32.
[0054] The output-side converter 33 can be configured as an AC / DC converter, which can be configured to receive a second AC signal from the secondary side of the isolation transformer 32, convert the second AC signal into a DC signal, and transmit the DC signal to the output-side circuit 20, more specifically, the output processing module 22. For this purpose, the isolation converter module 30 can have a second output interface for outputting a DC signal, which can be connected to the output-side circuit 20. Figure 2 As shown, the output-side converter 33 can be configured as a rectifier, such as a full-bridge rectifier or a half-bridge rectifier. By applying a corresponding switching signal to the semiconductor switch S1 within the rectifier, the second AC signal on the output side can be converted into a DC signal. In some embodiments, the output-side converter 33 can be configured as a passive rectifier, which can consist of multiple diodes and energy storage devices, such as inductors and capacitors, to convert the second AC signal on the output side into a DC signal.
[0055] In some embodiments, the output-side converter 33 can be configured as an active rectifier, which may be equipped with a second control unit 42. In some embodiments, the second control unit 42 may be integrated within the isolation converter module 30 or integrated with the first control unit 41. The second control unit 42 may be communicatively connected to a host control device to receive control commands from the host control device in real time. In some embodiments, the second control unit 42 may also be implemented in the host control device and transmit switching signals to the isolation converter module 30 via a communication line. The second control unit 42 may be configured to apply switching signals to the semiconductor switches of the output-side converter 33. These switching signals may be configured to switch the switching state of the semiconductor switches of the output-side converter 33 at a switching frequency of, for example, several kilohertz to several hundred kilohertz. Thus, the second control unit 42 may be configured to adjust, especially in real time, the frequency and / or duty cycle of the switching signals to adjust the generated DC signal. By adjusting the frequency and / or duty cycle of the switching signals, the waveform of the DC signal, such as its amplitude (e.g., between 5V and 20V, especially between 10V and 20V), can be flexibly adjusted to optimize signal and energy supply. Implementing active regulation in the output-side converter allows for more flexible design of the topology of isolated converter modules.
[0056] The output-side circuit 20 may include a demodulator 21 and a semiconductor switch S1 connected in the load circuit. The demodulator 21 may be configured to connect to the first output interface of the isolation converter module 30, so that it connects to the secondary side of the isolation transformer 32 within the scope of the isolation converter module 30 without passing through the output-side converter 33. Thus, the demodulator 21 may be configured to receive the modulation signal DS and demodulate the control signal CS from the modulation signal DS based on an understanding of the carrier setting, so as to control the switching state of the semiconductor switch S1 based on the control signal CS. Therefore, the control signal CS, which is originally a DC signal, is reliably and efficiently transmitted from the input-side circuit 10 to the output-side circuit 20 via electromagnetic coupling through modulation and demodulation. In some embodiments, at least a portion of the carrier generator 11, modulator 12, first control unit 41, demodulator 21, and second control unit 42 may be integrated into a single functional module.
[0057] In some improved embodiments, the output-side circuit 20 may further include an output processing module 22, which may be electrically connected to the output-side converter 33, demodulator 21, and semiconductor switch S1 of the isolation converter module 30. In other words, the output processing module 22 may be electrically connected to a second output interface of the isolation converter module 30 for outputting a DC signal, so as to receive a DC signal from the output-side converter 33 from the second output interface. Furthermore, the output processing module 22 may receive a demodulated control signal CS from the demodulator 21. Thus, the output processing module 22 may be configured to generate an output signal OS in the presence of a DC signal fed from the output-side converter 33 and a demodulated control signal CS from the demodulator 21, for applying the output signal OS to the semiconductor switch S1.
[0058] To allow for reliable and efficient switching control of the semiconductor switch S1, the output processing module 22 may include a second shaping circuit configured to shape the demodulated control signal CS into a desired output signal. In some embodiments, the shaped control signal CS, or output signal OS, may be configured as a square wave pulse signal conforming to predetermined parameters in terms of signal amplitude, rise time, and / or fall time. For example, the rise time and / or fall time may be between tens of nanoseconds and tens of microseconds. It should be understood that the output processing module 22, or the second shaping circuit, is not mandatory. In particular, if the demodulated control signal CS already conforms to the specified parameters, then the control signal CS may substantially correspond to the output signal OS.
[0059] The second shaping circuit is a type of circuit used to process or change the signal waveform, primarily transforming the signal into a form more suitable for subsequent processing or transmission. In some embodiments, the second shaping circuit may include an amplifier circuit to increase the signal amplitude for reliable driving of the semiconductor switch S1, and common amplifier circuits include common-emitter, common-base, and common-collector configurations. Alternatively, the second shaping circuit may include a filter circuit to remove unwanted frequency components and retain the desired signal. Alternatively, the second shaping circuit may include a limiting circuit to limit the signal amplitude to a certain range, preventing the signal from exceeding the desired maximum value; this is typically implemented using diodes. Alternatively, the second shaping circuit may include a waveform correction circuit to make the signal waveform more ideal, often used for shaping pulse signals to improve the rise time and / or fall time. Alternatively, the second shaping circuit may include overcurrent protection circuits, undervoltage protection circuits, and / or overtemperature protection circuits to protect / shut down the circuit when the current is too high, below a voltage threshold, or above a temperature threshold.
[0060] In some improved embodiments, the output processing module 22 may include an inverting regulator or a negative regulator configured to generate a negative voltage as an additional output signal, which may be configured to reliably turn off the semiconductor switch S1, such as an IGBT.
[0061] In some embodiments, such as Figure 1 and 2 As shown, the solid-state relay 100 can be deployed in a DC circuit system 200, which includes a load circuit. The load circuit may include a load LD, a DC power supply V supplying power to the load LD, and the solid-state relay 100. The semiconductor switch S1 of the solid-state relay 100 can be connected to the load circuit to close or disconnect the load circuit. In this case, the semiconductor switch S1 can be configured as a MOSFET, IGBT, or BJT.
[0062] In some embodiments, such as Figure 3 As shown, the solid-state relay 100 can be deployed in an AC circuit system 200, which includes a load circuit. The load circuit may include a load LD, an AC power supply V for the load LD, and the solid-state relay 100. The semiconductor switch S1 of the solid-state relay 100 can be connected to the load circuit, for example, to a corresponding phase line, to close or disconnect the corresponding phase line. In this case, the semiconductor switches S1 and S2 can be configured as an SCR or a Triac. Therefore, the solid-state relay 100 of this application can broaden its applicability to various application scenarios.
[0063] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of this application. The various embodiments disclosed herein can be combined in any way without departing from the spirit and scope of this application. Those skilled in the art should also understand that various modifications can be made to the embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.
Claims
1. A solid-state relay, characterized in that, The solid-state relay includes: The input-side circuitry includes a carrier generator and a modulator; The output-side circuitry includes a demodulator and semiconductor switches. The isolation converter module is configured to electromagnetically isolate the input-side circuitry from the output-side circuitry. The modulator is configured to receive control signals and modulate the carrier generated by the carrier generator using the control signals to generate a modulated signal, which is then transmitted to the isolation converter module. The demodulator is configured to receive the modulated signal output by the isolation converter module and demodulate the control signal from the modulated signal so as to control the switching state of the semiconductor switch based on the control signal.
2. The solid-state relay according to claim 1, characterized in that, The isolation converter module includes an input-side converter, an isolation transformer, and an output-side converter. The input-side converter is configured as a DC / AC converter, and the input-side converter is configured to receive a control signal and convert the control signal into a first AC signal and transmit the first AC signal to the primary side of the isolation transformer. The isolation transformer is configured to convert a first AC signal on the primary side into a second AC signal on the secondary side of the isolation transformer. The output-side converter is configured as an AC / DC converter, which is configured to receive a second AC signal and convert the second AC signal into a DC signal.
3. The solid-state relay according to claim 2, characterized in that, The input-side converter is equipped with a first control unit, which is configured to apply a switching signal to the semiconductor switches of the input-side converter; and / or The output-side converter is equipped with a second control unit, which is configured to apply a switching signal to the semiconductor switch of the output-side converter.
4. The solid-state relay according to claim 3, characterized in that, The first control unit is configured to adjust the frequency and / or duty cycle of the switching signal in order to adjust the generated first AC signal; and / or The second control unit is configured to adjust the frequency and / or duty cycle of the switching signal in order to regulate the generated DC signal.
5. The solid-state relay according to claim 2, characterized in that, The modulator is electrically connected to the primary side of the isolation transformer and is configured to transmit the modulated signal to the primary side of the isolation transformer. An isolation transformer is configured to convert a modulated signal on the primary side into a modulated signal on the secondary side; The secondary side of the isolation transformer is electrically connected to the demodulator and is configured to transmit the modulated signal to the demodulator.
6. The solid-state relay according to claim 5, characterized in that, The isolation converter module has a first input interface for receiving a modulated signal from a modulator, the first input interface being connected to the primary side of an isolation transformer without passing through an input-side converter within the scope of the isolation converter module; The isolation converter module has a first output interface for outputting a modulated signal on the secondary side. This first output interface is connected to the secondary side of the isolation transformer without passing through an output-side converter within the scope of the isolation converter module, so as to transmit the modulated signal on the secondary side to the demodulator.
7. The solid-state relay according to any one of claims 1 to 6, characterized in that, The input-side circuitry includes an input processing module, which includes a first shaping circuit configured to shape the input signal into a desired control signal.
8. The solid-state relay according to claim 7, characterized in that, The first shaping circuit includes one or more of the following: an amplifier circuit, a rectifier circuit, a filter circuit, a limiting circuit, a waveform correction circuit, an overcurrent protection circuit, an undervoltage protection circuit, and an overtemperature protection circuit.
9. The solid-state relay according to claim 2, characterized in that, The solid-state relay includes an output processing module electrically connected to the output-side converter, demodulator, and semiconductor switch of the isolation converter module. The output processing module is configured to generate an output signal in the presence of a DC signal fed from the output-side converter and a demodulated control signal from the demodulator, for applying the output signal to the semiconductor switch.
10. The solid-state relay according to claim 9, characterized in that, The output processing module includes a second shaping circuit configured to shape the control signal demodulated from the demodulator into a desired output signal.
11. The solid-state relay according to claim 10, characterized in that, The first shaping circuit includes one or more of the following: an amplifier circuit, a filter circuit, a limiting circuit, a waveform correction circuit, an overcurrent protection circuit, an undervoltage protection circuit, and an overtemperature protection circuit.
12. The solid-state relay according to any one of claims 1 to 6, characterized in that, The control signal is configured as a square wave pulse signal; and / or the falling edge time of the control signal demodulated by the demodulator is between tens of nanoseconds and tens of microseconds.
13. The solid-state relay according to any one of claims 1 to 3, characterized in that, Semiconductor switches are configured as MOSFETs, IGBTs, BJTs, SCRs, or Triacs.
14. A circuit system, characterized in that, The circuit system includes a load circuit, the load circuit including a load and a power supply for supplying power to the load, wherein the load circuit further includes a solid-state relay according to any one of claims 1 to 13, wherein a semiconductor switch of the solid-state relay is connected in the load circuit to close or disconnect the load circuit.