Component suction control device and control method thereof, and electronic device

Abstract

This invention discloses a component pick-up control device and method, as well as an electronic device, relating to the field of circuit board technology. The device includes: a data storage unit that sends the top outline dimensions of components belonging to the surface mount process to a processor; the processor that synchronizes the top outline dimensions to a scanner and calculates the effective suction force of the nozzle based on the scanner's flatness detection results and nozzle-related parameters; determining the component pick-up risk based on the effective suction force to control the pick-up machine and leveler to perform corresponding actions; the scanner performing flatness detection on the top of the component according to preset scanning rules and feeding back the flatness detection results to the processor; and the leveler, according to the processor's repair instructions, selecting a leveling adhesive of the corresponding specification to apply and level the uneven areas on the top of the component. This solves the problems of components being unable to be picked up or falling off after being picked up due to unevenness at the top, significantly improving circuit board production efficiency and product quality.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a component pick-up control device and control method, and electronic equipment. Background Technology

[0002] Surface Mount Technology (SMT) involves using a pick-and-place machine to mount electronic components onto a circuit board, followed by reflow soldering to melt solder paste and solder the components to the board. During the placement process, the pick-and-place machine typically uses nozzles to quickly pick up and place components. However, in actual production, air leakage often occurs when the nozzles pick up components, leading to the inability to pick up components properly or for them to fall off during transport. The root cause of this problem is insufficient flatness on the top of the component. Uneven surfaces prevent the nozzle from forming a tight seal with the component, resulting in air leakage. If a component falls during transport, it can easily collide with unsoldered components nearby, causing adjacent components to tip over or shift. Such problems significantly increase the risk of scrapping the entire circuit board, severely impacting production yield and increasing production costs. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a component pick-up control device and control method, and an electronic device, which can solve the problems of components being unable to be picked up or falling after being picked up, at least from the source, thereby significantly improving the efficiency of circuit board production and product quality.

[0004] To solve the above-mentioned technical problems, the present invention provides a component pick-up control device, comprising: a data memory, a scanner, a leveler, and a processor respectively connected to the data memory, the scanner, and the leveler; The data storage is used to send the top outline size data of the components belonging to the surface mount process to the processor after identifying the soldering process to which the components belong; The processor is used to synchronize the top outline dimension data to the scanner, calculate the effective suction force of the nozzle based on the flatness detection result of the scanner and the relevant parameters of the nozzle, determine the component pick-up risk based on the effective suction force of the nozzle, and control the pick-and-place machine and the leveler to perform corresponding actions. The scanner is used to perform flatness detection on the top of the component according to a preset scanning rule, and to feed back the flatness detection result to the processor; The leveling device is used to apply and level uneven areas on the top of components by selecting leveling adhesive of the corresponding specification according to the repair instructions of the processor.

[0005] To address the aforementioned technical problems, the present invention also provides a control method for a component pick-up control device, comprising: The data storage device identifies the soldering process to which the component belongs and sends the top outline dimension data of the component belonging to the surface mount process to the processor; The processor synchronizes the top outline dimension data to the scanner, and calculates the effective suction force of the nozzle based on the flatness detection results of the scanner and the relevant parameters of the nozzle. Based on the effective suction force of the nozzle, it determines the risk of component pickup, so as to control the pick-and-place machine and the leveler to perform corresponding actions. The scanner receives the top outline dimension data, performs flatness detection on the top of the component according to a preset scanning rule, and feeds back the flatness detection result to the processor; The leveling device, according to the repair instructions from the processor, selects a leveling patch of the corresponding specification to apply and level the uneven area on the top of the component.

[0006] To address the aforementioned technical problems, the present invention also provides an electronic device, including the aforementioned component pick-up control device.

[0007] The component pick-up control device provided by this invention identifies the soldering process to which the component belongs and extracts the top dimensional data of the surface mount component through a data storage device. This enables precise screening of target processing objects, providing a reliable data foundation for subsequent inspection and control. The processor synchronizes the dimensional data to the scanner and calculates the effective suction force and determines the pick-up risk based on the flatness detection results and nozzle-related parameters. This allows for the early identification of potential issues such as components that cannot be picked up or will fall off after being picked up, enabling proactive risk assessment and intelligent decision-making. The scanner performs flatness detection on the top of the component according to preset rules and provides real-time feedback, accurately acquiring the top status information of the component and providing an objective basis for suction force calculation and repair judgment. The leveler selects an appropriate leveling patch according to the processor's instructions to apply and level uneven areas, effectively improving the adsorption conditions on the top of the component and ensuring stable and reliable pick-up by the nozzle. This approach addresses issues such as uneven component tops leading to failure to pick up components or components falling off after being picked up, thus preventing defects from occurring in advance, reducing rework and scrap losses, lowering manufacturing costs, and improving the stability and continuity of the mounting process, significantly enhancing board production efficiency and product quality.

[0008] Furthermore, the present invention also provides a corresponding control method and electronic equipment for the component pick-up control device, which have the same or corresponding technical features as the aforementioned component pick-up control device, further making the aforementioned component pick-up control device more practical. The control method and electronic equipment have corresponding advantages. Attached Figure Description

[0009] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the component pick-up control device provided in an embodiment of the present invention; Figure 2 This is a scanning diagram corresponding to the first scanning rule provided in an embodiment of the present invention; Figure 3 This is a scanning diagram corresponding to the second scanning rule provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the application of the leveling adhesive to the uneven area on the top of a component, as provided in this embodiment of the invention. Figure 5 This is a top view schematic diagram of the leveling device provided in an embodiment of the present invention; Figure 6 This is a front cross-sectional view of the leveling device provided in an embodiment of the present invention; Figure 7 This is a partially enlarged schematic diagram of the adhesive layer in the leveling device provided in an embodiment of the present invention; Figure 8 A flowchart of the control method for the component pick-up control device provided in an embodiment of the present invention. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0012] It should be noted that, in the description of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., used in this invention are used to distinguish similar objects and are not used to describe a set order or sequence.

[0013] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0014] An embodiment of the present invention provides a component pick-up control device. Figure 1 This is a schematic diagram of the component pick-up control device provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the component pick-up control device includes: a data storage 1, a scanner 2, a leveler 3, and a processor connected to the data storage 1, the scanner 2, and the leveler 3 respectively; Data storage 1 is used to send the top outline size data of components belonging to the surface mount process to the processor after identifying the soldering process to which the component belongs; The processor is used to synchronize the top outline dimension data to the scanner 2, and calculate the effective suction force of the nozzle based on the flatness detection results of the scanner 2 and the relevant parameters of the nozzle. Based on the effective suction force of the nozzle, the pick-up risk of the component is determined, so as to control the pick-up machine and the leveler 3 to perform corresponding actions. Scanner 2 is used to perform flatness detection on the top of the component according to preset scanning rules and to feed back the flatness detection results to the processor; Leveler 3 is used to apply and level uneven areas on the top of components by selecting the corresponding leveling patch according to the processor's repair instructions.

[0015] It should be noted that the processor can centrally control the entire system, coordinating the collaboration of data storage 1, scanner 2, leveler 3, and the placement machine. The main function of data storage 1 is to provide all dimensional information of the components (primarily top dimension data), process information (surface mount or wave soldering), and the weight of the component itself. Data storage 1 can first determine whether the component belongs to the surface mount or wave soldering process, and then transmit the top dimension data of components belonging to the surface mount process to the processor, which then synchronizes this top dimension data to scanner 2. The main function of scanner 2 is to scan the flatness of the component's top. The main function of leveler 3 is to level any uneven parts on the component's top.

[0016] In the component pick-up control device provided in this embodiment of the invention, the data storage 1 identifies the soldering process to which the component belongs and extracts the top shape dimension data of the surface mount process component, which can accurately screen the target processing object and provide a reliable data foundation for subsequent detection and control; the processor synchronizes the dimension data to the scanner 2 and calculates the effective suction force and determines the pick-up risk based on the flatness detection result and the relevant parameters of the nozzle, which can identify the hidden dangers of not being able to pick up or falling after being picked up in advance before the component is mounted, and realize risk pre-judgment and intelligent decision-making; the scanner 2 performs flatness detection on the top of the component according to preset rules and provides real-time feedback results, which can accurately obtain the top status information of the component and provide an objective basis for suction force calculation and repair judgment; the leveler 3 selects the appropriate leveling patch according to the processor instruction to attach and level the uneven area, which can effectively improve the adsorption conditions on the top of the component and ensure that the nozzle picks up stably and reliably. This approach addresses issues such as uneven component tops leading to failure to pick up components or components falling off after being picked up, thus preventing defects from occurring in advance, reducing rework and scrap losses, lowering manufacturing costs, and improving the stability and continuity of the mounting process, significantly enhancing board production efficiency and product quality.

[0017] Furthermore, in a specific implementation, in the component pick-up control device provided in the embodiments of the present invention, the processor can specifically be used to receive the flatness detection result fed back by the scanner 2; if the flatness detection result is flat, the pick-and-place machine is controlled to pick up and place the component according to the set process; if the flatness detection result is uneven, the effective suction force of the nozzle is calculated based on the detected unevenness information and the relevant parameters of the nozzle, and the effective suction force of the nozzle is compared with the minimum suction force required for component pick-up to determine whether there is a risk of component pick-up in the current state.

[0018] During implementation, after scanner 2 completes the flatness detection of the top of the component, it feeds back the flatness result and the corresponding data of the uneven area to the processor. If the top of the component scanned by scanner 2 is flat, that is, the scanning result is flat, the processor directly controls the pick-and-place machine to perform normal pick-and-place operations on the component according to the set process. If the top of the component scanned by scanner 2 is uneven, that is, the scanning result is uneven, scanner 2 uploads data including the length, width and height of the uneven area, the area of ​​the air leakage area corresponding to the uneven part, etc. to the processor. The processor calculates the effective suction force of the nozzle under the air leakage state based on this kind of unevenness information and the relevant parameters of the nozzle, and compares the effective suction force with the minimum suction force required to pick up the component to determine whether the air leakage will cause the nozzle to be unable to stably pick up the component, thereby determining whether subsequent operations such as leveling or switching scanning areas are required. By inspecting the flatness of the component top before mounting and accurately calculating the effective suction force of the nozzle based on the unevenness information, it is possible to determine in advance whether there is a risk of unstable picking or falling of the component. This avoids problems such as pick-up failure, component falling, and circuit board damage caused by air leakage from the source, effectively reducing production abnormalities and circuit board rework and scrap costs, improving the production stability and overall production efficiency of the pick-and-place machine, and ensuring the quality of circuit board production.

[0019] Furthermore, in a specific implementation, in the component pick-up control device provided in the embodiments of the present invention, the processor can be specifically used to control the pick-up and place the component according to the set process if it is determined that there is no pick-up risk; if it is determined that there is a pick-up risk, it determines whether the uneven area has repair conditions; if it is determined that the repair conditions are met, it issues a repair command to the leveler 3; if it is determined that the repair conditions are not met, it controls the scanner 2 to re-scan according to the preset scanning rules until a flatness detection result that meets the pick-up conditions is obtained.

[0020] In implementation, the processor executes a graded control strategy based on the risk assessment results. When there is no risk, the pick-and-place machine is driven to operate normally. When there is a risk, it is further determined whether the component can be repaired. If it can be repaired, the leveler 3 is activated for repair. If it cannot be repaired, the scanning area is switched for re-inspection. Through closed-loop judgment and adaptive adjustment, the system continuously ensures that the component meets the safety pick-up requirements. This not only ensures the stability and reliability of the placement process, but also minimizes component scrap and board abnormalities, thereby improving the rationality and efficiency of the overall production.

[0021] Furthermore, in a specific implementation, in the component suction control device provided in the embodiments of the present invention, the processor can be used to determine the area of ​​the air leakage area caused by the detected unevenness information; and to obtain the effective suction force of the nozzle by combining the area of ​​the air leakage area with the total area sucked by the nozzle and the nominal total suction force of the nozzle through a preset calculation method.

[0022] In implementation, the processor determines the area of ​​the leakage region caused by the unevenness on the top of the component based on the unevenness information fed back by scanner 2. Assume the area of ​​the leakage region caused by the unevenness is... The total area sucked up by the nozzle is The nominal total suction power of the nozzle is The weight of the component body is The acceleration due to gravity is The acceleration of the nozzle during movement is a = Δv / Δt (Δv refers to the change in the velocity of the nozzle. If the nozzle changes from a static state to a uniform motion with velocity V, then Δv = V - 0, and Δt refers to the time taken for the nozzle to change from a static state to a velocity V).

[0023] Effective adsorption area ratio = ,Then That is, the calculated suction power of the nozzle after leakage needs to be greater than Wyu(g+a). Based on this, the formula for the above preset calculation method is: ; in, This is a coefficient that can be adjusted according to the actual situation; the default value is 1.

[0024] This invention first calculates the effective adsorption area ratio based on the total adsorption area and the leakage area. Then, it combines the nominal total suction force with a correction factor to obtain the actual effective suction force after leakage correction. This effective suction force is compared with the minimum adsorption force required by the component in both static and dynamic states to determine whether the current adsorption state meets the requirements for stable absorption. Through this calculation method, the influence of static gravity and dynamic acceleration on absorption stability can be comprehensively considered, accurately quantifying the degree to which leakage weakens the adsorption effect. This allows for accurate determination of the reliability of component absorption, thereby proactively avoiding risks such as absorption failure and component drop, and improving the safety and stability of the mounting process.

[0025] Furthermore, in a specific implementation, in the component suction control device provided in the embodiments of the present invention, the processor can specifically be used to calculate the minimum suction force required to suction the component based on the weight of the component body, the gravitational acceleration, and the acceleration when the suction nozzle moves; when the effective suction force of the suction nozzle is greater than the minimum suction force required to suction the component, it is determined that there is no suction risk; when the effective suction force of the suction nozzle is not greater than the minimum suction force required to suction the component, it is determined that there is a suction risk.

[0026] During implementation, the previously obtained effective suction power of the nozzle will be utilized. Minimum suction force required to pick up components Compare: If the calculated Value greater than This means that even with air leakage, the suction power of the nozzle can still pick up the components, posing no risk of injury. The processor then controls the pick-and-place machine to perform the pickup and placement operations according to the set normal procedure. If the calculated... Value less than or equal to This requires the processor to immediately control the leveler 3 to perform a leveling operation on the uneven areas on the top of the component, in order to improve the adsorption conditions and enhance the stability of the pick-up. In this way, through the above-mentioned suction comparison and risk assessment method, potential pick-up failures can be accurately identified before placement. Production efficiency can be guaranteed when there is air leakage but stable pick-up is still possible. When the suction is insufficient, repair measures can be initiated in time. This avoids unnecessary downtime and repair actions, and effectively prevents component pick-up failure or displacement and drop, thereby improving the reliability and continuity of placement production, and reducing the board defect rate and production costs.

[0027] Furthermore, in a specific implementation, in the component pick-up control device provided in the embodiments of the present invention, the scanner 2 can be used to receive the top outline size data sent by the processor, determine the corresponding scanning area based on the top outline size data, perform flatness detection on the top of the component according to the preset first scanning rule with the center of the component as the reference, and feed back the flatness detection information to the processor.

[0028] In implementation, scanner 2 receives the component top outline dimension data sent by the processor and determines the corresponding scanning area based on this dimension data. According to the preset first scanning rule, the center point of the component needs to be selected as the reference. If the nozzle is circular, a square area tangent to the nozzle is used to perform overall flatness detection on the component top. If the nozzle is rectangular, square, or other regular shapes, the detection area is defined by extending the four sides of the nozzle by a set length (e.g., 0.1mm), and the overall flatness detection on the component top is performed based on this detection area. The detected flatness information and related data are fed back to the processor. If the detection area is flat, the processor is notified to control the pick-and-place machine to perform normal pick-and-place operations. If the detection area is uneven, the unevenness-related data is transmitted to the processor for suction force calculation and repairability judgment. If it is repairable, the leveler 3 performs leveling operations on the uneven area.

[0029] Figure 2 This is a schematic diagram of the scanning rule corresponding to the first scanning rule provided in an embodiment of the present invention. For example... Figure 2 As shown, the dashed square represents the scanning area, which is a square scan circumscribed outside the nozzle (circle in the diagram) at the center point of the component (the outermost rectangle). This allows for precise matching of the nozzle's actual adsorption range, comprehensively and accurately identifying unevenness defects on the top of the component. This provides reliable data support for subsequent suction calculations and repair assessments, effectively improving detection accuracy and the rationality of judgments, and ensuring the stability of component adsorption.

[0030] Furthermore, in a specific implementation, in the component pick-up control device provided in the embodiments of the present invention, the scanner 2 can be specifically used to switch to a preset second scanning rule according to the processor's control instruction if the processor determines that the uneven area does not meet the repair conditions. Taking the center of the component as a symmetry reference, the scanner avoids the uneven area and performs flatness detection at symmetrical positions on both sides of the top of the component, and feeds back the corresponding flatness detection results to the processor. If the processor still determines that the uneven area does not meet the repair conditions, the preset second scanning rule is repeated until the flatness detection result is flat, or it is determined that there is no pick-up risk, or it is determined that the uneven area meets the repair conditions.

[0031] In implementation, scanner 2 receives control commands from the processor. When it determines that an uneven area is not repairable, it switches to a preset second scanning rule. The second scanning principle involves scanner 2 performing multiple scans, avoiding uneven areas and selecting two symmetrical areas on both sides of the top of the component for secondary scanning, based on the principle of symmetry around the component's center point. If the nozzle is circular, a square area tangent to the nozzle is used for scanning, and the scanning results are fed back to the processor. If the nozzle is rectangular, square, or other regular shapes, the detection area is defined by extending the four sides of the nozzle by a set length (e.g., 0.1mm) for scanning, and the scanning results are fed back to the processor. If the pick-up conditions are still not met or repair is not possible, the first and second scanning rules are executed repeatedly until a flat area is obtained or it is determined that the component is repairable and there is no risk of pick-up. Finally, the pick-up machine uses dual nozzles to simultaneously pick up the component from the symmetrical area on the top of the component. The dual nozzles reduce the suction power requirement of a single nozzle and improve pick-up stability. This method of using symmetrical area cyclic scanning and dual-nozzle collaborative suction can effectively avoid uneven areas on the top of components that cannot be repaired, achieving reliable suction without discarding components, greatly reducing the scrap rate of components and boards. At the same time, the dual-nozzle structure can improve the safety and stability of the suction process, further ensuring the continuous and efficient production of the pick-and-place machine.

[0032] Figure 3 This is a schematic diagram of the scanning rule corresponding to the second scanning rule provided in an embodiment of the present invention. Figure 3 As shown, the solid cube represents an uneven area. After avoiding the uneven area, scan the two symmetrical areas on both sides (the areas marked by the two dashed lines on the left and right).

[0033] Furthermore, in a specific implementation, in the component pick-up control device provided in the embodiments of the present invention, the leveler 3 can specifically be used to receive the repair command issued by the processor, synchronously acquire the relevant information of the uneven area on the top of the component transmitted by the processor, determine the size parameters of the uneven area based on the acquired information, select a leveling patch that matches the parameters of the uneven area from at least two specifications of leveling patches stored in its own storage, and determine the number of leveling patches to be used and the number of layers to be applied; and apply and level the uneven area on the top of the component by means of the selected leveling patch according to the principle of applying from the edge of the nozzle to the center.

[0034] In implementation, the leveling device 3 contains two sizes of leveling pads: a small leveling pad with dimensions of 0.1mm x 0.1mm x 0.05mm (length x width x height) and a large leveling pad with dimensions of 0.5mm x 0.5mm x 0.05mm (length x width x height). The leveling pads are arranged according to the principle of using large leveling pads in the central area and small leveling pads on the sides. The leveling device 3 has a certain height, allowing for automatic layer-by-layer movement of the leveling pads. Its bottom layer has a relatively high adhesive layer, enabling precise application of the leveling pads to the top of components, thus completing the automated application process. The leveling pad material must have a smooth surface and possess a certain degree of toughness and flexibility, allowing for slight deformation to accommodate uneven areas on the top of components.

[0035] The leveling rules of leveler 3 can specifically include the following methods: The first leveling rule is that when the height of the uneven area on the top of the component is an integer multiple of 0.05mm, the leveler 3 selects one or more small leveling stickers and large leveling stickers according to the size of the uneven area. For areas with a height exceeding 0.005mm, the uneven area is gradually leveled from the edge of the nozzle outward by increasing the number of leveling sticker layers to ensure that there is no air leakage when the nozzle adsorbs after leveling. Figure 4 This is a schematic diagram illustrating the application of the leveling adhesive to uneven areas on the top of components, as provided in this embodiment of the invention. Figure 4 As shown, the large dotted box in the upper left corner marks the uneven area, and the three identical small boxes mark the specific placement of the patch. This method of application ensures the seal of the nozzle.

[0036] The second leveling rule is that when the height of the uneven area on the top of the component is not an integer multiple of 0.05mm and is less than 0.05mm, or the length and width dimensions of the uneven area are less than 0.1mm × 0.1mm, such uneven areas are determined to be unrepairable. In this case, the leveler 3 feeds back this determination to the processor, which then controls the scanner 2 to switch to the second scanning rule, avoiding the unrepairable uneven area. Using the component's center point as a symmetry reference, a second scan is performed on two symmetrical areas on either side of the component's top, following the corresponding rules: if the nozzle is circular, a square area tangent to the nozzle is used for scanning; if the nozzle is rectangular, square, or other regular shapes, the detection area is defined by extending the four sides of the nozzle by a set length (e.g., 0.1mm). Once a flat area is scanned, the pick-and-place machine uses two nozzles to pick up the component from the two symmetrical areas on the component's top for subsequent production operations.

[0037] The third leveling rule is: when the height of the uneven area on the top of the component is not an integer multiple of 0.05mm but is greater than 0.05mm, the leveler 3 should first follow the requirements of the first leveling rule and select one or more small leveling stickers and large leveling stickers according to the size of the uneven area. The leveling stickers should be applied from the edge of the nozzle outwards to level the uneven area. The leveling stickers can be arranged in layers until the height of the uneven area is less than 0.05mm after leveling. After leveling is completed, leveler 3 feeds back the leveling result to the processor, which recalculates the effective suction force of the nozzle under the leakage condition to determine whether the nozzle can still stably pick up the component. If the calculation result shows that the nozzle can stably pick up the component, the processor directly controls the pick-and-place machine to operate normally. If the calculation result shows that the nozzle cannot stably pick up the component, the area is determined to be unrepairable according to the requirements of leveling rule two. The processor controls scanner 2 to execute the second scanning rule, avoiding the uneven area. Using the center point of the component as a symmetrical reference, two scans are performed on two symmetrical areas on both sides of the top of the component, in the manner of the nozzle circumscribing a square, until a flat area or a repairable area is scanned. Finally, the pick-and-place machine uses two nozzles to pick up the component together in the symmetrical area to advance subsequent production.

[0038] Figure 5 This is a top view schematic diagram of the leveling device provided in an embodiment of the present invention. Figure 5 As shown, the small frames on the left and right sides are small leveling patches, and the large frame in the middle is a large leveling patch. The leveling patches are available in sizes to fit uneven areas of different dimensions and heights. Combined with the arrangement of the large patch in the middle and the small patches on both sides, and the layered leveling strategy, it can accurately level various repairable uneven areas, ensuring the airtightness of the nozzle after leveling and solving the problem of suction failure caused by air leakage at the source.

[0039] Figure 6 This is a front cross-sectional view of the leveling device provided in an embodiment of the present invention. Figure 6 As shown, the entire leveling device 3 has a certain height, with multiple leveling pads stacked together. A is the vertical lifting track that conveys the leveling pads downwards. Area B is the adhesive layer. The protrusions on the red rod (the leveling pads have a certain degree of elasticity) can be moved up and down through the leftmost dotted frame. Pressing the leveling pad downwards will then adhere it to the top of the component.

[0040] Figure 7 This is a partially enlarged schematic diagram of the adhesive layer in the leveling device provided in an embodiment of the present invention. Figure 7 As shown, the entire adhesive layer mainly consists of four parts. D (the solid block in the figure) is the fixed part of the telescopic rod. E (the several large hollow blocks adjacent to the solid block in the figure) is the telescopic part of the telescopic rod, which can extend or retract into D. The telescopic rod can move up and down through the moving track of C. Then, F (the hollow block with solid lines in the figure) is the pressing block that can protrude downwards from the telescopic part. Normally, it remains inside the telescopic part E (the hollow block with dashed lines in the figure).

[0041] Next, let's explain the steps for applying the leveling patch to the adhesive layer. When the adhesive layer is not in use, the pressing block F is inside E, and E is retracted inside D. When the leveling patch needs to be applied, A conveys the leveling patch downwards to the bottom layer. At this time, D moves to the top of the telescopic rod C, then E extends outwards, and then F protrudes downwards. Then, D drives E and F to move downwards as a whole, thereby pushing the bottom leveling patch out from the bottom of the leveler 3 and finally attaching it to the top of the component.

[0042] It should be noted that, Figure 7 The specific dimensions, the number of sections of the telescopic rod, and the requirement for two telescopic rods from both sides for large-sized leveling pads can all be adjusted according to the actual situation; they are not fixed.

[0043] The leveling device 3 of this invention enables automated lowering and application of leveling patches. Coupled with clearly defined leveling rules, it significantly improves leveling efficiency, reduces manual intervention, and ensures production continuity. The material selection for the leveling patch balances smoothness and flexibility, ensuring both the stability of the nozzle's adsorption and improving the patch's adhesion compatibility, thus preventing damage to components during the leveling process. Furthermore, by clearly distinguishing between repairable and non-repairable areas, this invention performs targeted leveling or scanning rule switching operations, avoiding production waste caused by ineffective leveling and maximizing component utilization while minimizing component scrap. Combined with the subsequent dual-nozzle suction method, it further enhances the stability of component suction, effectively avoiding the risk of components falling or impacting surrounding components after suction, leading to board scrapping, reducing rework and scrap costs, and simultaneously improving board production quality and overall production efficiency.

[0044] This invention can be applied to the production and manufacturing of circuit boards in all types of electronic fields such as servers and computers, covering categories such as AI servers, general servers, multi-node servers, edge servers, switches, storage servers and computer products.

[0045] In the above embodiments, the component pick-up control device has been described in detail. Based on the same inventive concept, the embodiments of the present invention also provide a control method for the component pick-up control device and corresponding embodiments for electronic devices.

[0046] This invention also provides a control method for the above-mentioned component pick-up control device. Figure 8 A flowchart illustrating the control method of the component pick-up control device provided in an embodiment of the present invention. Figure 8 As shown, the control method of the component pick-up control device may specifically include the following steps: S801, the data storage unit identifies the soldering process to which the component belongs and sends the top outline dimension data of the component belonging to the surface mount process to the processor.

[0047] S802 The processor synchronizes the top outline dimension data to the scanner, and calculates the effective suction force of the nozzle based on the flatness detection results of the scanner and the relevant parameters of the nozzle. Based on the effective suction force of the nozzle, it determines the risk of picking up components, so as to control the pick-and-place machine and the leveler to perform corresponding actions.

[0048] S803: The scanner receives the top outline dimension data, performs flatness detection on the top of the component according to the preset scanning rules, and feeds back the flatness detection result to the processor.

[0049] S804, the leveler, according to the processor's repair instructions, selects the corresponding specification of leveling adhesive to apply and level the uneven area on the top of the component.

[0050] In the control method of the component pick-up control device provided in the embodiments of the present invention, the data storage identifies the soldering process to which the component belongs and extracts the top shape dimension data of the surface mount process component, which can accurately screen the target processing object and provide a reliable data foundation for subsequent detection and control; the processor synchronizes the dimension data to the scanner and calculates the effective suction force and determines the pick-up risk based on the flatness detection result and the relevant parameters of the nozzle, which can identify the hidden dangers of not being able to pick up or falling off after being picked up in advance before the component is mounted, and realize risk pre-judgment and intelligent decision-making; the scanner performs flatness detection on the top of the component according to preset rules and provides real-time feedback results, which can accurately obtain the top status information of the component and provide an objective basis for suction force calculation and repair judgment; the leveler selects the appropriate leveling patch according to the processor instruction to attach and level the uneven area, which can effectively improve the adsorption conditions on the top of the component and ensure that the nozzle picks up stably and reliably. This approach addresses issues such as uneven component tops leading to failure to pick up components or components falling off after being picked up, thus preventing defects from occurring in advance, reducing rework and scrap losses, lowering manufacturing costs, and improving the stability and continuity of the mounting process, significantly enhancing board production efficiency and product quality.

[0051] Since the embodiments of the control method section correspond to the embodiments of the component pick-up control device section, please refer to the description of the embodiments of the component pick-up control device section for the embodiments of the control method section, and will not be repeated here. Furthermore, it has the same beneficial effects as the component pick-up control device mentioned above.

[0052] Furthermore, in a specific implementation, in the control method of the component pick-up control device provided in the embodiments of the present invention, step S802 involves the processor calculating the effective suction force of the nozzle based on the flatness detection result of the scanner and the relevant parameters of the nozzle, determining the pick-up risk of the component based on the effective suction force of the nozzle, and controlling the pick-up machine and the leveler to perform corresponding actions. Specifically, this may include: the processor receiving the flatness detection result fed back by the scanner; if the flatness detection result is flat, controlling the pick-up machine to pick up and place the component according to the set process; if the flatness detection result is uneven, then based on the detected unevenness... The system combines information with nozzle parameters to calculate the effective suction force of the nozzle. This effective suction force is then compared to the minimum suction force required to pick up the component, determining if there is any risk of component failure in the current state. If no risk is detected, the pick-and-place machine is controlled to pick up and place the component according to the set procedure. If a risk is detected, the system checks if the uneven area is repairable. If repair is possible, a repair command is sent to the leveler. If repair is not possible, the scanner is controlled to rescan according to preset scanning rules until a flatness test result that meets the pick-up requirements is obtained.

[0053] Furthermore, in specific implementation, the calculation of the effective suction power of the nozzle in the above steps may specifically include: determining the area of ​​the air leakage area caused by the detected unevenness information; and obtaining the effective suction power of the nozzle through a preset calculation method based on the area of ​​the air leakage area, the total area sucked by the nozzle, and the nominal total suction power of the nozzle.

[0054] Furthermore, in specific implementation, in the above steps, the effective suction force of the nozzle is compared with the minimum suction force required to pick up the component to determine whether there is a risk of picking up the component in the current state. Specifically, this may include: calculating the minimum suction force required to pick up the component based on the weight of the component, the acceleration due to gravity, and the acceleration of the nozzle during movement; if the effective suction force of the nozzle is greater than the minimum suction force required to pick up the component, it is determined that there is no risk of picking up the component; if the effective suction force of the nozzle is not greater than the minimum suction force required to pick up the component, it is determined that there is a risk of picking up the component.

[0055] Furthermore, in a specific implementation, in the control method of the component pick-up control device provided in the embodiments of the present invention, step S803, where the scanner receives top outline dimension data, performs flatness detection on the top of the component according to a preset scanning rule, and feeds back the flatness detection result to the processor, may specifically include: the scanner receiving top outline dimension data sent by the processor, determining the corresponding scanning area based on the top outline dimension data; performing flatness detection on the top of the component according to a preset first scanning rule, with the component center as the reference, and feeding back the flatness detection information to the processor. If the processor determines that the uneven area does not meet the repair conditions, it switches to a preset second scanning rule according to the processor's control instruction, using the component center as the symmetry reference, avoiding the uneven area, and performing flatness detection at symmetrical positions on both sides of the component top, and feeding back the corresponding flatness detection result to the processor; if the processor still determines that the uneven area does not meet the repair conditions, it repeats the preset second scanning rule until the flatness detection result is flat, or it is determined that there is no pick-up risk, or it is determined that the uneven area meets the repair conditions.

[0056] Furthermore, in a specific implementation, in the control method of the component pick-up control device provided in the embodiments of the present invention, step S804, the leveler selects a leveling patch of the corresponding specification to apply and level the uneven area on the top of the component according to the repair instruction of the processor. Specifically, this may include: the leveler receiving the repair instruction issued by the processor, synchronously acquiring the relevant information of the uneven area on the top of the component transmitted by the processor, determining the size parameters of the uneven area based on the acquired information; based on the determination result, selecting a leveling patch that matches the parameters of the uneven area from at least two specifications of leveling patches stored in its own storage, and determining the number of leveling patches to be used and the number of application layers; and applying and leveling the uneven area on the top of the component by using the selected leveling patch according to the application principle from the edge of the suction nozzle to the center.

[0057] For more detailed information on the working process of each of the above steps, please refer to the relevant content disclosed in the foregoing embodiments, which will not be repeated here.

[0058] Based on the same inventive concept, this invention also provides an electronic device, including the aforementioned component pick-up control device. Since the principle by which this electronic device solves the problem is similar to that of the aforementioned component pick-up control device, the implementation of this electronic device can refer to the implementation of the component pick-up control device; repeated details will not be elaborated further.

[0059] Any of the components, modules, units, parts, methods, and operations described herein can be implemented using software, firmware, hardware (e.g., fixed logic circuitry), manual processing, or any combination thereof. Alternatively or additionally, any functionality described herein can be executed at least in part by one or more hardware logic components, such as, but not limited to, a central processing unit (CPU), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), an application-specific standard product (ASSP), a system-on-chip (SoC), a complex programmable logic device (CPLD), a microcontroller unit (MCU), etc. The terms "system," "computing device," or "apparatus" as used herein encompass various means, devices, and machines for processing data, including, for example, one or more programmable processors, computers, SoCs, or combinations thereof. The apparatus may also include code that creates an execution environment for the computer program in question, such as code constituting processor firmware, a protocol stack, a database management system, an operating system, a cross-platform runtime environment, a virtual machine, or a combination thereof. The aforementioned computer program (also known as a program, software, software application, app, script, or code) can be written in any form of programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as a standalone program or as a module, component, subroutine, object, or other unit suitable for a computing environment.

[0060] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0061] The server architecture and its operation method provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only intended to help understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A component pick-up control device, characterized in that, include: A data storage device, a scanner, a leveler, and a processor connected to the data storage device, the scanner, and the leveler, respectively; The data storage is used to send the top outline size data of the components belonging to the surface mount process to the processor after identifying the soldering process to which the components belong; The processor is used to synchronize the top outline dimension data to the scanner, calculate the effective suction force of the nozzle based on the flatness detection result of the scanner and the relevant parameters of the nozzle, determine the component pick-up risk based on the effective suction force of the nozzle, and control the pick-and-place machine and the leveler to perform corresponding actions. The scanner is used to perform flatness detection on the top of the component according to a preset scanning rule, and to feed back the flatness detection result to the processor; The leveling device is used to receive repair instructions issued by the processor, synchronously acquire relevant information about the uneven area on the top of the component transmitted by the processor, determine the size parameters of the uneven area based on the acquired information, select a leveling patch that matches the parameters of the uneven area from at least two specifications of leveling patches stored in its own storage, and determine the number of leveling patches to be used and the number of application layers; and apply and level the uneven area on the top of the component using the selected leveling patch according to the principle of application from the edge of the nozzle to the center.

2. The component pick-up control device according to claim 1, characterized in that, The processor is used to receive the flatness detection result fed back by the scanner; if the flatness detection result is flat, it controls the pick-and-place machine to pick up and place the components according to the set process; if the flatness detection result is uneven, it calculates the effective suction force of the nozzle based on the detected unevenness information and the relevant parameters of the nozzle, and compares the effective suction force of the nozzle with the minimum suction force required to pick up the components to determine whether there is a risk of picking up the components in the current state.

3. The component pick-up control device according to claim 2, characterized in that, The processor is configured to, if it is determined that there is no risk of pick-up, control the pick-and-place machine to pick up and place the components according to the set process; if it is determined that there is a risk of pick-up, determine whether the uneven area is repairable; if it is determined that the repairable area is repairable, issue a repair command to the leveler; if it is determined that the repairable area is not repairable, control the scanner to rescan according to the preset scanning rules until a flatness detection result that meets the pick-up conditions is obtained.

4. The component pick-up control device according to claim 2, characterized in that, The processor is used to determine the area of ​​the air leakage area caused by the detected unevenness information; and to obtain the effective suction force of the nozzle by combining the area of ​​the air leakage area with the total area sucked by the nozzle and the nominal total suction force of the nozzle through a preset calculation method.

5. The component pick-up control device according to claim 2, characterized in that, The processor is used to calculate the minimum suction force required to pick up the component based on the weight of the component body, the acceleration due to gravity, and the acceleration when the nozzle moves; if the effective suction force of the nozzle is greater than the minimum suction force required to pick up the component, it is determined that there is no risk of picking up the component; if the effective suction force of the nozzle is not greater than the minimum suction force required to pick up the component, it is determined that there is a risk of picking up the component.

6. The component pick-up control device according to claim 1, characterized in that, The scanner is used to receive the top outline dimension data sent by the processor, determine the corresponding scanning area based on the top outline dimension data, perform flatness detection on the top of the component according to a preset first scanning rule with the center of the component as the reference, and feed back the flatness detection information to the processor.

7. The component pick-up control device according to claim 3, characterized in that, The scanner is configured to, if the processor determines that the uneven area is not suitable for repair, switch to a preset second scanning rule according to the processor's control instructions, using the component center as a symmetry reference, avoid the uneven area, and perform flatness detection at symmetrical positions on both sides of the top of the component, and feed back the corresponding flatness detection results to the processor; if the processor still determines that the uneven area is not suitable for repair, the preset second scanning rule is repeated until the flatness detection result is flat, or it is determined that there is no risk of absorption, or it is determined that the uneven area is suitable for repair.

8. A control method for a component pick-up control device as described in any one of claims 1 to 7, characterized in that, include: The data storage device identifies the soldering process to which the component belongs and sends the top outline dimension data of the component belonging to the surface mount process to the processor; The processor synchronizes the top outline dimension data to the scanner, and calculates the effective suction force of the nozzle based on the flatness detection results of the scanner and the relevant parameters of the nozzle. Based on the effective suction force of the nozzle, it determines the risk of component pickup, so as to control the pick-and-place machine and the leveler to perform corresponding actions. The scanner receives the top outline dimension data, performs flatness detection on the top of the component according to a preset scanning rule, and feeds back the flatness detection result to the processor; The leveling device receives the repair command issued by the processor, synchronously acquires the relevant information of the uneven area on the top of the component transmitted by the processor, and determines the size parameters of the uneven area based on the acquired information. Based on the determination result, it selects a leveling patch that matches the parameters of the uneven area from at least two specifications of leveling patches stored in its own storage, and determines the number of leveling patches to be used and the number of application layers. Following the application principle from the edge of the nozzle to the center, the leveling device applies and levels the uneven area on the top of the component using the selected leveling patch.

9. An electronic device, characterized in that, Includes the component pick-up control device as described in any one of claims 1 to 7.

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