Vacuum adsorption device, detection and transfer system and detection and transfer method

Abstract

This application provides a vacuum adsorption device, a detection and transfer system, and a detection and transfer method. The vacuum adsorption device is used to adsorb and transfer abnormal LED beads, which are LED beads that cannot be lit normally. The vacuum adsorption device includes a base and a photodeformation structure. The base has multiple adsorption channels; the photodeformation structure is located inside the adsorption channels and is configured to expand in response to incident light during vacuum adsorption to block airflow within the adsorption channels. The structure of the vacuum adsorption device, consisting of the base, adsorption channels, and photodeformation structure, enables the photodeformation structure to expand under incident light to block airflow, thereby achieving the adsorption and transfer of abnormal LED beads while preventing the adsorption of normal LED beads, further improving detection efficiency.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a vacuum adsorption device, a detection and transfer system, and a detection and transfer method. Background Technology

[0002] Existing MiniLED (miniature light-emitting diode) / MicroLED (micron-level light-emitting diode) display devices contain tens of thousands of LED (light-emitting diode) beads, which places extremely high demands on raw materials and processes.

[0003] Current detection technology relies on mechanical probes to power on each individual LED chip individually (by receiving light signals through a photodetector), resulting in low detection efficiency. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a vacuum adsorption device, a detection and transfer system, and a detection and transfer method, thereby solving the problem of low detection efficiency in existing technologies and the need to test a large number of LED beads one by one.

[0005] To solve the aforementioned technical problems, the first technical solution provided in this application is: a vacuum adsorption device for adsorbing and transferring abnormal LED beads, wherein the abnormal LED beads are LED beads that cannot be lit normally; wherein, it includes: The base is equipped with multiple adsorption channels; A photodeformable structure, located inside the adsorption channel, is configured to expand in response to incident light during vacuum adsorption to block airflow within the adsorption channel.

[0006] In some embodiments, the vacuum adsorption device further includes a first limiting member and a second limiting member spaced apart within the adsorption pipe, with the first limiting member and the second limiting member defining a receiving space; the photodeformation structure is located within the receiving space.

[0007] In some embodiments, the first limiting member and the second limiting member are mesh panels, and the maximum effective outer dimension of the photodeformation structure in its natural state is greater than the minimum passage size of the mesh openings of the mesh panel.

[0008] In some embodiments, the photodeformation structure is spherical, and the cross-section of the accommodating space in the direction of the base plate is circular.

[0009] In some embodiments, the adsorption pipe is a conical tube, and the inner diameter of the adsorption pipe gradually decreases from the first end to the second end; the first end is used to adsorb lamp beads, and the second end is used to connect to a vacuum source; the maximum effective outer dimension of the photodeformation structure in its natural state is smaller than the minimum inner diameter of the conical tube.

[0010] In some embodiments, the inner wall surface of the adsorption pipe is a light-shielding surface or a reflective surface.

[0011] In some embodiments, the adsorption conduit is at least partially enclosed by the body of the base; or, the adsorption conduit is enclosed by a tubular structure penetrating the base.

[0012] In some embodiments, the vacuum adsorption device further includes a third limiting member disposed on the inner wall of the adsorption pipe and located within the accommodating space to limit the displacement of the photo-deformed structure under deformation.

[0013] To address the aforementioned technical problems, the second technical solution provided in this application is: a detection and transfer system, comprising: The substrate to be tested has multiple flip-chip LEDs. A vacuum adsorption device is used to adsorb and transfer abnormal LED beads on the substrate to be tested; the vacuum adsorption device is the aforementioned vacuum adsorption device. A driving device is used to apply a driving signal to the LED beads during the adsorption process to light up the LED beads that are in normal working order.

[0014] To solve the above-mentioned technical problems, the third technical solution provided in this application is: to provide a detection transfer method, which uses the above-mentioned detection transfer system to perform detection transfer, wherein the method includes: Align the adsorption pipe of the vacuum device with the LED beads on the substrate to be tested; Apply a drive signal to the LED chip to light up the LED chip that is functioning normally; Activate the vacuum adsorption device to adsorb and transfer the abnormal LED beads.

[0015] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a vacuum adsorption device, a detection and transfer system, and a detection and transfer method. The vacuum adsorption device is used to adsorb and transfer abnormal LED beads, which are LED beads that cannot be lit normally. The vacuum adsorption device includes a base and a photodeformation structure. The base has multiple adsorption channels; the photodeformation structure is located inside the adsorption channels and is configured to expand in response to incident light during vacuum adsorption to block airflow within the adsorption channels. The structure of the base, adsorption channels, and photodeformation structure of the vacuum adsorption device enables the photodeformation structure to expand under incident light to block airflow, thereby achieving the adsorption and transfer of abnormal LED beads while preventing the adsorption of normal LED beads, further improving detection efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0017] Figure 1 This is a schematic diagram of a module of an embodiment of the detection and transfer system provided in this application; Figure 2 This is a schematic diagram of the structure of an embodiment of the detection and transfer system provided in this application; Figure 3 This is a schematic diagram of the structure of an embodiment of the LED provided in this application; Figure 4 This is a schematic diagram of the structure of the first embodiment of the vacuum adsorption device provided in this application; Figure 5 This is a schematic diagram of the structure of the second embodiment of the vacuum adsorption device provided in this application; Figure 6 This is a schematic diagram of the structure of the third embodiment of the vacuum adsorption device provided in this application; Figure 7 This is a schematic diagram of the structure of the fourth embodiment of the vacuum adsorption device provided in this application; Figure 8 This is a schematic diagram of the structure of the fifth embodiment of the vacuum adsorption device provided in this application; Figure 9 This is a schematic diagram of the sixth embodiment of the vacuum adsorption device provided in this application; Figure 10 This is a flowchart illustrating one embodiment of the detection transfer method provided in this application; Figure 11 yes Figure 10 Structural diagrams corresponding to the implementation methods of steps S1 to S3; Figure 12 yes Figure 11 A schematic diagram of the structure restoration of the photo-induced deformation structure after the abnormal LED bead is transferred; Figure 13 yes Figure 10 A schematic diagram of the structure corresponding to another embodiment of steps S1 to S3; Figure 14 yes Figure 10 A schematic diagram of the structure restoration after the abnormal LED bead is transferred, showing the photo-induced deformation structure.

[0018] Explanation of icon numbers: 100. Vacuum adsorption device; 10. Base; 20. Photodeformation structure; 30. Adsorption pipe; 31. First pipe section; 32. Second pipe section; 40. First limiting member; 50. Second limiting member; 60. Third limiting member; 70. Accommodation space; 200. Substrate to be tested; 210. Substrate; 211. Connecting electrode; 220. Lamp bead; 221. Light-emitting chip; 222. Packaging structure; 2221. Reflective layer; 2222. Packaging element; 223. Optical protective layer; 230. Solder paste; 300. Driving device; 1. Detection and transfer system. Detailed Implementation

[0019] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0020] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] In existing technologies, the most common method is to power on the LED beads using a probe and receive the light signal using a photodetector, thereby performing photoelectric detection on each LED bead individually. Then, the position data of the LED beads that are not working properly is transferred to a transfer machine, which removes the LED beads that do not meet the requirements. This method requires the probe to move mechanically when switching the position of the LED beads, powering on a large number of LED beads individually, resulting in extremely low measurement efficiency. Furthermore, the probe may block the light-emitting area of ​​the LED beads, affecting the accuracy of the measurement. The probe size is limited, and for extremely small LED beads, the probe may be difficult to align or may easily damage the LED beads.

[0025] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of a module of an embodiment of the detection and transfer system provided in this application. Figure 2 This is a schematic diagram of an embodiment of the detection and transfer system provided in this application. Figure 3 This is a schematic diagram of the structure of an embodiment of the LED provided in this application.

[0026] This application provides a detection and transfer system 1, which includes a substrate 200 to be tested, a vacuum adsorption device 100, and a driving device 300. The substrate 200 to be tested has a plurality of flip-chip LEDs 220. The vacuum adsorption device 100 is used to adsorb and transfer abnormal LEDs 224 on the substrate 200 to be tested; the driving device 300 is used to apply a driving signal to the LEDs 220 during the adsorption process to light up the LEDs 220 that are functioning normally.

[0027] The substrate 200 to be tested is provided with a plurality of flip-chip LEDs 220. Specifically, each LED 220 has a light-emitting surface and an electrode surface that are arranged opposite to each other. During the adsorption process, the light-emitting surface of the LED 220 is positioned facing the vacuum adsorption device 100.

[0028] In some embodiments, the substrate 200 to be tested includes a substrate 210 and a plurality of LED beads 220 disposed on the substrate 210, the electrodes of the LED beads 220 being electrically connected to the substrate 210. Exemplarily, the electrodes of the LED beads 220 are connected to the connection electrodes 211 of the substrate 210 via solder paste 230. The LED beads 220 include a light-emitting chip 221, a packaging structure 222, and an optical protective layer 223. The light-emitting chip 221 includes a semiconductor light-emitting layer; the packaging structure 222 is composed of a reflective layer 2221 and packaging elements 2222; the optical protective layer 223 is a transparent protective adhesive covering the light-emitting surface of the light-emitting chip 221, used to protect the chip and optimize light output. The packaging structure 222 and the optical protective layer 223 surround the light-emitting chip 221.

[0029] In some embodiments, the LED 220 is a MiniLED or a MicroLED.

[0030] The driving device 300 is connected to the electrode of the lamp bead 220 and is used to apply a driving signal to make the normal lamp bead 220 emit light.

[0031] Please see Figures 4 to 6 , Figure 4 This is a schematic diagram of the structure of the first embodiment of the vacuum adsorption device provided in this application. Figure 5 This is a schematic diagram of the structure of the second embodiment of the vacuum adsorption device provided in this application. Figure 6 This is a schematic diagram of the third embodiment of the vacuum adsorption device provided in this application.

[0032] This application provides a vacuum adsorption device 100 for adsorbing and transferring abnormal LED beads 224, wherein the abnormal LED beads 224 are LED beads 220 that cannot be lit normally; the vacuum adsorption device 100 includes a base 10 and a photodeformation structure 20. The base 10 is provided with a plurality of adsorption channels 30; the photodeformation structure 20 is located inside the adsorption channels 30 and is configured to expand in response to incident light during the vacuum adsorption process to block the airflow inside the adsorption channels 30.

[0033] The structure of the vacuum adsorption device 100, consisting of the base 10, the adsorption pipe 30, and the photodeformation structure 20, enables the photodeformation structure 20 to expand under incident light to block airflow, thereby achieving the adsorption and transfer of abnormal LED beads 224 while normal LED beads 220 are not adsorbed, further improving detection efficiency.

[0034] By utilizing the property that the photodeformation structure 20 in the vacuum adsorption device 100 expands under light to block the airflow in the adsorption pipe 30, the adsorption pipe 30 corresponding to the normal LED bead 220 cannot generate negative pressure, while the adsorption pipe 30 corresponding to the abnormal LED bead 224 can generate negative pressure, thereby realizing the automatic detection and transfer of the abnormal LED bead 224. This structure enables the system to process abnormal LED beads 224 in batches without the need for mechanically moving probes, thus improving detection efficiency and accuracy.

[0035] The adsorption channel 30 has a first end and a second end arranged along its axial direction. The first end is used to adsorb the LED bead 220, and the second end is used to connect to a vacuum source, such as a vacuum pump. A vacuum pump is used to evacuate the adsorption channel 30, establishing a negative pressure field, thereby generating sufficient adsorption force to stably pick up the LED bead 220. During the adsorption process, the orthographic projection of the first end of the adsorption channel 30 lies within the light-emitting surface of the corresponding LED bead 220.

[0036] When the vacuum adsorption device 100 is working (i.e. during the vacuum adsorption process), the normal LED bead 220 is powered on and emits light to form incident light, which irradiates the photodeformation structure 20 in the corresponding adsorption pipe 30, causing it to expand and block the adsorption pipe 30, blocking the air flow in the adsorption pipe 30. As a result, a negative pressure cannot be generated at the first end of the adsorption pipe 30, so the normal LED bead 220 cannot be adsorbed and remains in its original position. The abnormal LED bead 224 cannot emit light, and its corresponding photodeformation structure 20 remains in its natural state, without blocking the air flow in the adsorption pipe 30. A negative pressure can be generated at the first end of the adsorption pipe 30 to adsorb the abnormal LED bead 224 and transfer it.

[0037] The photodeformation structure 20 is always located inside the adsorption channel 30 and is a photoresponsive polymer material.

[0038] In some embodiments, the photodeformation structure 20 is a reversible deformation structure. The photodeformation structure 20 returns to its natural state, i.e., its initial state, under the influence of no incident light. The reversible deformation characteristic of the photodeformation structure 20 facilitates the reuse of the vacuum adsorption device 100 and improves the overall production yield.

[0039] In some embodiments, the photodeformation structure 20 includes a polymer backbone, a photoresponsive unit, and a crosslinking agent.

[0040] The polymer backbone, composed of siloxane or polyacrylic acid segments, provides an elastic network framework. The photoresponsive unit, an azobenzene derivative, undergoes cis-trans isomerization under light irradiation, leading to changes in molecular configuration and inducing network stress, thereby triggering macroscopic deformation of the material. The crosslinking agent, containing reversible dynamic bonds (dynamic CN or diselenylene bonds), connects the polymer chains to form a three-dimensional network, enabling the material to be reshaped and self-healing after deformation.

[0041] In some embodiments, the vacuum adsorption device 100 further includes a first limiting member 40 and a second limiting member 50 spaced apart within the adsorption pipe 30, with the first limiting member 40 and the second limiting member 50 defining a receiving space 70; the photodeformation structure 20 is located within the receiving space 70.

[0042] The first limiting member 40 and the second limiting member 50 are structures spaced apart inside the adsorption pipe 30, arranged opposite each other along the axial direction of the adsorption pipe 30 to form a receiving space 70. This design ensures that the photodeformation structure 20 remains within the receiving space 70 during the adsorption process and will not be moved out of the adsorption pipe 30 due to vacuum adsorption force, thus ensuring that it always remains inside the adsorption pipe 30 and can be reused.

[0043] For example, such as Figure 4 As shown, the first limiting member 40 is located between the first end and the second end of the adsorption pipe 30, and the second limiting member 50 is located at the second end of the adsorption pipe 30.

[0044] The photodeformation structure 20 can be configured to be movably disposed within the receiving space 70, or it can be configured to be immovably disposed within the receiving space 70.

[0045] The first limiting member 40 and the second limiting member 50 are mesh plates. The maximum effective outer dimension of the photodeformation structure 20 in its natural state is greater than the minimum passage size of the mesh plate.

[0046] For example, the photodeformation structure 20 is configured to be movably disposed within the receiving space 70. During the operation of the vacuum adsorption device 100, when the lamp bead 220 fails to emit light, the photodeformation structure 20 remains in its natural state, its size being larger than the minimum passage size of the mesh and thus unable to pass through the mesh, and is thus confined within the receiving space 70; when the lamp bead 220 emits light normally, the photodeformation structure 20 expands and enlarges under light, its size still being larger than the minimum passage size of the mesh and thus unable to pass through the mesh, and is thus confined within the receiving space 70.

[0047] The mesh plate has multiple mesh holes to prevent the photodeformation structure 20 from blocking the mesh holes even when the LED bead 220 fails to emit light abnormally during the adsorption process, thus preventing it from vacuuming and adsorbing the abnormal LED bead 224 and affecting the accuracy of LED bead 220 detection.

[0048] Within a single adsorption channel 30, there may be multiple or one photodeformation structure 20, and / or the photodeformation structure 20 may be regular or irregular in shape. It is only necessary to ensure that during the adsorption process, when the photodeformation structure 20 is not illuminated, the adsorption channel 30 can be evacuated to adsorb abnormal LED beads 224, and when the photodeformation structure 20 is illuminated, the adsorption channel 30 cannot be evacuated and normal LED beads 220 cannot be adsorbed.

[0049] In some embodiments, the photodeformation structure 20 is spherical, and the cross-section of the accommodating space 70 in the direction of the plate surface of the base 10 is circular.

[0050] For example, the photodeformation structure 20 is spherical. The cross-section of the accommodating space 70 in the direction of the base 10 plate is circular, which matches the geometric characteristics of the spherical photodeformation structure 20, ensuring that the photodeformation structure 20 has no directional resistance during expansion.

[0051] The spherical photodeformation structure 20 allows it to expand uniformly when illuminated, avoiding jamming or uneven expansion caused by irregular shape, thereby improving the reliability of abnormal LED beads 224 detection.

[0052] In some embodiments, such as Figure 4 As shown, the adsorption pipe 30 is a conical tube, and the inner diameter of the adsorption pipe 30 gradually decreases from the first end to the second end; the first end is used to adsorb the lamp bead 220, and the second end is used to connect to the vacuum source; the maximum effective outer dimension of the photodeformation structure 20 in its natural state is smaller than the minimum inner diameter of the conical tube.

[0053] In the initial state (i.e., before vacuuming begins), the photodeformation structure 20 is in its natural state at the first limiting member 40 of the adsorption pipe 30. During adsorption, the vacuum suction force causes the photodeformation structure 20 to move towards the second end of the adsorption pipe 30. The unlit photodeformation structure 20 remains in its natural state because its size is smaller than the minimum inner diameter of the conical tube, and it cannot block the airflow inside the adsorption pipe 30, thus allowing the corresponding LED bead 220 to be adsorbed. When the photodeformation structure 20 is illuminated, it expands and enlarges, blocking the adsorption pipe 30 to prevent the airflow inside. Negative pressure cannot be formed in the section from the photodeformation structure 20 to the first end, and the corresponding LED bead 220 cannot be adsorbed.

[0054] The first end of the adsorption pipe 30 has the largest inner diameter so that the incident light generated by the light emitted by the lamp bead 220 can illuminate the photodeformation structure 20 as much as possible, thereby causing it to expand fully and block the air flow inside the adsorption pipe 30, thus improving the detection accuracy.

[0055] In other embodiments, the adsorption pipe 30 can be a cylindrical pipe or other regular or irregular pipe structure. For example, the accommodating space 70 is located in the middle section of the adsorption pipe 30, and the pipe section from the accommodating space 70 to the first or second end can be a regular or irregular structure such as a cone or rectangle.

[0056] In other embodiments, such as Figure 5As shown, the first limiting member 40 and the second limiting member 50 are both located between the first and second ends of the adsorption pipe 30, and the accommodating space 70 is cylindrical. The photodeformation structure 20 is cylindrical, and its cross-section in the direction of the plate surface of the base 10 is circular. The first limiting member 40 and the second limiting member 50 fix the photodeformation structure 20 in the accommodating space 70, that is, the photodeformation structure 20 is configured to be immovably disposed in the accommodating space 70. For example, in some specific embodiments, the first limiting member 40 and the second limiting member 50 sandwich the photodeformation structure 20. The outer diameter of the photodeformation structure 20 in its natural state is smaller than the inner diameter of the pipe section in which the accommodating space 70 is located. During the vacuum adsorption process, the photodeformation structure 20 that is not illuminated cannot block the airflow in the adsorption pipe 30, while the photodeformation structure 20 that is illuminated expands radially to abut against the inner wall of the adsorption pipe 30 to block the adsorption pipe 30, thereby blocking the airflow inside it.

[0057] In some embodiments, the inner wall surface of the adsorption pipe 30 is a light-shielding surface or a reflective surface.

[0058] The light-shielding surface refers to the surface that absorbs or blocks light, while the reflective surface refers to the surface that reflects light. When the LED bead 220 is emitting light normally, the reflective surface enhances the internal light intensity, causing the photodeformation structure 20 to fully expand under light to block the adsorption channel 30.

[0059] For example, a black matte coating can be used as the light-shielding material.

[0060] When the LED bead 220 fails to emit light, the light-shielding surface blocks stray light from entering the adsorption channel 30, maintaining a light-free state and keeping the photodeformation structure 20 in its original state.

[0061] For example, polished aluminum film can be used as the reflective surface material, or the inner wall can be designed with a microstructure texture to optimize light reflection efficiency.

[0062] In other embodiments, the outer wall surface of the adsorption pipe 30 can be a light-shielding surface or a reflective surface to block external stray light from entering the interior of the adsorption pipe 30 during the vacuum adsorption process.

[0063] In some embodiments, the adsorption conduit 30 is at least partially enclosed by the body of the base 10; or, the adsorption conduit 30 is enclosed by a tubular structure penetrating the base 10.

[0064] In some specific embodiments, the adsorption pipe 30 is entirely formed by the body of the base 10. The structure in which the base 10 forms the adsorption pipe 30 makes the pipe and the base 10 an integral whole, reducing the number of assembly interfaces and components.

[0065] In other specific embodiments, the adsorption pipe 30 is partially formed by the body of the base 10 and partially formed by an external structure.

[0066] In some other embodiments, the adsorption pipe 30 is formed by a tubular structure penetrating the base 10. This tubular structure penetrating the base 10 to form the adsorption pipe 30 allows for independent replacement or customization of the adsorption pipe 30, thereby improving the ease of maintenance and long-term reliability of the device.

[0067] For example, the adsorption pipe 30 is partially formed by the body of the base 10 and partially formed by an external structure. Figure 6 As shown, in some specific embodiments, the adsorption pipe 30 includes a first pipe section 31 and a second pipe section 32 connected together. The first pipe section 31 is cylindrical, and the second pipe section 32 is conical. The first pipe section 31 penetrates the base 10. The smallest inner diameter of the second pipe section 32 is connected to the first pipe section 31, and the largest inner diameter of the second pipe section 32 serves as the first end of the adsorption pipe 30. The adsorption pipes 30 are arranged in a one-to-one correspondence with the LED beads 220. In other specific embodiments, the adsorption pipes 30 are cylindrical, and two adsorption pipes 30 correspond to one LED bead 220, for simultaneously adsorbing the corresponding LED beads 220.

[0068] Please see Figures 7 to 9 , Figure 7 This is a schematic diagram of the fourth embodiment of the vacuum adsorption device provided in this application. Figure 8 This is a schematic diagram of the fifth embodiment of the vacuum adsorption device provided in this application. Figure 9 This is a schematic diagram of the sixth embodiment of the vacuum adsorption device provided in this application.

[0069] In some embodiments, such as Figure 7 As shown, the vacuum adsorption device 100 also includes a third limiting member 60, which is disposed on the inner wall of the adsorption pipe 30 and located within the accommodating space 70 to limit the displacement of the photo-deformed structure 20 under deformed state.

[0070] The third limiting member 60 is used to provide a contact point to limit the axial displacement of the photodeformation structure 20 as it expands.

[0071] The third limiting member 60 is located between the first limiting member 40 and the second limiting member 50, so that the expanded photodeformed structure 20 is restricted between the third limiting member 60 and the first limiting member 40.

[0072] The third limiting member 60 can be a protruding structure disposed on the inner wall of the adsorption pipe 30. The protruding structure is annular, or the protruding structure includes multiple dot-shaped protrusions, and the multiple dot-shaped protrusions are distributed along the circumference of the adsorption pipe 30. The third limiting member 60 can also be a mesh plate.

[0073] It should be noted that in some embodiments, the third limiting member 60 can allow the photo-deformed structure 20 in its natural state to pass through. For example, the third limiting member 60 is a ring-shaped protrusion, the inner diameter of which is larger than the maximum effective outer dimension of the photo-deformed structure 20 in its natural state. In other embodiments, the third limiting member 60 can prevent the photo-deformed structure 20 in its natural state from passing through (in this case, the second limiting member 50 and the third limiting member 60 provide double protection to prevent the photo-deformed structure 20 from being moved out of the adsorption pipe 30 during the vacuuming process). For example, the third limiting member 60 is a mesh plate.

[0074] For example, the protruding structure is annular, and the surface of the protruding structure arranged axially upward along the adsorption pipe 30 is inclined. Specifically, the cross-section of the protruding structure along the direction perpendicular to the surface of the base 10 plate is triangular. The surface of the protruding structure facing the first end of the adsorption pipe 30 is inclined to reduce the contact area between the protruding structure and the adsorption pipe 30; and the surface of the protruding structure facing the second end of the adsorption pipe 30 is inclined to guide the photodeformation structure 20 to slide down.

[0075] Exemplarily, in some embodiments, such as Figure 6 and Figure 7 As shown, in Figure 6 A third limiting element 60 is added to the adsorption pipe 30 shown.

[0076] Exemplarily, in other embodiments, such as Figure 8 As shown, the adsorption pipe 30 is cylindrical, and the third limiting member 60 is located between the first limiting member 40 and the second limiting member 50.

[0077] Exemplarily, in other embodiments, such as Figure 9 As shown, the adsorption pipe 30 includes a cylindrical first pipe section 31 and two conical second pipe sections 32. The first pipe section 31 is located between the two second pipe sections 32, and the second pipe section 32 with the smallest inner diameter is connected to the first pipe section 31. The first pipe section 31 is entirely enclosed by the body of the base 10. A third limiting member 60 and a first limiting member 40 are respectively disposed at both ends of the first pipe section 31 along its axial direction, and a second limiting member 50 is disposed at the second end of the adsorption pipe 30. That is, the photodeformation structure 20 is configured to move within the space enclosed by the body of the base 10. The body of the base 10 serves as the pipe wall of the first pipe section 31, which can enhance the stability of the pipe wall of the first pipe section 31 and prevent the photodeformation structure 20 from expanding and squeezing the inner wall of the adsorption pipe 30, thus avoiding displacement or deformation of the adsorption pipe 30.

[0078] The third limiting member 60 is a structure that restricts the displacement of the photo-induced deformation structure 20 in the deformed state, so that the photo-induced deformation structure 20 remains stable during the expansion process.

[0079] Please see Figure 7 , Figure 8 , Figures 10 to 14 , Figure 10 This is a flowchart illustrating one embodiment of the detection transfer method provided in this application. Figure 11 yes Figure 10 Structural diagrams corresponding to the embodiments of steps S1 to S3 are shown below. Figure 12 yes Figure 11 A schematic diagram of the structure restoration after the abnormal LED chip is transferred, showing the photo-induced deformation structure. Figure 13 yes Figure 10 A structural diagram corresponding to another embodiment of steps S1 to S3 is shown. Figure 14 yes Figure 10 A schematic diagram of the structure restoration after the abnormal LED bead is transferred, showing the photo-induced deformation structure.

[0080] This application provides a detection transfer method, which uses the above-mentioned detection transfer system 1 to perform detection transfer, wherein the detection transfer method includes: Step S1: Align the adsorption pipe of the vacuum device with the LED beads on the substrate to be tested.

[0081] Specifically, the vacuum adsorption device 100 and / or the substrate to be tested 200 are moved to align the adsorption channel 30 with the lamp bead 220.

[0082] In some implementations, a single adsorption channel 30 corresponds to a single LED 220.

[0083] In other embodiments, multiple adsorption channels 30 correspond to a single LED bead 220. For example, two adsorption channels 30 are used to adsorb a single LED bead 220 simultaneously.

[0084] Step S2: Apply a drive signal to the LED to light up the LED that is functioning normally.

[0085] Specifically, the driving device 300 applies a driving signal to the LED beads 220 on the substrate 200 to be tested. Normal LED beads 220 emit light, while abnormal LED beads 224 remain non-emitting light.

[0086] Step S3: Activate the vacuum adsorption device to adsorb and transfer abnormal LED beads.

[0087] Specifically, the vacuum adsorption device 100 is activated to perform a vacuuming operation.

[0088] The abnormal LED bead 224 does not emit light, resulting in no incident light irradiating the photodeformation structure 20 in the corresponding adsorption channel 30. The photodeformation structure 20 does not deform, and the adsorption channel 30 remains unobstructed, thereby forming a negative pressure to adsorb and transfer the abnormal LED bead 224, thus removing the abnormal LED bead 224 from the substrate 200 to be tested.

[0089] When the normal LED bead 220 emits light, incident light shines into the corresponding adsorption channel 30 and onto the photodeformation structure 20, causing it to expand and block the adsorption channel 30. This prevents the formation of a negative pressure to adsorb the normal LED bead 220, thus keeping the normal LED bead 220 on the substrate 200 to be tested.

[0090] After the abnormal LED bead 224 is adsorbed and transferred, the drive device 300 is turned off, the LED bead 220 stops emitting light, and the photodeformed structure 20 that has expanded in the adsorption pipe 30 returns to its natural state due to the lack of incident light, and is located at the first limiting member 40.

[0091] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0092] The above are merely embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A vacuum adsorption device for adsorbing and transferring abnormal LED beads, wherein the abnormal LED beads are LED beads that cannot be lit normally; characterized in that, include: The base is equipped with multiple adsorption channels; A photodeformable structure is located inside the adsorption channel and is configured to expand in response to incident light during vacuum adsorption to block airflow within the adsorption channel. The vacuum adsorption device further includes a first limiting member and a second limiting member spaced apart within the adsorption pipe, with the first limiting member and the second limiting member defining a receiving space; the photodeformation structure is located within the receiving space; The first and second limiting members are mesh panels, and the maximum effective outer dimension of the photodeformation structure in its natural state is greater than the minimum passage size of the mesh openings of the mesh panel.

2. The vacuum adsorption device according to claim 1, characterized in that, The photodeformation structure is spherical, and the accommodating space has a circular cross-section in the direction of the plate surface of the base.

3. The vacuum adsorption device according to claim 2, characterized in that, The adsorption pipe is a conical tube, and the inner diameter of the adsorption pipe gradually decreases from the first end to the second end; the first end is used to adsorb lamp beads, and the second end is used to connect to a vacuum source; the maximum effective outer dimension of the photodeformation structure in its natural state is smaller than the minimum inner diameter of the conical tube.

4. The vacuum adsorption device according to claim 1, characterized in that, The inner wall of the adsorption pipe is a light-shielding surface or a reflective surface.

5. The vacuum adsorption device according to claim 1, characterized in that, The adsorption conduit is at least partially enclosed by the body of the base; or, the adsorption conduit is enclosed by a tubular structure penetrating the base.

6. The vacuum adsorption device according to claim 1, characterized in that, The vacuum adsorption device further includes a third limiting member, which is disposed on the inner wall of the adsorption pipe and located within the accommodating space to limit the displacement of the photo-deformed structure under deformation.

7. A detection and transfer system, characterized in that, include: The substrate to be tested has multiple flip-chip LEDs. A vacuum adsorption device is used to adsorb and transfer abnormal LED beads on the substrate to be tested. The vacuum adsorption device is the vacuum adsorption device according to any one of claims 1 to 6; A driving device is used to apply a driving signal to the LED beads during the adsorption process to light up the LED beads that are in normal working order.

8. A detection transfer method, comprising using the detection transfer system of claim 7 for detection transfer, characterized in that, include; Align the adsorption pipe of the vacuum device with the LED beads on the substrate to be tested; A drive signal is applied to the LED to illuminate the LED that is functioning normally; The vacuum adsorption device is activated to adsorb and transfer the abnormal LED beads.

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