Resin supply device, resin molded article manufacturing device, and resin molded article manufacturing method
By coordinating the detection and control departments, the pressing and chuck movements in the resin supply device are precisely controlled, solving the problem of continuous resin material ejection and improving the quality and production efficiency of resin molded products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TOWA
- Filing Date
- 2024-08-14
- Publication Date
- 2026-06-23
AI Technical Summary
In existing resin supply devices, resin material continues to be ejected even after the pressing part stops moving, resulting in droplet and liquid flow phenomena. This makes it difficult to accurately control the supply amount, affecting the quality of resin molded products and production efficiency.
The resin material supply is detected by a detection unit, and the operation of the pressing unit and the chuck is controlled by a control unit. The pressing unit stops moving and the chuck closes when the first predetermined value and the second predetermined value are reached, respectively, so as to accurately control the resin material supply.
It enables precise control of the resin material supply, improves the quality and production efficiency of resin molded products, shortens the supply time, and reduces the variability of the supply.
Smart Images
Figure CN122270366A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a resin supply apparatus, an apparatus for manufacturing resin molded articles, and a method for manufacturing resin molded articles. Background Technology
[0002] As disclosed in Japanese Patent Application Publication No. 2018-134846 (Patent Document 1), a resin supply device for supplying resin material to an object is known. The device described in Patent Document 1 includes a syringe, a nozzle, a plunger, and a clamp valve. The clamp valve opens and closes the nozzle by clamping it. When the plunger stops descending, the clamp valve closes, thereby stopping the dispensing of liquid resin from the nozzle.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-134846 Summary of the Invention
[0006] The problem that the invention aims to solve
[0007] In a resin supply device, when the pressing part (such as a plunger) inside the resin-containing receiving part (such as a syringe) stops moving, the resin inside the receiving part is no longer pressurized. Even after the pressing part stops moving, resin material continues to be ejected from the dispensing part (such as a nozzle) for a period of time. This phenomenon of continuous ejection from the dispensing part after the pressing part stops moving is also called "droplet" or similar term.
[0008] In a resin supply device, a component called a chuck can be used. The chuck is configured to contact the dispensing section and open or close the internal space of the dispensing section. For example, when dropleting occurs, the chuck is driven to change from an open state to a closed state to prevent the continuous supply of resin material to the object being supplied.
[0009] When the chuck closes, some of the resin material adhering to the internal space of the ejector is squeezed out and supplied to the object being fed. Furthermore, the up-and-down movement of the resin supply device promotes the ejection of the resin material. This series of actions is also referred to as "liquid flow," etc.
[0010] Ensuring the final weight of resin material supplied to the object is close to the desired value helps improve the quality of resin molded products, such as size and shape. Accurately controlling the supply of resin material caused by droplets and flow, and ensuring the final weight of resin material supplied to the object is close to the desired value, requires time. There is a need to reduce these required times and improve the production efficiency of resin molded products.
[0011] The purpose of this specification is to disclose a resin supply device, a resin molding manufacturing apparatus, and a method for manufacturing resin moldings, which can help improve the quality and production efficiency of resin moldings.
[0012] Technical means to solve the problem
[0013] A resin supply device for supplying resin material to a supply object includes: a receiving section for receiving the resin material and having a dispensing section for discharging the resin material; a pressing mechanism having a pressing part inserted into the receiving section, wherein the resin material is extruded from the dispensing section by movement of the pressing part; a detection section for detecting the weight of the resin material extruded from the dispensing section and supplied to the supply object; and an opening and closing mechanism having a chuck configured to form an open state and a closed state, wherein the resin material extruded from the dispensing section is allowed to reach the supply object in the open state of the chuck. The chuck is closed to prevent the resin material extruded from the ejector from reaching the object to be supplied; a control unit is used to control the movement of the pressing part and the opening and closing action of the chuck; wherein, if the weight of the resin material extruded from the ejector and supplied to the object to be supplied, as detected by the detection unit, is set as the detection weight, the control unit stops the movement of the pressing part when the detection weight reaches a first predetermined value or above, and after the pressing part stops moving, when the detection weight reaches a second predetermined value or above, changes the chuck from the open state to the closed state.
[0014] An apparatus for manufacturing resin molded articles, comprising the resin supply device.
[0015] A method for manufacturing a resin-molded article using the apparatus for manufacturing the resin-molded article includes the following steps: a step of supplying the resin material to a target object using the resin supply device; and a step of resin molding the target object using the resin material.
[0016] The effects of the invention
[0017] Based on the disclosure in this specification, a resin supply device, a resin molding article manufacturing apparatus, and a resin molding article manufacturing method can be obtained, which can help improve the quality and production efficiency of resin molding articles. Attached Figure Description
[0018] [ Figure 1 [] is a functional block diagram representing a resin molding manufacturing apparatus 1000.
[0019] [ Figure 2 [Illustration 1] is a cross-sectional view showing the state of the molding section 80 included in the resin molding manufacturing apparatus 1000 before mold closing.
[0020] [ Figure 3 [Illustration 1] is a cross-sectional view showing the state of the molding section 80 included in the resin molding manufacturing apparatus 1000 after the mold is closed.
[0021] [ Figure 4 [ ] is a flowchart illustrating a method for manufacturing resin molded articles using a resin molding article manufacturing apparatus 1000.
[0022] [ Figure 5 [Illustration 1] is a cross-sectional view of the resin supply device 100 included in the resin molding manufacturing apparatus 1000.
[0023] [ Figure 6 [] is a timing diagram applicable to the resin supply device in the comparative example.
[0024] [ Figure 7 [ ] is a flowchart showing the various processes of resin supply performed by the resin supply device in the comparative example.
[0025] [ Figure 8 [ ] is a cross-sectional view showing the state of resin supply by the resin supply device 100R in the comparative example.
[0026] [ Figure 9 [ ] is a cross-sectional view showing the state of resin supply by the resin supply device 100R in the comparative example.
[0027] [ Figure 10 [ ] is a cross-sectional view showing the state of resin supply by the resin supply device 100R in the comparative example.
[0028] [ Figure 11 [] is a timing diagram representing the resin supply device applicable to the implementation method.
[0029] [ Figure 12 [ ] is a flowchart illustrating the various processes of resin supply performed by the resin supply device in the embodiment.
[0030] [ Figure 13 [1] is a cross-sectional view showing the state (first movement M1) of the resin supply device 100 supplying resin in the embodiment.
[0031] [ Figure 14 [ ] is a cross-sectional view showing the state (second movement M2) of the resin supply device 100 supplying resin in the embodiment.
[0032] [ Figure 15 [Illustration 1] is a cross-sectional view showing the state (droplet) of resin supply by the resin supply device 100 in the embodiment.
[0033] [ Figure 16[Illustration 1] is a cross-sectional view showing the state (liquid flow) of resin supply by the resin supply device 100 in the embodiment. Detailed Implementation
[0034] The following describes embodiments of this disclosure. In the embodiments described below, when terms such as number or quantity are mentioned, unless specifically stated otherwise, the scope of this disclosure is not necessarily limited to those numbers or quantities. Unless specifically stated otherwise, each constituent element is not necessarily essential to this disclosure. Identical parts and equivalent parts will be marked with the same reference numerals, and repeated descriptions may not be repeated.
[0035] [Resin Molding Manufacturing Apparatus 1000]
[0036] Figure 1 This is a functional block diagram representing a resin molding manufacturing apparatus 1000. Figure 2 This is a cross-sectional view of the molding section 80 included in the resin molding manufacturing apparatus 1000 before mold closing. Figure 3 This is a cross-sectional view showing the state of the molding section 80 included in the resin molding manufacturing apparatus 1000 after the mold is closed.
[0037] like Figure 1 As shown, the resin molding article manufacturing apparatus 1000 includes a substrate module 101, a pressure module 102, an ejection module 103, and a thin film module 104. Substrate 90 ( Figure 2 ) is delivered from substrate module 101, thin film 60 ( Figure 2 The liquid resin material 13 is fed from the thin film module 104. The ejection module 103 supplies the thermosetting resin material 13 onto the thin film 60. The pressure module 102 uses the liquid resin material 13 supplied to the thin film 60 to resin mold the substrate 90. Figure 3 ).
[0038] In the resin molding manufacturing apparatus 1000, the substrate module 101, pressure module 102, ejection module 103, and film module 104 are described as separate, independent modules. Each module can be detachable from the other modules, and the number of modules can be increased or decreased. For example, two or three ejection modules 103 can be arranged between the pressure module 102 and the film module 104.
[0039] The resin molding manufacturing apparatus 1000 also includes a conveying mechanism 91 and a conveying mechanism 92. The conveying mechanism 91 conveys the substrate 90 sent from the substrate module 101 to the molding section 80 of the pressure module 102. Figure 2 The upper mold of the forming mold 81 ( Figure 2 The conveying mechanism 92 will transport the film 60 containing resin material 13 ejected from the ejection module 103 to the lower mold 87 of the forming mold of the forming part 80 of the pressure module 102. Figure 2 The conveying mechanism 92 also conveys the film 60, which is not loaded with resin material 13, from the film module 104 to the discharge module 103.
[0040] [Manufacturing method of resin molded articles]
[0041] Figure 4 This is a flowchart illustrating a method for manufacturing resin molded articles using a resin molding manufacturing apparatus 1000. Figure 5 This is a cross-sectional view of the resin supply device 100 included in the resin molding article manufacturing apparatus 1000. The manufacturing method of the resin molded article will be described here, and the detailed structure and operation of the resin supply device 100 will be described later.
[0042] Reference Figures 1-5 In the method for manufacturing resin molded articles, firstly, the resin supply device 100 ( Figure 5 The resin material 13 is supplied onto the film 60 (step S101). For example, the conveying mechanism 92 transports the film 60 and the frame-shaped tray cover 54 disposed on the film 60. Figure 5 It is transferred from the thin film module 104 to the discharge module 103.
[0043] Next, the resin supply device 100 of the ejection module 103 supplies resin material 13 onto the film 60 inside the tray cover 54. The details of this operation will be described later. Then, the conveying mechanism 91 transports the substrate 90 from the substrate module 101 to the pressure module 102 and places it on the lower surface of the upper mold 81 of the molding die of the pressure module 102 (process S102).
[0044] The conveying mechanism 91 places the film 60, on which resin material 13 has been supplied, on the upper surface of the lower mold 87 (step S103). The conveying mechanism 92 transports the film 60, on which resin material 13 has been supplied from the ejection module 103, together with the tray cover 54, to the pressure module 102, and places the film 60 carrying resin material 13 on the upper surface of the lower mold 87 of the molding mold in the pressure module 102. The conveying mechanism 92 does not place the tray cover 54 inside the pressure module 102, but instead transports the tray cover 54 to the film module 104.
[0045] like Figure 2 As shown, in the forming section 80, a block-shaped fixed platform 88 is supported by a tie rod or a support frame. An upper mold 81 is provided on the lower side of the fixed platform 88. A movable platform 86 is disposed on the lower side of the fixed platform 88. A lower mold 87 is provided on the upper side of the movable platform 86.
[0046] The lower mold 87 includes a bottom component 82, side components 83, multiple elastic components 84, and a base plate 85. A recessed portion is formed on the lower side of the lower mold 87. A conveying mechanism 92 places a film 60 on the upper surface of the lower mold 87, such that the resin material 13 on the film 60 is located on the bottom surface of the recess. The conveying mechanism 91, as described above... Figure 2 As shown, the substrate 90 is placed on the lower surface of the upper mold 81.
[0047] The upper mold 81 and lower mold 87 are closed by moving the lower mold 87 upward toward the upper mold 81 (step S104). For example, a mold closing mechanism (not shown) moves the movable platform 86 upward. As a result, the lower mold 87 moves upward toward the upper mold 81. As the movable platform 86 moves upward, the frame-shaped side member 83 first contacts the substrate 90 through the thin film 60.
[0048] Subsequently, the movable platform 86 continues to move upward. With the side member 83 stopped moving upward, the bottom member 82 moves upward, compressing the multiple elastic members 84. When the upper surface of the side member 83 reaches a predetermined position, the upward movement of the movable platform 86 stops, and the mold closing process of step S104 ends.
[0049] After the lower mold 87 stops moving and the mold closes, the temperature of the molding die is increased (step S105). The resin material 13 is thermosetting. Therefore, when the temperature of the resin material 13 rises, the resin material 13 hardens into cured resin 18. Figure 3 (Step S106). After the resin material 13 has hardened, the lower mold 87 is moved downward by moving the base plate 85 downward. Thus, the mold is opened, and a resin molded article with the lower surface of the substrate 90 encapsulated in resin is produced (Step S107).
[0050] In the above content, for example, Figure 2 and Figure 3 As shown, a pressure module 102 for manufacturing resin molded articles by placing a substrate 90 on an upper mold 81 is illustrated. Figure 1 In the case where the ejection module 103 of the resin molding article manufacturing apparatus 1000 shown is equipped with the resin supply device 100 of the above embodiment, it may, for example, have a pressure module 102 for manufacturing resin molding articles by placing the substrate 90 in the lower mold 87. Figure 1 The dispensing module 103 of the resin molding manufacturing apparatus 100 shown is equipped with the resin supply device 100 of the above embodiment.
[0051] [Resin supply device 100]
[0052] Reference Figure 5The resin supply device 100 supplies liquid resin material 13 to the object to be supplied, such as the film 60. Specifically, the resin supply device 100 includes, for example, an ink cartridge 10, a holding mechanism 20, a pressing mechanism 30, an opening and closing mechanism 40, a detection unit 50, a placement stage 52, and a control unit 70.
[0053] (Ink cartridge 10)
[0054] The ink cartridge 10 has a cover 11, a receiving portion 12, and a resin material 13. The receiving portion 12 receives the resin material 13, and the cover 11 is disposed on the surface of the resin material 13. The cover 11 seals the resin material 13 to prevent the resin material 13 from leaking out of the receiving portion 12. The receiving portion 12 of the ink cartridge 10 is disposed inside the cylindrical portion 23 of the holding mechanism 20 described later. The end of the receiving portion 12 is provided with a dispensing portion 12a. The ink cartridge 10 dispenses the resin material 13 through the dispensing portion 12a.
[0055] (Testing Department 50)
[0056] A mounting stage 52 is disposed below the dispensing section 12a, and the film 60 conveyed from the film module 104 is placed on the mounting stage 52. A frame-shaped tray cover 54 is disposed on the film 60. Resin material 13 is supplied to the inside of the tray cover 54 on the film 60. A detection unit 50 is connected to the mounting stage 52 and is used to detect the weight of the resin material 13 extruded from the dispensing section 12a and supplied to the film 60.
[0057] (Maintain organization 20)
[0058] The retaining mechanism 20 has a peripheral wall 21, locking members 22, and a cylindrical portion 23 for retaining the ink cartridge 10. Multiple locking members 22 are provided on the inner periphery of the peripheral wall 21, and the cylindrical portion 23 is locked to the multiple locking members 22. The ink cartridge 10 is detachably disposed inside the cylindrical portion 23.
[0059] (Pressing mechanism 30)
[0060] The pressing mechanism 30 has a servo motor 31 and a pressing part 32. The pressing part 32 is inserted into the inside of the receiving part 12 of the ink cartridge 10 and is configured to contact the cover 11. By moving the pressing part 32, the pressing part 32 presses the resin material 13 through the cover 11, causing the resin material 13 to be squeezed out from the dispensing part 12a of the ink cartridge 10.
[0061] (Opening and closing mechanism 40, control unit 70)
[0062] The opening and closing mechanism 40 has a drive unit 41 and a pair of chucks 42 and 43. The chucks 42 and 43 are configured to open and close the internal space of the ejector section 12a. The chucks 42 and 43 are configured to be in an open state and a closed state, and these states are switched by the drive unit 41. The ejector section 12a may also be a structure with a flexible material tube installed, and the chucks 42 and 43 may also press the tube.
[0063] The opening and closing mechanism 40 allows the resin material 13 extruded from the ejector 12a to reach the film 60 when the chucks 42 and 43 are open, and prevents the resin material 13 extruded from the ejector 12a from reaching the film 60 when the chucks 42 and 43 are closed. The control unit 70 is connected to the servo motor 31, the drive unit 41, and the detection unit 50, and can control the movement of the pressing unit 32 and the opening and closing actions of the chucks 42 and 43 according to the values detected by the detection unit 50.
[0064] Before describing the embodiments of this disclosure in detail, comparative examples related to the embodiments will be described below.
[0065] [Comparative Example]
[0066] Figure 6 This is a timing diagram applicable to the resin supply device in the comparative example. Figure 7 This is a flowchart illustrating the resin supply process performed by the resin supply device in the comparative example. Figures 8 to 10 This is a cross-sectional view showing the state of the resin supply device 100R supplying resin in the comparative example.
[0067] Comparative example resin supply device 100R ( Figure 8 ) is, first at time t0 ( Figure 6 When this happens, the set values (preset weight and preset time) are read from a pre-prepared reference table, etc. Figure 7 (Process t101). At time t0, chuck 42 and chuck 43 are in the closed state.
[0068] The "predetermined weight" setting mentioned here is set as follows: The weight of the resin material 13 extruded from the dispensing section 12a and supplied to the film 60 is detected by the detection section 50 and transmitted to the control section 70 as the detection weight. When the pressing section 32 starts moving and supplying resin to the film 60, and the weight of resin supplied to the film 60 reaches the predetermined weight, the movement of the pressing section 32 stops. The threshold weight at which the pressing section 32 stops moving is the "predetermined weight" mentioned here. The predetermined weight is appropriately set to a desired value based on past resin supply practices, etc.
[0069] Furthermore, the "predetermined time" setting mentioned here is set as follows: After the pressing part 32 stops moving, at a point after the predetermined time has elapsed, the driving part 41 changes the chuck 42 and chuck 43 from the open state to the closed state. During the period from when the pressing part 32 stops moving until the driving part 41 changes the chuck 42 and chuck 43 from the open state to the closed state (i.e., within the predetermined time), the resin material 13 is continuously supplied to the film 60 in the form of droplets. The time from when the pressing part 32 stops moving until the driving part 41 changes the chuck 42 and chuck 43 from the open state to the closed state is the "predetermined time" mentioned here. The predetermined time is appropriately set to a desired value based on past resin supply practices, etc.
[0070] At time t1 ( Figure 6 When ), the pressing part 32 begins to move ( Figure 7 Process t102). Movement amount of pressing part 32 ( Figure 6 As the movement amount a1 gradually increases, the resin material 13 is extruded from the ejector 12a. Before the resin material 13 reaches the film 60, the weight w1 remains unchanged. At time t2, the resin material 13 reaches the film 60, and the weight begins to increase (weight w2, weight w3).
[0071] At time t3 ( Figure 6 The point in time when the weight detected by the detection department 50 reaches or exceeds the predetermined weight. Figure 7 If step t103 is "YES", the movement of the pressing part 32 stops (step t104). The movement of the pressing part 32 almost stops increasing from the movement amount a3. Figure 9 As shown, even after the pressing part 32 stops moving, the resin material 13 will continue to be discharged from the dispensing part 12a in the form of droplets, and the weight will continue to increase (weight w3, weight w4).
[0072] Reference Figure 10 At time t4 ( Figure 6 The point in time that occurs after a predetermined time has elapsed since the pressing part 32 stops moving. Figure 7 (If step t105 is YES), the drive unit changes chuck 42 and chuck 43 from the open state to the closed state (step t106). Even after chuck 42 and chuck 43 are closed, resin material 13 will continue to be supplied to the film 60 in the form of liquid (resin material continuously supplied to the film 60 due to the liquid flow phenomenon), and the weight will continue to increase slightly (weight w4, weight w5). The resin supply is completed when the liquid flow stops. Figure 6 Time t5 Figure 7 The process t107). If necessary, the next resin supply will be made to another film 60 ( Figure 7Process t108 is YES).
[0073] In the comparative example described above, the weight of the resin material 13 supplied to the film 60 is brought close to the desired value by pre-determined weight and time. The pre-determined time can be optimized based on past resin supply practices, etc.
[0074] (The role and effect of the comparative example)
[0075] However, the compressibility of liquid resin materials generally varies with environmental conditions, making it difficult to perfectly correspond the movement of the pressing part 32 to the ejection weight of the resin material 13. Furthermore, even if the timing of stopping the pressing part 32 is optimized based on a predetermined weight value, and the timing of closing the chuck 42 and chuck 43 is optimized based on a predetermined time value, the weight of the resin material 13 supplied to the film 60 due to droplets and liquid flow is easily affected by factors such as the physical properties of the resin material.
[0076] Furthermore, adjusting the "predetermined time" to bring the final weight of resin material supplied to the object closer to the desired value can easily lead to a prolonged cycle time. In other words, while droplets may form when the pressing part 32 is not moving, this period is essentially standby time. Because the supply of resin material 13 is small, it takes a long time to bring the supply of resin material 13 close to the target weight. Therefore, adjusting the "predetermined time" does not necessarily guarantee that the weight of the resin material will be controlled at the target value.
[0077] [Implementation Method]
[0078] Compared to the comparative example described above, the resin supply device 100 of the embodiment performs resin supply as described below.
[0079] Figure 11 This is a timing diagram showing the resin supply device applicable to the implementation method. Figure 12 This is a flowchart illustrating the various resin supply processes performed by the resin supply device in the embodiment. Figures 13 to 16 This is a cross-sectional view showing the state in which the resin supply device 100 supplies resin in the embodiment.
[0080] Resin supply device 100 of the embodiment ( Figure 5 ) is, first at time T0 ( Figure 11 When ), the set values (first predetermined value and second predetermined value) are read from a pre-prepared reference table, etc. Figure 12 (Process T101). At time T0, chuck 42 and chuck 43 are in the closed state.
[0081] The "first predetermined value" mentioned here is set as follows: The weight of the resin material 13 extruded from the dispensing section 12a and supplied to the film 60 is detected by the detection section 50 and transmitted to the control section 70 as the detected weight. When the pressing section 32 starts moving and supplying resin to the film 60, and the weight of the resin supplied to the film 60 reaches the first predetermined value, the movement of the pressing section 32 stops. The threshold weight at which the movement of the pressing section 32 stops is the "first predetermined value" mentioned here. The first predetermined value is appropriately set to a desired value based on past resin supply practices, etc.
[0082] Furthermore, the setting value of the "second predetermined value" mentioned here is set as follows: Even after the pressing part 32 stops moving, the resin material 13 continues to be supplied to the film 60 in the form of droplets. The weight of the resin material 13 supplied to the film 60 is detected by the detection unit 50 and transmitted to the control unit 70 as the detected weight. When the weight of the resin supplied to the film 60 reaches the second predetermined value, the drive unit 41 changes the chuck 42 and chuck 43 from the open state to the closed state. The threshold weight at which the drive unit 41 changes the chuck 42 and chuck 43 from the open state to the closed state is the "second predetermined value" mentioned here. The second predetermined value is appropriately set to a desired value based on past resin supply practices, etc.
[0083] At time T1 ( Figure 11 When ), the pressing part 32 begins to move ( Figure 12 Process T102). Movement amount of pressing part 32 ( Figure 11 Starting with a movement amount A1, the resin material 13 is gradually extruded from the ejector 12a. Before the resin material 13 reaches the film 60, the weight W1 remains unchanged. Since the ejector 12a has not yet drawn a pattern on the film 60, the pattern path length does not increase (length D1). At time T2, the resin material 13 reaches the film 60, and the weight begins to increase (weight W2, weight W4, weight W5). At time T3, the ejector 12a begins to draw a pattern on the film 60, and the pattern path length begins to increase (length D3, length D4, length D5). Figure 13 ).
[0084] At time T5 ( Figure 11 When the weight detected by the detection unit 50 reaches or exceeds the first predetermined value, that is, when the weight detected by the detection unit 50 reaches or exceeds the first predetermined value. Figure 12 (Step T103 is YES), and the movement of the pressing part 32 is stopped (step T104). At this time, the weight of the resin material 13 has reached weight W5.
[0085] In this embodiment, before time T5, the pressing part 32 is configured to perform a first movement M1 and a second movement M2. The first movement M1 begins at time T1 and ends at time T4. Figure 11 At time T5, the movement changes from the first movement M1 to the second movement M2.
[0086] In other words, control unit 70 ( Figure 13 The pressing mechanism 30 is controlled to cause the pressing part 32 to move in a first movement M1, and after the first movement M1, the pressing mechanism 30 is controlled to cause the pressing part 32 to move in a second movement M2. During at least the second movement M2 of the first movement M1 and the second movement M2, the detection unit 50 detects the weight of the resin material 13 extruded from the dispensing part 14a and supplied to the film 60.
[0087] The timing for switching from the first movement M1 to the second movement M2 is, for example, when the control unit 70 moves the pressing part 32 a predetermined distance L1 by performing the first movement M1 via the pressing part 32. Figure 11 After (movement amount A4), the pressing part 32 is moved a second time M2.
[0088] Figure 13 This indicates that the pressing part 32 has moved M1 in the first direction. Figure 14 This indicates the second movement M2 of the pressing part 32. Using the weight of the resin material 13 extruded from the dispensing part 12a and supplied to the film 60 per unit time as a reference weight, the control unit 70 can control the pressing mechanism 30 so that the reference weight during the second movement M2 of the pressing part 32 is less than the reference weight during the first movement M1. With this structure, the slope of the straight line between weights W4 and W5 will be smaller than the slope of the straight line between weights W2 and W4.
[0089] At time T5 ( Figure 11 When the weight detected by the detection unit 50 reaches or exceeds the first predetermined value, that is, when the weight detected by the detection unit 50 reaches or exceeds the first predetermined value. Figure 12 In process T103 (YES), the movement of the pressing part 32 is stopped (process T104). At this time, the weight of the resin material 13 has reached weight W5. The movement of the pressing part 32 hardly increases from the movement amount A5. Figure 15 As shown, even after the pressing part 32 stops moving, the resin material 13 continues to be ejected from the ejection part 12a in the form of droplets, and the weight continues to increase (weight W5, weight W6).
[0090] Reference Figure 16 At time T6 ( Figure 11 The point in time when the weight detected by the detection unit 50 reaches or exceeds the second predetermined value. Figure 12(If step T105 is YES), the drive unit 41 changes the chucks 42 and 43 from the open state to the closed state (step T106). Even after the chucks 42 and 43 are closed, the resin material 13 continues to be supplied to the film 60 in the form of a liquid (resin material continuously supplied to the film 60 due to the liquid flow phenomenon), and its weight continues to increase slightly (weight W6, weight W7). The resin supply is completed when the liquid flow stops. Figure 11 Time T7 Figure 12 Process T107).
[0091] like Figure 12 As shown in process T108, after the control unit 70 changes from the open state to the closed state via chuck 42 and chuck 43 and the resin material 13 stops being supplied to the film 60, it acquires the detection weight and calculates the difference between the acquired value and the preset target weight value WD. Figure 11 The value is changed by modifying at least one of the first and second predetermined values. The changed value is stored in the setpoint table. Figure 12 If necessary, the next resin supply will be made to the other film 60. Figure 12 Process T109 is YES.
[0092] (The role and effect of the implementation method)
[0093] In the above-described embodiment, the weight of the resin material 13 supplied to the film 60 is brought close to the desired value (target weight value) by using the first predetermined value and the second predetermined value. That is, the weight of the resin material 13 extruded from the dispensing section 12a and supplied to the film 60, as detected by the detection unit 50, is used as the detection weight. While monitoring the detection weight immediately or at fixed time intervals, the pressing section 32 is continuously moved until the detection weight reaches or exceeds the first predetermined value.
[0094] As described in the comparative example above, adjusting the "predetermined time" to bring the final weight of resin material supplied to the object closer to the desired value can easily lead to a prolonged cycle time. In contrast, in this embodiment, the weight of the liquid droplets ejected is monitored even after the pressing part 32 stops moving. The weight is monitored and detected immediately or at fixed time intervals. When the detected weight reaches or exceeds a second predetermined value after the pressing part 32 stops moving, the chuck 42 and chuck 43 are changed from the open state to the closed state. These configurations suppress variations in the supply amount caused by the properties of the resin material 13, improving the accuracy of the resin ejection weight and shortening the time required for resin supply.
[0095] After the control unit 70 changes from an open state to a closed state via chuck 42 and chuck 43, and the resin material 13 is no longer supplied to the film 60, it acquires the measured weight and changes at least one of a first predetermined value and a second predetermined value based on the difference between the acquired value and a preset target weight value. In other words, by optimizing the first and second predetermined values based on past resin supply practices, it can not only control the amount of liquid resin dispensed with high precision but also suppress the extension of cycle time, thereby improving the quality and production efficiency of resin molded products.
[0096] Furthermore, in this embodiment, if the weight of the resin material 13 extruded from the dispensing section 12a and supplied to the film 60 per unit time is used as the reference weight, the control section 70 can control the pressing mechanism 30 so that the reference weight during the second movement M2 of the pressing section 32 is less than the reference weight during the first movement M1 of the pressing section 32. With this configuration, the slope of the straight line between weights W4 and W5 is smaller than the slope of the straight line between weights W2 and W4. With this configuration, the residual pressure in the receiving section 12 after the pressing section 32 stops moving can be reduced (that is, the residual pressure can be made closer to atmospheric pressure), so that the next resin supply can start from a pressure closer to atmospheric pressure, for example, it can make it easier to supply the required amount of resin in the initial stage of the next resin supply.
[0097] (Regarding other components)
[0098] For the target weight value, when it reaches or exceeds a second predetermined value, the chuck will close. This second predetermined value can be optimized, for example, by changing... Figure 11 The interval G2 between times T6 and T7 is shown. Ideally, the optimal value should be calculated automatically and fed back to a second predetermined value to minimize error.
[0099] By changing the first predetermined value, the timing at which the pressing part 32 stops moving can be altered. Figure 11 The interval G4 between time T5 and time T7 is shown. Besides optimizing the first and second predetermined values based on past resin supply practices, the timing of starting the patterning action can also be adjusted, for example. Figure 11 The interval G1 between time T2 and time T3 is shown. Alternatively, the time when performing the second movement M2 can be adjusted, that is, adjusted at... Figure 11 The moving speed of the pressing part 32 moving in the interval G3 shown.
[0100] Furthermore, for example, if the time for the pressing part 32 to move first M1 is set as the first time C1 ( Figure 11If the time for the pressing part 32 to move M2 is set as the second time C2, then the control part 70 can control the pressing mechanism 30 to make the second time C2 shorter than the first time C1.
[0101] Furthermore, if the time from when the control unit 70 stops the pressing part 32 from moving to when the control unit 70 changes the chuck 42 and chuck 43 from the open state to the closed state is defined as the third time C3, Figure 11 If the control unit 70 controls the pressing mechanism 30 and / or the chuck 42 and chuck 43, the third time C3 will be shorter than the second time C2.
[0102] The embodiments of this disclosure have been described above, but it should be understood that the embodiments disclosed herein are exemplary in all respects and not restrictive. The scope of this disclosure is set forth in the claims and is intended to include all modifications within the equivalent meaning and scope of the claims.
[0103] Explanation of icon numbers
[0104] 10: Ink cartridge
[0105] 11: Cover
[0106] 12: Containment Department
[0107] 12a, 14a: Ejection section
[0108] 13: Resin materials
[0109] 18: Cured resin
[0110] 20: Maintain the organization
[0111] 21: Zhou Bi
[0112] 22: Locking component
[0113] 23: Cylindrical part
[0114] 30: Pressing mechanism
[0115] 31: Servo Motor
[0116] 32: Pressing part
[0117] 40: Opening and closing mechanism
[0118] 41: Drive Unit
[0119] 42, 43: Chuck
[0120] 50: Testing Department
[0121] 52: Platform
[0122] 54: Tray lid
[0123] 60: Film (the object to be supplied)
[0124] 70: Control Department
[0125] 80: Forming section
[0126] 81: Upper mold
[0127] 82: Bottom Components
[0128] 83: Side components
[0129] 84: Elastic components
[0130] 85: Base Plate
[0131] 86: Movable Platform
[0132] 87: Lower mold
[0133] 88: Fixed Platform
[0134] 90: Substrate
[0135] 91, 92: Transporting organizations
[0136] 100, 100R: Resin supply device
[0137] 101: Baseboard Module
[0138] 102: Pressure Module
[0139] 103: Output Module
[0140] 104: Thin Film Module
[0141] 1000: Resin molding manufacturing apparatus
Claims
1. A resin supply device for supplying resin material to a target object, comprising: A receiving section for receiving resin material and having a dispensing section for dispensing the resin material. The pressing mechanism has a pressing part inserted into the receiving part, and the resin material is squeezed out from the dispensing part by the movement of the pressing part; The detection unit detects the weight of the resin material extruded from the ejection section and supplied to the object to be supplied; An opening and closing mechanism comprising a chuck configured to be in an open state and a closed state, wherein in the open state the chuck allows resin material extruded from the ejector to reach the object to be supplied, and in the closed state the chuck prevents the resin material extruded from the ejector from reaching the object to be supplied; and The control unit is used to control the movement of the pressing part and the opening and closing action of the chuck. Wherein, the weight of the resin material that is detected by the detection unit, extruded from the dispensing unit, and supplied to the object to be supplied, is defined as the detected weight. Then the control unit The movement of the pressing part stops when the detected weight reaches or exceeds a first predetermined value. After the pressing part stops moving, when the detected weight reaches or exceeds a second predetermined value, the chuck is changed from the open state to the closed state.
2. The resin supply device according to claim 1, wherein... The control unit acquires the detected weight after the chuck changes from the open state to the closed state, thus the resin material is no longer supplied to the object to be supplied, and changes at least one of the first predetermined value and the second predetermined value based on the difference between the acquired value and the preset target weight value.
3. The resin supply device according to claim 1 or 2, wherein... The control unit controls the pressing mechanism to make the pressing part move in a first movement, and after the first movement, controls the pressing mechanism to make the pressing part move in a second movement. The detection unit detects the weight of the resin material extruded from the ejector and supplied to the object being supplied during at least the second movement of the first and second movements.
4. The resin supply device according to claim 3, wherein After the control unit moves the pressing part a predetermined distance by performing the first movement, it causes the pressing part to perform the second movement.
5. The resin supply device according to claim 3 or 4, wherein If the weight of the resin material extruded from the ejector and supplied to the object being supplied per unit time is set as the baseline weight. The control unit then controls the pressing mechanism so that the reference weight during the second movement of the pressing unit is less than the reference weight during the first movement of the pressing unit.
6. The resin supply device according to any one of claims 3 to 5, wherein If the time for the pressing part to make the first movement is set as the first time. The time during which the pressing part makes the second movement is set as the second time. The control unit then controls the pressing mechanism to make the second time shorter than the first time.
7. The resin supply device according to claim 6, wherein... If the time from when the control unit stops moving the pressing part to when the control unit changes the chuck from the open state to the closed state is defined as the third time, then... The control unit then controls the pressing mechanism and / or the chuck to make the third time shorter than the second time.
8. An apparatus for manufacturing resin molded articles, comprising a resin supply device as claimed in any one of claims 1 to 7.
9. A method for manufacturing a resin molded article, comprising the following steps, using the resin molded article manufacturing apparatus as described in claim 8: The process of the resin supply device supplying the resin material to the object to be supplied; and The process of using the resin material to perform resin molding on the supplied object.