A processing platform for manufacturing electronic components

By using a multi-angle tilt adjustment mechanism and fine-tuning components, combined with Y-axis and X-axis drive mechanisms and laser processing, the accuracy and efficiency issues of existing platforms have been solved, achieving efficient and environmentally friendly processing results.

CN122274403APending Publication Date: 2026-06-26BEIJING FANGXIN TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
BEIJING FANGXIN TECHNOLOGY CO LTD
Filing Date
2026-05-07
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing processing platforms have low positioning and motion accuracy, which cannot meet the requirements of high-precision processing. The adsorption carrier lacks integrated cooling and exhaust gas treatment, and the single processing mode leads to low production efficiency and high cost.

Method used

Multi-angle tilt adjustment is achieved by setting up a material loading mechanism and fine-tuning components. Combined with Y-axis and X-axis drive mechanisms and laser processing mechanisms, it is equipped with negative pressure airflow and cooling components for the adsorption carrier. A dual-station switching mechanism is adopted to improve processing efficiency and reduce costs.

Benefits of technology

It achieves high-precision machining, improves cooling efficiency and exhaust gas treatment, reduces pollution and safety hazards in the processing area, lowers equipment costs, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a processing platform for electronic component manufacturing, belonging to the technical field of processing equipment. It primarily addresses the problems of insufficient processing precision, lagging cooling and heat dissipation, lack of waste gas treatment, and low workstation efficiency in existing products. The proposed technical solution includes a frame and a base mounted on top of the frame. Two slide rails are symmetrically arranged on the top of the base, and a gantry frame is slidably connected to both slide rails. An X-axis drive mechanism is mounted on the gantry frame. This invention, through the setting of a loading mechanism, allows the adsorption carrier to be flexibly tilted at multiple angles according to actual usage, with the cooperation of its fine-tuning components. Combined with the Y-axis drive mechanism, X-axis drive mechanism, and laser processing mechanism, high-precision processing of workpieces is achieved. Utilizing the negative pressure airflow of the adsorption carrier, and with the cooperation of cooling components, the air velocity in the workpiece area during processing is accelerated, thereby improving the cooling efficiency of the processing area and the collection of smoke and waste gas.
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