Component packaging heat dissipation test system and method

Abstract

The application discloses a kind of component heat dissipation test system and method.The system includes: test module, for applying adjustable test current or voltage to control heating power;Data acquisition module, for real-time acquisition internal temperature and surface temperature distribution data;Data processing module, construct multidimensional heat conduction equivalent network and extract internal and external temperature thermal coupling correlation parameter;Thermal resistance calculation module, calculate total thermal resistance and local partial layer thermal resistance, and decouple along the step thermal resistance value of heat conduction path into steady-state and transient component, generate corresponding steady-state heat accumulation index and transient heat accumulation index;Heat dissipation performance evaluation module, based on thermal performance data and heat accumulation index, carry out multiple state failure determination and generate test report.The application significantly improves the accuracy and reliability of component heat dissipation performance evaluation early warning capability.

Description

Technical Field

[0001] This invention relates to the field of instrument testing and measurement technology, and specifically to component testing systems and methods. Background Technology

[0002] As electronic components evolve towards higher power, higher integration, and miniaturization, heat dissipation performance has become a key factor restricting component reliability and lifespan. Traditional component heat dissipation testing techniques are typically based on surface temperature measurement and static thermal resistance assumptions, primarily focusing on measuring the overall thermal resistance under steady-state conditions. However, in actual operating conditions, there are complex spatial heat conduction paths between the internal heat source and the external heat dissipation interface of the component, and frequent switching of power loads can trigger significant transient thermal capacitive responses. Existing technologies often neglect the coupling relationship between internal temperature distribution and surface temperature field, failing to quantify the degree of local heat accumulation at different locations along the heat conduction path. Furthermore, the lack of a decoupling evaluation mechanism for steady-state continuous heat exchange capacity and transient thermal buffering capacity makes it difficult to accurately identify the transient thermal shock risk caused by insufficient thermal inertia matching, or the steady-state thermal fatigue risk caused by obstructed continuous heat dissipation channels. Furthermore, traditional testing systems lack adaptive calibration mechanisms and lifetime decay mapping models based on multi-state thermal performance data during long-term operation or complex environment simulation. Test results are easily affected by sensor drift and the limitations of single steady-state data, and cannot provide accurate and multi-dimensional data support for component thermal design optimization and reliability early warning.

[0003] Therefore, there is an urgent need for a component heat dissipation testing system and method that can simultaneously acquire internal and external temperature distributions, decouple steady-state and transient thermal characteristics, and accurately quantify the evolution of spatial heat accumulation, so as to achieve a comprehensive evaluation of the actual heat dissipation capacity and thermal response characteristics of components. Summary of the Invention

[0004] To address the above problems, this invention provides a component packaging heat dissipation system and method.

[0005] A first aspect of the present invention provides a component package heat dissipation system, comprising:

[0006] The test module is configured to apply an adjustable test current or voltage to the component under test in order to control the heat generation power of the component under test;

[0007] The data acquisition module is configured to acquire the internal temperature and surface temperature distribution data of the component under test in real time; the data processing module includes a thermal conduction coupling analysis unit, which is configured to construct a multi-dimensional thermal conduction equivalent network of the component under test, and calculate the heat flux density distribution from the internal heat source to the external surface by inverting the spatial mapping relationship between the internal temperature measurement points and the surface temperature distribution data, and extract the thermal coupling correlation parameters between the internal temperature and the external temperature.

[0008] A thermal resistance calculation module, connected to the test module, the data acquisition module and the data processing module, is configured to calculate the total thermal resistance and local delamination thermal resistance of the component under test based on the heating power, the internal temperature, the surface temperature distribution data and the thermal coupling correlation parameters.

[0009] The heat dissipation performance evaluation module is configured to compare the total thermal resistance value and the local layered thermal resistance value with a preset heat dissipation performance threshold and generate a heat dissipation test report.

[0010] As a preferred embodiment, the thermal resistance calculation module is further configured to:

[0011] Multiple test sections are divided along the heat conduction path of the component under test. Based on the internal temperature difference and surface temperature distribution data of each section, the stepped thermal resistance between adjacent sections is calculated. The stepped thermal resistance is decoupled into a steady-state stepped thermal resistance component that represents the continuous heat conduction path characteristics under thermal equilibrium state, and a transient stepped thermal resistance component that represents the thermal capacity response characteristics during the heat flow change stage.

[0012] The continuous heat exchange and thermal resistance stability of the tested component under thermal equilibrium is defined as its steady-state heat dissipation capability.

[0013] Its thermal capacity response and heat flow conduction during the power loading / unloading transient phase are defined as transient heat dissipation capability;

[0014] A steady-state heat accumulation index is generated based on the steady-state heat dissipation capability, and a transient heat accumulation index is generated based on the transient heat dissipation capability. The steady-state heat accumulation index is used to quantify the degree of continuous heat accumulation and heat dissipation efficiency of each cross section under thermal equilibrium state, and the transient heat accumulation index is used to quantify the heat storage rate and thermal buffering efficiency of each cross section during temperature jump process. Through the spatial distribution mapping of the steady-state heat accumulation index and the transient heat accumulation index, the step thermal resistance evolution law and overall heat dissipation capability of the component under test are comprehensively represented.

[0015] As a preferred embodiment, the system also includes an environmental simulation module configured to provide an external temperature cycle and airflow disturbance environment; the heat dissipation performance evaluation module is further configured to receive environmental parameter signals from the environmental simulation module and record the transient response values ​​of the thermal performance data output by the thermal resistance calculation module at different stages of environmental parameter changes.

[0016] As a preferred embodiment, a calibration module is also included. The calibration module is configured to calibrate the data acquisition module using a standard heat source at a specific node of the temperature cycle of the environmental simulation module, and adjust the equivalent thermal network model parameters in the heat conduction coupling analysis unit according to the calibration results. The calibration triggering period is a function-mapped relationship with the operating period of the temperature cycle.

[0017] A second aspect of the present invention provides a method for testing the heat dissipation of components, comprising the following steps:

[0018] Initialize the test environment by setting the initial operating power and ambient temperature of the component under test;

[0019] The power loading step involves applying a test current or voltage to the component under test.

[0020] Within a preset time series, the transient temperature response curve at the initial stage of power switching and the steady-state temperature distribution data after thermal equilibrium are collected synchronously. Each set of test data includes internal temperature, surface temperature distribution data and corresponding heat generation power.

[0021] After obtaining the transient temperature response curve and steady-state temperature distribution data, a spatial mapping relationship between the internal temperature and the surface temperature distribution is constructed, and the transient thermal coupling parameters and steady-state thermal coupling parameters are calculated respectively.

[0022] By combining the heating power, the internal temperature, the surface temperature distribution data, and the corresponding thermal coupling parameters, the steady-state thermal performance data representing the steady-state heat accumulation state and the transient thermal performance data representing the transient heat accumulation state are calculated separately.

[0023] Analyze the trends of the steady-state and transient thermal performance data to determine whether the heat dissipation performance of the component under test meets the standards.

[0024] As a preferred method, determining whether heat dissipation performance meets the standards includes the following steps:

[0025] When the temperature difference between the internal temperature and the surface temperature exceeds the first preset temperature difference threshold, and the calculated total thermal resistance value is higher than the first thermal resistance threshold, it is determined that the internal heat conduction path is blocked, resulting in a decrease in heat dissipation performance.

[0026] When the surface temperature distribution data shows local hot spot clustering and the corresponding local layered thermal resistance value increases non-linearly, it is determined that there is an anomaly in the packaging interface or heat dissipation contact layer.

[0027] When the thermal resistance performance data remains linear and stable within the preset power range, and the total thermal resistance value is lower than the second thermal resistance threshold, the heat dissipation performance is deemed qualified.

[0028] When the transient heat accumulation index exceeds the transient heat dissipation capacity threshold, while the steady-state heat accumulation index is within the normal range, it is determined that the transient thermal inertia matching of the component under test is insufficient, and there is a risk of transient thermal shock failure.

[0029] When the steady-state heat accumulation index is continuously higher than the steady-state heat dissipation capacity threshold, and the steady-state stepped thermal resistance component shows a monotonically increasing trend, it is determined that the component under test has a risk of steady-state thermal fatigue failure.

[0030] When both the transient heat accumulation index and the steady-state heat accumulation index are lower than the corresponding thresholds, and the ratio of their rates of change is within a preset coordination range, it is determined that the component under test has a balanced thermal buffer and static heat dissipation capability, and its overall heat dissipation performance meets the standards.

[0031] As a preferred approach, a pre-aging test step is also included before performing the power loading step:

[0032] The component to be tested was placed in a high temperature and high humidity environment for pre-aging treatment;

[0033] Record the thermal conductivity decay data of the interface material of the component under test and the baseline drift data of the internal temperature measurement node before and after the pre-aging treatment.

[0034] The thermal conductivity decay data and baseline drift data are used as initial correction parameters and input into the thermal resistance calculation module to correct the calculation benchmark of the thermal resistance performance data.

[0035] As a preferred method, analyzing the changing trend of the thermal resistance performance data further includes the following steps:

[0036] Establish a degradation mapping model between thermal resistance performance data and the working life of the component under test;

[0037] Based on the thermal resistance performance data obtained from the current test and the evolution slope of the stepped thermal resistance value, the corresponding estimated remaining lifetime is queried in the degradation mapping model.

[0038] When the estimated remaining lifespan is lower than the preset lifespan threshold, a heat dissipation failure warning is issued.

[0039] As a preferred method, the test current or voltage is applied using a stepped power load. During each power step, the internal temperature and surface temperature are held in thermal equilibrium before the multiple sets of test data are recorded to obtain steady-state thermal resistance data.

[0040] As a preferred approach, a transient thermal testing step is also included: at the instant when the test module is suddenly cut off or suddenly applied a test current or voltage, the internal temperature and surface temperature change curves over time are recorded at a high-frequency sampling rate; based on the temperature response time constant of the change curves and the thermal coupling correlation parameters, the transient heat dissipation capability and equivalent thermal capacity characteristics of the component under test are evaluated.

[0041] Compared with the prior art, the present invention has the following advantages:

[0042] The data processing module constructs a multidimensional equivalent heat conduction network, establishing a spatial mapping relationship between internal temperature measurement points and surface temperature distribution data. It then inverts the heat flux density distribution and extracts thermal coupling parameters, overcoming the limitations of traditional methods that rely solely on single-point surface temperature measurement. The thermal resistance calculation module, combined with these coupling parameters, simultaneously calculates the total thermal resistance and local layered thermal resistance, accurately reconstructing the bottleneck location of heat conduction from the internal heat source to the external surface.

[0043] The stepped thermal resistance calculated along the heat conduction path is decoupled into steady-state and transient stepped thermal resistance components, clearly defining the steady-state heat dissipation capacity under thermal equilibrium and the transient heat dissipation capacity during power transients. Based on this, the generated steady-state and transient heat accumulation indices quantify the degree of heat accumulation at each cross-section during continuous heat exchange and the heat storage rate during temperature jumps, respectively. Through the spatial distribution mapping of these two indices, the evolution law of the stepped thermal resistance and the overall heat dissipation capacity of the component are comprehensively represented.

[0044] The heat dissipation performance evaluation module establishes detailed judgment logic based on separately calculated steady-state and transient thermal performance data. When the transient heat accumulation index exceeds the standard while the steady-state index is normal, it can be accurately determined that the risk of thermal shock is caused by insufficient transient thermal inertia matching. When the steady-state heat accumulation index is consistently high and the steady-state stepped thermal resistance increases monotonically, it can be clearly determined that the risk of steady-state thermal fatigue is caused by a bottleneck in the continuous heat dissipation channel. When both indices are coordinated and below the threshold, the overall performance is deemed satisfactory. This mechanism overcomes the shortcomings of traditional testing that "emphasize results over mechanisms," significantly improving the engineering guidance value for fault location.

[0045] The trigger cycle of the calibration module is functionally mapped to the ambient temperature cycle, ensuring stable temperature acquisition accuracy under complex operating conditions and long-term testing. Thermal conductivity decay and baseline drift data obtained from pre-aging treatment are used for benchmark correction, and a lifetime degradation mapping model between thermal performance data and the gradient thermal resistance evolution slope is established. This enables a leap from single performance testing to remaining lifetime prediction and proactive failure warning, significantly improving the foresight of component thermal management design and system reliability. Attached Figure Description

[0046] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0047] Figure 1 This is a schematic diagram of the system structure provided in an embodiment of the present invention. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] This disclosure provides a component heat dissipation testing system, such as... Figure 1 As shown, the system includes a testing module, a data acquisition module, a data processing module, a thermal resistance calculation module, and a heat dissipation performance evaluation module. The system aims to simultaneously evaluate the steady-state and transient heat dissipation capabilities of components through multi-dimensional temperature field acquisition and equivalent heat conduction network inversion, providing a scientific testing basis for thermal design optimization and reliability early warning.

[0050] Specifically, the test module in this embodiment is configured to apply an adjustable test current or voltage to the component under test (BUT) to control its heat generation power. In this embodiment, the test module employs a high-precision programmable DC power supply and electronic load combination architecture, with an output current adjustment range of 0-50A, a voltage adjustment range of 0-100V, and a power control accuracy of ±0.2%FS. The test module incorporates a PID closed-loop control algorithm, which can output stepped, pulsed, or continuous ramp power waveforms according to test requirements, ensuring precise controllability and rapid switching of heat generation power.

[0051] The data acquisition module is configured to acquire real-time internal and surface temperature distribution data of the component under test. In this embodiment, the internal temperature is acquired using an embedded miniature thermocouple or fiber optic grating sensor array. The sensor probe diameter is 0.1 mm, the temperature measurement range is -50℃ to 200℃, and the accuracy is ±0.1℃. It is directly attached to the chip junction area or the core heat source. The surface temperature distribution data is acquired using a high-resolution infrared thermal imager with a pixel resolution of 640×480, a thermal sensitivity (NETD) of <30 mK, and a sampling frequency of 30 Hz. The internal temperature measurement points and the surface thermal image are aligned at the pixel level using a spatial coordinate calibration algorithm, providing a high-precision reference data source for subsequent heat flow inversion.

[0052] The data processing module includes a thermal conduction coupling analysis unit, configured to construct a multidimensional thermal conduction equivalent network for the component under test. Through the spatial mapping relationship between internal temperature measurement points and surface temperature distribution data, it inversely calculates the heat flux density distribution from the internal heat source to the external surface and extracts the thermal coupling correlation parameters between the internal and external temperatures. In this embodiment, the thermal conduction coupling analysis unit constructs a three-dimensional thermal conduction equivalent network based on the finite difference method or RC reduced-order network algorithm, discretizing the internal structure of the component into several thermal nodes. The coordinates of the internal temperature measurement nodes are established using least-squares fitting or Kalman filtering algorithms. With surface temperature pixels The spatial mapping matrix M. Based on Fourier's law of heat conduction. The heat flux density vector distribution between nodes is retrieved using a mapping matrix. Thermal coupling correlation parameters include the interface equivalent thermal conductivity. Heat capacity of each layer and inter-node thermal resistance coupling matrix This is used to represent the energy exchange characteristics of internal heat sources conducting energy to external surfaces.

[0053] The thermal resistance calculation module is connected to the test module, the data acquisition module, and the data processing module, and is configured to calculate the total thermal resistance and local delamination thermal resistance of the component under test based on the heating power, the internal temperature, the surface temperature distribution data, and the thermal coupling correlation parameters. In this embodiment, the total thermal resistance... Based on the steady-state thermal balance formula Calculation, where For the internal core temperature, For ambient temperature, This represents the heat generation power. The localized layered thermal resistance value is obtained by the ratio of the equivalent network node potential difference to the heat flow, accurately locating the proportion of thermal resistance contribution at each interface of the chip, solder, substrate, TIM layer, and heat sink.

[0054] Furthermore, the thermal resistance calculation module is configured to: divide the heat conduction path of the component under test into multiple test sections, and calculate the stepped thermal resistance between adjacent sections based on the internal temperature difference and surface temperature distribution data corresponding to each section. In this embodiment, the heat conduction path is divided into four test sections sequentially along the direction of "chip junction area → bottom solder → ceramic substrate → thermally conductive interface material → metal heat sink". The stepped thermal resistance between adjacent sections is calculated. ,in The average temperature difference between the cross sections. This represents the inverted heat flow passing through this cross section.

[0055] The stepped thermal resistance value is decoupled into a steady-state stepped thermal resistance component representing the continuous heat conduction path characteristics under thermal equilibrium, and a transient stepped thermal resistance component representing the thermocapacitive response characteristics during the heat flow abrupt change phase. The steady-state heat dissipation capability is defined as the continuous heat exchange and stable thermal resistance behavior of the device under test under thermal equilibrium; the transient heat dissipation capability is defined as its thermocapacitive response and heat flow conduction behavior during the power loading / unloading transient phase. A steady-state heat accumulation index is generated based on the steady-state heat dissipation capability. A transient heat accumulation index is generated based on the transient heat dissipation capability. .

[0056] In this embodiment, ;

[0057] ,in As the standard thermal resistance baseline, For the equivalent heat capacity of the cross section, The steady-state heat accumulation index is used to quantify the continuous heat accumulation and heat dissipation efficiency of each cross-section under thermal equilibrium, while the transient heat accumulation index is used to quantify the heat storage rate and thermal buffering efficiency of each cross-section during temperature jumps. Through the spatial distribution mapping of the steady-state and transient heat accumulation indices, the evolution law of the stepped thermal resistance and the overall heat dissipation capacity of the tested component are comprehensively represented.

[0058] The heat dissipation performance evaluation module in this embodiment is configured to compare the total thermal resistance value and the local layered thermal resistance value with a preset heat dissipation performance threshold to generate a heat dissipation test report. In this embodiment, the evaluation module has a built-in multi-dimensional decision tree that matches thermal resistance data, heat accumulation index, and failure mechanism library to automatically generate a standardized test report including a thermal cloud map, a stepped thermal resistance bar chart, a heat accumulation index radar chart, and a reliability score.

[0059] Furthermore, this embodiment of the disclosure also includes an environmental simulation module configured to provide an external temperature cycling and airflow disturbance environment. In this embodiment, the environmental simulation module consists of a programmable high and low temperature test chamber and a multi-directional variable frequency fan, with a temperature cycling range of -40℃ to 125℃ and an airflow speed adjustment range of 0.5m / s to 5.0m / s. The heat dissipation performance evaluation module is also configured to receive environmental parameter signals from the environmental simulation module and record the transient response values ​​of the thermal performance data output by the thermal resistance calculation module at different stages of environmental parameter changes (such as the heating stage, the heat preservation stage, and the cooling stage).

[0060] Furthermore, this embodiment also includes a calibration module configured to calibrate the data acquisition module using a standard heat source at specific nodes of the temperature cycle in the environmental simulation module, and adjust the equivalent thermal network model parameters in the heat conduction coupling analysis unit based on the calibration results. In this embodiment, the calibration module uses a blackbody radiation source or a precision heating block to trigger calibration at the peaks, troughs, and median nodes of the temperature cycle. Calibration trigger cycle. Operating cycle with the temperature cycle It presents a functional mapping relationship, for example (α, β, γ are the system's adaptive learning parameters). The calibration results are expressed as correction coefficients. and The equivalent network is injected in the form of [a specific method / mechanism], updating the node thermal capacity and thermal conductivity parameters to eliminate sensor thermal drift and model degradation errors.

[0061] This disclosure also provides a component heat dissipation testing method, based on the above system, including the following steps:

[0062] Step S1: Initialize the test environment by setting the initial operating power and ambient temperature of the component under test. In this embodiment, the ambient temperature is stabilized at 25±1℃, the component under test is fixed on the insulating test fixture, and the internal thermocouple arrangement and infrared thermal imager focal length calibration are completed.

[0063] Step S2: Perform the power loading step by applying a test current or voltage to the component under test through the test module. In this embodiment, a stepped power loading strategy is adopted, with the initial power set at 20% of the rated power, and subsequently increasing in increments of 10% to 100%.

[0064] Step S3: Within a preset time series, synchronously acquire the transient temperature response curve at the initial stage of power switching and the steady-state temperature distribution data after thermal equilibrium. Each set of test data includes internal temperature, surface temperature distribution data, and corresponding heat generation power. In this embodiment, during each power step holding period, the system continuously monitors the internal temperature change rate. When it lasts for 60 seconds, it is determined that a thermal equilibrium state has been reached, and at this time, the steady-state distribution data is recorded. At the moment of power jump (within 0-2s), the transient response curve is recorded at a high-frequency sampling rate of 1000Hz to obtain steady-state thermal resistance data and transient thermal impedance characteristics.

[0065] Step S4: After obtaining the transient temperature response curve and steady-state temperature distribution data, construct the spatial mapping relationship between the internal temperature and the surface temperature distribution, and calculate the transient thermal coupling parameters and steady-state thermal coupling parameters respectively. In this embodiment, the steady-state parameters are obtained by solving the equivalent thermal conductivity matrix based on the Fourier steady-state heat conduction equation; the transient parameters are obtained by extracting the transient heat capacity and interface thermal resistance time constant of each layer based on the structure function method or the Cauer / Forster network inversion algorithm.

[0066] Step S5: Combining the heating power, internal temperature, surface temperature distribution data, and corresponding thermal coupling parameters, calculate the steady-state thermal performance data representing the steady-state heat accumulation state and the transient thermal performance data representing the transient heat accumulation state. In this embodiment, the steady-state thermal performance data includes total thermal resistance, the steady-state stepped thermal resistance components of each layer, and the steady-state heat accumulation index; the transient thermal performance data includes transient thermal resistance, temperature response time constant, and transient heat accumulation index.

[0067] Step S6: Analyze the changing trends of the steady-state thermal performance data and transient thermal performance data to determine whether the heat dissipation performance of the component under test meets the standards. The specific determination logic is as follows:

[0068] When the temperature difference between the internal temperature and the surface temperature exceeds the first preset temperature difference threshold (e.g., 15℃), and the calculated total thermal resistance value is higher than the first thermal resistance threshold (e.g., 2.5℃ / W), it is determined that the internal heat conduction path is blocked, resulting in a decrease in heat dissipation performance.

[0069] When the surface temperature distribution data shows local hot spot clustering (hot spot temperature difference > 5℃) and the corresponding local layered thermal resistance value shows a non-linear sharp increase (slope > 0.3℃ / W / s), it is determined that there is an abnormality in the packaging interface or heat dissipation contact layer.

[0070] When the thermal resistance performance data remains linear and stable within the preset power range, and the total thermal resistance value is lower than the second thermal resistance threshold (e.g., 1.8℃ / W), the heat dissipation performance is deemed qualified.

[0071] When the transient heat accumulation index exceeds the transient heat dissipation capacity threshold, while the steady-state heat accumulation index is within the normal range, it is determined that the transient thermal inertia matching of the component under test is insufficient, and there is a risk of transient thermal shock failure.

[0072] When the steady-state heat accumulation index is continuously higher than the steady-state heat dissipation capacity threshold, and the steady-state stepped thermal resistance component shows a monotonically increasing trend (the increase rate at 3 consecutive test points is >5%), it is determined that the continuous heat dissipation channel of the component under test has a bottleneck and there is a risk of steady-state thermal fatigue failure.

[0073] Subdivision 3: When both the transient heat accumulation index and the steady-state heat accumulation index are lower than the corresponding thresholds, and the ratio of their rates of change is within a preset coordination range, it is determined that the component under test has a balanced thermal buffer and static heat dissipation capability, and its overall heat dissipation performance meets the standards.

[0074] Step S7: Before performing the power loading step, a pre-aging test step is also included. The component under test is placed in a high-temperature and high-humidity environment (e.g., 85℃ / 85%RH) for 24-168 hours of pre-aging treatment. The thermal conductivity decay data of the interface material of the component under test and the baseline drift data of the internal temperature measurement nodes are recorded before and after the pre-aging treatment. The thermal conductivity decay data and baseline drift data are used as initial correction parameters and input into the thermal resistance calculation module to correct the calculation benchmark of the thermal resistance performance data and eliminate the interference of early material degradation on the test accuracy.

[0075] Step S8: Establish a degradation mapping model between thermal resistance performance data and the service life of the component under test. In this embodiment, a multivariate degradation function is constructed based on the Arrhenius accelerated life model and the Coffin-Manson thermal fatigue equation. Based on the thermal resistance performance data obtained from the current test and the evolution slope of the stepped thermal resistance value, the corresponding estimated remaining lifetime is queried in the degradation mapping model. When the estimated remaining lifetime is lower than the preset lifetime threshold, the system automatically triggers an audible and visual alarm and outputs a heat dissipation failure warning report.

[0076] Step S9: Perform transient thermal testing. At the instant the test module is suddenly disconnected or suddenly applied a test current or voltage, record the changes in internal and surface temperatures over time at a high-frequency sampling rate (≥1kHz). Based on the temperature response time constant τ of the change curves and the thermal coupling correlation parameters, evaluate the transient heat dissipation capability and equivalent thermal capacity characteristics of the component under test. In this embodiment, by fitting... Extracting the τ value, the smaller the τ and the higher the heat capacity matching degree, the better the transient heat conduction path and the stronger the transient heat dissipation ability. Here, τ is the temperature response time constant.

[0077] This disclosed embodiment overcomes the limitations of traditional single-point temperature measurement by coordinating the testing module and the data acquisition module, achieving synchronous capture of the internal core and external surface temperature fields. The data processing module constructs a multi-dimensional heat conduction equivalent network and spatial mapping mechanism, transforming discrete temperature measurement data into a continuous heat flux density field, giving the extraction of thermally coupled parameters clear physical meaning. The thermal resistance calculation module innovatively introduces stepped thermal resistance decoupling logic, clearly distinguishing between steady-state continuous heat exchange capacity and transient thermal buffering capacity, and quantifying spatial heat accumulation distribution through steady-state / transient heat accumulation indices. This method not only avoids misjudgments caused by "total thermal resistance only" but also achieves precise separation of transient thermal shock risks and steady-state thermal fatigue bottlenecks. Combined with environmental simulation and adaptive function mapping calibration mechanisms, the system can maintain measurement accuracy under complex operating conditions. The introduction of pre-aging correction and life degradation mapping models upgrades testing from static qualification judgment to life prediction and proactive early warning, enhancing the foresight, scientific rigor, and engineering practical value of component thermal design verification.

[0078] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0079] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented using electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods for each specific application to achieve the described functions, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the described devices, apparatuses, and units can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0080] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, function, and operation of possible implementations of apparatus, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than those disclosed in the description; sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based device that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A component heat dissipation testing system, characterized in that, include: The test module is configured to apply an adjustable test current or voltage to the component under test in order to control the heat generation power of the component under test; The data acquisition module is configured to acquire the internal temperature and surface temperature distribution data of the component under test in real time; The data processing module includes a thermal conduction coupling analysis unit, which is configured to construct a multidimensional thermal conduction equivalent network of the component under test, and calculate the heat flux density distribution from the internal heat source to the external surface by inverting the spatial mapping relationship between the internal temperature measurement points and the surface temperature distribution data, and extract the thermal coupling correlation parameters between the internal temperature and the external temperature. A thermal resistance calculation module, connected to the test module, the data acquisition module and the data processing module, is configured to calculate the total thermal resistance and local delamination thermal resistance of the component under test based on the heating power, the internal temperature, the surface temperature distribution data and the thermal coupling correlation parameters. When calculating the thermal resistance value for localized layering, the thermal resistance calculation module is configured as follows: Multiple test sections are divided along the heat conduction path of the component under test. Based on the internal temperature difference and surface temperature distribution data of each section, the stepped thermal resistance between adjacent sections is calculated. The stepped thermal resistance is decoupled into a steady-state stepped thermal resistance component that represents the continuous heat conduction path characteristics under thermal equilibrium state, and a transient stepped thermal resistance component that represents the thermal capacity response characteristics during the heat flow change stage. The heat dissipation performance evaluation module is configured to compare the total thermal resistance value and the local layered thermal resistance value with a preset heat dissipation performance threshold and generate a heat dissipation test report.

2. The component heat dissipation testing system according to claim 1, characterized in that, The thermal resistance calculation module is also configured to: The continuous heat exchange and thermal resistance stability of the tested component under thermal equilibrium is defined as its steady-state heat dissipation capability. Its thermal capacity response and heat flow conduction during the power loading or unloading transient phase are defined as transient heat dissipation capability. A steady-state heat accumulation index is generated based on the steady-state heat dissipation capability, and a transient heat accumulation index is generated based on the transient heat dissipation capability. The steady-state heat accumulation index is used to quantify the degree of continuous heat accumulation and heat dissipation efficiency of each cross section under thermal equilibrium state, and the transient heat accumulation index is used to quantify the heat storage rate and thermal buffering efficiency of each cross section during temperature jump process. Through the spatial distribution mapping of the steady-state heat accumulation index and the transient heat accumulation index, the step thermal resistance evolution law and overall heat dissipation capability of the component under test are comprehensively represented.

3. The component heat dissipation testing system according to claim 1, characterized in that, It also includes an environmental simulation module, configured to provide an external temperature cycle and airflow disturbance environment; the heat dissipation performance evaluation module is further configured to receive environmental parameter signals from the environmental simulation module, and record the transient response values ​​of the thermal performance data output by the thermal resistance calculation module at different stages of environmental parameter changes.

4. The component heat dissipation testing system according to claim 3, characterized in that, It also includes a calibration module, which is configured to calibrate the data acquisition module using a standard heat source at a specific node of the temperature cycle of the environmental simulation module, and adjust the equivalent thermal network model parameters in the heat conduction coupling analysis unit according to the calibration results, and the calibration triggering period is functionally mapped to the running period of the temperature cycle.

5. A method for testing the heat dissipation of electronic components, implemented based on the heat dissipation testing system for electronic components according to any one of claims 1 to 4, characterized in that, Includes the following steps: Initialize the test environment by setting the initial operating power and ambient temperature of the component under test; The power loading step involves applying a test current or voltage to the component under test. Within a preset time series, the transient temperature response curve at the initial stage of power switching and the steady-state temperature distribution data after thermal equilibrium are collected synchronously. Each set of test data includes internal temperature, surface temperature distribution data and corresponding heat generation power. After obtaining the transient temperature response curve and steady-state temperature distribution data, a spatial mapping relationship between the internal temperature and the surface temperature distribution is constructed, and the transient thermal coupling parameters and steady-state thermal coupling parameters are calculated respectively. By combining the heating power, the internal temperature, the surface temperature distribution data, and the corresponding thermal coupling parameters, the steady-state thermal performance data representing the steady-state heat accumulation state and the transient thermal performance data representing the transient heat accumulation state are calculated separately. Analyze the trends of the steady-state and transient thermal performance data to determine whether the heat dissipation performance of the component under test meets the standards.

6. The component heat dissipation testing method according to claim 5, characterized in that, Determining whether heat dissipation performance meets the standards involves the following steps: When the temperature difference between the internal temperature and the surface temperature exceeds the first preset temperature difference threshold, and the calculated total thermal resistance value is higher than the first thermal resistance threshold, it is determined that the internal heat conduction path is blocked, resulting in a decrease in heat dissipation performance. When the surface temperature distribution data shows local hot spot clustering and the corresponding local layered thermal resistance value increases non-linearly, it is determined that there is an anomaly in the packaging interface or heat dissipation contact layer. When the thermal resistance performance data remains linear and stable within the preset power range, and the total thermal resistance value is lower than the second thermal resistance threshold, the heat dissipation performance is deemed qualified. When the transient heat accumulation index exceeds the transient heat dissipation capacity threshold, while the steady-state heat accumulation index is within the normal range, it is determined that the transient thermal inertia matching of the component under test is insufficient, and there is a risk of transient thermal shock failure. When the steady-state heat accumulation index is continuously higher than the steady-state heat dissipation capacity threshold, and the steady-state stepped thermal resistance component shows a monotonically increasing trend, it is determined that the component under test has a risk of steady-state thermal fatigue failure. When both the transient heat accumulation index and the steady-state heat accumulation index are lower than the corresponding thresholds, and the ratio of their rates of change is within a preset coordination range, it is determined that the component under test has a balanced thermal buffer and static heat dissipation capability, and its overall heat dissipation performance meets the standards.

7. The component heat dissipation testing method according to claim 5, characterized in that, Prior to the power loading step, a pre-aging test step is also included: The component to be tested was placed in a high temperature and high humidity environment for pre-aging treatment; Record the thermal conductivity decay data of the interface material of the component under test and the baseline drift data of the internal temperature measurement node before and after the pre-aging treatment. The thermal conductivity decay data and baseline drift data are used as initial correction parameters and input into the thermal resistance calculation module to correct the calculation benchmark of the thermal resistance performance data.

8. The component heat dissipation testing method according to claim 7, characterized in that, Analyzing the changing trend of the thermal resistance performance data also includes the following steps: Establish a degradation mapping model between thermal resistance performance data and the working life of the component under test; Based on the thermal resistance performance data obtained from the current test and the evolution slope of the stepped thermal resistance value, the corresponding estimated remaining lifetime is queried in the degradation mapping model. When the estimated remaining lifespan is lower than the preset lifespan threshold, a heat dissipation failure warning is issued.

9. The component heat dissipation testing method according to claim 5, characterized in that, The test current or voltage uses a stepped power load. During each power step, the internal temperature and surface temperature are held in thermal equilibrium before multiple sets of test data are recorded to obtain steady-state thermal resistance data.

10. The component heat dissipation testing method according to claim 9, characterized in that, It also includes a transient thermal testing step: at the instant when the test module is suddenly cut off or suddenly applied a test current or voltage, the internal temperature and surface temperature change curves over time are recorded at a high frequency sampling rate; based on the temperature response time constant of the change curves and the thermal coupling correlation parameters, the transient heat dissipation capability and equivalent thermal capacity characteristics of the component under test are evaluated.

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