A device for detecting organic matter on a silicon wafer surface

Abstract

The application relates to the technical field of organic matter detection, and discloses a silicon wafer surface organic matter detection device, which comprises a cleanliness meter and a mounting rack for mounting the cleanliness meter, the mounting rack comprises a base, a bottom disc is arranged on the base, two supports are fixedly installed on the bottom disc, and a circular ring is rotatably installed between the two supports; a first support plate and a second support plate for alternately bearing silicon wafers are rotatably installed on the circular ring; when the front surface of the silicon wafer is detected, the first support plate is in a horizontal extension state and serves as a bearing surface, and the second support plate is accommodated in the circular ring to avoid interference; after the front surface detection is completed, the circular ring is driven to rotate by 180 degrees around a horizontal shaft, so that the circular ring is turned over as a whole; at this time, the second support plate extends from the other side of the circular ring and is switched to a horizontal bearing position, reliable support of the back surface of the silicon wafer is realized, and the first support plate is retracted into the circular ring, thereby abandoning the complicated operation of manually using tweezers to clamp and turn over.

Description

Technical Field

[0001] This invention relates to the field of organic matter detection technology, specifically to a device for detecting organic matter on the surface of silicon wafers. Background Technology

[0002] As the basic material for semiconductor manufacturing, the surface cleanliness of silicon wafers directly affects the quality and yield of subsequent processes such as photolithography, etching, and deposition. During silicon wafer processing, processes such as grinding, cutting, cleaning, and polishing may introduce organic contaminants, such as grinding fluid residue, cleaning agent residue, human contact oil, and exudates from packaging materials. These organic substances may lead to serious consequences such as decreased film adhesion, increased contact resistance, device leakage, or even chip scrapping.

[0003] To address the issue of detecting organic matter on silicon wafer surfaces, various detection devices have been developed in the industry. Among them, the SITA cleanliness meter, a precision measuring instrument based on fluorescence detection technology, has been widely used in detecting organic matter on silicon wafer surfaces due to its advantages such as being non-destructive, rapid, and unaffected by surface roughness. This instrument uses a confocal method, irradiating the surface under test with 365nm ultraviolet light emitted from a UV-LED light source, exciting organic molecules to produce fluorescence. The fluorescence intensity is directly proportional to the surface contaminant content, and the measurement result is expressed as an RFU value (relative fluorescence unit); the lower the value, the cleaner the surface.

[0004] When testing silicon wafers in the laboratory, the SITA cleanliness meter is usually installed in a fixed manner. The main body of the instrument is mounted on a stand, and the silicon wafer is placed on the worktable of the stand base. Before testing, the operator needs to adjust the detection distance between the instrument probe and the surface of the silicon wafer. After the distance is adjusted and locked, the silicon wafer is manually moved to achieve non-contact scanning detection of the silicon wafer surface. In order to ensure the high consistency of the detection distance in the multi-point measurement process, the existing technology generally adopts the operation mode of fixing the instrument probe and relying on manual movement of the silicon wafer. However, the existing equipment lacks an auxiliary flipping mechanism. When the back side needs to be tested after the front side of the silicon wafer has been completed, the operator usually uses tweezers to pick up the edge of the silicon wafer and manually flip it. The silicon wafer is thin, and one side is attached to the base during the test, making it difficult for the operator to pick up and flip it. At the same time, manual movement of the silicon wafer is easy to leave fingerprints, and because the silicon wafer is attached tightly to the base, it is inconvenient to move. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a device for detecting organic matter on the surface of silicon wafers, aiming to solve problems such as inconvenience and low efficiency caused by relying on manual flipping.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a silicon wafer surface organic matter detection device, comprising a cleanliness meter and a mounting frame for mounting the cleanliness meter, the mounting frame comprising a base, a chassis disposed on the base, two supports fixedly mounted on the chassis, a ring rotatably mounted between the two supports, a cavity being formed within the ring, and two sets of openings communicating with the cavity being formed on the inner wall of the ring, a first support plate and a second support plate for placing the silicon wafer being rotatably mounted in the two sets of openings respectively, a first rotating component and a second rotating component for controlling the rotation of the first support plate and the second support plate being rotatably mounted in the cavity respectively, a limiting component for controlling the rotation of the ring being disposed between one of the supports and the ring, and a connecting component for controlling the rotation of the first rotating component and the second rotating component being disposed between the other support and the ring, the limiting component controlling the rotation of the ring to flip the silicon wafer, and the connecting component being used to control the alternating switching of the first support plate and the second support plate during the flipping process.

[0007] Preferably, the mounting frame further includes a column fixedly mounted on the base, and a lifting mounting seat is mounted on the column. The cleanliness meter is magnetically connected to the lifting mounting seat.

[0008] Preferably, both the first support plate and the second support plate are circular plates, and an arc-shaped opening is provided on one side of the circular plate.

[0009] Preferably, the first rotating component includes a first annular toothed plate rotatably connected to the inner wall of the cavity. The inner wall of the cavity is provided with a plurality of arc-shaped grooves. A rotating column is fixedly installed on the axis of the first support plate. The rotating column is located in the arc-shaped groove and is rotatably connected to the cavity through a damping rotating shaft. A first toothed ring that meshes with the first annular toothed plate is fixedly sleeved on the rotating column.

[0010] Preferably, the second rotating component includes a second annular toothed plate rotatably connected to the inner wall of the cavity, and a rotating rod is fixedly installed on the axis of the second support plate. The rotating rod is located in the arc groove and is rotatably connected to the cavity through a damping rotating shaft. A second toothed ring that meshes with the second annular toothed plate is fixedly sleeved on the rotating rod. Both the first annular toothed plate and the second annular toothed plate are rotatably connected to the inner wall of the cavity through a damping rotating shaft.

[0011] Preferably, the connector includes a round rod fixedly mounted on one of the brackets, one end of the round rod being located in the cavity and rotatably connected to the ring, and a missing gear being fixedly mounted on one end of the round rod located in the cavity. The first and second annular toothed plates are each fixedly mounted with multiple saw teeth that mesh with the missing gear on the side of the missing gear.

[0012] Preferably, the limiting component includes a fixed rod rotatably mounted on another bracket, the fixed rod being fixedly connected to a ring, a circular cavity being formed at one end of the ring, a square groove being formed on the side wall of the circular cavity, a square rod being slidably disposed in the square groove, a spring being disposed between the square rod and the square groove, a square cavity communicating with the circular cavity being formed on a bracket located on one side of the fixed rod, one end of the square rod passing through the circular cavity and located inside the square cavity, a connecting rod being fixedly connected to the square rod being disposed on a bracket located on one side of the fixed rod, and a rotating handle being fixedly installed on the outer end of the connecting rod.

[0013] Preferably, the base has a mounting cavity, and a magnet that attracts the chassis is slidably disposed in the mounting cavity.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. To achieve rapid automatic flipping during the detection of organic matter on the silicon wafer surface, this invention innovatively designs the silicon wafer support mechanism. Specifically, a flippable silicon wafer support system is constructed by rotating and installing a ring between two supports, and rotating and installing a first support plate and a second support plate on the ring for alternating support of the silicon wafer. When the front side of the silicon wafer is being detected, the first support plate is in a horizontally extended state as the support surface, while the second support plate is retracted inside the ring to avoid interference. After the front side detection is completed, the ring is driven to rotate 180 degrees around the horizontal axis, causing the entire ring to flip. At this time, the second support plate extends from the other side of the ring and switches to a horizontal support position, achieving reliable support for the back side of the silicon wafer, while the first support plate retracts into the ring. This structure realizes the mechanized automatic flipping of the silicon wafer, eliminating the cumbersome operation of traditional manual handling and flipping with tweezers. During the flipping process, the silicon wafer is always supported by the support plate, eliminating the need for direct contact by personnel, so that the flipping action and the switching of the support surface are completed synchronously.

[0015] 2. To achieve full protection of the silicon wafer during the flipping process and prevent it from falling due to support switching delays, this invention optimizes the linkage control mechanism of the support plate. Specifically, a round rod is fixedly installed on one of the brackets, and a notched gear is fitted onto the round rod. When the drive ring rotates around the horizontal axis to flip the silicon wafer, the first annular toothed plate located above the ring moves synchronously with the ring. Its inner serrations mesh with the notched gear, driving the first support plate to gradually extend outward from its retracted state. In the initial stage of flipping, the first support plate extends first, providing dynamic protection for the silicon wafer during the flipping process. After the first support plate extends, the first annular toothed plate continues to move until it disengages from the notched gear, and the first support plate remains extended. After flipping is completed, the first support plate remains in a horizontal bearing position, serving as the back side of the silicon wafer. The first support plate provides a stable support surface. Simultaneously, the second annular toothed plate located below the ring moves synchronously with the ring. Its inner serrations are in a non-meshing state with the missing gear in the initial flipping stage, and the second support plate remains extended to protect the other side of the silicon wafer. When the flipping enters the later stage, the second annular toothed plate moves to the position of meshing with the missing gear, driving the second support plate to gradually retract from the extended state into the ring, avoiding interference with the detection probe and making room for subsequent detection. This structure realizes the time-linked control of the flipping action of the support plate and the ring. The first support plate extends first in the initial flipping stage, and the second support plate does not retract in the initial flipping stage, ensuring that the silicon wafer has protective support throughout the flipping process and eliminating the risk of the silicon wafer falling. The second support plate automatically retracts in the later stage of flipping to avoid interference with the detection probe and ensure the smooth operation of the detection.

[0016] 3. To achieve non-contact position adjustment and temporary positioning during silicon wafer inspection, this invention slides a magnet attracted to the chassis within the mounting cavity of the base. By pushing the support to move, the position of the silicon wafer can be adjusted without contact. When the movement stops and inspection is performed, the mutual attraction between the chassis and the magnet can temporarily fix the position of the ring and the silicon wafer. This design avoids the risk of fingerprint contamination or scratches caused by operators directly pushing the silicon wafer with their hands or tools, and simplifies the position adjustment and positioning process, significantly improving the convenience and safety of the inspection process. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This is a three-dimensional cross-sectional structural diagram of the base of the present invention; Figure 3 This is a three-dimensional structural diagram of the ring of the present invention; Figure 4 This is a schematic diagram showing the disassembled structure of the ring, the first support plate, and the second support plate of the present invention; Figure 5 This is a three-dimensional structural schematic diagram of the first rotating component of the present invention; Figure 6 for Figure 5 A magnified structural diagram of A in the middle; Figure 7 This is a three-dimensional structural schematic diagram of the second rotating component of the present invention; Figure 8 for Figure 7 A magnified structural diagram of B in the diagram; Figure 9 This is a frontal three-dimensional cross-sectional view of the ring structure of the present invention; Figure 10 for Figure 9 A magnified structural diagram of C.

[0018] In the diagram: 1. Base; 2. Lifting mounting base; 3. Column; 4. Cleanliness meter; 5. Rotary handle; 6. Ring; 7. Mounting cavity; 8. Bracket; 9. Chassis; 10. Magnet; 11. Round rod; 12. First support plate; 13. Second support plate; 14. First annular toothed plate; 15. Gear missing; 16. Rotary column; 17. Connecting rod; 18. Cavity; 19. Opening; 20. Arc groove; 21. Square rod; 22. Spring; 23. Square groove; 24. Circular cavity; 25. Square cavity; 26. First toothed ring; 27. Sawtooth; 28. Second annular toothed plate; 29. ​​Rotary rod; 30. Fixing rod; 31. Silicon wafer; 32. Second toothed ring. Detailed Implementation

[0019] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0020] Please see Figures 1-10 A device for detecting organic matter on the surface of a silicon wafer includes a cleanliness meter 4 and a mounting frame for mounting the cleanliness meter 4. The mounting frame includes a base 1 and a column 3 fixedly mounted on the base 1. A lifting mounting seat 2 is mounted on the column 3 (the lifting mounting seat 2 can be adjusted up and down on the column 3 to control the distance between the cleanliness meter 4 and the silicon wafer 31; the adjustment method is prior art; the lifting mounting seat 2 can slide on the column 3 and then be fixed by bolts; the adjustment method is not limited to the above one). The cleanliness meter 4 and the lifting mounting seat 2 are magnetically connected. The above structure is prior art and is well known to those skilled in the art. A base 1 is provided with a chassis 9, and two supports 8 are fixedly installed on the chassis 9. In order to achieve rapid automatic flipping during the detection of organic matter on the surface of silicon wafer 31, the present invention has made an innovative design to the silicon wafer 31 support mechanism. Specifically, a ring 6 is rotatably installed between the two supports 8. A cavity 18 is opened in the ring 6. Two sets of openings 19 communicating with the cavity 18 are opened in the inner wall of the ring 6. A first support plate 12 and a second support plate 13 (both the first support plate 12 and the second support plate 13 are circular plates, and an arc-shaped opening is opened on one side of the circular plate) are rotatably installed in the two sets of openings 19 for placing the silicon wafer 31. A first rotating component and a second rotating component for controlling the rotation of the first support plate 12 and the second support plate 13 are rotatably installed in the cavity 18. A limiting component for controlling the rotation of the ring 6 is provided between one support 8 and the ring 6, and a limiting component for controlling the rotation of the first rotating component and the second supporting component is provided between the other support 8 and the ring 6. The connecting component and the limiting component control the rotation of the ring 6 to flip the silicon wafer 31. The connecting component is used to control the alternating switching of the first support plate 12 and the second support plate 13 during the flipping process. When the front side of the silicon wafer 31 is being inspected, the first support plate 12 is in a horizontally extended state as a bearing surface, while the second support plate 13 is retracted inside the ring 6 to avoid interference. After the front side inspection is completed, the limiting component drives the ring 6 to rotate 180 degrees around the horizontal axis, causing the ring 6 to flip as a whole. During this process, the second support plate 13 extends to protect the back side of the silicon wafer 31 during rotation and to provide support after flipping, thus providing reliable support for the back side of the silicon wafer 31. Meanwhile, the first support plate 12 retracts into the ring 6, realizing the mechanized automatic flipping of the silicon wafer 31. This eliminates the tedious operation of manually using tweezers to pick up and flip the wafer. During the flipping process, the silicon wafer 31 is always supported by the support plate, eliminating the need for direct contact by personnel. This allows the flipping action and the switching of the support surface to be completed synchronously. The first rotating component includes a first annular toothed plate 14 rotatably connected to the inner wall of the cavity 18. The inner wall of the cavity 18 has multiple arc-shaped grooves 20. A rotating column 16 is fixedly mounted on the axis of the first support plate 12. The rotating column 16 is located within the arc-shaped grooves 20 and is rotatably connected to the cavity 18 via a damping shaft. A first toothed ring 26, meshing with the first annular toothed plate 14, is fixedly sleeved on the rotating column 16. The second rotating component includes a second annular toothed plate 28 rotatably connected to the inner wall of the cavity 18. A rotating rod 29 is fixedly mounted on the axis of the second support plate 13. The rotating rod 29 is located within the arc-shaped grooves 20 and is rotatably connected to the cavity 18 via a damping shaft. A second toothed ring 32, meshing with the second annular toothed plate 28, is fixedly sleeved on the rotating rod 29. Both the first annular toothed plate 14 and the second annular toothed plate 28 are rotatably connected to the inner wall of the cavity 18 via damping shafts. The connecting component includes a round rod fixedly mounted on one of the brackets 8. 11. One end of the round rod 11 is located in the cavity 18 and is rotatably connected to the ring 6. In order to achieve full protection of the silicon wafer 31 during the flipping process and avoid the silicon wafer 31 falling due to support switching delay, the present invention optimizes the linkage control mechanism of the support plates (first support plate 12 and second support plate 13). Specifically, a missing gear 15 is fixedly installed at one end of the round rod 11 located in the cavity 18. The first annular toothed plate 14 and the second annular toothed plate 28 are both fixedly installed on one side of the missing gear 15 with multiple serrations 27 that mesh with the missing gear 15 (the first annular toothed plate 14 and the second annular toothed plate 28 rotate half a turn around the missing gear 15, and the first support plate 12 and the second support plate 13 rotate half a turn respectively). When the driving ring 6 rotates around the horizontal axis (round rod 11) to flip the silicon wafer 31, the first annular toothed plate 14 located above the ring 6 moves synchronously with the ring 6 (see Figure 10The inner serration 27 of the first ring toothed plate 14 meshes with the missing gear 15, driving the first ring toothed plate 14 to rotate. The first ring toothed plate 14 drives multiple first toothed rings 26 to rotate. The first toothed rings 26 drive the first support plate 12 to gradually extend outward from the retracted state through the rotating column 16. In the initial stage of flipping (before the rotation of the ring 6 is less than 60 degrees), the first support plate 12 extends first, providing dynamic protection for the silicon wafer 31 during the flipping process. (At this time, the second ring toothed plate 28 located below the ring 6 moves synchronously with the ring 6. Its inner serration 27 is in a non-meshing state with the missing gear 15 in the initial stage of flipping. The second support plate 13 remains extended, providing protection for the other side of the silicon wafer 31.) Afterward, the ring 6 continues to rotate, and the serration 27 on one side of the first ring toothed plate 14 disengages from the missing gear 15 until the flipping is completed. The serration 27 on one side of the first ring toothed plate 14 remains disengaged from the missing gear 15. After the flipping is completed, the first support plate... 12 is in a horizontal bearing position, serving as a stable support surface for the back of silicon wafer 31. When the flipping enters the later stage (after the ring 6 rotates more than 120 degrees), the second annular toothed plate 28 moves to the position where its inner serrations 27 mesh with the missing gear 15, driving the second annular toothed plate 28 to rotate. The second annular toothed plate 28 drives multiple second toothed rings 32 to rotate. The second toothed rings 32 drive the second support plate 13 from the extended state to gradually retract into the ring 6 through the rotating rod 29, avoiding interference with the detection probe and making room for subsequent detection. This structure realizes the time-linked control of the flipping action of the support plate and the ring 6. The first support plate 12 extends first in the early stage of flipping, and the second support plate 13 does not retract in the early stage of flipping, ensuring that the silicon wafer 31 has protective support throughout the flipping process and eliminating the risk of the silicon wafer 31 falling. The second support plate 13 automatically retracts in the later stage of flipping to avoid interference with the detection probe and ensure the smooth progress of the detection operation.

[0021] As a further technical solution of the present invention, the limiting member includes a fixed rod 30 rotatably mounted on another bracket 8. The fixed rod 30 is fixedly connected to a circular ring 6. A circular cavity 24 is opened at one end of the circular ring 6. A square groove 23 is opened on the side wall of the circular cavity 24. A square rod 21 is slidably arranged in the square groove 23. A spring 22 is arranged between the square rod 21 and the square groove 23. A square cavity 25 communicating with the circular cavity 24 is opened on the bracket 8 located on one side of the fixed rod 30 (the vertical cross-sectional size of the square groove 23, the square cavity 25 and the square rod 21 are the same). One end of the square rod 21 passes through the circular cavity 24 and is located in the square cavity 25. A spring 22 is arranged on the bracket 8 located on one side of the fixed rod 30. A connecting rod 17 is fixedly connected to the square rod 21. A handle 5 is fixedly installed on the outer end of the connecting rod 17. When it is necessary to control the flipping, the handle 5 is squeezed, and the handle 5 pushes the connecting rod 17. The connecting rod 17 pushes one end of the square rod 21 out of the square cavity 25, and the spring 22 is squeezed. Then the handle 5 is rotated, and the handle 5 drives the rotation. The connecting rod 17 drives the square rod 21 to rotate. The square rod 21 drives the fixed rod 30 to rotate through the square groove 23. The fixed rod 30 drives the ring 6 to rotate. After the flipping is completed, the handle 5 is released. Due to the action of the spring 22 (the handle 5 is rotated slowly in the later stage to reduce the lateral squeezing force applied to the handle 5), one end of the square rod 21 is pushed into the square cavity 25 for limiting.

[0022] As a further technical solution of the present invention, a mounting cavity 7 is provided in the base 1. In order to achieve non-contact position adjustment and temporary positioning during the inspection of silicon wafer 31, a magnet 10 attracted to the chassis 9 is slidably arranged in the mounting cavity 7. By pushing the bracket 8 to move, the position of silicon wafer 31 can be adjusted without contact. When the movement stops and inspection is carried out, the mutual attraction between the chassis 9 and the magnet 10 can temporarily fix the position of the ring 6 and the silicon wafer 31. This setting not only avoids the risk of fingerprint contamination or scratches caused by the operator directly pushing the silicon wafer 31 with his hands or tools, but also simplifies the operation process of position adjustment and positioning, and significantly improves the convenience and safety of the inspection process.

[0023] During work: Step 1: Initial State Before operation, the ring 6 is in the initial position, the first support plate 12 is in a horizontally extended state as a bearing surface, and the second support plate 13 is stored inside the ring 6. The silicon wafer 31 to be tested is placed on the first support plate 12. The detection distance between the cleanliness instrument 4 and the silicon wafer 31 is adjusted by the lifting mounting seat 2. After adjusting to the optimal detection distance, it is locked. During testing, the operator pushes the bracket 8 to move the chassis 9 on the base 1 to adjust the testing position of the silicon wafer 31. After the movement stops, the magnet 10 in the mounting cavity 7 attracts the chassis 9 to form a temporary fixation of the ring 6 and the silicon wafer 31 in position. Step 2: Preparing to flip the dough After the front inspection is completed, the operator needs to flip the silicon wafer 31 over for the back inspection. First, press the handle 5. The handle 5 pushes the connecting rod 17 inward. The connecting rod 17 drives the square rod 21 to overcome the elastic force of the spring 22 and move it to the side of the ring 6, so that the end of the square rod 21 exits from the square cavity 25, releasing the circumferential lock on the ring 6. The press-type unlocking design allows the operator to complete the limit release with one hand without the need for tools. Step 3: Initial Flip The operator rotates the handle 5, which drives the square rod 21 to rotate through the connecting rod 17. The square rod 21 drives the fixed rod 30 to rotate through the square groove 23. The fixed rod 30 drives the ring 6 to start flipping around the horizontal axis (round rod 11). In the initial stage of flipping (before the rotation angle of the ring 6 is less than 60 degrees), the first annular toothed plate 14 located above the ring 6 moves synchronously with the ring 6. Its inner sawtooth 27 meshes with the missing gear 15 to drive the first annular toothed plate 14 to rotate. The first annular toothed plate 14 drives the rotating column 16 to rotate through the first toothed ring 26, so that the first support plate 12 gradually extends outward (towards the center of the ring 6) from the horizontal bearing state. At the same time, the second annular toothed plate 28 located below the ring 6 moves synchronously with the ring 6. Its inner serration 27 is in a non-meshing state with the missing gear 15 in the initial flipping stage. The second support plate 13 remains in an extended state, providing support and protection for the silicon wafer 31 from the other side. This ensures that the silicon wafer 31 receives active support from the first support plate 12 and continuous support from the second support plate 13 in the initial flipping stage, achieving double-sided protection and preventing the silicon wafer 31 from falling due to gravity during the flipping process. The action of the first support plate 12 extending first is synchronized with the flipping of the ring 6, requiring no additional operation. Step 4: Turning the Tide As the ring 6 continues to rotate, when the sawtooth 27 on one side of the first annular toothed plate 14 disengages from the missing gear 15, the first support plate 12 stops rotating. Under the action of the damping shaft, the first support plate 12 remains in a fully extended state. At this time, the silicon wafer 31 is supported by the first support plate 12 and the second support plate 13 and flips together with the ring 6. At this time, the second support plate 13 is still in an extended state. Step 5: Post-processing When the ring 6 flips into the later stage (after the rotation angle is greater than 120 degrees), the second ring tooth plate 28 moves to the position where its inner sawtooth 27 meshes with the missing gear 15. The missing gear 15 drives the second ring tooth plate 28 to rotate. The second ring tooth plate 28 drives the rotating rod 29 to rotate through the second tooth ring 32, so that the second support plate 13 gradually retracts from the extended state into the inside of the ring 6. The ring 6 continues to rotate until it completes a 180-degree flip. At this time, the second support plate 13 has been completely retracted, and the first support plate 12 is in a horizontal bearing position, serving as a stable support surface on the back of the silicon wafer 31. The second support plate 13 automatically retracts in the later stage of the flip to avoid interference with the detection probe of the cleanliness meter 4, thus making room for subsequent back-side inspection. The retraction action and the flipping action are completed simultaneously without manual intervention. Step 6: Flipping and Position Locking Completed After the ring 6 completes a 180-degree rotation, the operator releases the handle 5, and the spring 22 pushes the square rod 21 to slide outward (the handle 5 is rotated slowly later to reduce the lateral pressure applied to the handle 5), so that the end of the square rod 21 is re-engaged into the square cavity 25, thereby achieving circumferential locking of the ring 6 and ensuring that the position of the ring 6 is stable when the back side of the silicon wafer 31 is inspected. Then, the silicon wafer 31 is inspected in the same way as the front-side inspection, and this process can be repeated for repeated use.

[0024] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the claims of the present invention.

Claims

1. A device for detecting organic matter on the surface of a silicon wafer, comprising a cleanliness meter (4) and a mounting frame for mounting the cleanliness meter (4), the mounting frame comprising a base (1), characterized in that, A base (1) is provided with a chassis (9), and two supports (8) are fixedly installed on the chassis (9). A ring (6) is rotatably installed between the two supports (8). A cavity (18) is opened in the ring (6). Two sets of openings (19) communicating with the cavity (18) are opened on the inner wall of the ring (6). A first support plate (12) and a second support plate (13) for placing the silicon wafer (31) are rotatably installed in the two sets of openings (19). A control device is rotatably installed in the cavity (18). A first rotating member and a second rotating member are provided to control the rotation of the first support plate (12) and the second support plate (13). A limiting member for controlling the rotation of the ring (6) is provided between one of the brackets (8) and the ring (6). A connecting member for controlling the rotation of the first rotating member and the second rotating member is provided between the other bracket (8) and the ring (6). The limiting member controls the rotation of the ring (6) to flip the silicon wafer (31). The connecting member is used to control the alternation of the first support plate (12) and the second support plate (13) during the flipping process. The first rotating component includes a first annular toothed plate (14) rotatably connected to the inner wall of the cavity (18). The inner wall of the cavity (18) is provided with a plurality of arc-shaped grooves (20). A rotating column (16) is fixedly installed on the axis of the first support plate (12). The rotating column (16) is located in the arc-shaped groove (20) and is rotatably connected to the cavity (18) through a damping rotating shaft. A first toothed ring (26) that meshes with the first annular toothed plate (14) is fixedly sleeved on the rotating column (16). The second rotating component includes a second annular toothed plate (28) rotatably connected to the inner wall of the cavity (18). A rotating rod (29) is fixedly installed on the axis of the second support plate (13). The rotating rod (29) is located in the arc groove (20) and is rotatably connected to the cavity (18) through a damping rotating shaft. A second toothed ring (32) that meshes with the second annular toothed plate (28) is fixedly sleeved on the rotating rod (29). The first annular toothed plate (14) and the second annular toothed plate (28) are both rotatably connected to the inner wall of the cavity (18) through a damping rotating shaft. The connector includes a round rod (11) fixedly installed on one of the brackets (8). One end of the round rod (11) is located in the cavity (18) and is rotatably connected to the ring (6). A missing gear (15) is fixedly installed at one end of the round rod (11) located in the cavity (18). The first annular toothed plate (14) and the second annular toothed plate (28) are both fixedly installed with multiple serrations (27) that mesh with the missing gear (15) on the side of the missing gear (15). The limiting component includes a fixed rod (30) rotatably mounted on another bracket (8). The fixed rod (30) is fixedly connected to a ring (6). A circular cavity (24) is opened at one end of the ring (6). A square groove (23) is opened on the side wall of the circular cavity (24). A square rod (21) is slidably arranged in the square groove (23). A spring (22) is arranged between the square rod (21) and the square groove (23). A square cavity (25) communicating with the circular cavity (24) is opened on the bracket (8) located on one side of the fixed rod (30). One end of the square rod (21) passes through the circular cavity (24) and is located in the square cavity (25). A connecting rod (17) fixedly connected to the square rod (21) is arranged on the bracket (8) located on one side of the fixed rod (30). A rotating handle (5) is fixedly installed on the outer end of the connecting rod (17).

2. The device for detecting organic matter on the surface of a silicon wafer according to claim 1, characterized in that, The mounting frame also includes a column (3) fixedly installed on the base (1), and a lifting mounting seat (2) is installed on the column (3). The cleanliness meter (4) and the lifting mounting seat (2) are magnetically connected.

3. The device for detecting organic matter on the surface of a silicon wafer according to claim 2, characterized in that, Both the first support plate (12) and the second support plate (13) are circular plates, and an arc-shaped opening is provided on one side of the circular plate.

4. The device for detecting organic matter on the surface of a silicon wafer according to claim 3, characterized in that, The base (1) has an installation cavity (7) inside, and a magnet (10) that attracts the chassis (9) is slidably arranged inside the installation cavity (7).

Images