A multi-channel full-temperature parameter test method and system for SLD batch detection

Abstract

The application relates to the technical field of SLD detection, in particular to a multi-channel full-temperature parameter test method and system for SLD batch detection. The method comprises the following steps: acquiring a multi-channel test information set, analyzing the reflection light coupling evolution process of SLD output light on the surface of an external optical path element in each test channel based on the multi-channel test information set, and obtaining a reflection light interference information set; acquiring temperature parameter information, analyzing the cooperative interference characteristics of power fluctuation effects and spectrum disturbance effects caused by the reflection light back injection into an SLD chip in a temperature adjustment process based on the temperature parameter information and in combination with the reflection light interference information set, and obtaining an optical path reflection-temperature coupling interference information set; and generating a dynamic compensation test strategy according to the optical path reflection-temperature coupling interference information set, and outputting a multi-channel full-temperature parameter test log. The precision, stability and batch consistency of SLD parameter tests in a full temperature range are improved.

Description

Technical Field

[0001] This application relates to the field of SLD testing technology, and in particular to a multi-channel full-temperature parameter testing method and system for batch SLD testing. Background Technology

[0002] Superluminescent diodes (SLDs) are core light sources in high-precision optical systems such as fiber optic gyroscopes and optical coherence tomography (OCT). The stability of key parameters such as output power, spectral width, and center wavelength under different temperature environments directly determines the performance and reliability of the final system. In the mass production of SLDs, to evaluate the performance of devices across the entire temperature range, a multi-channel parallel testing system combined with a high-low temperature test chamber is typically used for batch testing. Existing testing schemes mainly rely on multi-channel driver sources to provide operating current to the SLD under test, switching the optical path via an optical switch, and importing the output optical signal into an optical power meter and a spectrometer for data acquisition, with the test results recorded by host computer software.

[0003] However, in existing technologies, the output light from the SLD inevitably generates reflected light when passing through components such as lenses, isolators, and fiber optic interfaces in the transmission optical path. This reflected light is injected back into the SLD chip, disturbing its internal resonant mode. At the same time, the optical gain spectrum and refractive index of the SLD chip are highly sensitive to temperature changes, resulting in complex nonlinear coupling between the reflected light interference effect and temperature changes. This causes unexpected fluctuations and distortions in the test data, seriously affecting the accuracy, repeatability, and consistency of batch test results and product grading. Summary of the Invention

[0004] This application provides a multi-channel full-temperature parameter testing method and system for batch testing of SLDs to solve the above-mentioned problems.

[0005] In a first aspect, this application provides a multi-channel full-temperature parameter testing method for batch testing of SLDs. The method includes: acquiring a multi-channel test information set; based on the multi-channel test information set, analyzing the evolution process of reflected light coupling of SLD output light on the surface of external optical path components in each test channel to obtain a reflected light interference information set; acquiring temperature parameter information; based on the temperature parameter information and combined with the reflected light interference information set, analyzing the synergistic interference characteristics of power fluctuation effect and spectral perturbation effect caused by the back injection of reflected light into the SLD chip during temperature adjustment to obtain an optical path reflection-temperature coupling interference information set; generating a dynamic compensation test strategy based on the optical path reflection-temperature coupling interference information set, and outputting a multi-channel full-temperature parameter test log.

[0006] Through the above technical solution, a multi-channel test information set is obtained and the evolution process of reflected light coupling on the surface of external optical path components of SLD output light is analyzed, thereby obtaining a reflected light interference information set that can characterize dynamic reflection behavior. On this basis, temperature parameter information is further obtained, and the synergistic interference characteristics of power fluctuation effect and spectral perturbation effect caused by reflected light back-injection into SLD chip during temperature adjustment are analyzed in depth, thereby constructing an optical path reflection-temperature coupling interference information set that reveals the nonlinear coupling mechanism of the two. Subsequently, a dynamic compensation test strategy that can actively cancel interference is generated based on this coupling interference information set, and a multi-channel full-temperature parameter test log containing complete process data is output simultaneously. This series of steps enables a shift from simple open-loop data acquisition to closed-loop intelligent control. By precisely quantifying the dynamic coupling relationship between reflected light and temperature changes, it effectively solves the problem of nonlinear fluctuations in measurement data caused by neglecting the synergistic effect between the two in existing tests. It also avoids large dispersion and misjudgment of test results due to uncompensated interference. Therefore, this solution significantly improves the accuracy, stability, and batch consistency of SLD parameter testing across the entire temperature range. At the same time, the generated structured test logs provide valuable data support for subsequent process optimization and device reliability analysis, achieving high-precision and highly robust automated batch testing.

[0007] Optionally, the step of analyzing the evolution process of reflected light coupling of SLD output light on the surface of external optical path components in each test channel based on the multi-channel test information set to obtain a reflected light interference information set includes: the multi-channel test information set includes SLD driving information and optical path component information; based on the optical path component information, analyzing the static reflection points and reflectivity distribution formed by the differences in coating characteristics and incident angles on the surfaces of different optical components in each test channel to obtain an initial reflection spectrum; based on the SLD driving information and combined with the initial reflection spectrum, analyzing the characteristic information of the changes in light intensity and spot shape of SLD output light under different driving currents and modulation states on the initial reflection spectrum to obtain the reflected light interference information set.

[0008] Optionally, the process of constructing the initial reflection spectrum includes: based on the optical path element information, analyzing the variation law of coating reflectivity under different incident angles, and the influence of optical element surface curvature on incident angle distribution, to obtain reflectivity-incident angle correlation information; based on the reflectivity-incident angle correlation information, analyzing the actual incident angle range of SLD output light on the surface of each optical element and the corresponding reflectivity distribution, to obtain the static reflection points and reflectivity distribution of all optical surfaces in each test channel, as the initial reflection spectrum.

[0009] Optionally, based on the SLD driving information and combined with the initial reflection spectrum, the analysis of the characteristic information of the changes in the intensity and spot shape of the SLD output light under different driving currents and modulation states on the initial reflection spectrum to obtain the reflected light interference information set includes: based on the SLD driving information, analyzing the characteristic that the increase in the intensity of the SLD output light during the increasing driving current stage leads to a proportional increase in the actual reflected light power at each reflection point, to obtain reflected light intensity dynamic response information; based on the reflected light intensity dynamic response information, analyzing the characteristic that the broadening of the divergence angle of the SLD chip's thermally induced beam leads to the expansion of the output spot shape, thereby activating previously unilluminated reflection points and changing the effective incident angle of the original reflection points, to obtain spot-reflection coupling information; based on the spot-reflection coupling information, analyzing the characteristic information of the real-time evolution of the reflected light intensity and reverse injection path in each test channel with driving conditions, to obtain the reflected light interference information set.

[0010] Optionally, based on the temperature parameter information and combined with the reflected light interference information set, the analysis of the synergistic interference characteristics of power fluctuation and spectral perturbation effects caused by the back-injection of reflected light into the SLD chip during temperature adjustment, to obtain the optical path reflection-temperature coupled interference information set, includes: the temperature parameter information being the multi-channel temperature parameter information of the SLD during batch testing; based on the temperature parameter information and combined with the reflected light interference information set, analyzing the characteristics of selective amplification or suppression of the back-injected wavelength reflected light due to changes in the gain spectrum and refractive index caused by chip temperature changes, to obtain spectral perturbation information; based on the spectral perturbation information, analyzing the characteristics of unexpected fluctuations in the total output power of the SLD caused by the selective amplification process, to obtain power fluctuation correlation information; and based on the power fluctuation correlation information, analyzing the interference characteristics of the temporal coupling evolution of spectral perturbation and power fluctuation, and their variation with reflected light, to obtain the optical path reflection-temperature coupled interference information set.

[0011] Optionally, the process of constructing the spectral perturbation information includes: based on the temperature parameter information, analyzing the influence of the temperature uniformity change of the SLD chip heat sink on the change of the center wavelength of the gain spectrum in different local areas of the chip, and obtaining regionalized gain spectrum change information; based on the reflected light interference information set, analyzing the wavelength components and polarization state distribution carried by the reflected light injected back into the SLD chip from different spatial reflection points, and obtaining multipath reflection spectrum information; based on the regionalized gain spectrum change information, combined with the multipath reflection spectrum information, analyzing the spatial difference of the gain spectrum formed by the non-uniform temperature distribution inside the chip, and the interaction between it and the reflected light from different sources, and obtaining the spectral perturbation information.

[0012] Optionally, the process of constructing the power fluctuation correlation information includes: based on the spectral perturbation information, analyzing the characteristics of optical field mode competition induced in the SLD chip resonant cavity by wavelength reflected light selectively amplified by chip temperature, and obtaining mode competition perturbation information; based on the mode competition perturbation information, analyzing the characteristics of nonlinear change of the total output power of SLD with temperature and reflected light conditions, and obtaining the power fluctuation correlation information.

[0013] Optionally, the step of analyzing the temporal coupling evolution of spectral perturbations and power fluctuations based on the power fluctuation correlation information, and the interference characteristics that vary with reflected light, to obtain the optical path reflection-temperature coupling interference information set, includes: based on the power fluctuation correlation information, analyzing the periodic coupling relationship between the peak values ​​of spectral perturbations triggered by temperature changes and the power fluctuations caused by them, due to the existence of thermal hysteresis effect, resulting in a dynamic phase difference; and based on the time-domain perturbation phase information, combined with the reflected light interference information set, analyzing the evolution process of the amplitude and asymmetry of the periodic coupling relationship being reconstructed in real time when the intensity and path of reflected light change with driving conditions, to obtain the optical path reflection-temperature coupling interference information set.

[0014] Optionally, the step of generating a dynamic compensation test strategy based on the optical path reflection-temperature coupling interference information set and outputting a multi-channel full-temperature parameter test log includes: analyzing the mapping relationship between real-time amplitude and asymmetry characteristics and the current test conditions based on the optical path reflection-temperature coupling interference information set, and obtaining the compensation parameter mapping relationship; dynamically generating current fine-tuning instructions and temperature compensation instructions to offset periodic coupling interference based on the compensation parameter mapping relationship and the real-time temperature and drive current parameters during the test process, as the dynamic compensation test strategy; executing the dynamic compensation test strategy, and synchronously recording the original parameters, compensation instructions and compensated test results of each test channel during the execution process, and outputting the multi-channel full-temperature parameter test log.

[0015] Secondly, this application provides a multi-channel full-temperature parameter testing system for batch testing of SLDs. The system includes: a reflected light coupling evolution module, used to acquire a multi-channel test information set, and based on the multi-channel test information set, analyze the reflected light coupling evolution process of the SLD output light on the surface of the external optical path element in each test channel to obtain a reflected light interference information set; a light reflection temperature coupling module, used to acquire temperature parameter information, and based on the temperature parameter information, combined with the reflected light interference information set, analyze the synergistic interference characteristics of power fluctuation effect and spectral perturbation effect caused by the back injection of reflected light into the SLD chip during temperature adjustment to obtain an optical path reflection-temperature coupling interference information set; and a dynamic compensation module, used to generate a dynamic compensation test strategy according to the optical path reflection-temperature coupling interference information set, and output a multi-channel full-temperature parameter test log. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram illustrating an application scenario provided in one embodiment of this application;

[0018] Figure 2 A flowchart of a multi-channel full-temperature parameter testing method for batch testing of SLDs provided in an embodiment of this application;

[0019] Figure 3 This is a schematic diagram of a multi-channel full-temperature parameter testing system for batch testing of SLDs, provided in one embodiment of this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0021] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0022] The embodiments of this application will now be described in further detail with reference to the accompanying drawings.

[0023] In the mass production testing of superluminescent diodes (SLDs), multi-channel parallel testing systems are typically used to improve efficiency, and full-temperature parameter testing is conducted under high and low temperature environments to evaluate device performance. However, existing testing techniques often only perform open-loop temperature control or passively suppress reflection using high-isolation devices, making it difficult to eliminate the dynamic and nonlinear coupling interference generated between external optical path reflected light and chip temperature changes. Specifically, reflected light from SLD output light on the surfaces of components such as lenses and fiber optic interfaces can be injected back into the chip, disturbing the internal resonant modes. At the same time, changes in chip temperature alter its gain spectrum and refractive index, leading to selective amplification of reflected light at specific wavelengths, which in turn causes power jumps and spectral distortions. The synergistic effect of this reflected light interference and temperature changes renders existing static compensation methods ineffective, resulting in poor repeatability and low consistency of batch test results, especially with large data dispersion near extreme temperature points, which seriously affects test accuracy and the reliability of product grading.

[0024] Based on this, this application provides a multi-channel full-temperature parameter testing method and system for batch testing of SLDs. By analyzing the evolution of SLD reflected light coupling and temperature parameters, a reflection-temperature coupling interference information set is constructed, a dynamic compensation strategy is formulated, and a full-temperature test log is output. This achieves open-loop acquisition to closed-loop intelligent control, solves the data fluctuation problem, and improves test accuracy, stability, and consistency.

[0025] Figure 1 This application provides an illustration of an application scenario. In multi-channel full-temperature parameter testing for batch SLD inspection, the method provided in this application is applied to analyze the coupling interference mechanism between SLD reflected light and temperature, generate a dynamic compensation strategy, and complete closed-loop intelligent testing. This solves the problems of nonlinear fluctuations and data discrepancies, comprehensively improves the testing performance across the entire temperature range, and provides high-quality data for process optimization.

[0026] Specifically, the method provided in this application can be applied to any server. The server interacts with a multi-channel photodetector and a high-precision temperature sensor to obtain a multi-channel test information set provided by the multi-channel photodetector and temperature parameter information provided by the high-precision temperature sensor. To address the problem of reflection and temperature coupling interference in SLD testing, the method uses multi-channel acquisition, interference modeling, and dynamic compensation, and outputs a multi-channel full-temperature parameter test log to the testing personnel. This achieves a shift from open-loop acquisition to closed-loop control, significantly reducing data fluctuations and misjudgments.

[0027] For specific implementation details, please refer to the following examples.

[0028] Figure 2 This is a flowchart illustrating a multi-channel full-temperature parameter testing method for batch SLD testing, provided in one embodiment of this application. The method of this embodiment can be applied to servers in the above-described scenarios. Figure 2 As shown, the method includes:

[0029] S201. Obtain a multi-channel test information set. Based on the multi-channel test information set, analyze the evolution process of reflected light coupling on the surface of external optical path components of SLD output light in each test channel to obtain a reflected light interference information set.

[0030] The multi-channel test information set refers to a dataset describing the initial state and configuration parameters of the multi-channel test system. It includes SLD drive information and optical path component information, with the multi-channel photodetector as the data source. The SLD drive information specifically includes parameters such as the drive current range, modulation waveform format, and current ramp-up rate for each test channel; this information comes from the control command configuration of the test system. The optical path component information includes the preset physical parameters of each optical component (such as collimating lenses, isolators, fiber optic connectors, etc.) in each channel's optical path, such as the component's spatial coordinates, installation angle, surface coating type, and its corresponding reflectivity-incident angle characteristic curve. This multi-channel test information set serves as the baseline input for subsequent reflected light behavior analysis, providing fundamental data support for constructing a dynamic interference model.

[0031] The evolution of reflected light coupling can refer to the physical process in which the output light of an SLD changes in intensity distribution and spot shape due to changes in driving state during multi-channel optical path transmission, thereby causing dynamic changes in the activation state and reflectivity of reflection points on the surface of external optical path components. Specifically, based on the information of optical path components, ray tracing simulation or geometric calculation is performed to first determine the static reflection points and reflectivity distribution of each optical surface under the standard divergence angle, forming an initial reflection spectrum. Subsequently, combined with SLD driving information, the characteristics of the increase in SLD output light intensity leading to a proportional increase in the actual reflected light power of each reflection point when the driving current increases are analyzed, as well as the characteristics of the SLD chip thermally induced beam divergence angle widening leading to an enlarged output spot, which activates previously unilluminated reflection points and shifts the effective incident angle of the original reflection points. For example, when the drive current of a certain channel increases from 50mA to 200mA, the SLD junction temperature rises, causing the beam divergence angle to widen from 15 degrees to 22 degrees. The lens edge coating area, which was originally outside the edge of the beam spot, is now included in the illumination range, thus adding a new set of high-reflectivity feedback paths. Through this dynamic analysis, the system can capture in real time the evolution of reflected light intensity and reverse injection path with driving conditions.

[0032] This step aims to quantify the dynamic interference characteristics of reflected light in each test channel. By establishing a mapping relationship from driving conditions to reflected light states, a set of reflected light interference information is obtained. This information set quantitatively describes the effective reflectivity, reflected light power, and the predicted optical path of each reflection point at each moment, as well as its reverse injection into the SLD chip. This provides accurate input variables for subsequent analysis of the synergistic interference between temperature and reflected light, effectively avoiding distortion of the interference model caused by ignoring dynamic changes in the light spot.

[0033] S202. Obtain temperature parameter information. Based on the temperature parameter information and combined with the reflected light interference information set, analyze the synergistic interference characteristics of power fluctuation effect and spectral perturbation effect caused by the reverse injection of reflected light into the SLD chip during the temperature adjustment process, and obtain the optical path reflection-temperature coupling interference information set.

[0034] Among these, the power fluctuation effect can refer to the phenomenon where the total output power of the SLD undergoes an unexpected nonlinear change due to intracavity mode competition caused by the reverse injection of reflected light; the spectral perturbation effect can refer to the phenomenon where changes in chip temperature cause a shift in the center wavelength of the gain spectrum, resulting in resonance matching with reflected light of a specific wavelength, thus producing selective amplification or suppression of spectral distortion. The cooperative interference characteristic can refer to the dynamic phase difference and amplitude coupling relationship between the aforementioned power fluctuation and spectral perturbation in the time dimension due to thermal hysteresis.

[0035] Specifically, based on temperature parameter information, the impact of chip temperature changes on the material's refractive index and gain spectrum is analyzed, particularly the regionalized gain spectrum changes caused by non-uniform temperature distribution. Simultaneously, combined with the aforementioned set of reflected light interference information, the wavelength components and polarization state distributions carried by reflected light from different spatial reflection points are analyzed. When the wavelength of reflected light from a certain path matches the peak gain spectrum of a local region of the chip at a specific temperature, that reflected light will be selectively amplified, leading to spectral perturbations. Furthermore, the amplified reflected light competes with the master mode within the SLD chip's resonant cavity, vying for gain resources and causing output power fluctuations. Crucially, due to the hysteresis in chip thermal capacity and heat conduction, there is a dynamic phase difference between the temperature-triggered spectral perturbation and the final power fluctuation, and this phase difference is periodically coupled to the perturbation amplitude. For example, during the process of heating from -40℃ to 85℃, when the temperature reaches 60℃, the chip gain spectrum redshifts to 1550nm, which happens to match the 1550nm stray light reflected back from the fiber end face. At this time, the spectrum shows a peak, and then after 200ms, the power drops significantly due to the thermal accumulation effect. This correlation between the time lag and the amplitude is the cooperative interference characteristic.

[0036] This step, through in-depth analysis of the interaction mechanism between the temperature field and the light field, integrates isolated temperature effects and reflection interference into a unified coupling model, obtaining an information set of optical path reflection-temperature coupling interference. This information set not only contains the static amplitude of the interference, but also the phase and asymmetry characteristics of the interference over time, revealing the root cause of nonlinear fluctuations in data during full-temperature testing and providing a core basis for generating accurate dynamic compensation strategies.

[0037] S203. Based on the optical path reflection-temperature coupling interference information set, generate a dynamic compensation test strategy and output a multi-channel full-temperature parameter test log.

[0038] The dynamic compensation test strategy can refer to a set of real-time control commands used to counteract periodic coupling interference, including current fine-tuning commands and temperature compensation commands. The current fine-tuning command is used to slightly increase the drive current in advance to maintain output stability when a decrease in power due to coupling interference is predicted. The temperature compensation command is used to reverse the temperature control system to smooth out spectral fluctuations when the rate of temperature change is too rapid, causing a sudden change in the gain spectrum. The multi-channel full-temperature parameter test log can refer to a structured data file that records the entire test process, including the original parameters of each test channel, the executed compensation commands, the compensated test results, and the corresponding coupling interference signature.

[0039] Specifically, based on the optical path reflection-temperature coupling interference information set, the mapping relationship between real-time amplitude and asymmetry characteristics and the current test conditions (such as the current temperature point, drive current value, and specific reflected light mode) is first analyzed to establish a compensation parameter mapping relationship. Subsequently, based on the real-time monitoring data during the test, specific compensation instructions are dynamically generated by looking up tables or calculating. For example, when it is detected that a channel is about to enter the temperature-reflection resonance region, a pre-compensation amount of +0.5mA is automatically superimposed on the drive current of that channel, and the temperature control rate is adjusted synchronously to actively offset the expected power drop. While executing the above dynamic compensation test strategy, the set temperature, measured temperature, set current, compensation current increment, measured original power, compensated power, spectral data pointer, and coupling interference feature code of each test channel are recorded simultaneously to form a complete test log.

[0040] This step realizes the transformation from passive measurement to active intelligent control. The real-time generated compensation strategy effectively eliminates the measurement error caused by the combined interference of reflected light and temperature, significantly improving the accuracy and repeatability of SLD parameter testing across the entire temperature range. At the same time, the output multi-channel full-temperature parameter test log completely preserves the interference model and compensation process data, providing valuable data support for subsequent optimization of SLD chip design, improvement of optical path packaging process, and prediction of device reliability.

[0041] The method provided in this embodiment achieves in-depth modeling and real-time compensation of complex interference mechanisms in SLD batch testing. Specifically, the constructed dynamic reflected light interference information set provides accurate optical path boundary conditions, enabling temperature-reflection coupling analysis to be based on a dynamically evolving optical path rather than an idealized static one. The revealed cooperative interference characteristics provide precise compensation targets and phase basis, allowing the compensation strategy to proactively offset interference rather than retrospectively correct it. The generated test logs, in turn, verify the accuracy of the first two models, forming a closed-loop optimization mechanism. Through this progressive technical solution, this application successfully solves the problem of large test data dispersion caused by neglecting the coupling effect of reflected light and temperature in existing technologies. While ensuring high efficiency of multi-channel parallel testing, it achieves extremely high consistency and reliability, making it particularly suitable for mass production testing scenarios of high-end SLD devices with stringent performance requirements.

[0042] Example 2

[0043] In one optional embodiment, the method further includes the following steps: Analyzing the evolution process of reflected light coupling to obtain a set of reflected light interference information.

[0044] Step 1: The multi-channel test information set includes SLD driver information and optical path component information;

[0045] SLD driving information refers to the electrical control parameters required for the testing of the superluminescent diode, specifically including the drive current setpoint, current ramp-up rate, modulation waveform type, and modulation frequency for each test channel. Optical path component information refers to the physical property data of all optical components along the optical signal transmission path in the multi-channel test system, including the spatial coordinates, surface curvature radius, mounting angle, and material property curves of surface coatings for components such as lenses, isolators, and fiber optic connectors. SLD driving information and optical path component information work together; the former provides the dynamic excitation conditions of the light source, while the latter provides the static environmental constraints for light propagation. Together, they constitute the complete input boundary for analyzing the coupling evolution process of reflected light. By collecting these two types of information, a full-link digital model from electrical drive to optical transmission can be established, laying the data foundation for accurately calculating the behavior of reflected light.

[0046] Step 2: Based on the optical path component information, analyze the static reflection points and reflectivity distribution formed by the coating characteristics and incident angle differences on the surfaces of different optical components in each test channel to obtain the initial reflection spectrum;

[0047] The initial reflection map can be a static spatial mapping of all potential reflection sources in the test optical path. This map is constructed based on optical path element information, utilizing geometric optics principles to perform ray tracing or gridding scanning on each test channel. Specifically, for each optical element surface in the optical path, the system calculates the actual incident angle distribution range of the SLD output beam on that surface based on its surface curvature and mounting angle. Simultaneously, the pre-stored coating characteristic database is invoked to query the reflectivity values ​​of the coating on the surface under different incident angles. Since the coating reflectivity usually exhibits a non-linear relationship with the incident angle, and the curvature of different component surfaces can cause differences in the incident angle of the same beam at different locations, the above analysis can determine which areas on each optical surface will be covered by the beam (i.e., static reflection points) and the specific reflectivity values ​​corresponding to these points. For example, for a collimating lens with a curvature radius of 10mm, when the beam is incident at an angle ranging from 5 to 15 degrees, the incident angles of the lens's central and edge regions are different, causing its reflectivity to change from 0.5% to 1.2%. This continuously changing reflectivity distribution is discretized into multiple static reflection points and their attributes, which are recorded in the initial reflection spectrum. By constructing the initial reflection spectrum, the complex optical path structure is abstracted into a calculable set of reflection points, clarifying the background reflection state under no dynamic driving changes, and providing a benchmark reference for subsequent analysis of dynamic interference.

[0048] Step 3: Based on the SLD driving information and combined with the initial reflection spectrum, analyze the characteristic information of the changes in the light intensity and spot shape of the SLD output light under different driving currents and modulation states on the initial reflection spectrum, and obtain the reflection light interference information set.

[0049] The reflected light interference information set can be a dynamic data sequence describing the intensity, path, and evolution of reflected light. This information set is generated by coupling the static initial reflection spectrum with the dynamic SLD driving information. Specifically, firstly, based on the data from the increasing drive current stage in the SLD driving information, the characteristic that the increase in SLD output light intensity leads to a proportional increase in the actual reflected light power at each static reflection point is analyzed, yielding dynamic response information for reflected light intensity. Secondly, considering the thermally induced beam divergence angle broadening effect of the SLD chip, as the drive current increases or the chip junction temperature rises over a long period, the output beam pattern expands. Further analysis is conducted to determine how this beam expansion activates dormant reflection points that were originally outside the edge of the beam in the initial reflection spectrum and were not illuminated, while simultaneously causing a slight shift in the effective incident angle of the original reflection points, thus leading to dynamic adjustment of reflectivity. This process is called beam-reflection coupling. For example, when the drive current increases from 50mA to 200mA, the beam divergence angle of the SLD may widen from 20 degrees to 25 degrees, causing the edge of the fiber optic connector end face, which was originally unlit, to enter the beam spot range, generating new strong reflection points. Simultaneously, the change in the incident angle of the original points leads to a 0.3% fluctuation in reflectivity. Based on the above beam spot-reflection coupling information, the characteristics of the real-time evolution of reflected light intensity and reverse injection path in each test channel under driving conditions are comprehensively calculated, ultimately forming a set of reflected light interference information including timestamps, channel IDs, reflection point coordinates, instantaneous reflected power, and reverse injection angles. This step, by mapping the dynamic changes in the driving state onto a static optical path model, achieves accurate capture of the entire lifecycle of reflection interference, revealing the physical nature of reflected light not being constant but dynamically reconstructed according to operating conditions. This provides high-fidelity dynamic input data for subsequent temperature-coupled interference analysis.

[0050] This embodiment achieves a leap from static optical path modeling to dynamic interference quantification. By introducing a hierarchical processing mechanism of SLD driving information and optical path component information, an initial reflection spectrum covering coating characteristics and incident angle differences is first constructed using optical path component information, establishing a spatial benchmark for reflection interference. Based on this, the physical processes of light intensity enhancement and spot morphology broadening are simulated using SLD driving information, dynamically activating potential reflection points and correcting existing reflectivity, generating a set of reflection light interference information that reflects real-time operating conditions. This modeling approach, combining static spectrum and dynamic response, not only overcomes the limitations of existing methods that only consider fixed reflection loss, but also effectively solves the problem of reflection path uncertainty caused by changes in driving state. The initial reflection spectrum provides precise geometric and physical constraints for dynamic analysis, while the SLD driving information endows the model with the ability to evolve over time. The synergistic effect of both enables the prediction of the evolution trend of reflected light under different current and modulation states, significantly improving the perception accuracy of external optical path reflection interference and laying a solid data foundation for the subsequent generation of high-precision dynamic compensation strategies.

[0051] Example 3

[0052] In another optional embodiment, the initial reflectance spectrum construction method further includes:

[0053] Step 1: Based on the information of optical path components, analyze the variation law of coating reflectivity under different incident angles, and the influence of the surface curvature of optical components on the incident angle distribution, to obtain reflectivity-incident angle correlation information;

[0054] The optical path component information refers to the detailed set of physical parameters of the optical components contained in each channel of the multi-channel test system. Specifically, this includes the surface coating type, coating design curve, geometric radius of curvature, and spatial installation orientation of components such as lenses, isolators, and fiber collimators. The reflectivity-incident angle correlation information is an intermediate data model obtained by combining the inherent coating characteristics of optical components with their geometric shape. Specifically, firstly, a pre-stored Fresnel reflectivity database is called to extract the characteristic curves of reflectivity variation with incident angle under different polarization states (S-ray and P-ray). Simultaneously, combined with the curvature parameters of the optical component surface, the local incident angle distribution field formed by the continuous change of the normal direction when the light beam passes through the surface is calculated. For example, for a plano-convex lens with a radius of curvature R, when the SLD output beam illuminates its surface at a divergence angle θ, there is a significant difference in the actual incident angle between the beam's central region and the edge region. This difference causes the same beam of light to excite different reflectivity responses at different positions on the lens surface. By quantifying the superposition of the incident angle broadening effect caused by curvature and the sensitivity of the coating angle, reflectivity-incident angle correlation information describing the three-dimensional mapping relationship between spatial location, incident angle, and reflectivity is generated. This step aims to eliminate the errors caused by treating the optical surface as an ideal plane or ignoring the influence of curvature on the diagonal distribution in traditional modeling, laying a physical foundation for the subsequent accurate calculation of static reflection points.

[0055] Step 2: Based on the reflectivity-incident angle correlation information, analyze the actual incident angle range and corresponding reflectivity distribution of the SLD output light on the surface of each optical element, and obtain the static reflection points and reflectivity distribution of all optical surfaces in each test channel as the initial reflection spectrum.

[0056] The initial reflection map refers to a static reflection feature map that, under a specific optical path architecture, does not dynamically change with the driving current but is determined by the optical path geometry. Static reflection points are the set of coordinates where the beam effectively interacts with the optical surface, calculated using a ray tracing algorithm after considering the divergence characteristics of the SLD light source and the spatial layout of the optical elements. The reflectivity distribution is the energy reflection coefficient matrix corresponding to these points. Specifically, using the reflectivity-incident angle correlation information generated in the previous step, the propagation path of the SLD output beam in the optical path is discretized and sampled. For each sampled ray, the precise incident angle when it reaches the surface of each optical element is calculated, and the correlation information database is queried to obtain the instantaneous reflectivity at that point. For example, in a certain test channel, the beam emitted by the SLD illuminates the isolator end face after passing through a collimating lens. Analysis revealed that due to the slight tilt design of the isolator end face, the incident angle of the beam in the upper half is 4 degrees, corresponding to a reflectivity of 0.1%. In the lower half, due to beam divergence, the incident angle increases to 8 degrees, and the reflectivity jumps to 0.5%. These areas with significant reflection contributions are marked as static reflection points, and their spatial coordinates (x, y, z) and reflectivity values ​​R(x, y) are recorded. Finally, these are integrated to form an initial reflection map covering all channels. Through this refined construction method, the initial reflection map can accurately reproduce the background reflection noise map in complex optical paths. This provides a high-fidelity reference for subsequent steps when analyzing the movement or intensity change of the light spot caused by changes in the driving current, thereby significantly improving the accuracy of identifying dynamic reflection interference.

[0057] The method provided in this embodiment achieves high-precision construction of the initial reflection spectrum. By deeply analyzing the nonlinear law of the coating reflectivity variation with the incident angle, and combining the specific influence of the surface curvature of optical elements on the incident angle distribution, accurate reflectivity-incident angle correlation information is established. Based on this, the actual incident angle range of the SLD output light is further matched with this correlation information, which not only determines the static reflection points of all optical surfaces in each test channel, but also quantifies the reflectivity distribution of each point. This processing method overcomes the modeling deviations caused by the use of average reflectivity or simplified geometric models in existing technologies, ensuring that the initial reflection spectrum can truly reflect the inherent reflection characteristics of the optical path system. The resulting initial reflection spectrum serves as a benchmark for subsequent dynamic analysis, effectively supporting the accurate deduction of the reflected light coupling evolution process caused by the increase in light intensity and changes in light spot morphology under SLD driving conditions, thus providing a reliable data source for generating high-precision dynamic compensation test strategies.

[0058] Example 4

[0059] In one embodiment, a set of reflected light interference information is obtained by combining driving information with an initial reflection spectrum. The method further includes the following steps:

[0060] Step 1: Based on the SLD driving information, analyze the characteristic that the increase in the intensity of the SLD output light leads to a proportional increase in the actual reflected light power at each reflection point during the increasing driving current stage, and obtain the dynamic response information of the reflected light intensity.

[0061] The dynamic response information of reflected light intensity can be calculated by mapping the real-time acquired drive current value to the light intensity-current characteristic curve and combining it with the static reflectivity of each point in the initial reflection spectrum constructed in the previous steps. Its function is to quantitatively describe the linear energy growth law on the existing reflection paths in the optical path when the external excitation is enhanced. Specifically, the processor reads the current drive current setting value of the current channel, for example, linearly increasing from 50mA to 200mA, and determines that the output light intensity increases proportionally based on the electro-optical conversion efficiency of the SLD device. Since the initial reflection spectrum has defined the reflectivity of each optical element surface (such as lens surface, fiber end face) at a specific geometric position, the actual reflected light power at any reflection point is equal to the product of the static reflectivity at that point and the total output light intensity of the SLD at the current moment. Through this real-time mapping mechanism, the synchronous amplification effect of optical power on all known reflection paths can be accurately tracked during the current ramp-up process, thereby forming dynamic response information of reflected light intensity that reflects the dynamic changes in light intensity. This step aims to establish a direct linear relationship model between the driving current and the intensity of reflected light, laying the foundation for subsequent analysis of nonlinear thermal effects.

[0062] Step 2: Based on the dynamic response information of reflected light intensity, analyze the characteristics of the expansion of the output light spot shape caused by the thermally induced beam divergence angle of the SLD chip, which activates the originally unilluminated reflection points and changes the effective incident angle of the original reflection points, and obtain the light spot-reflection coupling information.

[0063] The beam-reflection coupling information can be obtained by further analyzing the thermal physical effects of the SLD chip based on the dynamic response information of reflected light intensity. During the increase of the driving current, the SLD chip generates Joule heating, leading to an increase in the chip junction temperature. This, in turn, causes changes in the refractive index distribution of the active region and a broadening of the beam divergence angle. This physical process causes the shape of the output beam to dynamically expand over time. The role of the beam-reflection coupling information is to capture the reflection pattern reconstruction phenomenon caused by the change in beam shape, including the activation of new reflection points and the drift of the incident conditions of old reflection points. Specifically, as the beam diameter increases, optical surface areas that were originally outside the beam's coverage area and not illuminated (i.e., previously unilluminated reflection points) enter the optical path. These new areas are instantly activated due to their specific coating reflectivity, becoming new reflection sources. Simultaneously, for previously illuminated reflection points, the angle at which light reaches the surface is slightly adjusted due to the change in the beam divergence angle, causing the effective incident angle to deviate from the initial design value. Therefore, based on the reflectivity-incident angle characteristic curve of the coating material, the actual reflectivity of this point undergoes a nonlinear jump. For example, when the driving current increases from 100mA to 150mA, the chip junction temperature rises by 5°C, and the beam divergence angle half-angle widens from 15° to 18°. At this point, a lens edge region farther from the optical axis begins to receive light energy, and its reflectivity abruptly changes from 0 to 0.5%. Simultaneously, the change in the incident angle in the central region causes the reflectivity to decrease from 0.2% to 0.15%. By comprehensively calculating the contribution of the newly added activated points and the parameter drift of existing points, spot-reflection coupling information containing spatial topology changes and dynamic reflectivity adjustments is generated. This step reveals the nonlinear effect of electro-thermal-optical multiphysics coupling on reflection interference, avoiding modeling errors caused by only considering linear increases in light intensity.

[0064] Step 3: Based on the spot-reflection coupling information, analyze the characteristic information of the real-time evolution of reflected light intensity and reverse injection path in each test channel with driving conditions to obtain the reflected light interference information set.

[0065] The method for generating the reflected light interference information set involves using the driving current sequence on the time axis as the independent variable and iteratively solving the spot shape and reflection point state at each moment to construct a four-dimensional data matrix (time, spatial coordinates, reflection intensity, and injection path vector). Specifically, based on the coordinates of the newly activated point and the change parameters of the original point determined in the spot-reflection coupling information, the geometric path length and phase delay of each reverse injection optical path are recalculated. Combined with the real-time reflection intensity, an interference characteristic sequence that evolves with the driving current in real time is formed. For example, in a certain test channel, as the driving current continues to increase, a third reverse injection path is detected to be suddenly established due to the activation of a new reflection point, and the injection light intensity of this path shows a step-like increase, while the intensity of the first main reflection path shows a slight dip due to the change in the incident angle. By integrating these dynamic evolution features, the resulting set of reflected light interference information can accurately characterize the complex reflection interference panorama induced by different driving conditions under multi-channel batch detection environment. This result provides high-fidelity dynamic input data for subsequent analysis of the synergistic interference of temperature and reflected light, ensuring that the compensation strategy can adapt to the entire process of device operating state changes.

[0066] This embodiment achieves a technological leap from static reflection modeling to dynamic evolution tracking. First, by analyzing the linear enhancement effect of light intensity caused by increasing driving current, the basic magnitude of reflection interference is established. Based on this, a chip-induced thermal beam divergence angle broadening mechanism is introduced, accurately capturing the activation of reflection points and incident angle drift caused by the expansion of the beam spot shape, revealing the source of nonlinear abrupt changes in reflection interference. Finally, the dynamic response of light intensity and the beam spot-reflection coupling effect are spatiotemporally fused to construct a reflection light interference information set that can reflect the real-time evolution of reflected light intensity and reverse injection path with driving conditions. This progressive analysis logic not only predicts conventional optical power fluctuations but also proactively identifies novel reflection path interference caused by thermal effects. This solves the technical problem of incomplete reflection interference assessment and compensation failure caused by neglecting the dynamic changes in the SLD's own operating state in existing testing methods, significantly improving the accuracy and robustness of multi-channel full-temperature parameter testing.

[0067] Example 5

[0068] In an optional embodiment, the method further includes the following steps: Analyzing the combined interference characteristics of power fluctuations and spectral perturbations to obtain a set of coupled interference information.

[0069] Step 1: Temperature parameter information refers to the multi-channel temperature parameter information of the SLD during batch testing;

[0070] Temperature parameter information refers to the real-time temperature data set of each test channel during the high and low temperature cycle batch testing of SLD devices. Data is sourced from high-precision temperature sensors. This information includes not only the target temperature value set in the temperature chamber, but more importantly, the instantaneous temperature value and its rate of change measured by the high-precision temperature sensor attached to the heat sink or casing surface of the SLD chip. Because it is a multi-channel parallel test, the temperature parameter information exists in matrix or list form, with each row corresponding to an independent test channel, recording the temperature state of that channel at a specific timestamp. For example, in test channel number 3, the temperature parameter information can be recorded as the temperature sampling points per second during the process of heating from -40℃ to 85℃, such as {T1=-40.0℃, T2=-39.8℃, ..., Tn=85.0℃}. This temperature data serves as the basic input variable for subsequent analysis of changes in the internal physical characteristics of the chip, directly reflecting the thermal environment state of the SLD chip. By acquiring multi-channel temperature parameter information, the thermal history of all devices under test can be monitored simultaneously, ensuring the channel specificity and real-time performance of subsequent interference analysis.

[0071] Step 2: Based on temperature parameter information and combined with the reflected light interference information set, analyze the characteristics of selective amplification or suppression of the wavelength reflected light injected in reverse due to changes in the gain spectrum and refractive index caused by chip temperature changes, and obtain spectral perturbation information.

[0072] The spectral perturbation information refers to the data set describing the optical characteristic drift of the SLD chip caused by temperature changes, which, after interacting with externally back-injected reflected light, leads to distortion of the output spectrum. Specifically, the refractive index of the active region material and the center wavelength of the gain spectrum of the SLD chip both exhibit significant temperature dependence. When the temperature increases, the bandgap decreases, causing the gain spectrum to redshift towards longer wavelengths. At the same time, the increased refractive index alters the optical path length within the cavity. In this case, if reflected light from external optical path elements (such as lens surfaces or fiber end faces) is back-injected into the chip, and its wavelength component happens to fall within the high-gain region of the chip's gain spectrum at the current temperature, this portion of the reflected light will be selectively amplified by the chip. Conversely, if the wavelength of the reflected light deviates from the gain peak, it will be suppressed. This selective response is not static but dynamically evolves with real-time changes in temperature parameters. For example, when the temperature of a channel rises from 25°C to 60°C, the chip's gain peak redshifts by 15nm. The 1560nm reflected light component, which was suppressed at 25°C, may be at the peak of the gain at 60°C and thus amplified dramatically, resulting in abnormal spikes or sidelobes in the output spectrum. Furthermore, considering the non-uniformity of the chip's heat sink temperature distribution, the center wavelength of the gain spectrum in different local regions of the chip may have slight differences, forming regionalized gain spectrum variations. This causes reflected light from different spatial paths to be modulated to varying degrees at different locations within the chip. Through the above analysis, we can quantify how temperature changes modulate external reflected light by altering the chip's intrinsic properties, thereby accurately capturing the mechanism of spectral perturbation generation.

[0073] Step 3: Based on spectral perturbation information, analyze the characteristics of unexpected fluctuations in the total output power of the SLD caused by the selective amplification process, and obtain power fluctuation correlation information;

[0074] The power fluctuation correlation information refers to a data sequence characterizing the intracavity mode competition effect caused by spectral perturbations, which leads to nonlinear and unexpected fluctuations in the total output power of the SLD. Within the SLD chip's resonant cavity, photon gain resources are limited. When the intensity of the selectively amplified reflected light component reaches a certain threshold, it competes with the chip's original dominant mode for carriers and gain resources, triggering intense mode competition. This competition results in the compression of the dominant mode power or energy shifting back and forth between the dominant mode and the amplified reflected mode. Macroscopically, this manifests as drastic fluctuations or step-like jumps in the total output power, rather than a smooth change with temperature or current. For example, during temperature rise, if a certain reflected light wavelength suddenly enters the high-gain region and is amplified, it may instantly seize 20% of the gain resources, causing the total output power to drop by 5mW in a short time, subsequently recovering due to thermal equilibrium adjustment, forming a significant power dip. This fluctuation differs from simple thermally induced power decreases; it is abrupt and unpredictable, and its amplitude often far exceeds the normal temperature drift range. Power fluctuation correlation information records the time point, fluctuation amplitude, and duration of such power anomalies triggered by spectral perturbations. By analyzing the causal chain between spectral perturbation information and power data, it is possible to identify which power fluctuations are caused by reflected light coupling, thereby distinguishing environmental noise from actual device performance.

[0075] Step 4: Based on the power fluctuation correlation information, analyze the interference characteristics of the temporal coupling evolution of spectral perturbation and power fluctuation and their variation with reflected light to obtain the optical path reflection-temperature coupling interference information set;

[0076] The optical path reflection-temperature coupling interference information set is a multi-dimensional dynamic model data that fully describes the co-evolution of spectral perturbations and power fluctuations in the time domain, and how this pattern is reconstructed with changes in reflected light conditions (such as intensity and path). Crucially, the spectral perturbations triggered by temperature changes (due to changes in refractive index and gain spectrum) and the resulting power fluctuations are not instantaneously synchronized. Instead, there is a thermal hysteresis effect caused by chip thermal capacity and thermal conduction delays. This means that when the temperature reaches a certain critical point and triggers spectral resonance, the dramatic power fluctuations may lag by several seconds or even tens of seconds before reaching their peak, creating a specific phase difference on the time axis. Furthermore, as the driving conditions change (refer to the update of the reflected light interference information set above), the intensity and incident path of the external reflected light will change, which will reconstruct the amplitude and asymmetry of the aforementioned periodic coupling relationship in real time. For example, when the driving current increases, causing the light spot to expand and activating new strong reflection points, the coupling amplitude between the spectral perturbations and power fluctuations may double, and the phase difference may decrease. By tracking the time series of power fluctuation correlation information and spectral perturbation information in real time, the cross-correlation function or phase lag angle of the two is calculated, and parameters characterizing this dynamic coupling feature (such as coupling coefficient, lag time constant, and waveform asymmetry) are extracted. The resulting optical path reflection-temperature coupling interference information set not only includes the current interference intensity but also predicts the interference trend under future temperature or driving changes, providing a precise mathematical model basis for subsequent dynamic compensation.

[0077] This embodiment constructs a full-link interference model from microscopic physical mechanisms to macroscopic manifestations. Through deep fusion of temperature parameter information and reflected light interference information, it reveals the selective amplification mechanism between chip gain spectrum drift and external reflected light, elucidating the causal chain of spectral perturbation-induced mode competition leading to power fluctuations. More importantly, this scheme captures the asynchronous coupling characteristics of spectral perturbation and power fluctuations in the time dimension, namely the dynamic phase difference caused by thermal hysteresis. This deep modeling of the interaction and time lag of multiple physical fields—temperature, reflection, spectrum, and power—allows temperature influence and reflection interference to be treated as independent factors, but rather as a dynamically coupled system for overall control. It can accurately predict the timing and intensity of interference, thus laying a solid data foundation for generating dynamic compensation strategies that can proactively offset such periodic coupled interference. This effectively solves the technical challenge of existing static compensation methods being unable to cope with nonlinear, time-varying coupled interference, significantly improving the accuracy and consistency of full-temperature testing.

[0078] Example 6

[0079] In one embodiment, the method for constructing spectral perturbation information further includes the following steps:

[0080] Step 1: Based on temperature parameter information, analyze the impact of the temperature uniformity change of the SLD chip heat sink on the change of the center wavelength of the gain spectrum in different local regions of the chip, and obtain the regionalized gain spectrum change information.

[0081] During operation, SLD chips often exhibit a non-uniform internal temperature distribution due to Joule heating from current injection and the Peltier effect, meaning there are significant temperature gradients between the chip's central and edge regions, and between the P-region and N-region. This variation in temperature uniformity directly leads to spatially differentiated distributions of the semiconductor material's bandgap and refractive index, resulting in a shift in the center wavelength of the gain spectrum in different local regions of the chip. This regionalized gain spectrum variation information can be obtained by dividing the chip into several micro-grids and, for each grid, calculating the peak wavelength and linewidth change of the gain spectrum in that local region using a semiconductor bandgap theory model or a pre-calibrated temperature-wavelength shift coefficient matrix based on the measured temperature value within that grid. For example, when the temperature in the chip's central region is detected to be 5°C higher than that in the edge region, based on the approximately 0.1 nm / °C redshift coefficient of the InGaAsP material system, the center wavelength of the gain spectrum in the central region will redshift by 0.5 nm relative to the edge region, thus forming a spatially non-uniform gain spectrum distribution. This step aims to quantify the modulating effect of spatial inhomogeneity of the temperature field on the spectral characteristics of the chip, providing spatial data as a basis for subsequent analysis of the differentiated responses of multipath reflected light.

[0082] Step 2: Based on the reflected light interference information set, analyze the wavelength components and polarization state distribution of the reflected light injected back into the SLD chip from different spatial reflection points to obtain multipath reflection spectrum information;

[0083] In the multi-channel test optical path, the SLD output light is reflected at different spatial locations as it passes through multiple optical interfaces such as lenses, isolators, and fiber end faces. These reflected lights are then injected back into the active region of the SLD chip along the original path or at a specific angle. Because the optical path lengths corresponding to different reflection points are different, and the coating characteristics of the optical components they pass through vary, the reflected light returning to the chip exhibits significant differences in wavelength composition (spectral structure) and polarization state (TE / TM mode ratio). Multipath reflection spectral information can be obtained by tracing and analyzing the spectrum of each active reflection point to extract the specific wavelength component intensity distribution and polarization extinction ratio of the returned light. For example, reflected light from the fiber end face may have a wider spectral coverage due to Fresnel reflection, while reflected light passing through narrowband filters or specifically coated lens surfaces may only carry energy in a specific wavelength band, and the polarization state may rotate due to oblique incidence. By analyzing these characteristics, the system can distinguish interference sources from different physical paths and identify the specific spectral fingerprint carried by each reflected light path.

[0084] Step 3: Based on the regionalized gain spectrum change information and combined with the multipath reflection spectrum information, analyze the spatial difference of gain spectrum caused by non-uniform temperature distribution inside the chip and its interaction with different reflected light to obtain spectral perturbation information.

[0085] The generation of spectral perturbation information relies on matching and coupling analysis between the spatially non-uniform gain spectral distribution and the multipath reflection spectral characteristics obtained above. Specifically, when the wavelength component of the reflected light injected from a certain path coincides with or highly overlaps with the current gain spectral peak of a local high-temperature or low-temperature region of the chip, this local region will produce a strong selective amplification effect on the reflected light (i.e., external cavity feedback resonance). This interaction not only changes the overall output spectral shape of the chip, leading to perturbation phenomena such as multi-peaks, sidelobes, or spectral line broadening, but also causes random shifts in the spectral centroid due to gain competition between different regions. Through this refined spatial-spectral coupling modeling, it is possible to accurately locate which temperature region resonates with which reflected light path, thereby quantitatively calculating the amplitude, frequency shift, and waveform distortion of the spectral perturbation. For example, if the temperature in the right region of the chip is high, causing the gain peak to redshift to 1550.5nm, and at this time there happens to be a reflected light from the lens surface with a main wavelength of 1550.4nm, the matching of the two will cause the light intensity in this band to be abnormally amplified, forming an obvious spectral peak, which is recorded as a key spectral perturbation feature.

[0086] The method provided in this embodiment achieves a leap from single temperature compensation to spatial-spectral multidimensional coupled analysis. By introducing the synergistic processing of regionalized gain spectrum variation information and multipath reflection spectrum information, it not only reveals the differentiated response mechanism of SLD chips to external reflected light under non-uniform temperature fields, but also accurately captures the essence of spectral perturbations caused by local resonance. This modeling method based on spatial dimension subdivision effectively solves the problems of unclear interference source tracing and compensation strategy failure caused by the assumption of uniform temperature in traditional methods. It enables the generated spectral perturbation information to truly reflect the device behavior under complex operating conditions, providing solid data support for the subsequent generation of high-precision dynamic compensation test strategies, and significantly improving the accuracy and reliability of spectral data in full-temperature parameter testing.

[0087] Example 7

[0088] In another optional embodiment, the process of constructing power fluctuation correlation information further includes:

[0089] Step 1: Based on the spectral perturbation information, analyze the characteristics of optical field mode competition induced in the SLD chip resonant cavity by the wavelength reflected light selectively amplified by the chip temperature, and obtain the mode competition perturbation information.

[0090] The reflected light, selectively amplified by the chip temperature, can refer to the reverse-injected light whose wavelength components fall within the peak gain range of the SLD chip at the current temperature. Optical mode competition refers to the dynamic game between the master oscillation mode and parasitic modes excited by external reflected light within the SLD chip's resonant cavity, vying for limited carrier resources and gain medium. Mode competition perturbation information can be a dataset that quantifies the intensity, frequency, and stability of this competition.

[0091] Specifically, when reflected light from an external optical path is injected into the SLD chip in reverse, if its wavelength coincides with the gain spectrum center of a local region of the chip due to temperature adjustment, the reflected light will obtain an extremely high gain coefficient in the resonant cavity, forming one or more strong parasitic longitudinal modes. These parasitic modes, together with the original dominant mode, consume the number of inverted particles in the active region. For example, when the heat sink temperature rises from 25°C to 45°C, the gain spectrum center of the SLD chip redshifts by about 0.3 nm. If the wavelength of reflected light from a certain path is located at the gain peak after this redshift, the reflected light will be amplified to an order of magnitude comparable to the dominant mode, causing a drastic rearrangement of the photon density distribution in the cavity. The dominant mode power is suppressed, while the parasitic mode power surges. This dynamic process of ebb and flow constitutes mode competition. By monitoring the rate of change of the light intensity ratio and phase noise of each mode in real time, mode competition perturbation information characterizing the intensity of competition can be extracted. This information is closely coupled with the aforementioned spectral perturbation information. Spectral perturbation provides the incentive for competition (wavelength matching), while mode competition perturbation reveals the dynamic behavior of competition in the cavity.

[0092] Step 2: Based on the mode competition perturbation information, analyze the characteristics of the nonlinear change of the total output power of the SLD with temperature and reflected light conditions to obtain the power fluctuation correlation information;

[0093] The total output power of the SLD can be the integral value of the power of all optical modes coupled out from the chip end face. Nonlinear variation means that the fluctuation amplitude of the total power does not have a simple linear proportional relationship with the temperature change or the intensity of reflected light, but exhibits complex characteristics such as threshold effect, hysteresis loop or abrupt jump.

[0094] Specifically, due to mode competition, the total output power of the SLD no longer depends solely on the injection current and temperature setpoint, but is strongly modulated by the energy distribution efficiency of the intracavity modes. When mode competition disturbance information indicates intense competition, some energy is locked in higher-order transverse modes that cannot be effectively coupled to the output, or in parasitic longitudinal modes with high losses, leading to an unexpected decrease or high-frequency oscillation in the macroscopically observed total output power. For example, under a constant driving current of 200mA, as the temperature rises at a rate of 1℃ / min, if the mode competition disturbance information detects that the parasitic mode gain exceeds the dominant mode threshold at a certain moment, the total output power may experience a step drop of 5%-10% within milliseconds, and then slowly recover as the temperature continues to rise and the gain spectrum further mismatches, forming a typical nonlinear fluctuation curve. By analyzing the temporal evolution of mode competition disturbance information, combined with the current temperature change rate and reflected light intensity distribution, the amplitude, frequency, and phase characteristics of the total power fluctuation are fitted, thereby constructing power fluctuation correlation information. This information not only records the results of power fluctuations, but also includes the intrinsic mechanism parameters that cause the fluctuations, providing a direct basis for generating accurate dynamic compensation strategies.

[0095] This embodiment establishes a complete causal chain from external spectral perturbation to internal mode competition, and then to macroscopic power fluctuations. By introducing mode competition perturbation information as an intermediate variable, the abstract spectral perturbation is transformed into a specific intracavity dynamic process, making the analysis of the nonlinear characteristics of power fluctuations more accurate. The spectral perturbation information and the mode competition perturbation information work together. The former determines which wavelengths of reflected light will participate in the interference, while the latter quantifies the degree of resource competition caused by these interfering lights in the cavity. The two work together to finally derive power fluctuation correlation information that can accurately predict and describe the nonlinear changes in the total output power of the SLD with temperature and reflected light conditions. The clarification of this mechanism enables the test to distinguish between power changes caused by simple temperature drift and power anomalies caused by mode competition induced by reflected light. This lays a solid physical foundation for formulating targeted current fine-tuning and temperature compensation commands, effectively solving the problem of compensation failure caused by neglecting intracavity mode competition in existing methods.

[0096] Example 8

[0097] In one possible implementation, the method analyzes the temporal perturbation phase and obtains a set of coupled interference information, and further includes the following steps:

[0098] Step 1: Based on the power fluctuation correlation information, analyze the dynamic phase difference formed by the thermal hysteresis effect between the spectral perturbation triggered by temperature change and the power fluctuation caused thereby, resulting in the periodic coupling relationship between the peak values ​​of the two, and obtain the time-domain perturbation phase information.

[0099] Among these, spectral perturbation can be a physical phenomenon caused by changes in chip temperature leading to a shift in the center wavelength of the gain spectrum and a change in refractive index, which in turn selectively amplifies or suppresses specific wavelengths of reflected light injected in reverse. Thermal hysteresis can be a physical characteristic of SLD chips and their heat sinks during temperature regulation, where the change in the internal temperature field distribution lags behind the change in the external ambient temperature setpoint due to the presence of material heat capacity and thermal conductivity resistance.

[0100] Specifically, this step aims to extract the relative positional relationship between the spectral perturbation signal and the power fluctuation signal in the time dimension. Due to the thermal hysteresis effect, when the ambient temperature changes abruptly or linearly, the drift of the gain spectrum inside the chip (i.e., the trigger source of the spectral perturbation) and the fluctuation of the final manifest as the total output power (i.e., the result of the power fluctuation) do not occur synchronously, but rather there is a dynamic time delay. This time delay is manifested as a dynamic phase difference between the peak values ​​of the two in the frequency domain or time domain waveform. By acquiring the temperature change rate curve, the spectral center wavelength drift curve, and the output power fluctuation curve in real time, and using cross-correlation analysis or Hilbert transform algorithm, the time difference between the peak time of the spectral perturbation and the peak time of the power fluctuation is calculated and converted into a phase angle, thereby obtaining the phase information of the time domain perturbation. For example, when the temperature chamber heats up at a rate of 2°C / min, the temperature of the active area of ​​the chip may lag behind the change of the ambient temperature by about 15 seconds, causing the peak value of the gain spectrum to appear before the peak value of the power fluctuation, forming a fixed phase offset between the two.

[0101] Step 2: Based on the temporal perturbation phase information and combined with the reflected light interference information set, analyze the evolution process of the amplitude and asymmetry of the periodic coupling relationship being reconstructed in real time when the intensity and path of the reflected light change with the driving conditions, and obtain the optical path reflection-temperature coupling interference information set.

[0102] The periodic coupling relationship can be a repetitive interference waveform formed by the phase difference between spectral perturbation and power fluctuation under specific temperature cycling and driving conditions. The amplitude can be the oscillation intensity of the interference waveform, and the asymmetry can refer to the asymmetric characteristics of the interference waveform in terms of the slope, duration, or shape of the rising and falling edges.

[0103] Specifically, the core of this step lies in revealing the mechanism by which dynamic changes in the external optical path reshape the internal thermal-optical coupling interference waveform. The reflected light is not static; as the SLD driving current increases or the modulation state switches, the spot shape of the SLD output light broadens or shifts, causing changes in the light intensity distribution on external optical path components (such as lens surfaces and fiber end faces), thereby activating new reflection points or altering the incident angle of existing reflection points. This real-time change in the intensity and path of the reflected light directly alters the light energy and wavelength composition distribution injected into the SLD chip. When these dynamically changing reflected lights interact with thermally induced spectral perturbations with specific temporal phase differences, the originally stable periodic coupling relationship is broken and reconstructed in real time. Specifically, the amplitude of the interference waveform increases significantly with the increase in reflected light intensity, while the waveform symmetry is distorted due to the multiple interference effects of reflected light from different paths, exhibiting a complex asymmetric shape. By performing multi-dimensional mapping operations on the temporal perturbation phase information and the real-time updated reflected light interference information set, the evolution trajectory of the interference waveform under different driving conditions is simulated, thereby obtaining an optical path reflection-temperature coupling interference information set containing amplitude variation patterns and asymmetric characteristics. For example, when the driving current jumps from 100mA to 200mA, the light spot enlarges and activates the high reflection point at the lens edge, causing a sudden increase in the intensity of the reverse injected light. At this time, the observed power fluctuation waveform not only doubles in amplitude, but its rising edge also becomes steeper, exhibiting obvious asymmetric peak characteristics.

[0104] Based on the above analysis, this application extends the static phase difference model into a dynamic waveform reconstruction model, so that the obtained optical path reflection-temperature coupling interference information set can truly reflect the full picture of interference under complex working conditions. This information set not only includes the intensity of interference, but also accurately describes the morphological characteristics of interference evolution over time, providing a complete data foundation for generating high-precision dynamic compensation strategies and ensuring that compensation commands can accurately offset cooperative interference with asymmetric and time-varying characteristics.

[0105] This embodiment achieves a leap from single-factor analysis to multi-dimensional spatiotemporal coupling modeling. First, by utilizing the principle of thermal hysteresis, the temporal misalignment between spectral perturbations and power fluctuations is accurately captured, generating temporal perturbation phase information that characterizes the timing of interference occurrence. Based on this, a reflected light interference information set is further introduced as a dynamic variable to deeply analyze how changes in external optical path conditions reshape the amplitude and asymmetry of the interference waveform in real time. The temporal perturbation phase information provides a time coordinate for interference prediction, while the reflected light interference information set provides modulation parameters in spatial and energy dimensions. Together, they construct an optical path reflection-temperature coupled interference information set that can describe the entire dynamic evolution of interference. This approach not only reveals the deep physical mechanism of interference generation but, more importantly, endows the test system with predictive power for the evolution trend of the interference waveform. This allows for the generation of targeted current fine-tuning and temperature compensation commands in advance, based on the reconstructed amplitude and asymmetry characteristics, before the interference peak arrives. This fundamentally eliminates the shortcomings of traditional static compensation methods in dealing with dynamic nonlinear interference, significantly improving the accuracy and robustness of multi-channel full-temperature parameter testing.

[0106] Example 9

[0107] In one embodiment, a dynamic compensation test strategy is generated and test logs are output. The method further includes the following steps:

[0108] Step 1: Based on the optical path reflection-temperature coupling interference information set, analyze the mapping law between real-time amplitude and asymmetry characteristics and the current test conditions to obtain the compensation parameter mapping relationship;

[0109] The optical path reflection-temperature coupling interference information set can be the dynamic model data constructed by quantifying the synergistic effect of reflected light reverse injection and chip temperature changes. It includes key characteristic indicators such as interference amplitude, phase difference, and waveform asymmetry that evolve over time. The current test condition refers to the specific operating state of the test system at a given moment, mainly including real-time ambient temperature, estimated SLD chip junction temperature, drive current magnitude, and modulation state. The compensation parameter mapping relationship can refer to establishing a functional correspondence rule or lookup table between interference characteristics and the required compensation amount. Specifically, through training with historical test data or derivation of physical mechanisms, the analysis examines the proportion of current increment required to offset power drops when the interference amplitude increases; simultaneously, it analyzes the temperature adjustment rate or bias amount required to smooth spectral disturbances when the interference waveform exhibits specific asymmetry (e.g., steep rising edge, gentle falling edge). For example, when the amplitude of coupled interference in a certain channel is detected to be A=0.5mW and the asymmetry coefficient is S=0.3, the mapping relationship outputs a corresponding current compensation coefficient k1=0.02mA / mW and a temperature compensation slope k2=0.1℃ / min. By establishing this mapping rule, the abstract interference model can be transformed into specific control parameters, providing a mathematical basis for the subsequent generation of precise instructions. This step aims to solve the nonlinear matching problem between interference characteristics and control execution quantities, ensuring the targeted nature of the compensation strategy.

[0110] Step 2: Based on the compensation parameter mapping relationship, and according to the real-time temperature and drive current parameters during the test, dynamically generate current fine-tuning commands and temperature compensation commands to offset periodic coupling interference, as a dynamic compensation test strategy.

[0111] The real-time temperature and drive current parameters are physical quantities acquired in real time by the data acquisition module at the instant of the test. The current fine-tuning command refers to a small adjustment superimposed on the basic drive current, used for rapid response to power fluctuations; the temperature compensation command refers to a correction to the temperature control device's setpoint, used to suppress spectral drift caused by thermal hysteresis. Specifically, the real-time acquired temperature and current values ​​are substituted into the compensation parameter mapping relationship obtained above to calculate the current predicted interference value in real time, and then a control command that can offset this predicted value is solved in reverse. For example, if real-time monitoring shows that the current temperature is rising and accompanied by strong reflected light injection, causing the predicted power to decrease by 2%, a +1.5mA current fine-tuning command and a -0.2℃ temperature setpoint reduction command are immediately generated based on the mapping relationship. These commands constitute the core of the dynamic compensation test strategy; they are not fixed preset values, but rather dynamic sequences updated in milliseconds as the test conditions change. Through the dual coordinated adjustment of current and temperature, the periodic interference caused by the thermal-optical coupling effect can be effectively offset, stabilizing the SLD's output on the true characteristic curve.

[0112] Step 3: Execute the dynamic compensation test strategy, and synchronously record the original parameters, compensation instructions and test results after compensation for each test channel during the execution process, and output the multi-channel full-temperature parameter test log.

[0113] The execution process involves the control system sending current fine-tuning commands to the multi-channel drive source and temperature compensation commands to the high and low temperature test chamber, thereby changing the operating state of the SLD. The original parameters can be the measured optical power, spectral data, and ambient temperature and humidity before compensation; the compensation commands can be the actual current and temperature adjustment values; and the post-compensation test results can be the final performance parameters re-acquired and corrected by the algorithm after the compensation action. The multi-channel full-temperature parameter test log is a structured data file used to completely trace the entire test process. Specifically, while performing compensation, the log records the original reading-compensation action-final result triplet data for each test channel in parallel, indexed by timestamps. For example, a single data entry in the log might contain: time t=10:05:23, channel ID=CH03, original power=12.5mW, applied current compensation=+0.8mA, power after compensation=13.1mW, and associated interference signature=Type-B-Phase-Lag. This method not only achieves real-time elimination of interference but also preserves a complete record of the decision-making process. This step ensures the traceability and analyzability of the test data, providing detailed data support for subsequent optimization of the compensation model, while also meeting the stringent requirements for data integrity in batch testing.

[0114] The method provided in this embodiment realizes a fully closed-loop control process from interference feature analysis to compensation strategy generation and execution recording. By analyzing the real-time amplitude and asymmetry characteristics based on the optical path reflection-temperature coupling interference information set, a precise mapping relationship of compensation parameters is established, solving the problem that existing static compensation cannot cope with dynamic nonlinear interference. On this basis, by using this mapping relationship in conjunction with the dynamic generation of current fine-tuning and temperature compensation commands under real-time operating conditions, active cancellation of periodic coupling interference is achieved, significantly improving the accuracy and stability of full-temperature testing. At the same time, by synchronously recording the original parameters, compensation commands, and post-compensation results to generate test logs, a complete test data chain is constructed, which not only ensures the reliability of single test results, but also provides core data assets for self-learning iteration and quality backtracking.

[0115] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

[0116] Figure 3 A schematic diagram of a multi-channel full-temperature parameter testing system for batch testing of SLDs provided in an embodiment of this application is shown below. Figure 3 As shown, a multi-channel full-temperature parameter testing system 300 for batch testing of SLDs in this embodiment includes: a reflected light coupling evolution module 301, a light reflection temperature coupling module 302, and a dynamic compensation module 303.

[0117] The reflected light coupling evolution module 301 is used to acquire a multi-channel test information set, and based on the multi-channel test information set, analyze the reflected light coupling evolution process of the SLD output light on the surface of the external optical path element in each test channel to obtain a reflected light interference information set; the light reflection temperature coupling module 302 is used to acquire temperature parameter information, and based on the temperature parameter information, combined with the reflected light interference information set, analyze the synergistic interference characteristics of the power fluctuation effect and spectral perturbation effect caused by the back injection of reflected light into the SLD chip during the temperature adjustment process to obtain an optical path reflection-temperature coupling interference information set; the dynamic compensation module 303 is used to generate a dynamic compensation test strategy according to the optical path reflection-temperature coupling interference information set, and output a multi-channel full-temperature parameter test log.

[0118] Optionally, when the reflected light coupling evolution module 301 analyzes the reflected light coupling evolution process of the SLD output light on the surface of the external optical path element in each test channel based on the multi-channel test information set to obtain the reflected light interference information set, it is specifically used for: the multi-channel test information set including SLD driving information and optical path element information; based on the optical path element information, analyzing the static reflection points and reflectivity distribution formed by the differences in coating characteristics and incident angles on the surfaces of different optical elements in each test channel to obtain an initial reflection spectrum; based on the SLD driving information, combined with the initial reflection spectrum, analyzing the characteristic information of the changes in light intensity and spot shape of the SLD output light under different driving currents and modulation states acting on the initial reflection spectrum to obtain the reflected light interference information set.

[0119] Optionally, the reflected light coupling evolution module 301, during the construction of the initial reflection spectrum, is specifically used to: analyze the variation law of coating reflectivity under different incident angles based on the optical path element information, and the influence of the surface curvature of the optical element on the incident angle distribution, to obtain reflectivity-incident angle correlation information; based on the reflectivity-incident angle correlation information, analyze the actual incident angle range of the SLD output light on the surface of each optical element and the corresponding reflectivity distribution, to obtain the static reflection points and reflectivity distribution of all optical surfaces in each test channel, as the initial reflection spectrum.

[0120] Optionally, when the reflected light coupling evolution module 301 analyzes the characteristics of the changes in the intensity and spot shape of the SLD output light acting on the initial reflection spectrum under different driving currents and modulation states based on the SLD driving information and combined with the initial reflection spectrum to obtain the reflected light interference information set, it is specifically used to: analyze the characteristics of the increase in the intensity of the SLD output light leading to a proportional increase in the actual reflected light power at each reflection point during the increasing driving current stage, based on the SLD driving information, to obtain reflected light intensity dynamic response information; analyze the characteristics of the widening of the divergence angle of the SLD chip's thermally induced beam, leading to an expansion of the output spot shape, which activates previously unilluminated reflection points and changes in the effective incident angle of the original reflection points, based on the reflected light coupling information, to obtain spot-reflection coupling information; and analyze the characteristics of the real-time evolution of the reflected light intensity and reverse injection path in each test channel with driving conditions, based on the spot-reflection coupling information, to obtain the reflected light interference information set.

[0121] Optionally, when the optical reflection temperature coupling module 302 analyzes the synergistic interference characteristics of power fluctuation and spectral perturbation effects caused by the back-injection of reflected light into the SLD chip during temperature adjustment based on the temperature parameter information and the reflected light interference information set, and obtains the optical path reflection-temperature coupling interference information set, the following specific uses are employed: the temperature parameter information is the temperature parameter information of multiple channels of the SLD during batch testing; based on the temperature parameter information and the reflected light interference information set, the module analyzes the characteristics of selective amplification or suppression of the back-injected wavelength reflected light caused by changes in the gain spectrum and refractive index due to chip temperature changes, thereby obtaining spectral perturbation information; based on the spectral perturbation information, the module analyzes the characteristics of unexpected fluctuations in the total output power of the SLD caused by the selective amplification process, obtaining power fluctuation correlation information; based on the power fluctuation correlation information, the module analyzes the interference characteristics of the temporal coupling evolution of spectral perturbation and power fluctuation, and their variation with reflected light, to obtain the optical path reflection-temperature coupling interference information set.

[0122] Optionally, the light reflection temperature coupling module 302, during the construction of the spectral perturbation information, is specifically used for: analyzing the influence of the temperature uniformity change of the SLD chip's heat sink on the change of the center wavelength of the gain spectrum in different local regions of the chip based on the temperature parameter information, to obtain regionalized gain spectrum change information; analyzing the wavelength components and polarization state distribution carried by the reflected light injected back into the SLD chip from different spatial reflection points based on the reflected light interference information set, to obtain multipath reflection spectral information; and analyzing the spatial differences in the gain spectrum formed by the non-uniform temperature distribution inside the chip and the interaction between them and the reflected light from different sources based on the regionalized gain spectrum change information and the multipath reflection spectral information, to obtain the spectral perturbation information.

[0123] Optionally, the light reflection temperature coupling module 302, during the construction of the power fluctuation correlation information, is specifically used to: analyze the characteristics of light field mode competition induced in the SLD chip resonant cavity by the wavelength reflected light selectively amplified by the chip temperature based on the spectral perturbation information, and obtain mode competition perturbation information; and analyze the characteristics of the nonlinear change of the total output power of the SLD with temperature and reflected light conditions based on the mode competition perturbation information, and obtain the power fluctuation correlation information.

[0124] Optionally, when the optical reflection temperature coupling module 302 analyzes the temporal coupling evolution of spectral perturbations and power fluctuations based on the power fluctuation correlation information and the interference characteristics that change with reflected light to obtain the optical path reflection-temperature coupling interference information set, it is specifically used to: analyze the periodic coupling relationship between the spectral perturbations triggered by temperature changes and the power fluctuations caused by them due to the thermal hysteresis effect, resulting in a dynamic phase difference between the peak values ​​of the two, based on the power fluctuation correlation information, to obtain time-domain perturbation phase information; and analyze the evolution process of the amplitude and asymmetry of the periodic coupling relationship being reconstructed in real time when the intensity and path of the reflected light change with the driving conditions, based on the time-domain perturbation phase information and the reflected light interference information set, to obtain the optical path reflection-temperature coupling interference information set.

[0125] Optionally, when the dynamic compensation module 303 generates a dynamic compensation test strategy based on the optical path reflection-temperature coupling interference information set and outputs a multi-channel full-temperature parameter test log, it is specifically used to: analyze the mapping law between real-time amplitude and asymmetry characteristics and the current test condition based on the optical path reflection-temperature coupling interference information set, and obtain the compensation parameter mapping relationship; based on the compensation parameter mapping relationship, dynamically generate current fine-tuning instructions and temperature compensation instructions to offset periodic coupling interference according to the real-time temperature and driving current parameters during the test process, as the dynamic compensation test strategy; execute the dynamic compensation test strategy, and synchronously record the original parameters, compensation instructions and compensated test results of each test channel during the execution process, and output the multi-channel full-temperature parameter test log.

[0126] The system in this embodiment can be used to execute the methods of any of the above embodiments, and its implementation principle and technical effect are similar, so they will not be described again here.

Claims

1. A multi-channel full-temperature parameter testing method for batch testing of SLDs, characterized in that, include: A multi-channel test information set is obtained. Based on the multi-channel test information set, the evolution process of reflected light coupling of SLD output light on the surface of external optical path components in each test channel is analyzed to obtain a reflected light interference information set. Acquire temperature parameter information, which is the temperature parameter information of multiple channels of SLD in batch detection; based on the temperature parameter information, combined with the reflected light interference information set, analyze the characteristics of selective amplification or suppression of the wavelength reflected light injected in reverse due to changes in the gain spectrum and refractive index caused by chip temperature changes, and obtain spectral perturbation information. Based on the spectral perturbation information, the characteristics of unexpected fluctuations in the total output power of the SLD caused by the selective amplification process are analyzed to obtain power fluctuation correlation information. Based on the power fluctuation correlation information, the characteristics of a dynamic phase difference formed between the spectral perturbation triggered by temperature changes and the power fluctuations caused thereby, resulting in a periodic coupling relationship between their peak values, are analyzed to obtain time-domain perturbation phase information. Based on the time-domain perturbation phase information, combined with the reflected light interference information set, the evolution process of the amplitude and asymmetry of the periodic coupling relationship being reconstructed in real time when the intensity and path of the reflected light change with the driving conditions is analyzed to obtain the optical path reflection-temperature coupling interference information set. Based on the optical path reflection-temperature coupling interference information set, the mapping law between the real-time amplitude and asymmetry characteristics of the periodic coupling relationship and the current test conditions is analyzed to obtain the compensation parameter mapping relationship; based on the compensation parameter mapping relationship, according to the real-time temperature and driving current parameters during the test process, current fine-tuning commands and temperature compensation commands for offsetting periodic coupling interference are dynamically generated as a dynamic compensation test strategy. The dynamic compensation test strategy is executed, and the original parameters, compensation instructions and test results after compensation of each test channel are recorded synchronously during the execution process. The multi-channel full-temperature parameter test log is then output.

2. The method according to claim 1, characterized in that, Based on the multi-channel test information set, the evolution process of reflected light coupling on the surface of external optical path components of the SLD output light in each test channel is analyzed to obtain a reflected light interference information set, including: The multi-channel test information set includes SLD driver information and optical path component information; Based on the optical path element information, the static reflection points and reflectivity distribution formed on the surfaces of different optical elements in each test channel due to differences in coating characteristics and incident angle are analyzed to obtain the initial reflection spectrum. Based on the SLD driving information and combined with the initial reflection spectrum, the characteristic information of the changes in light intensity and spot shape of the SLD output light under different driving currents and modulation states on the initial reflection spectrum is analyzed to obtain the reflected light interference information set.

3. The method according to claim 2, characterized in that, The process of constructing the initial reflectance spectrum includes: Based on the optical path element information, the variation law of coating reflectivity under different incident angles is analyzed, as well as the influence of optical element surface curvature on incident angle distribution, to obtain reflectivity-incident angle correlation information; Based on the reflectivity-incident angle correlation information, the actual incident angle range and corresponding reflectivity distribution of the SLD output light on the surface of each optical element are analyzed to obtain the static reflection points and reflectivity distribution of all optical surfaces in each test channel, which serve as the initial reflection spectrum.

4. The method according to claim 2, characterized in that, Based on the SLD driving information and combined with the initial reflection spectrum, the characteristic information of the influence of SLD output light intensity and spot morphology changes on the initial reflection spectrum under different driving currents and modulation states is analyzed to obtain the reflected light interference information set, including: Based on the SLD driving information, the characteristics of the SLD output light intensity increase leading to a proportional increase in the actual reflected light power at each reflection point are analyzed during the driving current increase stage, and dynamic response information of reflected light intensity is obtained. Based on the dynamic response information of the reflected light intensity, the characteristics of the expansion of the output light spot shape caused by the broadening of the divergence angle of the SLD chip thermally induced beam are analyzed, which activates the originally unilluminated reflection points and changes the effective incident angle of the original reflection points, thus obtaining the light spot-reflection coupling information. Based on the light spot-reflection coupling information, the characteristic information of the real-time evolution of reflected light intensity and reverse injection path in each test channel with driving conditions is analyzed to obtain the reflected light interference information set.

5. The method according to claim 4, characterized in that, Based on the temperature parameter information and combined with the reflected light interference information set, the synergistic interference characteristics of power fluctuation and spectral perturbation effects caused by the back injection of reflected light into the SLD chip during temperature regulation are analyzed to obtain the optical path reflection-temperature coupling interference information set, including: The temperature parameter information refers to the multi-channel temperature parameter information of the SLD during batch testing. Based on the temperature parameter information and the reflected light interference information set, the characteristics of selective amplification or suppression of the wavelength reflected light injected in the reverse are analyzed due to the change in gain spectrum and refractive index caused by the chip temperature change, thereby obtaining spectral perturbation information. Based on the spectral perturbation information, the characteristics of unexpected fluctuations in the total output power of the SLD caused by the selective amplification process are analyzed to obtain power fluctuation correlation information. Based on the power fluctuation correlation information, the interference characteristics of the temporal coupling evolution of spectral perturbation and power fluctuation and their variation with reflected light are analyzed to obtain the optical path reflection-temperature coupling interference information set.

6. The method according to claim 5, characterized in that, The process of constructing the spectral perturbation information includes: Based on the temperature parameter information, the influence of the temperature uniformity change of the SLD chip heat sink on the change of the center wavelength of the gain spectrum in different local areas of the chip is analyzed, and the regionalized gain spectrum change information is obtained. Based on the aforementioned set of reflected light interference information, the wavelength components and polarization state distribution of reflected light injected into the SLD chip from different spatial reflection points are analyzed to obtain multipath reflection spectrum information. Based on the regionalized gain spectrum variation information and combined with the multipath reflection spectrum information, the spatial difference in gain spectrum caused by non-uniform temperature distribution inside the chip and its interaction with different reflected light are analyzed to obtain the spectral perturbation information.

7. The method according to claim 5, characterized in that, The process of constructing the power fluctuation correlation information includes: Based on the spectral perturbation information, the characteristics of optical field mode competition induced in the SLD chip resonant cavity by the wavelength reflected light selectively amplified by the chip temperature are analyzed to obtain mode competition perturbation information. Based on the mode competition disturbance information, the characteristics of the nonlinear change of the total output power of the SLD with temperature and reflected light conditions are analyzed to obtain the power fluctuation correlation information.

8. The method according to claim 5, characterized in that, Based on the power fluctuation correlation information, the interference characteristics of the temporal coupling evolution of spectral perturbations and power fluctuations, and their variation with reflected light, are analyzed to obtain the optical path reflection-temperature coupling interference information set, including: Based on the power fluctuation correlation information, the dynamic phase difference formed by the thermal hysteresis effect between the spectral perturbation triggered by temperature change and the power fluctuation caused thereby is analyzed, resulting in the periodic coupling relationship between the peak values ​​of the two, and the time-domain perturbation phase information is obtained. Based on the temporal perturbation phase information and combined with the reflected light interference information set, the evolution process of the amplitude and asymmetry of the periodic coupling relationship being reconstructed in real time when the intensity and path of the reflected light change with the driving conditions is analyzed, and the optical path reflection-temperature coupling interference information set is obtained.

9. The method according to claim 8, characterized in that, The process of generating a dynamic compensation test strategy based on the optical path reflection-temperature coupling interference information set and outputting a multi-channel full-temperature parameter test log includes: Based on the optical path reflection-temperature coupling interference information set, the mapping law between real-time amplitude and asymmetric characteristics and the current test conditions is analyzed to obtain the compensation parameter mapping relationship; Based on the aforementioned compensation parameter mapping relationship, and according to the real-time temperature and drive current parameters during the test process, current fine-tuning commands and temperature compensation commands are dynamically generated to counteract periodic coupling interference, serving as the dynamic compensation test strategy. The dynamic compensation test strategy is executed, and the original parameters, compensation instructions and test results after compensation of each test channel are recorded synchronously during the execution process. The multi-channel full-temperature parameter test log is then output.

10. A multi-channel full-temperature parameter testing system for batch testing of SLDs, characterized in that, The method applied to any one of claims 1-9 includes: The reflected light coupling evolution module is used to acquire a multi-channel test information set. Based on the multi-channel test information set, the reflected light coupling evolution process of the SLD output light on the surface of the external optical path element in each test channel is analyzed to obtain a reflected light interference information set. The optical reflection temperature coupling module is used to acquire temperature parameter information, which is the temperature parameter information of multiple channels of the SLD during batch testing. Based on the temperature parameter information and the reflected light interference information set, the module analyzes the characteristics of selective amplification or suppression of the back-injected wavelength reflected light caused by changes in the gain spectrum and refractive index due to chip temperature changes, thus obtaining spectral perturbation information. Based on the spectral perturbation information, the module analyzes the characteristics of unexpected fluctuations in the total output power of the SLD caused by the selective amplification process, thus obtaining power fluctuation correlation information. Based on the power fluctuation correlation information, the module analyzes the characteristics of a dynamic phase difference formed between the spectral perturbation triggered by temperature changes and the power fluctuations caused by it, resulting in a periodic coupling relationship between their peak values, thus obtaining time-domain perturbation phase information. Based on the time-domain perturbation phase information and the reflected light interference information set, the module analyzes the evolution process of the amplitude and asymmetry of the periodic coupling relationship being reconstructed in real time when the intensity and path of the reflected light change with the driving conditions, thus obtaining the optical path reflection-temperature coupling interference information set. The dynamic compensation module is used to analyze the mapping relationship between the real-time amplitude and asymmetry characteristics of the periodic coupling relationship and the current test conditions based on the optical path reflection-temperature coupling interference information set, and obtain the compensation parameter mapping relationship; based on the compensation parameter mapping relationship, according to the real-time temperature and drive current parameters during the test process, it dynamically generates current fine-tuning commands and temperature compensation commands to cancel the periodic coupling interference, as a dynamic compensation test strategy; it executes the dynamic compensation test strategy, and synchronously records the original parameters, compensation commands and compensated test results of each test channel during the execution process, and outputs a multi-channel full-temperature parameter test log.

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