A multifunctional integrated circuit chip intelligent testing machine

Abstract

The application discloses a kind of multifunctional integrated circuit chip intelligent testing machines, belong to chip test field, it includes: testing machine, inside horizontal fixed base;Mounting plate, fixed in the outside one side of the testing machine;Feeding mechanism, assembled in the upper end surface of the mounting plate;Sorting manipulator, vertically set in the testing machine;Chip transfer unit, installed in the testing machine and located the upper end surface of base;Testing mechanism, vertically set in the upper end surface of the base and located sorting manipulator far from the side of feeding mechanism;Through hole, set in the base and located the immediately below of testing mechanism, the testing machine is located below through hole and is provided with preset temperature cavity unit;The application can realize the rapid test of chip under different environmental temperature, greatly shorten the test cycle of chip, and can test the stability of chip under sharp temperature change, realize multifunctional test.

Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, specifically a multifunctional intelligent integrated circuit chip testing machine. Background Technology

[0002] During the research, development, production, and reliability verification of integrated circuit chips, functional testing, performance evaluation, and aging screening are required under different ambient temperatures to expose potential defects in the chips under extreme operating conditions. Traditional technologies use heaters and refrigerators to slowly switch the test chamber from low to high or high to low temperatures. After completing the low-temperature test, the chamber must be allowed to heat up to the high temperature (and vice versa), with each heating / cooling cycle taking several minutes to tens of minutes, resulting in extremely low testing efficiency. Some equipment uses separate high-temperature and low-temperature chambers, with a robotic arm removing the chip from one chamber and placing it into another. While this method avoids the waiting time for the chambers to heat up or cool down, the robotic arm's long travel distance and slow switching speed make it difficult to achieve rapid switching between high and low temperatures, and thus cannot test the chip's stability under drastic temperature changes. Summary of the Invention

[0003] To achieve the above objectives, the present invention provides the following technical solution: a multifunctional integrated circuit chip intelligent testing machine, comprising: a testing platform with a base horizontally fixed inside; a mounting plate fixed to one side of the testing platform; a feeding mechanism assembled on the upper surface of the mounting plate, with its feeding end positioned close to the testing platform; a sorting robot fixed to the upper surface of the base near the feeding mechanism; a chip transfer unit mounted on the upper surface of the base, with two horizontally arranged slide rails on the base; and a testing mechanism vertically arranged on the upper surface of the base and located near the sorting robot. On the side away from the feeding mechanism; a through hole is formed on the base and located directly below the testing mechanism. A preset temperature cavity unit is provided below the through hole in the testing machine. The preset temperature cavity unit is sealed with the testing mechanism through the chip transfer unit to form a temperature testing chamber. The preset temperature cavity unit includes: a support base, which is fixed in the testing machine. A turntable is rotatably provided on the upper end surface of the support base; and four heat preservation cavities, which are symmetrically distributed in a circle. The four heat preservation cavities are arranged clockwise as a first high temperature cavity, a first low temperature cavity, a second high temperature cavity, and a second low temperature cavity.

[0004] Preferably, the feeding mechanism includes: a track groove, horizontally formed on the mounting plate, with a strip rail slidably connected in the track groove; a carrier plate, fixed to one end of the strip rail; a propulsion cylinder, horizontally fixed on the mounting plate, with one end of the propulsion cylinder connected to the carrier plate; and a limiting rod, fixed on the mounting plate and arranged parallel to the propulsion cylinder, with a limiting plate fixed to the other end of the strip rail.

[0005] Preferably, the carrier plate slides along the track groove with the bar rail to a position directly below the sorting robot; the limiting rod is internally threaded with an adjusting rod; and a vision sensor is provided on one side of the track groove on the mounting plate.

[0006] Preferably, the chip transfer unit includes: a positioning plate with a test template mounted at the center of its upper surface, the test template having a chip test slot, the positioning plate being slidably connected to the slide rail, and a fine-tuning cylinder fixed on the base, one end of the fine-tuning cylinder being connected to the positioning plate; two guide shafts arranged in parallel, each fixed to the positioning plate and located on both sides of the test template; two chip clamping plates arranged symmetrically, each chip clamping plate being slidably connected to the guide shaft; and two connecting cylinders, horizontally fixed to the positioning plate, one end of each connecting cylinder being connected to the chip clamping plate.

[0007] Preferably, the preset temperature chamber unit further includes: a central shaft, vertically rotatably connected to the middle of the support base, the upper end of the central shaft being fixed to the turntable, and a transmission gear being fixed to the lower end of the central shaft; a rack, slidably installed below the support base, the rack meshing with the transmission gear; and an adjusting cylinder, fixed inside the testing machine, one end of the adjusting cylinder being connected to the rack.

[0008] Preferably, both the first high-temperature cavity and the second high-temperature cavity are equipped with electric heating modules; and both the first low-temperature cavity and the second low-temperature cavity are equipped with semiconductor cooling modules; infrared heating tubes are also distributed circumferentially inside the first high-temperature cavity; and a liquid nitrogen ejector is connected to the outside of the first low-temperature cavity.

[0009] Preferably, a sealing layer is provided on the lower end face of the base, and a heat insulation layer is rotatably provided below the sealing layer. The heat insulation layer has multiple through holes, and the upper end of each heat insulation cavity is in sealed contact with the inner wall of the through hole. A sealing hole with the same center as the through hole is provided in the sealing layer, and the sealing hole is located directly below the testing mechanism.

[0010] Preferably, the testing mechanism includes: a frame with a lifting plate vertically slidably mounted on one side; a main board vertically fixed to the lifting plate, with a connecting cylinder vertically fixed to the main board; a heat insulation sleeve coaxially fixed below the connecting cylinder, with a guide cylinder sealingly connected between the heat insulation sleeve and the connecting cylinder; an inner partition sleeve coaxially fixed inside the heat insulation sleeve, with an inner guide cavity horizontally arranged inside the guide cylinder, the inner guide cavity having an L-shaped structure, and one end of the inner guide cavity being sealed and connected to the inner partition sleeve; a rotating shaft horizontally rotatably connected inside the guide cylinder, one end of the rotating shaft extending into the inner guide cavity, and the other end of the shaft having a blade fixed thereon; and air inlets circumferentially distributed inside the guide cylinder and located around the inner guide cavity.

[0011] Preferably, each chip clamp in the chip transfer unit has a circumferentially distributed group of inner holes and a group of outer holes. The group of inner holes is located in the inner spacer, and the group of outer holes is located between the inner spacer and the heat insulation sleeve.

[0012] Preferably, a heating cylinder is coaxially mounted on the main board above the connecting cylinder. A heat-conducting column is vertically rotatably connected inside the heating cylinder, with its lower end extending into the connecting cylinder. A heat-conducting probe is slidably connected coaxially inside the heat-conducting column, with its lower end extending into the inner spacer. A ring is slidably connected inside the connecting cylinder, with the heat-conducting probe slidably connected to the ring coaxially. A guide pin is vertically fixed on the outer wall of the ring, and a sliding groove is axially provided on the outer wall of the connecting cylinder. An adjusting ring is rotatably connected to the main board, with a straight groove on it, and the guide pin is slidably connected to the straight groove. A propulsion cylinder is inclined outward on the main board, with one end connected to the adjusting ring. A drive motor is fixed on the main board. Multiple floats are rolled at the lower end of the heat-conducting probe.

[0013] Compared with the prior art, the beneficial effects of the present invention are: In this invention, integrated circuit chips can be automatically fed by a feeding mechanism, and a sorting robot sorts the fed chips into a chip transfer unit, which then moves them to the testing station for automated testing. The testing machine has a pre-constructed temperature chamber unit with two high-temperature and two low-temperature testing chambers. During testing, the corresponding insulation chambers and the testing mechanism can seal together to form the temperature testing chambers, enabling rapid testing of the chips under different ambient temperatures and significantly shortening the chip testing cycle. The four circumferentially distributed high and low temperature testing chambers have a fast switching speed, and adjacent insulation chambers can switch between different chip temperatures as the turntable deflects, used to test the chip's stability under rapid temperature changes, thus achieving temperature shock testing. Additionally, the testing mechanism is equipped with thermal probes that can contact the chip surface to raise the chip's temperature, achieving a hot spot effect, thereby simulating the chip's additional temperature rise under extreme temperatures and high loads, enabling multi-functional chip testing. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the feeding mechanism in this invention; Figure 3 for Figure 2 Enlarged schematic diagram of the structure at point A in the middle; Figure 4 This is a schematic diagram of the pre-set temperature cavity unit in this invention; Figure 5This is a schematic diagram of the structure of the sealing layer and the heat insulation layer in this invention; Figure 6 This is a schematic diagram of the testing mechanism in this invention; Figure 7 This is a schematic diagram of the internal structure of the heat insulation sleeve in this invention; In the diagram: 1. Testing machine; 11. Base; 12. Mounting plate; 13. Sorting robot; 14. Through hole; 2. Feeding mechanism; 21. Strip rail; 22. Carrier plate; 23. Push cylinder; 24. Limiting plate; 25. Vision sensor; 3. Chip transfer unit; 31. Slide rail; 32. Positioning plate; 33. Test template; 34. Chip clamping plate; 35. Fine adjustment cylinder; 36. Guide shaft; 37. Connecting cylinder; 38. Inner hole assembly; 39. Outer hole assembly; 4. Testing mechanism; 41. Frame; 42. Lifting plate; 43. Main board; 44. Connecting cylinder; 45. Insulation sleeve; 46. Guide cylinder; 47. Inner partition sleeve; 48. Inner guide cavity; 49. Blade; 410. Air inlet; 5. Preset temperature chamber unit; 51. Support base; 52. Turntable; 53. First high temperature chamber; 54. First low temperature chamber; 55. Second high temperature chamber; 56. Second low temperature chamber; 57. Rack; 58. Adjusting cylinder; 59. Sealing layer; 510. Insulation layer; 511. Through hole; 6. Heating cylinder; 61. Heat-conducting column; 62. Heat-conducting probe; 63. Ring sleeve; 64. Adjusting ring; 65. Fixing cylinder. Detailed Implementation

[0015] Please see Figures 1-7In this embodiment of the invention, a multifunctional integrated circuit chip intelligent testing machine includes: a testing platform 1, with a base 11 horizontally fixed inside; a mounting plate 12 fixed to one side of the testing platform 1; a feeding mechanism 2, assembled on the upper surface of the mounting plate 12, with its feeding end positioned close to the testing platform 1, and a tray on one side of the feeding mechanism 2 for transferring the chips to be tested one by one; a sorting robot 13, vertically disposed inside the testing platform 1, fixed to the upper surface of the base 11 near the feeding mechanism 2; and a chip transfer unit 3, installed inside the testing platform 1 and located on the upper surface of the base 11, with two horizontally arranged slide rails 31 on the base 11, and the chip transfer unit 3 sliding with the slide rails 31 via a slider. The sorting robot 13 can sort the chips that have been loaded in the loading mechanism 2 onto the chip transfer unit 3, and the chip transfer unit 3 will transfer the chips to the testing station to achieve automated testing. The testing mechanism 4 is vertically set on the upper surface of the base 11 and located on the side of the sorting robot 13 away from the loading mechanism 2. The through hole 14 is opened on the base 11 and located directly below the testing mechanism 4. The testing machine 1 is provided with a preset temperature cavity unit 5 below the through hole 14. The preset temperature cavity unit 5 is sealed with the testing mechanism 4 through the chip transfer unit 3 to form a temperature testing chamber. The through hole 14 serves as a connection channel, so that the preset temperature cavity unit 5 (cold / heat source) located below and the testing mechanism 4 located above can achieve a vertically sealed docking through the chip transfer unit 3. The chip transfer unit 3 transports the chip to the through hole 14, and then the test mechanism 4 descends and presses it to seal, forming a closed and independent temperature test chamber. This temperature test chamber can quickly reach the set temperature, reduce external airflow interference, and significantly improve test efficiency.

[0016] In this embodiment, the loading mechanism 2 includes: a track groove, horizontally opened on the mounting plate 12, with a strip rail 21 slidably connected in the track groove; a carrier plate 22, fixed to one end of the strip rail 21, used to load and support the test chip; a propulsion cylinder 23, horizontally fixed on the mounting plate 12, with one end of the propulsion cylinder 23 connected to the carrier plate 22, the propulsion cylinder 23 adjusting the horizontal sliding of the carrier plate 22 during telescopic operation; and a limiting rod, fixed on the mounting plate 12 and parallel to the propulsion cylinder 23, with a limiting plate 24 fixed to the other end of the strip rail 21, the limiting rod cooperating with the limiting plate 24 to restrict the horizontal movement of the strip rail 21, so as to precisely control the moving distance of the carrier plate 22 and achieve precise positioning and transfer.

[0017] In a preferred embodiment, the carrier plate 22 slides along the track groove with the strip rail 21 to directly below the sorting robot 13. During operation, after the chip is loaded onto the carrier plate 22, the propulsion cylinder 23 extends and retracts to move the carrier plate 22 below the sorting robot 13. The sorting robot 13 removes the chip from the carrier plate 22, and then the carrier plate 22 slides back to its original position. The sorting robot 13 then places the chip on the chip transfer unit 3, completing the chip sorting and transfer. An adjusting rod is internally threaded onto the limiting rod, used to precisely adjust the sliding limit of the limiting plate 24, achieving precise positioning of the carrier plate 22 and the sorting robot 13 during sliding. A vision sensor 25 is installed on one side of the track groove on the mounting plate 12. The vision sensor 25 is used to visually scan the chip on the carrier plate 22, acquiring spatial information such as the chip's placement and orientation.

[0018] In this embodiment, the chip transfer unit 3 includes: a positioning plate 32, on which a test template 33 is mounted at the center of its upper surface. The test template 33 has a chip test slot. The positioning plate 32 is slidably connected to the slide rail 31, and a fine-tuning cylinder 35 is fixed on the base 11. One end of the fine-tuning cylinder 35 is connected to the positioning plate 32 to move and adjust the positioning plate 32 to the test position; and two guide shafts 36 arranged in parallel, which are respectively fixed on the positioning plate 32 and located on the test template 3. On both sides of 3; chip clamping plates 34, two of which are symmetrically arranged, each of which is slidably connected to the guide shaft 36; connecting cylinders 37, two of which are horizontally fixed on the positioning plate 32, one end of each connecting cylinder 37 is connected to the chip clamping plate 34. When the chip is placed behind the chip test slot by the sorting robot 13, the two connecting cylinders 37 work synchronously to extend and retract, thereby using the chip clamping plate 34 to clamp and position the chip; then the fine adjustment cylinder 35 extends and retracts to transfer the chip to the test station.

[0019] In this embodiment, the preset temperature chamber unit 5 includes: a support base 51, which is fixed inside the testing machine 1, and a turntable 52 is rotatably mounted on the upper surface of the support base 51; four circumferentially distributed heat-insulating chambers, which are arranged clockwise as a first high-temperature chamber 53, a first low-temperature chamber 54, a second high-temperature chamber 55, and a second low-temperature chamber 56; thus, since the temperatures of adjacent chambers are different, the turntable 52 only needs to be deflected by 90° to switch from the high-temperature chamber to the adjacent low-temperature chamber, achieving rapid alternation of hot and cold; center A shaft is vertically rotatably connected to the middle of the support base 51. The upper end of the central shaft is fixed to the turntable 52, and the lower end of the central shaft is fixed with a transmission gear. A rack 57 is slidably installed below the support base 51, and the rack 57 meshes with the transmission gear. An adjusting cylinder 58 is fixed inside the testing machine 1, and one end of the adjusting cylinder 58 is connected to the rack 57. This setting of the adjusting cylinder 58 enables the turntable 52 to deflect in both directions under telescopic adjustment, thereby allowing the four insulation chambers to switch spatially.

[0020] In this embodiment, both the first high-temperature cavity 53 and the second high-temperature cavity 55 are equipped with electric heating modules, which provide a basic temperature rise to about 200°C. Both the first low-temperature cavity 54 and the second low-temperature cavity 56 are equipped with semiconductor cooling modules, which can lower the temperature to about -60°C. The first high-temperature cavity 53 is also circumferentially distributed with infrared heating tubes, which further enhance the high-temperature effect of the first high-temperature cavity 53, raising the temperature to 300°C or even higher. The first low-temperature cavity 54 is externally connected to a liquid nitrogen injector, which injects liquid nitrogen directly into the first low-temperature cavity 54 through a solenoid valve and nozzle, achieving rapid cooling within the first low-temperature cavity 54, further rapidly lowering its internal temperature to -120°C or even lower. Therefore, for the four insulation cavities, the outer shell is made of stainless steel or aluminum alloy with a thickness of 2mm-3mm, while the interior is equipped with an insulation layer made of high-performance heat-insulating material, and the inner liner inside the insulation layer is 1mm-2mm thick.

[0021] In a preferred embodiment, a sealing layer 59 is provided on the lower end face of the base 11, and the sealing layer 59 is located inside the through hole 14. A heat insulation layer 510 is rotatably disposed below the sealing layer 59, and a plurality of through holes 511 are opened inside the heat insulation layer 510. The upper end of each heat insulation cavity is in sealed contact with the inner wall of the through hole 511. In the chip transfer unit 3, the positioning plate 32 is designed as a hollow structure, and the chip clamping plate 34 is located in the hollow position. The upper end face of the sealing layer 59 can be tightly fitted with the lower end face of the chip clamping plate 34 in the chip transfer unit 3 through the hollow position of the positioning plate 32. The sealing layer 59 has a sealing hole with the same center as the through hole 511. The sealing hole is located directly below the test mechanism 4, that is, the heat insulation layer 510 can be relatively fixed with each heat insulation cavity on the turntable 52. The upper end of each heat insulation cavity is inserted into the corresponding through hole 511 in the heat insulation layer 510 and maintains a sealed contact. When the turntable 52 drives the four heat insulation cavities to rotate and switch positions, the heat insulation layer 510 rotates synchronously, so that each through hole 511 is connected to the sealing hole accordingly. This enables rapid switching between high and low temperature environments during chip testing and tests the stability of the chip.

[0022] In this embodiment, the testing mechanism 4 includes: a frame 41, on one side of which a lifting plate 42 is vertically slidably mounted; a main board 43, vertically fixed on the lifting plate 42, with a connecting cylinder 44 vertically fixed on the main board 43; a heat insulation sleeve 45, coaxially fixed below the connecting cylinder 44, with a guide cylinder 46 sealingly connected between the heat insulation sleeve 45 and the connecting cylinder 44; and an inner partition sleeve 47, coaxially fixed inside the heat insulation sleeve 45, with an inner guide cavity 48 horizontally arranged inside the guide cylinder 46, the inner guide cavity 48 being L-shaped. The structure is shaped and one end of which is sealed and connected to the inner spacer 47. The heat insulation sleeve 45 can be sealed and contacted with the two chip clamps 34 in the chip transfer unit 3, thereby forming a test cavity. The inner spacer 47 is sealed and contacted with the chip clamps 34 and covers the chip test slot of the test template 33. The rotating shaft is horizontally rotatably connected in the guide cylinder 46. One end of the rotating shaft extends into the inner guide cavity 48, and the other end is fixed with a blade 49. The air inlet 410 is circumferentially distributed in the guide cylinder 46 and located on the periphery of the inner guide cavity 48.

[0023] In this embodiment, each chip clamping plate 34 in the chip transfer unit 3 is provided with circumferentially distributed inner hole groups 38 and outer hole groups 39. The inner hole groups 38 are located in the inner spacer 47, and the outer hole groups 39 are located between the inner spacer 47 and the heat insulation sleeve 45. Specifically, the sealing hole on the sealing layer 59 can be sealed and connected to the inner hole groups 38 and outer hole groups 39 on the chip clamping plate 34 through the hollow position in the positioning plate 32. When one of the heat insulation cavities is connected to the sealing hole through the corresponding through hole 511 in the heat insulation layer 510, the heat insulation cavity can form a sealed cavity structure with the inner hole groups 38 and outer hole groups 39 on the chip clamping plate 34 and the heat insulation sleeve 45. The rotating shaft drives the blades 4. 9. High-speed rotation creates negative pressure at the air inlet 410, allowing cold (or hot) flow in the insulation cavity to enter the annular space between the inner partition 47 and the insulation sleeve 45 through the outer hole group 39. Then, it enters the inner guide cavity 48 through the air inlet 410 and finally enters the interior of the inner partition 47, thereby changing the ambient temperature of the chip test. The set value can be reached in a very short time, significantly shortening the test waiting time. The cold (or hot) flow in the inner partition 47 flows back to the insulation cavity through the inner hole group 38 to achieve flow circulation. Furthermore, by changing the rotation direction of the blades (i.e., using bidirectional blades), the airflow can be reversed, achieving rapid switching between hot and cold in forward and reverse circulation.

[0024] Therefore, in this device, multiple high and low temperature insulation chambers in the preset temperature chamber unit 5 are sealed and connected to the heat insulation sleeve 45 in the test mechanism 4 through a priority design, and the internal airflow convection circulation is realized, so that the ambient temperature of the chip test can quickly reach the set value and can be quickly switched during the test to realize chip testing under rapid temperature changes; compared with the traditional technology of heating or cooling the chip from room temperature, this device can truly reproduce temperature shock and realize rapid hot and cold shock test of the chip.

[0025] In this embodiment, a heating cylinder 6 is coaxially arranged on the main board 43 above the connecting cylinder 44. A heat-conducting column 61 is vertically rotatably connected inside the heating cylinder 6. The lower end of the heat-conducting column 61 extends into and connects to the connecting cylinder 44. A heat-conducting probe 62 is slidably connected coaxially inside the heat-conducting column 61. The lower end of the heat-conducting probe 62 extends into and connects to the inner spacer 47. A ring sleeve 63 is slidably connected inside the connecting cylinder 44. The heat-conducting probe 62 and the ring sleeve 63 are coaxially slidably connected. The outer side of the ring sleeve 63... A guide pin is vertically fixed to the wall. The outer wall of the connecting cylinder 44 has an axially oriented sliding groove. When the ring 63 slides axially along the inside of the connecting cylinder 44, the guide pin and the sliding groove slide in contact synchronously. An adjusting ring 64 is rotatably connected to the main plate 43. The adjusting ring 64 has a straight groove, and the guide pin is slidably connected to the straight groove. A fixing cylinder 65 is inclined outwardly on the main plate 43. One end of the fixing cylinder 65 is connected to the adjusting ring 64. A drive motor is fixed on the main plate 43. The output end of the drive motor is rotatably connected to the heat-conducting column 61. The lower end of the heat-conducting probe 62 is provided with multiple floating balls. Specifically, when the fixed cylinder 65 extends and retracts, it can deflect the adjusting ring 64. During the deflection, the adjusting ring 64 uses the sliding action between the straight groove and the guide pin to drive the guide pin to slide vertically along the sliding groove. At this time, the heat-conducting probe 62 can gradually come into contact with the chip surface as it slides axially with the ring sleeve 63. Multiple floating balls form point contact heat conduction with the chip surface, achieving a hot spot effect, thereby achieving contact heat conduction on the chip and simulating the working condition where the chip generates additional temperature rise due to high load. In addition, the heat-conducting probe 62 can be driven to continuously rotate in a circular motion while maintaining contact with the chip. Multiple floating balls continuously change the contact point with the chip surface, forming dynamic rolling contact. Combined with the extension and retraction action of the fixed cylinder 65, the heat conduction time is changed, thereby simulating the effect of the temperature rise difference caused by different load durations on the chip's working stability. It can also be used to test the chip's tolerance to instantaneous thermal shock.

[0026] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A multifunctional integrated circuit chip intelligent testing machine, characterized in that, It includes: The testing machine (1) has a base (11) fixed horizontally inside it; Mounting plate (12) is fixed to the outside side of the test machine (1); The feeding mechanism (2) is mounted on the upper surface of the mounting plate (12), and its feeding end is set close to the testing machine (1); The sorting robot (13) is fixed on the upper end face of the base (11) near the feeding mechanism (2); A chip transfer unit (3) is installed on the upper surface of a base (11), and two slide rails (31) are horizontally arranged on the base (11); The testing mechanism (4) is vertically arranged on the upper surface of the base (11) and located on the side of the sorting robot (13) away from the feeding mechanism (2); A through hole (14) is opened on the base (11) and located directly below the test mechanism (4). A preset temperature cavity unit (5) is provided in the test machine (1) below the through hole (14). The preset temperature cavity unit (5) is sealed with the test mechanism (4) through the chip transfer unit (3) to form a temperature test cavity. The preset temperature cavity unit (5) includes: A support base (51) is fixed inside the test machine (1), and a turntable (52) is rotatably provided on the upper surface of the support base (51). The insulation chamber consists of four symmetrically distributed circumferences, arranged clockwise as a first high-temperature chamber (53), a first low-temperature chamber (54), a second high-temperature chamber (55), and a second low-temperature chamber (56). A sealing layer (59) is provided on the lower end face of the base (11), and a heat insulation layer (510) is rotatably provided below the sealing layer (59). A plurality of through holes (511) are opened in the heat insulation layer (510), and the upper end of each heat insulation cavity is in sealed contact with the inner wall of the through hole (511). The sealing layer (59) has a sealing hole with the same center as the through hole (511), and the sealing hole is located directly below the test mechanism (4); The testing facility (4) includes: The frame (41) has a lifting plate (42) vertically slidingly mounted on one side; The main board (43) is vertically fixed on the lifting plate (42), and a connecting cylinder (44) is vertically fixed on the main board (43); A heat insulation sleeve (45) is coaxially fixed below the connecting cylinder (44), and a guide cylinder (46) is sealed between the heat insulation sleeve (45) and the connecting cylinder (44); The inner partition sleeve (47) is coaxially fixed inside the heat insulation sleeve (45). The inner guide cavity (48) is horizontally arranged inside the guide cylinder (46). The inner guide cavity (48) has an L-shaped structure, and one end of it is sealed and connected to the inner partition sleeve (47). A rotating shaft is horizontally rotatably connected inside a guide cylinder (46). One end of the rotating shaft extends into the inner guide cavity (48), and the other end is fixed with a blade (49). The air inlet (410) is circumferentially distributed inside the guide cylinder (46) and located on the periphery of the inner guide cavity (48).

2. The multifunctional integrated circuit chip intelligent testing machine according to claim 1, characterized in that, The feeding mechanism (2) includes: A track groove is horizontally opened on the mounting plate (12), and a strip rail (21) is slidably connected in the track groove; The carrier plate (22) is fixed to one end of the strip rail (21); A propulsion cylinder (23) is horizontally fixed on the mounting plate (12), and one end of the propulsion cylinder (23) is connected to the carrier plate (22); A limiting rod is fixed on the mounting plate (12) and arranged parallel to the propulsion cylinder (23), and a limiting plate (24) is fixed at the other end of the strip rail (21).

3. The multifunctional integrated circuit chip intelligent testing machine according to claim 2, characterized in that: The carrier plate (22) moves along the track groove with the bar rail (21) to directly below the sorting robot (13); The limiting rod is internally threaded with an adjusting rod. A vision sensor (25) is provided on one side of the track groove on the mounting plate (12).

4. The multifunctional integrated circuit chip intelligent testing machine according to claim 1, characterized in that, The chip transfer unit (3) includes: The positioning plate (32) has a test template (33) installed at the center of its upper end face. The test template (33) is provided with a chip test slot. The positioning plate (32) is slidably connected to the slide rail (31). A fine adjustment cylinder (35) is fixed on the base (11). One end of the fine adjustment cylinder (35) is connected to the positioning plate (32). The guide shafts (36) are two parallel ones, which are respectively fixed on the positioning plate (32) and located on both sides of the test template (33); The chip clamps (34) are two symmetrically arranged, and each chip clamp (34) is slidably connected to the guide shaft (36); Two connecting cylinders (37) are configured and horizontally fixed on the positioning plate (32). One end of each connecting cylinder (37) is connected to the chip clamping plate (34).

5. The multifunctional integrated circuit chip intelligent testing machine according to claim 1, characterized in that, The preset temperature cavity unit (5) also includes: The central shaft is vertically rotatably connected to the middle of the support base (51). The upper end of the central shaft is fixed to the turntable (52), and the lower end of the central shaft is fixed with transmission teeth. A rack (57) is slidably mounted below a support base (51), and the rack (57) meshes with the transmission gear; An adjusting cylinder (58) is fixed inside the test machine (1), and one end of the adjusting cylinder (58) is connected to the rack (57).

6. The multifunctional integrated circuit chip intelligent testing machine according to claim 5, characterized in that: Both the first high-temperature cavity (53) and the second high-temperature cavity (55) are equipped with electric heating modules; and both the first low-temperature cavity (54) and the second low-temperature cavity (56) are equipped with semiconductor cooling modules. Infrared heating tubes are also distributed circumferentially inside the first high-temperature cavity (53); a liquid nitrogen ejector is connected to the outside of the first low-temperature cavity (54).

7. The multifunctional integrated circuit chip intelligent testing machine according to claim 1, characterized in that: Each chip clamp (34) in the chip transfer unit (3) is provided with a circumferentially distributed inner hole group (38) and outer hole group (39). The inner hole group (38) is located in the inner spacer (47), and the outer hole group (39) is located between the inner spacer (47) and the heat insulation sleeve (45).

8. The multifunctional integrated circuit chip intelligent testing machine according to claim 1, characterized in that: A heating cylinder (6) is coaxially arranged on the main board (43) above the connecting cylinder (44). A heat-conducting column (61) is vertically rotatably connected inside the heating cylinder (6). The lower end of the heat-conducting column (61) extends into and is connected to the connecting cylinder (44). A heat-conducting probe (62) is coaxially slidably connected inside the heat-conducting column (61). The lower end of the heat-conducting probe (62) extends into and is connected to the inner spacer (47). The connecting cylinder (44) is slidably connected to a ring sleeve (63), the heat-conducting probe (62) is slidably connected to the ring sleeve (63) on the same axis, a guide pin is vertically fixed on the outer wall of the ring sleeve (63), and a sliding groove is provided axially on the outer wall of the connecting cylinder (44). An adjusting ring (64) is rotatably connected to the main board (43). A straight groove is provided on the adjusting ring (64), and the guide pin is slidably connected to the straight groove. A fixed cylinder (65) is inclined outward on the main board (43), one end of the fixed cylinder (65) is connected to the adjusting ring (64), and a drive motor is fixed on the main board (43); The lower end of the thermal probe (62) is provided with multiple floating beads.

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