An SMT patch device for integrated circuit board manufacturing

Abstract

The application discloses an SMT patch device for integrated circuit board manufacturing and belongs to the technical field of patch machines, which comprises a mounting table, the top surface of the mounting table is provided with conveying rails, the conveying rails are provided with two conveying rails, the top surface of the mounting table is provided with a row frame, and the outer wall of the row frame is provided with a moving module; in the application, a grabbing assembly is arranged in the inner part, through the design, when components are grabbed, the components can be limited by elastic sheets, so that errors during alignment of the suction cups and the components are reduced, the components can be accurately adsorbed by the suction cups, the components can be clamped into grooves due to the fact that the positioning cover is internally provided with grooves corresponding to the components, the components are further limited, the components are prevented from being inclined and deviated during adsorption, and the components can be in correct postures during patching.

Description

Technical Field

[0001] This invention belongs to the field of chip mounter technology, and particularly relates to an SMT chip mounter device for integrated circuit board manufacturing. Background Technology

[0002] In the mass production process of circuit boards, since there are usually a large number of various components on the surface of the circuit board, in order to improve the mounting efficiency of the components on the surface of the circuit board, some manufacturers will use surface mount devices to mount the components to improve the production efficiency of the circuit board. At the same time, they adopt a process of first applying solder paste, then mounting the components, and finally reflow soldering to quickly produce circuit boards.

[0003] During the process of mounting components on the surface of a circuit board, due to the small size of the components, the contact position between the suction cup and the component may be inaccurate due to positioning accuracy issues. This can easily lead to the component being tilted or misaligned, thus affecting the mounting effect. Summary of the Invention

[0004] The purpose of this invention is to solve the problem of components becoming sideways or misaligned due to positioning inaccuracies during the process of picking up components with a chuck, and to propose an SMT placement device for integrated circuit board manufacturing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an SMT placement device for integrated circuit board manufacturing, comprising a mounting platform, wherein the top surface of the mounting platform is provided with conveyor rails, and two conveyor rails are provided; the top surface of the mounting platform is provided with a frame, and the outer wall of the frame is provided with a moving module; and further comprising: The gripping component includes a mounting base installed on one side of the mobile module, a connecting rod at the bottom end of the mounting base, and a suction cup installed at the bottom end of the connecting rod; A connecting cylinder is sleeved on the outer wall of a connecting rod. A positioning cover is installed at the bottom end of the connecting cylinder, and a suction cup is located inside the positioning cover. A lever is installed on the outer wall of the positioning cover. A spring sheet is slidably disposed on the outer wall of the positioning cover.

[0006] As a further description of the above technical solution: The gripping assembly further includes: a second electric push rod, which is disposed at the top of the mounting base, and the telescopic end of the second electric push rod is connected to the connecting rod; An air supply pipe is provided at the top of the mounting base, with one end of the air supply pipe passing through a connecting rod and connected to the suction cup, and the other end of the air supply pipe connected to the pump body. A connecting ring is installed at the bottom of the mounting base, and the connecting ring is coaxial with the connecting rod.

[0007] As a further description of the above technical solution: The gripping component further includes: a housing, the top of which is rotatably mounted inside the connecting ring, and the housing is sleeved on the outer wall of the connecting cylinder; A shaping plate is installed at the bottom of the outer shell, and the inner side of the shaping plate is in contact with the outer wall of the spring sheet; An extrusion plate is installed on the outer wall of the connecting rod and is slidably disposed in a groove on the inner wall of the outer casing. The first limiting rod is installed at the top of the connecting cylinder and passes through the through hole inside the extrusion plate.

[0008] As a further description of the above technical solution: The gripping assembly further includes: a first spring, which surrounds the outer wall of the first limiting rod, and both ends of the first spring are fixedly connected to the connecting cylinder and the extrusion plate, respectively; A fixing ring is installed on the outer wall of the connecting cylinder. A second spring is installed at the bottom end of the fixing ring, and the bottom end of the second spring is fixedly connected to the spring piece.

[0009] As a further description of the above technical solution: It also includes: a feeding assembly, which includes a conveyor frame disposed on one side of the mounting platform; Side plates are installed on both sides of the conveyor frame, and guide grooves are formed on the surface of the side plates; The second connecting seat is located at the bottom of the conveyor frame. Both ends of the second connecting seat are equipped with mounting brackets, which are slidably disposed in the guide groove. An extension plate corresponding to the lever is provided on one side of the mounting bracket.

[0010] As a further description of the above technical solution: The feeding assembly further includes: an extrusion bar, which is slidably disposed inside the second connecting seat, and a limit strip is installed at the bottom end of the extrusion bar; The fourth spring is installed at one end of the extrusion bar, and the other end of the fourth spring is fixedly connected to the inner wall of the second connecting seat; A flexible frame is mounted on one side of the mounting frame and is located above the conveyor frame.

[0011] As a further description of the above technical solution: The feeding assembly further includes: a second limiting rod, which is installed on both sides of the top of the conveyor frame, and the second limiting rod is slidably connected to the mounting frame through a through hole inside the extension plate on one side of the mounting frame; The third spring is wrapped around the outer wall of the second limiting rod, and the top end of the third spring is fixedly connected to the mounting bracket.

[0012] As a further description of the above technical solution: It also includes: a support assembly, the support assembly comprising a base plate disposed in a groove on the top surface of the mounting platform, the top surface of the base plate being fitted with an abutment seat; A connecting frame, the bottom end of which is hinged to the abutment seat, and connecting columns are installed on both sides of the connecting frame.

[0013] As a further description of the above technical solution: The support assembly further includes: a support plate, which is disposed in the gap between the conveying rails, and a first connecting seat is installed on the bottom surface of the support plate, and the first connecting seat is hinged to the top of the connecting frame; A positioning plate is installed on one side of a support plate, and a buffer groove is provided on one side of the positioning plate.

[0014] As a further description of the above technical solution: The support assembly further includes: a push frame, which is slidably disposed on the outside of the connecting frame, and a limit groove is formed in the push frame, and the connecting column is slidably disposed in the limit groove; The first electric push rod is installed on one side of the base plate, and the telescopic end of the first electric push rod is fixedly connected to the push frame. A fixed base is installed on the top surface of the base plate, and the top of the fixed base is provided with a through hole corresponding to the push frame, and the push frame is slidably connected to the fixed base through the through hole.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: In this invention, by incorporating a gripping component, the design enables the component to be positioned using a spring clip during gripping. This reduces alignment errors between the suction cup and the component, ensuring precise suction. Furthermore, the positioning cover has a corresponding groove inside, allowing the component to be inserted into the groove for further positioning. This prevents tilting or shifting of the component during suction and ensures the component is in the correct orientation during placement.

[0016] In this invention, by incorporating a feeding assembly, the design enables the mounting frame to be squeezed via a lever as the connecting cylinder descends while the suction cup picks up the component. This causes the mounting frame to move downwards and bring the bottom of the elastic frame into contact with the surface of the conveyor frame. The elastic frame then limits the two ends of the component, further ensuring the accuracy of the suction cup's pick-up of the component. Furthermore, the downward movement of the mounting frame moves the second connecting seat, causing the extrusion bar to further compress the carrier belt, thereby changing the tension of the carrier belt and ensuring that it fits tightly against the surface of the conveyor frame, preventing the carrier belt from being pulled up when picking up the component.

[0017] In this invention, by incorporating a support component, the circuit board can be positioned and stopped at a designated location by a positioning plate during transport. This also facilitates the positioning of components by the suction cup, further ensuring the accuracy of component placement. Simultaneously, the rotation of the connecting frame moves the support plate and positioning plate apart from one side, preventing damage to the edges of the circuit board during positioning and ensuring the integrity of the circuit board. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of an SMT (Surface Mount Technology) assembly device used in integrated circuit board manufacturing.

[0019] Figure 2 This is a schematic diagram of the split structure of an SMT (Surface Mount Technology) assembly device used in integrated circuit board manufacturing.

[0020] Figure 3 This is a schematic diagram of the disassembled structure of the gripping component in an SMT placement device for integrated circuit board manufacturing.

[0021] Figure 4 This is a partial cross-sectional schematic diagram of the gripping component in an SMT placement device for integrated circuit board manufacturing.

[0022] Figure 5 This is a schematic diagram showing the disassembled structure of a support component in an SMT (Surface Mount Technology) assembly device for integrated circuit board manufacturing.

[0023] Figure 6 This is a schematic diagram showing the disassembled structure of the feeding component in an SMT placement device for integrated circuit board manufacturing.

[0024] Figure 7 for Figure 6 A magnified structural diagram of part A in the middle.

[0025] Figure 8 This is a partial structural diagram of the feeding component in an SMT placement device for integrated circuit board manufacturing.

[0026] Legend: 1. Mounting platform; 2. Conveyor rail; 3. Frame; 4. Support assembly; 401. Positioning plate; 402. Support plate; 403. First connecting seat; 404. Connecting frame; 405. Connecting column; 406. Abutment seat; 407. Base plate; 408. Fixed seat; 409. First electric push rod; 410. Pushing frame; 411. Limiting groove; 5. Gripping assembly; 501. Air supply pipe; 502. Second electric push rod; 503. Mounting seat; 504. Extrusion plate; 505. Connecting ring; 506. Connecting rod; 507. Suction cup; 508. 509. Outer shell; 510. Lever; 511. First limiting lever; 512. Shaping plate; 513. First spring; 514. Fixing ring; 515. Connecting cylinder; 516. Positioning cover; 517. Second spring; 518. Spring sheet; 6. Moving module; 701. Feeding assembly; 702. Second limiting lever; 703. Mounting bracket; 704. Third spring; 705. Elastic frame; 706. Conveying frame; 707. Guide groove; 708. Side plate; 709. Second connecting seat; 710. Extrusion strip; 711. Limiting strip; 712. Fourth spring. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figures 1-8 This invention provides a technical solution: an SMT placement device for integrated circuit board manufacturing, including a mounting platform 1, a conveyor rail 2 on the top surface of the mounting platform 1, and two conveyor rails 2, a frame 3 on the top surface of the mounting platform 1, and a moving module 6 on the outer wall of the frame 3, and further including: like Figure 3 , Figure 4 As shown, the gripping component 5 includes a mounting base 503 installed on one side of the moving module 6, a connecting rod 506 at the bottom of the mounting base 503, and a suction cup 507 installed at the bottom of the connecting rod 506. A connecting cylinder 514 is sleeved on the outer wall of the connecting rod 506. A positioning cover 515 is installed at the bottom of the connecting cylinder 514, and a suction cup 507 is located inside the positioning cover 515. A lever 509 is installed on the outer wall of the positioning cover 515. Spring piece 517 is slidably disposed on the outer wall of positioning cover 515; The gripping component 5 also includes: a second electric push rod 502, which is disposed at the top of the mounting base 503, and the telescopic end of the second electric push rod 502 is connected to the connecting rod 506; The air supply pipe 501 is located at the top of the mounting base 503. One end of the air supply pipe 501 passes through the connecting rod 506 and is connected to the suction cup 507. The other end of the air supply pipe 501 is connected to the pump body. The connecting ring 505 is installed at the bottom of the mounting base 503, and the connecting ring 505 is coaxial with the connecting rod 506; The gripping component 5 also includes: a housing 508, the top of which is rotatably mounted inside the connecting ring 505, and the housing 508 is sleeved on the outer wall of the connecting cylinder 514; The shaping plate 511 is installed at the bottom of the housing 508, and the inner side of the shaping plate 511 is in contact with the outer wall of the spring piece 517. The extrusion plate 504 is installed on the outer wall of the connecting rod 506 and is slidably disposed in the groove of the inner wall of the housing 508. The first limiting rod 510 is installed at the top of the connecting cylinder 514 and passes through the through hole inside the extrusion plate 504. The gripping component 5 also includes: a first spring 512, which surrounds the outer wall of the first limiting rod 510, and the two ends of the first spring 512 are fixedly connected to the connecting cylinder 514 and the extrusion plate 504 respectively. A retaining ring 513 is installed on the outer wall of the connecting cylinder 514. A second spring 516 is installed at the bottom of the retaining ring 513, and the bottom of the second spring 516 is fixedly connected to the spring piece 517.

[0029] The specific implementation is as follows: When mounting the circuit board, the circuit board can be transported to a suitable position by the conveyor rail 2. At the same time, the moving module 6 drives the mounting base 503 to move on the frame 3 to move the suction cup 507 above the conveyor frame 705 with the carrier tape, so that the suction cup 507 is aligned with the component. Then, the second electric push rod 502 pushes the connecting rod 506 to move downward, and drives the suction cup 507 to move downward, so as to pick up the component by the suction cup 507. Furthermore, during the downward movement of the connecting rod 506, since the extrusion plate 504 is connected to the top of the connecting cylinder 514 via the first limiting rod 510 and the first spring 512, the downward movement of the connecting rod 506 causes the connecting cylinder 514 to move downward as well, thereby driving the positioning cover 515 and the spring piece 517 to move downward. During the downward movement of the spring piece 517, as the spring piece 517 contacts the top surface of the conveyor frame 705, the spring piece 517 can limit the two sides of the component to prevent the airflow when the suction cup 507 sucks in air from causing the component to tilt or shift. Furthermore, if the suction cup 507 is not aligned with the component, the component can be pushed to one side during the downward movement of the spring 517 to ensure the accuracy of the component. After the spring 517 limits the component, when the component is adsorbed by the suction cup 507, as the component is adsorbed into the positioning cover 515, the position of the component can be adjusted to avoid the component from being skewed because the positioning cover 515 has a groove corresponding to the component. Furthermore, as the spring piece 517 resets after adsorption is completed and moves upward, the bottom end of the shaping plate 511 abuts against the outer curled part of the bottom end of the spring piece 517. The spring piece 517 is pulled by the abutment of the shaping plate 511 against the spring piece 517 to ensure the shape of the spring piece 517 and avoid the spring piece 517 from repeatedly touching the top surface of the conveyor frame 705 and deforming. Furthermore, during the process of placing the components onto the circuit board surface, since the circuit board surface is lower than the top surface of the conveyor 705, the connecting rod 506 and the suction cup 507 move down a longer distance. Also, since the travel of the internal groove of the outer shell 508 where the extrusion plate 504 and the top extension plate of the connecting cylinder 514 are located is limited, the first spring 512 is in an extremely compressed state when the connecting rod 506 moves down a certain distance, so that the connecting cylinder 514 no longer moves down, and the suction cup 507 drives the components out of the positioning cover 515 and attaches the components to the circuit board surface.

[0030] like Figure 6 , Figure 7 and Figure 8 As shown, the feeding assembly 7 includes a conveyor frame 705 disposed on one side of the mounting platform 1; Side plate 707 is installed on both sides of conveyor frame 705, and guide groove 706 is provided on the surface of side plate 707; The second connecting seat 708 is located at the bottom of the conveyor frame 705. Both ends of the second connecting seat 708 are equipped with mounting brackets 702, and the mounting brackets 702 are slidably located in the guide groove 706. An extension plate corresponding to the lever 509 is provided on one side of the mounting bracket 702. The feeding assembly 7 also includes: an extrusion bar 709, which is slidably disposed inside the second connecting seat 708, and a limit bar 710 is installed at the bottom end of the extrusion bar 709; The fourth spring 711 is installed at one end of the extrusion bar 709, and the other end of the fourth spring 711 is fixedly connected to the inner wall of the second connecting seat 708. The elastic frame 704 is installed on one side of the mounting frame 702 and is located above the conveyor frame 705. The feeding assembly 7 also includes: a second limiting rod 701, which is installed on both sides of the top of the conveyor frame 705, and the second limiting rod 701 is slidably connected to the mounting frame 702 through the through hole inside the extension plate on one side of the mounting frame 702; The third spring 703 surrounds the outer wall of the second limiting rod 701, and the top end of the third spring 703 is fixedly connected to the mounting bracket 702.

[0031] The specific implementation is as follows: When performing chip mounting, the carrier tape containing the components can be placed on the surface of the conveyor frame 705 and passed through the gap between the extrusion strip 709 and the limiting strip 710 from below. Then, the end of the carrier tape is wrapped around the surface of the take-up module for recycling. When the suction cup 507 picks up the components, as the connecting cylinder 514 moves down, the extension plate on one side of the mounting frame 702 can be squeezed by the lever 509 to drive the elastic frame 704 to move. This causes the bottom end of the elastic frame 704 to contact the top surface of the conveyor frame 705 and causes the elastic frame 704 to deform to slide inward through the bottom end of the elastic frame 704, thereby limiting the two ends of the components to ensure that the suction cup 507 can accurately pick up the components. Furthermore, during the downward movement of the mounting frame 702, the mounting frame 702 drives the second connecting seat 708 to move, so that the extrusion strip 709 further extrudes the carrier belt, thereby increasing the tension of the carrier belt to ensure that the carrier belt can fit tightly against the surface of the conveyor frame 705.

[0032] like Figure 5 As shown, the support assembly 4 includes a base plate 407 disposed in a groove on the top surface of the mounting platform 1, and an abutment seat 406 is mounted on the top surface of the base plate 407. Connecting frame 404, the bottom end of connecting frame 404 is hinged to abutment seat 406, and connecting posts 405 are installed on both sides of connecting frame 404; The support assembly 4 also includes: a support plate 402, which is disposed in the gap between the conveying rails 2. A first connecting seat 403 is installed on the bottom surface of the support plate 402, and the first connecting seat 403 is hinged to the top of the connecting frame 404. Positioning plate 401 is installed on one side of support plate 402, and a buffer groove is provided on one side of positioning plate 401. Support component 4 also includes: push frame 410, push frame 410 is slidably disposed outside the connecting frame 404, push frame 410 is provided with a limit groove 411, and connecting column 405 is slidably disposed in the limit groove 411; The first electric push rod 409 is installed on one side of the base plate 407, and the telescopic end of the first electric push rod 409 is fixedly connected to the push frame 410. The fixed base 408 is installed on the top surface of the base plate 407, and the top of the fixed base 408 is provided with a through hole corresponding to the push frame 410, and the push frame 410 is slidably connected to the fixed base 408 through the through hole.

[0033] The specific implementation is as follows: During the process of conveying the circuit board on the conveyor rail 2, the positioning plate 401 can limit one end of the circuit board to ensure the accuracy of the circuit board's stopping position, so that the suction cup 507 can quickly position when placing components. At the same time, the support plate 402 can support the bottom of the circuit board to prevent the suction cup 507 from pushing the circuit board and causing damage to the circuit board when placing components. Furthermore, after the patch is completed, the pusher frame 410 can be moved by the first electric push rod 409. Since the connecting column 405 is located in the limiting groove 411, the movement of the pusher frame 410 can drive the connecting frame 404 to rotate and drive the support plate 402 and the positioning plate 401 to move away from one side, so as to avoid the positioning plate 401 from damaging the edge of the circuit board.

[0034] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An SMT placement apparatus for manufacturing integrated circuit boards, comprising: Mounting platform (1), the top surface of which is provided with conveyor rails (2), and there are two conveyor rails (2). The top surface of the mounting platform (1) is provided with a truss (3), and the outer wall of the truss (3) is provided with a movable module (6). The feature is that it further includes: The gripping component (5) includes a mounting base (503) installed on one side of the mobile module (6), and a connecting rod (506) is provided at the bottom end of the mounting base (503), and a suction cup (507) is installed at the bottom end of the connecting rod (506). A connecting cylinder (514) is sleeved on the outer wall of the connecting rod (506). A positioning cover (515) is installed at the bottom end of the connecting cylinder (514), and a suction cup (507) is located inside the positioning cover (515). A lever (509) is installed on the outer wall of the positioning cover (515), and the positioning cover (515) has a groove corresponding to the component inside. A spring sheet (517) is slidably disposed on the outer wall of the positioning cover (515); The crawling component (5) also includes: The second electric push rod (502) is located at the top of the mounting base (503), and the telescopic end of the second electric push rod (502) is connected to the connecting rod (506). The gas supply pipe (501) is located at the top of the mounting base (503), and one end of the gas supply pipe (501) passes through the connecting rod (506) and is connected to the suction cup (507), and the other end of the gas supply pipe (501) is connected to the pump body. A connecting ring (505) is installed at the bottom end of the mounting base (503), and the connecting ring (505) is coaxial with the connecting rod (506); The outer shell (508) is rotatably mounted inside the connecting ring (505) at its top end, and the outer shell (508) is sleeved on the outer wall of the connecting cylinder (514); A shaping plate (511) is installed at the bottom of the outer casing (508), and the inner side of the shaping plate (511) is in contact with the outer wall of the spring piece (517); An extrusion plate (504) is installed on the outer wall of the connecting rod (506) and is slidably disposed in a groove on the inner wall of the outer shell (508); The first limiting rod (510) is installed at the top of the connecting cylinder (514) and the first limiting rod (510) passes through the through hole inside the extrusion plate (504); The first spring (512) surrounds the outer wall of the first limiting rod (510), and the two ends of the first spring (512) are fixedly connected to the connecting cylinder (514) and the extrusion plate (504) respectively. A fixing ring (513) is installed on the outer wall of the connecting cylinder (514). A second spring (516) is installed at the bottom end of the fixing ring (513), and the bottom end of the second spring (516) is fixedly connected to the spring piece (517).

2. The SMT placement apparatus for integrated circuit board manufacturing according to claim 1, characterized in that, Also includes: The feeding assembly (7) includes a conveyor frame (705) disposed on one side of the mounting platform (1). Side plates (707) are installed on both sides of the conveyor frame (705), and guide grooves (706) are provided on the surface of the side plates (707). The second connecting seat (708) is located at the bottom of the conveyor frame (705). Both ends of the second connecting seat (708) are equipped with mounting brackets (702), and the mounting brackets (702) are slidably located in the guide groove (706). An extension plate corresponding to the lever (509) is provided on one side of the mounting bracket (702).

3. The SMT placement apparatus for integrated circuit board manufacturing according to claim 2, characterized in that, The feeding assembly (7) also includes: An extrusion strip (709) is slidably disposed inside the second connecting seat (708), and a limit strip (710) is installed at the bottom end of the extrusion strip (709). The fourth spring (711) is installed at one end of the extrusion bar (709), and the other end of the fourth spring (711) is fixedly connected to the inner wall of the second connecting seat (708); The elastic frame (704) is mounted on one side of the mounting frame (702) and is located above the conveyor frame (705).

4. The SMT placement apparatus for integrated circuit board manufacturing according to claim 3, characterized in that, The feeding assembly (7) also includes: The second limiting rod (701) is installed on both sides of the top of the conveyor frame (705), and the second limiting rod (701) is slidably connected to the mounting frame (702) through the through hole inside the extension plate on one side of the mounting frame (702); The third spring (703) surrounds the outer wall of the second limiting rod (701), and the top of the third spring (703) is fixedly connected to the mounting bracket (702).

5. The SMT placement apparatus for integrated circuit board manufacturing according to claim 4, characterized in that, Also includes: Support assembly (4), the support assembly (4) includes a base plate (407) disposed in a groove on the top surface of the mounting platform (1), and an abutment seat (406) is installed on the top surface of the base plate (407). A connecting frame (404) is hinged at its bottom end to an abutment seat (406), and connecting columns (405) are installed on both sides of the connecting frame (404).

6. The SMT placement apparatus for integrated circuit board manufacturing according to claim 5, characterized in that, The support component (4) also includes: A support plate (402) is provided in the gap between the conveying rails (2). A first connecting seat (403) is installed on the bottom surface of the support plate (402), and the first connecting seat (403) is hinged to the top of the connecting frame (404). Positioning plate (401) is installed on one side of support plate (402), and a buffer groove is provided on one side of positioning plate (401).

7. The SMT placement apparatus for integrated circuit board manufacturing according to claim 6, characterized in that, The support component (4) also includes: A pusher frame (410) is slidably disposed on the outside of a connecting frame (404). A limiting groove (411) is provided in the pusher frame (410), and a connecting column (405) is slidably disposed in the limiting groove (411). The first electric push rod (409) is installed on one side of the base plate (407), and the telescopic end of the first electric push rod (409) is fixedly connected to the push frame (410); The fixed seat (408) is installed on the top surface of the base plate (407), and the top of the fixed seat (408) is provided with a through hole corresponding to the push frame (410), and the push frame (410) is slidably connected to the fixed seat (408) through the through hole.

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