A display panel and its manufacturing method

Abstract

This invention discloses a display panel and its fabrication method, relating to the field of display device technology. The method includes: fixing multiple flip chips onto the display area of ​​a PCB substrate using a die-bonding method, wherein the multiple flip chips are arranged in a matrix, and the spacing between two adjacent flip chips is 0.5mm~0.9mm; setting a diffusion film on the light-emitting side of the PCB substrate, the diffusion film covering the display area and being positioned opposite to the light-emitting surface of the flip chips, the diffusion film being adhered to the light-emitting surface of the flip chips, and there being no air gap between the diffusion film and the flip chips; by controlling the thickness of the flip chips and the diffusion film, the stacking height of the flip chips and the diffusion film in the direction perpendicular to the PCB substrate is made to be 230μm~310μm, and crosstalk interference between adjacent flip chips is suppressed, thereby obtaining the display panel. This invention solves the problems of existing display panels where the large thickness of SMT LEDs makes it difficult to achieve ultra-thin design and where light diffusion leads to poor display effect.

Description

Technical Field

[0001] This invention relates to the field of display device technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] Display panels are widely used in home appliance control panels, instruments and meters, consumer electronics, smart terminals, and various devices that require digital, character, Chinese, or graphic displays.

[0003] In the existing technology, the most common assembly process for display panel structure is to first mount LED beads on the PCB board using SMT process to form a PCBA, and then directly fix the PCBA on the bracket of the whole machine, and then cooperate with the product panel to realize the light-emitting display. However, most display panels use SMT LEDs as light-emitting devices, and the above assembly process has the following drawbacks: First, SMT LEDs are usually large in size, and their package thickness and mounting height determine the high assembly space requirements of the display module in the whole machine. For products that require compact structure and ultra-thin display area, existing SMT LED display solutions are difficult to further reduce thickness, limiting the overall thin and light design. Second, the light emission angle of SMT LEDs (about 120°) is usually large. When there is a certain installation gap between the display module and the whole machine panel, the light emitted by the LED is easy to diffuse in the gap space, forming residual light and crosslight phenomena. The light not only illuminates adjacent areas, but also easily forms halos at the edges of strokes when displaying numbers, English letters, Chinese characters or patterns, resulting in unclear display boundaries and blurred display outlines, affecting the overall appearance and recognition effect. Especially in high contrast and close-range observation application scenarios, the above display problems are more obvious.

[0004] Therefore, existing display panels suffer from problems such as the difficulty in achieving ultra-thin designs due to the large thickness of SMT LEDs and poor display effects due to light diffusion. Summary of the Invention

[0005] The purpose of this invention is to provide a display panel and its manufacturing method, which solves the problems of existing display panels having difficulty in achieving ultra-thin design due to the large thickness of SMT LEDs and poor display effect due to light diffusion.

[0006] To achieve this objective, the present invention adopts the following technical solution: According to a first aspect, the present invention provides a method for manufacturing a display panel, comprising: Step S1: Multiple flip chips are fixedly mounted on the display area of ​​the PCB substrate by die bonding. The multiple flip chips are arranged in a matrix, and the spacing between two adjacent flip chips is 0.5mm~0.9mm. Step S2: A diffusion film is disposed on the light-emitting side of the PCB substrate. The diffusion film covers the display area and is disposed opposite to the light-emitting surface of the flip chip. The diffusion film is attached to the light-emitting surface of the flip chip, and there is no air gap between the diffusion film and the flip chip. Step S3: By controlling the thickness of the flip chip and the diffusion film, the stacking height of the flip chip and the diffusion film in the direction perpendicular to the PCB substrate is 230μm~310μm, so as to obtain the display panel and suppress crosstalk between adjacent flip chips.

[0007] Optionally, the gap between the diffusion film and the external device panel is 0~0.2mm, so that the diffusion film and the external device panel form a surface contact or near-surface contact state.

[0008] Optionally, the gap between the diffusion film and the external device panel is 0~0.1mm, and the ratio of the spacing between two adjacent flip chips to the gap is not less than 7, so that the propagation distance of light in the vertical direction is less than the critical distance at which it diffuses laterally between adjacent flip chips.

[0009] Optionally, an assembly space of less than or equal to 0.37 mm is formed between the display panel and the external device bracket, so that the display panel as a whole is in a confined installation space and the multiple reflections and diffusions of light in the light emission path are limited.

[0010] Optionally, the thickness of the flip chip is 100μm~140μm, and the thickness of the diffusion film is 130μm~170μm; wherein, when the thickness of the flip chip is greater than 140μm or the thickness of the diffusion film is greater than 170μm, the propagation distance of light before entering the diffusion film increases.

[0011] Optionally, the spacing between two adjacent flip chips is 0.7 mm, the thickness of the flip chip is 120 μm, the thickness of the diffusion film is 150 μm, and the stack height is 270 μm, so that the light spot formed by a single flip chip diffuses beyond half the center distance of the adjacent flip chips on the light-emitting side boundary of the diffusion film.

[0012] Optionally, in step S1, solder paste or conductive adhesive is applied to the pads in the display area of ​​the PCB substrate, and the flip chip is mounted on the corresponding pads. The flip chip is then electrically connected to the PCB substrate through reflow soldering or curing processes.

[0013] Optionally, the diffusion film is an optical diffusion film containing diffusing particles.

[0014] Optionally, the external device panel is a touch screen glass or a transparent display cover.

[0015] According to a second aspect, the present invention provides a display panel manufactured using the method described in the first aspect, comprising a PCB substrate, wherein a plurality of flip chips electrically connected to each other are disposed on a display area of ​​the PCB substrate, the plurality of flip chips being arranged in a matrix; and a diffusion film directly bonded to the flip chips is disposed on the light-emitting side of the PCB substrate, the diffusion film covering the display area. The PCB substrate has electronic components connected to its backlight side, and the flip chip and the diffusion film form a stack height of 230μm~310μm in a direction perpendicular to the PCB substrate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. By directly mounting flip chips on the PCB substrate using a die-bonding method and arranging multiple flip chips in a matrix with a spacing of 0.5mm to 0.9mm, traditional SMT LED devices are replaced. This significantly reduces the package size and mounting height of the light-emitting devices, thereby reducing the overall thickness of the display module from the source. This is conducive to achieving ultra-thin design of the display panel and the overall structure, meeting the development needs of thinner and lighter products.

[0017] 2. By attaching a diffusion film to the light-emitting side of the flip chip, and with no air gap between the diffusion film and the flip chip, the light is uniformly modulated before emission, effectively reducing the disordered diffusion of light in the air layer, reducing the generation of residual light and crosstalk, thereby significantly improving the optical consistency of the display area.

[0018] 3. By controlling the stacking height of the flip chip and the diffusion film within the range of 230μm~310μm, the overall structure of the display panel is made more compact, and the propagation path of light is effectively constrained within the limited space. This further suppresses crosstalk interference between adjacent flip chips, avoids halo phenomena at the edges of display strokes, improves the clarity and sharpness of display boundaries, and thus improves the display effect of the display panel. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0021] Figure 1 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention; Figure 2 This is a top view structural diagram of a display panel provided in an embodiment of the present invention; Figure 3 for Figure 2 A magnified structural diagram at point A; Figure 4 This is an exploded view of a display panel according to an embodiment of the present invention; Figure 5 for Figure 4 A magnified structural diagram at point B.

[0022] Illustration: 10. PCB substrate; 20. Flip chip; 30. Diffusion film; 40. Electronic components. Detailed Implementation

[0023] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0024] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0025] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0026] The first aspect of this invention provides a method for manufacturing a display panel, such as... Figures 1 to 5 As shown, the preparation method includes: Step S1: Multiple flip chips 20 are fixedly mounted on the display area of ​​the PCB substrate 10 by die bonding. The multiple flip chips 20 are arranged in a matrix, and the spacing between two adjacent flip chips 20 is 0.5mm~0.9mm. Step S2: A diffusion film 30 is disposed on the light-emitting side of the PCB substrate 10. The diffusion film 30 covers the display area and is disposed opposite to the light-emitting surface of the flip chip 20. The diffusion film 30 is attached to the light-emitting surface of the flip chip 20, and there is no air gap between the diffusion film 30 and the flip chip 20. The diffusion film 30 is an optical diffusion film containing diffusion particles. Step S3 involves controlling the thickness of the flip chip 20 and the diffusion film 30 to achieve a stacking height of 230μm~310μm between the flip chip 20 and the diffusion film 30 in the direction perpendicular to the PCB substrate 10, while suppressing crosstalk interference between adjacent flip chips 20, thereby obtaining the display panel. Display panels using traditional SMT LED structures typically have an overall thickness greater than 1mm, and due to their large emission angle, they are prone to significant crosstalk and halo phenomena when there are installation gaps.

[0027] It should be noted that the display panel manufacturing method provided in this embodiment of the invention directly mounts multiple flip chips 20 arranged in a matrix in the display area of ​​the PCB substrate 10 by die bonding, and controls the spacing between adjacent flip chips 20 within the range of 0.5mm to 0.9mm. Compared with traditional SMT LED devices, this method can significantly reduce the packaging height of the flip chips 20, thereby effectively reducing the overall thickness of the display panel and facilitating the miniaturization and ultra-thin design of the display module.

[0028] Based on this, by setting a diffusion film 30 containing diffusion particles on the light-emitting side of the PCB substrate 10, and making the diffusion film 30 adhere to the light-emitting surface of the flip chip 20 with no air gap between them, the light emitted by the flip chip 20 is uniformly scattered after entering the diffusion film 30, which effectively avoids the disorderly diffusion of light in the air layer, reduces the phenomenon of residual light and cross light, and thus improves the light emission uniformity of the display area.

[0029] Furthermore, by coordinating the thickness control of the flip chip 20 and the diffusion film 30, the stacking height of the two in the direction perpendicular to the PCB substrate 10 is maintained within the range of 230μm~310μm. This not only ensures the compactness of the overall structure but also effectively constrains the light propagation path within a limited space, further suppressing crosstalk interference between adjacent flip chips 20 and reducing halo phenomena generated during display. Therefore, the display panel prepared by the method of this embodiment of the invention achieves ultra-thin structure while significantly improving the clarity of display boundaries and the sharpness of pattern outlines, thereby enhancing the overall display effect and visual recognition performance.

[0030] In one embodiment, the gap between the diffusion film 30 and the external device panel is 0~0.2mm, so that the diffusion film 30 and the external device panel form a surface contact or near-surface contact state. The external device panel is a touch screen glass or a transparent display cover. Compared with the traditional structural design with a large air gap, this design can further reduce the divergence space of light during the propagation process between the diffusion film 30 and the external device panel, thereby effectively suppressing the secondary diffusion and reflection of light, and reducing the generation of residual light and crosslight.

[0031] When the diffusion film 30 makes surface or near-surface contact with the external device panel, the light emitted from the flip chip 20, after being uniformly processed by the diffusion film 30, can directly enter the external device panel and be emitted outward along a relatively controlled path. This avoids the problem of disordered propagation and multiple reflections of light in the air gap, thereby making the light spot boundary of the display area clearer and the outline of the displayed numbers, characters, or patterns sharper, significantly improving the display contrast and visual recognition effect. At the same time, this structure, combined with the aforementioned stacking height (230μm~310μm), further optimizes the optical path while ensuring a compact overall structure, which is conducive to achieving a unified ultra-thin design of the display panel and a high-quality display effect.

[0032] When the gap between the diffuser film 30 and the external device panel exceeds 0.2mm, the light emitted from the diffuser film 30 needs to travel a certain distance in the air layer. During this process, the light will further diverge, causing the originally modulated light spot to expand again, thus blurring the edges of the displayed strokes and resulting in a blurring phenomenon, reducing display clarity. In addition, in larger gaps, light is prone to multiple reflections or refractions between the diffuser film 30 and the panel, forming a noticeable halo phenomenon, especially when displaying high-contrast patterns (such as the edges of numbers and characters), which is more prominent and affects visual perception. Because non-target areas are illuminated by stray light (i.e., increased peripheral light), blacks or dark areas are not pure enough, thereby reducing the overall display contrast and affecting the recognition effect, especially when viewed in low light or at close range.

[0033] In this embodiment, the diffusion film 30 refers to an optical thin film incorporating micron- or nano-sized diffusing particles into a substrate. Its function is to scatter incident light, making the light distribution more uniform, thereby improving the brightness uniformity and visual effect of the display. Surface contact refers to two planar structures with virtually no gap or a very small gap, allowing them to adhere to each other over a large area; near-surface contact refers to a very small gap (such as 0~0.2mm in this embodiment) between the two due to manufacturing or assembly tolerances, but the overall appearance is still a large-area adherence. External device panel refers to a transparent structural component located outside the display panel for user observation or operation, such as touch screen glass or a transparent display cover. Its main function is to protect the internal display structure and provide a display interface. Crosslighting refers to the phenomenon where light emitted from a flip chip 20 leaks into adjacent display areas, interfering with the display of adjacent pixels or patterns, usually resulting in blurred display boundaries or image distortion. Peripheral light refers to scattered or reflected light that is not effectively limited or utilized. This light can generate brightness in non-target areas, affecting the contrast and clarity of the display.

[0034] In an optional embodiment, the gap between the diffusion film 30 and the external device panel is 0~0.1mm, and the ratio of the spacing between two adjacent flip chips 20 to the gap is not less than 7, so that the propagation distance of light in the vertical direction is less than the critical distance at which it diffuses laterally between adjacent flip chips 20, thereby further optimizing the display structure in the optical path and obtaining a better display effect.

[0035] Specifically, reducing the gap to 0-0.1mm allows the diffuser film 30 to be in near-tight contact with the external device panel, significantly shortening the light propagation distance in the air and reducing re-divergence and multiple reflections during the emission process. This effectively reduces residual light and halo phenomena, further improving the clarity of the display boundary. Simultaneously, by limiting the ratio of the flip chip spacing 20 to the gap to be no less than 7, the vertical propagation distance of the light is restricted relative to its lateral diffusion capability. This means that the light has essentially completed its emission to the external device panel before it diffuses laterally to the adjacent flip chip 20 area. Through this structural design, lateral crosstalk between adjacent flip chips 20 can be effectively suppressed, significantly reducing the probability of light leakage. Furthermore, an optical constraint condition of "prioritizing vertical emission and suppressing lateral diffusion" is established, making the light propagation path more concentrated and controllable. This ensures an ultra-thin structure while further improving the edge sharpness, contrast, and overall consistency of the display pattern.

[0036] When the gap between the diffusion film 30 and the external device panel gradually increases from 0.1 mm to more than 0.2 mm, the divergence of light in the gap shows a non-linear increasing trend, resulting in a rapid expansion of the light spot boundary. Similarly, when the ratio of the flip chip 20 spacing to the gap decreases from 7 to 6 or less, the probability of light spreading laterally to adjacent areas increases significantly, and the crosstalk phenomenon is significantly enhanced.

[0037] In one embodiment, an assembly space of less than or equal to 0.37 mm is formed between the display panel and the external device bracket, so that the display panel as a whole is in a confined installation space and the multiple reflections and diffusions of light in the light emission path are limited.

[0038] In practical implementation, the smaller assembly space effectively constrains the upper and lower spaces of the display panel, compressing the light propagation path within a limited range as it travels from the flip chip 20 through the diffuser film 30 and finally exits to the external device panel. This reduces the possibility of multiple reflections and disordered diffusion of light within the structure. Compared to structures with larger assembly spaces, this confined space significantly reduces stray light generation and alleviates peripheral light and crosstalk problems. Because the light propagation path is more concentrated, interference caused by light reflecting off the support structure or cavity and then re-entering the display area is effectively avoided, thereby improving the contrast of the display area and making the bright and dark areas of the displayed content more distinct.

[0039] Furthermore, the assembly space of less than or equal to 0.37 mm works synergistically with the aforementioned stacking height (230 μm~310 μm) and the bonding gap of the diffusion film 30 (0~0.2 mm) to ensure a compact structure while allowing light to exit in a path closer to the vertical direction, further improving the boundary clarity and outline sharpness of the displayed pattern, thereby improving the display effect of the display panel.

[0040] In one embodiment, the thickness of the flip chip 20 is 100μm~140μm, and the thickness of the diffusion film 30 is 130μm~170μm, so that the flip chip 20 and the diffusion film 30 form a reasonably matched stacking relationship, thereby effectively controlling the light propagation path.

[0041] Specifically, the smaller thickness of the flip chip 20 helps shorten the initial propagation distance of light from the light source to the diffusion film 30, allowing the light to enter the diffusion film 30 more quickly for uniform diffusion. This reduces the free diffusion space of the light before entering the diffusion film 30, thereby reducing the degree of light spot divergence. Simultaneously, controlling the thickness of the diffusion film 30 within the range of 130μm to 170μm ensures sufficient diffusion capacity while avoiding excessively long propagation paths of light within the film due to an excessively thick diffusion layer, thus balancing uniform light distribution with controllability of the light emission direction.

[0042] Furthermore, when the thickness of the flip chip 20 exceeds 140 μm or the thickness of the diffusion film 30 exceeds 170 μm, the propagation distance of light before entering the diffusion film 30 or within the diffusion film 30 increases. This makes the light more prone to disordered diffusion or multiple scattering, leading to increased spot size, blurred boundaries, and increased risk of crosstalk, which is detrimental to achieving a clear display effect on the display panel. Therefore, by synergistically limiting the thickness range mentioned above, light can complete the process from emission to uniform emission within a shorter path, effectively suppressing excessive light diffusion, improving display boundary clarity and contrast, while also helping to maintain the ultra-thin characteristics of the overall structure.

[0043] In an optional embodiment, by setting the spacing between two adjacent flip chips 20 to 0.7 mm, the thickness of the flip chip 20 to 120 μm, the thickness of the diffusion film 30 to 150 μm, and the overall stack height to 270 μm, a synergistic matching relationship is formed among the structural parameters, thereby achieving precise control over the light spot diffusion range. Under the above parameter combination, the light emitted by a single flip chip 20 undergoes controlled diffusion after entering the diffusion film 30, and the light spot boundary formed on the light-emitting side of the diffusion film 30 is limited to no more than half the center distance between adjacent flip chips 20. Therefore, the light spots corresponding to adjacent flip chips 20 remain essentially independent in space, avoiding significant overlap of light spots and effectively suppressing crosstalk.

[0044] Furthermore, because the light spot diffusion range is constrained, the boundaries of the display areas corresponding to each flip chip 20 are clearer. When displaying numbers, characters, or patterns, it effectively avoids problems such as stroke adhesion, blurred edges, or halo diffusion, thereby significantly improving display resolution and outline sharpness. At the same time, the reasonable matching of the thickness and stacking height allows light to diffuse and radiate outward within a shorter path, ensuring a certain level of uniform light while avoiding excessive diffusion, which helps to achieve a balance between display uniformity and clarity.

[0045] In summary, by setting the specific parameters mentioned above, not only can the size of the light spot be effectively limited, but the display accuracy and visual effect of the display panel can also be further improved while maintaining a compact and ultra-thin structure.

[0046] Specifically, in step S1, solder paste or conductive adhesive is applied to the pads of the display area of ​​the PCB substrate 10, and the flip chip 20 is mounted on the corresponding pads. The flip chip 20 is electrically connected to the PCB substrate 10 through reflow soldering or curing processes, so that the flip chip 20 can be directly fixed to the surface of the PCB substrate 10 in a leadless or short interconnection path manner.

[0047] The surface-contact electrical connection achieved using solder paste or conductive adhesive helps reduce the connection height between the flip chip 20 and the PCB substrate 10. Compared to traditional wire bonding or SMT packaging structures, this significantly reduces the overall package thickness, facilitating ultra-thin display panel designs. A stable electrical connection interface is formed through reflow soldering or curing processes, making the connection between the flip chip 20 and the PCB substrate 10 more robust and reliable, improving the mechanical strength and long-term stability of the electrical connection, thereby enhancing product reliability. Since the flip chip 20 is directly mounted on the pads, its electrical connection path is shorter and its resistance is lower, which helps reduce signal transmission loss and heat generation, improving driving efficiency and luminous performance. Furthermore, this mounting method improves the positioning accuracy of the flip chip 20, resulting in a more regular arrangement on the PCB substrate 10, providing a good foundation for the subsequent matching of the diffusion film 30, thus helping to ensure the uniformity and consistency of the display panel.

[0048] A second aspect of the present invention provides a display panel manufactured using the method of the first aspect, as shown in the figure. Figures 2 to 5 As shown, the PCB substrate 10 has multiple flip chips 20 electrically connected on its display area, and the multiple flip chips 20 are arranged in a matrix. A diffusion film 30 is provided on the light-emitting side of the PCB substrate 10 and is directly attached to the flip chips 20, and the diffusion film 30 covers the display area. In this embodiment, an electronic component 40 is connected to the backlight side of the PCB substrate 10, and the flip chip 20 and the diffusion film 30 form a stack height of 230μm~310μm in a direction perpendicular to the PCB substrate 10. In this embodiment, the electronic component 40 is a technology known in the art, and its specific structure will not be described in detail.

[0049] It should be noted that, firstly, by setting multiple flip chips 20 arranged in a matrix in the display area of ​​the PCB substrate 10 and directly electrically connecting the flip chips 20 to the PCB substrate 10, the overall height of the flip chips 20 can be effectively reduced compared to the traditional SMT LED packaging structure, thereby significantly reducing the thickness of the display panel and facilitating the realization of a thinner and lighter display module design.

[0050] Secondly, by setting a diffusion film 30 that is directly bonded to the flip chip 20 on the light-emitting side of the PCB substrate 10, and by covering the entire display area, the light emitted by the flip chip 20 enters the diffusion medium for uniform modulation in the early stage of emission, avoiding disordered diffusion of light in the air layer, thereby effectively reducing residual light and cross-light phenomena and improving the display uniformity of the display panel.

[0051] Furthermore, by controlling the stacking height of the flip chip 20 and the diffusion film 30 in the direction perpendicular to the PCB substrate 10 within the range of 230μm to 310μm, the light propagation path is kept within a controlled range. This effectively suppresses optical crosstalk between adjacent flip chips 20 while ensuring a compact structure, reducing halo effects and improving the clarity and sharpness of display boundaries. In addition, connecting electronic components to the backlight side of the PCB substrate 10 facilitates the integrated integration of the driving circuit and the flip chip 20, improving the overall structural compactness and electrical connection reliability, while also facilitating system integration and mass production.

[0052] In summary, the display panel provided by the embodiments of the present invention, while achieving an ultra-thin structural design, can significantly improve the display panel's clarity, contrast, and consistency, resulting in excellent display effects and application value. In practical applications, the above-described display panel structure can significantly reduce the blur width of display boundaries and significantly reduce the light-crossing area, thereby improving display resolution.

[0053] It should be further explained that the technical solution of the present invention is not a simple size optimization or conventional parameter adjustment of the existing display structure, but a restricted light propagation structure constructed based on a systematic analysis of the light propagation path and diffusion behavior.

[0054] By coordinating and matching the spacing of the flip chips 20, the thickness of the diffusion film 30, the gap between the diffusion film 30 and the external device panel, and the overall stack height, the light propagation process exhibits the following controlled characteristics: On the one hand, by reducing the stack height and the thickness of the flip chips 20, the propagation distance of the light before entering the diffusion film 30 is limited; on the other hand, by reducing the gap between the diffusion film 30 and the external device panel, secondary divergence of the light is avoided during the emission process; furthermore, by limiting the ratio between the chip spacing and the gap, the light completes vertical emission before it diffuses laterally into the adjacent flip chip 20 area.

[0055] Based on the aforementioned synergistic effect of multiple parameters, this invention essentially constructs a confined light field structure that prioritizes vertical emission and suppresses lateral diffusion, thereby effectively suppressing crosstalk and halo phenomena even under ultra-thin structure conditions. It should be noted that simply reducing the gap in the diffusion film 30, adjusting the chip thickness, or changing the chip spacing alone cannot simultaneously achieve the goals of light diffusion control and ultra-thin structure; light spot diffusion or crosstalk problems will still exist. Therefore, the technical effect achieved by this invention through multi-parameter coupling has significant synergy and is irreplaceable.

[0056] During actual verification, it was found that when only the gap between the diffusion film 30 and the external device panel was reduced, without matching control of the spacing or stack height of the flip chip 20, the problem of lateral light diffusion inside the diffusion film 30 still occurred, resulting in the crosstalk phenomenon not being effectively improved. Similarly, when only the thickness or stack height of the flip chip 20 was reduced, but a large gap still existed between the diffusion film 30 and the external device panel, the re-divergence of light in the air layer was still obvious, and the display boundary remained blurry.

[0057] Therefore, relying solely on single-parameter optimization is insufficient to achieve ideal display results. The multi-parameter collaborative control of this invention is necessary to simultaneously achieve ultra-thin structure and high display clarity. This invention constructs a confined light propagation path through multi-parameter coupling, offering a simpler structure and more precise optical control compared to existing solutions that rely solely on adding light-shielding structures or adjusting single optical parameters.

[0058] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Step S1: Multiple flip chips are fixedly mounted on the display area of ​​the PCB substrate by die bonding. The multiple flip chips are arranged in a matrix, and the spacing between two adjacent flip chips is 0.5mm~0.9mm. Step S2: A diffusion film is disposed on the light-emitting side of the PCB substrate. The diffusion film covers the display area and is disposed opposite to the light-emitting surface of the flip chip. The diffusion film is attached to the light-emitting surface of the flip chip, and there is no air gap between the diffusion film and the flip chip. Step S3: By controlling the thickness of the flip chip and the diffusion film, the stacking height of the flip chip and the diffusion film in the direction perpendicular to the PCB substrate is 230μm~310μm; The gap between the diffusion film and the external device panel is 0~0.1mm, and the ratio of the distance between two adjacent flip chips to the gap is not less than 7, so that the propagation distance of light in the vertical direction is less than the critical distance for lateral diffusion between adjacent flip chips, so that the light is preferentially emitted to the external device panel in the vertical direction after being uniformly processed by the diffusion film, and the lateral crosstalk interference between adjacent flip chips is suppressed, thereby obtaining a display panel. The thickness of the flip chip is 100μm~140μm, and the thickness of the diffusion film is 130μm~170μm; wherein, when the thickness of the flip chip is greater than 140μm or the thickness of the diffusion film is greater than 170μm, the propagation distance of light before entering the diffusion film increases. An assembly space of less than or equal to 0.37 mm is formed between the display panel and the external device bracket, so that the display panel as a whole is in a confined installation space and the multiple reflections and diffusions of light in the light emission path are limited.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The spacing between two adjacent flip chips is 0.7 mm, the thickness of the flip chip is 120 μm, the thickness of the diffusion film is 150 μm, and the stack height is 270 μm, so that the light spot formed by a single flip chip diffuses beyond half the center distance of the adjacent flip chips at the light-emitting side boundary of the diffusion film.

3. The method for manufacturing a display panel according to claim 1, characterized in that, In step S1, solder paste or conductive adhesive is applied to the pads in the display area of ​​the PCB substrate, and the flip chip is mounted on the corresponding pads. The flip chip is then electrically connected to the PCB substrate through reflow soldering or curing processes.

4. The method for manufacturing a display panel according to claim 1, characterized in that, The diffusion film is an optical diffusion film containing diffusing particles.

5. The method for manufacturing a display panel according to claim 1, characterized in that, The external device panel is a touch screen glass or a transparent display cover.

6. A display panel, manufactured using the method described in any one of claims 1 to 5, characterized in that, The device includes a PCB substrate, on which a plurality of flip chips electrically connected to each other are disposed in a display area, the plurality of flip chips being arranged in a matrix; a diffusion film is disposed on the light-emitting side of the PCB substrate, which is directly bonded to the flip chips, and the diffusion film covers the display area; The PCB substrate has electronic components connected to its backlight side, and the flip chip and the diffusion film form a stack height of 230μm~310μm in a direction perpendicular to the PCB substrate.

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