A material overturning tin ball soldering device

Abstract

This invention discloses a material flipping solder ball soldering device, which includes a feeding unit, a flipping fixture unit, and a soldering unit. The flipping fixture unit includes a clamping mechanism, a first moving mechanism, a first flipping drive mechanism, and a second flipping drive mechanism. In use, firstly, the first flipping drive mechanism drives the suction member to rotate so that the suction hole faces downward. Then, the first moving mechanism drives the first flipping drive mechanism to move the clamping mechanism above the feeding unit. Then, the suction member of the clamping mechanism sucks up the material on the feeding unit through the suction hole. After sucking up the material, the second flipping drive mechanism drives the second end of the clamping member to rotate towards the suction hole of the suction member to form a clamping space to clamp the material. Then, the first moving mechanism drives the first flipping drive mechanism to move the clamping mechanism below the soldering unit to perform the soldering process. This avoids the problems of large layout and complex operation of the material flipping process in the prior art.

Description

Technical Field

[0001] This invention relates to the field of welding technology, and in particular to a material-turning solder ball welding device. Background Technology

[0002] In existing technologies, to automate solder ball soldering, a flipping fixture is first used to flip the material, and then a soldering fixture is used to fix the material for soldering. This creates two separate processes: material flipping and solder ball soldering. In practical applications, the material flipping process is usually completed by a robotic arm, resulting in a large layout and complex operations for this process. Summary of the Invention

[0003] This invention addresses the shortcomings of existing technologies by providing a material flipping solder ball soldering device, comprising a feeding unit, a flipping fixture unit, and a soldering unit;

[0004] The feeding unit includes at least one material carrier for carrying materials;

[0005] The flipping fixture unit includes a clamping mechanism, a first moving mechanism, a first flipping drive mechanism, and a second flipping drive mechanism. The clamping mechanism is mounted on the first flipping drive mechanism, which is mounted on the first moving mechanism. The first moving mechanism drives the first flipping drive mechanism to move the clamping mechanism above the feeding unit or below the welding unit. The clamping mechanism includes an adsorption element and a clamping element. The adsorption element has multiple suction holes for adsorbing the material. The first flipping drive mechanism drives the adsorption element to rotate so that the suction holes face downwards or upwards. The first end of the clamping element is rotatably connected to the adsorption element. The second flipping drive mechanism drives the second end of the clamping element to rotate towards the suction holes of the adsorption element to form a clamping space.

[0006] As a preferred embodiment, the first flipping drive mechanism includes a first flipping motor, the first flipping motor includes a first motor body and a first output shaft, the first motor body is fixedly connected to the first moving mechanism, and the adsorption member is fixedly connected to the first output shaft.

[0007] As a preferred embodiment, the second flipping drive mechanism includes a second flipping motor, the second flipping motor includes a second motor body and a second output shaft, the second motor body is fixedly connected to the adsorption member, the adsorption member is rotatably connected to the second output shaft, and the second end of the clamping member is fixedly connected to the output shaft of the second flipping motor.

[0008] As a preferred embodiment, the feeding unit further includes a rotating mechanism, and there are two material platforms, namely a first material platform and a second material platform. The first material platform and the second material platform are connected side by side to the rotating mechanism, and the rotating mechanism is used to drive the first material platform and the second material platform to rotate around the drive shaft of the rotating mechanism.

[0009] As a preferred embodiment, the feeding unit further includes a lifting drive mechanism, and the rotating mechanism is mounted on the lifting drive mechanism.

[0010] As a preferred embodiment, the feeding unit further includes a second moving mechanism, on which the lifting drive mechanism is mounted. The second moving mechanism is used to drive the lifting drive mechanism to move the rotating mechanism and the two material carriers horizontally.

[0011] As a preferred embodiment, the welding unit includes a welding nozzle, a welding nozzle driving mechanism, a shooting mechanism, and a control device; the shooting mechanism is used to photograph the material on the flipping fixture unit; the control device is configured as follows:

[0012] Based on the imaging results of the imaging mechanism, the offset information between the area of ​​the material to be welded and the welding nozzle is determined;

[0013] Based on the offset information, the welding nozzle driving mechanism is controlled to drive the welding nozzle to move to the target welding position.

[0014] As a preferred embodiment, the shooting mechanism includes a first camera and a second camera, wherein the shooting directions of the first camera and the second camera are perpendicular to each other;

[0015] The first camera is positioned above the flip drive unit to photograph the material;

[0016] The second camera is located to the side of the flip drive unit to photograph the material;

[0017] The control device is specifically configured as follows:

[0018] Based on the image captured by the first camera, determine the horizontal offset between the area of ​​the material to be welded and the welding nozzle;

[0019] Based on the image captured by the second camera, the vertical offset between the area of ​​the material to be welded and the welding nozzle is determined;

[0020] Based on the horizontal and vertical offsets, the welding nozzle driving mechanism is controlled to move the welding nozzle to the target welding position.

[0021] As a preferred embodiment, the welding unit further includes a mounting base and a camera mounting base. The welding nozzle driving mechanism includes a horizontal driving device and a vertical driving device. The horizontal driving device is mounted on the mounting base, the mounting base and the vertical driving device are mounted on the horizontal driving device, the shooting mechanism is mounted on the mounting base, and the welding nozzle is mounted on the vertical driving device.

[0022] As a preferred embodiment, the material flipping solder ball welding device further includes a base, and the feeding unit, the flipping fixture unit and the welding unit are all mounted on the base.

[0023] Compared to existing technologies, the material flipping solder ball soldering device of this invention includes a feeding unit, a flipping fixture unit, and a soldering unit. The flipping fixture unit includes a clamping mechanism, a first moving mechanism, a first flipping drive mechanism, and a second flipping drive mechanism. In use, firstly, the first flipping drive mechanism drives the suction member to rotate so that the suction hole faces downward. Then, the first moving mechanism drives the first flipping drive mechanism to move the clamping mechanism above the feeding unit. Next, the suction member of the clamping mechanism sucks up the material on the feeding unit through the suction hole. After sucking up the material, the second flipping drive mechanism drives the second end of the clamping member to rotate towards the suction hole of the suction member to form a clamping space to clamp the material. Then, the first moving mechanism drives the first flipping drive mechanism to move the clamping mechanism below the soldering unit to perform the soldering process. This invention achieves the material flipping process and material feeding by integrating the first and second flipping drive mechanisms with a suction method, avoiding the problems of large layout and complex operation of the material flipping process caused by the use of robotic arms in existing technologies. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the material flipping solder ball welding device in an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the clamping mechanism flipping in an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the clamping mechanism adsorbing material in an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram of the material after adsorption in an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the material being flipped in an embodiment of the present invention.

[0029] Figure 6 This is a schematic diagram of the photographed material in an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of the debugging of the welding unit in an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of the assembly between the material and the tray in an embodiment of the present invention.

[0032] The components are as follows: 1. Base; 2. Feeding slide tank chain; 3. Second moving mechanism; 4. Lifting drive mechanism; 5. First material platform; 6. First material tray; 7. Mounting base; 8. Clamping component; 9. First flipping drive mechanism; 10. Second camera; 11. Camera mounting base; 12. Welding unit; 13. Welding unit tank chain; 14. Welding nozzle drive mechanism; 15. Horizontal drive device; 16. Vertical drive device; 17. First camera; 18. Camera light source; 19. Shooting mechanism; 20. Welding nozzle; 21. Suction hole; 22. Adsorption component; 23. Flipping clamp unit; 24. Second material tray; 25. Second material platform; 26. Rotation mechanism; 27. Feeding unit; 28. First moving mechanism; 29. ​​Second flipping drive mechanism; 30. Material. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please see Figure 1 This is a schematic diagram of the material flipping solder ball welding device in an embodiment of the present invention.

[0035] The material flipping solder ball soldering device of this invention includes a feeding unit 27, a flipping fixture unit 23, and a soldering unit 12;

[0036] The feeding unit 27 includes at least one material carrier for carrying material 30;

[0037] The flipping clamp unit 23 includes a clamping mechanism, a first moving mechanism 28, a first flipping drive mechanism 9, and a second flipping drive mechanism 29. The clamping mechanism is installed on the first flipping drive mechanism 9, which is installed on the first moving mechanism 28. The first moving mechanism 28 drives the first flipping drive mechanism 9 to move the clamping mechanism above the feeding unit 27 or below the welding unit 12. The clamping mechanism includes an adsorption member 22 and a clamping member 8. The adsorption member 22 has multiple suction holes 21 for adsorbing the material 30. The first flipping drive mechanism 9 drives the adsorption member 22 to rotate so that the suction holes 21 face downwards or upwards. The first end of the clamping member 8 is rotatably connected to the adsorption member 22. The second flipping drive mechanism 29 drives the second end of the clamping member 8 to rotate towards the suction holes 21 of the adsorption member 22 to form a clamping space.

[0038] In this embodiment of the invention, when using the material flipping solder ball soldering device, firstly, the first flipping drive mechanism 9 drives the adsorption member 22 to rotate until the suction hole 21 faces downwards. Then, the first moving mechanism 28 drives the first flipping drive mechanism 9 to move the clamping mechanism above the feeding unit 27. Next, the adsorption member 22 of the clamping mechanism sucks up the material 30 from the feeding unit 27 through the suction hole 21. After sucking up the material 30, the second flipping drive mechanism 29 drives the second end of the clamping member 8 to rotate towards the suction hole 21 of the adsorption member 22, forming a clamping space to clamp the material 30. Then, the first moving mechanism 28 drives the first flipping drive mechanism 9 to move the clamping mechanism below the soldering unit 12 to perform the soldering process. This embodiment of the invention achieves the material flipping process and material 30 feeding by combining the integrated first flipping drive mechanism 9 and the second flipping drive mechanism 29 with an adsorption method, avoiding the problems of large layout and complex movements in the material flipping process caused by the use of robotic arms in the prior art.

[0039] In specific implementations, the adsorption element 22 is equipped with a vacuum device, such as a vacuum pump, which provides adsorption force so that the suction hole 21 adsorbs the material 30. In this embodiment of the invention, the material 30 is, for example, a magnetic head or a chip assembly; please refer to [reference needed]. Figure 8 A1 is the micro-magnetic head or chip to be mounted, and A2 is the micro-magnetic head or chip circuit board or other fixing device. B is the tray for placing material 30. This invention takes the placement of 10 materials 30 as an example. Before this curing process, A1 and A2 have been cured with adhesive. The areas to be welded are the adjacent rows on the back of material 30.

[0040] In a specific implementation, the first flipping drive mechanism 9 includes a first flipping motor, which includes a first motor body and a first output shaft. The first motor body is fixedly connected to the first moving mechanism 28, and the adsorption member 22 is fixedly connected to the first output shaft.

[0041] In a specific implementation, the second flipping drive mechanism 29 includes a second flipping motor, which includes a second motor body and a second output shaft. The second motor body is fixedly connected to the adsorption member 22, and the adsorption member 22 is rotatably connected to the second output shaft. The second end of the clamping member 8 is fixedly connected to the output shaft of the second flipping motor.

[0042] Combination Figure 1 The feeding unit 27 further includes a rotating mechanism 26. There are two material platforms, namely a first material platform 5 and a second material platform 25. The first material platform 5 and the second material platform 25 are connected side by side to the rotating mechanism 26. The rotating mechanism 26 is used to drive the first material platform 5 and the second material platform 25 to rotate around the drive shaft of the rotating mechanism 26.

[0043] Combination Figure 1 The feeding unit 27 further includes a lifting drive mechanism 4, and the rotating mechanism 26 is mounted on the lifting drive mechanism 4. In specific implementations, the lifting drive mechanism 4 can be implemented, for example, by using a motor combined with a lifting slide.

[0044] Combination Figure 1 The feeding unit 27 further includes a second moving mechanism 3, and the lifting drive mechanism 4 is mounted on the second moving mechanism 3. The second moving mechanism 3 is used to drive the lifting drive mechanism 4 to move the rotating mechanism 26 and the two material carriers horizontally.

[0045] In practical implementation, the second moving mechanism 3 enables the horizontal movement of the material platform, facilitating automated material feeding and simplifying device installation and debugging. Specifically, the second moving mechanism 3 can be, for example, a tank chain mechanism. Figure 1 In the middle, horizontal movement can be achieved through the feeding slide tank chain 2.

[0046] Combination Figure 1 The welding unit 12 includes a welding nozzle 20, a welding nozzle 20 drive mechanism 14, a shooting mechanism 19, and a control device (not shown in the figure); the shooting mechanism 19 is used to photograph the material 30 on the flipping fixture unit 23; the control device is configured as follows:

[0047] Based on the imaging results of the imaging mechanism 19, the offset information between the area to be welded of the material 30 and the welding nozzle 20 is determined;

[0048] Based on the offset information, the welding nozzle 20 driving mechanism 14 is controlled to drive the welding nozzle 20 to move to the target welding position.

[0049] In related technologies, the two sets of fixtures for material 30 flipping and solder ball soldering need to be adjusted separately, resulting in low adjustment efficiency and high cost for both sets of fixtures. However, this embodiment of the invention utilizes an imaging mechanism 19 to capture images of the offset between the area to be soldered on the material 30 and the soldering nozzle 20. This allows for adjustment of the soldering nozzle 20 position based on the offset, eliminating the need to adjust the material 30 flipping fixture, effectively improving adjustment efficiency and reducing costs. Furthermore, in specific implementations, the imaging accuracy can be improved by adding a light source, for example... Figure 1 The camera uses a light source 18 to improve the shooting environment and thus improve shooting accuracy.

[0050] Combination Figure 1 The shooting mechanism 19 includes a first camera 17 and a second camera 10, and the shooting directions of the first camera 17 and the second camera 10 are perpendicular to each other;

[0051] The first camera 17 is positioned above the flip drive unit to photograph the material 30;

[0052] The second camera 10 is located to the side of the flip drive unit to photograph the material 30;

[0053] The control device is specifically configured as follows:

[0054] Based on the shooting results of the first camera 17, the horizontal offset between the area to be welded of the material 30 and the welding nozzle 20 is determined;

[0055] Based on the shooting results of the second camera 10, the vertical offset between the area to be welded of the material 30 and the welding nozzle 20 is determined;

[0056] Based on the horizontal and vertical offsets, the welding nozzle 20 driving mechanism 14 is controlled to drive the welding nozzle 20 to move to the target welding position.

[0057] In this embodiment of the invention, a first camera 17 takes a top-down view of the material 30 to obtain the horizontal offset between the area to be welded on the material 30 and the welding nozzle 20, and a second camera 10 takes a height view from the side of the material 30 to obtain the vertical offset between the area to be welded on the material 30 and the welding nozzle 20. Based on the horizontal and vertical offsets, the welding nozzle 20 driving mechanism 14 can be controlled to move the welding nozzle 20 to the target welding position for welding, thereby achieving precise welding.

[0058] Combination Figure 1 The welding unit 12 further includes a mounting base 7 and a camera mounting base 11. The welding nozzle 20 driving mechanism 14 includes a horizontal driving device 15 and a vertical driving device 16. The horizontal driving device 15 is mounted on the mounting base 7. The mounting base and the vertical driving device 16 are mounted on the horizontal driving device 15. The shooting mechanism 19 is mounted on the mounting base. The welding nozzle 20 is mounted on the vertical driving device 16.

[0059] In specific implementations, the horizontal drive device 15 can, for example, be a motor-driven tank chain, such as... Figure 1 As shown, the tank chain of welding unit 12 can move horizontally.

[0060] Combination Figure 1 The material flipping solder ball welding device also includes a base 1, and the feeding unit 27, the flipping clamp unit 23 and the welding unit 12 are all installed on the base 1.

[0061] The following, with reference to the accompanying drawings, illustrates the usage of the material flipping solder ball soldering device according to an embodiment of the present invention:

[0062] Step 1, as follows Figure 2 When material 30 needs to be fed for welding, the operator places the first material tray 6 and the second material tray 24 onto the first material platform 5 and the second material platform 25 respectively. Then, the clamping mechanism rotates about 220° so that the suction hole 21 of the clamping mechanism is parallel to the horizontal plane.

[0063] Step two, the first moving mechanism 28 drives the clamping mechanism to move directly above the second material tray 24, as follows. Figure 3 In this state, the lifting drive mechanism 4 is activated, causing the material 30 in the second material tray 24 to approach the suction hole 21 on the clamping mechanism. Under the action of vacuum, the suction hole 21 sucks up the 10 materials 30 in the second material tray 24.

[0064] Step 3: After the 10 materials 30 in the second material tray 24 are picked up by the clamping mechanism, the first moving mechanism 28 reverses, and the lifting drive mechanism 4 drives the material platform to descend, separating the materials 30 from the second material tray 24. The first moving mechanism 28 then moves the clamping mechanism away from the feeding unit 27. Figure 4 As shown.

[0065] Step four: The clamping mechanism rotates 220°, thereby flipping material 30 so that its back side faces up. Figure 5 As shown.

[0066] Step five: When the back of material 30 is facing upwards, the second flipping drive mechanism 29 actuates, thereby pressing material 30 onto the suction hole 21 of the adsorption member 22 via the clamping member 8. After material 30 is fixed, the first moving mechanism 28 moves the area on the back of material 30 that needs to be welded to a position directly below the first camera 17 for X and Y direction photography, in order to perform X and Y direction positioning compensation calculations, such as... Figure 6 As shown, the second camera 10 also takes pictures at the same time to perform height compensation calculation in the Z direction, and finally calculates the position where the material 30 needs to be welded.

[0067] Step six, as follows Figure 7 As shown, the horizontal drive device 15 and the vertical drive device 16 of the welding unit 12 move to move the welding nozzle 20 to the position area to be welded calculated by the camera. Under the action of laser and nitrogen, the solder ball is sprayed from the inside of the welding nozzle 20 into the area to be welded of the material 30, and the two rows on the material 30 are welded and connected.

[0068] Similarly, the nine materials 30 on the second tray 24 undergo the same XYZ orientation positioning calculations as steps five and six above, followed by corresponding solder ball soldering. Once all ten materials 30 on the second tray 24 have completed solder ball soldering, the materials 30 are unloaded onto the second tray 24 following the reverse process described above. At this point, the rotating mechanism 26 can be used to rotate the materials 30 on the first tray 6 to directly below the clamping mechanism, and then perform the corresponding flipping and solder ball soldering as described above.

[0069] Compared to existing technologies, the material flipping solder ball soldering device of this invention includes a feeding unit 27, a flipping clamping unit 23, and a soldering unit 12. The flipping clamping unit 23 includes a clamping mechanism, a first moving mechanism 28, a first flipping drive mechanism 9, and a second flipping drive mechanism 29. In use, firstly, the first flipping drive mechanism 9 drives the adsorption member 22 to rotate so that the suction hole 21 faces downward. Then, the first moving mechanism 28 drives the first flipping drive mechanism 9 to move the clamping mechanism above the feeding unit 27. Then, the adsorption member 22 of the clamping mechanism picks up the material 30 on the feeding unit 27 through the suction hole 21. After picking up the material 30, the second flipping drive mechanism 29 drives the second end of the clamping member 8 to rotate toward the suction hole 21 of the adsorption member 22 to form a clamping space to clamp the material 30. Then, the first moving mechanism 28 drives the first flipping drive mechanism 9 to move the clamping mechanism below the soldering unit 12 to perform the soldering process. The embodiments of the present invention achieve the material flipping process and material 30 feeding by combining the integrated first flipping drive mechanism 9 and the second flipping drive mechanism 29 with the adsorption method, avoiding the problems of large layout and complex operation of the material flipping process caused by the use of robotic arms to complete the material flipping process in the prior art.

[0070] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A material flip tin ball bonding apparatus, characterized by, Includes a feeding unit, a flipping fixture unit, and a welding unit; The feeding unit includes at least one material carrier for carrying materials; The flipping fixture unit includes a clamping mechanism, a first moving mechanism, a first flipping drive mechanism, and a second flipping drive mechanism. The clamping mechanism is mounted on the first flipping drive mechanism, which is mounted on the first moving mechanism. The first moving mechanism drives the first flipping drive mechanism to move the clamping mechanism above the feeding unit or below the welding unit. The clamping mechanism includes an adsorption element and a clamping element. The adsorption element has multiple suction holes for adsorbing the material. The first flipping drive mechanism drives the adsorption element to rotate so that the suction holes face downwards or upwards. The first end of the clamping element is rotatably connected to the adsorption element. The second flipping drive mechanism drives the second end of the clamping element to rotate towards the suction holes of the adsorption element to form a clamping space.

2. The material flip chip ball bonding apparatus of claim 1, wherein, The first flipping drive mechanism includes a first flipping motor, which includes a first motor body and a first output shaft. The first motor body is fixedly connected to the first moving mechanism, and the adsorption member is fixedly connected to the first output shaft.

3. The material flip chip ball bonding apparatus of claim 2, wherein, The second flipping drive mechanism includes a second flipping motor, which includes a second motor body and a second output shaft. The second motor body is fixedly connected to the adsorption member, the adsorption member is rotatably connected to the second output shaft, and the second end of the clamping member is fixedly connected to the output shaft of the second flipping motor.

4. The material flip chip ball bonding apparatus of claim 1, wherein, The feeding unit also includes a rotating mechanism. There are two material platforms, namely a first material platform and a second material platform. The first material platform and the second material platform are connected side by side to the rotating mechanism. The rotating mechanism is used to drive the first material platform and the second material platform to rotate around the drive shaft of the rotating mechanism.

5. The material flip chip ball bonding apparatus of claim 4, wherein, The feeding unit also includes a lifting drive mechanism, and the rotating mechanism is mounted on the lifting drive mechanism.

6. The material flip chip ball bonding apparatus of claim 5, wherein, The feeding unit also includes a second moving mechanism, on which the lifting drive mechanism is mounted. The second moving mechanism is used to drive the lifting drive mechanism to move the rotating mechanism and the two material carriers horizontally.

7. The material flip chip ball bonding apparatus of claim 1, wherein, The welding unit includes a welding nozzle, a welding nozzle driving mechanism, a photographing mechanism, and a control device; the photographing mechanism is used to photograph the material on the flipping fixture unit; the control device is configured to: Based on the imaging results of the imaging mechanism, the offset information between the area of ​​the material to be welded and the welding nozzle is determined; Based on the offset information, the welding nozzle driving mechanism is controlled to drive the welding nozzle to move to the target welding position.

8. The material flip chip ball bonding apparatus of claim 7, wherein, The shooting mechanism includes a first camera and a second camera, and the shooting directions of the first camera and the second camera are perpendicular to each other; The first camera is positioned above the flip drive unit to photograph the material; The second camera is located to the side of the flip drive unit to photograph the material; The control device is specifically configured as follows: Based on the image captured by the first camera, determine the horizontal offset between the area of ​​the material to be welded and the welding nozzle; Based on the image captured by the second camera, the vertical offset between the area of ​​the material to be welded and the welding nozzle is determined; Based on the horizontal and vertical offsets, the welding nozzle driving mechanism is controlled to move the welding nozzle to the target welding position.

9. The material flip chip ball bonding apparatus of claim 7, wherein, The welding unit further includes a mounting base and a camera mounting base. The welding nozzle driving mechanism includes a horizontal driving device and a vertical driving device. The horizontal driving device is mounted on the mounting base. The mounting base and the vertical driving device are mounted on the horizontal driving device. The shooting mechanism is mounted on the mounting base. The welding nozzle is mounted on the vertical driving device.

10. The material flip chip ball bonding apparatus according to any one of claims 1 to 9, wherein The material flipping solder ball welding device also includes a base, and the feeding unit, the flipping fixture unit and the welding unit are all mounted on the base.

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