Calibration method and calibration system of mechanical arm, electronic device, and storage medium

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By setting a reference structure and a detection mechanism in the loading device, the offset of the robotic arm is automatically detected and adjusted, which solves the problem of low accuracy of robotic arm calibration caused by manual observation and achieves efficient and accurate robotic arm calibration.

CN122299602APending Publication Date: 2026-06-30SHANGHAI OPTICAL COMMUNICATIONS CORP

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner: SHANGHAI OPTICAL COMMUNICATIONS CORP
Filing Date: 2024-12-20
Publication Date: 2026-06-30

AI Technical Summary

Technical Problem

In existing technologies, the positioning and calibration of robotic arms mainly rely on manual observation, which has low accuracy and low efficiency, affecting production efficiency.

Method used

A reference structure is set in the loading device as the reference position. The robotic arm moves the wafer and the detection mechanism detects the offset of the actual position relative to the reference position. The robotic arm is calibrated based on the offset, including detecting the offset of the actual position of the wafer projected onto the reference position, the offset angle, and the height offset. The position of the robotic arm is automatically adjusted by the adjustment mechanism.

Benefits of technology

Eliminating the need for manual observation improves the accuracy and efficiency of robotic arm calibration, reduces the difficulty of judging the precision of robotic arm transfer, and ensures accurate positioning of the wafer.

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Abstract

The application relates to a mechanical arm calibration method, a calibration system, an electronic device and a storage medium. The mechanical arm calibration method comprises the following steps: loading a plurality of wafer accommodating spaces arranged in sequence in a device, arranging a reference structure in at least one wafer accommodating space, and setting a position of one of the reference structures as a reference position; moving a wafer to an idle wafer accommodating space in the device by using a mechanical arm; detecting an offset of an actual position of the wafer relative to the reference position; and calibrating the mechanical arm according to the offset. The offset of the actual position of the wafer relative to the reference position is detected, and the offset of the actual position of the wafer relative to the reference position when the actual position of the wafer is orthogonally projected to a reference surface where the reference position is located is detected. The wafer position is observed by using the naked eye to determine the moving accuracy of the mechanical arm, the difficulty of determining the moving accuracy of the mechanical arm is reduced, the detection accuracy is improved, and the mechanical arm is calibrated conveniently.

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