An IC carrier automatic board receiving and releasing cleaning streamline

Abstract

The application belongs to the technical field of PCB processing, and particularly relates to an IC carrier plate automatic plate receiving and releasing cleaning flow line, which comprises a plate feeding machine, a cleaning flow line and a plate discharging machine arranged in sequence, a pair of carrier backflow lines are arranged in parallel between the top of the plate feeding machine and the plate discharging machine, the conveying direction of the carrier backflow lines is opposite to that of the cleaning flow line, a pair of plate feeding flow lines are horizontally arranged in the plate feeding machine, and a pair of plate discharging flow lines are horizontally arranged in the plate discharging machine. The application has the beneficial effect that the plate feeding machine, the cleaning flow line, the plate discharging machine and the reversely running carrier backflow lines form a closed loop circulation system, combined with a jacking mechanism, a carrier plate feeding and discharging mechanism, a carrier carrying mechanism and a plate receiving and releasing mechanism, the separation and combination of the IC carrier plate and the carrier, the automatic backflow stacking of the carrier and the continuous conveying of the IC carrier plate in the cleaning flow line can be automatically completed; manual intervention is not needed, the production rhythm and the equipment utilization rate are effectively improved, and the cleaning efficiency of the IC carrier plate is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, specifically to an automatic IC carrier board handling and cleaning line. Background Technology

[0002] IC substrates (IC packaging substrates) are critical substrates in the semiconductor packaging and testing process, and their surface cleanliness directly affects the packaging yield and reliability of chips. During processes such as drilling, electroplating, and layer addition on IC substrates, submicron-level contaminants such as metal debris, oil, and dust can easily remain on the surface, necessitating efficient cleaning. Simultaneously, the specialized carriers used to support the IC substrates (typically thin, high-temperature resistant materials) also need to be cleaned and reused, and the cleaning process must avoid scratching the circuit board.

[0003] For example, the PCB board washing machine disclosed in CN216174928U includes a feeding device and a surface cleaning device; the feeding device includes a platform and a board conveying module. Since each adsorption roller has a suction hole, when the board needs to be fed, the board is placed between the adsorption roller and the sliding roller. The motor drives the adsorption roller to rotate via a sliding belt. When the suction hole rotates to the position aligned with the board, the adsorption roller will adsorb the board through the suction hole. As the adsorption roller continues to rotate, the board is conveyed. The suction hole can prevent the board from shifting position during the conveying process, ensuring the surface cleanliness of the board afterward. The board conveying module includes a lifting cylinder and a lifting platform. The lifting cylinder can output power to drive the lifting platform to move up and down, adjusting the distance between the sliding roller and the adsorption roller within the lifting platform, thus accommodating boards of different thicknesses.

[0004] However, the board loading and unloading processes of the aforementioned cleaning equipment mostly rely on manual labor to place IC carrier boards into or remove them from the carriers, which is inefficient, labor-intensive, and prone to contamination and scratches. Furthermore, after cleaning, the carriers need to be manually transported back to the loading end, which cannot form a closed-loop circulation flow line, resulting in a large equipment footprint and inconsistent production rhythm. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of low efficiency and difficulty in achieving automatic carrier return in existing cleaning lines that rely on manual loading and unloading of plates.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An automated IC carrier board handling and cleaning production line includes a board loading machine, a cleaning line, and a board unloading machine arranged sequentially. A pair of carrier return lines are parallel to each other between the tops of the board loading machine and the board unloading machine, and the transport direction of the carrier return lines is opposite to that of the cleaning line. A pair of board loading lines and a pair of board unloading lines are horizontally arranged inside the board loading machine and the board unloading machine, respectively. Several carriers are arranged on the top of the board loading and unloading lines. A board handling mechanism is provided at the end of each board loading and unloading line away from the cleaning line. The board loading and unloading lines face the cleaning line... The end is provided with a transition flow line. A lifting mechanism is provided on the lower side of the middle of the upper plate flow line and the lower plate flow line. A carrier loading and unloading mechanism is provided on the side of the lifting mechanism. A carrier transport mechanism is provided on the side of the lifting mechanism away from the carrier loading and unloading mechanism. The loading and unloading mechanism includes a pair of material rack buffer bins. A first flow line is provided at the bottom of the material rack buffer bin. A plurality of material racks are provided inside the first flow line. A first lifting module is provided on the side of the material rack buffer bin facing the cleaning flow line. A top platform is fixedly connected to the lifting platform of the first lifting module. A second flow line is provided on the top of the top platform.

[0008] Furthermore, a support frame is fixedly connected between the pair of material rack buffer bins. A third lifting module is provided at the bottom of the support frame. A fixed plate is fixedly connected to the top edge of the support frame away from the cleaning flow line. A push plate cylinder is fixedly connected to the top of the outer wall of the fixed plate. A top head is fixedly connected to the piston rod of the push plate cylinder. A pair of stop bars are provided on the side of the material rack away from the cleaning flow line. A first linear module is provided at the top of the pair of support frames. A second lifting module is fixedly connected to the moving platform of the first linear module. A material rack clamping cylinder is fixedly connected to the lifting platform of the second lifting module. A pair of clamping plates are fixedly connected to the output end of the material rack clamping cylinder.

[0009] Furthermore, the lifting mechanism includes a first lifting cylinder, the piston rod of the first lifting cylinder is fixedly connected to a first lifting frame, a plurality of first ejector pins are vertically fixedly connected to the four corners of the top of the first lifting frame, a second lifting cylinder is fixedly connected to the top of the side wall of the first lifting cylinder, the piston rod of the second lifting cylinder is fixedly connected to a second lifting frame, a plurality of second ejector pins are vertically fixedly connected to the top of the second lifting frame, and the second lifting frame is located inside the first lifting frame.

[0010] Furthermore, the carrier includes a base plate, the top of which is detachably provided with a cover plate, the cover plate being shaped like an "U". The bottom of the base plate has several bottom holes, the positions of which match the first ejector pin.

[0011] Furthermore, the vehicle upper and lower plate mechanism includes a mounting frame, a second linear module is fixedly connected to the top of the mounting frame, a movable frame is fixedly connected to the moving platform of the second linear module, a fourth lifting module is vertically arranged on the top of the movable frame, a suction cup is fixedly connected to the lifting platform of the fourth lifting module, two pairs of cover plate clamping cylinders are symmetrically fixedly connected to the bottom sides of the movable frame, the piston rod of the cover plate clamping cylinder is fixedly connected to a gripper, and the shape and size of the suction cup match the cover plate.

[0012] Furthermore, the vehicle transport mechanism includes a fifth lifting module, the lifting platform of the fifth lifting module is fixedly connected to a transport frame, the top of the transport frame is provided with a third linear module, and the moving platform of the third linear module is fixedly connected to a movable claw.

[0013] Furthermore, the vehicle return line includes a vehicle conveyor flow line, with a pair of baffles symmetrically arranged on both sides of the vehicle conveyor flow line. A cover is provided on the outside of the vehicle conveyor flow line, and receiving flow lines are connected to both ends of the vehicle conveyor flow line. A pair of slots are opened on the side wall of the receiving flow line facing the fifth lifting module. A pair of pushing cylinders are fixedly connected to the side wall of the receiving flow line away from the fifth lifting module. A pushing block is fixedly connected to the piston rod of the pushing cylinder. A vehicle buffer compartment is fixedly connected to the bottom of the receiving flow line, and several baffles are symmetrically fixedly connected to the inner side wall of the vehicle buffer compartment.

[0014] Furthermore, the transition streamline includes a fourth straight module, the movable stage of the fourth straight module is fixedly connected to the movable streamline, and a pair of branch lines are provided on the side of the movable streamline facing the clean streamline.

[0015] Furthermore, the unloading machine is equipped with a buffer mechanism, which is located between the transition flow line and the unloading flow line. The buffer mechanism includes a sixth lifting module, and the lifting platform of the sixth lifting module is fixedly connected to a lifting buffer chamber. Several buffer flow lines are arranged in parallel inside the lifting buffer chamber.

[0016] Furthermore, both the upper and lower flow lines are equipped with scanning mechanisms on their sides. Each scanning mechanism includes a mounting rod, an adjustment frame is detachably connected to the top of the mounting rod, and a barcode scanner is fixedly connected to the movable end of the adjustment frame.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] 1. The present invention provides an automatic IC carrier board cleaning and take-up line, which forms a closed-loop circulation system through a board loading machine, a cleaning line, a board unloading machine, and a reverse-running carrier return line. Combined with a lifting mechanism, a carrier loading and unloading mechanism, a carrier transport mechanism, and a board taking-up and take-up mechanism, it can automatically complete the separation and combination of IC carrier boards and carriers, the automatic return stacking of carriers, and the continuous conveying of IC carrier boards in the cleaning line; no manual intervention is required, which effectively improves the production cycle and equipment utilization rate, thereby improving the cleaning efficiency of IC carrier boards.

[0019] 2. The present invention provides an automated IC carrier board handling and cleaning process. During the automated handling process, a precision positioning and clamping mechanism (such as a suction cup, gripper, ejector pin, pusher cylinder, etc.) is used to transport the IC carrier board and the carrier. This improves the positioning accuracy of the IC carrier board and the carrier, and reduces scratches, contamination, or board offset caused by manual operation. At the same time, a barcode scanning mechanism can trace the information of each carrier or IC carrier board, and a buffer mechanism and transition flow line can achieve smooth connection and temporary storage of products of multiple specifications, ensuring the consistency and traceability of the cleaning process, thereby effectively improving the cleaning effect of the IC carrier board and the final packaging yield. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of an automatic IC carrier board loading and unloading board cleaning process according to the present invention.

[0021] Figure 2 This is a schematic diagram of the internal structure of an automatic IC carrier board loading and unloading board cleaning process according to the present invention.

[0022] Figure 3 This is a schematic diagram of the internal structure of an automatic IC carrier board receiving and cleaning line machine according to the present invention.

[0023] Figure 4 This is a schematic diagram of the internal structure of an IC carrier board automatic take-up and take-up board cleaning process de-boarding machine according to the present invention.

[0024] Figure 5 This is a schematic diagram of the internal structure of an IC carrier automatic take-up and take-down board cleaning conveyor return line according to the present invention.

[0025] Figure 6 This is a schematic diagram of an automatic IC carrier board take-up and take-up cleaning streamline take-up and take-up mechanism according to the present invention.

[0026] Figure 7 This is a schematic diagram of a pusher cylinder structure for an automatic IC carrier board loading and unloading cleaning process according to the present invention.

[0027] Figure 8 This is a schematic diagram of the upper and lower plate structure of an automated IC carrier loading and unloading board cleaning streamline carrier according to the present invention.

[0028] Figure 9 This is a schematic diagram of an automatic IC carrier board loading and unloading board cleaning streamline lifting mechanism according to the present invention.

[0029] Figure 10 This is a schematic diagram of an automated IC carrier loading and unloading, cleaning, and transport mechanism according to the present invention.

[0030] Figure 11 This is a schematic diagram of the transition streamline structure of the automatic IC carrier board loading and unloading board cleaning process according to the present invention.

[0031] Figure 12 This is a schematic diagram of an automatic IC carrier board loading and unloading board cleaning streamline buffer mechanism according to the present invention.

[0032] Figure 13 This is a schematic diagram of an automatic IC carrier board take-up and take-up board cleaning streamline scanning mechanism according to the present invention.

[0033] In the diagram: 1. Loading machine; 2. Cleaning line; 3. Unloading machine; 4. Carrier return line; 401. Carrier conveying line; 402. Stopper; 5. Loading line; 6. Unloading line; 7. Loading and unloading mechanism; 701. Material rack buffer; 702. Unloading rack; 703. First line; 704. First lifting module; 705. First linear module; 706. Second lifting module; 707. Material rack clamping cylinder; 708. Clamping plate 709. Top platform; 710. Second streamline; 711. Support frame; 712. Third lifting module; 713. Fixed plate; 714. Push plate cylinder; 715. Stop bar; 8. Carrier upper and lower plate mechanism; 801. Mounting frame; 802. Second linear module; 803. Movable frame; 804. Fourth lifting module; 805. Cover plate clamping cylinder; 806. Gripper; 807. Suction cup; 9. Lifting mechanism; 901. First lifting mechanism 902. Cylinder; 903. First lifting frame; 904. First ejector pin; 905. Second lifting cylinder; 906. Second lifting frame; 907. Second ejector pin; 10. Carrier transport mechanism; 1001. Fifth lifting module; 1002. Transport frame; 1003. Third linear module; 1004. Movable claw; 1005. Material receiving flow line; 1006. Slotting; 1007. Pushing cylinder; 1008. Carrier buffer bin; 1009. 11. Stop bar; 12. Transition flow line; 13. Fourth straight line module; 14. Flow line; 15. Diverter line; 16. Buffer mechanism; 17. Sixth lifting module; 18. Lifting buffer compartment; 19. Buffer flow line; 10. Barcode scanning mechanism; 11. Mounting rod; 12. Adjustment frame; 13. Barcode scanner; 14. Carrier; 15. Base plate; 16. Bottom hole; 17. Cover plate. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please see Figure 1-13This embodiment of an automatic IC carrier board loading and unloading cleaning production line includes a loading machine 1, a cleaning production line 2, and a unloading machine 3 arranged sequentially, respectively used for loading, cleaning, and unloading IC carrier boards. A pair of carrier return lines 4 are arranged parallel to each other between the tops of the loading machine 1 and the unloading machine 3. The carrier return lines 4 are in the opposite direction to the conveying direction of the cleaning production line 2. A pair of loading lines 5 are arranged horizontally inside the loading machine 1, and a pair of unloading lines 6 are arranged horizontally inside the unloading machine 3. Several carriers 14 are arranged on the top of the loading lines 5 and the unloading lines 6. Both the upper and lower flow lines 5 and 6 are equipped with a tray loading / unloading mechanism 7 at the end away from the cleaning flow line 2, for automatically loading and unloading IC carrier boards. A transition flow line 11 is provided at the end of the upper and lower flow lines 5 and 6 facing the cleaning flow line 2. A lifting mechanism 9 is provided on the lower side of the middle of both the upper and lower flow lines 5 and 6. A carrier loading / unloading mechanism 8 is provided on the side of the lifting mechanism 9. A carrier transport mechanism 10 is provided on the side of the lifting mechanism 9 away from the carrier loading / unloading mechanism 8. The tray loading / unloading mechanism 7 includes a pair of rack buffer bins 701, with the bottom of the rack buffer bins 701... A first flow line 703 is provided, and several material racks 702 are arranged inside the first flow line 703. A first lifting module 704 is arranged on the side of the material rack buffer bin 701 facing the cleaning flow line 2. The lifting platform of the first lifting module 704 is fixedly connected to a top platform 709. A second flow line 710 is arranged on the top of the top platform 709. A support frame 711 is fixedly connected between a pair of material rack buffer bins 701. A third lifting module 712 is arranged at the bottom of the support frame 711. A fixing plate is fixedly connected to the top edge of the support frame 711 on the side away from the cleaning flow line 2. 713, a push plate cylinder 714 is fixedly connected to the top of the outer wall of the fixed plate 713, and a top head is fixedly connected to the piston rod of the push plate cylinder 714. A pair of stop bars 715 are provided on the side of the material rack 702 away from the cleaning flow line 2. A first linear module 705 is provided on the top of a pair of support frames 711. A second lifting module 706 is fixedly connected to the moving platform of the first linear module 705. A material rack clamping cylinder 707 is fixedly connected to the lifting platform of the second lifting module 706. A pair of clamping plates 708 are fixedly connected to the output end of the material rack clamping cylinder 707.During cleaning, the loading conveyor 5 in the loading machine 1 transports the carrier 14 to the lifting mechanism 9. The lifting mechanism 9 lifts the carrier 14, and the carrier loading / unloading mechanism 8 opens the cover and places the IC carrier board inside. Subsequently, the carrier 14 is sent to the cleaning conveyor 2 via the transition conveyor 11 for cleaning. After cleaning, the carrier 14 enters the unloading conveyor 6 of the unloading machine 3. The lifting mechanism 9 lifts it again, and the carrier loading / unloading mechanism 8 removes the IC carrier board. The empty carrier 14 is transferred to the carrier return conveyor via the carrier transport mechanism 10. Line 4 reverses the flow back to the top of the upper platen machine 1, achieving a closed-loop cycle. When the upper platen machine 1 is loading materials, the fully loaded unloading rack 702 flows into the upper platen machine 1 along the inlet and stacks on the first flow line 703 in the rack buffer bin 701. The first flow line 703 transports the unloading rack 702 to the second flow line 710 at the top of the top platform 709. At this time, the first lifting module 704 drives the top platform 709 to rise, causing the unloading rack 702 to move upward synchronously until the top unloading rack 702 is transported. The material rack is moved to the top of the material rack buffer 701. At this time, the first linear module 705 and the second lifting module 706 drive the material rack clamping cylinder 707 to move, and the clamping plate 708 clamps the material rack 702, placing the material rack 702 with its opening facing the upper plate streamline 5 on the lifting platform of the third lifting module 712. Then, the third lifting module 712 drives the material rack 702 to move downward, so that the IC carrier board inside it passes through the push plate cylinder 714 from bottom to top. At step 714, the pusher cylinder 714 drives the top head to push the IC carrier board out of the unloading rack 702, so that it flows to the upper board flow line 5, realizing the automatic unloading of the IC carrier board; after cleaning, the unloading machine 3's unloading mechanism 7 repeats the above steps in reverse, realizing the automatic unloading of the IC carrier board; through the above steps, the entire process of IC carrier board loading, cleaning to unloading is automated, the carrier 14 automatically returns without manual handling, greatly improving production efficiency and reducing equipment footprint.

[0036] The lifting mechanism 9 includes a first lifting cylinder 901, the piston rod of which is fixedly connected to a first lifting frame 902. Several first ejector pins 903 are vertically fixedly connected to the four corners of the top of the first lifting frame 902. A second lifting cylinder 904 is fixedly connected to the top of the side wall of the first lifting cylinder 901. A second lifting frame 905 is fixedly connected to the piston rod of the second lifting cylinder 904. Several second ejector pins 903 are vertically fixedly connected to the top of the second lifting frame 905. The ejector pin 906 and the second lifting frame 905 are located inside the first lifting frame 902; the carrier 14 includes a base plate 1401, and a cover plate 1403 is detachably provided on the top of the base plate 1401. The cover plate 1403 is shaped like an "mouth". Several bottom holes 1402 are opened at the bottom of the base plate 1401. The position of the bottom holes 1402 matches the first ejector pin 903; a material blocking cylinder is provided on the side of the lifting mechanism 9 facing the conveying direction of the upper plate flow line 5 and the lower plate flow line 6. When the carrier 14 is transported to the top of the lifting mechanism 9 by the carrier transport mechanism 10, the second lifting cylinder 904 drives the second lifting frame 905 to rise, and the second ejector pin 906 lifts the base plate 1401 to a certain height, which facilitates the receiving and positioning of the carrier 14. When the IC carrier is being moved in and out, the blocking cylinder blocks the carrier 14, the first lifting cylinder 901 drives the first lifting frame 902 to rise, and the first ejector pin 903 inserts into the bottom hole 1402 to lift the cover plate 1403. The two-stage lifting structure achieves precise control of the two actions of overall positioning of the carrier 14 and separation of the cover plate 1403, avoiding mechanical collision damage to the carrier 14 and the IC carrier, and improving positioning accuracy and operational reliability.

[0037] The vehicle upper and lower plate mechanism 8 includes a mounting frame 801. A second linear module 802 is fixedly connected to the top of the mounting frame 801. A movable frame 803 is fixedly connected to the movable platform of the second linear module 802. A fourth lifting module 804 is vertically arranged on the top of the movable frame 803. A suction cup 807 is fixedly connected to the lifting platform of the fourth lifting module 804. Two pairs of cover plate clamping cylinders 805 are symmetrically fixedly connected to both sides of the bottom of the movable frame 803. A gripper 806 is fixedly connected to the piston rod of the cover plate clamping cylinder 805. The shape and size of the suction cup 807 match the cover plate 1403. When the IC carrier board is placed, it moves along the upper board streamline 5 to the side of the lifting mechanism 9. The second linear module 802 first drives the movable frame 803 to move above the lifting mechanism 9 in the middle of the upper board streamline 5. At this time, the lifting mechanism 9 lifts the cover plate 1403 of the carrier 14 between the grippers 806. The cover plate clamping cylinder 805 drives the grippers 806 to clamp and fix the cover plate 1403. Then the lifting mechanism 9 resets, and the second linear module 802 drives the movable frame 803 and the cover plate 1403 to move synchronously to the top of the adjacent IC carrier board. The fourth lifting module 804 drives the suction cup 807 to descend through the middle of the cover plate 1403 to absorb the IC carrier board. The fourth lifting module 804 then rises to lift the IC carrier board. The second linear module 802 drives the IC carrier board and cover plate 1403 to move again to the top of the lifting mechanism 9. The fourth lifting module 804 drives the suction cup 807 to place the IC carrier board on top of the base plate 1401. The first ejector pin 903 lifts up to receive the cover plate 1403. Then the gripper 806 releases, and the first ejector pin 903 resets, so that the cover plate 1403 covers the base plate 1401, limiting the IC carrier board on the top of the base plate 1401. When the IC carrier board is retracted, the above steps are repeated in reverse, which can realize the automatic retraction and placement of the IC carrier board and carrier 14, further improving the efficiency of board retraction and placement.

[0038] The vehicle handling mechanism 10 includes a fifth lifting module 1001, with a transport frame 1002 fixedly connected to the lifting platform of the fifth lifting module 1001. A third linear module 1003 is installed on the top of the transport frame 1002, and a movable claw 1004 is fixedly connected to the moving platform of the third linear module 1003. The vehicle return line 4 includes a vehicle conveying flow line 401, with a pair of baffles 402 symmetrically arranged on both sides of the vehicle conveying flow line 401. A cover is installed on the outside of the vehicle conveying flow line 401. The two ends of 1 are connected to receiving flow lines 1005. A pair of slots 1006 are opened on the side wall of the receiving flow line 1005 facing the fifth lifting module 1001. A pair of pushing cylinders 1007 are fixedly connected to the side wall of the receiving flow line 1005 away from the fifth lifting module 1001. A pushing block is fixedly connected to the piston rod of the pushing cylinder 1007. A carrier buffer compartment 1008 is fixedly connected to the bottom of the receiving flow line 1005. Several baffles 1009 are symmetrically fixedly connected to the inner side wall of the carrier buffer compartment 1008. When the IC carrier board is placed, the empty carrier 14 moves along the carrier return line 4 to the receiving flow line 1005. The fifth lifting module 1001 drives the transport frame 1002 to move upward to the side of the receiving flow line 1005. The third linear module 1003 drives the movable claw 1004 to extend into the bottom of the receiving flow line 1005 along the slot 1006. The pushing cylinder 1007 drives the push block to push the carrier 14 into the movable claw 1004. Then the movable claw 1004 resets. The fifth lifting module 1001 drives the movable claw 1004 to move downward to the side of the upper board flow line 5. Then the third linear module 1003 drives the carrier 14 to move. The carrier 14 is received by the second ejector pin 906 at the top of the lifting mechanism 9. When too much empty carrier 14 is returned, the carrier 14 is stacked in the carrier buffer bin 1008 by the movable claw 1004 for buffering. When the IC carrier board is collected, the above steps are repeated in reverse, placing the carrier 14 in the receiving flow line 1005 for return or in the carrier buffer bin 1008 for buffering. Through the above steps, the automatic grabbing, transfer, stacking, buffering and reverse return of empty carrier 14 can be realized, forming a complete carrier circulation system, reducing manual intervention and improving production line continuity and space utilization.

[0039] The transition flow line 11 includes a fourth linear module 1101. The movable platform of the fourth linear module 1101 is fixedly connected to the movable flow line 1102. A pair of branch lines 1103 are provided on the side of the movable flow line 1102 facing the cleaning flow line 2. The fourth linear module 1101 drives the movable flow line 1102 to move to the position where it docks with the upper plate flow line 5 or the lower plate flow line 6. After receiving the carrier 14, it is transported to the branch line 1103 and then sent into the cleaning flow line 2, or it can receive the carrier 14 sent out by the cleaning flow line 2 in the opposite direction. This realizes the flexible connection between the upper plate machine 1, the cleaning flow line 2, and the lower plate machine 3, adapts to the docking requirements of different workstations, and reduces the jamming and drop during the carrier transportation process.

[0040] The unloading machine 3 is internally equipped with a buffer mechanism 12, which is located between the transition flow line 11 and the unloading flow line 6. The buffer mechanism 12 includes a sixth lifting module 1201, whose lifting platform is fixedly connected to a lifting buffer chamber 1202. Several buffer flow lines 1203 are arranged in parallel inside the lifting buffer chamber 1202. When the output speed of the cleaning flow line 2 does not match the processing speed of the unloading flow line 6, the carrier 14 first enters the buffer flow line 1203 for temporary storage. The sixth lifting module 1201 drives the lifting buffer chamber 1202 to rise or fall, so that the buffer flow lines 1203 at different levels sequentially connect to the feed or discharge. Through the above steps, downstream congestion and upstream waiting time can be reduced, improving the smoothness and stability of the entire line operation.

[0041] Both the upper flow line 5 and the lower flow line 6 are equipped with scanning mechanisms 13 on their sides. Each scanning mechanism 13 includes a mounting rod 1301, with an adjusting frame 1302 detachably connected to the top of the mounting rod 1301. A barcode scanner 1303 is fixedly connected to the movable end of the adjusting frame 1302. When the carrier 14 or IC substrate passes through the scanning mechanism 13, the barcode scanner 1303 automatically scans the barcode or QR code on it, reading product information, batch number, production parameters, and other data, and uploading this data to the production management system. This enables full-process information traceability of the IC substrate and carrier 14, facilitating quality control, defective product tracking, and production data analysis, thereby improving yield.

[0042] Working principle: During cleaning, the loading conveyor 5 in the loading machine 1 transports the carrier 14 to the lifting mechanism 9. The lifting mechanism 9 lifts the carrier 14, and the carrier loading / unloading mechanism 8 opens the cover and places the IC carrier board inside. The carrier 14 then passes through the transition conveyor 11 into the cleaning conveyor 2 for cleaning. After cleaning, the carrier 14 enters the unloading conveyor 6 of the unloading machine 3. The lifting mechanism 9 lifts it again, and the carrier loading / unloading mechanism 8 removes the IC carrier board. The empty carrier 14 is then transferred to the loading / unloading mechanism 10. With a return line 4, the material is conveyed back to the top of the upper platen machine 1 in the reverse direction, realizing a closed-loop cycle. When the upper platen machine 1 is loading, the fully loaded feeding rack 702 flows into the upper platen machine 1 along the feed inlet and stacks on the first flow line 703 in the material rack buffer bin 701. The first flow line 703 conveys the feeding rack 702 to the second flow line 710 at the top of the top platform 709. At this time, the first lifting module 704 drives the top platform 709 to rise, so that the feeding rack 702 moves upward synchronously until the top feeding rack 702 is reached. 2. The device moves to the top of the material rack buffer 701. At this time, the first linear module 705 and the second lifting module 706 drive the material rack clamping cylinder 707 to move, and the clamping plate 708 clamps the unloading rack 702. The unloading rack 702 is placed on the lifting platform of the third lifting module 712 with its opening facing the upper plate streamline 5. Then, the third lifting module 712 drives the unloading rack 702 to move downward, so that the IC carrier board inside passes through the push plate cylinder 714 from bottom to top. The IC carrier board flows through the push plate cylinder... When cylinder 714 is in operation, the pusher cylinder 714 drives the top head to push the IC carrier board out of the unloading rack 702, so that it flows to the upper board flow line 5, realizing the automatic unloading of the IC carrier board; after cleaning, the unloading machine 3's unloading mechanism 7 repeats the above steps in reverse, realizing the automatic unloading of the IC carrier board; through the above steps, the entire process of IC carrier board from loading, cleaning to unloading is automated, the carrier 14 automatically returns without manual handling, greatly improving production efficiency and reducing equipment footprint.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated IC carrier board handling and cleaning production line, characterized in that: The system includes an upper plate machine (1), a cleaning flow line (2), and a lower plate machine (3) arranged sequentially. A pair of carrier return lines (4) are arranged parallel to each other between the tops of the upper plate machine (1) and the lower plate machine (3). The carrier return lines (4) are opposite to the conveying direction of the cleaning flow line (2). A pair of upper plate flow lines (5) are arranged horizontally inside the upper plate machine (1), and a pair of lower plate flow lines (6) are arranged horizontally inside the lower plate machine (3). Several carriers (14) are arranged on the top of the upper plate flow lines (5) and the lower plate flow lines (6). A plate receiving and releasing mechanism (7) is provided at the end of the upper plate flow lines (5) and the lower plate flow lines (6) away from the cleaning flow line (2). A transition flow line (11) is provided at the end of the upper plate flow lines (5) and the lower plate flow lines (6) facing the cleaning flow line (2). 5) and the lower plate flow line (6) are both provided with lifting mechanisms (9) in the middle and lower side. The lifting mechanism (9) is provided with a carrier loading and unloading mechanism (8) on the side. The lifting mechanism (9) is provided with a carrier transport mechanism (10) on the side away from the carrier loading and unloading mechanism (8). The loading and unloading mechanism (7) includes a pair of material rack buffer bins (701). The bottom of the material rack buffer bin (701) is provided with a first flow line (703). The interior of the first flow line (703) is provided with several material racks (702). The side of the material rack buffer bin (701) facing the cleaning flow line (2) is provided with a first lifting module (704). The lifting platform of the first lifting module (704) is fixedly connected to a top platform (709). The top of the top platform (709) is provided with a second flow line (710). The lifting mechanism (9) includes a first lifting cylinder (901), the piston rod of the first lifting cylinder (901) is fixedly connected to a first lifting frame (902), a plurality of first ejector pins (903) are vertically fixedly connected to the four corners of the top of the first lifting frame (902), a second lifting cylinder (904) is fixedly connected to the top of the side wall of the first lifting cylinder (901), the piston rod of the second lifting cylinder (904) is fixedly connected to a second lifting frame (905), a plurality of second ejector pins (906) are vertically fixedly connected to the top of the second lifting frame (905), and the second lifting frame (905) is located inside the first lifting frame (902); The vehicle transport mechanism (10) includes a fifth lifting module (1001), the lifting platform of the fifth lifting module (1001) is fixedly connected to a transport frame (1002), the top of the transport frame (1002) is provided with a third linear module (1003), and the moving platform of the third linear module (1003) is fixedly connected to a movable claw (1004). The vehicle return line (4) includes a vehicle conveying line (401). A pair of baffles (402) are symmetrically arranged on both sides of the vehicle conveying line (401). A cover is provided on the outside of the vehicle conveying line (401). A receiving line (1005) is connected to both ends of the vehicle conveying line (401). A pair of slots (1006) are opened on the side wall of the receiving line (1005) facing the fifth lifting module (1001). A pair of pushing cylinders (1007) are fixedly connected to the side wall of the receiving line (1005) away from the fifth lifting module (1001). A pushing block is fixedly connected to the piston rod of the pushing cylinder (1007). A vehicle buffer chamber (1008) is fixedly connected to the bottom of the receiving line (1005). A number of baffles (1009) are symmetrically fixedly connected to the inner side wall of the vehicle buffer chamber (1008).

2. The IC carrier board automatic take-up and take-up board cleaning production line according to claim 1, characterized in that: A support frame (711) is fixedly connected between a pair of material rack buffer bins (701). A third lifting module (712) is provided at the bottom of the support frame (711). A fixed plate (713) is fixedly connected to the top edge of the side of the support frame (711) away from the cleaning flow line (2). A push plate cylinder (714) is fixedly connected to the top of the outer side wall of the fixed plate (713). A top head is fixedly connected to the piston rod of the push plate cylinder (714). A pair of stop bars (715) are provided on the side of the material rack (702) away from the cleaning flow line (2). A first linear module (705) is provided on the top of the pair of support frames (711). A second lifting module (706) is fixedly connected to the moving platform of the first linear module (705). A material rack clamping cylinder (707) is fixedly connected to the lifting platform of the second lifting module (706). A pair of clamping plates (708) are fixedly connected to the output end of the material rack clamping cylinder (707).

3. The IC carrier board automatic take-up and take-up board cleaning production line according to claim 1, characterized in that: The carrier (14) includes a base plate (1401), and a cover plate (1403) is detachably provided on the top of the base plate (1401). The cover plate (1403) is shaped like an "mouth". A plurality of bottom holes (1402) are provided on the bottom of the base plate (1401). The position of the bottom holes (1402) matches that of the first ejector pin (903).

4. The IC carrier board automatic take-up and take-up board cleaning production line according to claim 3, characterized in that: The vehicle upper and lower plate mechanism (8) includes a mounting frame (801), a second linear module (802) is fixedly connected to the top of the mounting frame (801), a movable frame (803) is fixedly connected to the moving platform of the second linear module (802), a fourth lifting module (804) is vertically arranged on the top of the movable frame (803), a suction cup (807) is fixedly connected to the lifting platform of the fourth lifting module (804), two pairs of cover plate clamping cylinders (805) are symmetrically fixedly connected to the bottom sides of the movable frame (803), a clamping claw (806) is fixedly connected to the piston rod of the cover plate clamping cylinder (805), and the shape and size of the suction cup (807) are matched with the cover plate (1403).

5. The IC carrier board automatic take-up and take-up board cleaning production line according to claim 1, characterized in that: The transition streamline (11) includes a fourth linear module (1101), and the movable stage of the fourth linear module (1101) is fixedly connected to an active streamline (1102). A pair of branch lines (1103) are provided on the side of the active streamline (1102) facing the clean streamline (2).

6. The IC carrier board automatic take-up and take-up board cleaning production line according to claim 1, characterized in that: The lowering machine (3) is provided with a buffer mechanism (12) inside. The buffer mechanism (12) is located between the transition flow line (11) and the lowering flow line (6). The buffer mechanism (12) includes a sixth lifting module (1201). The lifting platform of the sixth lifting module (1201) is fixedly connected to a lifting buffer chamber (1202). Several buffer flow lines (1203) are arranged in parallel inside the lifting buffer chamber (1202).

7. The IC carrier board automatic take-up and take-up board cleaning production line according to claim 1, characterized in that: The upper plate streamline (5) and the lower plate streamline (6) are both provided with a scanning mechanism (13). The scanning mechanism (13) includes a mounting rod (1301). The top of the mounting rod (1301) is detachably connected to an adjustment frame (1302). The movable end of the adjustment frame (1302) is fixedly connected to a barcode scanner (1303).

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