A reactive polyimide resin, a preparation method and application thereof

Abstract

This invention belongs to the field of low-dielectric materials technology, and provides a reactive polyimide resin, its preparation method, and its applications. This reactive polyimide resin is constructed by polycondensation and imidization of an indene-containing diamine with different dianhydrides to form a polyimide backbone containing indene structural units. Then, maleic anhydride is used to end-cap the molecular chain, introducing maleic end groups. This reactive polyimide resin can maintain a low dielectric constant and low dielectric loss, while its molecular structure design allows for targeted control of thermal properties, dimensional stability, dielectric retention after moisture absorption, and processing adaptability. This meets the comprehensive performance requirements of the resin system for various applications such as prepregs, circuit boards, multilayer films, semiconductor sealing materials, and semiconductor devices.

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