Surface treatment process for soldering components of semiconducting aluminium alloys

By using a specially formulated cleaning agent and a multi-step cleaning process, the problems of black marks and excessive particles on weld beads of aluminum alloy welded parts have been solved, achieving the high standards of cleanliness and appearance required by semiconductor equipment, and ensuring the structural integrity and dimensional stability of the parts.

CN122303896APending Publication Date: 2026-06-30爱利彼半导体设备(上海)有限公司
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Patent Information

Application Number
CN202610673206.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-15
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing surface treatment processes for aluminum alloy welded parts cannot effectively remove black marks and tiny particles from the weld beads, resulting in poor appearance and substandard cleanliness, which cannot meet the stringent requirements of semiconductor equipment.

Method used

A specific cleaning agent (including 68% concentrated nitric acid, ammonium bifluoride, and ammonium sulfate) is used in combination with a multi-step cleaning process to specifically remove black marks on weld beads and residual particles on the surface. The process includes ultrasonic degreasing, acid etching, pickling, and ultrasonic hot water washing. The ionic strength of the solution is adjusted to stabilize the reaction system and avoid excessive corrosion of the aluminum alloy substrate.

Benefits of technology

It effectively removes black marks from solder joints, meets the stringent cleanliness requirements of semiconductor equipment, ensures the consistency of component appearance and dimensional stability, and guarantees that the particle count QⅢ test data is qualified, thus avoiding dimensional changes caused by excessive corrosion.

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Abstract

The application belongs to the technical field of workpiece surface treatment, and particularly relates to a semiconductor aluminum alloy welding part surface treatment process, which comprises the following steps: configuring a cleaning agent; sequentially performing ultrasonic degreasing, acid etching and acid pickling process treatment on the pretreated part; using the cleaning agent to clean the weld bead on the part, and then sequentially performing ultrasonic hot water washing and precision cleaning process treatment on the part; after the treatment, drying the part to complete the part surface treatment, wherein the cleaning agent comprises the following components: 68% concentrated nitric acid, ammonium hydrogen fluoride and ammonium sulfate. The application adds the weld bead cleaning process on the basis of the existing process, can effectively remove the weld bead black print and the small particles remaining on the surface, meanwhile, does not damage the workpiece, and can meet the stringent requirement of the semiconductor equipment on cleanliness.
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