Piezoelectric pump body, heat dissipation system and electronic device
CN122304979APending Publication Date: 2026-06-30HONOR DEVICE CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONOR DEVICE CO LTD
- Filing Date
- 2024-12-31
- Publication Date
- 2026-06-30
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Figure CN122304979A_ABST
Abstract
This application discloses a piezoelectric pump body, a heat dissipation system, and an electronic device, relating to the field of piezoelectric pump technology. The piezoelectric pump body includes a base, a valve body assembly, and a vibration assembly. The base has a fluid inlet. The valve body assembly is stacked on the base and has a first channel. The inlet of the first channel communicates with the fluid inlet. The vibration assembly is located on the side of the valve body assembly away from the base and forms a pump chamber with the valve body assembly. The outlet of the first channel communicates with the pump chamber. The valve body assembly has a fixing part and a first valve plate. The first valve plate is deformably connected to the fixing part along a first direction. The first valve plate is used to open the inlet of the first channel. The first direction is parallel to the stacking direction of the base and the valve body assembly. The valve body assembly also includes an elastic connecting part, which connects the first valve plate and the fixing part. The elastic connecting part includes a first connecting segment, a second connecting segment, and an annular segment. The annular segment connects the first connecting segment and the second connecting segment, and the annular segment is a closed ring.
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