Adsorption refrigeration device, control method thereof, and liquid cooling system
By adjusting the flow distribution and compression refrigeration system in the adsorption refrigeration device, the problem of poor heat source temperature adaptability was solved, ensuring stable desorption and adsorption in the adsorption bed and improving refrigeration efficiency and heat recovery effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN ENVICOOL TECH
- Filing Date
- 2024-12-31
- Publication Date
- 2026-06-30
Smart Images

Figure CN122305652A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of temperature control technology, and more specifically, to an adsorption refrigeration device and its control method, and also to a liquid cooling system including the above-mentioned adsorption refrigeration device. Background Technology
[0002] The adsorption refrigeration device mainly involves three structural components: an adsorption bed, a condenser, and an evaporator. Multiple adsorption beds can be set up in parallel and / or in series. The specific connection method of the adsorption refrigeration device can refer to the current regenerative cycle, thermal wave cycle, and multi-stage cycle, etc.
[0003] Generally, during the adsorption stage, a heat source fluid is introduced into the adsorption bed to desorb the gaseous adsorbent. The condenser is used to remove the desorbed gaseous adsorbent from the adsorption bed and condenses it into a liquid state by absorbing heat from the surroundings through the introduced cooling fluid. Desorption is generally considered complete when the adsorption bed has fully desorbed the gaseous adsorbent.
[0004] Furthermore, a low-temperature cooling fluid can be introduced into the adsorption bed again to cool it down and allow it to enter the adsorption stage. At this time, the gaseous adsorbent in the chamber where the adsorbent is located is absorbed by the adsorbent, and the outlet of the evaporator's evaporation chamber is used to connect to the adsorption chamber of the adsorption bed so that the adsorbent in the evaporation chamber is continuously absorbed by the adsorbent. In this way, the evaporator can achieve evaporation and heat absorption.
[0005] In the process of realizing this invention, the inventors discovered that the prior art has at least the following problems: the power of the heat source load that generates the heat source fluid changes during use, and once the power of the heat source load changes, the adsorption cooling effect will be poor. Therefore, the current adsorption cooling device has the problem of poor adaptability to heat source temperature. Summary of the Invention
[0006] In view of this, the first objective of the present invention is to provide an adsorption refrigeration device that can effectively solve the problem of poor adaptability of adsorption refrigeration devices. The second objective of the present invention is to provide a liquid cooling system including the above-mentioned adsorption refrigeration device. The third objective of the present invention is to provide a control method for the above-mentioned adsorption refrigeration device.
[0007] To achieve the first objective mentioned above, the present invention provides the following technical solution:
[0008] An adsorption refrigeration device, comprising:
[0009] An adsorption bed, wherein the adsorption chamber of the adsorption bed is provided with an adsorbent to exchange heat with a heat exchange channel;
[0010] A heat source supply port is connected to the inlet of the heat exchange channel for supplying heat source fluid from the heat source load to the heat exchange channel.
[0011] A heat source outlet is used to supply heat source fluid to the heat source load;
[0012] A compression refrigeration system includes a heat-receiving passage for absorbing heat from the refrigerant after compression by the compressor, wherein the outlet of the heat-receiving passage is connected to the inlet of the heat exchange passage;
[0013] A flow distribution device is used to distribute the fluid flowing out of the heat exchange channel to the heat source outlet and the inlet of the heated channel according to a set distribution ratio, and the set distribution ratio is adjustable.
[0014] In the aforementioned adsorption refrigeration device, during operation, the heat source channel of the heat source load is connected between the heat source supply port and the heat source discharge port. After the heat source load starts working, the fluid in the heat source channel is circulated. The fluid is heated by the heating device of the heat source load through the heat source channel, then flows to the heat source supply port, and then to the heat exchange channel of the adsorption bed. At this time, the adsorption bed is in the desorption stage, and the fluid in the heat exchange channel cools down and is discharged from the outlet of the heat exchange channel. It can then be discharged into the heat source discharge port to enter the heat source channel again, acquire heat again, and return to the adsorption bed from the heat source supply port for heat release. At this time, the heat generation power of the heat source load can be monitored. When the heat generation power increases or decreases, the flow rate of the fluid entering the heat source channel can be adjusted by the flow distribution device to ensure that the fluid temperature at the heat source supply port reaches the preset temperature, which is the optimal desorption temperature of the adsorption bed. The other portion of the fluid enters the heating channel. The compression and refrigeration power of the compression refrigeration system can be adjusted according to the fluid flow rate in the heating channel, thereby changing the heat release power to ensure that the outlet temperature of the heating channel reaches the preset temperature. Through this adjustment method, even if the heat source load power changes, the final fluid flow rate entering the heat exchange channel remains constant, and the temperature remains stable, ensuring a stable desorption phase and facilitating stable alternating desorption and adsorption in the adsorption bed. Furthermore, this method fully utilizes the heat power of the heat source load, resulting in better heat recovery. In summary, this adsorption refrigeration device effectively solves the problem of poor adaptability in adsorption refrigeration devices.
[0015] In some technical solutions, a controller is also included. The controller can control the flow distribution device to adjust the distribution ratio according to the temperature of the heat source supply port, so as to reduce the temperature difference between the temperature of the heat source supply port and the first preset temperature. The controller can also control the operating power of the compression refrigeration system according to the outlet temperature of the heated channel, so as to reduce the temperature difference between the outlet temperature of the heated channel and the first preset temperature.
[0016] Some technical solutions also include a heating drive pump for driving the fluid flow in the heat exchange channel.
[0017] Some technical solutions also include a first three-way structure, wherein the three interfaces of the first three-way structure are respectively connected to the heat source supply port, the outlet of the heating channel and the inlet of the heat exchange channel.
[0018] In some technical solutions, a second three-way structure is also included. The flow distribution device includes a first flow regulating valve and a second flow regulating valve. The first flow regulating valve is connected in series with the heated channel in a connecting branch. The three ports of the second three-way structure are respectively connected to one end of the connecting branch, the heat source outlet, and the outlet of the heat exchange channel. The second flow regulating valve is connected in series between the first three-way structure and the heat source supply port or between the second three-way structure and the heat source outlet.
[0019] In some technical solutions, the first end of each heat exchange channel is optionally connected to the first three-way structure via a first multi-way valve, and the second end of each heat exchange channel is optionally connected to the second three-way structure via a second multi-way valve, so that heating fluid can be optionally introduced into each heat exchange channel.
[0020] In some technical solutions, the compression refrigeration system includes the compressor, the condenser heat exchanger, the throttling device, and the compression evaporator. The condenser heat exchanger includes a condenser-side refrigerant passage and a heating passage that exchange heat with each other. The compressor, the condenser-side refrigerant passage, the throttling device, and the compression evaporator are sequentially and cyclically connected.
[0021] Some technical solutions include a condenser, an evaporator, a first cooling fluid interface, and a second cooling fluid interface;
[0022] The evaporation chamber of the evaporator is optionally connected to the adsorption chambers corresponding to different adsorption beds in the plurality of adsorption beds through the first valve group. The evaporator is also provided with a refrigeration fluid channel for heat exchange with the liquid adsorption working fluid in the evaporation chamber.
[0023] The condenser's condensing chamber is optionally connected to the adsorption chambers corresponding to different adsorption beds in the plurality of adsorption beds through a second valve group. The condenser is also provided with a cooling fluid channel for exchanging heat with the gaseous adsorption working fluid in the condensing chamber.
[0024] The first end of each heat exchange channel is optionally connected to the first cooling fluid interface via a third multi-way valve, and the second end of each heat exchange channel is optionally connected to the second cooling fluid interface via a fourth multi-way valve, so that cooling fluid can be optionally introduced.
[0025] To achieve the second objective mentioned above, the present invention also provides a liquid cooling system, which includes any of the aforementioned adsorption refrigeration devices, a heat load device, and a heat source channel capable of exchanging heat with the heating element in the heat load device. One end of the heat source channel is connected to the heat source outlet of the adsorption refrigeration device, and the other end is connected to the heat source supply port of the adsorption refrigeration device. Since the aforementioned adsorption refrigeration device possesses the above-mentioned technical effects, the liquid cooling system incorporating this adsorption refrigeration device should also possess corresponding technical effects.
[0026] In some technical solutions, a cooling tower and a temperature sensor for monitoring the temperature of the fluid at the outlet of the heat source channel are also included. The cooling water supply port of the cooling tower is connected to the inlet of the heat source channel through a switching valve. The switching valve can control the opening of the switching valve when the detected value of the temperature sensor exceeds a second preset temperature.
[0027] To achieve the third objective mentioned above, the present invention also provides a control method for an adsorption refrigeration device, comprising:
[0028] Based on the temperature of the heat source supply port, the flow distribution device is controlled to adjust the distribution ratio so that the temperature difference between the heat source supply port and the first preset temperature is reduced.
[0029] And / or, based on the outlet temperature of the heated channel, control the operating power of the compression refrigeration system to reduce the temperature difference between the outlet temperature of the heated channel and the first preset temperature. Attached Figure Description
[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0031] Figure 1 This is a schematic diagram of the adsorption refrigeration device provided in an embodiment of the present invention;
[0032] Figure 2 This is a schematic diagram of the liquid cooling system provided in an embodiment of the present invention.
[0033] The following labels are shown in the attached diagram:
[0034] The system comprises: an adsorption bed 1, a heat source supply port 2, a heat exchange channel 3, a first cooling fluid interface 4, a heat source discharge port 5, a second cooling fluid interface 6, a condenser 7, an evaporator 8, a first valve group 9, a second valve group 10, a refrigerant fluid supply port 11, a first multi-way valve 12, a second multi-way valve 13, a third multi-way valve 14, a fourth multi-way valve 15, a cooling channel 16, a compressor 17, a condensing heat exchanger 18, a throttling device 19, an evaporating heat exchanger 20, a flow distribution device 21, a heating drive pump 22, a refrigeration drive pump 23, a first three-way structure 24; a condensing-side refrigerant channel 181, a heating channel 182, an evaporating-side refrigerant channel 201, and a heat release channel 202.
[0035] Adsorption refrigeration system 100, compression refrigeration system 200, load device 300. Detailed Implementation
[0036] This invention discloses an adsorption refrigeration device to effectively solve the problem of poor adaptability of adsorption refrigeration devices.
[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0038] Please see Figures 1-2 , Figure 1 This is a schematic diagram of the adsorption refrigeration device provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the liquid cooling system provided in an embodiment of the present invention.
[0039] In some embodiments, an adsorption refrigeration device is provided, which specifically includes an adsorption bed 1, a heat source supply port 2, a heat source discharge port 5, a compression refrigeration system 200, and a flow distribution device 21.
[0040] The adsorption chamber of the adsorption bed 1 is equipped with an adsorbent, and the working fluid used in conjunction with the adsorbent can flow through the adsorption chamber and the condensation chamber of the condenser 7, as well as through the evaporator 8. The working fluid and the adsorbent combine to form a working fluid pair. In an adsorption refrigeration system 100, multiple sets of working fluid pairs can be provided. One adsorbent can be used for multiple working fluids, or multiple adsorbents can be used for one working fluid.
[0041] For adsorption bed 1, there are two main working states: adsorption and desorption, which are generally carried out in stages. In the adsorption state, a low-temperature fluid is used to cool adsorption bed 1, allowing the adsorbent in adsorption bed 1 to adsorb the gaseous working medium, thus ensuring continuous adsorption capacity of the adsorption chamber until the adsorbent reaches a preset saturation state. Taking physical adsorption as an example, the gaseous working medium will liquefy into a liquid state to maintain a low-pressure state within the adsorption chamber, enabling continuous external suction of the gaseous working medium, such as continuous adsorption of the gaseous working medium in the bed evaporator 8, allowing the bed evaporator 8 to continuously evaporate and absorb heat. Of course, adsorption bed 1 can also obtain the gaseous working medium from the outside, instead of from the bed evaporator 8. In the desorption state, the adsorption bed 1 is generally heated by a high-temperature fluid, so that the adsorbent in the adsorbent is desorbed from the adsorbent and re-formed into a gaseous adsorbent. The gaseous adsorbent enters the condenser 7 and is liquefied into a liquid adsorbent in the condenser 7. Alternatively, the adsorbent can be discharged to the outside.
[0042] The adsorption bed 1 has a heat exchange channel 3 for heat exchange with the adsorbent in the adsorption chamber. This heat exchange channel 3 is a channel capable of carrying at least a high-temperature fluid (heat source fluid) during the desorption phase of the adsorption bed 1. During the adsorption phase, the heat exchange channel 3 can be closed or used to carry a low-temperature fluid. The heat exchange channel 3 can exchange heat with the adsorbent, ensuring that during the desorption phase, a high-temperature fluid flows through it, keeping the entire adsorption chamber at a high temperature. After absorbing heat, the adsorbent desorbs a gaseous adsorbent, which absorbs heat from the high-temperature fluid in the heat exchange channel 3. This gaseous adsorbent can be discharged to the outside or into the condensation chamber of the condenser 7, where it is condensed back into a gaseous adsorbent. It should be noted that a heat exchange channel 3 can be provided to alternately circulate high-temperature fluid and low-temperature fluid; or a heat exchange channel 3 can be provided specifically for low-temperature fluid, while another channel can be provided specifically for high-temperature fluid; or only a heat exchange channel 3 can be provided for either high-temperature or low-temperature fluid, and the adsorption or desorption stage of the adsorption bed 1 is not carried out by fluid, but by other heat-conducting structures, such as metal heat-conducting components, for heat dissipation.
[0043] The heat source supply port 2 is used to supply heat source fluid from the heat source load to the heat exchange channel 3, and the heat source discharge port 5 is used to supply heat source fluid to the heat source load. In use, the heat source supply port 2 is connected to the heat source channel of the heat source load, and the heat source discharge port 5 is connected to the aforementioned heat source channel. The fluid flowing out from the heat source discharge port 5 enters the heat source channel, where it obtains heat from the heating element of the heat source load to raise its temperature, and then is discharged into the heat source supply port 2.
[0044] The compression refrigeration system 200 refers to a system capable of compression refrigeration. The compression refrigeration system 200 mainly includes a compressor 17, a condenser, a throttling device 19, and an evaporator. The compressor 17 is used to compress the refrigerant to form a high-temperature refrigerant. The high-temperature refrigerant is cooled at the condenser to exchange heat and then exits. The cooled refrigerant enters the throttling device 19, and after being throttled by the throttling device 19, it is further cooled and enters the evaporator to absorb heat. Then it returns to the compressor 17.
[0045] The compression refrigeration system 200 also includes a heating channel 182. The heating channel 182 is used to absorb heat from the refrigerant after compression by the compressor 17, thereby raising the internal temperature of the fluid. The heating channel 182 can be located outside the compressor 17 casing. The heated refrigerant will transfer heat to the compressor 17 casing. Alternatively, the heating channel 182 can also obtain heat from the condenser of the compression refrigeration system 200. The high-temperature refrigerant after compression will enter the condenser, and the heating channel 182 can directly exchange heat with the refrigerant condensation channel in the condenser 7, or it can achieve indirect heat exchange through a heat exchanger.
[0046] The outlet of the heated channel 182 is connected to the inlet of the heat exchange channel 3 to supply high-temperature fluid to the heat exchange channel 3. Both the outlet of the heated channel 182 and the heat source supply port 2 supply heat exchange fluid to the heat exchange channel 3. Specifically, the heat source fluid entering through the inlet of the heated channel 182 absorbs heat from the refrigerant compressed by the compressor 17 at the heated channel 182. After being heated, it is supplied to the inlet of the heat exchange channel 3 again for desorption in the adsorption bed 1.
[0047] The flow distribution device 21 is used to distribute the fluid flowing out of the outlet of the heat exchange channel 3 to the heat source outlet 5 and the inlet of the heated channel 182 according to a set distribution ratio. The set distribution ratio is adjustable; that is, the proportion of fluid flowing out of the outlet of the heat exchange channel 3 distributed to the heat source outlet 5 and the inlet of the heated channel 182 can be adjusted through the adjustment function of the flow distribution device 21. The flow distribution device 21 can be a flow distribution valve, with its inlet connected to the outlet of the heat exchange channel 3 and its two outlets connected to the heat source outlet 5 and the inlet of the heated channel 182, respectively. The internal valve core is movable, allowing fluid to enter the inlet and changing the ratio to allow it to enter the two outlets separately. Alternatively, the flow distribution device 21 can include two double-connector flow valves to adjust the flow rate of the two branches separately. Other flow distribution devices 21 can also be used.
[0048] In the aforementioned adsorption refrigeration device, during operation, the heat source channel of the heat source load is connected between the heat source supply port 2 and the heat source discharge port 5. After the heat source load starts working, the fluid in the heat source channel is circulated. The fluid is heated by the heating device of the heat source load through the heat source channel and then flows to the heat source supply port 2, and then to the heat exchange channel 3 of the adsorption bed 1. At this time, the adsorption bed 1 is in the desorption stage, and the fluid in the heat exchange channel 3 will cool down and then be discharged from the outlet of the heat exchange channel 3. It can then be discharged into the heat source discharge port 5 to enter the heat source channel again, acquire heat again, and return to the adsorption bed 1 from the heat source supply port 2 for heat release. At this time, the heat generation power of the heat source load can be monitored. When the heat generation power increases or decreases, the flow rate of the fluid entering the heat source channel can be adjusted by the flow distribution device 21 to ensure that the fluid temperature at the heat source supply port 2 reaches the preset temperature, which is the optimal desorption temperature of the adsorption bed 1. The other portion of the fluid enters the heating channel 182. The compression and refrigeration power of the compression refrigeration system 200 can be adjusted according to the fluid flow rate in the heating channel 182, thereby changing the heat release power to ensure that the outlet temperature of the heating channel 182 reaches the preset temperature. Through this adjustment method, even if the heat source load power changes, the final fluid flow rate entering the heat exchange channel 3 remains unchanged, and the temperature remains stable, ensuring a stable desorption stage and facilitating the stable alternation of desorption and adsorption in the adsorption bed 1. Furthermore, this method fully utilizes the heat power of the heat source load, resulting in better heat recovery. In summary, this adsorption refrigeration device effectively solves the problem of poor adaptability in adsorption refrigeration devices.
[0049] In some embodiments, for better automatic adjustment, a controller can be provided. The controller controls the flow distribution device 21 to adjust the flow distribution based on the temperature of the heat source supply port 2, so that the temperature of the heat source supply port 2 reaches a preset temperature. Then, based on the temperature or flow rate at the outlet of the heated channel 182, the operating power of the compression refrigeration system 200 is adjusted so that the fluid temperature at the outlet of the heated channel 182 also reaches the preset temperature. At this time, the temperature and flow rate of the high-temperature fluid entering the adsorption bed 1 for heat exchange do not change and can adapt to changes according to the load. Of course, when obtaining the outlet temperature of the heated channel 182 and the temperature of the heat source supply port 2, mutual interference should be avoided. It should be noted that for the heat source load, controlling the temperature of the heat source supply port 2 can effectively control the heat dissipation temperature of the heat source load, preventing the heat source load from not being effectively cooled.
[0050] Specifically, the controller can adjust the flow distribution device 21 according to the temperature of the heat source supply port 2 to reduce the temperature difference between the fluid temperature at the heat source supply port 2 and the first preset temperature. The smaller the temperature difference, the better. This control method can be PID regulation. Specifically, if the temperature of the heat source supply port 2 is higher than the first preset temperature, the flow distribution device 21 adjusts to increase the fluid flow rate at the heat source outlet 5. After the fluid flow rate in the heat source channel increases, the outlet water temperature of the corresponding heat source channel decreases, and the fluid flow rate in the heating channel 182 decreases. Conversely, if the fluid temperature of the heat source supply port 2 is lower than the first preset temperature, the flow distribution device 21 adjusts to decrease the fluid flow rate at the heat source outlet 5. After the fluid flow rate in the heat source channel decreases, the outlet water temperature of the corresponding heat source channel increases, and the fluid flow rate in the heating channel 182 increases. This repeated adjustment gradually reduces the temperature difference between the heat source supply port 2 and the first preset temperature. The first preset temperature is preferably an acceptable desorption temperature for the adsorption bed 1. In order to improve the desorption effect, the first preset temperature is preferably the optimal temperature of the adsorption bed 1, so as to ensure that the adsorption bed 1 can present the best desorption effect.
[0051] The controller can control the operating power of the compression refrigeration system 200 based on the outlet temperature of the heated channel 182, so as to reduce the temperature difference between the outlet temperature of the heated channel 182 and the first preset temperature, and the smaller the temperature difference between the outlet temperature of the heated channel 182 and the first preset temperature, the better. The control method at this time can be PID regulation. Specifically, based on the above adjustments: when the fluid flow in the heated channel 182 decreases, the outlet temperature of the heated channel 182 is higher than the first preset temperature, so the refrigeration power of the compression refrigeration system 200 needs to be reduced. The reduced refrigeration power leads to a decrease in the heat power at its corresponding hot ends (compressor 17 and condenser 18), and thus a decrease in the outlet temperature of the corresponding heated channel 182. Conversely, when the fluid flow in the heated channel 182 increases, the outlet temperature of the heated channel 182 is lower than the first preset temperature, so the refrigeration power of the compression refrigeration system 200 needs to be increased. The increased refrigeration power leads to an increase in the temperature at its corresponding hot ends (compressor 17 and condenser 18), and thus an increase in the outlet temperature of the corresponding heated channel 182.
[0052] In some embodiments, a heating drive pump 22 is further included for driving fluid flow in the heat exchange channel 3. This allows the entire adsorption refrigeration device to have its own heating drive pump 22, eliminating the need for a separate heating drive device. The heating drive pump 22 is used to drive fluid flow in the heat exchange channel 3, at least for driving the flow of heating fluid, and may or may not be used to drive the flow of cooling fluid. The specific driving method can be set as needed.
[0053] In some embodiments, generally, the fluid supplied by the heat source supply port 2 and the fluid supplied by the heated channel 182 can return to the same heat exchange channel 3, or they can return to different heat exchange channels 3. To facilitate the arrangement of the adsorption bed 1 structure, a first three-way structure 24 is preferably included, wherein the three ports of the first three-way structure 24 are respectively connected to the heat source supply port 2, the outlet of the heated channel 182, and the inlet of the heat exchange channel 3, so that the fluid supplied by the heat source supply port 2 and the fluid flowing out of the heated channel 182 can both enter the same heat exchange channel 3. In this case, the heating drive pump 22 can be disposed between the first three-way structure 24 and the heat exchange channel 3.
[0054] Of course, in some embodiments, the heating drive pump 22 may not be provided. Instead, the heat source load device 300 is equipped with a first drive pump, and a second drive pump is connected in series at the heated channel 182 to respectively control the fluid in the heated channel 182 and the fluid in the heat source channel. In this case, if the pump speeds of the first drive pump and the second drive pump are adjustable, they can also be used as a flow distribution device 21.
[0055] In some embodiments, a second three-way structure is also included, wherein the three ports of the second three-way structure are respectively connected to the heat source outlet 5, the inlet of the heated channel 182, and the outlet of the heat exchange channel 3 to achieve fluid diversion. In use, the heated channel 182 and the heat source channel can be connected in parallel.
[0056] In some embodiments, the flow distribution device 21 can be integrated into the second three-way structure. Alternatively, the flow distribution device 21 can include at least two valve bodies, such as flow regulating valves, connected in series with the heated channel 182 and the heat source channel respectively, to regulate the flow rate separately and control the overall flow rate. Specifically, the flow distribution device 21 can include a first flow regulating valve and a second flow regulating valve. The first flow regulating valve is connected in series with the heated channel 182 in a connecting branch. The three ports of the second three-way structure are respectively connected to one end of the connecting branch, the heat source outlet 5, and the outlet of the heat exchange channel 3. In this case, the second flow regulating valve is connected in series between the first three-way structure 24 and the heat source supply port 2, or between the second three-way structure and the heat source outlet 5, to connect the heat source channel in series and form another connecting branch, forming a parallel structure with the aforementioned connecting branch. By regulating with two flow regulating valves, a better control effect can be achieved.
[0057] In some embodiments, the flow distribution device 21 may include only the first flow regulating valve and not the second flow regulating valve, or only the second flow regulating valve and not the first flow regulating valve. By adjusting the flow regulating valve, the flow rate reduction can be avoided.
[0058] In some embodiments, if the selected flow distribution device 21 experiences a change in flow rate during flow distribution, resulting in a change in total flow rate, the flow distribution device 21 and the heating drive pump 22 can be used in combination to ensure that the flow rate remains constant, thereby avoiding flow rate changes and ensuring the stability of the desorption time.
[0059] In some embodiments, multiple adsorption beds 1 are typically provided, corresponding to multiple heat exchange channels 3. Desorption and adsorption do not occur simultaneously in some adsorption beds 1. Generally, some adsorption beds 1 perform desorption while others perform adsorption, ensuring that some adsorption beds 1 are always adsorbing while others are desorbing, thus guaranteeing the continuity of heat source utilization and cooling. As shown in the attached figure, two adsorption beds 1 are provided, each equipped with a heat exchange channel 3. The two adsorption beds 1 alternately perform adsorption and desorption. Preheating and precooling are required during switching, but the switching time is generally very short and can be ignored. The precooling stage, in particular, has a beneficial effect on the heat source load. A single heat exchange channel 3 in the adsorption bed 1 can be a single-channel structure or a multi-channel parallel structure.
[0060] To facilitate control and switching, the first end of each heat exchange channel 3 is optionally connected to the first three-way structure 24 via the first multi-way valve 12, and the second end of each heat exchange channel 3 is optionally connected to the second three-way structure via the second multi-way valve 13, so that heating fluid can be selectively introduced into each heat exchange channel 3.
[0061] Each heat exchange channel 3 has its first end connected to a respective outlet of the first multi-way valve 12, and its inlet connected to the first three-way structure 24. The inlet of the first multi-way valve 12 can optionally be connected to any one of the outlets. Similarly, each heat exchange channel 3 has its second end connected to a respective inlet of the second multi-way valve 13, and its outlet connected to the second three-way structure. The outlet of the second multi-way valve 13 can optionally be connected to any one of the inlets. The first multi-way valve 12 and the second multi-way valve 13 can be combined to form a reversing valve structure, or they can be separate multi-way valve structures.
[0062] In some embodiments, to facilitate heating of the heating passage 182, the compression refrigeration system 200 includes a compressor 17, a condensing heat exchanger 18, a throttling device 19, and an evaporator 8. The condensing heat exchanger 18 includes a condensing-side refrigerant passage 181 and a heating passage 182 that exchange heat with each other. The compressor 17, the condensing-side refrigerant passage 181, the throttling device 19, and the evaporator 8 are sequentially and cyclically connected. Alternatively, the evaporator 8 can be an evaporating heat exchanger 20, which includes an evaporating-side refrigerant passage 201 and a heat release passage 202 that exchange heat with each other. In this case, the compressor 17, the condensing-side refrigerant passage 181, the throttling device 19, and the evaporating-side refrigerant passage 201 are sequentially and cyclically connected.
[0063] When in use, the refrigerant, after being compressed by the compressor 17, forms a high-temperature fluid. This high-temperature fluid exchanges heat with the heating channel 182 in the condensing-side refrigerant channel 181, thereby raising the temperature of the fluid in the heating channel 182. Generally, the temperature of the compressed high-temperature fluid needs to be higher than the set heating fluid temperature of the adsorbent in the adsorption bed 1 (such as the first preset temperature mentioned above) to ensure that the heating channel 182 is effectively heated to meet the usage requirements of the adsorption bed 1. After releasing heat, the refrigerant in the refrigerant channel cools down. The cooled fluid is then throttled by the throttling device 19 to form a low-temperature fluid. This low-temperature fluid enters the evaporating-side refrigerant channel 201, where it absorbs heat from the heat release channel 202 to achieve a temperature increase. After flowing out of the evaporating-side refrigerant channel 201, the refrigerant can re-enter the compressor 17, be compressed by the compressor 17, and then supplied to the condensing-side refrigerant channel 181. This cycle repeats continuously, and during the cycle, the refrigerant may undergo a gas-liquid phase transition. It should be noted that if the refrigerant temperature at the inlet of the throttling device 19 is too high, a portion of the refrigerant can be discharged from the throttling outlet to cool the inlet refrigerant and meet the throttling requirements. The heat release channel 202 can be used to cool some equipment, or it can be used to cool the same equipment along with the chilled water produced by the adsorption refrigeration device.
[0064] In some embodiments, the adsorption refrigeration system 100 is generally provided with a bed condenser 7 and a bed evaporator 8. The bed condenser 7 and the bed evaporator 8 are usually provided separately, but they can also be provided together, such as by using a heat exchanger to be used alternately as the bed condenser 7 and the bed evaporator 8.
[0065] The evaporation chamber of the bed evaporator 8 is optionally connected to the adsorption chambers of different adsorption beds 11 in multiple adsorption beds 1 through the first valve group 9. The bed evaporator 8 is also provided with a cryogenic fluid channel for heat exchange with the liquid adsorbent in the evaporation chamber. The cryogenic fluid channel is used to cool the object being cooled. Generally, the cryogenic fluid channel and the channel in the object being cooled form a circulating flow so that after absorbing heat in the object being cooled, it flows back to the cryogenic fluid channel and then releases heat in the bed evaporator 8, so that the liquid adsorbent in the evaporation chamber evaporates and carries away the heat. The heat release channel 202 can be set in series or in parallel with the cryogenic fluid channel. When the adsorption bed 1 is in the adsorption stage, the adsorption chamber of the adsorption bed 1 is connected to the evaporation chamber so that the gaseous adsorbent in the evaporation chamber can enter the adsorption chamber and be adsorbed by the adsorbent. The first valve group 9 can be a multi-way valve or a valve group formed by multiple switching valves. As shown in the figure, the outlet of the evaporation chamber is connected to the adsorption chamber of each adsorption bed 1 through multiple switching valves. It should be noted that there can be one bed evaporator 8 or multiple bed evaporators 8.
[0066] The condensing chamber of the bed condenser 7 is optionally connected to the adsorption chambers of different adsorption beds 1 in the plurality of adsorption beds 1 through the second valve group 10. The bed condenser 7 is also provided with a cooling fluid channel for heat exchange with the gaseous adsorbent in the condensing chamber. The cooling fluid channel mainly introduces external cooling water to absorb heat from the gaseous adsorbent in the condensing chamber, so that the gaseous adsorbent can be condensed into a liquid adsorbent, so that gaseous adsorbent can be continuously drawn from the corresponding adsorption chamber. When the adsorption bed 1 is in the desorption stage, the adsorption chamber of the adsorption bed 1 is connected to the condensing chamber. The second valve group 10 can be a multi-way valve or a valve group formed by a combination of multiple switching valves. As shown in the figure, the inlet of the condensing chamber is connected to the adsorption chamber of each adsorption bed 1 through multiple switching valves. It should be noted that there can be one bed condenser 7 or multiple bed condensers 7.
[0067] In some embodiments, a first cooling fluid interface 4 and a second cooling fluid interface 6 may be further provided. Specifically, the first end of each heat exchange channel 3 may be optionally connected to the first cooling fluid interface 4 via a third multi-way valve 14, and the second end of each heat exchange channel 3 may be optionally connected to the second cooling fluid interface 6 via a fourth multi-way valve 15, so that cooling fluid can be optionally introduced. At this time, the cooling fluid used to cool the adsorbent in the adsorption stage and the heating fluid used to heat the adsorbent in the desorption stage can share the heat exchange channel 3, so that the heating fluid (heat source fluid) and cooling fluid alternately flow into the heat exchange channel 3.
[0068] The first cooling fluid interface 4 serves as the cooling fluid supply port, and the second cooling fluid interface 6 serves as the cooling fluid discharge port. The first end of each heat exchange channel 3 is connected to each outlet of the third multi-way valve 14, while the inlet of the third multi-way valve 14 is connected to the first cooling fluid interface 4, and the inlet of the third multi-way valve 14 can optionally be connected to any one of the outlets. The second end of each heat exchange channel 3 is connected to each inlet of the fourth multi-way valve 15, while the outlet of the fourth multi-way valve 15 is connected to the second cooling fluid interface 6, and the outlet of the fourth multi-way valve 15 can optionally be connected to any one of the inlets.
[0069] For ease of control, the first valve group 9, the second valve group 10, the inlet three-way valve, the first multi-way valve 12, the second multi-way valve 13, the third multi-way valve 14, the fourth multi-way valve 15, and the switching valve are all electrically controlled valves, which are all connected to the controller and can be controlled by the controller; moreover, the control port of the electric heating device and the control port of the drive pump are also connected to the controller and can be controlled by the controller.
[0070] In some embodiments, unless otherwise stated or contradicted, the adsorption refrigeration system 100 comprises an adsorption bed 1, a condenser 7, and an evaporator 8 forming an adsorption working fluid circulation system, which may specifically constitute a multi-stage circulation system, a return circulation system, a heat wave circulation system, or other circulation systems.
[0071] Based on the adsorption refrigeration device provided in the above embodiments, the present invention also provides a liquid cooling system. This liquid cooling system includes any one of the adsorption refrigeration devices described in the above embodiments, and further includes a heat load device 300 and a heat source channel capable of exchanging heat with the heating element in the heat load device 300. One end inlet of the heat source channel is connected to the heat source outlet 5 of the adsorption refrigeration device, and the other end outlet is connected to the heat source supply port 2 of the adsorption refrigeration device. Since this liquid cooling system uses the adsorption refrigeration device described in the above embodiments, the beneficial effects of this liquid cooling system are explained in the above embodiments.
[0072] In some embodiments, due to unreliable factors during the operation of the adsorption bed 1, the adsorption bed 1 may not absorb enough heat during the desorption stage. If the previous operating mode is maintained, the fluid temperature at the heat source outlet 5 may rise rapidly, affecting the operation of the heat source equipment. Based on this, a cooling tower and a temperature sensor for monitoring the fluid temperature at the outlet of the heat source channel are preferably included. The cooling water supply port of the cooling tower is connected to the inlet of the heat source channel via a switching valve. The switching valve can control the opening of the switching valve when the temperature sensor's detection value exceeds a second preset temperature, so as to introduce cold water from the cooling tower into the heat source channel and prevent the heat source equipment from heating up rapidly. Correspondingly, the heat source fluid at the outlet of the heat source channel can be discharged, returned to the cooling tower for continued use, or returned to the heat storage tank for continued use.
[0073] Specifically, the cooling tower can be a water-cooled cooling tower, a wet-dry cooling tower, or a dry cooling tower.
[0074] Based on the adsorption refrigeration device provided in the above embodiments, the present invention also provides a control method applied to the adsorption refrigeration device, including: controlling the flow distribution device 21 to adjust the distribution ratio according to the temperature of the heat source supply port 2, so as to reduce the temperature difference between the temperature of the heat source supply port 2 and the first preset temperature.
[0075] And / or, based on the outlet temperature of the heated channel 182, the operating power of the compression refrigeration system 200 is controlled to reduce the temperature difference between the outlet temperature of the heated channel 182 and the first preset temperature. Since this control method employs the adsorption refrigeration device described in the above embodiments, the beneficial effects of this control method are explained in the above embodiments.
[0076] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0077] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An adsorption refrigeration device, characterized in that, include: Adsorption bed (1), wherein the adsorption chamber of the adsorption bed (1) is provided with an adsorbent so that it can exchange heat with the heat exchange channel (3); A heat source supply port (2) is connected to the inlet of the heat exchange channel (3) for supplying heat source fluid from the heat source load to the heat exchange channel (3). Heat source outlet (5) is used to supply heat source fluid to the heat source load; The compression refrigeration system (200) includes a heat-receiving passage (182) for absorbing heat from the refrigerant after compression by the compressor (17), the outlet of the heat-receiving passage (182) being connected to the inlet of the heat exchange passage (3); The flow distribution device (21) is used to distribute the fluid flowing out of the heat exchange channel (3) to the heat source outlet (5) and the inlet of the heat receiving channel (182) according to a set distribution ratio, and the set distribution ratio is adjustable.
2. The adsorption refrigeration device according to claim 1, characterized in that, It also includes a controller, which can control the flow distribution device (21) to adjust the distribution ratio according to the temperature of the heat source supply port (2) so that the temperature difference between the heat source supply port (2) and the first preset temperature is reduced; the controller can control the operating power of the compression refrigeration system (200) according to the outlet temperature of the heated channel (182) so that the temperature difference between the outlet temperature of the heated channel (182) and the first preset temperature is reduced.
3. The adsorption refrigeration device according to claim 2, characterized in that, It also includes a heating drive pump (22) for driving the flow of fluid in the heat exchange channel (3).
4. The adsorption refrigeration device according to claim 2, characterized in that, It also includes a first three-way structure (24), the three interfaces of which are respectively connected to the heat source supply port (2), the outlet of the heat receiving channel (182) and the inlet of the heat exchange channel (3).
5. The adsorption refrigeration device according to claim 4, characterized in that, It also includes a second three-way structure. The flow distribution device (21) includes a first flow regulating valve and a second flow regulating valve. The first flow regulating valve is connected in series with the heating channel (182) in the connecting branch. The three ports of the second three-way structure are respectively connected to one end of the connecting branch, the heat source outlet (5) and the outlet of the heat exchange channel (3). The second flow regulating valve is connected in series between the first three-way structure (24) and the heat source supply port (2) or in series between the second three-way structure and the heat source outlet (5).
6. The adsorption refrigeration device according to claim 4, characterized in that, The first end of each heat exchange channel (3) is optionally connected to the first three-way structure (24) via a first multi-way valve (12), and the second end of each heat exchange channel (3) is optionally connected to the second three-way structure via a second multi-way valve (13), so that each heat exchange channel (3) can optionally be supplied with heating fluid.
7. The adsorption refrigeration device according to claim 6, characterized in that, The compression refrigeration system (200) includes the compressor (17), the condenser heat exchanger (18), the throttling device (19), and the compressor evaporator (8). The condenser heat exchanger (18) includes a condenser-side refrigerant passage (181) and a heat-receiving passage (182) that exchange heat with each other. The compressor (17), the condenser-side refrigerant passage (181), the throttling device (19), and the compressor evaporator (8) are sequentially and cyclically connected.
8. The adsorption refrigeration device according to claim 6, characterized in that, Includes a condenser (7), an evaporator (8), a first cooling fluid interface (4), and a second cooling fluid interface (6); The evaporation chamber of the evaporator (8) can be optionally connected to the adsorption chambers of different adsorption beds (1) in the plurality of adsorption beds (1) through the first valve group (9). The evaporator (8) is also provided with a refrigeration fluid channel for exchanging heat with the liquid adsorption working fluid in the evaporation chamber. The condenser (7) has its condensation chamber connected to the adsorption chambers of different adsorption beds (1) in the plurality of adsorption beds (1) via the second valve group (10). The condenser (7) is also provided with a cooling fluid channel for exchanging heat with the gaseous adsorption working fluid in the condensation chamber. The first end of each heat exchange channel (3) is optionally connected to the first cooling fluid interface (4) via a third multi-way valve (14), and the second end of each heat exchange channel (3) is optionally connected to the second cooling fluid interface (6) via a fourth multi-way valve (15) so that cooling fluid can be optionally introduced.
9. A liquid cooling system, comprising a heat load device (300) and a heat source channel capable of exchanging heat with a heat-generating component in the heat load device (300), characterized in that, It also includes the adsorption refrigeration device as described in any one of claims 1-8; one end of the heat source channel is connected to the heat source outlet (5) of the adsorption refrigeration device, and the other end is connected to the heat source supply port (2) of the adsorption refrigeration device.
10. The adsorption refrigeration device according to claim 9, characterized in that, It also includes a cooling tower and a temperature sensor for monitoring the temperature of the fluid at the outlet of the heat source channel. The cooling water supply port of the cooling tower is connected to the inlet of the heat source channel via a switching valve. The switching valve can control the opening of the switching valve when the detected value of the temperature sensor exceeds a second preset temperature.
11. A control method for an adsorption refrigeration device, characterized in that, The adsorption refrigeration device is as described in any one of claims 1 to 8; the control method includes: According to the temperature of the heat source supply port (2), the flow distribution device (21) is controlled to adjust the distribution ratio so that the temperature difference between the heat source supply port (2) and the first preset temperature is reduced; And / or, based on the outlet temperature of the heated channel (182), control the operating power of the compression refrigeration system (200) so that the temperature difference between the outlet temperature of the heated channel (182) and the first preset temperature is reduced.