Apparatus and method for detecting cracks in chip package using edge-lit LED backlight

Abstract

This invention relates to the field of semiconductor testing technology and discloses an apparatus and method for detecting chip package cracks using side-lit LED backlighting. The apparatus includes an operating table, a testing component disposed on the top left side of the operating table, and a placement platform fixedly mounted on the top of the operating table to the right of the testing component. The testing component extends above the placement platform. A limiting mechanism extending above and to the left of the placement platform is disposed on the inner side of the placement platform. A moving mechanism is disposed on the right side of the operating table. This apparatus for detecting chip package cracks using side-lit LED backlighting, by setting the limiting mechanism, uses an electric push rod to push a push plate. Through the sliding cooperation between the wedge block and the wedge plate, the limiting plate is driven to move inward, clamping the chip package and preventing displacement or vibration during testing. This achieves the purpose of preventing chip displacement by providing a positioning and clamping structure. By setting the moving mechanism and the cleaning mechanism, the purpose of cleaning the chip surface is achieved.

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