A pressure-sensitive touch integrated digital screen module

By combining inner and outer frame structures and designing directional airflow paths, the impact resistance and heat dissipation efficiency of digital screen modules have been solved, achieving efficient heat dissipation and structural stability, and improving the reliability of the equipment.

CN122307960APending Publication Date: 2026-06-30SHENZHEN SAISHIDA TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN SAISHIDA TECH CO LTD
Filing Date
2026-03-27
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing digital screen modules are deficient in terms of structural impact resistance and heat dissipation efficiency. They are easily damaged by external vibrations or drops, resulting in internal component damage. Furthermore, their heat dissipation design is inefficient, leading to screen overheating and performance throttling.

Method used

It adopts an inner and outer frame combination structure, with buffer pads and elastic abutment parts set between the inner and outer frames to form a stable gap space around the perimeter. It also forms a directional airflow path through the heat dissipation back plate, heat dissipation strips and heat dissipation channels to achieve efficient heat dissipation.

Benefits of technology

It significantly improves the structural impact resistance and heat dissipation efficiency of the digital display module, avoids damage to internal components and overheating problems, and ensures the stability and response speed of the equipment under high load operation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122307960A_ABST
    Figure CN122307960A_ABST
Patent Text Reader

Abstract

This invention discloses a pressure-sensitive touch integrated digital display module, relating to the field of digital display technology. It includes a back cover and an outer frame, which together form a cavity. A pressure-sensitive display component is installed within the cavity. The module also includes an inner frame nested around the pressure-sensitive display component, with buffer pads engaged at each corner between the inner and outer frames. Several elastic abutment members are distributed on both sides of the inner wall of the outer frame. An arc-shaped groove for the elastic abutment members to engage is formed on the outer wall of the inner frame. A heat dissipation backplate is embedded within the back cover, with one side contacting the pressure-sensitive display component and the other side having several longitudinally distributed heat dissipation strips. Several heat dissipation channels, staggered from the heat dissipation strips, are formed along the length of the heat dissipation strips on the edge of the back cover. This invention effectively absorbs external impact energy by setting up a combined structure of the inner frame and buffer pads, and by providing elastic abutment members between the inner and outer frames. The elastic abutment members on the inner wall of the outer frame engage with the arc-shaped groove on the outer wall of the inner frame.
Need to check novelty before this filing date? Find Prior Art