Power distribution apparatus and server

Abstract

This application discloses a power distribution device and a server. The power distribution device includes: a first circuit board with a first power connector for connecting to a power supply unit of the server and obtaining power from the power supply unit; a second circuit board connected to the first circuit board, with at least one functional connector for connecting to at least one functional unit of the server, wherein the second circuit board obtains power from the first circuit board and supplies power to the functional unit, and the at least one functional unit includes at least one of a heat dissipation unit and a storage unit; and a third circuit board connected to the first circuit board, with a motherboard connector for connecting to a motherboard unit of the server, wherein the third circuit board obtains power from the first circuit board and supplies power to the motherboard unit. This application can reduce the cost of servers.

Description

Technical Field

[0001] This application relates to the field of server technology, specifically to a power distribution device and a server. Background Technology

[0002] With the rapid development of cloud computing and AI (Artificial Intelligence) services, high-density storage servers are increasingly used in these applications. As the overall power consumption of high-density storage servers rises and the number of components requiring power increases, power supply design and distribution present significant challenges. Current technology uses an adapter board to transfer power from the power supply to the mainboard unit, which then distributes power to various power-consuming units. These units can only draw power from the mainboard unit, resulting in poor versatility and scalability. This makes it impossible to power the storage and cooling units of high-density storage servers. To power these units, modifications to the mainboard ports are needed, leading to higher server costs. Summary of the Invention

[0003] This application provides a power distribution device and server that can reduce server costs.

[0004] Firstly, the power distribution equipment provided in this application includes:

[0005] A first circuit board is provided with a first power connector, which is used to connect to the power supply unit of the server and obtain electrical energy from the power supply unit.

[0006] A second circuit board is connected to the first circuit board. The second circuit board is provided with at least one functional connector. The at least one functional connector is used to connect to at least one functional unit of the server. The second circuit board obtains power from the first circuit board and supplies power to the functional unit. The at least one functional unit includes at least one of a heat dissipation unit and a storage unit.

[0007] A third circuit board is connected to the first circuit board. The third circuit board is provided with a motherboard connector for connecting to the motherboard unit of the server. The third circuit board obtains power from the first circuit board and supplies power to the motherboard unit.

[0008] In an optional embodiment, the first circuit board is provided with at least two first power connectors, which are respectively connected to at least two power supply units of the server, and the at least two first power connectors are connected in parallel on the first circuit board.

[0009] In an optional embodiment, at least one of the functional connectors includes a control connector, a heat dissipation connector, and a first storage connector, wherein the control connector is used to connect to the logic control unit of the server, the heat dissipation connector is used to connect to the heat dissipation unit of the server, and the first storage connector is used to connect to the storage unit of the server.

[0010] In an optional embodiment, the surfaces of the first circuit board and the second circuit board are arranged opposite to each other.

[0011] In an optional embodiment, the first circuit board has a first male connector on the side facing the second circuit board, and the second circuit board has a first female connector. The first male connector is inserted into the first female connector to connect the first circuit board and the second circuit board. The second circuit board obtains electrical energy from the first circuit board through the first male connector and the first female connector.

[0012] In an optional embodiment, a plurality of connectors are provided between the first circuit board and the second circuit board, and the two ends of the connectors are detachably connected to the first circuit board and the second circuit board, respectively.

[0013] In an optional embodiment, the first male connector is located between the first power connector and the third circuit board.

[0014] In an optional embodiment, the first circuit board includes a first sub-board and a second sub-board, the second sub-board extending from one side edge of the first sub-board, one end of the extended second sub-board being detachably connected to the third circuit board, the first power connector and the connector being located on the first sub-board, and the first male connector being located on the second sub-board.

[0015] In an optional embodiment, the second daughterboard is provided with at least one second storage connector for connecting to the storage unit of the server, and at least one second storage connector is located between the first male connector and the third circuit board.

[0016] In an optional embodiment, the interface of the second storage connector is oriented away from the second daughter board, and the second storage connector is located outside the projection of the second circuit board onto the first circuit board.

[0017] In an optional embodiment, the angle between the surface of the first circuit board and the surface of the third circuit board is greater than zero.

[0018] In an optional embodiment, the surface of the first circuit board is perpendicular to the surface of the third circuit board.

[0019] In an optional embodiment, a second male connector is provided on one side of the third circuit board, and a second female connector is provided on the first circuit board. The second male connector is inserted into the second female connector to detachably connect the first circuit board and the third circuit board.

[0020] In an optional embodiment, the third circuit board is detachably connected to the motherboard connector.

[0021] Secondly, the server provided in this application includes a power distribution device, which includes: a first circuit board, on which a first power connector is provided, the first power connector being used to connect to the power supply unit of the server and obtain electrical energy from the power supply unit;

[0022] A second circuit board is connected to the first circuit board. The second circuit board is provided with at least one functional connector. The at least one functional connector is used to connect to at least one functional unit of the server. The second circuit board obtains power from the first circuit board and supplies power to the functional unit. The at least one functional unit includes at least one of a heat dissipation unit and a storage unit.

[0023] A third circuit board is connected to the first circuit board. The third circuit board is provided with a motherboard connector for connecting to the motherboard unit of the server. The third circuit board obtains power from the first circuit board and supplies power to the motherboard unit.

[0024] In an optional embodiment, the first circuit board is provided with at least two first power connectors, which are respectively connected to at least two power supply units of the server, and the at least two first power connectors are connected in parallel on the first circuit board.

[0025] In an optional embodiment, at least one of the functional connectors includes a control connector, a heat dissipation connector, and a first storage connector, wherein the control connector is used to connect to the logic control unit of the server, the heat dissipation connector is used to connect to the heat dissipation unit of the server, and the first storage connector is used to connect to the storage unit of the server.

[0026] In an optional embodiment, the surfaces of the first circuit board and the second circuit board are arranged opposite to each other.

[0027] In an optional embodiment, the first circuit board has a first male connector on the side facing the second circuit board, and the second circuit board has a first female connector. The first male connector is inserted into the first female connector to connect the first circuit board and the second circuit board. The second circuit board obtains electrical energy from the first circuit board through the first male connector and the first female connector.

[0028] In an optional embodiment, a plurality of connectors are provided between the first circuit board and the second circuit board, and the two ends of the connectors are detachably connected to the first circuit board and the second circuit board, respectively.

[0029] In an optional embodiment, the first male connector is located between the first power connector and the third circuit board.

[0030] In an optional embodiment, the first circuit board includes a first sub-board and a second sub-board, the second sub-board extending from one side edge of the first sub-board, one end of the extended second sub-board being detachably connected to the third circuit board, the first power connector and the connector being located on the first sub-board, and the first male connector being located on the second sub-board.

[0031] In an optional embodiment, the second daughterboard is provided with at least one second storage connector for connecting to the storage unit of the server, and at least one second storage connector is located between the first male connector and the third circuit board.

[0032] In an optional embodiment, the interface of the second storage connector is oriented away from the second daughter board, and the second storage connector is located outside the projection of the second circuit board onto the first circuit board.

[0033] In an optional embodiment, the angle between the surface of the first circuit board and the surface of the third circuit board is greater than zero.

[0034] In an optional embodiment, the surface of the first circuit board is perpendicular to the surface of the third circuit board.

[0035] In an optional embodiment, a second male connector is provided on one side of the third circuit board, and a second female connector is provided on the first circuit board. The second male connector is inserted into the second female connector to detachably connect the first circuit board and the third circuit board.

[0036] In an optional embodiment, the third circuit board is detachably connected to the motherboard connector.

[0037] In this application, compared to related technologies, the power distribution device includes: a first circuit board, on which a first power connector is provided for connection to a power supply unit of a server, obtaining power from the power supply unit; a second circuit board, connected to the first circuit board, on which at least one functional connector is provided for connection to at least one functional unit of the server, the second circuit board obtaining power from the first circuit board and supplying power to the functional unit, the at least one functional unit including at least one of a heat dissipation unit and a storage unit; and a third circuit board, connected to the first circuit board, on which a motherboard connector is provided for connection to the motherboard unit of the server, the third circuit board obtaining power from the first circuit board and supplying power to the motherboard unit. This application, on the one hand, provides power to functional units such as heat dissipation units or storage units through the second circuit board connected to the first circuit board, and on the other hand, provides power to the motherboard unit through the third circuit board connected to the first circuit board. This allows for the supply of power to the motherboard unit and functional units such as heat dissipation units or storage units of a server while using existing motherboard units, thereby reducing server costs. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the structure of one embodiment of the power distribution device provided in this application;

[0040] Figure 2 This is a schematic diagram of another embodiment of the power distribution device provided in this application;

[0041] Figure 3 This is a schematic diagram of another embodiment of the power distribution device provided in this application;

[0042] Figure 4 This is a schematic diagram of the overall structure of another embodiment of the power distribution device provided in this application;

[0043] Figure 5 This is a schematic diagram of the structure of the first circuit board in another embodiment of the power distribution device provided in this application;

[0044] Figure 6 This is a schematic diagram of the structure of the second circuit board in another embodiment of the power distribution device provided in this application;

[0045] Figure 7 This is a schematic diagram of the structure of the third circuit board in another embodiment of the power distribution device provided in this application;

[0046] Figure 8 This is a schematic diagram of the structure of one embodiment of the server provided in this application. Detailed Implementation

[0047] It should be noted that the principles of this application are illustrated by example in a suitable computing environment. The following description is based on the specific embodiments of this application that are illustrated, and should not be regarded as limiting other specific embodiments not detailed herein.

[0048] In the following description of this application, "some embodiments" are referred to, which describe a subset of all possible embodiments. However, it is understood that "some embodiments" may be the same subset or different subset of all possible embodiments, and may be combined with each other without conflict.

[0049] In the following description of this application, the terms "first, second, third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0051] While the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0052] In the embodiments described in this application, references to "one embodiment" or "some embodiments" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0053] In the embodiments of this application, the terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0054] In the embodiments of this application, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0055] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0056] In the embodiments of this application, the directional terms mentioned, such as "up", "down", "left", "right", "inner", and "outer", are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0057] The server involved in this embodiment can be a device in the field of cloud computing or a device in the field of AI (Artificial Intelligence).

[0058] Cloud computing is a computing model that distributes computing tasks across a resource pool composed of a large number of computers, enabling various application systems to obtain computing power, storage space, and information services as needed. The network providing these resources is called the "cloud." From the user's perspective, the resources in the "cloud" are infinitely scalable, readily available, on-demand, and expandable, with payment based on usage.

[0059] As a provider of fundamental cloud computing capabilities, a cloud resource pool (referred to as a cloud platform, generally called an IaaS (Infrastructure as a Service) platform) is established. Various types of virtual resources are deployed within the resource pool for external customers to choose from. The cloud resource pool mainly includes: computing devices (virtualized machines containing operating systems), storage devices, and network devices.

[0060] Based on logical function, a PaaS (Platform as a Service) layer can be deployed on top of the IaaS (Infrastructure as a Service) layer, and a SaaS (Software as a Service) layer can be deployed on top of the PaaS layer. Alternatively, SaaS can be deployed directly on top of IaaS. PaaS is the platform for running software, such as databases and web containers. SaaS refers to various types of business software, such as web portals and bulk SMS senders. Generally speaking, SaaS and PaaS are upper layers compared to IaaS.

[0061] The aforementioned servers can be independent physical servers, server clusters or distributed systems composed of multiple physical servers, or cloud servers that provide basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN (Content Delivery Network), and big data and artificial intelligence platforms.

[0062] With the rapid development of cloud computing and AI businesses, high-density storage servers are increasingly being used in these applications. High-density storage servers are server facilities with an optimized architecture designed for cloud computing, data centers, and the internet. They feature a special internal design that integrates more processors and I / O expansion capabilities within a very small physical space. High-density storage servers achieve higher density compared to other servers primarily through scalability, dual motherboards, and horizontal scaling designs; significantly reducing space costs and noticeably enhancing computer performance. High-density storage servers share power supplies and fans, reducing overall power consumption and greatly improving the efficiency of power and cooling systems. They also offer flexible solutions to meet different user needs. Unlike ordinary rack servers with independent power supplies and fans, high-density storage servers are lighter and more effectively reduce costs.

[0063] However, as the overall power consumption of high-density storage servers increases, the number of components requiring power also increases, posing significant challenges to power supply design and distribution. Current technology uses an adapter board to transfer power from the power supply to the motherboard unit, which then distributes power to each power-consuming unit. Each power-consuming unit can only draw power from the motherboard unit, resulting in poor versatility and scalability. It cannot power the storage units and cooling units of high-density storage servers. To power these components, modifications to the ports on the motherboard unit are needed, leading to higher server costs.

[0064] Therefore, this application provides a power distribution device, comprising: a first circuit board, wherein a first power connector is provided on the first circuit board for connecting to a power supply unit of a server and obtaining power from the power supply unit; a second circuit board, wherein the second circuit board is connected to the first circuit board and wherein at least one functional connector is provided on the second circuit board for connecting to at least one functional unit of the server, wherein the second circuit board obtains power from the first circuit board and supplies power to the functional unit, wherein the at least one functional unit includes at least one of a heat dissipation unit and a storage unit; and a third circuit board, wherein the third circuit board is connected to the first circuit board and wherein a motherboard connector is provided on the third circuit board for connecting to a motherboard unit of the server, wherein the third circuit board obtains power from the first circuit board and supplies power to the motherboard unit.

[0065] This application provides power to functional units such as heat dissipation units or storage units through a second circuit board connected to the first circuit board, and provides power to the motherboard unit through a third circuit board connected to the first circuit board. This allows the application to provide power to the server's motherboard unit and functional units such as heat dissipation units or storage units while using an existing motherboard unit, thereby reducing the cost of the server.

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0067] Please refer to Figure 1 This application provides a power distribution device 10, which includes a first circuit board 110, a second circuit board 120, and a third circuit board 130. The first circuit board 110 has a first power connector 111 for connecting to a power supply unit of a server and obtaining power from the power supply unit. The second circuit board 120 is connected to the first circuit board 110 and has at least one functional connector 129 for connecting to at least one functional unit of the server. The second circuit board 120 obtains power from the first circuit board 110 and supplies power to the functional unit, which includes at least one of a heat dissipation unit and a storage unit. The third circuit board 130 is connected to the first circuit board 110 and has a motherboard connector 132 for connecting to a motherboard unit of the server. The third circuit board 130 obtains power from the first circuit board 110 and supplies power to the motherboard unit.

[0068] In this embodiment, the first circuit board 110, the second circuit board 120, and the third circuit board 130 can be rigid circuit boards, flexible circuit boards, or rigid-flex boards, selected according to specific circumstances. A printed circuit board (PCB) is an indispensable component in modern devices, enabling the integration of numerous functions and circuits. A circuit board can include pads, vias, mounting holes, and conductors. Pads: Metal holes for soldering component leads. Vias: Divided into metal vias and non-metal vias; metal vias are used to connect component leads between layers. Mounting holes: Primarily used to fix the circuit board. Conductors: Copper films forming the electrical network connecting component leads. All components on the circuit board must not exceed this boundary. Circuit boards miniaturize and visualize circuits, and therefore appear in every type of electronic device. Their main function is to provide electrical connections between the various components.

[0069] In this embodiment, the Power Supply Unit (PSU) is used to rectify and convert the input AC power into DC power to provide power to the server. The first power connector 111 can be selected according to specific requirements. A connector, or CONNECTOR, generally refers to an electrical connector. It is a device that connects two active devices to transmit current or signals. Connectors are components frequently encountered by electronic engineers. Their function is very simple: to bridge gaps in a circuit or between isolated circuits, allowing current to flow and enabling the circuit to perform its intended function. Connectors are indispensable components in electronic devices; following the path of current flow, you will always find one or more connectors. Connector forms and structures are highly varied, with different forms depending on the application, frequency, power, and application environment. Generally speaking, connectors connect more than just current. In today's rapidly developing optoelectronic technology, in fiber optic systems, the carrier of signals is light, and glass and plastic replace the wires in ordinary circuits. However, connectors are also used in optical signal paths, and their function is the same as that of circuit connectors.

[0070] In some embodiments, at least one functional unit includes at least one of a heat dissipation unit and a storage unit. The heat dissipation unit may be a fan radiator, a liquid cooling radiator, etc., and the storage unit may be a solid-state drive, a hard disk drive, etc., depending on the specific situation. At least one functional connector 129 is used to connect at least one functional unit.

[0071] This application provides power to functional units such as heat dissipation units or storage units through a second circuit board 120 connected to the first circuit board 110, and provides power to the motherboard unit through a third circuit board 130 connected to the first circuit board 110. This allows the application to provide power to the server's motherboard unit and functional units such as heat dissipation units or storage units while using an existing motherboard unit, thereby reducing the cost of the server.

[0072] See Figure 2 This application provides a power distribution device 10, which includes a first circuit board 110, a second circuit board 120, and a third circuit board 130. The first circuit board 110 has a first power connector 111 for connecting to a power supply unit of a server and obtaining power from the power supply unit. The second circuit board 120 is connected to the first circuit board 110 and has at least one functional connector 129 for connecting to at least one functional unit of the server. The second circuit board 120 obtains power from the first circuit board 110 and supplies power to the functional unit, which includes at least one of a heat dissipation unit and a storage unit. The third circuit board 130 is connected to the first circuit board 110 and has a motherboard connector 132 for connecting to a motherboard unit of the server. The third circuit board 130 obtains power from the first circuit board 110 and supplies power to the motherboard unit.

[0073] In some embodiments, the first circuit board 110 is provided with two first power connectors 111, which are respectively connected to two power supply units of the server, and are connected in parallel on the first circuit board 110. The two first power connectors 111 connected in parallel on the first circuit board 110 can obtain power from the two power supply units respectively. When one power supply unit or first power connector 111 fails, the other power supply unit or first power connector 111 can continue to provide power, ensuring normal power supply to the device. In other embodiments, the first circuit board 110 is provided with at least two first power connectors 111, which are respectively connected to at least two power supply units of the server, and are connected in parallel on the first circuit board 110. The number of first power connectors 111 can be three or more, with at least two first power connectors 111 serving as backup connectors for each other, which can improve the power supply stability of the power distribution equipment.

[0074] In some embodiments, the second circuit board 120 is provided with two functional connectors 129 for connecting to two functional units of the server. The second circuit board 120 obtains power from the first circuit board 110 and supplies power to the two functional units, which include at least one of a heat dissipation unit and a storage unit. In other embodiments, the second circuit board 120 is provided with two or more functional connectors 129.

[0075] See Figure 3 In this embodiment, the power distribution device 10 includes a first circuit board 110, a second circuit board 120, and a third circuit board 130. The first circuit board 110 has a first power connector 111 for connecting to a power supply unit of the server and obtaining power from the power supply unit. The second circuit board 120 is connected to the first circuit board 110 and has at least one functional connector for connecting to at least one functional unit of the server. The second circuit board 120 obtains power from the first circuit board 110 and supplies power to the functional unit. The at least one functional unit includes at least one of a heat dissipation unit and a storage unit. The third circuit board 130 is connected to the first circuit board 110 and has a motherboard connector 132 for connecting to a motherboard unit of the server. The third circuit board 130 obtains power from the first circuit board 110 and supplies power to the motherboard unit.

[0076] In some embodiments, the first circuit board 110 is provided with two first power connectors 111, which are respectively connected to two power supply units of the server, and are connected in parallel on the first circuit board 110. The two first power connectors 111 connected in parallel on the first circuit board 110 can obtain power from the two power supply units respectively. When one power supply unit or first power connector 111 fails, the other power supply unit or first power connector 111 can continue to provide power, ensuring normal power supply to the device.

[0077] In some embodiments, at least one functional connector includes a control connector 121, a heat dissipation connector 122, and a first storage connector 123. The control connector 121 is used to connect to the logic control unit of the server, the heat dissipation connector 122 is used to connect to the heat dissipation unit of the server, and the first storage connector 123 is used to connect to the storage unit of the server.

[0078] The logic control unit can be a Retimer chip. A Retimer chip is a hybrid digital-analog signal device with sensing capabilities, enabling it to completely recover and retransmit the data signal. Specifically, it extracts the embedded clock from the input signal using its internal Clock and Data Recovery (CDR) circuit, and then retransmits the data using the complete, undamaged clock signal to form a new copy of the original data signal. In addition to the broadband gain node also present in the Redriver, the Retimer chip also includes a Decision Feedback Equalizer (DFE) and a Finite Impulse Response (FIR) driver for the transmitted signal. It typically uses Finite State Machines (FSMs) or a microcontroller to automatically adapt the broadband gain node, implementing the Link Training and Status State Machine (LTSSM) function. This Retimer's method of recovering data first and then retransmitting the signal through a serial channel effectively solves the signal attenuation problem.

[0079] In some embodiments, a first male connector 112 is provided on a first circuit board 110, and a first female connector 124 is provided on a second circuit board 120. The first male connector 112 is connected to the first female connector 124, connecting the first circuit board 110 and the second circuit board 120. The second circuit board 120 obtains electrical energy from the first circuit board 110 through the first male connector 112 and the first female connector 124.

[0080] In some embodiments, the second circuit board 120 is provided with at least one second storage connector 115, which is used to connect to the storage unit of the server.

[0081] In some embodiments, the third circuit board 130 is provided with a second male connector 131, and the first circuit board 110 is provided with a second female connector 116. The second male connector 131 is connected to the second female connector 116 to connect the first circuit board 110 and the third circuit board 130.

[0082] For further details, please refer to [link / reference]. Figures 4 to 7In this embodiment, the power distribution device 10 includes a first circuit board 110, a second circuit board 120, and a third circuit board 130. The first circuit board 110 has a first power connector 111 for connecting to a power supply unit of the server and obtaining power from the power supply unit. The second circuit board 120 is connected to the first circuit board 110 and has at least one functional connector for connecting to at least one functional unit of the server. The second circuit board 120 obtains power from the first circuit board 110 and supplies power to the functional unit, which includes at least one of a heat dissipation unit and a storage unit. The third circuit board 130 is connected to the first circuit board 110 and has a motherboard connector 132 for connecting to a motherboard unit 20 of the server. The third circuit board 130 obtains power from the first circuit board 110 and supplies power to the motherboard unit 20.

[0083] In this embodiment, the first circuit board 110 is provided with two first power connectors 111, which are respectively connected to two power supply units of the server. The two first power connectors 111 are connected in parallel on the first circuit board 110. The two first power connectors 111 connected in parallel on the first circuit board 110 can obtain power from the two power supply units respectively. When one power supply unit or first power connector 111 fails, the other power supply unit or first power connector 111 can continue to provide power to ensure normal power supply to the device.

[0084] In this embodiment of the application, at least one functional connector includes a control connector 121, a heat dissipation connector 122, and a first storage connector 123. The control connector 121 is used to connect to the logic control unit of the server, the heat dissipation connector 122 is used to connect to the heat dissipation unit of the server, and the first storage connector 123 is used to connect to the storage unit of the server.

[0085] In this embodiment, the surfaces of the first circuit board 110 and the second circuit board 120 are arranged opposite to each other. This arrangement reduces the space occupied by the first circuit board 110, the second circuit board 120, and their components.

[0086] Specifically, the angle between the surface of the first circuit board 110 and the surface of the second circuit board 120 is less than 90 degrees, and the projection of the second circuit board 120 onto the plane containing the first circuit board 110 at least partially overlaps with the first circuit board 110. In an optional embodiment, the angle between the surface of the first circuit board 110 and the surface of the second circuit board 120 is 0 degrees, that is, the surface of the first circuit board 110 and the surface of the second circuit board 120 are parallel, which can further reduce the space occupied by the first circuit board 110, the second circuit board 120 and the devices thereon. It should be noted that the angle between the surface of the first circuit board 110 and the surface of the second circuit board 120 ranges from 0 degrees to 90 degrees.

[0087] In this embodiment of the application, the first circuit board 110 is provided with a first male connector 112 on the side facing the second circuit board 120, and the second circuit board 120 is provided with a first female connector 124. The first male connector 112 is inserted into the first female connector 124 to connect the first circuit board 110 and the second circuit board 120. The second circuit board 120 obtains electrical energy from the first circuit board 110 through the first male connector 112 and the first female connector 124.

[0088] In this embodiment, the control connector 121, the heat dissipation connector 122, the first storage connector 123, and the first connection socket 124 are spaced apart in the first direction F1. The number of heat dissipation connectors 122 is three; however, in other embodiments, the number of heat dissipation connectors 122 can be two, four, or more.

[0089] In this embodiment, two first power connectors 111 are spaced apart in a first direction F1. The two first power connectors 111 are flush with one side of the power supply unit, one side of the first circuit board 110, and one side of the second circuit board 120.

[0090] Furthermore, the orientation of the interfaces of the heat dissipation connector 122 and the first storage connector 123 is opposite to the orientation of the interface of the first power connector 111, which allows the heat dissipation unit and the storage unit to be connected from the side of the power distribution device 10 to the heat dissipation connector 122 and the first storage connector 123, facilitating the access of the power supply unit, the heat dissipation unit and the storage unit.

[0091] Furthermore, the interface of the control connector 121 faces away from the heat dissipation connector 122, allowing the logic control unit to be connected to the control connector 121 from the side of the power distribution device 10, facilitating the connection of the logic control unit. Also, the opening of the control connector 121 faces a different direction than the interfaces of the heat dissipation connector 122 and the first storage connector 123, allowing the logic control unit, heat dissipation unit, and storage unit to be connected from different sides of the second circuit board 120, avoiding interference.

[0092] Furthermore, the interface of the first power connector 111 is far away from the first male connector 112, which can enable the power supply unit to be connected to the first power connector 111 from the side of the power distribution device 10, thus facilitating the connection of the power supply unit.

[0093] In this embodiment, there are two first female connectors 124 and two first male connectors 112. The two first male connectors 112 are spaced apart in the first direction F1. When the connection between one of the first male connectors 112 and the first female connector 124 fails, the connection between the other first male connector 112 and the first female connector 124 can serve as a backup connection, thereby maintaining the normal operation of the power distribution device 10.

[0094] In this embodiment, the first female connector 124 and the first male connector 112 can be the male and female connectors of a RadSok connector. RadSok connectors are based on overprinted patterns forming a planar grid, twisted into a hyperbolic geometry to provide stable, unique high-density terminal-to-mating terminals. Connecting the first circuit board 110 and the second circuit board 120 via RadSok connectors enables better power transmission.

[0095] In this embodiment, a plurality of connectors are provided between the first circuit board 110 and the second circuit board 120, and the two ends of the connectors are detachably connected to the first circuit board 110 and the second circuit board 120, respectively. The connectors can be bolts, pins, etc., depending on the specific situation. The number of connectors can be one or more, depending on the specific situation.

[0096] In some embodiments, the multiple connectors may be bolts, and the two ends of the multiple connectors are respectively threaded to the first circuit board 110 and the second circuit board 120.

[0097] In other embodiments, the multiple connectors can be pins, and the first circuit board 110 and the second circuit board 120 have multiple pin holes. The two ends of the multiple connectors are respectively inserted into the pin holes on the first circuit board 110 and the second circuit board 120, so as to be connected to the first circuit board 110 and the second circuit board 120 respectively.

[0098] In this embodiment, the first male connector 112 is located between the first power connector 111 and the third circuit board 130. Since the surfaces of the first circuit board 110 and the second circuit board 120 are positioned opposite each other, the first power connector 111 is used to connect the power supply unit, and the third circuit board 130 is used to connect the main board unit 20. The first male connector 112, as a connecting device between the first circuit board 110 and the second circuit board 120, is located between the first power connector 111 and the third circuit board 130, allowing the second circuit board 120 to be closer to the center of the first circuit board 110, thus avoiding interference with the installation of the main board unit 20 and the power supply unit.

[0099] In this embodiment of the application, the first circuit board 110 includes a first sub-board 113 and a second sub-board 114. The second sub-board 114 extends out from one side edge of the first sub-board 113. One end of the second sub-board 114 is detachably connected to the third circuit board 130. The first power connector 111 and the connector are located on the first sub-board 113, and the first male connector 112 is located on the second sub-board 114.

[0100] In this embodiment, the first sub-board 113 and the second sub-board 114 can be detachably connected or integrally formed, depending on the specific circumstances.

[0101] Furthermore, the second sub-board 114 extends from one side edge of the first sub-board 113 in a second direction F2. The width of the second sub-board 114 in the first direction F1 is smaller than the width of the first sub-board 113 in the first direction F1. Both the first direction F1 and the second direction F2 are parallel to the surface of the first circuit board 110, and the second direction F2 is perpendicular to the first direction F1. One side edge of the second sub-board 114 is flush with one side edge of the first sub-board 113.

[0102] In this embodiment, the multiple connectors include multiple first connectors 141 and multiple second connectors 142, with the first connectors 141 and second connectors 142 respectively located along the edges of the first daughter board 113. Specifically, two first power connectors 111 are located between the first connectors 141 and the second connectors 142. The second daughter board 114 extends in a second direction F2 from one edge of the first daughter board 113, allowing devices on the first daughter board 113 to avoid the second connectors 142, thus preventing the second connectors 142 from interfering with other devices.

[0103] In this embodiment, the second daughter board 114 is provided with at least one second storage connector 115, which is used to connect to the storage unit of the server. The at least one second storage connector 115 is located between the first male connector 112 and the third circuit board 130. Specifically, there are three second storage connectors 115, but of course, there can be three or more.

[0104] In this embodiment, the interface of the second storage connector 115 faces away from the second daughter board 114, and the second storage connector 115 is located outside the projection of the second circuit board 120 onto the first circuit board 110. The orientation of the interface of the second storage connector 115 away from the second daughter board 114 ensures that the storage cells connected to the interface of the second storage connector 115 do not interfere with the third circuit board 130. The location of the second storage connector 115 outside the projection of the second circuit board 120 onto the first circuit board 110 further prevents interference between the storage cells connected to the interface of the second storage connector 115 and the second circuit board 120. This allows for a more compact structure of the power distribution device 10 and reduces the space occupied by the power distribution device 10.

[0105] In other embodiments, the number of second storage connectors 115 can be two, with the interfaces of the two second storage connectors 115 being far apart from each other, and the two second storage connectors 115 being arranged at intervals in the first direction F1.

[0106] In this embodiment, the angle between the surface of the first circuit board 110 and the surface of the third circuit board 130 is greater than zero. Since the surface of the first circuit board 110 and the surface of the second circuit board 120 are arranged opposite each other, if the surface of the first circuit board 110 and the surface of the third circuit board 130 were parallel, interference would occur between their positions. Therefore, the angle between the surface of the first circuit board 110 and the surface of the third circuit board 130 is greater than zero, making them non-parallel. This avoids interference between the positions of the third circuit board 130 and the second circuit board 120, thereby making the power distribution device 10 more compact and reducing its footprint.

[0107] In this embodiment, the surface of the first circuit board 110 is perpendicular to the surface of the third circuit board 130. The perpendicularity of the first circuit board 110 to the third circuit board 130 minimizes interference between the positions of the third circuit board 130 and the second circuit board 120, thereby making the power distribution device 10 more compact and reducing its footprint.

[0108] In this embodiment, a second male connector 131 is provided on one side of the third circuit board 130, and a second female connector 116 is provided on the first circuit board 110. The second male connector 131 is inserted into the second female connector 116 to detachably connect the first circuit board 110 and the third circuit board 130. Specifically, a second female board 114 is provided with a second female connector 116, and the second male connector 131 is inserted into the second female connector 116 to detachably connect the second female board 114 and the third circuit board 130.

[0109] In this embodiment, the third circuit board 130 is detachably connected to the motherboard connector 132. By replacing different motherboard connectors 132, different types of motherboard units 20 can be adapted.

[0110] This application provides power to functional units such as heat dissipation units or storage units through a second circuit board 120 connected to the first circuit board 110, and provides power to the motherboard unit through a third circuit board 130 connected to the first circuit board 110. This allows the application to provide power to the server's motherboard unit and functional units such as heat dissipation units or storage units while using an existing motherboard unit, thereby reducing the cost of the server.

[0111] This application provides a server, which includes the power distribution device 10 described above.

[0112] See Figure 8 This application provides a server 100, which includes a power distribution device 10, a power supply unit 40, at least one functional unit 30, and a motherboard unit 20. The power distribution device 10 includes a first circuit board 110, a second circuit board 120, and a third circuit board 130. The first circuit board 110 has a first power connector 111 for connecting to the power supply unit 40 and obtaining power from it. The second circuit board 120 is connected to the first circuit board 110 and has at least one functional connector 129 for connecting to at least one functional unit 30 of the server. The second circuit board 120 obtains power from the first circuit board 110 and supplies power to the functional unit 30. The at least one functional unit 30 includes at least one of a heat dissipation unit and a storage unit. The third circuit board 130 is connected to the first circuit board 110. The third circuit board 130 is provided with a motherboard connector 132, which is used to connect to the motherboard unit 20 of the server. The third circuit board 130 obtains power from the first circuit board 110 and supplies power to the motherboard unit 20.

[0113] Furthermore, the server 100 also includes a chassis, a power distribution device 10, a power supply unit 40, at least one functional unit 30, and a motherboard unit 20, all of which are located inside the chassis.

[0114] Compared to related technologies, the power distribution device includes: a first circuit board with a first power connector for connecting to a server's power supply unit and obtaining power from it; a second circuit board connected to the first circuit board, with at least one functional connector for connecting to at least one functional unit of the server, the second circuit board obtaining power from the first circuit board and supplying power to the functional unit, the at least one functional unit including at least one of a heat dissipation unit and a storage unit; and a third circuit board connected to the first circuit board, with a motherboard connector for connecting to the server's motherboard unit, the third circuit board obtaining power from the first circuit board and supplying power to the motherboard unit. This application, on the one hand, provides power to functional units such as heat dissipation units or storage units through a second circuit board connected to the first circuit board, and on the other hand, provides power to the motherboard unit through a third circuit board connected to the first circuit board. This allows for the supply of power to the server's motherboard unit and functional units such as heat dissipation units or storage units while using existing motherboard units, thereby reducing server costs.

[0115] The power distribution device and server provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0116] It should be noted that when the above embodiments of this application are applied to specific products or technologies, and user-related data is involved, user permission or consent is required, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

Claims

1. A power distribution device, characterized in that, The power distribution device includes: A first circuit board is provided with a first power connector, which is used to connect to the power supply unit of the server and obtain electrical energy from the power supply unit. A second circuit board is connected to the first circuit board. The second circuit board is provided with at least one functional connector. The at least one functional connector is used to connect to at least one functional unit of the server. The second circuit board obtains power from the first circuit board and supplies power to the functional unit. The at least one functional unit includes at least one of a heat dissipation unit and a storage unit. A third circuit board is connected to the first circuit board. The third circuit board is provided with a motherboard connector for connecting to the motherboard unit of the server. The third circuit board obtains power from the first circuit board and supplies power to the motherboard unit.

2. The power distribution device according to claim 1, characterized in that, The first circuit board is provided with at least two first power connectors, which are respectively connected to at least two power supply units of the server, and the at least two first power connectors are connected in parallel on the first circuit board.

3. The power distribution device according to claim 1, characterized in that, At least one of the functional connectors includes a control connector, a heat dissipation connector, and a first storage connector. The control connector is used to connect to the logic control unit of the server, the heat dissipation connector is used to connect to the heat dissipation unit of the server, and the first storage connector is used to connect to the storage unit of the server.

4. The power distribution device according to claim 1, characterized in that, The surfaces of the first circuit board and the second circuit board are arranged opposite each other.

5. The power distribution device according to claim 4, characterized in that, The first circuit board has a first male connector on the side facing the second circuit board, and the second circuit board has a first female connector. The first male connector is inserted into the first female connector to connect the first circuit board and the second circuit board. The second circuit board obtains power from the first circuit board through the first male connector and the first female connector.

6. The power distribution device according to claim 5, characterized in that, A plurality of connectors are provided between the first circuit board and the second circuit board, and the two ends of the connectors are detachably connected to the first circuit board and the second circuit board, respectively.

7. The power distribution device according to claim 6, characterized in that, The first male connector is located between the first power connector and the third circuit board.

8. The power distribution device according to claim 7, characterized in that, The first circuit board includes a first sub-board and a second sub-board. The second sub-board extends out from one side edge of the first sub-board. One end of the extended second sub-board is detachably connected to the third circuit board. The first power connector and the connector are located on the first sub-board, and the first male connector is located on the second sub-board.

9. The power distribution device according to claim 8, characterized in that, The second sub-board is provided with at least one second storage connector, which is used to connect to the storage unit of the server, and at least one second storage connector is located between the first male connector and the third circuit board.

10. The power distribution device according to claim 9, characterized in that, The interface of the second storage connector is oriented away from the second daughter board, and the second storage connector is located outside the projection of the second circuit board onto the first circuit board.

11. The power distribution device according to claim 1, characterized in that, The angle between the surface of the first circuit board and the surface of the third circuit board is greater than zero.

12. The power distribution device according to claim 11, characterized in that, The surface of the first circuit board is perpendicular to the surface of the third circuit board.

13. The power distribution device according to claim 1, characterized in that, The third circuit board has a second male connector on one side, and the first circuit board has a second female connector. The second male connector can be inserted into the second female connector to detachably connect the first circuit board and the third circuit board.

14. The power distribution device according to claim 1, characterized in that, The third circuit board is detachably connected to the motherboard connector.

15. A server, characterized in that, The server includes the power distribution device according to any one of claims 1-14.

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