An adaptive two-phase heat dissipation system and control method for server chips

Abstract

This invention relates to the field of heat dissipation technology for electronic devices, and discloses an adaptive two-phase heat dissipation system and control method for server chips. The system includes a circulation drive module, an evaporative cooling plate module, a proportional flow distribution module, a composite cold source module, a pressure equalization and throttling module, a volume balancing module, and a control and acquisition module. The control and acquisition module generates a predicted heat load based on the chip's multi-dimensional operating status data and controls the fluid distribution ratio between the natural cooling and mechanical cooling branches. The pressure equalization and throttling module performs pressure reduction and throttling to eliminate pressure difference before the two branches merge. The volume balancing module dynamically changes the physical volume of the variable-volume cavity according to the fluid dryness and throttling flash gas phase parameters. This invention solves the hysteresis problem of temperature feedback control, avoids fluid backflow caused by pressure differences in multiple branches, and maintains the single-phase liquid condition of the fluid at the inlet of the circulation drive module, preventing cavitation.

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