Intelligent power grid user external adaptive heat dissipation and moisture-proof electric energy metering box

Abstract

The application discloses an intelligent power grid user external self-adaptive heat-dissipation moisture-proof electric energy metering box, which comprises a box body, two inner-embedded sealed box doors are movably arranged on the front face of the box body, a ceiling box is fixedly arranged on the top of the box body, air vents are formed in the two sides of the ceiling box, a photovoltaic power generation plate group is arranged on the outer side of the top end of the ceiling box, a sunken box is fixedly arranged at the bottom of the box body, an installation pipe is fixedly arranged at the bottom of the center of the sunken box, and a plurality of heat-conducting strips are fixedly and penetratively arranged on the outer side of the bottom end of the installation pipe. The sintered copper pipe assembly is provided with a high-density capillary core structure formed by sintering copper powder in the inside, has strong capillary suction and fast heat-conducting response, can drive working medium phase change circulation under the condition of no power, realizes passive heat dissipation by combining with the underground buried pipe and the constant-temperature and low-temperature characteristics of the stratum, can effectively avoid the power consumption and interference problems of active heat dissipation, can reduce the opening holes outside the box, and improves the sealing and moisture-proof performance.

Description

Technical Field

[0001] This invention relates to the field of electricity metering box technology, specifically to an external adaptive heat dissipation and moisture-proof electricity metering box for smart grid users. Background Technology

[0002] Electricity metering boxes are devices used for electricity metering in the 3-35kV range. They include combined instrument transformers (for collecting three-phase current and voltage signals), a box enclosure, electricity meters, surge arresters, vacuum circuit breakers (for prepaid systems), etc. Electricity metering is the process of measuring, recording, analyzing, and managing electricity consumption through specialized devices. It is the core basis for power companies' electricity billing, energy efficiency assessment, grid operation monitoring, and user electricity management. Outdoor electricity metering boxes, as the core protective carrier of grid terminal metering equipment, are widely deployed in outdoor environments such as open fields, transformer substations, and residential building exteriors. They are subjected to long-term exposure to high summer temperatures, drastic diurnal temperature variations, high humidity during the rainy season, and dust and insect infestations. The core components integrated inside the box, such as smart meters, current / voltage transformers, terminals, and power supply modules, have their operating temperature and humidity stability directly affecting the accuracy of electricity metering, electrical insulation performance, and equipment lifespan. This is crucial for ensuring the fairness of electricity metering and the reliability of grid operation.

[0003] Traditional natural heat dissipation methods rely on ventilation louvers and holes in the enclosure to achieve air convection. While simple in structure and low in cost, these methods are extremely inefficient in high-temperature summer environments. Heat easily accumulates inside, leading to excessive internal temperature rise, causing temperature drift in the metering chip and accelerated aging of electronic components. Furthermore, the ventilation holes directly introduce rainwater, humid air, and dust, significantly increasing the risk of condensation, corrosion, and short circuits, failing to simultaneously meet both heat dissipation and moisture protection requirements. Active cooling solutions, such as adding cooling fans and semiconductor cooling modules, can improve heat dissipation, but require additional power, increasing system power consumption and making energy saving difficult. Additionally, moisture protection methods often rely on heating dehumidification, which requires continuous power consumption and contradicts heat dissipation requirements, making it difficult to achieve stable, long-term, energy-saving, and adaptive temperature and humidity coordination. Therefore, this paper proposes a smart grid user outdoor adaptive heat dissipation and moisture-proof energy metering box. Summary of the Invention

[0004] The purpose of this invention is to provide an outdoor adaptive heat dissipation and moisture-proof power metering box for smart grid users, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a smart grid user external adaptive heat dissipation and moisture-proof energy metering box, comprising a box body, two embedded sealed doors movably installed on the front of the box body, a roof box fixedly installed on the top of the box body, ventilation windows on both sides of the roof box, a photovoltaic power generation panel array installed on the outer side of the top of the roof box, a sunken box fixedly installed at the bottom of the box body, an installation pipe fixedly installed at the bottom center of the sunken box, several heat-conducting strips fixedly installed through the outer side of the bottom end of the installation pipe, a second heat insulation layer laid on the inner wall of the sunken box, and a first composite heat insulation layer laid on the inner wall of the box body. The interior of the housing is surrounded by sintered copper tube assemblies. A vacuum valve is connected to the bottom of one end of the sintered copper tube assembly. The bottom end of the vacuum valve is connected to a connecting sintered tube. The bottom end of the connecting sintered tube is connected to a spiral vortex sintered tube. A semiconductor cooler cooling end is fixedly installed on the outside of the spiral vortex sintered tube. A semiconductor cooler heat dissipation end is installed at the bottom of the semiconductor cooler cooling end. A flow guiding sintered tube is connected to the center end of the spiral vortex sintered tube. The other end of the flow guiding sintered tube is connected to a spiral sintered tube. The bottom end of the spiral sintered tube is connected to a connecting sintered tube. Two flow guiding closed cones are fixedly sleeved inside the bottom end of the mounting tube.

[0006] The sintered copper tube assembly includes a copper tube fitting, the inner wall of which is sintered with a copper powder sintered layer, and a number of heat dissipation fins are fixedly sleeved on the outer side of the copper tube fitting, with a number of mounting holes opened inside the heat dissipation fins.

[0007] Preferably, the outer side of the recessed sealed door is recessed and embedded into the inner side of the box body, and the joint between the recessed sealed door and the box body is sealed. A temperature and humidity sensor is installed inside the box body, and a dehumidifier is installed at the bottom of the inner cavity of the box body.

[0008] Preferably, the bottom of the inner cavity of the canopy box is covered with a heat insulation layer three, and the bottom of the back of the canopy box is connected to a drain valve.

[0009] Preferably, the bottom of the sunken box is fixedly equipped with several legs, which are symmetrically and evenly distributed in a rectangular shape at the bottom of the sunken box, and the composite heat insulation layer is composed of a shielding layer and a heat insulation layer.

[0010] Preferably, the heat dissipation fins are linearly and uniformly distributed on the outside of the copper pipe fitting, the mounting holes are rectangularly and linearly and uniformly opened inside the heat dissipation fins, the sintered copper pipe assembly is distributed around the inside of the housing, and the bottom end of the sintered copper pipe assembly is fixedly inserted through the housing, the sunken box and the flow guide sealing cone and extends to the bottom of the inner cavity of the mounting pipe.

[0011] Preferably, the spiral sintered tube is fixedly embedded inside the heat dissipation plate of the cooling end of the semiconductor cooler, the cooling end of the semiconductor cooler is fixedly installed at the bottom of the inner cavity of the sunken box, the heat dissipation end of the semiconductor cooler is fixedly installed at the bottom of the sunken box, and the opposite sides of the cooling end and the heat dissipation end of the semiconductor cooler are heat-insulated.

[0012] Preferably, the flow guiding sintered tube is fixedly inserted through the sink box and extends into the interior of the mounting tube, the spiral sintered tube is sleeved on the opposite side of the mounting tube and the sintered copper tube assembly, the connecting sintered tube is fixedly inserted through a flow guiding closed cone at the bottom and connects to the bottom of the flow guiding closed cone, and the flow guiding closed cone is fixedly sleeved on the outside of the sintered copper tube assembly and the flow guiding sintered tube.

[0013] Preferably, the bottom of the inner cavity of the mounting tube is provided with a working fluid coolant, the heat-conducting strip is fixedly inserted through the mounting tube and extends to the outside of the mounting tube, the heat-conducting strip is evenly distributed in a circle inside the mounting tube, the bottom end of the mounting tube is conical, the length of the mounting tube is greater than 1 meter, and the length of the spiral sintered tube is greater than the size of the sintered copper tube assembly inside the box.

[0014] Preferably, a battery assembly is installed at the bottom of the inner cavity of the sunken box, and a control module assembly is installed at the bottom of the inner cavity of the sunken box.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. When the device is in use, the temperature inside the box will generally be stable at slightly higher than the ground temperature due to the ground environment and the operation of the internal electronic components. At this time, the heat inside the box will cause the working liquid inside the sintered copper tube assembly to evaporate and absorb heat, and gradually extend and be extracted under the internal sintering capillary action. The liquid gradually spreads from the bottom of the inner cavity of the installation tube to the inside of the sintered copper tube assembly, and contacts the heat dissipation structure of the electrical appliance in the fins of the sintered copper tube assembly, improving the heat absorption efficiency. The internal working liquid absorbs heat and vaporizes inside the sintered copper tube assembly. The working liquid absorbs heat in the underground section of the installation tube and introduces the heat into the ground through the working liquid and heat conduction strip inside the installation tube. The soil temperature is low and stable, the vapor condenses into liquid, and the heat is finally absorbed by the earth, realizing passive continuous heat dissipation. The temperature inside the box fluctuates little, reducing the risk of condensation, and the temperature remains relatively stable. The heat dissipation capacity is stronger when exposed to high temperatures. It does not consume electricity, does not require wiring, does not occupy the power consumption budget, has good energy-saving and environmental protection effects, long service life, and is maintenance-free. 2. If the cabinet contains high-power electronic components, and the temperature and humidity sensor generates a lot of heat while the external environment cannot achieve the maximum effect, the heat dissipation end and the cooling end of the semiconductor cooler will be activated. The cooling end of the semiconductor cooler condenses and liquefies the working fluid flowing inside through the spiral vortex sintered tube, and dissipates the heat to the bottom of the sink box through the heat dissipation end of the semiconductor cooler, thereby ensuring the heat dissipation effect, increasing heat dissipation redundancy, and starting less frequently. Compared with other active cooling methods, it consumes less power and is more energy-efficient. 3. The sintered copper tube assembly has a high-density capillary core structure formed by internal sintered copper powder. It has strong capillary attraction and fast thermal response. It can drive the working fluid phase change cycle by temperature difference under no-power conditions. Combined with the underground buried pipe to utilize the constant temperature and low temperature characteristics of the stratum to achieve passive heat dissipation, it can effectively avoid the power consumption and interference problems of active heat dissipation. At the same time, it can reduce the openings on the outside of the box and improve the sealing and moisture-proof performance. Attached Figure Description

[0016] Figure 1 This is a front-view stereoscopic structural diagram of the present invention.

[0017] Figure 2 This is a schematic diagram of the three-dimensional appearance structure of the present invention from a rear-view or upward-view perspective.

[0018] Figure 3 This is a three-dimensional structural diagram of a section of the sintered copper tube assembly of the present invention.

[0019] Figure 4 This is a front sectional view of the internal structure of the present invention.

[0020] Figure 5 This is a top-view cross-sectional view of the internal structure of the sunken box of the present invention.

[0021] Figure 6 For the present invention Figure 2 Enlarged structural diagram at point A in the middle.

[0022] Figure 7 For the present invention Figure 4 Enlarged structural diagram at point B.

[0023] Figure 8 For the present invention Figure 4 Enlarged structural diagram at point C.

[0024] In the diagram: 1. Box body; 2. Embedded sealed door; 3. Roof box; 4. Photovoltaic power generation panel; 5. Ventilation window; 6. Sunken box; 7. Support legs; 8. Mounting pipe; 9. Heat-conducting strip; 10. Drain valve; 11. Heat dissipation end of semiconductor cooler; 12. Composite insulation layer one; 13. Insulation layer two; 14. Battery assembly; 15. Control module assembly; 16. Sintered copper tube assembly; 1601. Copper pipe fitting; 1602. Copper powder sintered layer; 1603. Heat dissipation fins; 1604. Mounting hole; 17. Dehumidifier; 18. Temperature and humidity sensor; 19. Insulation layer three; 20. Cooling end of semiconductor cooler; 21. Spiral vortex sintered tube; 22. Flow guiding sintered tube; 23. Vacuum valve; 24. Connecting sintered tube; 25. Spiral sintered tube; 26. Connecting sintered tube; 27. Flow guiding closed cone. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Please see Figures 1-8 This invention provides a technical solution: an outdoor adaptive heat dissipation and moisture-proof power metering box for smart grid users, comprising a box body 1, two embedded sealed boxes 2 movably installed on the front of the box body 1, a roof box 3 fixedly installed on the top of the box body 1, ventilation windows 5 on both sides of the roof box 3, a photovoltaic power generation panel 4 installed on the outer side of the top of the roof box 3, a sunken box 6 fixedly installed at the bottom of the box body 1, an installation pipe 8 fixedly installed at the bottom center of the sunken box 6, several heat-conducting strips 9 fixedly installed through the outer side of the bottom end of the installation pipe 8, a second heat insulation layer 13 laid on the inner wall of the sunken box 6, a composite heat insulation layer 12 laid on the inner wall of the box body 1, and sintered materials arranged around the inside of the box body 1. A copper tube assembly 16 has a vacuum valve 23 connected to the bottom of one end of the sintered copper tube assembly 16. The bottom end of the vacuum valve 23 is connected to a connecting sintered tube 24. The bottom end of the connecting sintered tube 24 is connected to a spiral vortex sintered tube 21. A semiconductor cooler cooling end 20 is fixedly installed on the outside of the spiral vortex sintered tube 21. A semiconductor cooler heat dissipation end 11 is installed at the bottom of the semiconductor cooler cooling end 20. A flow guiding sintered tube 22 is connected to the center end of the spiral vortex sintered tube 21. The other end of the flow guiding sintered tube 22 is connected to a spiral sintered tube 25. The bottom end of the spiral sintered tube 25 is connected to a connecting sintered tube 26. Two flow guiding closed cones 27 are fixedly sleeved inside the bottom end of the mounting tube 8.

[0027] The sintered copper tube assembly 16 includes a copper tube 1601, the inner wall of which is sintered with a copper powder sintered layer 1602, and a number of heat dissipation fins 1603 are fixedly sleeved on the outer side of the copper tube 1601. A number of mounting holes 1604 are opened inside the heat dissipation fins 1603.

[0028] The working principle of the above technical solution is as follows: During use, the housing 1 and the sunken box 6 are installed at the usage position, and the installation pipe 8 is inserted into the ground. When in use, due to the ground environment and the operation of the internal electronic components, the temperature inside the housing 1 will generally stabilize at slightly higher than the ground temperature. At this time, the heat inside the housing 1 will cause the working fluid inside the sintered copper tube assembly 16 to evaporate and absorb heat, and gradually extend and be extracted under the internal sintering capillary action. The liquid gradually spreads from the bottom of the inner cavity of the installation pipe 8 into the interior of the sintered copper tube assembly 16. The fins of the sintered copper tube assembly 16 come into contact with the heat dissipation structure of the electrical appliance, improving heat absorption efficiency. The internal working fluid absorbs heat and vaporizes inside the sintered copper tube assembly 16, then flows along the assembly into the vacuum valve 23 and the connecting sintered tube 24, and is introduced into the spiral vortex sintered tube 21 and the guide sintered tube 22. At this time, the temperature inside the sinking box 6 is lower than the temperature inside the box 1. The working fluid initially absorbs the heat, gradually liquefies, and flows back into the spiral sintered tube 25 and the connecting sintered tube 26. In the underground section of the installation pipe 8, heat is absorbed and transferred to the ground through the working fluid inside the installation pipe 8 and the heat-conducting strip 9. The soil temperature is low and stable, the steam condenses into liquid, and the heat is eventually absorbed by the earth, achieving passive and continuous heat dissipation. The internal temperature of the box 1 fluctuates little, reducing the risk of condensation, and the temperature remains relatively stable. The heat dissipation capacity is stronger when exposed to high temperatures. It consumes no electricity, requires no wiring, does not occupy the power consumption budget, has good energy-saving and environmental protection effects, long service life, and requires no maintenance. If the box 1 contains high-power electronic components, and the temperature and humidity sensor 18 generates a lot of heat, and the external environment cannot achieve the maximum effect, the semiconductor cooler heat dissipation end 11 and the semiconductor cooler cooling end 20 are activated. The semiconductor cooler cooling end 20 condenses and liquefies the working fluid flowing inside through the spiral vortex sintered tube 21, and dissipates the heat to the bottom of the sunken box 6 through the semiconductor cooler heat dissipation end 11, thereby ensuring the heat dissipation effect, increasing heat dissipation redundancy, and having a low activation frequency. Compared with other active cooling methods, it consumes less power and is more energy-efficient.

[0029] In another implementation scheme, such as Figures 1-4 As shown, the outer side of the recessed sealed door 2 and the inner side of the box body 1 are recessed and closed, and the joint between the recessed sealed door 2 and the box body 1 is sealed. A temperature and humidity sensor 18 is installed inside the box body 1, and a dehumidifier 17 is installed at the bottom of the inner cavity of the box body 1.

[0030] The embedded sealed door 2 adopts a sealed structure, making the interior of the cabinet 1 sealed. Combined with the capillary heat dissipation structure of the sintered copper tube assembly 16, there is no motor, no fan, no noise, no electromagnetic interference, no impact on metering accuracy, almost zero power consumption, no increase in meter load, constant underground temperature, usually around 15-20℃, stable heat dissipation effect and still efficient in summer. The temperature inside the cabinet 1 is stable, reducing condensation caused by day and night temperature differences, reducing the entry of moisture, and unlike traditional cooling fans, it will not draw humid air from the outside into the cabinet. At the same time, it has a certain degree of moisture-proof and anti-condensation effect, and the internal temperature of the cabinet is more stable and not easy to suddenly cool or heat up.

[0031] In another implementation scheme, such as Figure 1 , Figure 2 and Figure 4 As shown, the bottom of the inner cavity of the canopy box 3 is covered with a heat insulation layer 19, and the bottom of the back of the canopy box 3 is connected to a drain valve 10.

[0032] The function of the roof box 3 is to form a double-layer structure with a roof cavity at the top of the box 1. When the outdoor sunlight is strong, the photovoltaic power generation panel 4 first blocks some of the heat and converts it into electrical energy, which is stored inside the battery assembly 14 to provide some energy supplement. As the heat is high, heat waves are generated inside the roof box 3. At this time, the heat is naturally dissipated through the ventilation window 5, and the heat is conducted to the outside through natural heat circulation. The heat insulation layer 3 19 reduces the heat conduction to the box 1, thereby reducing the heat radiation at the top of the box 1. If condensation or rainwater intrusion occurs inside the roof box 3 due to temperature difference, it is discharged through the drain valve 10, thereby stabilizing the structural performance.

[0033] In another implementation scheme, such as Figures 1-4 As shown, several support legs 7 are fixedly installed at the bottom of the sunken box 6. The support legs 7 are symmetrically and evenly distributed in a rectangular shape at the bottom of the sunken box 6. The composite heat insulation layer 12 is composed of a shielding layer and a heat insulation layer.

[0034] The function of the support leg 7 is to raise the sunken box 6 and, with the obstruction of the box body 1 and the sunken box 6, prevent the temperature at the bottom of the sunken box 6 from becoming too high due to direct sunlight. At the same time, raising it facilitates the heat dissipation space of the semiconductor cooler heat dissipation end 11. The mounting tube 8 is the same length as the support leg 7. A heat insulation sleeve is set on the outside to reduce the space where heat enters the interior of the mounting tube 8. The area where the mounting tube 8 is opposite to the support leg 7 does not enter the underground area and is not filled with working fluid. Heat exchange is reduced by the heat insulation sleeve and the cavity. After the mounting tube 8 is placed in a suitable position below the ground, a heat-conducting working fluid is filled on the outside of the spiral sintered tube 25 for heat exchange. In practical applications, the end of the spiral sintered tube 25 is placed on the opposite side of the flow-guiding closed cone 27. This position is filled with working fluid to ensure heat dissipation effect.

[0035] In another implementation scheme, such as Figures 1-8As shown, the heat dissipation fins 1603 are linearly and uniformly distributed on the outside of the copper tube 1601, and the mounting holes 1604 are rectangularly and linearly and uniformly opened inside the heat dissipation fins 1603. The sintered copper tube assembly 16 is distributed around the inside of the housing 1, and the bottom end of the sintered copper tube assembly 16 is fixedly inserted through the housing 1, the sunken box 6 and the flow guiding closed cone 27 and extends to the bottom of the inner cavity of the mounting tube 8.

[0036] The heat dissipation fins 1603 increase the heat-conducting contact surface, indirectly ensuring heat dissipation efficiency. Heat sinks can be added via mounting holes 1604, or connected to heat dissipation components for internal electronic components in the enclosure 1 to ensure heat dissipation efficiency. The copper tube 1601 is a high-quality copper tube with a corrosion-resistant coating on the outside. The copper powder sintered layer 1602 is a sintered layer made using a copper powder sintering process, used to increase heat dissipation through capillary action, thus ensuring stable heat dissipation. The sintered copper inner wall forms a strong capillary structure, automatically drawing condensate back to the heat-absorbing end. Continuous pump-free circulation is achieved through temperature difference and capillary force, with heat ultimately absorbed by the ground, achieving passive and continuous heat dissipation. The sintered copper tube possesses a high-density capillary core structure formed by internal sintered copper powder, exhibiting strong capillary suction and fast thermal conductivity. It can drive the working fluid phase change cycle through temperature difference under no-power conditions. Combined with underground buried pipes utilizing the constant temperature and low temperature characteristics of the ground, passive heat dissipation is achieved, effectively avoiding the power consumption and interference problems of active heat dissipation. Simultaneously, it reduces external openings and improves sealing and moisture-proof performance. This type of sintered capillary copper tube structure has not yet been applied to the integrated heat dissipation and moisture-proof design of outdoor power metering boxes. It can meet the comprehensive needs of power metering boxes for passive and efficient heat dissipation, suppression of internal temperature rise, reduction of external moisture intrusion, reduction of condensation risk, and long-term stable operation.

[0037] In another implementation scheme, such as Figures 1-7 As shown, the spiral sintered tube 21 is fixedly embedded inside the heat sink plate of the cooling end 20 of the semiconductor cooler. The cooling end 20 of the semiconductor cooler is fixedly installed at the bottom of the inner cavity of the sunken box 6. The heat sink end 11 of the semiconductor cooler is fixedly installed at the bottom of the sunken box 6. The opposite sides of the cooling end 20 and the heat sink end 11 of the semiconductor cooler are heat-insulated.

[0038] The spiral vortex structure of the spiral vortex sintered tube 21 is embedded in the heat dissipation component of the cooling end 20 of the semiconductor cooler to increase the heat exchange effect of the structure and ensure the heat dissipation effect of the structure. The semiconductor cooler, composed of the heat dissipation end 11 and the cooling end 20, is installed by embedding it into the sunken box 6. The heat dissipation end 11 is placed on the outside and the cooling end 20 is placed on the inside. The cooling end 20 reduces the temperature inside the sunken box 6, ensuring operation when needed.

[0039] In another implementation scheme, such as Figures 1-8As shown, the flow guiding sintering pipe 22 is fixedly inserted through the sunken box 6 and extends into the interior of the mounting pipe 8. The spiral sintering pipe 25 is sleeved on the opposite side of the mounting pipe 8 and the sintered copper pipe assembly 16. The connecting sintering pipe 26 is fixedly inserted through a flow guiding closed cone 27 at the bottom and connected to the bottom of the flow guiding closed cone 27. The flow guiding closed cone 27 is fixedly sleeved on the outside of the sintered copper pipe assembly 16 and the flow guiding sintering pipe 22.

[0040] The flow-guiding sintering tube 22 is used to connect the spiral vortex sintering tube 21 and the spiral sintering tube 25, and passes through the flow-guiding closed cone 27 so that the spiral sintering tube 25 is located on the opposite side of the two flow-guiding closed cones 27. The heat dissipation working fluid is stored at the bottom of the lowest part of the inner cavity of the mounting tube 8, at the bottom of one of the flow-guiding closed cones 27, thereby ensuring stable heat conduction. Other working fluids that meet the operating requirements are filled on the opposite side of the two flow-guiding closed cones 27, so that the spiral sintering tube 25 can conduct heat to the ground through the working fluid and the mounting tube 8. As the depth increases, the heat dissipation efficiency increases. Finally, the heat-conducting strip 9 keeps the high-efficiency coolant inside the mounting tube 8 at the bottom of the inner cavity, indirectly ensuring the structural stability.

[0041] In another implementation scheme, such as Figures 1-8 As shown, the bottom of the inner cavity of the mounting tube 8 is provided with working fluid coolant, the heat conduction strip 9 is fixedly inserted through the mounting tube 8 and extends to the outside of the mounting tube 8, the heat conduction strip 9 is evenly distributed in a circle inside the mounting tube 8, the bottom end of the mounting tube 8 is conical, the length of the mounting tube 8 is >1 meter, and the length of the spiral sintered tube 25 is greater than the size of the sintered copper tube assembly 16 located inside the box 1.

[0042] The working fluid coolant needs to be matched; water, acetone, ethanol, etc., are selected according to the temperature range. A sealed space is formed by the sintered copper tube assembly 16, the spiral sintered tube 21, the flow-guiding sintered tube 22, the vacuum valve 23, the connecting sintered tube 24 and the spiral sintered tube 25, and the bottom of the inner cavity of the installation tube 8. A high vacuum must be maintained inside the tubes. After vacuuming through the vacuum valve 23, the working fluid coolant is added. The burial depth should be ≥1m; the deeper the burial, the more stable the temperature and the better the heat dissipation effect in summer. Too shallow a burial depth will be affected by high surface temperatures, reducing heat dissipation efficiency. The length of the condensation section must be at least twice that of the heat absorption section. The spiral sintered tube 25 must be longer than the length of the sintered copper tube assembly 16 inside the casing 1 to efficiently dissipate heat into the soil. Therefore, the spiral sintered tube 25 needs to be placed on opposite sides of the two flow-guiding closed cones 27 to gradually guide heat dissipation.

[0043] In another implementation scheme, such as Figures 1-7 As shown, a battery assembly 14 is installed at the bottom of the inner cavity of the sunken box 6, and a control module assembly 15 is installed at the bottom of the inner cavity of the sunken box 6.

[0044] The battery assembly 14 is an integrated energy storage mechanism of the prior art. By storing the electrical energy generated by the photovoltaic power generation panel 4, it increases the energy-saving and environmental protection effect. It also supplies power to the heat dissipation end 11 of the semiconductor cooler, the control module assembly 15, the temperature and humidity sensor 18, and the cooling end 20 of the semiconductor cooler, reducing losses. The control module assembly 15 is an intelligent control component with intelligent control hardware and intelligent control system. It can be used after programming. The input end of the control module assembly 15 is electrically connected to the output end of the temperature and humidity sensor 18 through wires. The output end of the control module assembly 15 is electrically connected to the input end of the heat dissipation end 11 and the cooling end 20 of the semiconductor cooler through wires to control the operation of the semiconductor cooler. The overall electrical structure is less and the operating time is shorter. Combined with the passive heat dissipation technology of the sintered copper tube assembly 16, the energy-saving technology has a good effect.

[0045] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A smart grid user outdoor adaptive heat dissipation and moisture-proof power metering box, comprising a box body (1), characterized in that: The front of the enclosure (1) has two embedded sealed doors (2) that are movable. The top of the enclosure (1) is fixedly installed with a roof box (3). Ventilation windows (5) are provided on both sides of the roof box (3). A photovoltaic power generation panel group (4) is installed on the outer side of the top of the roof box (3). The bottom of the enclosure (1) is fixedly installed with a sunken box (6). An installation pipe (8) is fixedly installed at the bottom center of the sunken box (6). The outer side of the bottom end of the installation pipe (8) is fixedly installed through it. There are several heat-conducting strips (9), the inner wall of the sunken box (6) is covered with a second heat insulation layer (13), the inner wall of the box body (1) is covered with a first composite heat insulation layer (12), the inside of the box body (1) is surrounded by a sintered copper tube assembly (16), the bottom of one end of the sintered copper tube assembly (16) is connected to a vacuum valve (23), the bottom end of the vacuum valve (23) is connected to a connecting sintered tube (24), the bottom end of the connecting sintered tube (24) is connected to a spiral vortex sintered tube (21). The outer side of the spiral vortex sintered tube (21) is fixedly installed with a semiconductor cooler cooling end (20), the bottom of the semiconductor cooler cooling end (20) is installed with a semiconductor cooler heat dissipation end (11), the center end of the spiral vortex sintered tube (21) is connected to a flow guiding sintered tube (22), the other end of the flow guiding sintered tube (22) is connected to a spiral sintered tube (25), the bottom end of the spiral sintered tube (25) is connected to a connecting sintered tube (26), two flow guiding closed cones (27) are fixedly sleeved inside the bottom end of the mounting tube (8), the spiral vortex sintered tube (21) is fixedly embedded in the heat dissipation plate of the semiconductor cooler cooling end (20), the semiconductor cooler cooling end (20) is fixedly installed at the bottom of the inner cavity of the sunken box (6), the semiconductor cooler heat dissipation end (11) is fixedly installed at the bottom of the sunken box (6), and the opposite sides of the semiconductor cooler cooling end (20) and the semiconductor cooler heat dissipation end (11) are heat-insulated. The sintered copper tube assembly (16) includes a copper tube (1601), the inner wall of which is sintered with a copper powder sintered layer (1602), and a number of heat dissipation fins (1603) are fixedly sleeved on the outer side of the copper tube (1601). A number of mounting holes (1604) are opened inside the heat dissipation fins (1603). The flow guiding sintered tube (22) is fixedly inserted through the sink box (6) and extends to the inside of the mounting tube (8). The spiral sintered tube (25) is sleeved on the opposite side of the mounting tube (8) and the sintered copper tube assembly (16). The connecting sintered tube (26) is fixedly inserted through a flow guiding closed cone (27) at the bottom and connected to the bottom of the flow guiding closed cone (27). The flow guiding closed cone (27) is fixedly sleeved on the outer side of the sintered copper tube assembly (16) and the flow guiding sintered tube (22). The bottom of the inner cavity of the mounting tube (8) is provided with working fluid coolant.

2. The smart grid user external adaptive heat dissipation and moisture-proof power metering box according to claim 1, characterized in that: The outer side of the embedded sealed door (2) and the inner side of the box body (1) are recessed and embedded in a closed manner, and the joint between the embedded sealed door (2) and the box body (1) is sealed. A temperature and humidity sensor (18) is installed inside the box body (1), and a dehumidifier (17) is installed at the bottom of the inner cavity of the box body (1).

3. The smart grid user external adaptive heat dissipation and moisture-proof power metering box according to claim 1, characterized in that: The bottom of the inner cavity of the canopy box (3) is covered with a heat insulation layer three (19), and the bottom of the back of the canopy box (3) is connected to a drain valve (10).

4. The smart grid user external adaptive heat dissipation and moisture-proof power metering box according to claim 1, characterized in that: The bottom of the sunken box (6) is fixedly equipped with several legs (7). The legs (7) are evenly distributed in a rectangular shape on the bottom of the sunken box (6). The composite heat insulation layer (12) is composed of a shielding layer and a heat insulation layer.

5. The smart grid user external adaptive heat dissipation and moisture-proof power metering box according to claim 1, characterized in that: The heat dissipation fins (1603) are linearly and uniformly distributed on the outside of the copper tube (1601). The mounting holes (1604) are rectangularly and linearly and uniformly opened inside the heat dissipation fins (1603). The sintered copper tube assembly (16) is distributed around the inside of the box (1). The bottom end of the sintered copper tube assembly (16) is fixedly inserted through the box (1), the sunken box (6) and the flow guiding closed cone (27) and extends to the bottom of the inner cavity of the mounting tube (8).

6. The smart grid user external adaptive heat dissipation and moisture-proof power metering box according to claim 1, characterized in that: The heat-conducting strip (9) is fixedly inserted through the mounting tube (8) and extends to the outside of the mounting tube (8). The heat-conducting strip (9) is evenly distributed in a circle inside the mounting tube (8). The bottom end of the mounting tube (8) is conical. The length of the mounting tube (8) is greater than 1 meter. The length of the spiral sintered tube (25) is greater than the size of the sintered copper tube assembly (16) inside the box (1).

7. The smart grid user external adaptive heat dissipation and moisture-proof power metering box according to claim 1, characterized in that: A battery assembly (14) is installed at the bottom of the inner cavity of the sunken box (6), and a control module assembly (15) is installed at the bottom of the inner cavity of the sunken box (6).

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