A cold plate, liquid cooling system, and electronic device

Abstract

This invention discloses a cold plate, a liquid cooling system, and an electronic device, applicable to the field of electronic device cooling technology. The cold plate includes: a substrate and a housing; a flow channel layer comprising a plurality of guide plates, each guide plate being spaced apart and extending along a first direction, with adjacent guide plates forming a flow channel for the flow of heat exchange medium; and a heat-conducting layer containing a plurality of heat exchange channels, adjacent heat exchange channels being sequentially connected, and the heat exchange channels extending in an arc shape along the first direction, a second direction, and / or a third direction, with arc-shaped sidewalls. The cold plate provided by this invention, through the synergistic effect of the flow channel layer and the heat-conducting layer, enables the cold plate to achieve higher heat exchange capacity under the same heat exchange medium flow rate, while controlling the pressure drop of the heat exchange medium within an acceptable range.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and in particular to a cold plate, a liquid cooling system, and electronic devices. Background Technology

[0002] As the heat flux density of power devices and battery systems continues to rise, cold plates are being widely used due to their high heat transfer capacity per unit volume and ability to be placed close to heat sources.

[0003] In related technologies, to improve the heat exchange efficiency of cold plates, structures such as open-cell metal foam and biomimetic porous networks are often used for heat exchange. Because open-cell metal foam and biomimetic porous networks have a large specific surface area and an internal skeleton that can induce turbulence, they are used to enhance heat exchange. However, their common problem is that the pressure drop is too high. Furthermore, in the solutions of related technologies, due to the inlet / outlet effect of the cold plate, the medium flow distribution is uneven, resulting in insufficient liquid supply at the corners / far ends of the cold plate, stagnant backflow and thickening of the boundary layer. The temperature difference between the hot spot of the heating element and the surface of the cold plate is amplified, the temperature uniformity of the plate surface is deteriorated, and the cooling effect of the cold plate is poor.

[0004] Therefore, how to improve the applicability of cold-rolled steel plates is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a cold plate, liquid cooling system, and electronic equipment that can achieve higher heat exchange capacity at the same flow rate while keeping the pressure drop within an acceptable range.

[0006] To achieve the above objectives, the present invention provides the following technical solution.

[0007] A cold plate includes: a substrate and a housing, the housing being disposed on the substrate, the housing having an interior cavity for the flow of a heat exchange medium, the substrate being used to connect to a heating element; a flow channel layer located within the cavity, the flow channel layer including a plurality of guide plates, each guide plate being spaced apart and extending along a first direction, with adjacent guide plates forming a flow channel for the flow of the heat exchange medium; and a heat-conducting layer located within the cavity and connected to the flow channel layer, the heat-conducting layer having a plurality of heat exchange channels, adjacent heat exchange channels being sequentially connected, and the heat exchange channels extending in an arc shape along the first direction, the second direction, and / or a third direction, and the sidewalls of the heat exchange channels being arc-shaped sidewalls; and the substrate, the flow channel layer, and the heat-conducting layer being arranged sequentially along a third direction, the first direction, the second direction, and the third direction being perpendicular to each other.

[0008] The present invention also provides a liquid cooling system comprising the cold plate of any of the above.

[0009] The cold plate provided by this invention has the following advantages: Through the substrate, the substrate can contact the heating element, thereby transferring heat from the heating element to the substrate, which in turn transfers heat to the flow channel layer and the heat-conducting layer. A shell covers the outside of the flow channel layer and the heat-conducting layer, providing a flow space for the heat exchange medium. The shell can be provided with an inlet and an outlet. The heat exchange medium flows into the cavity of the shell through the inlet and then flows out through the outlet. The flow channel layer includes several guide plates, forming a flow channel between adjacent guide plates. The heat exchange medium flows within the flow channel, and the flow channel layer has low resistance, reducing the pressure drop of the heat exchange medium. The heat-conducting layer is located on the side of the flow channel layer away from the substrate, i.e., the substrate, flow channel layer, and heat-conducting layer are arranged sequentially. The heat-conducting layer contains several heat exchange... The heat exchange medium in the heat exchange channel can enter and exit the heat exchange channel. The heat exchange channel extends in an arc shape along a first direction, a second direction, and / or a third direction. Specifically, adjacent heat exchange channels can be interconnected. The heat exchange medium flows along the first direction. By setting the arc extension of the heat exchange channel, the heat exchange medium entering the heat exchange channel can flow along the arc-shaped channel in the first, second, and / or third directions. This ensures the flow rate of the heat exchange medium while also maximizing energy exchange with it. The arc-shaped sidewalls of the heat exchange channel reduce flow obstruction and increase the specific surface area of ​​the heat exchange channel, thereby improving the heat exchange efficiency between the heat exchange medium and the heat-conducting layer. The cold plate provided by this invention has a lower layer consisting of a low-resistance flow channel layer that carries most of the heat exchange medium. The upper layer is a high specific surface area heat-conducting layer, which is used to disrupt the boundary layer and induce near-wall micro-vortices. That is, by disturbing the near-wall low-speed heat exchange medium layer, the thermal resistance barrier is broken, and the heat dissipation efficiency is greatly improved. Through the synergistic effect of the flow channel layer and the heat-conducting layer, the cold plate can achieve a higher heat exchange capacity under the same heat exchange medium flow rate, while keeping the pressure drop of the heat exchange medium within an acceptable range.

[0010] In one embodiment, the guide vane extends in a wavy shape along a first direction, and a heat-conducting layer is connected to the top of the guide vane. This configuration, by setting the guide vane to extend in a wavy shape, can reduce secondary flow losses and additional losses in the flow channel layer through continuous curvature. Secondary flow losses refer to the energy dissipation caused by the heat exchange medium flowing in a non-mainstream direction within the guide channel, while additional losses refer to energy losses caused by factors other than secondary flow losses. The fins formed by the wavy guide vane significantly improve heat exchange efficiency by increasing surface area and creating turbulence. Its wavy structure can disrupt the boundary layer of the heat exchange medium, enhancing heat transfer, while also possessing a certain degree of elasticity, further promoting heat exchange. Furthermore, the wavy guide vane can also improve strength and service life.

[0011] In one embodiment, a positioning edge is formed on the periphery of the substrate relative to the housing, and a plurality of positioning holes are provided on the positioning edge. This configuration, by providing positioning holes on the substrate, enables the substrate to have a positioning reference. When the cold plate needs to be welded and fixed, or when flow resistance testing is performed, the positioning holes can be used as mechanical fixing points, thereby improving the installation or testing accuracy of the cold plate and enhancing the reproducibility of the test.

[0012] In one embodiment, the lower part of the heat-conducting layer is provided with several lower fixed sections, which have the same shape as the top of the guide plate and are connected one-to-one. Furthermore, several heat exchange channel inlets are provided between adjacent lower fixed sections to allow the heat exchange medium in the heat-conducting layer to flow into it. Specifically, the lower fixed sections are used to connect to the top of the guide plate, and the shape and size of the lower fixed sections should be consistent with the shape and size of the top of the guide plate. This ensures that after the heat-conducting layer is connected and fixed to the channel layer, the heat exchange channel and the guide channel can transition smoothly, allowing the heat exchange medium to flow more smoothly between them. Simultaneously, the presence of several heat exchange channel inlets between adjacent lower fixed sections means that the heat exchange medium in the guide channel, while flowing along the first direction, can flow into the heat exchange channel through these inlets at any time, and then flow in the respective heat exchange channels of the heat-conducting layer in the extending direction for heat exchange.

[0013] In one embodiment, the upper part of the heat-conducting layer is further provided with several upper fixed sections, which are fixed to the inner wall of the shell; and several heat exchange channel outlets are provided between adjacent upper fixed sections, allowing the heat exchange medium in the heat-conducting layer to flow through the inner surface of the shell. In this configuration, the upper fixed sections are used to connect with the top inner wall of the shell. The heat exchange medium flows into the heat-conducting layer through the heat exchange channel inlet, and then enters each heat exchange channel of the heat-conducting layer. It can remain flowing within the heat exchange channel, or it can flow through the heat exchange channel outlet to contact the shell and exchange heat with it.

[0014] In one embodiment, the top and bottom of the heat-conducting layer are provided with a plurality of recessed structures. The recessed structures located at the bottom of the heat-conducting layer are arranged periodically along the first direction, and the recessed structures located at the top of the heat-conducting layer are arranged periodically along the second direction. The pitch of the recessed structures is 1.5-2.5 mm, and the bow height of the recessed structures is 0.25-0.26 mm. The aforementioned dimensional settings are based on a deep integration of boundary layer theory and topology optimization in heat transfer medium mechanics. According to the boundary layer control principle, the concave structure has a large and stable radius of curvature, which can generate the Coanda effect, causing the heat transfer medium to flow along the concave structure. While avoiding severe flow separation and high pressure drop in dead zones, the bow height s induces near-wall micro-vortices, actively disrupting the thermal resistance of the laminar sublayer and entraining the exchange of hot and cold heat transfer media. From a topology optimization perspective, the bow height s aims to establish a cross-scale "suction-recirculation" coupling mechanism: utilizing the periodic pressure gradient generated by the corrugated surface, it drives the heat transfer medium to exchange mass between the guide channel and the heat transfer channel. If the bow height s is too small, the pressure difference will be insufficient to drive the exchange; if it is too large, it will lead to a surge in mainstream resistance. In summary, this dimensional combination constructs a "critical roughness" on the surface of the heat-conducting layer, maintaining the low-resistance characteristics of streamlined attachment while maximizing the heat transfer capacity per unit volume through micro-vortices and cross-interface exchange.

[0015] The liquid cooling system provided by the present invention is equipped with the above-mentioned cold plate. Since the cold plate has the above-mentioned technical effects, the liquid cooling system equipped with the cold plate should also have the corresponding technical effects.

[0016] The electronic device provided by the present invention is equipped with the above-mentioned liquid cooling system. Since the liquid cooling system has the above-mentioned technical effects, the electronic device equipped with the liquid cooling system should also have the corresponding technical effects. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a specific embodiment of the cold plate provided by the present invention.

[0019] Figure 2 for Figure 1 The top view of the cold plate shown.

[0020] Figure 3 for Figure 1 The front view of the cold plate shown.

[0021] Figure 4 for Figure 1 Left view of the cold plate shown.

[0022] Figure 5 for Figure 4 An enlarged structural diagram of part A in the cold plate shown.

[0023] Figure 6 for Figure 1 The diagram shows an enlarged view of the substrate, flow channel layer, and heat-conducting layer in the cold plate.

[0024] Figure 7 for Figure 1 The diagram shows an enlarged view of the heat-conducting layer in the cold plate.

[0025] Figure 8 for Figure 1 The diagram shows the structure of the flow channel layer in the cold plate.

[0026] Reference numerals: 1-substrate; 11-positioning edge; 12-positioning hole; 2-flow channel layer; 21-guide plate; 22-flow channel; 3-heat-conducting layer; 31-heat exchange channel; 311-top heat exchange channel; 312-bottom heat exchange channel; 313-middle heat exchange channel; 314-height heat exchange channel; 32-lower fixed section; 33-upper fixed section; 34-recessed structure. Detailed Implementation

[0027] The core of this invention is to provide a cold plate, a liquid cooling system, and an electronic device that can improve cooling uniformity and reduce the hot spot area of ​​the heating element.

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0029] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similarity is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity, i.e., the limitations of the measurement system. For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Please refer to Figures 1 to 4 In this embodiment, the cold plate includes a substrate 1, a shell, a flow channel layer 2, and a heat-conducting layer 3.

[0032] The substrate 1 and the housing are provided. The housing is disposed on the substrate 1 and has a cavity inside for the flow of heat exchange medium. The substrate 1 is used to connect with the heating element.

[0033] The flow channel layer 2, located within the cavity, includes several guide plates 21, which are spaced apart and extend along a first direction. Adjacent guide plates 21 form flow channels 22 for the flow of the heat exchange medium. Figure 3 and Figure 8 As shown.

[0034] The heat-conducting layer 3 is located inside the cavity and connected to the flow channel layer 2. The heat-conducting layer 3 is provided with a plurality of heat exchange channels 31, adjacent heat exchange channels 31 are connected in sequence, and the heat exchange channels 31 extend in an arc shape along the first direction, the second direction and / or the third direction, and the sidewalls of the heat exchange channels 31 are arc-shaped sidewalls.

[0035] Furthermore, the substrate 1, the flow channel layer 2, and the thermal conductive layer 3 are arranged sequentially along a third direction, with the first direction, the second direction, and the third direction being perpendicular to each other.

[0036] Specifically, the heat exchange channel 31 extends in an arc shape along the first direction, the second direction, and / or the third direction, which is in contrast to extending in a straight line. That is, the heat exchange channel 31 extends in an arc shape with a smooth transition, which can not only ensure the flow velocity of the heat exchange medium, but also increase the heat exchange efficiency between the heat exchange medium and the heat-conducting layer 3. As for the channel layer 2, the guide plates 21 in the channel layer 2 are arranged in sequence to form a guide channel 22 between adjacent guide plates 21. The guide plate 21 is the fin structure of the channel layer 2. The heat of the heating element is first transferred to the substrate 1, and then the heat of the substrate 1 is transferred to the guide plate 21. The heat exchange medium in the guide channel 22 can exchange heat with the guide plate 21. The heat-conducting layer 3 is a porous metal structure. The heat-conducting layer 3 is an integral structure and can be processed by 3D printing technology.

[0037] The cold plate provided by this invention, through the arrangement of the substrate 1, allows the substrate 1 to contact the heating element, thereby transferring the heat from the heating element to the substrate 1. The substrate 1 then transfers the heat to the flow channel layer 2 and the heat-conducting layer 3. A shell covers the outside of the flow channel layer 2 and the heat-conducting layer 3, providing a flow space for the heat exchange medium. The shell can be provided with an inlet and an outlet. The heat exchange medium flows into the cavity of the shell through the inlet and then flows out of the cavity through the outlet. The flow channel layer 2 includes several guide plates 21, and adjacent guide plates 21 form... The heat exchange medium flows within the flow channel 22. The flow channel layer 2 has low resistance, reducing the pressure drop of the heat exchange medium. The heat-conducting layer 3 is disposed on the side of the flow channel layer 2 away from the substrate 1. That is, the substrate 1, flow channel layer 2, and heat-conducting layer 3 are arranged sequentially. The heat-conducting layer 3 contains several heat exchange channels 31. The heat exchange medium in the flow channel 22 can enter the heat exchange channels 31, and the medium in the heat exchange channels 31 can also flow back into the flow channel 22. The heat exchange channels 31 extend in an arc shape along a first direction, a second direction, and / or a third direction. Specifically… Adjacent heat exchange channels 31 can be interconnected. A single heat exchange channel 31 can extend in an arc shape along a first direction, a second direction, or a third direction; or, a single heat exchange channel 31 can extend in an arc shape in both the first and second directions; or, a single heat exchange channel 31 can extend in an arc shape in both the second and third directions; or, a single heat exchange channel 31 can extend in an arc shape in the first, second, and third directions. The heat exchange medium flows along the first direction. By setting the arc-shaped extension of the heat exchange channel 31, the heat exchange medium entering the heat exchange channel 31 can flow along the arc-shaped channel in the first, second and / or third directions. This ensures the flow rate of the heat exchange medium while also facilitating energy exchange with it. In addition, the sidewall of the heat exchange channel 31 is arc-shaped, which reduces the obstruction of the heat exchange medium and increases the specific surface area of ​​the heat exchange channel 31, thereby improving the heat exchange efficiency between the heat exchange medium and the heat-conducting layer 3.

[0038] The cold plate provided by this invention has a lower layer of low-resistance flow channel layer 2, which carries most of the heat exchange medium. The upper layer is a high specific surface area heat-conducting layer 3, which is used to disrupt the boundary layer and induce near-wall micro-vortices. That is, by disturbing the near-wall low-speed heat exchange medium layer, the thermal resistance barrier is broken, and the heat dissipation efficiency is greatly improved. Through the synergistic effect of the flow channel layer 2 and the heat-conducting layer 3, the cold plate can obtain a higher heat exchange capacity under the same heat exchange medium flow rate, while keeping the pressure drop of the heat exchange medium within an acceptable range.

[0039] In some embodiments, the heat-conducting layer 3 has a plurality of heat exchange channels 31 inside. A top heat exchange channel 311 can be provided at the top of the heat-conducting layer 3, a bottom heat exchange channel 312 can be provided at the bottom, and a middle heat exchange channel 313 can be provided in the middle. The top heat exchange channel 311, the bottom heat exchange channel 312, and the middle heat exchange channel 313 all extend along a first direction. The heat-conducting layer 3 also has a height heat exchange channel 314 extending along a third direction. The height heat exchange channel 314 can connect between the top heat exchange channel 311 and the bottom heat exchange channel 312, and the middle heat exchange channel 313 also extends through... The high-temperature heat exchange channel 314 extends in a direction that can extend along a second direction and a third direction simultaneously, as well as along a first direction. In other words, the line connecting the bottom and top of the high-temperature heat exchange channel 314 is inclined relative to the first direction, the second direction, and the third direction, making the high-temperature heat exchange channel 314 a three-dimensional channel. The high-temperature heat exchange channel 314 can connect the top heat exchange channel 311, the bottom heat exchange channel 312, and the middle heat exchange channel 313. There can be multiple high-temperature heat exchange channels 314, which are distributed throughout the interior of the heat-conducting layer 3, thereby improving heat exchange efficiency.

[0040] In some embodiments, the guide plate 21 extends in a wavy shape along the first direction, and the heat-conducting layer 3 is connected to the top of the guide plate 21. This arrangement, by setting the guide plate 21 to extend in a wavy shape, can reduce secondary flow losses and additional losses in the flow channel layer 2 through continuous curvature. The fins formed by the wavy guide plate 21 significantly improve heat exchange efficiency by increasing surface area and creating turbulence. Its wavy structure can disrupt the boundary layer of the heat exchange medium, enhancing heat transfer, while also possessing a certain degree of elasticity, further promoting heat exchange. Furthermore, the wavy guide plate 21 can also improve strength and service life. Specifically, secondary flow loss refers to the energy dissipation caused by the flow of the heat exchange medium in the non-mainstream direction within the guide channel 22. Additional loss refers to the energy loss caused by other factors besides secondary flow loss, including friction loss, separation loss, impact loss, wake loss, and wave drag loss. Friction loss refers to the energy loss generated by the surface friction between the heat exchange medium and the guide plate 21. Separation loss refers to the energy loss caused by boundary layer separation. Impact loss refers to the energy loss generated by the heat exchange medium impacting the guide plate 21. Wake loss refers to the energy loss generated by the convergence of boundary layers at the tail of the guide plate 21 to form vortices. Wave drag loss refers to the energy loss caused by the compression wave generated when the heat exchange medium flows at high speed.

[0041] In some embodiments, the flow guide plate 21 includes a plurality of flow guide plates, which are sequentially spliced ​​together, and there is a smooth transition between adjacent flow guide plates. The flow guide plate 21 is formed by splicing the flow guide plates, which makes the arrangement more convenient. In addition, the extension direction of the flow guide plate 21 is easier to adjust. For example, the flow guide plate 21 can extend along the length direction of the substrate 1 or along the diagonal direction of the substrate 1. The smooth transition between adjacent flow guide plates can ensure the smooth flow of the heat exchange medium and reduce obstruction.

[0042] In some implementation methods, please refer to Figure 2 The periphery of the substrate 1 extends relative to the shell to form a positioning edge 11, and the positioning edge 11 is provided with a plurality of positioning holes 12. The above-mentioned arrangement, by providing positioning references for the substrate 1 by opening positioning holes 12 on the substrate 1, allows the positioning holes 12 to be used as mechanical fixing points when the cold plate needs to be welded and fixed or when flow resistance testing is performed, thereby improving the installation or testing accuracy of the cold plate and improving the reproducibility of the test.

[0043] In some implementation methods, please refer to Figure 7 The lower part of the heat-conducting layer 3 is provided with several lower fixed sections 32. The lower fixed sections 32 have the same shape as the top of the guide plate 21 and are connected one by one. Furthermore, several heat exchange channels 31 inlets are provided between adjacent lower fixed sections 32 to allow the heat exchange medium in the heat-conducting layer 3 to flow into the heat-conducting layer 3. Specifically, the lower fixed section 32 is used to connect with the top of the guide plate 21. The shape and size of the lower fixed section 32 should be consistent with the shape and size of the top of the guide plate 21, so that after the heat-conducting layer 3 is connected and fixed to the flow channel layer 2, the heat exchange channel 31 and the flow channel 22 can transition smoothly, so that the heat exchange medium can flow more smoothly between the heat exchange channel 31 and the flow channel 22. At the same time, several heat exchange channel 31 inlets are provided between adjacent lower fixed sections 32. That is, the heat exchange medium in the flow channel 22 will flow into the heat exchange channel 31 through the heat exchange channel 31 inlets at any time during the flow of the flow channel 22 in the first direction, and then flow in the heat exchange channel 31 in the extension direction in the heat-conducting layer 3 for heat exchange. It also facilitates fixation.

[0044] In some implementation methods, please refer to Figure 7 The upper part of the heat-conducting layer 3 is further provided with several upper fixed sections 33, which are fixed to the inner wall of the shell. Furthermore, several heat exchange channels 31 outlets are provided between adjacent upper fixed sections 33, allowing the heat exchange medium in the heat-conducting layer 3 to flow through the inner surface of the shell. With this configuration, the upper fixed sections 33 are connected to the top inner wall of the shell. The heat exchange medium flows into the heat-conducting layer 3 through the inlet of the heat exchange channel 31, and then enters each heat exchange channel 31 of the heat-conducting layer 3. It can remain flowing within the heat exchange channel 31, or it can flow through the outlet of the heat exchange channel 31 to contact the shell and exchange heat with it; this also facilitates fixation.

[0045] In some implementation methods, please refer to Figure 6 The heat-conducting layer 3 is an integrally formed heat-conducting layer 3, which can be made of metal. In the plane formed by the second direction and the third direction, at least one cross section of the heat-conducting layer 3 forms a plurality of S-shaped structures that are spaced apart along the second direction and extend along the third direction. With this arrangement, a plurality of high heat exchange channels 314 can be formed in the heat-conducting layer 3, and the S-shaped structure of the high heat exchange channels 314 can increase the heat exchange efficiency.

[0046] In some embodiments, in a plane formed by the first direction and the third direction, at least one cross-section of the heat-conducting layer 3 forms an S-shaped structure extending along the first direction; please refer to Figure 6 The S-shaped structure in the middle of the heat-conducting layer 3 can form a central heat exchange channel 313. The central heat exchange channel 314 is provided with a pore throat structure. The central heat exchange channel 313 can penetrate the pore throat structure to form a micro-scale exchange of "suction-reinjection" and improve the heat exchange capacity per unit volume.

[0047] In some implementation methods, please refer to Figure 5 The top and bottom of the heat-conducting layer 3 are provided with a number of recessed structures 34. The recessed structures 34 located at the bottom of the heat-conducting layer 3 are arranged periodically along the first direction, and the recessed structures 34 located at the top of the heat-conducting layer 3 are arranged periodically along the second direction. The pitch L of the recessed structure 34 is 1.5-2.5mm, and the arc height s of the recessed structure 34 is 0.25-0.26mm. The recessed structure 34 is an arc structure, and the pitch of the recessed structure 34 refers to the distance between the bottommost parts of two adjacent recessed structures 34.

[0048] In some implementations, the radius of curvature of the recessed structure 34 can be calculated according to formula (1).

[0049] R=L 2 / (8s)+s / 2 Formula (1).

[0050] Where R refers to the radius of curvature of the concave structure 34.

[0051] L refers to the pitch of the recessed structure 34.

[0052] s refers to the arch height of the concave structure 34.

[0053] The aforementioned dimensional settings are based on a deep integration of boundary layer theory and topology optimization in heat transfer medium mechanics. According to the boundary layer control principle, the concave structure 34 has a large and stable radius of curvature, which can generate the Coanda effect, causing the heat transfer medium to flow along the concave structure 34. While avoiding severe flow separation and high pressure drop in the dead zone, the bow height s induces near-wall micro-vortices, actively disrupting the thermal resistance of the laminar sublayer and entraining the exchange of hot and cold heat transfer media. From a topology optimization perspective, the bow height s is set to establish a cross-scale "suction-recirculation" coupling mechanism: using the periodic pressure gradient generated by the corrugated surface, the heat transfer medium is driven to exchange mass between the guide channel 22 and the heat transfer channel 31 with an aperture of approximately 0.9 mm. If the bow height s is too small, the pressure difference will not be sufficient to drive the exchange; if it is too large, the mainstream resistance will surge. In summary, this dimensional combination constructs a "critical roughness" on the surface of the heat-conducting layer 3, which maintains the low-resistance characteristics of streamlined attachment and maximizes the heat transfer capacity per unit volume through micro-vortices and cross-interface exchange. In one specific embodiment, the pitch L of the recessed structure 34 is 1.99 mm, the bow height s is 0.25 mm, and the radius of curvature R of the recessed structure 34 is 2.0 mm.

[0054] The cold plate provided by this invention employs a double-layer structure with upper and lower coupling. The lower layer is a low-resistance arc-shaped flow channel 22, which reduces secondary flow losses and additional losses with continuous curvature and bears the flow of most of the cooling medium. The upper layer is a high specific surface area heat-conducting layer 3, which can be an open-pore heat-conducting layer 3. The setting of the heat-conducting layer 3 can disrupt the boundary layer and induce near-wall micro-vortices. Through the synergistic arrangement of the flow channel layer 2 and the heat-conducting layer 3, the cold plate achieves higher heat transfer capacity at the same flow rate, while controlling the pressure drop within an acceptable range. In addition, through the effective heat transfer zone... The internal structure maintains a nearly uniform pitch arrangement, and utilizes the "distribution-convergence" function of the arc-shaped guide plate 21 to allow the coolant to cover the entire area of ​​the heating element through a composite method of "transportation via the guide channel 22 + micro-permeation through pores." This strategy can reduce the flow deviation in the inlet and outlet areas, reduce the hot spot area, and improve the temperature uniformity of the plate surface. Simultaneously, by providing positioning holes 12 on the positioning edges 11 of the substrate 1, for example, at the four corners of the substrate 1, these holes can be used for vacuum brazing positioning or to achieve precise alignment during diffusion connection, and provide mechanical fixing points for subsequent flow resistance testing fixtures. Furthermore, by arranging the inlet and outlet of the cold plate on its side or end, and providing independent connector positions on the cold plate that avoid the positions of the positioning holes 12, the testing fixation and fluid connection can be made independent of each other, thereby improving the consistency of the cold plate and the reproducibility of the test.

[0055] In one specific embodiment, the cold plate has a nearly rectangular shape with rounded corners, and its outer dimensions are approximately 63.05±0.1mm along the second direction and approximately 57.9±0.1mm along the first direction; the thickness along the third direction, i.e., the total thickness of the cold plate in the thickness direction, is 4.25mm; the cold plate consists of, from bottom to top, a substrate 1, an arc-shaped flow channel layer 2 formed thereon, and a heat-conducting layer 3 metallurgically connected to the flow channel layer 2, the heat-conducting layer 3 being an open-pore heat-conducting layer 3; the central 55mm × 39.99mm portion of the cold plate is... The effective heat exchange zone retains a sealed perimeter and assembly frame. The four corners of the substrate 1 are provided with positioning holes 12, which can be four in number, with a diameter of 1.3 mm and a depth of 1 mm. These are brazing positioning holes 12 / test fixture positioning holes 12, used to limit the cold plate during vacuum brazing and prevent relative slippage between the cold plate and the processed components. During subsequent pressure drop-flow characteristic testing on the test bench, a special fixture can be used to achieve rigid fixation with these four positioning holes 12, ensuring consistent test conditions. It is important to emphasize that these four positioning holes 12 do not serve as inlet or outlet ports; the actual inlet and outlet ports are set on the edge or end face of the cold plate, connected via a standard connector. The standard connector can be a quick-connect plug to improve assembly efficiency. The standard connector is connected to the distribution / manifold of the flow channel layer 2, which is connected to the guide channel 22.

[0056] Furthermore, an arc-shaped flow channel layer 2 is disposed on the upper surface of the substrate 1. Each guide plate 21 adopts a corrugated shape with a continuous transition from arc to arc, so that the streamlines have no sharp turns; adjacent guide channels 22 are separated by guide plates 21. Considering that the thickness H of the entire cold plate is 4.25 mm and the thickness of the upper heat-conducting layer 3 is 3 mm, in this embodiment, the arc height of the arc-shaped guide plate 21 is controlled in the range of 0.25~0.35 mm, that is, the arc height of the recessed structure 34 is 0.25~0.35 mm, so that the cross section of the guide channel 22 can ensure sufficient flow area and provide a stable near-wall shear field for the upper layer. Multiple arc-shaped flow channels 22 are uniformly fed into the distribution cavity of the cold plate, spread out in a wave-like pattern along the surface of the substrate 1, merge in the confluence cavity on the other side of the cold plate, and are discharged from the outlet. If required by the application, a diagonal distribution-convergence method can also be adopted to further improve the temperature uniformity, that is, the extension direction of the flow guide plate 21 can also be parallel to the diagonal direction of the cold plate. The lower arc-shaped flow channels 22 and the upper heat-conducting layer 3 are separated by a thin wall, preferably 0.3~0.5mm thick, which helps to shorten the solid heat transfer path.

[0057] Furthermore, the heat-conducting layer 3 covers the arc-shaped flow channel 22, and its thickness can be 3±0.05mm. The top view of the heat-conducting layer 3 is a uniform grid; in the cross-sectional view of the heat-conducting layer 3, the upper surface forms periodic undulations along the first direction, and the lower surface is in contact with the arc-shaped flow guide plate 21. For ease of manufacturing control and simulation, this embodiment gives a pitch of 1.99mm in the drawing. At this pitch, the upper surface of the heat-conducting layer 3 presents a periodic concavity, that is, it is provided with periodically arranged concave structures 34; the arch height s of the crest-trough can be set to 0.25~0.26mm. The concave structure 34 is approximately a circular arc structure, and its radius of curvature R can be obtained by formula (1). Taking the chord length L = pitch = 1.99 mm, the calculations show that when s = 0.25 mm, R ≈ 3.9601 / 2.0 + 0.125 = 2.105 mm; when s = 0.26 mm, R ≈ 3.9601 / 2.08 + 0.13 ≈ 2.034 mm. Considering the process fillet radius and assembly tolerances, it is recommended to set R to a design target value of 2.0 ± 0.1 mm. This "large but stable" curvature allows for a smooth velocity transition between the heat-conducting layer 3 and the lower arc-shaped guide plate 21, inducing near-wall micro-vortices without causing significant separation at the interface.

[0058] In mass production, the porosity can be controlled between 45% and 65% to balance strength and permeability. This pore throat size, combined with the surface recess structure 34 with R≈2.0mm, makes the shear layer near the wall of the flow channel 22 comparable in size to the recirculation zone of the heat exchange channel 31, which easily forms a microscale exchange of "suction-recharge" and improves the heat exchange capacity per unit volume.

[0059] This invention achieves a composite mechanism of "strong near-wall disturbance + low main body loss" through the coupling of the upper heat-conducting layer 3 and the lower flow channel layer 2. Compared with only the arc-shaped guide plate 21 or only the porous layer of the cold plate, it can achieve a lower total thermal resistance and a lower pressure drop at the same pressure drop. Due to the passivation effect of the heat-conducting layer 3 on the temperature peak and the uniform distribution effect of the arc-shaped guide plate 21, the temperature difference on the plate surface is smaller and hot spots are less likely to form. The brazing positioning holes 12 at the four corners decouple assembly and testing, ensuring manufacturing consistency and improving the reliability of bench data, while not occupying the fluid interface position, which is conducive to system integration. The overall structure is compatible with common stamping / milling + vacuum brazing or additive manufacturing processes, making it feasible for mass production.

[0060] In summary, the cold-rolled steel plate provided in this application has the following characteristics.

[0061] 1. Overall structural features of double-layer coupling: Within the same cold plate, the arc-shaped flow channel 22, which undertakes volume transport, and the heat-conducting layer 3, which undertakes near-wall reinforcement, are coupled vertically and vertically, and are metallurgically connected or integrally formed with the substrate 1, so that the two layers work together within a total thickness of 4.25mm to form a heat exchange unit with low pressure drop and high strength.

[0062] 2. Matching relationship of key geometric parameters: The pitch of the heat-conducting layer 3 is approximately 1.99 mm, the nominal thickness is 3 ± 0.05 mm, and the equivalent arc radius R of its surface concave structure 34 is approximately 2.0 ± 0.1 mm; the equivalent hydraulic diameter d12 of the internal central heat exchange channel 313 is approximately 0.9 ± 0.15 mm, and its matching with the porosity of 45%~65%, the above parameters, together with the curvature and arc height of the arc-shaped flow channel 22, make the interface velocity gradient continuous and suppress separation.

[0063] 3. Integrated manufacturing and testing solution: including the continuous curvature forming of the arc-shaped flow channel 22 and the metallurgical connection of the heat-conducting layer 3, such as vacuum brazing / diffusion welding or additive integral forming, and the setting of four corner brazing positioning holes 12 for assembly positioning and bench fixing, which provide alignment and clamping functions during the manufacturing and testing stages. The interfaces of the actual liquid inlet and outlet are independently set at the plate side or end joint position, and are connected to the arc-shaped flow channel 22 through the distribution / manifold cavity, reducing intervention, facilitating processing, and achieving high assembly accuracy.

[0064] In addition to the aforementioned cold plate, the present invention also provides a liquid cooling system and an electronic device including the aforementioned cold plate. For the structure of other parts of the liquid cooling system and the electronic device, please refer to the relevant technology, which will not be repeated here.

[0065] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0066] The cold plate and liquid cooling system provided by this invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make several improvements and modifications to this invention without departing from the principles of this invention, and these improvements and modifications also fall within the protection scope of this invention.

Claims

1. A cold-rolled steel plate, characterized in that, include: A substrate (1) and a housing, wherein the housing is disposed on the substrate (1), and the housing has a cavity for the flow of heat exchange medium inside, and the substrate (1) is used to connect to the heating element; The flow channel layer (2) is located in the cavity. The flow channel layer (2) includes a plurality of guide plates (21). Each guide plate (21) is spaced apart and extends along a first direction. A flow channel (22) for the flow of heat exchange medium is formed between adjacent guide plates (21). A heat-conducting layer (3) is located in the cavity and connected to the flow channel layer (2). The heat-conducting layer (3) is provided with a plurality of heat exchange channels (31). Adjacent heat exchange channels (31) are connected in sequence. The heat exchange channels (31) extend in an arc shape along the first direction, the second direction and / or the third direction. The sidewalls of the heat exchange channels (31) are arc-shaped sidewalls. Furthermore, the substrate (1), the flow channel layer (2), and the thermal conductive layer (3) are arranged sequentially along a third direction, with the first direction, the second direction, and the third direction being perpendicular to each other; The heat-conducting layer (3) has a top heat exchange channel (311) at the top, a bottom heat exchange channel (312) at the bottom, and a middle heat exchange channel (313) in the middle. The top heat exchange channel (311), the bottom heat exchange channel (312), and the middle heat exchange channel (313) all extend along the first direction. The heat-conducting layer (3) is further provided with a height heat exchange channel (314) extending along the third direction. The height heat exchange channel (314) is connected between the top heat exchange channel (311), the middle heat exchange channel (313), and the bottom heat exchange channel (312). The line connecting the bottom and top of the height heat exchange channel (314) is inclined relative to the first direction, the second direction, and the third direction. The lower part of the heat-conducting layer (3) is provided with a plurality of lower fixed sections (32), the lower fixed sections (32) having the same shape as the top of the guide plate (21) and being connected one-to-one; and, between adjacent lower fixed sections (32) are provided a plurality of heat exchange channel (31) inlets for the heat exchange medium in the channel layer (2) to flow into the heat-conducting layer (3); the heat-conducting layer (3) is an integrally formed heat-conducting layer (3); in the plane formed by the second direction and the third direction, at least one cross section of the heat-conducting layer (3) forms a plurality of S-shaped structures spaced apart along the second direction and extending along the third direction; in the plane formed by the first direction and the third direction, at least one cross section of the heat-conducting layer (3) forms an S-shaped structure extending along the first direction in the middle; The S-shaped structure in the middle of the heat-conducting layer (3) can form the middle heat exchange channel (313). The middle of the high heat exchange channel (314) is provided with a throat structure, and the middle heat exchange channel (313) penetrates the throat structure.

2. The cold-rolled plate according to claim 1, characterized in that, The guide plate (21) extends in a wave shape along the first direction, and the heat-conducting layer (3) is connected to the top of the guide plate (21); and / or, the guide plate (21) includes a plurality of guide plates, each of which is spliced ​​together in sequence, and there is a smooth transition between adjacent guide plates.

3. The cold-rolled plate according to claim 1, characterized in that, The periphery of the substrate (1) extends relative to the housing and forms a positioning edge (11), and the positioning edge (11) is provided with a plurality of positioning holes (12).

4. The cold-rolled plate according to claim 1, characterized in that, The upper part of the heat-conducting layer (3) is also provided with several upper fixed sections (33), which are fixed on the inner wall of the shell. Furthermore, several heat exchange channels (31) outlets are provided between adjacent upper fixed sections (33) for the heat exchange medium in the heat-conducting layer (3) to flow through the inner surface of the shell.

5. The cold-rolled plate according to claim 1, characterized in that, The heat-conducting layer (3) has several recessed structures (34) at its top and bottom. The recessed structures (34) at the bottom of the heat-conducting layer (3) are arranged periodically along the first direction, and the recessed structures (34) at the top of the heat-conducting layer (3) are arranged periodically along the second direction. The pitch of the recessed structures (34) is 1.5-2.5 mm, and the bow height of the recessed structures (34) is 0.25-0.26 mm.

6. A liquid cooling system, comprising a cold plate, characterized in that, The cold plate is the cold plate according to any one of claims 1 to 5.

7. An electronic device, comprising a liquid cooling system, characterized in that, The liquid cooling system is the liquid cooling system described in claim 6.

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