A laser slitting method for closed figures

Abstract

This invention discloses a laser cutting method for closed patterns, aiming to provide a method that ensures complete cutting of closed patterns without filament adhesion. It includes the following steps: determining the laser motion path of each laser processing unit, which includes at least one continuous main path. Each main path has over-cutting paths at both ends, with one over-cutting path being the starting over-cutting path and the other being the ending over-cutting path. The end point of the starting over-cutting path is the starting point of the corresponding main path, and the end point of the main path is the starting point of the corresponding ending over-cutting path. The main paths of all laser processing units form a closed pattern, and each over-cutting path is located within the closed pattern. The laser of each laser processing unit cuts the fabric to be cut along the laser motion path from the starting point of the starting over-cutting path until it reaches the end point of the ending over-cutting path.

Description

Technical Field

[0001] This invention relates to the field of fabric laser slitting technology, and specifically to a laser slitting method for closed patterns. Background Technology

[0002] Currently, the technical challenge of laser cutting technology for fabrics (such as laser cutting technology for sanitary product fabrics) in cutting closed patterns lies in the difficulty of achieving high-precision line matching. The cutting patterns are not easily aligned, leading to deviations and incomplete cuts of the closed patterns. This is especially true when cutting large areas of fabric. Due to the small effective cutting area of ​​current lasers, multiple lasers are often required to work together to cut large closed patterns. Furthermore, the overlap of the non-closed patterns cut by each laser at the predetermined intersection points is difficult to align, resulting in deviations and multiple areas of large closed patterns that cannot be completely cut.

[0003] On the other hand, the current fabric laser slitting process generally uses CO2 lasers. Although using this type of laser to slitting materials can achieve high processing efficiency, it is easy to generate a large heat-affected zone, resulting in a high degree of crystallization at the product slitting edges, poor tactile feel, and even easy to scratch the skin, making it difficult to meet the requirements of skin contact. Summary of the Invention

[0004] The primary objective of this invention is to provide a laser slitting method for closed graphics that ensures complete cutting of the closed graphic without any sticking of fibers.

[0005] Another objective of this invention is to provide a laser cutting method for closed patterns that can effectively prevent crystallization at the fabric cutting edges, improve the tactile feel of the cut surface to meet the requirements of skin contact, and ensure cutting quality.

[0006] The technical solution of this invention is: A laser cutting method for closed patterns, employing multiple laser processing units to cut fabric, includes the following steps: The laser motion path of each laser processing unit is determined, which includes at least one continuous main path. Each main path has over-cutting paths at both ends. One over-cutting path is the starting over-cutting path, and the other over-cutting path is the ending over-cutting path. The ending point of the starting over-cutting path is the starting point of the corresponding main path, and the ending point of the main path is the starting point of the corresponding ending over-cutting path. The main paths of each laser processing unit form a closed figure, and each over-cutting path is located within the closed figure. Each laser processing unit cuts the fabric along its laser path from the starting point of the cutting path until it reaches the end point of the cutting path. This method for laser slitting closed patterns utilizes multiple laser processing units working collaboratively, enabling the slitting of large-area closed patterns. Furthermore, a cutting path is positioned at the connection point of any two adjacent main paths within the waste area inside the closed pattern. This prevents cutting into the fabric itself and ensures that the non-closed patterns of each laser processing unit are successfully cut at predetermined intersections, guaranteeing complete slitting of the closed pattern without any fraying. This effectively solves the problem in existing fabric laser slitting processes where misalignment of the cutting pattern during closed pattern slitting leads to incomplete slitting.

[0007] Preferably, in the step of determining the laser motion path of each laser processing unit, at the connection endpoint between any two adjacent main paths in the closed pattern, there are two overcutting paths. Either of these overcutting paths lies between the other overcutting path and the corresponding main path. Thus, even if the endpoint positions of the main paths of each laser processing unit deviate, the overcutting paths at the ends of the main paths can ensure that the laser motion path (non-closed pattern) of each laser processing unit is successfully cut at the predetermined intersection, thereby ensuring that the closed pattern is completely cut without any sticking.

[0008] Preferably, the laser processing unit includes a picosecond pulsed laser. The cutting parameters for each laser processing unit are as follows: laser wavelength of 0.8-20 micrometers, repetition frequency of 1-3MHz, and pulse width of less than 100ps. Through extensive research and development and numerous experiments, the inventors discovered that using a picosecond pulsed laser to cut fabric, with the following cutting parameters set during the cutting process: laser wavelength of 0.8-20 micrometers, repetition frequency of 1-3MHz, and pulse width of less than 100ps, can effectively prevent crystallization at the fabric cutting edges, resulting in a better tactile feel at the cut surface to meet skin contact requirements and ensure cutting quality. This effectively solves the problem in existing fabric laser cutting processes using CO2 lasers where the cutting edges have a high degree of crystallization, poor tactile feel, and can even easily scratch the skin, making it difficult to meet skin contact requirements.

[0009] Preferably, when the slitting speed is 100m / min, the operating power of a single laser processing unit is not less than 80W; when the slitting speed is 200m / min, the operating power of a single laser processing unit is not less than 100W; and when the slitting speed is 300m / min, the operating power of a single laser processing unit is not less than 200W.

[0010] Preferably, the effective cutting area of ​​each laser processing unit is 100-300mm.

[0011] A laser cutting method for closed patterns, using a single laser processing unit to cut fabric, includes the following steps: The laser motion path of the laser processing unit is determined. The laser motion path includes a continuous main path. Both ends of the main path are provided with overcutting paths. One end of the overcutting path is the starting overcutting path, and the other end of the overcutting path is the ending overcutting path. The ending point of the starting overcutting path is the starting point of the main path, and the ending point of the main path is the starting point of the ending overcutting path. The starting point and the ending point of the main path are connected to form a closed figure, and each overcutting path is located within the closed figure. The laser in this laser processing unit cuts the fabric along its movement path from the starting point of the laser cutting path to the end point of the laser cutting path. This method for laser slitting closed patterns uses a single laser processing unit and is suitable for slitting small-area closed patterns. Furthermore, the main path in this method has cutting paths at both ends, located in the waste area inside the closed pattern. This prevents cutting the fabric itself and ensures that the closed pattern formed by the main path is successfully cut at the connection point between the starting and ending points, guaranteeing a complete cut without any fraying. This effectively solves the problem in existing fabric laser slitting processes where misalignment of the cutting pattern leads to incomplete cutting of closed patterns.

[0012] Preferably, the laser processing unit includes a picosecond pulsed laser. The parameters for cutting the fabric by the laser processing unit are as follows: laser wavelength of 0.8-20 micrometers, repetition frequency of 1-3MHz, and pulse width of less than 100ps. Through extensive research and development and numerous experiments, the inventors have discovered that using a picosecond pulsed laser to cut fabric, with the following cutting parameters set during the cutting process: laser wavelength of 0.8-20 micrometers, repetition frequency of 1-3MHz, and pulse width of less than 100ps, can effectively prevent crystallization at the fabric cutting edges, resulting in a better tactile feel at the cut surface to meet the requirements of skin contact and ensuring cutting quality. This effectively solves the problem in existing fabric laser cutting processes using CO2 lasers where the cutting edges have a high degree of crystallization, poor tactile feel, and can even easily scratch the skin, making it difficult to meet the requirements of skin contact.

[0013] Preferably, when the slitting speed is 100m / min, the operating power of the laser processing unit is not less than 80W; when the slitting speed is 200m / min, the operating power of the laser processing unit is not less than 100W; and when the slitting speed is 300m / min, the operating power of the laser processing unit is not less than 200W.

[0014] Preferably, the effective cutting area of ​​the laser processing unit is 100-300mm.

[0015] The beneficial effects of this invention are: Firstly, it can ensure that the closed pattern is completely cut without any sticking; it effectively solves the problem in the existing fabric laser cutting process that the cutting pattern is not easy to align and is prone to deviation, resulting in the closed pattern not being completely cut.

[0016] Secondly, it can effectively prevent crystallization at the fabric cutting edges, making the cut surface feel good to the touch, thus meeting the requirements of skin contact and ensuring cutting quality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram illustrating the use of a closed-pattern laser slitting method, as described in Embodiments 1 and 2 of the present invention, to slit fabric.

[0018] Figure 2 This is a schematic diagram illustrating the use of a closed-pattern laser slitting method, as described in Embodiments 3 and 4 of the present invention, to slit fabric. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Specific Implementation Example 1, such as Figure 1 As shown, a laser cutting method for closed patterns is used to cut fabric using a single laser processing unit.

[0020] A laser slitting method for closed shapes includes the following steps: The laser motion path of the laser processing unit is determined, and the laser motion path includes a continuous main path 1. Both ends of the main path 1 have over-cutting paths, with one end having a starting over-cutting path 2 and the other end having an ending over-cutting path 3. The endpoint of the starting over-cutting path 2 is the starting point of the main path 1. The endpoint of the main path 1 is the starting point of the ending over-cutting path 3. The starting and ending points of the main path 1 form a closed figure, and all over-cutting paths are located within this closed figure; that is, both the starting over-cutting path 2 and the ending over-cutting path 3 are located within the closed figure.

[0021] The laser of the laser processing unit cuts the fabric to be cut along the laser motion path from the starting point of the starting point of the cutting path 2 until it reaches the end point of the cutting path 3.

[0022] The laser slitting method for closed patterns in this embodiment uses a single laser processing unit for cutting, making it suitable for slitting small-area closed patterns. Simultaneously, both ends of the main path 1 in this method have over-cutting paths located in the waste area inside the closed pattern (the fabric in the inner area of ​​the closed pattern is waste). This prevents cutting the fabric itself and ensures that even if there is a deviation between the start and end points of the main path 1, the over-cutting paths at these points will allow the closed pattern to be successfully cut at the connection point between the start and end points of the main path 1, guaranteeing complete slitting without any sticky threads. This effectively solves the problem in existing fabric laser slitting processes where misalignment of the slitting pattern during closed pattern cutting leads to incomplete slitting.

[0023] Specific embodiment two, such as Figure 1 As shown, a laser cutting method for closed patterns is used to cut fabric using a single laser processing unit.

[0024] A laser slitting method for closed shapes includes the following steps: The laser motion path of the laser processing unit is determined, and the laser motion path includes a continuous main path 1. Both ends of the main path 1 have over-cutting paths, with one end having a starting over-cutting path 2 and the other end having an ending over-cutting path 3. The endpoint of the starting over-cutting path 2 is the starting point of the main path 1. The endpoint of the main path 1 is the starting point of the ending over-cutting path 3. The starting and ending points of the main path 1 form a closed figure. All over-cutting paths are located within this closed figure; that is, both the starting over-cutting path 2 and the ending over-cutting path 3 are located within the closed figure.

[0025] The laser in the laser processing unit starts at the beginning of cutting path 2 and cuts the fabric along the laser motion path using set laser parameters until it reaches the end of cutting path 3. The set laser parameters are: laser wavelength of 0.8-20 micrometers, repetition frequency of 1-3MHz, and pulse width of less than 100ps.

[0026] In one example, the laser parameters set for each laser processing unit are: a laser wavelength of 800 nm, a repetition frequency of 1.5 MHz, and a pulse width of less than 80 ps.

[0027] In another example, the laser parameters set for each laser processing unit are: a laser wavelength of 1064 nm, a repetition frequency of 2 MHz, and a pulse width of less than 15 ps.

[0028] In the third example, the laser parameters set for each laser processing unit are: laser wavelength of 12 micrometers, repetition frequency of 3 MHz, and pulse width of less than 40 ps.

[0029] In the fourth example, the laser parameters set for each laser processing unit are: laser wavelength of 20 micrometers, repetition frequency of 1 MHz, and pulse width of less than 60 ps.

[0030] The laser slitting method for closed patterns in this embodiment uses a single laser processing unit for cutting, making it suitable for slitting small-area closed patterns. Simultaneously, both ends of the main path 1 in this method have over-cutting paths located in the waste area inside the closed pattern (the fabric in the inner area of ​​the closed pattern is waste). This prevents cutting the fabric itself and ensures that even if there is a deviation between the start and end points of the main path 1, the over-cutting paths at these points will allow the closed pattern to be successfully cut at the connection point between the start and end points of the main path 1, guaranteeing complete slitting without any sticky threads. This effectively solves the problem in existing fabric laser slitting processes where misalignment of the slitting pattern during closed pattern cutting leads to incomplete slitting.

[0031] On the other hand, through extensive research and development and numerous experiments, the inventors discovered that using a picosecond pulsed laser to cut fabric, and employing the laser parameters described in this embodiment during the fabric cutting process, can effectively prevent crystallization at the fabric cutting edges, resulting in a better tactile feel at the cut surface to meet the requirements of skin contact and ensuring cutting quality. This effectively solves the problem in existing fabric laser cutting processes using CO2 lasers where the cutting edges have a high degree of crystallization, poor tactile feel, and are even prone to scratching the skin, making it difficult to meet the requirements of skin contact.

[0032] Specifically, the laser processing unit includes a picosecond pulsed laser, a beam expander, a field mirror, and a galvanometer. The laser processing unit is existing technology, and its specific structure is not the focus of this application; therefore, this application will not elaborate on the specific methods and structures of the laser processing unit or other conventional technical means. In this embodiment, each laser processing unit also includes a cooling machine, which is used to cool the temperature of the picosecond pulsed laser during the slitting process to prevent damage to the laser due to overheating.

[0033] The effective cutting area of ​​the laser processing unit is 100-300mm. In this context, "effective cutting area" refers to a square with a side length of 100-300mm. For example, if the effective cutting area of ​​the laser processing unit is a square with a side length of 230mm, then the laser processing unit can cut fabric with a cutting area within 230mm.

[0034] In this embodiment, when the slitting speed of the laser processing unit is determined to be 100 m / min, the operating power of a single laser processing unit is no less than 80 W. When the slitting speed of the laser processing unit is determined to be 200 m / min, the operating power of a single laser processing unit is no less than 100 W. When the slitting speed of the laser processing unit is determined to be 300 m / min, the operating power of a single laser processing unit is no less than 200 W. The operating power of the laser processing unit is related to the slitting speed in the specific processing procedure. As the slitting speed increases, the operating power of the laser processing unit is increased accordingly to ensure the slitting quality.

[0035] Specific embodiment three, such as Figure 2 As shown, a laser slitting method for closed patterns uses multiple laser processing units to slit the fabric, for example, 2-6 laser processing units. In this embodiment, the method of slitting fabric with 4 laser processing units is described as an example.

[0036] A laser slitting method for closed shapes includes the following steps: The laser motion path of each laser processing unit is determined, which includes at least one continuous main path 1. In this embodiment, the laser motion path of each laser processing unit includes one continuous main path 1. Each main path 1 has over-cutting paths at both ends, where the over-cutting path at one end is the starting over-cutting path 2, and the over-cutting path at the other end is the ending over-cutting path 3. Figure 2 The laser motion paths of each laser processing unit are illustrated using lines of different widths. The endpoint of the starting point over-cutting path 2 is the starting point of the corresponding main path 1, and the endpoint of the main path 1 is the starting point of the corresponding endpoint over-cutting path 3. The main paths 1 of each laser processing unit are connected sequentially to form a closed figure. All over-cutting paths are located within the closed figure, that is, all starting point over-cutting paths 2 and all endpoint over-cutting paths 3 are located within the closed figure.

[0037] The laser of each laser processing unit cuts the fabric to be cut along the laser motion path from the starting point of the starting point of the cutting path 2 until it reaches the end point of the cutting path 3.

[0038] The laser slitting method for closed patterns in this embodiment employs multiple laser processing units working collaboratively, enabling the slitting of large-area closed patterns. Simultaneously, an overcutting path is set at the connection endpoint of any two adjacent main paths 1 in the laser slitting method for closed patterns. This overcutting path is located in the waste area inside the closed pattern (the fabric in the inner area of ​​the closed pattern is waste). This prevents cutting the fabric body and ensures that even if there is a deviation between the start and end positions of the main path 1, the overcutting path at the start and end points of the main path 1 guarantees that the closed pattern is successfully cut at the connection point between the start and end points of the main path 1, thus ensuring complete slitting of the closed pattern without any sticking. This effectively solves the problem in existing fabric laser slitting processes where the slitting pattern is difficult to align, leading to deviations and preventing complete slitting of the closed pattern.

[0039] In this embodiment, during the step of determining the laser motion path of each laser processing unit, there are two overcutting paths at the connection endpoint between any two adjacent main paths 1 in the closed pattern. Either of these overcutting paths lies between the other overcutting path and the corresponding main path 1. Specifically, at the connection endpoint between any two adjacent main paths 1 in the closed pattern, both overcutting paths are either starting overcutting path 2; or both overcutting paths are ending overcutting path 3; or one of the two overcutting paths is starting overcutting path 2 and the other is ending overcutting path 3. Thus, even if the endpoint position of the main path 1 of each laser processing unit deviates, the overcutting paths at the ends of the main paths 1 can ensure that the laser motion path (non-closed pattern) of each laser processing unit is successfully cut at the predetermined intersection, thereby ensuring that the closed pattern is completely cut without any sticking.

[0040] Specific embodiment four, such as Figure 2 As shown, a laser slitting method for closed patterns uses multiple laser processing units to slit the fabric, for example, 2-6 laser processing units. In this embodiment, the method of slitting fabric with 4 laser processing units is described as an example.

[0041] A laser slitting method for closed shapes includes the following steps: The laser motion path of each laser processing unit is determined, which includes at least one continuous main path 1. In this embodiment, the laser motion path of each laser processing unit includes one continuous main path 1. Each main path 1 has over-cutting paths at both ends, where the over-cutting path at one end is the starting over-cutting path 2, and the over-cutting path at the other end is the ending over-cutting path 3. Figure 2The laser motion paths of each laser processing unit are illustrated using lines of different widths. The endpoint of the starting point over-cutting path 2 is the starting point of the corresponding main path 1, and the endpoint of the main path 1 is the starting point of the corresponding endpoint over-cutting path 3. The main paths 1 of each laser processing unit are connected sequentially to form a closed figure. All over-cutting paths are located within the closed figure, that is, all starting point over-cutting paths 2 and all endpoint over-cutting paths 3 are located within the closed figure.

[0042] The laser from each laser processing unit starts at the beginning of cutting path 2 and cuts the fabric along the laser motion path using set laser parameters until it reaches the end of cutting path 3. The set laser parameters are: laser wavelength of 0.8-20 micrometers, repetition frequency of 1-3MHz, and pulse width of less than 100ps.

[0043] In one example, the laser parameters set for each laser processing unit are: a laser wavelength of 800 nm, a repetition frequency of 1.5 MHz, and a pulse width of less than 80 ps.

[0044] In another example, the laser parameters set for each laser processing unit are: a laser wavelength of 1064 nm, a repetition frequency of 2 MHz, and a pulse width of less than 15 ps.

[0045] In the third example, the laser parameters set for each laser processing unit are: laser wavelength of 12 micrometers, repetition frequency of 3 MHz, and pulse width of less than 40 ps.

[0046] In the fourth example, the laser parameters set for each laser processing unit are: laser wavelength of 20 micrometers, repetition frequency of 1 MHz, and pulse width of less than 60 ps.

[0047] The laser slitting method for closed patterns in this embodiment employs multiple laser processing units working collaboratively, enabling the slitting of large-area closed patterns. Simultaneously, an overcutting path is set at the connection endpoint of any two adjacent main paths 1 in the laser slitting method for closed patterns. This overcutting path is located in the waste area inside the closed pattern (the fabric in the inner area of ​​the closed pattern is waste material). This prevents cutting the fabric body and ensures that the non-closed patterns of each laser processing unit are successfully cut at predetermined intersections, thus guaranteeing that the closed pattern is completely cut without any fraying. This effectively solves the problem in existing fabric laser slitting processes where the slitting pattern is difficult to align, leading to deviations and preventing the closed pattern from being completely cut.

[0048] On the other hand, through extensive research and development and numerous experiments, the inventors discovered that using a picosecond pulsed laser to cut fabric, and employing the laser parameters described in this embodiment during the fabric cutting process, can effectively prevent crystallization at the fabric cutting edges, resulting in a better tactile feel at the cut surface to meet the requirements of skin contact and ensuring cutting quality. This effectively solves the problem in existing fabric laser cutting processes using CO2 lasers where the cutting edges have a high degree of crystallization, poor tactile feel, and are even prone to scratching the skin, making it difficult to meet the requirements of skin contact.

[0049] Specifically, each laser processing unit includes a picosecond pulsed laser, a beam expander, a field mirror, and a galvanometer. The laser processing unit is a prior art concept, and its specific structure is not the focus of this application; therefore, this application will not elaborate on the specific methods and structures of the laser processing unit or other conventional technical means. In this embodiment, each laser processing unit also includes a cooling machine, which is used to cool the temperature of the picosecond pulsed laser during the slitting process, preventing the laser from being damaged due to overheating.

[0050] Each laser processing unit has an effective cutting area of ​​100-300mm. In this context, an effective cutting area of ​​100-300mm refers to a square with a side length of 100-300mm. For example, if the effective cutting area of ​​a laser processing unit is a square with a side length of 230mm, then four laser processing units working together can cut large areas of fabric with a cutting area between 200mm and 600mm. In other words, for different cutting area sizes, different numbers of laser processing units can be configured in the closed-shape laser cutting method of this application to meet the cutting needs of different sizes.

[0051] Furthermore, in the step of determining the laser motion path of each laser processing unit, at the connection endpoint between any two adjacent main paths 1 in the closed pattern, there are two overcutting paths. Either of these overcutting paths lies between the other overcutting path and the corresponding main path 1. Thus, even if the endpoint position of the main path 1 of each laser processing unit deviates, the overcutting path at the end of the main path 1 can ensure that the laser motion path (non-closed pattern) of each laser processing unit is successfully cut at the predetermined intersection, thereby ensuring that the closed pattern is completely cut without any sticking.

[0052] Specifically, at any two adjacent main paths 1 in the closed figure, there are two tangent paths, in which both tangent paths are starting tangent paths 2; or both tangent paths are ending tangent paths 3; or one of the two tangent paths is starting tangent path 2 and the other is ending tangent path 3.

[0053] In this embodiment, as Figure 2 As shown, at the connection endpoints between any two adjacent main paths 1 in the closed figure, there are two over-cutting paths, one of which is the starting over-cutting path 2, and the other is the ending over-cutting path 3. The main paths 1 of each laser processing unit are connected end to end to form a closed figure. All over-cutting paths are located within the closed figure.

[0054] Furthermore, when the slitting speed is 100 m / min, the operating power of a single laser processing unit is no less than 80 W. When the slitting speed is 200 m / min, the operating power of a single laser processing unit is no less than 100 W. When the slitting speed is 300 m / min, the operating power of a single laser processing unit is no less than 200 W. The operating power of the laser processing unit is related to the slitting speed in the specific processing procedure. As the slitting speed increases, the operating power of the laser processing unit should be increased accordingly to ensure slitting quality.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications, alterations, and equivalent transformations made to the above embodiments based on the technical essence of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A laser slitting method for closing a pattern, characterized by, The fabric is slit using multiple laser processing units, including the following steps: The laser motion path of each laser processing unit is determined, which includes at least one continuous main path. Each main path has over-cutting paths at both ends. One over-cutting path is the starting over-cutting path, and the other over-cutting path is the ending over-cutting path. The ending point of the starting over-cutting path is the starting point of the corresponding main path, and the ending point of the main path is the starting point of the corresponding ending over-cutting path. The main paths of each laser processing unit form a closed figure, and each over-cutting path is located within the closed figure. The laser of each laser processing unit cuts the fabric to be cut along the laser motion path from the starting point of the cutting path until it reaches the end point of the cutting path.

2. The laser slitting method for a closed pattern according to claim 1, characterized in that, In the step of determining the laser motion path of each laser processing unit, there are two overcut paths at the connection endpoint between any two adjacent main paths in the closed figure. Any one of these two overcut paths is located between the other overcut path and the main path corresponding to the other overcut path.

3. A laser slitting method for a closed pattern according to claim 1 or 2, characterized in that, The laser processing unit includes a picosecond pulsed laser. The parameters for cutting the fabric to be cut by each laser processing unit are as follows: laser wavelength is 0.8-20 micrometers, repetition frequency is 1-3MHz, and pulse width is less than 100ps.

4. A laser slitting method for a closed pattern according to claim 1 or 2, characterized in that, When the slitting speed is 100m / min, the operating power of a single laser processing unit shall not be less than 80W; When the slitting speed is 200m / min, the operating power of a single laser processing unit is not less than 100W; When the slitting speed is 300m / min, the operating power of a single laser processing unit is not less than 200W.

5. A laser slitting method for a closed pattern according to claim 1 or 2, characterized in that, The effective cutting area of ​​each laser processing unit is 100-300mm.

6. A laser cutting method for closed patterns, characterized in that, Fabric is slit using a laser processing unit, including the following steps: The laser motion path of the laser processing unit is determined. The laser motion path includes a continuous main path. Both ends of the main path are provided with overcutting paths. One end of the overcutting path is the starting overcutting path, and the other end of the overcutting path is the ending overcutting path. The ending point of the starting overcutting path is the starting point of the main path, and the ending point of the main path is the starting point of the ending overcutting path. The starting point and the ending point of the main path are connected to form a closed figure, and each overcutting path is located within the closed figure. The laser in the laser processing unit cuts the fabric to be cut along the laser motion path from the starting point of the cutting path until it reaches the end point of the cutting path.

7. The laser slitting method for a closed pattern according to claim 6, characterized in that, The laser processing unit includes a picosecond pulsed laser. The laser parameters for cutting the fabric to be cut by the laser processing unit are as follows: laser wavelength is 0.8-20 micrometers, repetition frequency is 1-3MHz, and pulse width is less than 100ps.

8. A laser slitting method for a closed pattern according to claim 6 or 7, characterized in that, When the slitting speed is 100m / min, the operating power of the laser processing unit shall not be less than 80W; When the slitting speed is 200m / min, the operating power of the laser processing unit shall not be less than 100W; When the slitting speed is 300m / min, the operating power of the laser processing unit shall not be less than 200W.

9. A laser slitting method for a closed pattern according to claim 6 or 7, characterized in that, The effective cutting area of ​​the laser processing unit is 100-300mm.

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