Test apparatus and test method

Abstract

The application relates to a testing device and a testing method. The testing device comprises a first mold assembly, a second mold assembly, a first mold fixing assembly, a second mold fixing assembly, a first temperature control assembly, a second temperature control assembly and a testing assembly. The first mold assembly is arranged at one end of the first mold fixing assembly. The second mold assembly is arranged on the second mold fixing assembly and faces the first mold assembly. The first mold assembly and the second mold assembly have a testing gap for filling a sample. The first temperature control assembly is arranged on at least one of the first mold assembly and the second mold assembly and can adjust the testing temperature of the sample. The second temperature control assembly is arranged on the second mold fixing assembly and can adjust the temperature of the second mold fixing assembly. The testing assembly is arranged at the end of the first mold fixing assembly away from the first mold assembly and can measure the stress of the first mold fixing assembly. The structure can independently control the testing gap and compensate for thermal deformation to guarantee the stress measurement accuracy.

Description

Technical Field

[0001] This application relates to the field of testing equipment, and in particular to a testing device and a testing method. Background Technology

[0002] Reactive adhesives undergo chemical shrinkage during the curing stage due to polymerization and thermal shrinkage during the cooling stage due to temperature reduction. Both types of shrinkage collectively induce internal stress in the adhesive layer, easily leading to cracks, voids, and peeling, directly reducing product reliability. Accurate characterization of this internal stress is crucial for adhesive research and application. Existing testing equipment places the connecting rod and mold as a whole into a temperature-controlled chamber for heating. Uneven thermal deformation of the connecting rod results in an unstable test gap, and the thermal deformation of the connecting rod cannot be individually controlled to flexibly adjust the test gap. Consequently, it is impossible to accurately obtain internal stress data during the adhesive curing and cooling processes. Summary of the Invention

[0003] Therefore, it is necessary to provide a testing device and method that can independently control the testing gap and compensate for thermal deformation to ensure the accuracy and stability of stress measurement.

[0004] This invention first provides a testing apparatus for testing samples, characterized in that it includes:

[0005] First mold fixing assembly and second mold fixing assembly;

[0006] The first mold assembly is disposed at one end of the first mold fixing assembly;

[0007] A second mold assembly is disposed on the second mold fixing assembly and faces the first mold assembly; a test gap for filling the sample is provided between the first mold assembly and the second mold assembly;

[0008] A first temperature control component is disposed in at least one of the first mold assembly and the second mold assembly, and is capable of adjusting the test temperature of the sample;

[0009] A second temperature control component is disposed on the second mold fixing component and is capable of adjusting the temperature of the second mold fixing component; and...

[0010] The test component is located at the end of the first mold fixing component away from the first mold component and is capable of measuring the stress of the first mold fixing component.

[0011] This configuration allows for independent arrangement of the first and second mold fixing components, enabling separate control of their positions. The first temperature control component is directly attached to at least one of the first and second mold components, resulting in a short heat transfer path, low loss, and rapid establishment of a uniform and stable test temperature. This reduces local temperature differences during sample curing and ensures consistent sample reaction states. The second temperature control component independently controls the temperature, allowing for flexible adjustment of the temperature value of the second mold fixing component. By compensating for thermal expansion deformation through temperature differences, the test gap maintains a constant size or changes precisely according to a preset pattern during testing. The test components are installed away from high-temperature test areas to avoid the impact of high temperatures on the performance of internal components, ensuring the accuracy and long-term stability of stress measurements.

[0012] In one embodiment, the testing apparatus further includes a connection component;

[0013] The first mold fixing assembly includes a first connecting rod extending along the first preset direction, and the second mold fixing assembly includes a second connecting rod extending along the first preset direction. The first end of the first connecting rod and the first end of the second connecting rod are both disposed in the connecting assembly.

[0014] The first mold assembly is disposed at the second end of the first connecting rod, and the second mold assembly is disposed at the second end of the second connecting rod.

[0015] This configuration optimizes the layout and force transmission efficiency of the first and second mold fixing components, resulting in more stable performance in test gap control, temperature field regulation, thermal deformation compensation, and stress measurement.

[0016] In one embodiment, the second mold assembly includes a mold base plate extending along a second preset direction, the second preset direction being perpendicular to the first preset direction, the mold base plate being connected to the second end of the second connecting rod, and the first mold assembly being disposed on the side of the mold base plate facing the second connecting rod.

[0017] This setup improves the flatness of the structural installation and the accuracy of temperature control, compensation, and measurement.

[0018] In one embodiment, there are two second connecting rods, which are respectively disposed on both sides of the first connecting rod and connected to both ends of the mold base plate.

[0019] With this setup, the mold base plate receives uniform and stable support, ensuring the uniformity and consistency of the test gaps.

[0020] In one embodiment, the number of the first temperature control components is multiple sets, at least one set of the first temperature control components is disposed on the mold base plate and can adjust the temperature of the mold base plate, and at least one set of the first temperature control components is disposed on the first mold assembly and can adjust the temperature of the first mold assembly.

[0021] With this setup, multiple sets of primary temperature control components can control the temperature in separate zones, reducing local temperature differences.

[0022] In one embodiment, the testing device further includes a first driving component capable of driving the first connecting rod to move along the first preset direction to adjust the size of the test gap; and / or, the testing device further includes a second driving component capable of driving the second connecting rod to move along the first preset direction to adjust the size of the test gap; and / or, the second connecting rod is detachably connected to the connecting component and / or the second mold component; and / or, the first connecting rod is detachably connected to the connecting component and / or the first mold component.

[0023] This setup allows for more flexible and precise independent control of the test intervals, and improves the ease of assembly and disassembly of the device, as well as its adaptability.

[0024] In one embodiment, the first mold fixing assembly further includes a first water-cooling component, which is disposed at the first end of the first connecting rod, and both ends of the test assembly are connected to the connecting assembly and the first water-cooling component.

[0025] With this configuration, the first water-cooled component blocks the heat conduction path, improving the measurement accuracy and stability of the test components.

[0026] In one embodiment, the second mold fixing assembly further includes a second water-cooling component, the two ends of which are connected to the connecting assembly and the second connecting rod; or, the connecting assembly includes a water-cooling connector and a first fixing plate, the first fixing plate and the water-cooling connector both extending along a second preset direction, the first end of the second connecting rod being connected to the water-cooling connector, and the two ends of the testing assembly being connected to the first end of the first connecting rod and the first fixing plate.

[0027] With this configuration, the second water-cooled component blocks the heat from the second connecting rod from being conducted to the connecting assembly, preventing thermal deformation of the connecting assembly from affecting the test gap control; the water-cooled connector and the first fixing plate integrate heat insulation and fixing functions, making the device structure more compact and the test results better.

[0028] In one embodiment, the testing device further includes an anti-interference airflow baffle, which forms an anti-interference space, wherein the first mold fixing component, the second mold fixing component, the first mold component, the second mold component, the first temperature control component, the second temperature control component, and the testing component are all located within the anti-interference space.

[0029] This setup reduces external environmental interference and makes the testing conditions more constant.

[0030] In one embodiment, the first mold assembly includes a first mold and a first mold carrier, the first mold carrier being disposed on the first mold fixing assembly, and the first mold being detachably disposed on the side of the first mold carrier opposite to the first mold fixing assembly; and / or, the second mold assembly includes a second mold and a second mold carrier, the second mold carrier being disposed on the second mold fixing assembly, and the second mold being detachably disposed on the side of the second mold carrier opposite to the second mold fixing assembly.

[0031] This setup improves the versatility and economy of the testing equipment, while also facilitating maintenance and cleaning, and ensuring testing accuracy.

[0032] This application also provides a testing method, using the above-described testing apparatus, including the following testing steps:

[0033] Adjust the value of the test gap between the first mold assembly and the second mold assembly to a preset test gap value;

[0034] The liquid sample is filled into the test gap between the first mold assembly and the second mold assembly;

[0035] Adjust the first temperature control component to a first preset temperature, and adjust the second temperature control component to a second preset temperature;

[0036] Wait for the liquid sample to solidify;

[0037] Obtain the measurement results of the test component.

[0038] This setup controls the temperatures of the first and second temperature control components, ensuring the sample cures at the set temperature while maintaining a constant test gap. Simultaneously, stress data is acquired in real time through the test components, enabling precise measurement of axial stress during sample curing and cooling.

[0039] In one implementation, a calibration step is included before the testing step:

[0040] A quartz crystal of the same size as the preset test gap is placed inside the test gap;

[0041] Adjust the test gap between the first mold assembly and the second mold assembly;

[0042] When the measurement result of the test component is a preset value, the adjustment of the test gap is stopped, and the value of the test gap at this time can be regarded as the value of the preset test gap;

[0043] Adjust the first temperature control component to the first preset temperature;

[0044] Adjust the temperature of the second temperature control component to obtain the measurement results of the test component;

[0045] When the measurement result of the test component is a preset value, the temperature of the second temperature control component is recorded as the second preset temperature.

[0046] With this setup, the low expansion characteristics of quartz can simulate a constant test gap, and the second preset temperature of the second temperature control component can be accurately obtained through calibration steps, resulting in more precise thermal deformation compensation. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a schematic diagram of the first structure of the test device provided in this application.

[0049] Figure 2 This is a schematic diagram of a second structure of the test device provided in this application.

[0050] Reference numerals: 1. First mold assembly; 11. First mold; 12. First mold carrier; 2. Second mold assembly; 21. Second mold; 22. Mold base plate; 3. First mold fixing assembly; 31. First connecting rod; 32. First water-cooling component; 4. Second mold fixing assembly; 41. Second connecting rod; 42. Second water-cooling component; 5. First temperature control assembly; 6. Second temperature control assembly; 7. Test assembly; 8. Connecting assembly; 81. First fixing plate; 82. Water-cooling connector; 83. Support column; 9. Anti-interference airflow baffle; 91. Anti-interference space. Detailed Implementation

[0051] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0052] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0053] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0055] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0056] Reactive adhesives undergo chemical shrinkage during the curing stage due to polymerization and thermal shrinkage during the cooling stage due to temperature reduction. Both types of shrinkage collectively induce internal stress in the adhesive layer, easily leading to cracks, voids, and peeling, directly reducing product reliability. Accurate characterization of this internal stress is crucial for adhesive research and application. Existing testing equipment places the connecting rod and mold as a whole into a temperature-controlled chamber for heating. Uneven thermal deformation of the connecting rod results in an unstable test gap, and the thermal deformation of the connecting rod cannot be individually controlled to flexibly adjust the test gap. Consequently, it is impossible to accurately obtain internal stress data during the adhesive curing and cooling processes.

[0057] Therefore, in order to solve the above problems, such as Figure 1 and Figure 2 As shown, this application provides a testing device and testing method that can independently control the testing gap and compensate for thermal deformation to ensure the accuracy and stability of stress measurement.

[0058] like Figure 1 The X-axis is the second preset direction, and the Z-axis is the first preset direction.

[0059] like Figure 1 As shown, this application provides a testing device for testing samples, including a first mold assembly 1, a second mold assembly 2, a first mold fixing assembly 3, a second mold fixing assembly 4, a first temperature control assembly 5, a second temperature control assembly 6, and a testing assembly 7; the first mold assembly 1 is disposed at one end of the first mold fixing assembly 3; the second mold assembly 2 is disposed on the second mold fixing assembly 4 and faces the first mold assembly 1; a testing gap for filling the sample is provided between the first mold assembly 1 and the second mold assembly 2; the first temperature control assembly 5 is disposed at at least one of the first mold assembly 1 and the second mold assembly 2 and is capable of adjusting the testing temperature of the sample; the second temperature control assembly 6 is disposed on the second mold fixing assembly 4 and is capable of adjusting the temperature of the second mold fixing assembly 4; the testing assembly 7 is disposed at the end of the first mold fixing assembly 3 away from the first mold assembly 1 and is capable of measuring the stress of the first mold fixing assembly 3.

[0060] Specifically, the first temperature control component 5 may include a heater and a temperature sensor, and is disposed on at least one of the first mold component 1 and the second mold component 2 to control the sample temperature; the second temperature control component 6 may also include a heater and a temperature sensor, and is disposed on the second mold fixing component 4 to independently control the temperature of the second mold fixing component 4. By setting temperature control programs separately, the first mold fixing component 3 and the second mold fixing component 4 can operate at different temperatures, thereby controlling the change in the test gap.

[0061] With this configuration, the independent arrangement of the first mold fixing component 3 and the second mold fixing component 4 enables separate control of the positions of the first mold component 1 and the second mold component 2. The first temperature control component 5 is directly attached to at least one of the first mold component 1 and the second mold component 2, resulting in a short heat transfer path, low loss, and the ability to quickly establish a uniform and stable test temperature, reducing local temperature differences during sample curing and ensuring a consistent sample reaction state. The second temperature control component 6 independently controls the temperature and can flexibly adjust the temperature value of the second mold fixing component 4, compensating for its thermal expansion deformation through temperature differences, allowing the test gap to maintain a constant size or change precisely according to a preset pattern during the test. The test component 7 is installed away from the high-temperature test area to avoid the high temperature affecting the performance of the internal components of the test component 7, ensuring the accuracy and long-term stability of stress measurement. Specifically, the positions of the first mold assembly 1 and the second mold assembly 2 can be adjusted and controlled by the corresponding first mold fixing assembly 3 and the second mold fixing assembly 4, respectively, to achieve independent control of the test gap; the first temperature control assembly 5 acts directly on at least one of the first mold assembly 1 and the second mold assembly 2, and can control the test temperature of the sample, so that the sample is in a uniform and stable temperature field during the test curing process; the second temperature control assembly 6 is independently set on the second mold fixing assembly 4, so that the temperature of the second mold fixing assembly 4 can be different from the temperature of the first mold assembly 1, the second mold assembly 2 or the first mold fixing assembly 3. By controlling the temperature of the second mold fixing assembly 4 independently, its thermal deformation caused by thermal expansion can be compensated, so that the test gap remains constant or changes according to a preset law during temperature changes; the test assembly 7 is set at the end of the first mold fixing assembly 3 away from the first mold assembly 1, and indirectly obtains the axial stress generated by the sample during curing and cooling by measuring the stress of the first mold fixing assembly 3. Since the test assembly 7 is far away from the high temperature area where the sample is located, heat is avoided from being directly conducted to the test assembly 7, thereby ensuring the measurement accuracy and stability of the test assembly 7.

[0062] like Figure 1As shown, in one embodiment, the testing device further includes a connecting assembly 8. The first mold fixing assembly 3 includes a first connecting rod 31 extending along a first preset direction, and the second mold fixing assembly 4 includes a second connecting rod 41 extending along the first preset direction. The first ends of both the first connecting rod 31 and the second connecting rod 41 are disposed on the connecting assembly 8. The first mold assembly 1 is disposed at the second end of the first connecting rod 31, and the second mold assembly 2 is disposed at the second end of the second connecting rod 41. This arrangement ensures that the first connecting rod 31 and the second connecting rod 41 extend along the same first preset direction and are uniformly installed on the connecting assembly 8, maintaining both a compact layout of the first mold fixing assembly 3 and the second mold fixing assembly 4, and preserving their independent adjustment functions without affecting the independent control of the test gap. The first connecting rod 31 supports the first mold assembly 1 and transmits stress, while the second connecting rod 41 supports the second mold assembly 2, ensuring unified positioning of the connecting assembly 8. Simultaneously, the test assembly 7 is kept away from high-temperature areas via the first connecting rod 31, continuously ensuring measurement accuracy and stability.

[0063] Furthermore, to ensure ease of control during testing, the first link 31 and the second link 41 are preferably made of the same material, such as stainless steel or aluminum alloy with suitable strength and coefficient of thermal expansion.

[0064] like Figure 1 As shown, in one embodiment, the second mold assembly 2 includes a mold base plate 22 extending along a second preset direction, which is perpendicular to the first preset direction. The mold base plate 22 is connected to the second end of the second connecting rod 41, and the first mold assembly 1 is disposed on the side of the mold base plate 22 facing the second connecting rod 41. Specifically, the first preset direction is vertical, and the second preset direction is horizontal. With this arrangement, the mold base plate 22 and the second connecting rod 41 form a vertical support structure, making the mounting plane of the second mold assembly 2 flatter, ensuring uniform test gap between the first mold assembly 1 and the second mold assembly 2, and optimizing the independent control effect of the two boundaries of the test gap. The vertical support of the second connecting rod 41 makes the thermal deformation compensation of the second temperature control assembly 6 more accurate, and the test gap is more likely to remain constant or change according to a preset law during temperature changes. At the same time, the vertical layout also makes the stress transmission of the first connecting rod 31 smoother, improving the measurement accuracy of the test assembly 7.

[0065] In another implementation, depending on actual needs, the second preset direction can be designed to form an acute or obtuse angle with the first preset direction.

[0066] like Figure 1As shown, in one embodiment, there are two second connecting rods 41, which are respectively disposed on both sides of the first connecting rod 31 and connected to both ends of the mold base plate 22. This arrangement, with the two second connecting rods 41 respectively disposed on both sides of the first connecting rod 31 and connected to both ends of the mold base plate 22, ensures effective support at both ends of the mold base plate 22, resulting in uniform force distribution on the mold base plate 22 and ensuring the levelness of the upper surface of the mold base plate 22. This, in turn, maintains a consistent test gap between the first mold assembly 1 and the second mold assembly 2 across the entire plane.

[0067] In the illustrated embodiment, the two second links 41 are arranged symmetrically about the first link 31.

[0068] In another implementation, depending on actual needs, the number of second links 41 can be 1, 3, or other quantities; multiple second links 41 can be designed to be located on the same side of the first link 31 or other non-uniform arrangements.

[0069] like Figure 1 As shown, in one embodiment, the number of first temperature control components 5 is multiple sets. At least one set of first temperature control components 5 is disposed on the mold base plate 22 and can adjust the temperature of the mold base plate 22, and at least one set of first temperature control components 5 is disposed on the first mold assembly 1 and can adjust the temperature of the first mold assembly 1. With this arrangement, multiple sets of first temperature control components 5 act on the mold base plate 22 and the first mold assembly 1 in zones, comprehensively constructing uniform and stable temperature conditions, making the temperature of the sample more uniform during the curing process, and strengthening the control of the sample test temperature; the uniform temperature field makes the sample stress generation more stable, and the measurement data of the test component 7 more accurate.

[0070] In the illustrated embodiment, the first temperature control component 5 is disposed on the mold base plate 22 and symmetrically located on both sides of the first mold assembly 1 along the extension direction of the mold base plate 22; a set of first temperature control components 5 is disposed at the second end of the first connecting rod 31 and is attached to the first mold assembly 1.

[0071] In another embodiment, depending on actual needs, one, three or other sets of first temperature control components 5 can be designed to be installed on the mold base plate 22, and two, three or other sets of first temperature control components 5 can be designed to be installed on the first mold component 1.

[0072] In one embodiment, the testing device further includes a first driving component capable of driving a first connecting rod 31 to move along a first preset direction to adjust the size of the test gap; the testing device also includes a second driving component capable of driving a second connecting rod 41 to move along the first preset direction to adjust the size of the test gap. The first and second driving components are disposed in the support column 83. With this configuration, the first and second driving components independently drive the first connecting rod 31 and the second connecting rod 41, which can actively adjust the size of the test gap; the actively adjusted test gap can quickly adapt to the testing requirements of different samples, and in conjunction with the thermal deformation compensation of the second temperature control component 6, a combination of static adjustment and dynamic temperature control compensation of the test gap is achieved, so that the test gap can more accurately remain constant or change according to a preset pattern during temperature changes.

[0073] In another embodiment, depending on actual needs, the test apparatus may include only one of the first drive component and the second drive component.

[0074] In one embodiment, the second connecting rod 41 is detachably connected to at least one of the connecting assembly 8 and the second mold assembly 2; the first connecting rod 31 is detachably connected to at least one of the connecting assembly 8 and the first mold assembly 1. This detachable connection allows for quick disassembly and replacement of the first connecting rod 31 and the second connecting rod 41, adapting to different testing requirements. Combined with the temperature control settings of the first temperature control assembly 5 and the thermal deformation compensation of the second temperature control assembly 6, the adaptability of the testing device is improved.

[0075] In another implementation, one of the first link 31 and the second link 41 may be designed as a detachable structure, depending on actual needs.

[0076] like Figure 1 As shown, in one embodiment, the first mold fixing assembly 3 further includes a first water-cooling component 32, which is disposed at the first end of the first connecting rod 31. Both ends of the test assembly 7 are connected to the connecting assembly 8 and the first water-cooling component 32. With this configuration, the first water-cooling component 32 blocks the heat conduction path, improving the measurement accuracy and stability of the test assembly 7.

[0077] like Figure 1 As shown, in one embodiment, the second mold fixing assembly 4 further includes a second water-cooling component 42, the two ends of which are connected to the connecting assembly 8 and the second connecting rod 41. This configuration prevents heat from the second connecting rod 41 from being conducted to the connecting assembly 8, thus avoiding thermal deformation of the connecting assembly 8 from affecting the test gap control.

[0078] like Figure 2As shown, in one embodiment, the connecting assembly 8 includes a water-cooled connector 82 and a first fixing plate 81. Both the first fixing plate 81 and the water-cooled connector 82 extend along a second preset direction. The first end of the second connecting rod 41 is connected to the water-cooled connector 82, and both ends of the test assembly 7 are connected to the first end of the first connecting rod 31 and the first fixing plate 81. With this configuration, the first fixing plate 81 provides an installation base for the test assembly 7; the water-cooled connector 82 supports the second connecting rod 41 while blocking heat conduction, thus enhancing the control effect on thermal deformation compensation and test gap stability.

[0079] In the illustrated embodiment, the first fixing plate 81 and the water-cooling connector 82 are two parallel beams. The first fixing plate 81 is located on the side of the water-cooling connector 82 away from the first mold assembly 1. The first connecting rod 31 passes through the water-cooling connector 82 and is connected to the first fixing plate 81 through the test assembly 7.

[0080] In another embodiment, depending on actual needs, the first fixing plate 81 can be arranged at other positions such as the side of the water-cooled connector 82 close to the first mold assembly 1; one of the first fixing plate 81 and the water-cooled connector 82 can be designed to extend along the second preset direction, and the extension direction of the other is at an angle to the second preset direction; or the first fixing plate 81 and the water-cooled connector 82 can be designed not to extend along the second preset direction, and the extension directions of the two can be parallel or at an angle to each other.

[0081] like Figure 1 and Figure 2 As shown, in one embodiment, the testing device further includes two support columns 83, which are respectively disposed at both ends of the connecting component 8. This arrangement provides symmetrical rigid support for the connecting component 8 with the double support columns 83, preventing the testing device from swaying and affecting the test gap control, thus improving the overall stability of the testing device.

[0082] like Figure 1 As shown, in one embodiment, the testing device further includes an anti-interference airflow baffle 9, which forms an anti-interference space 91. The first mold fixing component 3, the second mold fixing component 4, the first mold component 1, the second mold component 2, the first temperature control component 5, the second temperature control component 6, and the testing component 7 are all located within the anti-interference space 91. This configuration isolates the anti-interference space 91 from external airflow disturbances, preventing airflow from affecting the temperature field and testing gap, resulting in more accurate stress measurement. Simultaneously, the enclosed space ensures more stable test temperature conditions set by the first temperature control component 5 and protects the thermal deformation compensation of the second temperature control component 6 from external interference.

[0083] Furthermore, to facilitate observation of changes in the appearance of the sample during the testing process, the anti-interference airflow baffle 9 is preferably made of a transparent material, such as plexiglass or polycarbonate.

[0084] like Figure 1 As shown, in one embodiment, the first mold assembly 1 includes a first mold 11 and a first mold carrier 12. The first mold carrier 12 is disposed on the first mold fixing assembly 3, and the first mold 11 is detachably disposed on the side of the first mold carrier 12 opposite to the first mold fixing assembly 3. The second mold assembly 2 includes a second mold 21 and a second mold carrier. The second mold carrier is disposed on the second mold fixing assembly 4, and the second mold 21 is detachably disposed on the side of the second mold carrier opposite to the second mold fixing assembly 4. This configuration provides an installation reference for the first mold 11 via the first mold carrier 12, and the detachable placement of the first mold 11 on the side of the first mold carrier 12 opposite to the first mold fixing assembly 3 facilitates the replacement of the first mold 11. Similarly, the second mold carrier provides an installation reference for the second mold 21, and the second mold 21 is detachably disposed on the side of the second mold carrier opposite to the second mold fixing assembly 4, facilitating the replacement of the second mold 21. When testing samples of different shapes or sizes, only the corresponding first mold 11 and second mold 21 need to be replaced, improving the versatility of the device. Disassembly, cleaning, or replacement ensures the accuracy of the test. The first mold carrier 12 and the second mold carrier can adopt a standard interface design, so that the first mold 11 and the second mold 21 of different specifications can be used interchangeably.

[0085] In the illustrated embodiment, the second mold carrier is the mold base plate 22.

[0086] Furthermore, the surface of the first mold 11 facing the second mold 21 is parallel to the surface of the second mold 21 facing the first mold 11, so as to control the size of the measuring gap between the first mold 11 and the second mold 21.

[0087] This application also provides a testing method using the aforementioned testing apparatus. The testing method includes testing steps, which include the following steps:

[0088] S100. Adjust the value of the test gap between the first mold assembly 1 and the second mold assembly 2 to the preset test gap value;

[0089] S200. The liquid sample is filled into the test gap between the first mold assembly 1 and the second mold assembly 2;

[0090] S300. Adjust the first temperature control component 5 to the first preset temperature, and adjust the second temperature control component 6 to the second preset temperature;

[0091] S400. Wait for the liquid sample to solidify;

[0092] S500. Obtain the measurement results of test component 7.

[0093] Specifically, firstly, the test gap between the first mold assembly 1 and the second mold assembly 2 is adjusted to the preset test gap value, that is, by driving the components or manually adjusting, the distance between the first mold assembly 1 and the second mold assembly 2 reaches the required test gap value; then, liquid sample is filled into the test gap between the first mold assembly 1 and the second mold assembly 2. The sample can be a liquid material such as adhesive or resin, which flows naturally within the gap and fills the entire gap; next, the first temperature control component 5 is adjusted to the first preset temperature, which is determined according to the sample's curing process, so that the sample undergoes a curing reaction at the first preset temperature; simultaneously, the second temperature control component 6 is adjusted to the second preset temperature, which is determined according to the need to maintain a constant test gap. The temperature of the second mold fixing component 4 is adjusted by the second temperature control component 6 to compensate for thermal deformation, so that the test gap remains unchanged during the curing process and subsequent cooling process; wait for the liquid sample to fully cure and cool at the first preset temperature, the curing time being determined according to the sample material characteristics; finally, the measurement results are obtained by the test component 7, which records the stress change of the first mold fixing component 3 in real time, obtaining the axial stress data of the sample during the curing and cooling process.

[0094] With this setup, by controlling the temperatures of the first temperature control component 5 and the second temperature control component 6 respectively, the test gap remains unchanged during the curing and cooling process of the sample. At the same time, stress data is acquired in real time through the test component 7, enabling accurate measurement of axial stress during the curing and cooling process of the sample. The test process is controllable, and the test results are accurate and reliable.

[0095] In one implementation, a calibration step is included before the testing step:

[0096] S600. Place a quartz crystal of the same size as the preset test gap into the test gap.

[0097] S700. Adjust the value of the test gap between the first mold assembly 1 and the second mold assembly 2 to the preset test gap value;

[0098] S800. When the measurement result of test component 7 is the preset value, stop adjusting the test gap. The value of the test gap at this time can be regarded as the value of the preset test gap.

[0099] S900. Adjust the first temperature control component 5 to the first preset temperature;

[0100] S1000. Adjust the temperature of the second temperature control component 6 and obtain the measurement results of the test component 7;

[0101] S1100. When the measurement result of the test component 7 is a preset value, record the temperature of the second temperature control component 6 as the second preset temperature.

[0102] Specifically, the quartz is placed in the test gap, and the test gap between the first mold assembly 1 and the second mold assembly 2 is adjusted to near the preset test gap value, so that the quartz is slightly clamped; the first temperature control assembly 5 is adjusted to the first preset temperature, which is the temperature required for sample curing; then the temperature of the second temperature control assembly 6 is adjusted, and the measurement result of the test assembly 7 is observed. When the measurement result of the test assembly 7 is the preset value, such as 0.5N, it indicates that the clamping force of the first mold assembly 1 on the quartz is the preset value; since the thickness of the quartz remains unchanged, it can be considered that the test gap is equal to the preset test gap at this time; the temperature of the second temperature control assembly 6 at this time is recorded as the second preset temperature, which is the temperature of the second mold fixing assembly 4 required to keep the test gap constant at the first preset temperature; by repeating the above calibration process at different temperature points, a series of second preset temperatures corresponding to temperature points can be obtained, forming the temperature control program of the second temperature control assembly 6.

[0103] With this setup, the low expansion characteristics of quartz can simulate a constant test gap state, and the second preset temperature of the second temperature control component 6 can be accurately obtained through calibration steps, resulting in more precise thermal deformation compensation.

[0104] In another embodiment, during the calibration step, materials such as copper sheets can be used instead of quartz to be placed in the test gap, so as to meet the test requirements of the test gap size changing in a certain way during the cooling process.

[0105] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0106] The embodiments described above are merely examples of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A testing apparatus for testing samples, characterized in that, include: First mold fixing component (3) and second mold fixing component (4); The first mold assembly (1) is disposed at one end of the first mold fixing assembly (3); The second mold assembly (2) is disposed on the second mold fixing assembly (4) and faces the first mold assembly (1); a test gap for filling the sample is provided between the first mold assembly (1) and the second mold assembly (2); A first temperature control component (5) is disposed in at least one of the first mold component (1) and the second mold component (2) and is capable of adjusting the test temperature of the sample; The second temperature control component (6) is disposed on the second mold fixing component (4) and is capable of adjusting the temperature of the second mold fixing component (4); and, The test component (7) is located at the end of the first mold fixing component (3) away from the first mold component (1) and is capable of measuring the stress of the first mold fixing component (3); The calibration steps for the testing device are as follows: Place a quartz or copper sheet of the same size as the preset test gap inside the test gap; Adjust the test gap between the first mold assembly (1) and the second mold assembly (2); When the measurement result of the test component (7) is a preset value, the adjustment of the test gap is stopped, and the value of the test gap at this time can be regarded as the value of the preset test gap; Adjust the first temperature control component (5) to the first preset temperature; Adjust the temperature of the second temperature control component (6) to obtain the measurement results of the test component (7); When the measurement result of the test component (7) is a preset value, the temperature of the second temperature control component (6) is recorded as the second preset temperature.

2. The testing apparatus according to claim 1, characterized in that, The testing device also includes a connection component (8); The first mold fixing assembly (3) includes a first connecting rod (31) extending along a first preset direction, and the second mold fixing assembly (4) includes a second connecting rod (41) extending along the first preset direction. The first end of the first connecting rod (31) and the first end of the second connecting rod (41) are both disposed on the connecting assembly (8). The first mold assembly (1) is disposed at the second end of the first connecting rod (31), and the second mold assembly (2) is disposed at the second end of the second connecting rod (41).

3. The testing apparatus according to claim 2, characterized in that, The second mold assembly (2) includes a mold base plate (22) extending along a second preset direction, the second preset direction being perpendicular to the first preset direction. The mold base plate (22) is connected to the second end of the second connecting rod (41). The first mold assembly (1) is disposed on the side of the mold base plate (22) facing the second connecting rod (41).

4. The testing apparatus according to claim 3, characterized in that, There are two second connecting rods (41), which are respectively located on both sides of the first connecting rod (31) and connected to both ends of the mold base plate (22).

5. The testing apparatus according to claim 3, characterized in that, The number of the first temperature control components (5) is multiple sets. At least one set of the first temperature control components (5) is disposed on the mold base plate (22) and can adjust the temperature of the mold base plate (22). At least one set of the first temperature control components (5) is disposed on the first mold assembly (1) and can adjust the temperature of the first mold assembly (1).

6. The testing apparatus according to claim 2, characterized in that, The testing device further includes a first driving component, which is capable of driving the first connecting rod (31) to move along the first preset direction to adjust the size of the test gap; and / or, The testing device further includes a second driving component, which is capable of driving the second connecting rod (41) to move along the first preset direction to adjust the size of the test gap; and / or, The second connecting rod (41) is detachably connected to the connecting assembly (8) and / or the second mold assembly (2); and / or, The first connecting rod (31) is detachably connected to the connecting assembly (8) and / or the first mold assembly (1).

7. The testing apparatus according to claim 2, characterized in that, The first mold fixing assembly (3) further includes a first water-cooling component (32), which is disposed at the first end of the first connecting rod (31). The two ends of the test assembly (7) are connected to the connecting assembly (8) and the first water-cooling component (32).

8. The testing apparatus according to claim 2, characterized in that, The second mold fixing assembly (4) further includes a second water-cooling component (42), the two ends of which are connected to the connecting assembly (8) and the second connecting rod (41); or, The connecting component (8) includes a water-cooled connector (82) and a first fixing plate (81). The first fixing plate (81) and the water-cooled connector (82) both extend along a second preset direction. The first end of the second connecting rod (41) is connected to the water-cooled connector (82). The two ends of the test component (7) are connected to the first end of the first connecting rod (31) and the first fixing plate (81).

9. The testing apparatus according to claim 1, characterized in that, The testing device also includes an anti-interference airflow baffle (9), which forms an anti-interference space (91). The first mold fixing component (3), the second mold fixing component (4), the first mold component (1), the second mold component (2), the first temperature control component (5), the second temperature control component (6), and the testing component (7) are all located within the anti-interference space (91).

10. The testing apparatus according to claim 1, characterized in that, The first mold assembly (1) includes a first mold (11) and a first mold carrier (12), the first mold carrier (12) being disposed on the first mold fixing assembly (3), and the first mold (11) being detachably disposed on the side of the first mold carrier (12) opposite to the first mold fixing assembly (3); and / or, The second mold assembly (2) includes a second mold (21) and a second mold carrier, the second mold carrier being disposed on the second mold fixing assembly (4), and the second mold (21) being detachably disposed on the side of the second mold carrier opposite to the second mold fixing assembly (4).

11. A testing method, applied to the testing apparatus as described in any one of claims 1-10, characterized in that, Including test steps: Adjust the value of the test gap between the first mold assembly (1) and the second mold assembly (2) to the value of the preset test gap; The liquid sample is filled into the test gap between the first mold assembly (1) and the second mold assembly (2); Adjust the first temperature control component (5) to the first preset temperature, and adjust the second temperature control component (6) to the second preset temperature; Wait for the liquid sample to solidify; Obtain the measurement results of the test component (7).

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