A method and apparatus for optical fiber to chip coupling

Abstract

The application relates to a method and device for optical fiber and chip coupling. A method for optical fiber and chip coupling comprises the following steps: a workbench sends a chip to below a lens, the lens identifies all bonding points on a top surface of the chip, a path is planned based on the positions of the bonding points and a preset working position; a clamping mechanism clamps an optical fiber at the preset working position, a coupling end of the optical fiber extends downward from the clamping mechanism; a firing device fires an end of the coupling end of the optical fiber to vaporize and remove an insulating layer of the coupling end of the optical fiber; the workbench moves the chip to the preset working position according to the path, so that the bonding points on the top surface of the chip are located directly below the optical fiber; the clamping mechanism drives the optical fiber to move downward, a laser head emits a laser beam to a contact position between the coupling end of the optical fiber and the bonding points, and the optical fiber and the bonding points are fused and combined; when the coupling is completed, the clamping mechanism releases the optical fiber, and the workbench carries the optical fiber coupled with the chip to leave the clamping mechanism.

Description

Technical Field

[0001] This application belongs to the field of semiconductor packaging technology, and in particular relates to a method and apparatus for coupling optical fiber to a chip. Background Technology

[0002] The traditional method for coupling optical fibers to chips involves laser-etching V-grooves on the chip, placing the optical fiber (with the insulation layer removed) inside the V-groove, and then using glue and a cover plate to fix and couple the optical fiber.

[0003] However, when optical fibers are coupled with adhesive, problems such as adhesive venting and aging can easily occur. The adhesive is also prone to failure in extremely low temperature environments, resulting in low reliability of the coupling between the optical fiber and the chip. Summary of the Invention

[0004] The technical problem to be solved by this application is: to provide a method and apparatus for coupling optical fibers to chips, addressing the issue of low reliability in existing methods for coupling optical fibers to chips.

[0005] To address the aforementioned technical problems, this application provides a method for coupling optical fiber to a chip, comprising: The worktable delivers the chip to the area below the lens, which identifies the bonding sites on the top surface of the chip and plans a path based on the location of the bonding sites and a preset working position. The clamping mechanism clamps the optical fiber in the preset working position, and the coupling end of the optical fiber extends downward out of the clamping mechanism; The ignition device is aimed at the end of the coupling end of the optical fiber and ignited to vaporize and remove the insulating layer of the coupling end of the optical fiber. The workbench moves the chip to the preset working position according to the path, so that the bonding site of the chip is located directly below the optical fiber; The clamping mechanism drives the optical fiber to move downward, and the laser head emits a laser beam toward the contact position between the coupling end of the optical fiber and the bonding site, so that the optical fiber and the bonding site are fused together. Once coupling is complete, the clamping mechanism releases the optical fiber, and the worktable, carrying the optical fiber coupled to the chip, leaves the clamping mechanism.

[0006] Optionally, after the clamping mechanism clamps the optical fiber in the preset working position, and the coupling end of the optical fiber extends downward beyond the clamping mechanism, the method further includes: Optionally, the position of the ignition device relative to the workbench is fixed; The ignition device is aimed at the end of the coupling end of the optical fiber and ignites it to vaporize and remove the insulating layer at the coupling end of the optical fiber, specifically including: The clamping mechanism drives the optical fiber to move longitudinally until the end of the coupling end of the optical fiber reaches the ignition position of the ignition device. The ignition device ignites and vaporizes to remove the insulating layer at the coupling end of the optical fiber.

[0007] Optionally, the two ignition rods of the ignition device are arranged opposite each other on the radial sides of the optical fiber. When the ignition device ignites, the electric arc formed between the two ignition rods surrounds the outer periphery of the coupling end of the optical fiber, so that the insulating layer on the outer surface of the coupling end of the optical fiber is heated and vaporized.

[0008] Optionally, the clamping mechanism drives the optical fiber to move longitudinally until the end of the coupling end of the optical fiber reaches the ignition position of the ignition device, specifically including: The clamping mechanism drives the optical fiber to move longitudinally, and the ranging device measures the longitudinal height of the target point of the clamping mechanism relative to the worktable in real time. When the clamping mechanism moves to the target longitudinal height, the end of the coupling end of the optical fiber reaches the ignition position of the ignition device, and the clamping mechanism stops moving.

[0009] Optionally, the ranging device is a ranging sensor installed at the target point of the clamping mechanism.

[0010] Optionally, the clamping mechanism's wire clamp is located in the preset working position; The clamping mechanism clamps the optical fiber at the preset working position, and the coupling end of the optical fiber extends downward out of the clamping mechanism, specifically including: The wire feeding mechanism has a wire clamp that picks up and holds a longitudinally extending optical fiber; wherein the wire feeding mechanism is located on the horizontal side of the clamping mechanism; When the clamping mechanism opens, the wire feeding mechanism transfers the optical fiber to the clamping mechanism before it is moved to the clamp. After the wire feeding mechanism pushes the optical fiber into the clamp, the clamp clamps the optical fiber.

[0011] Optionally, the worktable delivers the chip below the lens, identifies the bonding sites on the top surface of the chip, and plans a path based on the location of the bonding sites and a preset working position, specifically including: The worktable delivers the chip to the area below the lens. A first coordinate system is established based on the worktable. The lens obtains the orientation of the chip in the first coordinate system by identifying multiple positioning feature points on the chip. Scan a standard chip template, establish a second coordinate system based on the standard chip template, and obtain the coordinates of the standard bonding sites on the standard chip template in the second coordinate system; Based on the orientation of the chip in the first coordinate system and the coordinates of the standard bonding sites on the standard chip template in the second coordinate system, the coordinates of the bonding sites of the chip in the first coordinate system are determined. Based on the coordinates of the bonding site in the first coordinate system and the preset working position, a path is planned.

[0012] Optionally, the clamping mechanism drives the optical fiber downward, and the laser head emits a laser beam towards the contact position between the coupling end of the optical fiber and the bonding site, causing the optical fiber and the bonding site to fuse together, specifically including: The clamping mechanism drives the optical fiber downward until the end face of the coupling end of the optical fiber contacts the bonding site on the top surface of the chip and stops. The laser head emits a laser beam toward the contact position between the coupling end of the optical fiber and the bonding site. The chip and the optical fiber melt simultaneously. While the optical fiber is melting, the clamping mechanism moves downward, pushing the optical fiber and the chip to fuse together.

[0013] On the other hand, this application provides an apparatus for coupling optical fiber to a chip, for implementing the above-mentioned method for coupling optical fiber to a chip, including a lens, a clamping mechanism, a worktable, a laser head, and a longitudinal motion mechanism, wherein the lens, clamping mechanism, and laser head are located above the worktable, and the longitudinal motion mechanism is used to drive the clamping mechanism to move longitudinally. The lens is used to identify the bonding sites on the top surface of the chip on the worktable. The clamping mechanism is used to clamp the optical fiber located at a preset working position. The worktable can drive the chip to move to the preset working position. The laser head is used to emit a laser to the contact position between the coupling end of the optical fiber and the bonding site of the chip, so that the optical fiber and the bonding site are fused together.

[0014] This application discloses a method for coupling optical fibers to chips. First, a lens identifies the bonding sites of the chip on a worktable. Based on the location of the bonding sites and a preset working position, the worktable's movement path is planned. The worktable then automatically moves along this path to the preset working position where the optical fiber is located, ensuring the chip's bonding sites are directly below the coupling end of the optical fiber. This allows the coupling end of the optical fiber to contact the bonding sites under the longitudinal movement of a clamping mechanism, and coupling is automatically completed through laser melting. This eliminates the need for adhesives and cover plates to fix the optical fiber, avoiding problems such as adhesive venting, aging, and failure at extremely low temperatures, effectively improving the reliability of the fiber-to-chip coupling. Laser melting coupling requires less time, and the entire coupling process is automated, significantly improving the coupling efficiency of optical fibers and chips, thereby increasing the production efficiency of optoelectronic devices. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of step S1 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 2 This is a schematic diagram of step S21 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 3 This is a schematic diagram of step S22 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 4 This is a schematic diagram of step S61 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 5 This is a schematic diagram of step S62 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 6 This is a schematic diagram of step S3 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 7 This is a schematic diagram of step S41 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 8 This is a schematic diagram of step S42 of a method for coupling an optical fiber to a chip provided in an embodiment of this application; Figure 9 This is a schematic diagram of step S5 of a method for coupling an optical fiber to a chip provided in an embodiment of this application.

[0016] The reference numerals in the accompanying drawings are as follows: 1. Workbench; 2. Lens; 3. Clamping mechanism; 31. Wire clamp; 4. Laser head; 5. Chip; 51. Bonding site; 6. Optical fiber; 61. Coupler end; 62. Insulating layer; 7. Ignition device; 71. Ignition rod; 8. Range measuring device; 9. Wire feeding mechanism; 10. Longitudinal motion mechanism. Detailed Implementation

[0017] To make the technical problems, technical solutions, and beneficial effects solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0018] An embodiment of this application provides a method for coupling an optical fiber to a chip, comprising the following steps: S1: As Figure 1 As shown, the workbench 1 delivers the chip 5 to the area below the lens 2, identifies the bonding site 51 on the top surface of the chip 5, and plans a path based on the position of the bonding site 51 and the preset working position.

[0019] S2: As Figure 3 As shown, the clamping mechanism 3 clamps the optical fiber 6 in the preset working position, and the coupling end 61 of the optical fiber 6 extends downward out of the clamping mechanism 3.

[0020] S3: As Figure 6 As shown, the workbench 1 moves the chip 5 to a preset working position according to the path, so that the bonding site 51 on the top surface of the chip 5 is located directly below the optical fiber 6.

[0021] S4: As Figures 6 to 8 As shown, the clamping mechanism 3 drives the optical fiber 6 to move downward, and the laser head 4 emits a laser beam at the contact position between the coupling end 61 of the optical fiber 6 and the bonding site 51, so that the optical fiber 6 and the bonding site 51 are fused together.

[0022] S5: As Figure 9 As shown, the coupling ends, the clamping mechanism 3 releases the optical fiber 6, and the worktable 1, carrying the optical fiber 6 coupled with the chip 5, leaves the clamping mechanism 3.

[0023] Specifically, as can be seen from steps S1 to S5, when the optical fiber 6 is coupled to the chip 5, the worktable 1 first moves the chip 5 to below the lens 2. The lens 2 identifies the bonding site 51 on the top surface of the chip 5 to obtain the initial position of the bonding site 51. Based on the initial position of the bonding site 51 and the preset working position, the worktable 1 plans the movement path of the worktable 1. The worktable 1 moves to the preset working position where the optical fiber 6 is located according to the path, so that the bonding site 51 of the chip 5 is directly below the coupling end 61 of the optical fiber 6. Then, the clamping mechanism 3 drives the optical fiber 6 to move downward. After the coupling end 61 of the optical fiber 6 contacts the bonding site 51 on the top surface of the chip 5, the laser head 4 emits a laser beam to the contact position between the coupling end 61 of the optical fiber 6 and the bonding site 51, so that the coupling end 61 of the optical fiber 6 and the bonding site 51 of the chip 5 melt simultaneously, realizing the coupling of the optical fiber 6 and the chip 5. After the coupling is completed, the clamping mechanism 3 releases the optical fiber 6, and the worktable 1 moves away with the optical fiber 6 and the chip 5 to complete the bonding of a single optical fiber 6.

[0024] The method for coupling optical fibers and chips in this application first uses a lens 2 to identify the bonding sites 51 of the chip 5 on the worktable 1. Based on the position of the bonding sites 51 and a preset working position, the worktable 1 is planned to move along a predetermined path to the preset working position where the optical fiber 6 is located. This ensures that the bonding sites 51 of the chip 5 are directly below the coupling end 61 of the optical fiber 6. The coupling end 61 of the optical fiber 6 then contacts the bonding sites 51 under the longitudinal movement of the clamping mechanism 3, and the coupling is automatically completed by laser melting. This eliminates the need for glue and cover plates to fix the optical fiber 6, avoiding problems such as glue venting, aging, and failure at extremely low temperatures, effectively improving the reliability of the coupling between the optical fiber 6 and the chip 5. The laser melting coupling process is quick and automated, significantly improving the coupling efficiency between the optical fiber 6 and the chip 5, thereby increasing the production efficiency of optoelectronic devices.

[0025] Moreover, the fiber 6 extending downward from the coupling end 61 is a bonding site 51 placed vertically on the top surface of the fiber 6, which can effectively save the area occupied by the chip 5.

[0026] In one embodiment, after step S2, the method further includes: S6: As Figure 4 and Figure 5 As shown, the ignition device 7 is aimed at the end of the coupling end 61 of the optical fiber 6 and ignites it to vaporize and remove the insulating layer 62 of the coupling end 61 of the optical fiber 6.

[0027] It is understandable that after the clamping mechanism 3 clamps the optical fiber 6, the insulating layer 62 on the outside of the coupling end 61 of the optical fiber 6 is removed by the ignition device 7 through ignition vaporization. This eliminates the need for manual pre-treatment of the coupling end 61 of the optical fiber 6, further improving the automation level of the coupling process between the optical fiber 6 and the chip 5.

[0028] Specifically, the ignition device 7 is an electric arc ignition device that generates ultra-high temperature through high-voltage discharge, electric arc plasma, and pulse sparks, instantly vaporizing the insulation layer 62 on the outside of the optical fiber 6, removing it non-contactly without mechanical damage.

[0029] In one embodiment, the position of the ignition device 7 relative to the workbench 1 is fixed.

[0030] Step S6 specifically includes: S61: As Figure 3 and Figure 4 As shown, the clamping mechanism 3 drives the optical fiber 6 to move longitudinally until the end of the coupling end 61 of the optical fiber 6 reaches the ignition position of the ignition device 7.

[0031] S62: As Figure 5 As shown, the ignition device 7 ignites and vaporizes to remove the insulating layer 62 of the coupling end 61 of the optical fiber 6.

[0032] It is understandable that the position of the ignition device 7 is fixed. Only the clamping mechanism 3 with longitudinal movement capability needs to move the optical fiber 6 to make the end of the coupling end 61 of the optical fiber 6 reach the ignition position. There is no need to move the ignition device 7 to align with the optical fiber 6, which reduces the control difficulty and improves the accuracy of removing the insulation layer 62 of the optical fiber 6.

[0033] In one embodiment, in step S62, as follows Figure 5 As shown, the two ignition rods 71 ​​of the ignition device 7 are arranged opposite each other on the radial sides of the optical fiber 6.

[0034] When the ignition device 7 ignites, the electric arc formed between the two ignition rods 71 ​​surrounds the outer periphery of the coupling end 61 of the optical fiber 6, causing the insulation layer 62 of the coupling end 61 of the optical fiber 6 to vaporize due to heat.

[0035] Understandably, the electric arc between the two ignition rods 71 ​​can form a ring-shaped high-temperature zone around the outer periphery of the optical fiber 6, so that the insulation layer 62 around the coupling end 61 of the optical fiber 6 is heated evenly, and there will be no problem of one side being completely removed while the other side has residue. After removal, the surface of the optical fiber 6 is smooth and without residue, thus improving the quality of insulation layer 62 removal.

[0036] Moreover, the two ignition rods 71 ​​discharge in opposite directions, concentrating the energy in the area between the two ignition rods 71. The arc energy is concentrated and the discharge time is in the millisecond range. The heat only acts on the insulation layer 62 of the optical fiber 6 and is not easily conducted to the internal quartz fiber core, effectively avoiding high-temperature damage to the fiber core and a decrease in strength.

[0037] In other embodiments, the ignition device 7 may be a ring-shaped ignition rod 71. After the coupling end 61 of the optical fiber 6 is inserted into the ring-shaped ignition rod 71, the ignition device 7 ignites.

[0038] In one embodiment, step S61 specifically includes: S611: As Figure 3 As shown, the clamping mechanism 3 drives the optical fiber 6 to move longitudinally, and the ranging device 8 measures the longitudinal height of the target point of the clamping mechanism 3 relative to the worktable 1 in real time.

[0039] S612: As Figure 4 As shown, when the clamping mechanism 3 moves to the target longitudinal height, the end of the coupling end 61 of the optical fiber 6 reaches the ignition position of the ignition device 7, and the clamping mechanism 3 stops moving.

[0040] Understandably, directly acquiring the longitudinal position data of the target point of the clamping mechanism 3 through the ranging device 8 and comparing it with the target longitudinal height data is more intuitive and reliable. It can accurately control the feed of the clamping mechanism 3, avoid excessive feed of the clamping mechanism 3 causing ignition position deviation, and also avoid insufficient feed causing the insulation layer 62 that needs to be removed to remain, thus ensuring the accuracy and consistency of the insulation layer 62 removal.

[0041] In other embodiments, a visual alignment system can be used, which uses a camera to photograph the bottom surface of the ignition rod 71 of the ignition device 7 (or the positioning block set at the same height as the ignition position) and the end face of the coupling end 61 of the optical fiber 6 to identify the edges. When the bottom surface of the ignition rod 71 of the ignition device 7 (or the bottom surface of the positioning block) and the edge of the coupling end 61 of the optical fiber 6 are aligned, the clamping mechanism 3 stops moving.

[0042] In one embodiment, the ranging device 8 is a ranging sensor installed at the target point of the clamping mechanism 3.

[0043] Specifically, the probe of the ranging sensor is vertically downward. The ranging sensor emits a laser downward and receives the laser reflected from the worktable 1. Based on the round-trip time or phase difference of the laser, the vertical height from the ranging sensor to the worktable 1 is calculated, which is the longitudinal height of the target point of the clamping mechanism 3 relative to the worktable 1. The structure is simple and the measurement is accurate.

[0044] In one embodiment, the clamp 31 of the clamping mechanism 3 is located in a preset working position.

[0045] Step S2 specifically includes: S21: As Figure 2 As shown, the cable feeding mechanism 9 uses a clamp to pick up the longitudinally extending optical fiber 6; wherein, the cable feeding mechanism 9 is located on the horizontal side of the clamping mechanism 3.

[0046] S22: As Figure 3 As shown, the clamp 31 of the clamping mechanism 3 is opened, and the wire feeding mechanism 9 transfers the optical fiber 6 to the clamp 31 of the clamping mechanism 3. After the wire feeding mechanism 9 pushes the optical fiber 6 into the clamp 31, the clamp 31 clamps the optical fiber 6.

[0047] Understandably, the wire feeding mechanism 9 can automatically acquire the optical fiber 6 and automatically transfer the optical fiber 6 into the clamp 31 of the clamping mechanism 3, realizing automatic feeding of the optical fiber 6 without manual clamping of the optical fiber 6, further improving the automation level of the entire coupling process, reducing the intensity of manual labor, and improving processing efficiency.

[0048] Specifically, the cable assembly fixture can be a vacuum V-groove fixture with suction holes inside. After the coupling end 61 of the optical fiber 6 is inserted into the fixture, the optical fiber 6 is vacuum-adsorbed. When the cable assembly fixture needs to release the optical fiber 6 to feed it into the clamping mechanism 3, the vacuum adsorption stops. The cable assembly fixture can also be a pneumatic finger clamp, with a cylinder driving the clamping head of the pneumatic finger clamp to open and close, thereby clamping or releasing the optical fiber 6. Moreover, the cable assembly fixture can rotate around a vertical axis to rotate the optical fiber 6 located on the side opposite to the clamping mechanism 3 to the side closer to the clamping mechanism 3.

[0049] The wire feeding mechanism 9 may include multiple transmission components, each transmission component including at least two rollers, the two rollers being arranged opposite each other at a distance, the optical fiber 6 passing between the two rollers of the transmission component and contacting the rollers, and when the rollers rotate, driving the optical fiber 6 to move linearly to be fed into the wire mounting fixture.

[0050] The clamp 31 of the clamping mechanism 3 can be a two-jaw pneumatic clamp.

[0051] In one embodiment, step S1 specifically includes: S11: As Figure 1 As shown, the worktable 1 delivers the chip 5 to the area below the lens 2. A first coordinate system is established based on the worktable 1. The lens 2 obtains the orientation of the chip 5 in the first coordinate system by identifying multiple positioning feature points on the chip 5. These positioning feature points can be geometric feature points, such as circular or cross-shaped marker lines.

[0052] S12: Establish a second coordinate system based on the standard chip template, and obtain the coordinates of the standard bonding sites on the standard chip template in the second coordinate system.

[0053] S13: Based on the orientation of chip 5 in the first coordinate system and the coordinates of the standard bonding site on the standard chip template in the second coordinate system, the coordinates of the bonding site 51 in the first coordinate system are calculated and determined.

[0054] S14: Based on the coordinates of the bonding site 51 in the first coordinate system and the preset working position, plan the path.

[0055] It should be noted that the standard chip template is the design drawing of the chip 5 coupled with the optical fiber 6. Before processing, the shape of the standard chip template and the coordinates of the standard bonding sites in the second coordinate system of the standard chip template will be input to the processing device for teaching and editing, which is used to clarify the theoretical position of the bonding sites 51 on each chip 5 to be processed.

[0056] In step S11, the coordinates and orientation of chip 5 in the first coordinate system are obtained by identifying multiple positioning feature points on chip 5 through lens 2. Therefore, the coordinates of bonding site 51 of chip 5 in the first coordinate system can be calculated based on the coordinates of the standard bonding site on the standard chip template and the coordinates of chip 5 on the worktable 1. Then, based on the coordinates of bonding site 51 and the preset working position, the path of the worktable 1 to move chip 5 to the preset working position is planned, ensuring that bonding site 51 can be accurately moved to the direct under the coupling end 61 of optical fiber 6 without manual alignment, effectively improving alignment accuracy and processing efficiency.

[0057] The "coordinates of bonding site 51" refers to the coordinates of the center point of bonding site 51.

[0058] In other embodiments, positioning feature points can be directly set on the bonding site 51 of the chip 5, and the lens 2 can directly obtain the coordinates of the bonding site 51 of the chip 5 through the positioning feature points.

[0059] In one embodiment, step S4 specifically includes: S41: As Figure 6 As shown, the clamping mechanism 3 drives the optical fiber 6 to move downwards until the end face of the coupling end 61 of the optical fiber 6 contacts the bonding site 51 on the top surface of the chip 5 and stops.

[0060] S42: As Figure 7 As shown, the laser head 4 emits a laser beam at the contact position between the coupling end 61 of the optical fiber 6 and the bonding site 51. The chip 5 and the optical fiber 6 melt simultaneously. While the optical fiber 6 is melting, the clamping mechanism 3 moves downward, pushing the optical fiber 6 and the chip 5 to fuse together.

[0061] Understandably, compared to bending the coupling end 61 of the optical fiber 6 by increasing the downward displacement of the clamping mechanism 3 before melting, thus reserving the melting length and causing deformation of the optical fiber 6, in this application, when the optical fiber 6 and the chip 5 just begin to melt, the end face of the coupling end 61 of the optical fiber 6 just contacts the bonding site 51 on the top surface of the chip 5, and the optical fiber 6 remains in its original shape. During the melting process, the longitudinal feed of the clamping mechanism 3 gradually pushes the optical fiber 6 downward, ensuring the bonding depth between the optical fiber 6 and the bonding site 51, effectively improving the firmness of the bonding between the two, and ensuring the stability of the coupled transmission.

[0062] In addition, one embodiment of this application also provides an apparatus for coupling optical fiber to a chip, used to implement the method for coupling optical fiber to a chip in any of the above embodiments, such as... Figure 2 and Figure 6 As shown, the device includes a lens 2, a clamping mechanism 3, a worktable 1, a laser head 4, and a longitudinal motion mechanism 10. The lens 2, clamping mechanism 3, and laser head 4 are located above the worktable 1, and the longitudinal motion mechanism 10 is used to drive the clamping mechanism 3 to move longitudinally.

[0063] Lens 2 is used to identify the bonding site 51 on the top surface of chip 5 on worktable 1. Clamping mechanism 3 is used to clamp the optical fiber 6 located in the preset working position. Worktable 1 can drive chip 5 to move to the preset working position. Laser head 4 is used to emit laser to the contact position between the coupling end 61 of optical fiber 6 and the bonding site 51 of chip 5, so that optical fiber 6 and bonding site 51 are fused together.

[0064] The device for coupling optical fibers and chips disclosed in this application uses a lens 2 to identify the bonding sites 51 of the chip 5 on the worktable 1. Based on the position of the bonding sites 51 and a preset working position, the worktable 1 plans its movement path. The worktable 1 then automatically moves along this path to the preset working position where the optical fiber 6 is located, ensuring that the bonding sites 51 of the chip 5 are directly below the coupling end 61 of the optical fiber 6. This allows the coupling end 61 of the optical fiber 6 to contact the bonding sites 51 under the longitudinal movement of the clamping mechanism 3, and the coupling is automatically completed through laser melting. This eliminates the need for glue and cover plates to fix the optical fiber 6, avoiding problems such as glue venting, aging, and failure at extremely low temperatures, effectively improving the reliability of the coupling between the optical fiber 6 and the chip 5. The laser melting coupling process is faster and more automated, significantly improving the coupling efficiency between the optical fiber 6 and the chip 5, thereby increasing the production efficiency of optoelectronic devices.

[0065] Moreover, the fiber 6 extending downward from the coupling end 61 is a bonding site 51 placed vertically on the top surface of the fiber 6, which can effectively save the area occupied by the chip 5.

[0066] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for coupling optical fiber to a chip, characterized in that, include: The worktable delivers the chip to the area below the lens, which identifies the bonding sites on the top surface of the chip and plans a path based on the location of the bonding sites and a preset working position. The clamping mechanism clamps the optical fiber in the preset working position, and the coupling end of the optical fiber extends downward out of the clamping mechanism; The ignition device is aimed at the end of the coupling end of the optical fiber and ignited to vaporize and remove the insulating layer of the coupling end of the optical fiber. The workbench moves the chip to the preset working position according to the path, so that the bonding site of the chip is located directly below the optical fiber; The clamping mechanism drives the optical fiber to move downward, and the laser head emits a laser beam toward the contact position between the coupling end of the optical fiber and the bonding site, so that the optical fiber and the bonding site are fused together. Once coupling is complete, the clamping mechanism releases the optical fiber, and the worktable, carrying the optical fiber coupled to the chip, leaves the clamping mechanism.

2. The method for coupling optical fiber and chip according to claim 1, characterized in that, The position of the ignition device relative to the workbench is fixed; The ignition device is aimed at the end of the coupling end of the optical fiber and ignites it to vaporize and remove the insulating layer at the coupling end of the optical fiber, specifically including: The clamping mechanism drives the optical fiber to move longitudinally until the end of the coupling end of the optical fiber reaches the ignition position of the ignition device. The ignition device ignites and vaporizes to remove the insulating layer at the coupling end of the optical fiber.

3. The method for coupling optical fiber and chip according to claim 2, characterized in that, The two ignition rods of the ignition device are arranged opposite each other on the radial sides of the optical fiber.

4. The method for coupling optical fiber and chip according to claim 2, characterized in that, The clamping mechanism drives the optical fiber to move longitudinally until the coupling end of the optical fiber reaches the ignition position of the ignition device, specifically including: The clamping mechanism drives the optical fiber to move longitudinally, and the ranging device measures the longitudinal height of the target point of the clamping mechanism relative to the worktable in real time. When the clamping mechanism moves to the target longitudinal height, the end of the coupling end of the optical fiber reaches the ignition position of the ignition device, and the clamping mechanism stops moving.

5. The method for coupling optical fiber and chip according to claim 4, characterized in that, The ranging device is a ranging sensor installed at the target point of the clamping mechanism.

6. The method for coupling optical fiber and chip according to claim 1, characterized in that, The clamping mechanism's wire clamp is located in the preset working position; The clamping mechanism clamps the optical fiber at the preset working position, and the coupling end of the optical fiber extends downward out of the clamping mechanism, specifically including: The wire feeding mechanism has a wire clamp that picks up and holds a longitudinally extending optical fiber; wherein the wire feeding mechanism is located on the horizontal side of the clamping mechanism; When the clamping mechanism opens, the wire feeding mechanism transfers the optical fiber to the clamping mechanism before it is moved to the clamp. After the wire feeding mechanism pushes the optical fiber into the clamp, the clamp clamps the optical fiber.

7. The method for coupling optical fiber and chip according to claim 1, characterized in that, The worktable delivers the chip below the lens, identifies the bonding sites on the top surface of the chip, and plans a path based on the location of the bonding sites and a preset working position, specifically including: The worktable delivers the chip to the area below the lens. A first coordinate system is established based on the worktable. The lens obtains the orientation of the chip in the first coordinate system by identifying multiple positioning feature points on the chip. A second coordinate system is established based on a standard chip template, and the coordinates of the standard bonding sites on the standard chip template in the second coordinate system are obtained. Based on the orientation of the chip in the first coordinate system and the coordinates of the standard bonding sites on the standard chip template in the second coordinate system, the coordinates of the bonding sites of the chip in the first coordinate system are determined. Based on the coordinates of the bonding sites of the chip in the first coordinate system and the preset working position, a path is planned.

8. The method for coupling optical fiber and chip according to claim 1, characterized in that, The clamping mechanism drives the optical fiber downward, and the laser head emits a laser beam towards the contact position between the coupling end of the optical fiber and the bonding site, causing the optical fiber and the bonding site to fuse together. Specifically, this includes: The clamping mechanism drives the optical fiber downward until the end face of the coupling end of the optical fiber contacts the bonding site on the top surface of the chip and stops. The laser head emits a laser beam toward the contact position between the coupling end of the optical fiber and the bonding site. The chip and the optical fiber melt simultaneously. While the optical fiber is melting, the clamping mechanism moves downward, pushing the optical fiber and the chip to fuse together.

9. An apparatus for coupling an optical fiber to a chip, used to implement the method for coupling an optical fiber to a chip as described in claim 1, characterized in that, It includes a lens, a clamping mechanism, a worktable, a laser head, and a longitudinal motion mechanism. The lens, clamping mechanism, and laser head are located above the worktable, and the longitudinal motion mechanism is used to drive the clamping mechanism to move longitudinally. The lens is used to identify the bonding sites on the top surface of the chip on the worktable. The clamping mechanism is used to clamp the optical fiber located at a preset working position. The worktable can drive the chip to move to the preset working position. The laser head is used to emit a laser to the contact position between the coupling end of the optical fiber and the bonding site of the chip, so that the optical fiber and the bonding site are fused together.

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