LED mounting bulk patching machine

Abstract

This invention relates to the field of LED chip mounting equipment technology, specifically a bulk chip mounting machine for LED mounting. The machine includes a main frame, a support platform and a feeding mechanism on the top of the main frame, a horizontal lifting module on the support platform, a pressing and mounting mechanism on the horizontal lifting module, and a substrate support mechanism on the main frame. This invention provides constant downward pressure during mounting, effectively preventing overpressure, especially during the simultaneous mounting of multiple chips. When the pressing speed is too fast, springs and sliding mechanisms buffer the pressing pressure, preventing sudden changes in pressing force and avoiding excessive adhesive overflow. After mounting, the anti-overpressure mechanism automatically resets, resulting in good mechanical repeatability and low maintenance costs. After pressing, the air passage is blocked to prevent dust from entering the nozzle when not in operation.

Description

Technical Field

[0001] This invention belongs to the technical field of LED chip mounting equipment, specifically relating to a bulk chip mounting machine for LED mounting. Background Technology

[0002] LED chip mounter is a specialized piece of equipment for the automated mounting of LED chips. It achieves sorting, adsorption, positioning and mounting of loose LED chips through automated control, enabling efficient and continuous mounting of loose LED chips. It is widely used in the production and manufacturing of LED lamps, displays, electronic components and other products.

[0003] Existing LED chip mounters mostly rely on motor-driven pressure mounting during the mounting process, lacking an effective overpressure buffer structure. When multiple chips are mounted simultaneously or the pressure speed is not properly controlled, excessive mounting pressure or sudden pressure changes can easily occur. This can lead to LED chip damage, substrate deformation, and glue overflow, affecting the mounting yield. Therefore, it is necessary to design a new LED chip mounter. Summary of the Invention

[0004] The purpose of this invention is to provide a simple and reasonably designed LED mounting chip and place machine in order to solve the above-mentioned problems.

[0005] The present invention achieves the above objectives through the following technical solutions: A chip mounter for LED mounting includes a main frame, a support platform and a feeding mechanism on the top of the main frame, a horizontal lifting module on the support platform, a pressing and mounting mechanism on the horizontal lifting module, a substrate support mechanism on the main frame, and a support plate on the substrate support mechanism for supporting the mounting substrate. The pressing and mounting mechanism includes a pressing platform connected to the horizontal lifting module, mounting frames symmetrically arranged on both sides of the pressing platform, and an overpressure prevention mechanism fixed on the mounting frames. The overpressure prevention mechanism includes a lower sleeve fixed on the mounting frames, a connecting ring slidably connected to the outside of the lower sleeve, a chip adsorption mechanism for picking up LED chips on the connecting ring, a dustproof mechanism on the chip adsorption mechanism, side supports evenly arranged on the side wall of the connecting ring, multiple pressure rollers rollingly connected to the side supports, a lower support slidably connected in a groove opened at the top of the inner wall of the lower sleeve, a friction ring slidably connected to the lower support, a support spring between the lower support and the friction ring, and a shrinking and clamping mechanism that generates friction with the friction ring at the top of the lower sleeve.

[0006] As a further optimization of the present invention, the shrinking and clamping mechanism includes an upper slide rail opened at the top of the lower sleeve, an arc-shaped piece slidably connected in the upper slide rail, and a friction ring located between the arc-shaped pieces.

[0007] As a further optimization of the present invention, the inner wall of the arc-shaped piece is a friction surface, and a return spring is abutted between adjacent arc-shaped pieces, and a pressing piece is fixed on the side wall of the arc-shaped piece.

[0008] As a further optimization of the present invention, the patch adsorption mechanism includes multiple connectors, and a side groove is provided on the side wall of the lower sleeve for the connectors to slide, and the top of the connector is fixed on the inner wall of the connecting ring.

[0009] As a further optimization of the present invention, a plurality of the connectors are fixed in a circular pattern on the top of the adsorption shell, a suction nozzle is provided at the bottom of the adsorption shell, and one side of the adsorption shell is connected to the suction end of the vacuum pump through a hose, and the vacuum pump is fixed on the lower pressure platform.

[0010] As a further optimization of the present invention, the dustproof mechanism includes a support sleeve fixed at the center of the top of the adsorption shell, a closed disc slidably connected in the suction nozzle, a connecting post provided on the top of the closed disc, and the connecting post slidably connected to the support sleeve.

[0011] As a further optimization of the present invention, a sealing ring is provided at the top of the closed disk, and a pressure post is provided at the bottom of the closed disk.

[0012] As a further optimization of the present invention, the feeding mechanism includes a feeding plate fixed to the top of the main frame, a vibrating feeding plate is provided on the feeding plate, a discharge rack is provided at the output end of the vibrating feeding plate, and a control panel is provided on one side of the main frame.

[0013] As a further optimization of the present invention, the transverse lifting module includes a transverse frame fixed on a support platform, a transverse screw rotatably connected to the transverse frame, a transverse motor fixed on one side of the transverse frame, the output end of the transverse motor connected to one end of the transverse screw, a lifting frame slidably connected to the transverse frame on the transverse screw, a lifting screw rotatably connected to the lifting frame, a lifting motor fixed on the top of the lifting frame, the output end of the lifting motor connected to one end of the lifting screw, a lower pressure platform connected to the lifting screw, and the lower pressure platform slidably connected to the lifting frame.

[0014] As a further optimization of the present invention, the substrate support mechanism includes a sliding frame slidably connected to the top of the main frame, the sliding frame being connected to a sliding screw, the sliding screw being rotatably connected to the main frame, a sliding motor being fixed on the main frame, the output end of the sliding motor being fixedly connected to one end of the sliding screw, and a support plate being fixed on the sliding frame.

[0015] The beneficial effects of this invention are as follows: 1. In the chip mounting stage of this invention, the lifting motor drives the lower pressure stage to move downward. After the chip contacts the substrate, the reaction force is transmitted to the connecting ring through the connector, which drives the connecting ring to move upward. The pressure roller on the connecting ring squeezes the pressure plate, causing the arc-shaped plate to slide inward along the upper slide and hug the friction ring. At this time, the reset spring between adjacent arc-shaped plates is compressed and deformed, and the support spring between the lower bracket and the friction ring is compressed synchronously. The mounting pressure is formed by the combination of the elastic force of the support spring and the friction force between the arc-shaped plate and the friction ring. Moreover, this pressure does not increase with the increase of the downward stroke, realizing constant pressure mounting. Even when multiple chips are mounted simultaneously, each overpressure prevention mechanism can independently form a stable constant pressure, effectively avoiding chip damage and substrate deformation caused by excessive pressure on a single chip, and ensuring the consistency and yield of multi-chip synchronous mounting.

[0016] 2. In the pressing process of this invention, after the chip is mounted, the lifting motor starts in reverse, driving the lower pressing platform to rise. The entire pressing and mounting mechanism moves upward, and the connecting ring slides downward along the lower sleeve under its own gravity. The pressure roller disengages from the pressure plate. At this time, the compressed reset spring releases its elastic rebound force, pushing the arc-shaped plate to slide outward along the upper slide rail to reset, releasing the grip on the friction ring. The friction ring resets under the rebound force of the support spring, and the lower bracket also slides down to the bottom of the slide groove on the inner wall of the lower sleeve. The entire overpressure prevention mechanism automatically returns to its initial state. This reset process does not require manual intervention and is automatically completed by relying on the mechanical structure and the elasticity of the spring. It has good mechanical repeatability, reduces manual maintenance operations, and lowers equipment maintenance costs.

[0017] 3. In this invention, after the chip is applied, the vacuum pump depressurizes, the nozzle releases the chip, and then the lifting motor drives the pressing and applying mechanism to move upward. The connecting column slides downward along the support sleeve under the action of gravity. When the sealing plate falls to the bottom, it will completely block the air passage port of the nozzle. When the equipment is not working, it effectively prevents external dust from entering the nozzle and air passage, avoids dust from affecting the subsequent adsorption effect, reduces the frequency of nozzle cleaning, and ensures long-term stable operation of the equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the transverse lifting module in this invention; Figure 3 This is a schematic diagram of the substrate support mechanism in this invention; Figure 4 This is a schematic diagram of the pressing and attaching mechanism in this invention; Figure 5 This is a schematic diagram of the overpressure prevention mechanism in this invention; Figure 6 This is an assembly diagram of the overpressure prevention mechanism in this invention; Figure 7This is a schematic diagram of the patch adsorption mechanism in this invention; Figure 8 This is a schematic diagram of the dustproof mechanism in this invention.

[0019] In the diagram: 1. Main frame; 2. Support platform; 3. Feeding mechanism; 4. Horizontal lifting module; 5. Pressing and bonding mechanism; 6. Substrate support mechanism; 7. Support plate; 8. Dustproof mechanism; 9. Control panel; 31. Feeding plate; 32. Vibrating feeder; 33. Discharge rack; 41. Horizontal frame; 42. Horizontal motor; 43. Lifting frame; 44. Lifting motor; 51. Pressing platform; 52. Mounting frame; 53. Overpressure protection mechanism; 54. Bonding adsorption mechanism; 61. Sliding frame; 62. Sliding... 82. Motor; 83. Support sleeve; 84. Connecting column; 85. Sealing ring; 86. Pressing column; 87. Sealing disc; 58. Pressing plate; 59. Lower sleeve; 50. Connecting ring; 51. Side support; 52. Pressing wheel; 533. Lower bracket; 54. Friction ring; 55. Support spring; 56. Upper slide rail; 57. Arc-shaped plate; 58. Return spring; 59. Connecting piece; 50. Side groove; 51. Adsorption shell; 52. Suction nozzle; 53. Vacuum pump. Detailed Implementation

[0020] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0021] Example: Please refer to Figures 1-8 A bulk LED chip mounting machine includes a main frame 1. A support platform 2 and a feeding mechanism 3 are mounted on the top of the main frame 1. The feeding mechanism 3 holds the bulk LED chips and arranges them into a fixed position during the mounting process, enabling continuous feeding. A horizontal lifting module 4 is mounted on the support platform 2, and a pressing mounting mechanism 5 is mounted on the horizontal lifting module 4. The horizontal lifting module 4 can adjust the position and height of the pressing mounting mechanism 5. A substrate support mechanism 6 is mounted on the main frame 1, and a support plate 7 is mounted on the substrate for supporting the mounting substrate. The main frame 1 serves as the mounting base for the entire machine, housing the support platform 2, feeding mechanism 3, substrate support mechanism 6, and horizontal lifting module 4. This ensures a uniform mounting reference, strong structural rigidity, and improved equipment stability and mounting accuracy. The horizontal lifting module 4 drives the pressing mounting mechanism 5 to achieve horizontal displacement and vertical lifting, adjusting the mounting position and pressing height.

[0022] Please see Figure 2 and Figures 4-8The pressing and mounting mechanism 5 includes a pressing platform 51 connected to the horizontal lifting module 4. Mounting brackets 52 are symmetrically arranged on both sides of the pressing platform 51. An overpressure protection mechanism 53 is fixed on the mounting brackets 52. The overpressure protection mechanism 53 buffers and stabilizes the mounting pressure during the pressing process, preventing excessive pressure from damaging the LED chip, preventing LED chip damage, substrate deformation, and excessive glue overflow, thus improving the mounting yield. The overpressure protection mechanism 53 includes a lower sleeve 531 fixed to the mounting brackets 52. A connecting ring 532 is slidably connected to the outside of the lower sleeve 531. A chip adsorption mechanism 54 for picking up LED chips is provided on the connecting ring 532. A dustproof mechanism 8 is provided on the adsorption mechanism 54. Side supports 533 are evenly arranged on the side wall of the connecting ring 532. Multiple pressure rollers 534 are slidably connected to the side supports 533. A lower support 535 is slidably connected in a groove opened at the top of the inner wall of the lower sleeve 531. In the non-stressed state, the lower... The bracket 535 is supported at the bottom of the inner wall groove of the lower sleeve 531. The lower bracket 535 is slidably connected to the friction ring 536 through the top guide rod. A support spring 537 is provided between the lower bracket 535 and the friction ring 536. The top of the lower sleeve 531 is provided with a shrinking clamping mechanism that generates friction with the friction ring 536. During the chip mounting process, the horizontal lifting module 4 first moves the chip mounting adsorption mechanism 54 to the position of the feeding mechanism 3. Then, the chip mounting adsorption mechanism 54 adsorbs the LED chip to be mounted. Then, the horizontal lifting module 4, together with the substrate support mechanism 6, adjusts the position of the chip mounting adsorption mechanism 54 so that the LED chip adsorbed by the chip mounting adsorption mechanism 54 is above the substrate to be mounted on the support plate 7. Then, the horizontal lifting module 4 moves the lower pressure table 51 down to press the LED chip onto the glue dispensing position of the substrate. During the process, the overpressure prevention mechanism 53 prevents excessive pressure from causing glue overflow or damage to the LED chip.

[0023] Please see Figures 1-4The feeding mechanism 3 includes a feeding plate 31 fixed to the top of the main frame 1. A vibrating feeding disk 32 is mounted on the feeding plate 31. The feeding plate 31 ensures the stability of the vibrating feeding disk 32, fixing the LED chip output position and facilitating precise picking by the chip mounting adsorption mechanism 54. An output rack 33 is provided at the output end of the vibrating feeding disk 32. (The vibrating feeding disk 32 uses vibration to sort, correct the posture, and directionally transport loose LED chips, ensuring that disordered LED chips are output in a uniform posture, guaranteeing consistent posture each time and improving adsorption reliability. The vibrating feeding disk 32 is existing technology and will not be elaborated further here.) The output rack 33 receives the LED chips output from the vibrating feeding disk 32, forming a stable picking station, preventing LED chips from falling or shifting posture, and ensuring a smooth picking process. The main frame 1... A control panel 9 is provided on one side; the horizontal moving and lifting module 4 includes a horizontal moving frame 41 fixed on the support platform 2, a horizontal moving screw rotatably connected to the horizontal moving frame 41 via bearings, a horizontal moving motor 42 fixed on one side of the horizontal moving frame 41, the output end of the horizontal moving motor 42 connected to one end of the horizontal moving screw via a coupling, a lifting frame 43 provided on the horizontal moving screw, the lifting frame 43 connected to the horizontal moving screw via an internally embedded ball nut, the lifting frame 43 slidably connected to the horizontal moving frame 41, a lifting screw rotatably connected to the lifting frame 43 via bearings, a lifting motor 44 fixed on the top of the lifting frame 43, the output end of the lifting motor 44 connected to one end of the lifting screw via a coupling, a lower pressure platform 51 connected to the lifting screw via an internally embedded ball nut, and the lower pressure platform 51 slidably connected to the lifting frame 43.

[0024] The substrate support mechanism 6 includes a sliding frame 61 slidably connected to the top guide rail of the main frame 1. The sliding frame 61 is connected to the sliding screw through an internally embedded ball nut. The sliding screw is rotatably connected to the main frame 1 through a bearing. A sliding motor 62 is fixed on the main frame 1. The output end of the sliding motor 62 is fixedly connected to one end of the sliding screw through a coupling. The support plate 7 is fixed on the sliding frame 61.

[0025] During operation, loose LED chips are poured into the vibrating feeding tray 32 of the feeding mechanism 3. The feeding plate 31 fixes and limits the vibrating feeding tray 32 to ensure its stability during operation and to fix the LED chip output position. The vibrating feeding tray 32 is then activated, and through vibration, it sorts, corrects the posture, and orients the disordered LED chips inside, ensuring all LED chips are transported in a uniform mounting posture to the output rack 33. The output rack 33 receives the LED chips output from the vibrating feeding tray 32, forming a stable picking station and preventing LED chips from falling or shifting their posture, thus preparing for subsequent processing. The material is ready for adsorption and picking. The transverse motor 42 starts, and its output drives the transverse screw to rotate through the coupling. The transverse screw drives the lifting frame 43 to slide through the ball nut, thereby moving the pressing and attaching mechanism 5 on the lifting frame 43 to the picking position. Then, the lifting motor 44 starts, and its output drives the lifting screw to rotate through the coupling. The lifting screw drives the pressing table 51 to move down through the ball nut, so that the attaching adsorption mechanism 54 of the pressing and attaching mechanism 5 is close to the LED chip on the discharge rack 33. At this time, the attaching adsorption mechanism 54 adsorbs the LED chip on the discharge rack 33 through the vacuum negative pressure. The chip is picked up; after chip picking, the lifting motor 44 starts in reverse, driving the lifting screw to rotate in the opposite direction through the coupling, thereby driving the lower pressure table 51 to rise, so that the LED chip is removed from the ejector rack 33; then, the transverse motor 42 starts again, driving the transverse screw to rotate through the coupling, driving the lifting frame 43 to move. At the same time, the substrate support mechanism 6 works synchronously, the sliding motor 62 starts, and its output end drives the sliding screw to rotate through the coupling. The sliding screw drives the sliding frame 61 to slide through the ball nut. The support plate 7 on the sliding frame 61 moves with the sliding frame 61, placing the PCB to be mounted. The substrate is transported to the mounting station. The horizontal lifting module 4 and the substrate support mechanism 6 work together to align the LED chip adsorbed by the mounting adsorption mechanism 54 with the dispensing position of the PCB substrate, completing the precise positioning before mounting. After positioning, the lifting motor 44 drives the lifting screw to rotate, causing the lower pressure table 51 to move down slowly. The overpressure protection mechanism 53 fixed on the mounting bracket 52 moves down simultaneously, so that the LED chip adsorbed by the mounting adsorption mechanism 54 gradually approaches and contacts the dispensing position of the substrate. After the LED chip is mounted, the mounting adsorption mechanism 54 stops vacuum adsorption, releases the LED chip, and completes a single mounting.

[0026] Please see Figures 4-7The shrink-fitting mechanism includes an upper slide rail 538 located at the top of the lower sleeve 531. Arc-shaped pieces 539 are slidably connected in the upper slide rail 538. Friction rings 536 are positioned between the arc-shaped pieces 539. The inner walls of the arc-shaped pieces 539 form friction surfaces, and a return spring 540 abuts against adjacent arc-shaped pieces 539. A pressing plate 530 is fixed to the side wall of the arc-shaped pieces 539. After the pressing process is initiated, the lower pressing table 51 drives the anti-overpressure mechanism 53 to move downwards. The patch adsorption mechanism 54, upon contact with the substrate, receives a reaction force, causing the connecting ring 532 to slide upwards along the lower sleeve 531. The pressing wheel 534 on the side support 533 moves upwards synchronously with the connecting ring 532. The pressure plate 530 gradually comes into contact with the compression clamping mechanism and applies compressive force. The pressure plate 530 is fixed on the side wall of the arc-shaped plate 539. Under the compressive force of the pressure roller 534, the arc-shaped plate 539 slides inward along the upper slide rail 538 opened at the top of the lower sleeve 531. The upper slide rail 538 provides a stable sliding guide for the arc-shaped plate 539, ensuring that the arc-shaped plate 539 does not deviate or jam during the sliding process. Since the friction ring 536 is located between the arc-shaped plates 539, as the arc-shaped plates 539 slide inward, the arc-shaped plates 539 gradually approach and clamp the friction ring 536; at the same time, the return spring 540 abutting between adjacent arc-shaped plates 539 is compressed. Elastic deformation occurs, storing elastic potential energy. When the arc-shaped piece 539 hugs the friction ring 536, the friction surface of the arc-shaped piece 539 is tightly attached to the surface of the friction ring 536, generating friction. As the lower pressure table 51 continues to move downward, the patch adsorption mechanism 54 is subjected to the reaction force of the substrate, causing the connecting ring 532 to slide along the lower sleeve 531. The side supports 533, which are evenly arranged on the side wall of the connecting ring 532, move upward with the connecting ring 532. The pressure rollers 534, which are rolled on the side supports 533, roll and trigger the retraction and clamping mechanism at the top of the lower sleeve 531 to move, causing the arc-shaped piece 539 of the retraction and clamping mechanism to retract inward, hug the friction ring 536 and generate static friction. Under the action of the mounting reaction force, the lower bracket 535 slides along the groove on the inner wall of the lower sleeve 531. The support spring 537 between the lower bracket 535 and the friction ring 536 is compressed, generating an elastic support force until the elastic support force overcomes the static friction force. The friction ring 536 slides in the shrinking clamping mechanism. At this time, the mounting pressure is provided by the combination of the elastic force of the support spring 537 and the sliding friction force between the friction ring 536 and the shrinking clamping mechanism. Moreover, the pressure does not increase with the increase of the downward stroke, realizing constant pressure mounting. This effectively prevents excessive pressure applied to the chip from causing glue overflow, LED chip damage, or substrate deformation, thereby improving the mounting yield.

[0027] Please see Figures 4-8The chip adsorption mechanism 54 includes multiple connectors 541. A side groove 542 for sliding of the connectors 541 is provided on the side wall of the lower sleeve 531. The top of the connectors 541 is fixed on the inner wall of the connecting ring 532. Multiple connectors 541 are circumferentially fixed on the top of the adsorption shell 543. A suction nozzle 544 is provided at the bottom of the adsorption shell 543. One side of the adsorption shell 543 is connected to the suction end of the vacuum pump 545 through a hose. The vacuum pump 545 is fixed on the lower pressure table 51. During the process of adsorbing LED chips, after the suction nozzle 544 contacts the upper surface of the chip, the vacuum pump 545 provides negative pressure, which can adsorb the LED chip on the bottom of the suction nozzle 544. During the pressing process, after the chip is attached to the substrate, the reverse support force is transmitted from the connectors 541 to the connecting ring 532.

[0028] Please see Figures 5-8 The dustproof mechanism 8 includes a support sleeve 82 fixed at the center of the top of the adsorption shell 543, a closed disk 86 slidably connected to the nozzle 544, a connecting post 83 on the top of the closed disk 86, the connecting post 83 slidably connected to the support sleeve 82, a sealing ring 84 on the top of the closed disk 86, and a pressing post 85 on the bottom of the closed disk 86. During the chip pick-up stage, the chip adsorption mechanism 54 drives the dustproof mechanism 8 to move down synchronously, approaching the chip to be picked up. The pressing post 85 first contacts the chip and drives the closed disk 86 to move up. At this time, the connecting post 83 moves upward along the support sleeve 82. Slide until the nozzle 544 adheres to the chip. At this point, the sealing disk 86 detaches from the nozzle 544, and the sealing ring 84 on the sealing disk 86 abuts against the adsorption shell 543, sealing the gap between the support sleeve 82 and the connecting post 83. The air passage port of the nozzle 544 is opened, and then adsorption is performed by the vacuum pump 545. After the mounting is completed, the vacuum pump 545 is depressurized first. As the chip adsorption mechanism 54 moves upward, the connecting post 83 moves downward under the action of gravity. When the sealing disk 86 falls to the bottom, it seals the air passage port of the nozzle 544 to prevent dust from entering the interior of the adsorption shell 543.

[0029] It should be noted that, in use, this type of LED chip placement machine first pours loose LED chips into a vibrating feeding tray 32. The vibrating feeding tray 32, through vibration, sorts and corrects the orientation of the disordered chips, then transports them orderly to the unloading rack 33, forming a stable pick-up station and preventing chips from falling or shifting their orientation. A transverse motor 42 drives a transverse lead screw to rotate, moving the lifting rack 43 and the downward placement mechanism 5 to the pick-up station. A lifting motor 44 drives a lifting lead screw to rotate, causing the placement suction mechanism 54 to move downwards. The pressure column 85 first contacts the chip and moves the sealing tray 86 upwards, opening the suction nozzle 544. In the air path, vacuum pump 545 starts to generate negative pressure, nozzle 544 stably adsorbs the chip, lifting motor 44 reverses to lift the chip and remove it from the discharge rack 33, traverse motor 42 drives traverse screw to transfer the chip; simultaneously, sliding motor 62 starts, driving sliding screw to rotate, driving the substrate on sliding frame 61 and support plate 7 to move to the mounting station. The traverse lifting module 4 and substrate support mechanism 6 work together to ensure the chip is precisely aligned with the substrate dispensing position. Lifting motor 44 drives lowering stage 51 to slowly move downwards. After the chip contacts the substrate, the reaction force is transmitted through connector 541 to connecting ring 532, driving the connecting... As ring 532 moves upward, pressure roller 534 presses against pressure plate 530, and return spring 540 deforms under pressure, causing arc-shaped plate 539 to slide inward along upper slide rail 538 to grip friction ring 536. Support spring 537 is compressed synchronously. As it continues to move downward, the elastic force of support spring 537 exceeds the friction force generated between arc-shaped plate 539 and friction ring 536. Afterward, the mounting pressure will not increase with the increase in displacement, achieving a stable constant pressure mounting effect, completing chip mounting, preventing chip and substrate damage and adhesive overflow. After mounting, vacuum pump 545 depressurizes, nozzle 544 releases the chip; lifting motor 44 starts in reverse. The lower pressure platform 51 is raised, and the connecting ring 532 resets under gravity. During this process, the support spring 537 returns to its original length. Then, the connecting piece 541 disengages from the lower support 535, the pressure roller 534 disengages from the pressure plate 530, and the reset spring 540 rebounds to push the arc plate 539 back to its original position. The arc plate 539 disengages from the friction ring 536 to prevent the continued generation of friction. The friction ring 536 and the lower support 535 reset under gravity. The dustproof mechanism 8 operates synchronously, and the connecting column 83 drives the sealing plate 86 to move down until the sealing plate 86 blocks the air passage to prevent dust from entering. After each mechanism resets, the next round of patching cycle begins.

[0030] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A bulk patcher for LED mounting, comprising a main frame (1), characterized in that: The main frame (1) is provided with a support platform (2) and a feeding mechanism (3) on its top. The support platform (2) is provided with a horizontal lifting module (4), and the horizontal lifting module (4) is provided with a pressing and attaching mechanism (5). The main frame (1) is provided with a substrate support mechanism (6), and the substrate support mechanism (6) is provided with a support plate (7) for supporting the attaching substrate. The pressing and attaching mechanism (5) includes a pressing platform (51) connected to the horizontal lifting module (4). Mounting frames (52) are symmetrically arranged on both sides of the pressing platform (51). An overpressure protection mechanism (53) is fixed on the mounting frame (52). The overpressure protection mechanism (53) includes a lower sleeve (531) fixed on the mounting frame (52). A connecting ring (532) is slidably connected to the outside of the lower sleeve (531). A attaching adsorption mechanism (54) for picking up LED chips is provided on the connecting ring (532). A dustproof mechanism (8) is provided on the attaching adsorption mechanism (54). Side supports (533) are evenly arranged on the side wall of the connecting ring (532). Multiple pressure rollers (534) are rolled on the side supports (533). A lower bracket (535) is slidably connected in a groove opened at the top of the inner wall of the lower sleeve (531). The lower bracket (535) is slidably connected to the friction ring (536). A support spring (537) is provided between the lower bracket (535) and the friction ring (536). A connection between the lower sleeve (531) and the friction ring (536) is provided at the top. A retractable clamping mechanism that generates friction; the retractable clamping mechanism includes an upper slide rail (538) opened at the top of the lower sleeve (531), an arc-shaped piece (539) is slidably connected in the upper slide rail (538), a friction ring (536) is located between the arc-shaped pieces (539), the inner wall of the arc-shaped piece (539) is a friction surface, and a return spring (540) abuts between adjacent arc-shaped pieces (539), and a pressing piece (530) is fixed on the side wall of the arc-shaped piece (539).

2. The bulk sheeting machine for LED mounting according to claim 1, characterized in that: The patch adsorption mechanism (54) includes multiple connectors (541). The side wall of the lower sleeve (531) is provided with a side groove (542) for the connectors (541) to slide. The top of the connectors (541) is fixed on the inner wall of the connecting ring (532).

3. The bulk sheeting machine for LED mounting according to claim 2, characterized in that: Multiple connectors (541) are circumferentially fixed on the top of the adsorption shell (543). A suction nozzle (544) is provided at the bottom of the adsorption shell (543). One side of the adsorption shell (543) is connected to the suction end of the vacuum pump (545) through a hose. The vacuum pump (545) is fixed on the lower pressure table (51).

4. The bulk sheeting machine for LED mounting according to claim 3, characterized in that: The dustproof mechanism (8) includes a support sleeve (82) fixed at the center of the top of the adsorption shell (543), a closed disk (86) slidably connected in the nozzle (544), a connecting column (83) provided on the top of the closed disk (86), and the connecting column (83) slidably connected to the support sleeve (82).

5. The bulk sheeting machine for LED mounting according to claim 4, characterized in that: The top of the closed disk (86) is provided with a sealing ring (84), and the bottom of the closed disk (86) is provided with a pressure post (85).

6. The bulk sheeting machine for LED mounting according to claim 1, wherein: The feeding mechanism (3) includes a feeding plate (31) fixed on the top of the main frame (1), a vibrating feeding plate (32) is provided on the feeding plate (31), a discharge rack (33) is provided at the output end of the vibrating feeding plate (32), and a control panel (9) is provided on one side of the main frame (1).

7. The LED mounting chip and place machine according to claim 1, characterized in that: The horizontal moving and lifting module (4) includes a horizontal moving frame (41) fixed on a support platform (2), a horizontal moving screw rotatably connected to the horizontal moving frame (41), a horizontal moving motor (42) fixed on one side of the horizontal moving frame (41), the output end of the horizontal moving motor (42) connected to one end of the horizontal moving screw, a lifting frame (43) slidably connected to the horizontal moving frame (41) on the horizontal moving screw, a lifting screw rotatably connected to the lifting frame (43), a lifting motor (44) fixed to the top of the lifting frame (43), the output end of the lifting motor (44) connected to one end of the lifting screw, a lower pressure platform (51) connected to the lifting screw, and the lower pressure platform (51) slidably connected to the lifting frame (43).

8. The LED mounting chip and place machine according to claim 1, characterized in that: The substrate support mechanism (6) includes a sliding frame (61) slidably connected to the top of the main frame (1), the sliding frame (61) is connected to a sliding screw, the sliding screw is rotatably connected to the main frame (1), a sliding motor (62) is fixed on the main frame (1), the output end of the sliding motor (62) is fixedly connected to one end of the sliding screw, and the support plate (7) is fixed on the sliding frame (61).

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