Wafer cleaning apparatus and wafer cleaning method using the same

Abstract

The application discloses a wafer cleaning device and a wafer cleaning method using the same. The wafer cleaning device comprises a supporting device for supporting a wafer, the supporting device being capable of moving to a cleaning position to clean the wafer; the wafer cleaning device further comprises at least two positioning devices; the positioning device is provided with a retractable first positioning member and a second positioning member, the first positioning member being used for supporting the wafer, and the second positioning member being used for adjusting the horizontal position of the wafer; the vertical distance between the supporting device and the positioning device is variable; when the vertical distance between the supporting device and the positioning device is less than or equal to a preset distance, the first positioning member can be retracted so as to transfer the wafer from the first positioning member to the supporting device. In this way, the wafer offset problem is solved, automatic centering and accurate positioning are realized. The first positioning member avoids the position deviation caused by mechanical hand shaking or manual operation error when the wafer is transferred to the supporting device. The second positioning member effectively reduces the horizontal error in the wafer transferring process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and in particular to a wafer cleaning apparatus and a wafer cleaning method using the same. Background Technology

[0002] In semiconductor manufacturing, single-wafer cleaning chambers are widely used in wafer cleaning processes. Before entering the cleaning chamber, the wafer needs to be precisely placed and fixed in the center of a support device (such as a vacuum chuck). The support device then carries the wafer to the cleaning position, where nozzles and other components spray chemical solutions or deionized water onto the rotating wafer surface for cleaning.

[0003] If the wafer is not accurately centered on the support device, it will cause severe vibration or slippage due to dynamic imbalance during high-speed rotation cleaning, which may even lead to wafer breakage in severe cases. On the other hand, it will also result in uneven thickness of the liquid film sprayed onto the wafer surface, causing differences in cleaning effect between the area near the rotation center and the outer edge, thus affecting the process yield.

[0004] Currently, single-wafer cleaning equipment is mainly divided into two categories: automatic equipment and manual equipment. In automatic equipment, robotic arms are usually used to complete the wafer loading operation; in manual equipment, wafers are usually loaded manually.

[0005] For automated wafer loading by robotic arms, the repeatability of the robotic arm, vibrations during movement, and slight slippage of the wafer on the end effector of the robotic arm can all cause the wafer to deviate from the predetermined center when it is placed on the support device.

[0006] For manual wafer loading, human factors such as operator skill level and fatigue can introduce significant positional deviations. Furthermore, when there are protruding structures such as water-retaining rings around the support device within the cleaning chamber, the operating space for the robotic arm or operator is restricted, further increasing the difficulty of accurately placing the wafer and raising the risk of the wafer deviating from the center of the support device. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to overcome the defects of wafer positioning errors in existing wafer cleaning equipment, which affect the cleaning effect, and to provide a wafer cleaning equipment and a wafer cleaning method using the same.

[0008] The present invention solves the above-mentioned technical problems through the following technical solution:

[0009] A wafer cleaning apparatus includes a support device for supporting wafers, the support device being movable to a cleaning position to clean the wafers;

[0010] The wafer cleaning equipment also includes at least three positioning devices;

[0011] The positioning device has a retractable first positioning element and a retractable second positioning element. The first positioning element is used to support the wafer, and the second positioning element is used to adjust and determine the horizontal position of the wafer.

[0012] The vertical distance between the supporting device and the positioning device is variable;

[0013] When the support device can physically hold the wafer, the first positioning member can be retracted to transfer the wafer from the first positioning member to the support device.

[0014] This technical solution addresses the wafer loading misalignment problem by providing a wafer cleaning device, achieving automatic centering and precise positioning. The first positioning component provides a stable initial support surface and performs vertical transfer within a preset distance, preventing positional deviations caused by robotic arm tremors or human error during wafer transfer to the support device. The second positioning component actively pushes the wafer edge through a telescopic motion, correcting the wafer to a preset center position. This effectively reduces horizontal errors during loading, significantly improves the uniformity of subsequent cleaning processes and equipment stability, and lowers the risk of wafer breakage due to misalignment.

[0015] Preferably, the wafer cleaning equipment further includes a water-retaining ring, and the positioning device is connected to the upper or inner wall of the water-retaining ring;

[0016] The water-blocking ring can move up and down between a first position and a second position, with the first position being higher than the second position in the vertical direction;

[0017] When the water-blocking ring is in the first position, the water-blocking ring is used to block water;

[0018] When the water-blocking ring is in the second position, the wafer can be transferred from the positioning device to the support device;

[0019] The positioning device is connected to the water-blocking ring.

[0020] In this technical solution, by using the above-mentioned settings, the water-blocking ring is used as the lifting drive carrier of the positioning device, eliminating the need for a separate drive structure and improving the integration level of the wafer cleaning equipment.

[0021] Preferably, the supporting device can be driven to rise and fall by a supporting drive component;

[0022] The water-blocking ring is driven to rise and fall by a water-blocking driving component;

[0023] The water-blocking drive component is located on the outside of the supporting drive component.

[0024] In this technical solution, the spatial layout of the wafer cleaning equipment is further optimized through the above settings, avoiding interference between drive components and facilitating installation and maintenance.

[0025] Preferably, the positioning device further includes a base, and both the first positioning element and the second positioning element are connected to the base.

[0026] In this technical solution, the above-mentioned configuration facilitates the separate assembly of the positioning device before connection, thereby improving the modular design and assembly efficiency of the wafer cleaning equipment.

[0027] Preferably, the wafer cleaning equipment further includes a control unit;

[0028] The control unit is electrically connected to the first positioning member and the second positioning member, and is capable of controlling the extension and retraction of the first positioning member and the second positioning member.

[0029] In this technical solution, through the above settings, the control unit can centrally and automatically control the extension and retraction of the first positioning member and the second positioning member, and supports complex logic and timing arrangement, thereby improving the convenience and consistency of operation and improving the process stability of mass production.

[0030] Preferably, the first positioning member and the second positioning member have different extension and retraction directions.

[0031] In this technical solution, the above-described configuration allows for the wafer to extend radially from below to support the bottom edge of the wafer, or to retract radially to release the wafer. This results in the shortest radial movement path, rapid action, and direct and stable support against gravity at the wafer edge.

[0032] Preferably, the second positioning element is capable of extending and retracting radially along the wafer cleaning equipment.

[0033] In this technical solution, the above-mentioned settings facilitate the application of a gentle radial thrust to the wafer, avoiding frictional damage to the wafer edges.

[0034] Preferably, there are at least three positioning devices;

[0035] And / or, each of the positioning devices is evenly distributed circumferentially;

[0036] And / or, the positioning device is made of engineering plastics or ceramics.

[0037] In this technical solution, by setting at least three positioning devices, it is convenient to use the geometric principle of three points to determine a circle, so that the positioning devices can work together from different directions to provide a stable and unique center position for the wafer.

[0038] By setting each positioning device to be evenly distributed circumferentially, the positioning process is subjected to uniform force, resulting in the best calibration effect. This allows the device to adapt to minute manufacturing tolerances in wafer diameter and achieve high-precision self-centering functionality.

[0039] By using materials such as engineering plastics or ceramics for the positioning device, the device is made of wear-resistant and has a low coefficient of friction, which minimizes the risk of scratching the wafer when it comes into contact with the wafer edge.

[0040] A wafer cleaning method, which employs the wafer cleaning equipment described above;

[0041] The wafer cleaning method includes the following steps:

[0042] S1. Place the wafer such that the wafer is supported by at least three of the first positioning members, and at least one of the second positioning members abuts against the edge of the wafer;

[0043] S2. The second positioning member extends and retracts to push the wafer to a preset wafer positioning area;

[0044] S3. Reduce the vertical distance between the supporting device and the positioning device;

[0045] When the support device physically fixes the wafer, each of the first positioning elements is retracted, so that the wafer is transferred from the first positioning elements to the support device.

[0046] S4. Move the support device to the cleaning position and begin cleaning the wafer.

[0047] This technical solution significantly improves the overall controllability and success rate of the wafer mounting process by providing this wafer cleaning method. It achieves non-destructive calibration and handover through step-by-step actions: Step S1 first places the wafer on the first positioning element to isolate it from the final support device; Step S2 then performs fine horizontal calibration to avoid back-side scratches or particle contamination that might occur from directly pushing the wafer on the support device; Step S3 achieves a soft-land handover by changing the vertical distance and retracting the first positioning element. The entire process maximizes wafer protection and ensures the accuracy of its final position.

[0048] Preferably, the wafer cleaning equipment further includes a water-retaining ring, and the positioning device is connected to the upper or inner wall of the water-retaining ring;

[0049] The water-blocking ring can move up and down between a first position and a second position, with the first position being higher than the second position in the vertical direction;

[0050] When the water-blocking ring is in the first position, the water-blocking ring is used to block water;

[0051] When the water-blocking ring is in the second position, the wafer can be transferred from the positioning device to the support device;

[0052] The positioning device is connected to the water-blocking ring;

[0053] Step S1 also includes:

[0054] S11: Raise the water-blocking ring to the first position, and then place the wafer;

[0055] Step S3 also includes:

[0056] S31. Lower the water-blocking ring to the second position, and then transfer the wafer;

[0057] Step S4 also includes:

[0058] S41. Raise the water-blocking ring to the first position and then clean the wafer.

[0059] In this technical solution, the timing coupling relationship between the water-retaining ring and the positioning action is clearly defined through the above settings, forming a standardized automated process. Placing the wafer when the water-retaining ring is in a high position provides maximum operating space for the robot or operator, avoids interference with the support device, and reduces the difficulty of wafer placement and the risk of collision. The descent of the water-retaining ring drives the wafer closer to the support device, cleverly using the water-retaining ring as a "lift" for the transfer action, achieving functional reuse. After the wafer transfer is completed, the water-retaining ring is immediately raised to the first position, preparing the environment for the subsequent cleaning steps.

[0060] The positive and progressive effects of this invention are as follows:

[0061] By providing this wafer cleaning equipment, the problem of wafer misalignment is solved, achieving automatic centering and precise positioning. The first positioning component provides a stable initial support surface and performs vertical transfer within a preset distance, avoiding positional deviations caused by robot arm tremors or human error during wafer transfer to the support device. The second positioning component actively pushes the wafer edge through a telescopic movement, correcting the wafer to the preset center position, effectively reducing horizontal errors during wafer loading, significantly improving the uniformity of subsequent cleaning processes and equipment stability, and lowering the risk of wafer breakage due to misalignment.

[0062] Through the above setup, the timing coupling relationship between the water-retaining ring and the positioning action is clearly defined, forming a standardized automated process. Placing the wafer when the water-retaining ring is in a high position provides maximum operating space for the robot or operator, avoids interference with the support device, and reduces the difficulty of wafer placement and the risk of collision. Utilizing the descending motion of the water-retaining ring to drive the wafer closer to the support device cleverly uses the water-retaining ring as a "lift" for the transfer action, achieving functional reuse. After the wafer transfer is completed, the water-retaining ring is immediately raised to the first position, preparing the environment for the subsequent cleaning steps. Attached Figure Description

[0063] Figure 1 This is a top view of a wafer cleaning device according to an embodiment of the present invention.

[0064] Figure 2 This is a three-dimensional structural diagram of a wafer cleaning device according to an embodiment of the present invention.

[0065] Figure 3 This is a flowchart of a wafer cleaning method according to an embodiment of the present invention.

[0066] Figure 4 This is a longitudinal cross-sectional view of a wafer cleaning apparatus according to an embodiment of the present invention (corresponding to step S2 of the wafer cleaning method).

[0067] Figure 5 This is a longitudinal cross-sectional view of a wafer cleaning apparatus according to an embodiment of the present invention (corresponding to step S31 of the wafer cleaning method).

[0068] Figure 6 This is a longitudinal cross-sectional view of a wafer cleaning apparatus according to an embodiment of the present invention (corresponding to step S3 of the wafer cleaning method).

[0069] Figure 7 This is a longitudinal cross-sectional view of a wafer cleaning apparatus according to an embodiment of the present invention (corresponding to step S41 of the wafer cleaning method).

[0070] Figure 8 for Figure 4 A magnified view of part B.

[0071] Figure 9 for Figure 5 A magnified view of part C.

[0072] Figure 10 for Figure 6 A magnified view of part D.

[0073] Figure 11 for Figure 7 A magnified view of part E.

[0074] Explanation of reference numerals in the attached figures:

[0075] 1. Wafer; 2. Wafer cleaning equipment; 21. Support device; 22. Positioning device; 22. First positioning component; 221. Second positioning component; 222. Base; 223. Telescopic cylinder; 224. Water baffle ring; 23. Support drive component; 241. Water baffle drive component; 242. Cleaning chamber; 25. Detailed Implementation

[0076] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0077] like Figure 1 , Figure 2 As shown, this embodiment provides a wafer cleaning apparatus 2, which includes a support device 21 for supporting a wafer 1. The support device 21 can be moved to a cleaning position to clean the wafer 1. The wafer cleaning apparatus 2 also includes at least two positioning devices 22. The positioning device 22 has a retractable first positioning member 221 and a retractable second positioning member 222. The first positioning member 221 is used to support the wafer 1, and the second positioning member 222 is used to adjust the horizontal position of the wafer 1. The vertical distance H between the support device 21 and the positioning device 22 is variable. When the support device can physically fix the wafer 1, the first positioning member 221 can be retracted to transfer the wafer 1 from the first positioning member 221 to the support device 21.

[0078] This setup solves the wafer loading offset problem, achieving automatic centering and precise positioning. The first positioning component 221 provides a stable initial support surface and performs vertical transfer within a preset distance, avoiding positional deviation caused by robot arm tremors or human error when transferring wafer 1 to the support device 21. The second positioning component 222 actively pushes the edge of wafer 1 through a telescopic movement, correcting wafer 1 to the preset center position, effectively reducing horizontal errors during the wafer loading process, significantly improving the uniformity of subsequent cleaning processes and equipment stability, and reducing the risk of wafer 1 breakage due to misalignment.

[0079] It should be noted that:

[0080] The aforementioned "physical fixation" can refer to methods such as mechanical fixation and adsorption fixation that use physical means to fix the wafer.

[0081] In this embodiment, since the dimensional error of wafer 1 at the time of manufacture is extremely small, there is no need to consider the manufacturing tolerance of wafer 1. Therefore, whether wafer 1 has been corrected to the preset center position can be confirmed by reading the extension position or size of each second positioning member 222 (the method of reading the position or size is prior art and will not be described here), and comparing it with the extension position or size that each second positioning member 222 should have when wafer 1 is located at the preset center position.

[0082] In this embodiment, when the supporting device 21 moves to the cleaning position, the wafer 1 is completely immersed in the cleaning chamber 25 below the positioning device 22, thereby achieving the purpose of cleaning the wafer 1. In other embodiments, the wafer 1 can be cleaned in any space or location that is capable of cleaning the wafer 1 in any prior art.

[0083] In this embodiment, a vacuum adsorption chuck is selected as the support device 21 to ensure the stability of wafer 1; in other embodiments, the support device may also be any non-contact support device such as a mechanical clamping chuck, an electrostatic adsorption chuck, or a Bernoulli chuck, which can stably support the wafer for cleaning.

[0084] like Figures 4-11 As shown, due to the thinness of wafer 1, its outline may not be easily discernible in the cross-sectional view. To more clearly illustrate the spatial position of wafer 1 within the wafer cleaning equipment 2, its position is schematically represented by dashed lines in the figure. These dashed lines are used only to enhance the readability of the illustration and do not indicate that wafer 1 is a non-physical structure or is in a non-existent state.

[0085] In this embodiment, the wafer cleaning equipment 2 also includes a water-retaining ring 23, and a positioning device 22 is connected to the inner wall of the water-retaining ring 23 (for ease of demonstration). Figure 1 The top cover of the water-retaining ring 23 has been removed; the water-retaining ring 23 can be in the first position (e.g. Figure 4 , Figure 7 (as shown) and second position (as shown) Figure 5 , Figure 6 The positioning device 22 is connected to the water-blocking ring 23. When the water-blocking ring 23 is in the first position, it blocks water. When the water-blocking ring 23 is in the second position, the wafer 1 can be transferred from the positioning device 22 to the supporting device 21. In this way, by using the water-blocking ring 23 as the lifting drive carrier for the positioning device 22, no separate drive structure is needed, improving the integration level of the wafer cleaning equipment 2. In other embodiments, the positioning device is connected above the water-blocking ring, achieving a similar effect.

[0086] In this embodiment, the support device 21 can be driven to rise and fall by the support drive member 241; the water baffle ring 23 is driven to rise and fall by the water baffle drive member 242; the water baffle drive member 242 is located outside the support drive member 241 (that is, the support drive member 241 is closer to the center of the wafer cleaning equipment 2, and the water baffle drive member 242 is farther away from the center of the wafer cleaning equipment 2). In this way, the spatial layout of the wafer cleaning equipment 2 is further optimized, interference between drive components is avoided, and installation and maintenance are convenient.

[0087] In this embodiment, both the support drive component 241 and the water-blocking drive component 242 are cylinders. In other embodiments, the support drive component and / or the water-blocking drive component may also be other drive elements capable of linear reciprocating motion, such as electric actuators, hydraulic cylinders, or linear motors.

[0088] In this embodiment, the positioning device 22 further includes a base 223; the base 223 has an inner end near the center of the wafer cleaning equipment 2, and the first positioning member 221 and the second positioning member 222 are both connected to the inner end. In this way, the overhang length of the first positioning member 221 and the second positioning member 222 is shortened, the overall rigidity of the positioning device 22 is improved, and the force transmission efficiency and positional accuracy when pushing the wafer 1 are guaranteed; in addition, it is convenient for the positioning device 22 to be assembled separately and then connected, which improves the modular design and assembly efficiency of the wafer cleaning equipment 2.

[0089] In this embodiment, the wafer cleaning equipment 2 also includes a control unit (not shown in the figure); the control unit is electrically connected to the first positioning member 221 and the second positioning member 222, and is capable of controlling the extension and retraction of the first positioning member 221 and the second positioning member 222. This configuration enables the control unit to centrally and automatically control the extension and retraction of the first positioning member 221 and the second positioning member 222, and supports complex logic and timing arrangement, thereby improving operational convenience and consistency, and enhancing the process stability of mass production.

[0090] In this embodiment, the first positioning member 221 can extend and retract along the radial direction A of the wafer cleaning equipment 2, so as to extend from below the wafer 1 in the radial direction to support the bottom edge of the wafer 1, or retract in the radial direction to release the wafer 1. The radial movement path is the shortest, the action is rapid, and it can directly and stably support the wafer 1 in the direction of gravity at the edge of the wafer 1.

[0091] In this embodiment, the second positioning member 222 can extend and retract along the radial direction A of the wafer cleaning equipment 2, which facilitates the application of a gentle pushing force to the wafer 1 and avoids frictional damage to the edge of the wafer 1.

[0092] In this embodiment, each positioning device 22 is provided with a first positioning element 221 and two second positioning elements 222. The first positioning element 221 supports the wafer 1 and is driven by a separate positioning cylinder (not shown in the figure). It works together with the second positioning element 222 of one of the positioning devices 22 to act on the edge of the wafer 1. The second positioning element 222 of the other positioning device 22 does not contact the edge of the wafer 1 at the moment. It is pushed by a separate telescopic cylinder 224 until the wafer 1 is locked, so as to realize the pushing and centering of the wafer 1.

[0093] In this embodiment, there are at least three positioning devices 22. By utilizing the geometric principle that three points determine a circle, the positioning devices 22 can work together from different directions to provide a stable and unique center position for the wafer 1.

[0094] In this embodiment, each positioning device 22 is evenly distributed in the circumference, so that the force is uniform during the positioning process, the calibration effect is optimal, and it can adapt to the small manufacturing tolerance of the wafer diameter 1, and realize the high-precision self-centering function.

[0095] In this embodiment, the positioning device 22 is made of ceramic, giving it excellent wear resistance and a low coefficient of friction, thus minimizing the risk of scratching the wafer 1 when it comes into contact with the edge of the wafer 1. In other embodiments, the positioning device can also be made of engineering plastics or other materials with similar properties to achieve a similar effect.

[0096] like Figure 3 As shown, this embodiment also provides a wafer 1 cleaning method, which uses the wafer cleaning equipment 2 as described above; the steps of the wafer 1 cleaning method include:

[0097] S1. Place wafer 1 such that wafer 1 is supported by at least two first positioning members 221 and at least one second positioning member 222 abuts against the edge of wafer 1.

[0098] S2, the second positioning member 222 extends and retracts to push the wafer 1 to the preset wafer 1 positioning area;

[0099] S3. Change the vertical distance H between the supporting device 21 and the positioning device 22 to a preset distance;

[0100] Retract each of the first positioning elements 221 to transfer the wafer 1 from the first positioning elements 221 to the support device 21;

[0101] S4. Move the support device 21 to the cleaning position and start cleaning the wafer 1.

[0102] Specifically, during a particular cleaning process, the various components worked together as follows:

[0103] Before S1 execution: Before the wafer is placed, the water-blocking drive 242 of the water-blocking ring 23 lifts the water-blocking ring 23, and the positioning cylinder pushes out, so that the positioning device 22 is in the state of waiting to receive the wafer 1.

[0104] When S1 is executed: the wafer 1 is placed on the first positioning member 221 of the positioning device 22 by manual or robotic arm. At this time, the second positioning members 222 of the two positioning devices 22 are in contact with the lower edge of the wafer 1 or hold the edge of the wafer 1.

[0105] When S2 is executed: the second positioning element 222 of the remaining positioning device 22 is pushed by the telescopic cylinder 224 to lock the wafer 1, finely adjust the position of the wafer 1, and push it to the preset wafer 1 positioning area to achieve self-calibration of the wafer 1 position;

[0106] When S3 is executed: the water-blocking drive component 242 drives the water-blocking ring 23 to descend, and the wafer 1 is smoothly transferred to the support device 21;

[0107] When S4 is executed, the telescopic cylinder 224 retracts, the positioning device 22 moves away from the wafer 1, and the water-blocking ring 23 lifting cylinder lifts the water-blocking ring 23 again, completing the entire wafer loading process and starting the subsequent cleaning process.

[0108] This method significantly improves the overall controllability and success rate of the wafer mounting process, and achieves non-destructive calibration and handover through step-by-step actions: Step S1 first places wafer 1 on the first positioning element 221 to isolate it from the final support device 21; Step S2 then performs fine horizontal calibration to avoid back-side scratches or particle contamination that may be caused by directly pushing wafer 1 on the support device 21; Step S3 achieves soft landing handover by changing the vertical distance H and retracting the first positioning element 221. The entire process protects wafer 1 to the greatest extent and ensures the accuracy of its final position.

[0109] In this embodiment, the vertical distance H can be reduced to 0, at which point the support device 21 and the wafer 1 are physically fixed.

[0110] like Figures 4-6 As shown, step S1 further includes:

[0111] S11: Raise the water-blocking ring 23 to the first position, and then place wafer 1;

[0112] Step S3 also includes:

[0113] S31. Lower the water-blocking ring 23 to the second position, and then transfer wafer 1;

[0114] Step S4 also includes:

[0115] S41. Raise the water-blocking ring 23 to the first position, and then clean the wafer 1.

[0116] This setup clearly defines the timing coupling between the water-retaining ring 23 and the positioning action, forming a standardized automated process. Placing wafer 1 when the water-retaining ring 23 is in a high position provides maximum operating space for the robot or operator, avoids interference with the support device 21, and reduces the difficulty of wafer placement and the risk of collision. The descent of the water-retaining ring 23 is used to drive wafer 1 closer to the support device 21, cleverly using the water-retaining ring 23 as a "lift" for the transfer action, achieving functional reuse. After wafer 1 is transferred, the water-retaining ring 23 is immediately raised to the first position, preparing the environment for the subsequent cleaning steps.

[0117] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A wafer cleaning apparatus comprising a support device for supporting a wafer, the support device being movable to a cleaning position to clean the wafer, characterized in that... ； The wafer cleaning equipment also includes at least three positioning devices; The positioning device has a retractable first positioning element and a retractable second positioning element. The first positioning element is used to support the wafer, and the second positioning element is used to adjust and determine the horizontal position of the wafer. The vertical distance between the supporting device and the positioning device is variable; When the support device can physically hold the wafer, the first positioning member can be retracted to transfer the wafer from the first positioning member to the support device. The wafer cleaning equipment also includes a water-retaining ring, and the positioning device is connected to the upper or inner wall of the water-retaining ring; The water-blocking ring can move up and down between a first position and a second position, with the first position being higher than the second position in the vertical direction; When the water-blocking ring is in the first position, the water-blocking ring is used to block water; When the water-blocking ring is in the second position, the wafer can be transferred from the positioning device to the support device; The positioning device is connected to the water-blocking ring.

2. The wafer cleaning equipment as described in claim 1, characterized in that, The supporting device can be lifted and lowered by a supporting drive component; The water-blocking ring is driven to rise and fall by a water-blocking driving component; The water-blocking drive component is located on the outside of the supporting drive component.

3. The wafer cleaning equipment as described in claim 1, characterized in that, The positioning device further includes a base, and both the first positioning element and the second positioning element are connected to the base.

4. The wafer cleaning equipment as described in claim 1, characterized in that, The wafer cleaning equipment also includes a control unit; The control unit is electrically connected to the first positioning member and the second positioning member, and is capable of controlling the extension and retraction of the first positioning member and the second positioning member.

5. The wafer cleaning equipment as described in claim 1, characterized in that, The first positioning element is capable of extending and retracting radially along the wafer cleaning equipment.

6. The wafer cleaning equipment as described in claim 1, characterized in that, The second positioning element is capable of extending and retracting radially along the wafer cleaning equipment.

7. The wafer cleaning equipment as described in claim 1, characterized in that, The positioning device is at least three; and / or, The positioning devices are evenly distributed circumferentially; and / or, The positioning device is made of engineering plastics or ceramics.

8. A wafer cleaning method, characterized in that, It employs the wafer cleaning equipment as described in any one of claims 1-7; The wafer cleaning method includes the following steps: S1. Place the wafer such that the wafer is supported by at least three of the first positioning members, and at least one of the second positioning members abuts against the edge of the wafer; S2. The second positioning member extends and retracts to push the wafer to a preset wafer positioning area; S3. Reduce the vertical distance between the supporting device and the positioning device; When the support device can physically fix the wafer, each of the first positioning elements is retracted, so that the wafer is transferred from the first positioning elements to the support device. S4. Move the support device to the cleaning position and begin cleaning the wafer.

9. The wafer cleaning method as described in claim 8, characterized in that, The wafer cleaning equipment also includes a water-retaining ring, and the positioning device is connected to the upper or inner wall of the water-retaining ring; The water-blocking ring can move up and down between a first position and a second position, with the first position being higher than the second position in the vertical direction; When the water-blocking ring is in the first position, the water-blocking ring is used to block water; When the water-blocking ring is in the second position, the wafer can be transferred from the positioning device to the support device; The positioning device is connected to the water-blocking ring; Step S1 also includes: S11: Raise the water-blocking ring to the first position, and then place the wafer; Step S3 also includes: S31. Lower the water-blocking ring to the second position, and then transfer the wafer; Step S4 also includes: S41. Raise the water-blocking ring to the first position and then clean the wafer.

Images