Vertical distribution integrated heat generating device thermosyphon heat dissipation power device

Abstract

The present application relates to a kind of vertical distribution integrated heat generating device thermosyphon heat dissipation power equipment.Compared with prior art, the present application integrates heat generating device with different heat dissipation requirements on the same mounting substrate, and a plurality of independent evaporation chambers, vapor flow channels and liquid flow channels are correspondingly arranged in the same mounting substrate.The top of the evaporation chambers is above all evaporation chambers on the mounting substrate.The pipeline part corresponding to the lower heat generating device and interfering with the upper heat generating device with different heat dissipation requirements is converted into a flow channel in the mounting substrate, achieving overall thinning in the thickness direction.The heat generating devices with different heat dissipation requirements on the same mounting substrate are vertically integrated, achieving overall compact integration of the device.In addition, the heat dissipation circulation path corresponding to each evaporation chamber is away from the heat generating device corresponding to the remaining evaporation chambers through the vapor flow channel and the liquid flow channel arranged inside the mounting substrate, achieving compact integration of heat generating devices with different heat dissipation requirements while achieving completely independent heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of power module technology, and in particular to a vertically distributed integrated heating element thermosiphon cooling power device. Background Technology

[0002] Power modules are typically power electronic devices, containing various heat-generating components such as power semiconductor devices, capacitors, and inductors. In power conversion modules, the main components that dissipate heat through the evaporator substrate are the power semiconductor devices and filter inductors. These typically generate high heat. When packaging power modules, there are certain requirements for the placement of the power semiconductor devices and filter inductors, as well as a certain internal thermal resistance. Therefore, a good heat dissipation method is needed to ensure that the device operating temperature is within a safe range.

[0003] Chinese invention patent document CN120692803A discloses a liquid-cooled heat sink and a power module. In a compact power module, a non-contact liquid-cooled plate is typically used as the heat dissipation mounting base for the main heat-generating components, using coolant to remove heat from the components. A fluid pump is required to drive the heat-absorbing liquid to the heat sink for heat dissipation. However, the liquid-cooled plate cooling method in power modules results in high thermal resistance between the heat-generating surface of the components and the cooling fluid, leading to higher internal temperature rises in the components and affecting the lifespan, reliability, and efficiency of the power module. Furthermore, the liquid-cooled plate typically contains a conductive liquid; leaks in the liquid-cooled plate, joints, or piping can pose electrical insulation risks. Liquid cooling technology requires a fluid pump and related fluid circulation components to ensure proper circulation of the cooling fluid.

[0004] Chinese utility model patent document CN219610424U discloses a power module and component. Some power modules employ a method of separating the evaporator and condenser pipelines, but the external pipelines occupy the thickness of the evaporator, failing to achieve compact integration of the power module and also failing to provide independent cooling loops for devices with different temperature requirements and heat generation. Some thermosiphon radiators do not effectively integrate the evaporator and steam / liquid flow channels into the same compact structure, nor do they meet the requirement of independent heat dissipation for heat-generating devices with different heat dissipation needs within the same radiator.

[0005] Chinese utility model patent document CN218414554U discloses a thermosiphon radiator. In this radiator, some power modules utilize a thermosiphon design, failing to distinguish between the evaporation area and the steam pipeline. Instead, the rising continuous channel serves as the unified channel for thermosiphon evaporation and steam discharge. It does not achieve a complete closed-loop thermosiphon system by connecting the pipeline to the condenser; instead, it uses a height difference in the condenser manifold to separate the gas and liquid, resulting in an unstable forward driving pressure difference and reduced condenser heat exchange efficiency. Structurally, the steam and evaporation pipelines and the return liquid pipeline are arranged close together in the thickness direction, making the return liquid susceptible to heat leakage from the evaporation end, leading to air bubbles, affecting return flow, and increasing thermal resistance. Furthermore, the heating elements are mounted on the heat exchange substrate corresponding to the exhaust channels. Due to the distance between the exhaust channels, the heat dissipation effect of the heating elements is poor. Although multiple heating elements can be arranged in the exhaust direction of the exhaust channels on the heat exchange substrate, it cannot simultaneously achieve independent heat dissipation for heating elements with different heat dissipation needs.

[0006] Furthermore, the evaporator is placed vertically. During the cooling process of the heat source, the medium in the lower half of the steam channel exchanges heat with the corresponding heat source, causing the medium in the lower part of the evaporator to vaporize. The resulting bubbles rise and affect the content of the medium in the upper part of the evaporator, thus affecting the heat dissipation of the medium in the upper part of the evaporator to the heat source above. In addition, bubbles are usually generated at the position where the evaporator is in contact with the heat source. As bubbles generated on the lower wall of the evaporator float upwards along the inner wall of the evaporator, if they move to the position on the upper wall of the evaporator where they are in contact with the heat source, they will reduce the heat exchange effect between the medium and the heat source inside the evaporator. Therefore, after the medium in the lower part of the evaporator is heated, it will exchange heat with the medium in the upper part, affecting the temperature of the medium in the upper part, further affecting the heat dissipation along the heat source above, and affecting the use of the heat source module. Summary of the Invention

[0007] The purpose of this invention is to overcome the defects of the prior art and provide a vertically distributed integrated heating element thermosiphon heat dissipation power device.

[0008] The objective of this invention can be achieved through the following technical solutions:

[0009] According to the present invention, a vertically integrated heating element thermosiphon cooling power device includes a vertically placed mounting base. The mounting base is used for vertically integrating heating elements with different heat dissipation requirements. The mounting base has multiple vertically distributed evaporation chambers, each corresponding to a heating element with a different heat dissipation requirement. Each evaporation chamber contains a heat-absorbing and vaporizing working fluid. Each of the multiple evaporation chambers independently corresponds to a steam pipeline, a liquid pipeline, a condenser, a steam channel disposed within the mounting base, and a liquid channel disposed within the mounting base. The condenser is located above the vertically placed mounting base. The bottom end of each steam channel connects to the top of the corresponding evaporation chamber, and the top end of each steam channel connects to the bottom of the corresponding steam pipeline. The top end of the steam pipeline is connected to the top steam inlet of the corresponding condenser, the bottom liquid outlet of the condenser is connected to the top end of the corresponding liquid pipeline, the bottom end of the liquid pipeline is connected to the top end of the corresponding liquid flow channel, and the bottom end of the liquid flow channel is connected to the bottom of the corresponding evaporation chamber. A heat dissipation circulation path is formed between the condenser and the corresponding evaporation chamber. The top of the steam flow channel and the top of the liquid flow channel are both above all the vertically distributed evaporation chambers on the mounting base, so that the heat dissipation circulation path corresponding to each evaporation chamber is insulated from the heating devices corresponding to the other evaporation chambers by the steam flow channel and liquid flow channel provided inside the mounting base, so as to achieve compact integration of heating devices with different heat dissipation requirements while achieving independent heat dissipation.

[0010] Compared with the prior art, in use, the present invention transfers heat to the working liquid in the corresponding evaporation chamber. The working liquid absorbs heat and vaporizes. The vaporized steam enters the condenser through the steam channel and steam pipeline. The condenser condenses and liquefies the steam. The liquefied working liquid flows back to the evaporation chamber through the liquid pipeline and liquid channel. Through gravity-driven gas-liquid two-phase loop thermosiphon heat transfer circulation, a heat dissipation circulation path is formed. The heating device can completely correspond to the evaporation chamber, which can improve the heat dissipation effect of the heating device. Furthermore, the complete heat dissipation circulation path through thermosiphon can reduce the heat dissipation thermal resistance of the heating device, reduce the internal temperature rise of the heating device, and improve the life and reliability of the power module. More importantly, this invention integrates heating devices with different heat dissipation requirements onto the same mounting substrate. Within this same mounting substrate, multiple independent evaporation chambers are correspondingly arranged according to the vertically arranged heating devices with different heat dissipation requirements. The tops of the steam flow channels and liquid flow channels are both located above all vertically distributed evaporation chambers on the mounting substrate. Pipelines that correspond to the lower heating devices and interfere with the upper heating devices with different heat dissipation requirements are transformed into flow channels within the mounting substrate. This achieves an overall thinning of the heat dissipation power device in the thickness direction. Furthermore, there are no pipe arrangements between heating devices with different heat dissipation requirements, allowing for compact vertical integration of heating devices with different heat dissipation requirements on the same mounting substrate. This fully utilizes the substrate, saves costs, reduces the volume of the power module, and achieves overall compact integration of the device. Additionally, the heat dissipation circulation path corresponding to each evaporation chamber is insulated from the heating devices corresponding to other evaporation chambers through steam and liquid flow channels located inside the mounting substrate. In other words, the heat dissipation circulation path corresponding to each evaporation chamber is kept away from the heating devices corresponding to other evaporation chambers through steam and liquid flow channels located inside the mounting substrate, ensuring that the heat dissipation of different heating devices does not interfere with each other. This achieves compact integration of heating devices with different heat dissipation requirements while achieving completely independent heat dissipation.

[0011] Preferably, the evaporation chamber, steam channel, and liquid channel are all located on the same plane inside the mounting substrate, and multiple heating elements are located on the same side of the mounting substrate, so that the top outlet of the steam channel and the top inlet of the liquid channel are located on the surface of the heating elements on the mounting substrate, and the liquid pipeline and steam pipeline are located on the same side of the heating elements on the mounting substrate, thereby reducing the thickness of the mounting substrate while achieving a compact integration of the heat dissipation power device.

[0012] Compared with the prior art, the evaporation chamber, steam channel and liquid channel of this application are located on the same plane inside the mounting substrate, which can reduce the thickness of the mounting substrate and achieve the overall compact integration of the heat dissipation power device. In addition, the heat dissipation circulation path corresponding to each evaporation chamber is further away from the heat-generating devices corresponding to other evaporation chambers through the steam channel and liquid channel located inside the mounting substrate, thereby reducing thermal resistance.

[0013] Preferably, there is a thermal insulation distance between the steam flow channel and the liquid flow channel corresponding to the same evaporation chamber, and there is a thermal insulation distance between different evaporation chambers, the steam flow channels corresponding to different evaporation chambers, and the liquid flow channels corresponding to different evaporation chambers, so as to maintain the steam temperature of the steam flow channel corresponding to each evaporation chamber and the liquid temperature of the corresponding liquid flow channel, thereby reducing thermal resistance and improving the heat transfer efficiency of the heat dissipation circulation path.

[0014] Compared with existing technologies, there is a thermal insulation distance between the steam flow channel and the liquid flow channel corresponding to the same evaporation chamber, and there is a thermal insulation distance between different evaporation chambers, the steam flow channels corresponding to different evaporation chambers, and the liquid flow channels corresponding to different evaporation chambers, so that there is an insulation zone. The steam in the steam flow channel and the liquid in the liquid flow channel are insulated, maintaining the steam temperature in the steam flow channel and the liquid temperature in the liquid flow channel, that is, maintaining the temperature difference between the steam flow channel and the liquid flow channel, thereby reducing thermal resistance and improving the heat transfer efficiency of the heat dissipation circulation path.

[0015] Preferably, the lateral length of the evaporation chamber is greater than the vertical length of the evaporation chamber, so that the heating device can be installed laterally, reducing the temperature difference between the upper and lower working liquids inside the evaporation chamber, making the heat dissipation of the heating device uniform in the same evaporation chamber, reducing thermal resistance, and ensuring that the thermal insulation distance between the corresponding steam flow channel and liquid flow channel in the same evaporation chamber is of sufficient length.

[0016] Preferably, multiple heat-generating devices with different heat dissipation requirements are physically sealed on the same mounting substrate using the same sealing housing.

[0017] Multiple heat-generating devices with different heat dissipation requirements within the power device area are physically sealed on the mounting substrate using the same sealed housing. This enables the spatial arrangement of heat-generating devices with different heat dissipation requirements within the cavity without the need for piping. Heat-generating devices with different heat dissipation requirements do not need to be installed and sealed separately using multiple sealed housings. Instead, they can be directly and integrally installed and sealed on the outside of the compact power module. This makes it easy to physically seal multiple heat-generating devices with different heat dissipation requirements on the mounting substrate as a whole, reducing sealing difficulty, saving time, cost and space, and further improving compact integration.

[0018] Preferably, the condenser is formed in the condenser housing, the condenser is inclined, and the flow direction of the working fluid in the condenser follows the inclination of the condenser. The plane of the inclination direction of the condenser is parallel to the surface of the mounting base plate. The condenser housing is disposed on the sealing housing to further achieve compact integration of the power module.

[0019] Preferably, the priority of the condensers is arranged according to the heat dissipation requirements of the heat-generating devices;

[0020] The condenser with high heat dissipation requirements is located at the main air inlet of the condenser shell, while the condenser with low heat dissipation requirements is located at the main air outlet of the condenser.

[0021] Preferably, the condenser housing has a duct baffle that separates different condensers, so that different condensers have independent air inlets and outlets.

[0022] Preferably, the plurality of said heating devices include power semiconductor devices and / or filter inductors.

[0023] Preferably, the mounting substrate has a heat dissipation substrate at a position corresponding to the evaporation chamber for attaching to the heat dissipation surface of the heat-generating device. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the thermosiphon heat dissipation power device of the present invention;

[0025] Figure 2 This is a schematic diagram of the vertically arranged evaporator / flow channel plate of the heating device in this invention;

[0026] Figure 3 This is a schematic diagram of the front and rear arrangement of the condenser in this invention;

[0027] Figure 4 This is a schematic diagram of the parallel air duct condenser of the present invention.

[0028] Reference numerals: 1. Condenser; 2. Steam line; 3. Liquid line; 4. Power semiconductor device; 5. First heat dissipation substrate; 6. Filter inductor; 7. Second heat dissipation substrate; 8. Mounting substrate; 9. Sealing housing; 10. Seal; 11. First liquid flow channel; 12. First evaporation zone; 13. Second liquid flow channel; 14. Second evaporation zone; 15. Second steam flow channel; 16. First steam flow channel; 17. Main air outlet; 18. Air outlet baffle; 19. Main air inlet; 20. Second heat dissipation condenser; 21. First heat dissipation condenser; 22. Power device; 23. Air duct baffle; 24. Top baffle; 25. First heat dissipation air outlet; 26. Second heat dissipation air outlet; 27. First heat dissipation air inlet; 28. Second heat dissipation air inlet. Detailed Implementation

[0029] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are based on the technical solution of the present invention and provide detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0030] The technical solutions provided by the various embodiments of the present invention are described below with reference to the accompanying drawings.

[0031] This specification presents an embodiment of a vertically distributed integrated heating element thermosiphon cooling power device, such as... Figure 1 and Figure 2 As shown, it includes a vertically placed mounting base plate 8; the mounting base plate 8 is used for vertically integrating and mounting heating devices with different heat dissipation requirements, and multiple evaporation chambers corresponding to heating devices with different heat dissipation requirements are vertically distributed inside the mounting base plate 8. Each evaporation chamber contains a heat-absorbing and vaporizing working fluid liquid; each of the multiple evaporation chambers independently corresponds to a steam line 2, a liquid line 3, a condenser 1, a steam channel and a liquid channel set in the mounting base plate 8; the condenser 1 is located above the vertically placed mounting base plate 8; the bottom end of the steam channel connects to the top of the corresponding evaporation chamber, the top end of the steam channel connects to the bottom end of the corresponding steam line 2, and the top end of the steam line 2... The top of the condenser 1 is connected to the top of the corresponding steam inlet, the bottom of the condenser 1 is connected to the top of the corresponding liquid pipeline 3, the bottom of the liquid pipeline 3 is connected to the top of the corresponding liquid flow channel, and the bottom of the liquid flow channel is connected to the bottom of the corresponding evaporation chamber. The condenser 1 and the corresponding evaporation chamber form a heat dissipation circulation path. The top of the steam flow channel and the top of the liquid flow channel are both above all the vertically distributed evaporation chambers on the mounting base plate 8, so that the heat dissipation circulation path corresponding to each evaporation chamber is insulated from the heating device corresponding to the other evaporation chambers through the steam flow channel and liquid flow channel provided inside the mounting base plate 8, so as to achieve compact integration of heating devices with different heat dissipation requirements while achieving independent heat dissipation.

[0032] Since the power module is used in a vertical position, the mounting base 8, which serves as the evaporator, is also placed vertically. Above the vertically arranged power module is a condenser and heat dissipation assembly integrated with the overall cavity of the power module. This assembly consists of a condenser 1, external steam and liquid connecting pipes, a necessary support frame, and sheet metal. The working fluid is typically a refrigerant. The steam flow channel of the mounting base 8 and the top steam inlet of the condenser 1 are welded to both ends of the steam line 2, respectively; the liquid flow channel of the mounting base 8 and the bottom liquid outlet of the condenser 1 are welded to both ends of the liquid line 3, respectively.

[0033] The heating device includes a power semiconductor device 4 and a filter inductor 6. The power semiconductor device 4 corresponds to the first liquid flow channel 11, the first vapor flow channel 16 and the first evaporation zone 12, and the filter inductor 6 corresponds to the second liquid flow channel 13, the second vapor flow channel 15 and the second evaporation zone 14.

[0034] The evaporation zones and steam / liquid channels of different types of heating elements can be independent of each other. Based on the actual arrangement of the heating elements when the power module is placed vertically, adjustments can be made to include... Figure 2 The evaporation zone and flow channel arrangement of this invention enable independent heat dissipation of different heat-generating devices within the same thermosiphon radiator, without interference between them.

[0035] According to the requirements of the internal electrical layout and energy flow of the power module, the filter inductor 6 and the power semiconductor device 4 IGBT need to be arranged on the AC side, and the power semiconductor device 4 is located above the filter inductor 6. For example, there are 6 IGBTs in total, each with a size of 111×60 and a maximum heat output of 2000W, arranged horizontally on the upper part of the substrate; there are 6 filter inductors in total, each with a heat dissipation surface size of 163×133 and a maximum heat output of 700W, arranged horizontally on the lower part of the substrate.

[0036] If multiple evaporation chambers corresponding to different heating devices are integrated onto a single substrate, all steam lines 2 and liquid return lines need to be arranged separately, resulting in multiple sets of lines extending from the back of the heat source on the substrate, thus losing compactness in the thickness direction. This invention allows the line outlets to be extended to the same side of the heat source on the top of the substrate without affecting compactness through the internal flow channels of the substrate. To ensure the sealing of the internal cavity of the power module, the evaporator / flow channel substrate should serve as the external sealing substrate for the power module cavity, sealing it with the cavity through sealing components. Components that are difficult to quickly install and seal, such as the joints between external pipelines and the evaporator / flow channel substrate, should be located outside the sealing surface of the cavity.

[0037] This invention provides a thermosiphon gas-liquid two-phase heat transfer loop to replace the traditional liquid-cooled circulation heat dissipation loop, offering a lower thermal resistance, more reliable, and compact heat dissipation method for the main heat-generating components of a power module. The heat-generating components transfer heat to the working fluid in the evaporation chamber. The working fluid absorbs heat and vaporizes. The vaporized steam enters the condenser 1 through the steam channel and steam pipeline 2. The condenser 1 condenses and liquefies the steam, and the liquefied working fluid flows back to the evaporation chamber through the liquid pipeline 3 and liquid channel. This invention, through a gravity-driven gas-liquid two-phase loop thermosiphon heat transfer cycle, can reduce the heat dissipation thermal resistance of the heat-generating components, reduce the internal temperature rise of the heat-generating components, and improve the lifespan and reliability of the power module. The integrated thermosiphon radiator of this invention is a single welded component with no moving parts, resulting in a very low risk of leakage. Even if leakage occurs, the working fluid will evaporate quickly, posing no risk to electrical insulation. The integrated thermosiphon radiator of this invention does not require liquid-cooled pipelines and fluid circulation pumps, relying entirely on gravity for circulation. This loop thermosiphon radiator of this invention solves the problems of excessively high thermal resistance and unstable heat transfer in traditional thermosiphon radiators. The substrate of this invention can serve as the mounting substrate 8 for all the main heat-generating devices of a (string) compact power module, enabling integrated and rapid installation with the power module.

[0038] In one embodiment, the evaporation chamber, the steam channel, and the liquid channel are all located on the same plane inside the mounting substrate 8, and multiple heating devices are located on the same side of the mounting substrate 8, so that the top outlet of the steam channel and the top inlet of the liquid channel are located on the surface of the heating devices on the mounting substrate 8, and the liquid line 3 and the steam line 2 are located on the same side of the heating devices on the mounting substrate 8, thereby reducing the thickness of the mounting substrate 8 while achieving the overall compact integration of the heat dissipation power device.

[0039] In one embodiment, there is a thermal insulation distance between the steam flow channel and the liquid flow channel corresponding to the same evaporation chamber, and there is a thermal insulation distance between different evaporation chambers, the steam flow channels corresponding to different evaporation chambers, and the liquid flow channels corresponding to different evaporation chambers, so as to maintain the steam temperature of the steam flow channel corresponding to each evaporation chamber and the liquid temperature of the corresponding liquid flow channel, thereby reducing thermal resistance and improving the heat transfer efficiency of the heat dissipation circulation path.

[0040] In one embodiment, the lateral length of the evaporation chamber is greater than its vertical length. This allows the heating element to be installed laterally, reducing the temperature difference between the upper and lower working fluid liquids within the evaporation chamber. This ensures uniform heat dissipation from the heating element within the same evaporation chamber, reducing thermal resistance while maintaining sufficient insulation distance between the corresponding steam and liquid channels within the same evaporation chamber. For example, the lateral length of the evaporation chamber can range from 600mm to 900mm, and the vertical length from 60mm to 80mm, ensuring that the insulation distance between the corresponding steam and liquid channels within the same evaporation chamber is at least 12mm in the lateral direction, thus meeting the insulation requirements for the steam and liquid channels within the same evaporation chamber.

[0041] In addition, heat sources of the same specifications in the same evaporation chamber should be arranged horizontally to ensure better temperature uniformity and consistency among all heat sources sharing the same evaporation area. If heat sources of the same specifications are arranged vertically in the same evaporation chamber / area, the change in gas phase composition in the vertical direction due to thermosiphon will result in a higher temperature at the top, and the temperature uniformity and consistency of the heat sources will deteriorate.

[0042] In one embodiment, the ratio of the lateral length of the evaporation chamber to the lateral length of the mounting base 8 ranges from 70% to 84%, and the ratio of the vertical length of the evaporation chamber to its lateral length ranges from 20% to 40%. The ratio of the total cross-sectional length of the steam channel and the liquid channel to the lateral length of the mounting base 8 is 12% to 25%. Within the same evaporation chamber, the ratio of the cross-sectional length of the liquid channel to the cross-sectional length of the steam channel is 30% to 50%. The thermal insulation distance between the steam rising channel and the liquid returning channel corresponding to the same evaporation chamber is at least 12 mm, and the thermal insulation distance between the heat dissipation circulation paths corresponding to different evaporation chambers should also be at least 12 mm to meet the insulation requirements.

[0043] In one embodiment, multiple heat-generating devices with different heat dissipation requirements are physically sealed on the same mounting substrate 8 using the same sealing housing 9. The sealing housing 9 of the power device 22 of the present invention can be integrally mounted on the outside of a compact power module. The contact area between the mounting substrate 8 and the sealing housing 9 is sealed with a sealing element 10, which is a sealing gasket and / or sealing foam.

[0044] In one embodiment, the condenser 1 is formed in the condenser housing, the condenser 1 is inclined, and the flow direction of the working fluid in the condenser 1 follows the inclination of the condenser 1. The plane containing the inclination direction of the condenser 1 is parallel to the surface of the mounting substrate 8. The condenser housing is disposed on the sealing housing 9 to further achieve compact integration of the power module. The sealing housing 9 is the outer housing of the power device 22. The condenser 1 includes a second heat dissipation condenser 20 corresponding to the filter inductor 6 and a first heat dissipation condenser 21 corresponding to the power semiconductor device 4.

[0045] In one embodiment, the priority of the condensers 1 is arranged according to the heat dissipation requirements of the heat-generating devices; the condensers 1 with high heat dissipation requirements are set at the main air inlet 19 of the condenser housing, and the condensers 1 with low heat dissipation requirements are set at the main air outlet 17 of the condenser 1.

[0046] The condenser 1 assembly is located above the power module body, realizing the return of liquid working fluid after heat dissipation and condensation. The first heat dissipation condenser 21 and the second heat dissipation condenser 20 belong to two thermosiphon heat dissipation circulation loops, which are respectively connected to their respective evaporation and circulation areas on the evaporator / flow channel substrate through external steam / liquid pipelines.

[0047] To ensure the lowest possible temperature rise in the power semiconductor module, which is most sensitive to temperature, the first heat dissipation condenser 21 is positioned at the very front of the overall heat dissipation duct, closest to the duct inlet, ensuring that the incoming airflow, closest to ambient temperature, cools the power semiconductor module. Behind the first heat dissipation condenser 21, a second heat dissipation condenser 20 is positioned to maximize the utilization of the space available for heat dissipation.

[0048] Air baffles 18 are arranged on the side of the condenser 1 in the upper cavity and at the interval between the two condensers 1 to ensure that the airflow direction of the air-cooled heat dissipation is strictly controlled. Figure 3 The airflow enters through the inlet and exits through the outlet, passing sequentially through the first condenser 21 and the second condenser 20.

[0049] In one embodiment, the condenser housing has a duct baffle that separates different condensers 1, so that different condensers 1 have independent air inlets and outlets.

[0050] The condenser 1 is located above the power module body, realizing the return of liquid working fluid after heat dissipation and condensation. The first heat dissipation condenser 21 and the second heat dissipation condenser 20 belong to two thermosiphon heat dissipation circulation loops, which are respectively connected to their respective evaporation and circulation areas on the evaporator / flow channel substrate through external steam / liquid pipelines.

[0051] To ensure the heat dissipation temperature of filter inductor 6, it is advisable to follow this embodiment and connect both the intake and exhaust areas through... Figure 4 The air duct baffle, top baffle 24 and side baffle shown are separated to ensure that the first heat dissipation condenser 21 and the second heat dissipation condenser 20 have independent heat dissipation air ducts, but can share the heat dissipation fan assembly, that is, having a first heat dissipation air outlet 25, a first heat dissipation air inlet 27, a second heat dissipation air outlet 26 and a second heat dissipation air inlet 28.

[0052] In one embodiment, the plurality of heat-generating devices include a power semiconductor device 4 and / or a filter inductor 6.

[0053] In one embodiment, a heat dissipation substrate on the mounting substrate 8, at a position corresponding to the evaporation chamber, is used to attach the heat dissipation surface of the heat-generating device.

[0054] In one embodiment, the condenser 1 is inclined, and the flow direction of the working fluid in the condenser 1 follows the inclination of the condenser 1 to increase the heat dissipation contact area. The heat dissipation condenser 1 should be arranged at an inclination to maximize space utilization while achieving good reflux of the liquid working fluid after condensation.

[0055] In one embodiment, a heat dissipation substrate for attaching a heat dissipation surface of a heat-generating device is disposed on the mounting substrate 8 at a position corresponding to the evaporation chamber. The heat dissipation substrate is thermal grease and / or a thermal pad. The first heat dissipation substrate 5 corresponds to the power semiconductor device 4, and the second heat dissipation substrate 7 corresponds to the filter inductor 6.

[0056] All heat-generating devices that require heat dissipation through this heat dissipation component have their heat dissipation substrate (heat dissipation surface) vertically mounted on the evaporation area of ​​the evaporator substrate, making good thermal contact with the evaporation area of ​​the evaporator, including but not limited to thermal grease, thermal pads, etc.

[0057] The principle of this invention is as follows: the heating element is installed within the evaporation zone of the evaporator. The circulating working fluid within the evaporation zone absorbs heat and vaporizes, entering the condenser 1 through the vapor channel / pipeline. The condenser 1 dissipates heat to the external environment, and the working fluid re-liquefies into liquid, replenishing the evaporation zone through the liquid pipeline 3 / channel, thus achieving a heat transfer cycle. This invention uses thermosiphon cooling instead of liquid cooling in a compact power module to dissipate heat from the main heating elements. In the power device 22, this invention integrates different heat sources onto a single evaporator / channel substrate, making full use of the substrate, saving costs, reducing the volume of heat dissipation components, and increasing compactness. The evaporator / channel substrate of this invention allows for direct external mounting and sealing of the power device 22, serving as the mounting substrate 8 of the power device 22, simplifying the installation process. This invention integrates the external heat sink with the power module cavity structure into a single integrated frame.

[0058] Under stable operation and overload conditions, the high heat generation of high-power semiconductor devices 4, whether stable or short-term, can be mitigated by the lower thermal resistance proposed in this invention, resulting in lower internal temperature rise, improved device reliability, extended device lifespan, and a wider operating temperature range for power modules. This result can be demonstrated by comparing the junction temperature of power semiconductor devices 4 using traditional liquid cooling methods under different ambient temperatures and power module operating conditions.

[0059] This solution eliminates the need for a pump-driven cooling circuit with moving parts in principle, and the gas-liquid two-phase heat transfer circuit is integrally welded and sealed. Compared with traditional liquid-cooled compact power modules, it reduces the cooling pump circuit, eliminates the need for on-site coolant filling, and reduces the electrical insulation risks caused by leaks.

[0060] The specific structure of this invention allows for independent heat dissipation of the main heat-generating components in the power module within the same heat sink, meeting diverse heat dissipation requirements. Furthermore, the heat sink structure of this invention is more suitable for integrated installation of the power module, resulting in a more compact structure.

[0061] This invention allows for the independent cooling of multiple heat sources with different temperatures and heat dissipation capacities within a compact area by setting up multiple independent regions on a single evaporator and flow channel substrate. The design of the internal flow channel and evaporator on the same substrate enables a space arrangement within the cavity without the need for piping, achieving greater compactness, and also making it easier to physically seal the same substrate within the power module cavity.

[0062] The preferred embodiments of the present invention have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of the present invention without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of the present invention through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A vertically distributed integrated heating element thermosiphon heat dissipation power device, characterized in that, The system includes a vertically placed mounting base; heating elements with different heat dissipation requirements are vertically integrated on the mounting base, and multiple evaporation chambers, each corresponding to a heating element with a different heat dissipation requirement, are vertically distributed inside the mounting base. Each evaporation chamber contains a heat-absorbing and vaporizing working fluid; each of the multiple evaporation chambers independently corresponds to a steam pipeline, a liquid pipeline, a condenser, a steam channel disposed within the mounting base, and a liquid channel disposed within the mounting base; the condensers are all located above the vertically placed mounting base; the bottom end of each steam channel connects to the top of the corresponding evaporation chamber, and the top end of each steam channel connects to the bottom end of the corresponding steam pipeline. The top end of the steam pipeline is connected to the top steam inlet of the corresponding condenser, the bottom liquid outlet of the condenser is connected to the top end of the corresponding liquid pipeline, the bottom end of the liquid pipeline is connected to the top end of the corresponding liquid flow channel, and the bottom end of the liquid flow channel is connected to the bottom of the corresponding evaporation chamber. The condenser and the corresponding evaporation chamber form a heat dissipation circulation path. The top of the steam flow channel and the top of the liquid flow channel are both above all the vertically distributed evaporation chambers on the mounting base, so that the heat dissipation circulation path corresponding to each evaporation chamber is insulated from the heating device corresponding to the other evaporation chambers by the steam flow channel and liquid flow channel provided inside the mounting base.

2. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to claim 1, characterized in that, The evaporation chamber, steam channel, and liquid channel are all located on the same plane inside the mounting base, and multiple heating devices are located on the same side of the mounting base, so that the top outlet of the steam channel and the top inlet of the liquid channel are located on the side of the heating device on the mounting base, and the liquid pipeline and steam pipeline are located on the same side of the heating device on the mounting base.

3. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to claim 2, characterized in that, There is a thermal insulation distance between the steam flow channel and the liquid flow channel corresponding to the same evaporation chamber, and there is a thermal insulation distance between different evaporation chambers, the steam flow channels corresponding to different evaporation chambers, and the liquid flow channels corresponding to different evaporation chambers, so as to maintain the steam temperature of the steam flow channel corresponding to each evaporation chamber and the liquid temperature of the corresponding liquid flow channel.

4. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to claim 3, characterized in that, The lateral length of the evaporation chamber is greater than the vertical length of the evaporation chamber, so that the heating device can be installed laterally.

5. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to any one of claims 1 to 4, characterized in that, Multiple heat-generating devices with different heat dissipation requirements are physically sealed on the same mounting substrate using the same sealing housing.

6. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to claim 5, characterized in that, The condenser is formed in the condensation shell, the condenser is inclined, and the flow direction of the working fluid in the condenser follows the inclination of the condenser. The plane of the inclination direction of the condenser is parallel to the surface of the mounting base plate, and the condensation shell is disposed on the sealing shell.

7. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to claim 6, characterized in that, The priority of the condensers is arranged according to the heat dissipation requirements of the heat-generating devices; The condenser with high heat dissipation requirements is located at the main air inlet of the condenser shell, while the condenser with low heat dissipation requirements is located at the main air outlet of the condenser.

8. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to claim 6, characterized in that, The condenser housing has a baffle plate that separates different condensers, so that different condensers have independent air inlets and outlets.

9. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to any one of claims 1 to 4, characterized in that, The plurality of said heat-generating devices include power semiconductor devices and / or filter inductors.

10. The vertically distributed integrated heating element thermosiphon heat dissipation power device according to any one of claims 1 to 4, characterized in that, The mounting substrate has a heat dissipation substrate at the position corresponding to the evaporation chamber for attaching to the heat dissipation surface of the heat-generating device.

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