Outer circuit vacuum two-fluid etching system

Abstract

The present application relates to printed circuit manufacturing equipment technical field, and discloses a kind of outer layer circuit vacuum two-fluid etching systems, including conveying belt, and the correction mechanism for the side of substrate that enters the inside of etching part is positioned on the import side of conveying belt, and the correction mechanism includes the fixed plate being arranged in the inner wall of etching part, and the positioning plate is fixedly connected with the side of fixed plate, and the inner wall of fixed plate is provided with the positioner, and the positioner includes the fixed shaft being fixedly arranged in the inner wall of fixed plate, and the sliding slot is opened in the outer wall of fixed shaft, and the sliding block is slidably connected in the inner wall of sliding slot, and the end of sliding block away from sliding slot is fixedly connected with the rectification plate.The present application is provided with correction mechanism, and by the self-adapting rectification, flexible limiting and full-process posture constraint design of correction mechanism, substrate can be accurately aligned before entering etching part, and full-process maintains median stable operation, avoids the problems such as uneven spraying, serious line side etching, excessively large line width deviation caused by substrate deviation.

Description

Technical Field

[0001] This invention relates to the field of printed circuit manufacturing equipment technology, and specifically to a vacuum two-fluid etching system for outer layer circuits. Background Technology

[0002] To meet the production needs of high-end PCBs, achieve uniform etching of fine lines on the outer layer, and improve the consistency of the etching factor of the circuit with the whole board, the etching solution is mixed with compressed air in the nozzle to form 5-20μm fine gas-liquid mixed droplets, which are sprayed at high speed onto the surface of the outer layer of the copper-clad laminate. The droplets have a large specific surface area and can penetrate into the gaps between fine lines to reduce side etching. At the same time, the vacuum pumping unit of the etching section forms a local negative pressure to remove reaction waste liquid, copper ions and excess mist in real time. In a vacuum two-fluid etching machine with a modular "spray-suction-spray" layout, the independent spray system and vacuum pumping system of each etching module operate alternately, resulting in periodic pressure fluctuations. This alternating pressure causes the substrate to bounce up and down and swing left and right during transport, leading to dynamic alignment deviations between the substrate and the upper and lower spray cavities. At the same time, the difference in droplet impact angles in different areas of the board surface increases significantly, resulting in severely uneven droplet coverage and an uneven "wavy" etching morphology on the sidewalls of the circuit, affecting the processing quality of precision circuits. Summary of the Invention

[0003] To address the aforementioned shortcomings of existing technologies, this invention provides an outer layer circuit vacuum two-fluid etching system that effectively solves the problem in existing technologies where periodic pressure fluctuations cause dynamic substrate misalignment and droplet impact angle differences, ultimately leading to severely uneven droplet coverage.

[0004] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a vacuum two-fluid etching system for outer layer circuits, comprising: The etching section has a spraying component for spraying etching solution at its top and a conveyor belt for transporting substrates at its bottom center. The conveyor belt inlet side has a correction mechanism for limiting the side of the substrate entering the etching section, and the conveyor belt outlet side has a guide component. The correction mechanism includes a fixed plate disposed on the inner wall of the etching section, a positioning plate fixedly connected to the side of the fixed plate, an adjusting component disposed on the inner wall of the fixed plate, the adjusting component including a fixed shaft fixedly disposed on the inner wall of the fixed plate, a sliding groove circumferentially opened on the outer wall of the fixed shaft, a slider slidably connected to the inner wall of the sliding groove, and a correction plate fixedly connected to the end of the slider away from the sliding groove. The positioning plate has a corrective component on its inner wall, and a limiting component is provided at the end of the corrective component away from the adjusting component. The limiting component is flush with the outer wall of the corrective plate.

[0005] Furthermore, the outer wall of the positioning plate adopts an arc-shaped design, and a circular groove is provided at one end of the positioning plate near the fixed shaft. The inner wall of the circular groove is slidably connected to the outer wall of the fixed shaft, and the inner wall of the circular groove is fixedly connected to one end of the slider.

[0006] Furthermore, a limiting groove is provided at the end of the positioning plate away from the fixed axis, and the inner wall of the limiting groove fits against the limiting component.

[0007] Furthermore, the limiting component includes a limiting plate with an arc-shaped design that fits against the inner wall of the limiting groove, and a rubber strip is fixedly connected to the other end of the limiting plate, the rubber strip being fixedly connected to another limiting plate.

[0008] Furthermore, an arc plate is fixedly connected to the middle of one end of the limiting plate near the rubber strip. The arc plate adopts a gradient arc design, and a groove is opened in the middle of the rubber strip.

[0009] Furthermore, the corrective component includes a corrective plate that fits against the limiting plate. The corrective plate adopts an L-shaped design and is symmetrical and stacked vertically. The short rods of the two corrective plates are elastically connected by a spring. A positioning block is fixedly connected to the outside of the corrective plate. A spring is elastically connected to the end of the positioning block away from the spring. The spring is connected to the inner wall of the etched part.

[0010] Furthermore, the corrective component also includes a crank, a knob spring is provided in the middle of the crank, and the crank is symmetrically designed.

[0011] Furthermore, the flow guide includes an elliptical plate disposed at the bottom center of the etching section outlet. A positioning shaft is fixedly connected to the inner wall of the elliptical plate, and connecting plates are fixedly connected to both ends of the positioning shaft. The end of the connecting plate away from the positioning shaft is embedded in the inner wall of the positioning frame. The positioning frame is designed as a parallelogram, and connecting rods are provided at both ends of the outer wall of the positioning frame.

[0012] The technical solution provided by this invention has the following advantages compared with the prior art: The present invention is equipped with a correction mechanism. Through the adaptive correction, flexible limiting and full-process posture constraint design of the correction mechanism, the substrate can be accurately corrected before entering the etching section, and the substrate can maintain stable operation in the middle position throughout the process. This avoids problems such as uneven spraying, severe side etching of lines and excessive line width deviation caused by substrate offset.

[0013] This application is equipped with a flow guide. Through the attitude adjustment design of the flow guide, the substrate is tilted at a gentle angle during discharge. The etching residue is guided and recycled by gravity, which prevents the residue from remaining on the substrate surface and in the gaps of the circuit. This avoids secondary chemical corrosion of the circuit by the residue and ensures the molding quality of the outer circuit. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; Figure 2 This is a schematic diagram of the correction mechanism structure according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the adjusting component structure according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the limiting component structure according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the corrective component structure according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the flow guide structure according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the positioning shaft structure according to an embodiment of the present invention.

[0016] The labels in the diagram represent: 1. Etching section; 2. Conveyor belt; 3. Spraying component; 4. Correction mechanism; 41. Fixing plate; 42. Adjusting component; 421. Correction plate; 422. Limiting groove; 423. Circular groove; 424. Slider; 425. Slide groove; 426. Fixing shaft; 43. Positioning plate; 44. Correcting component; 441. Correcting plate; 442. Spring 1; 443. Positioning block; 444. Spring 2; 445. Crank; 45. Limiting component; 451. Limiting plate; 452. Arc plate; 453. Groove bar; 454. Rubber strip; 5. Guide component; 51. Positioning shaft; 511. Connecting plate; 513. Positioning frame; 514. Connecting rod; 52. Elliptical plate. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0018] The present invention will be further described below with reference to embodiments.

[0019] Example:

[0020] Please see Figures 1-7 This invention provides a technical solution for a vacuum two-fluid etching system for outer layer circuits: refer to Figure 1 and Figure 2 The etching section 1 serves as the core sealed cavity, providing a stable process environment for vacuum two-fluid etching operations. This prevents leakage after the etching solution atomizes and avoids interference from external airflow on etching accuracy. It also facilitates maintaining a vacuum negative pressure state within the cavity, laying the foundation for precision etching. At the top of the etching section 1, spray elements 3 are neatly arranged. These elements are linked with the vacuum pumping system and etching solution circulation system within the cavity, employing a special atomization structure design to fully mix the etching solution with the compressed airflow, forming uniform and fine gas-liquid mixed droplets. This ensures that the etching solution evenly covers the substrate surface, avoiding etching differences caused by uneven spraying. A conveyor belt 2 is located at the bottom center of the etching section 1. Centered with the centerline of the etching section 1 cavity, the conveyor belt 2 serves as the core carrier for substrate transport. Its surface features an anti-slip and wear-resistant design, effectively preventing slippage and displacement of the substrate during transport. It also provides stable and uniform speed transport characteristics, ensuring the substrate passes through the etching area at a constant speed, guaranteeing consistent etching time.

[0021] A correction mechanism 4 is installed on the inlet side of conveyor belt 2, and a guide component 5 is installed on the outlet side, forming a full-process control structure of "feeding correction - etching operation - discharge guidance". This front-to-back coordinated layout design eliminates problems such as substrate misalignment and residual liquid retention from the source, eliminating the need for additional auxiliary equipment, simplifying the overall system structure, and improving the continuity of operation. The special layout design of the overall system has the core advantages of compact structure and high integration. It can achieve functional upgrades without significantly modifying the basic architecture of the original etching equipment, adapting to the transformation needs of existing production lines. The rational layout of each component and the continuous operation process reduce the dwell time of the substrate during the transmission process and improve production efficiency. The closed etching section 1, combined with a precise spray and transmission structure, provides a stable process guarantee for the precision etching of the outer layer circuitry, effectively improving etching accuracy and product consistency.

[0022] The correction mechanism 4, as the core correction unit before the substrate enters the etching section 1, adopts a composite structure design of "fixed reference + adjustable correction + flexible limit". The whole is composed of a fixed plate 41, an adjustment component 42, a positioning plate 43, a correction component 44 and a limit component 45. The special design of each sub-component works together to achieve precise centering correction of the substrate.

[0023] The fixing plate 41 is made of rigid material and is firmly embedded in the inner wall of the cavity of the etching part 1. It serves as the installation reference for the entire correction mechanism 4. Its special fixing method ensures the stability of its position and will not loosen or deform during long-term operation. It provides a stable assembly support for components such as the adjusting component 42 and the positioning plate 43, avoiding correction deviations caused by its own displacement. The positioning plate 43 is fixedly connected to the side of the fixing plate 41. The positioning plate 43 is perpendicularly connected to the fixing plate 41 to form a frame structure, which is used to support the correction component 44 and the limiting component 45. Its special frame design ensures that the relative positions of each correction component are constant, ensuring the uniformity of the correction reference.

[0024] refer to Figure 2 and Figure 3 The adjusting component 42 adopts a sliding fit structure of "shaft-groove-block" and is the core component for realizing the self-adaptive positioning of the substrate. The fixed shaft 426 is fixedly installed on the inner wall of the fixed plate 41, and a continuous sliding groove 425 is opened on the outer wall. The sliding groove 425 adopts a smooth arc groove design. The slider 424 is fitted into the inner wall of the sliding groove 425 and can slide freely along the groove without jamming or getting stuck. The end of the slider 424 away from the sliding groove 425 is fixedly connected to the positioning plate 421. This special sliding fit design allows the positioning plate 421 to achieve circumferential position fine adjustment with the fixed shaft 426 as a reference, which overcomes the limitation of traditional fixed baffles that cannot be adjusted. It can adaptively adjust its position according to the offset of the substrate to ensure precise contact with the side of the substrate.

[0025] The alignment plate 421 adopts an arc-shaped outer wall design, abandoning the traditional right-angled structure. The arc-shaped outer wall can smoothly fit with the side of the substrate, avoiding the hard edges from squeezing and scratching the substrate edge, surface dry film, and circuit patterns. At the same time, it reduces the resistance when the substrate enters, achieving a smooth introduction. A circular groove 423 is opened at one end of the alignment plate 421 near the fixed shaft 426. The inner wall of the circular groove 423 forms a nested sliding fit with the outer wall of the fixed shaft 426. At the same time, the inner wall of the circular groove 423 is fixedly connected to the end of the slider 424. This double-fit structure greatly improves the coaxiality and stability of the alignment plate 421 during the movement process, ensuring that the alignment plate 421 will not shift or wobble during the adjustment process, thus guaranteeing the correction accuracy. A limiting groove 422 is provided at the end of the alignment plate 421 away from the fixed axis 426. The limiting groove 422 adopts a groove structure that is compatible with the limiting member 45, which can achieve precise embedded fitting with the limiting member 45. This ensures that after the alignment plate 421 is adjusted to the correct position, it remains flush with the limiting member 45, maintaining the benchmark uniformity of the substrate positioning and correction, and avoiding correction deviations.

[0026] refer to Figure 2 and Figure 5The limiting component 45 adopts a flexible arc-shaped composite design, specifically for the smooth introduction and flexible limiting of the substrate. Its core consists of a limiting plate 451, an arc plate 452, a groove 453, and a rubber strip 454. The limiting plate 451 adopts an arc-shaped design, which precisely fits the inner wall of the limiting groove 422 at the end of the straightening plate 421, achieving a seamless structural connection and ensuring the coordination of limiting and straightening actions. The rubber strip 454 is fixedly connected between the two sets of symmetrically arranged limiting plates 451. The rubber strip 454 is made of flexible and wear-resistant material with good elastic deformation capability. This special material and connection design can provide adaptive buffer space for substrates of different widths, avoiding substrate compression deformation caused by rigid limiting, while reducing friction between the substrate and the limiting component 45 and protecting the substrate surface.

[0027] A limiting plate 451 is fixedly connected to an arc plate 452 at the middle of one end near the rubber strip 454. The arc plate 452 adopts a streamlined design with a gradually tapering arc shape, forming a gently converging guide slope from the outside in. This special design allows the offset substrate to slide smoothly into the center position along the slope of the arc plate 452, achieving impact-free correction and avoiding hard collisions between the substrate and the limiting component 45, further protecting the substrate edge and dry film. A groove 453 is provided in the middle of the rubber strip 454. The groove 453 provides sufficient space for the deformation, contraction, and extension of the rubber strip 454, further improving the self-adaptability of the limiting structure. It can flexibly accommodate substrates of various widths and specifications, enabling multi-specification production without changing the limiting components, greatly improving the versatility of the equipment.

[0028] refer to Figure 2 and Figure 5 The correction component 44 adopts a composite structure design of "elastic linkage + manual fine adjustment" to achieve full-process posture constraint of the substrate. Its core consists of a correction plate 441, spring one 442, positioning block 443, spring two 444, and crank 445. The correction plate 441 adopts an L-shaped structure design, with multiple sets of correction plates 441 arranged symmetrically and stacked vertically to form an enclosed limiting correction space. This allows for multi-dimensional posture constraint of the substrate from above, below, and sides, preventing vertical jumping and horizontal displacement during transmission. The short rods of two correction plates 441 are elastically connected by spring one 442. Relying on the elastic extension and contraction characteristics of spring one 442, the spacing between the correction plates 441 can be autonomously and adaptively adjusted, flexibly adapting to substrates of different thicknesses and achieving precise positioning without manual spacing adjustment.

[0029] The positioning block 443 is fixedly connected to the outside of the correction plate 441. The end of the positioning block 443 away from the first spring 442 is elastically connected to the second spring 444. The other end of the second spring 444 is fixedly connected to the inner wall of the etching part 1. This double-spring elastic layout design can form a bidirectional elastic buffer adjustment mechanism. The second spring 444 can effectively dissipate the lateral thrust caused by the spray airflow and vacuum negative pressure fluctuation inside the etching cavity, suppress the offset and shaking of the substrate during operation, and continuously maintain the center running accuracy of the substrate. At the same time, the elastic action of the first spring 442 and the second spring 444 can avoid hard contact between the correction plate 441 and the substrate, further protecting the substrate surface. The straightening component 44 also includes a symmetrically designed crank 445 with a knob spring in the middle. This special design allows for manual fine-tuning of the reference position of the straightening plate 441 through the crank 445 to adapt to the straightening requirements of different substrate specifications. It also enables automatic reset and position self-locking after adjustment by relying on the knob spring, ensuring that the straightening reference will not shift on its own during long-term mass production, reducing the frequency of manual recalibration and lowering the difficulty of equipment operation and maintenance.

[0030] The core advantage of the specially designed calibration mechanism 4 lies in its integrated calibration function of "adaptive alignment + flexible limiting + full-process constraint". It can accurately solve the problems of substrate misalignment and unstable centering while protecting the substrate surface from damage. The adjustable and flexible design of each component allows the equipment to flexibly adapt to substrates of various specifications, making it highly versatile. The purely mechanical structure design eliminates the need for complex electronic control components, resulting in a reliable structure, low failure rate, and easy daily maintenance. The high calibration accuracy ensures that the substrate always maintains a centered position, providing a stable foundation for subsequent precision etching.

[0031] refer to Figure 1 , Figure 6 and Figure 7 The guide component 5 serves as the attitude adjustment and residual liquid drainage unit after the substrate is etched. It adopts a special structural design of "linkage attitude adjustment + smooth flow guidance". The core is composed of positioning shaft 51, connecting plate 511, positioning frame 513, connecting rod 514 and elliptical plate 52. It is specifically used to solve the problem of residual liquid retention when the substrate is discharged, while protecting the safety of substrate discharge.

[0032] An elliptical plate 52 is located at the bottom center of the etching section 1 exit. It features a smooth, rounded curved surface, abandoning the traditional right-angled ejection plate structure. This unique design prevents the substrate edges from impacting the ejection plate during ejection, protecting the substrate's molding circuitry and substrate integrity. Simultaneously, the smooth curved surface reduces resistance during ejection, ensuring smooth substrate delivery. A positioning shaft 51 is fixedly connected to the inner wall of the elliptical plate 52, penetrating the entire elliptical plate 52. This shaft serves as a fixing and linkage reference for the elliptical plate 52. Connecting plates 511, made of rigid material, are fixed at both ends to ensure the stability of the connection between the positioning shaft 51 and the elliptical plate 52, preventing loosening or detachment during operation.

[0033] The end of the connecting plate 511 furthest from the positioning shaft 51 is embedded in the inner wall of the positioning frame 513. The positioning frame 513 adopts a parallelogram structure design. The parallelogram frame has flexible deformation and fine-tuning characteristics, with no dead points in mechanical movement, and can smoothly achieve adaptive changes in angle and height. This special structural design is different from traditional fixed or hinged attitude adjustment structures, which can achieve smooth attitude adjustment at the discharge end and avoid impact on the substrate during attitude adjustment. Connecting rods 514 are provided at both ends of the outer wall of the positioning frame 513. The connecting rods 514 are rigidly connected to the positioning frame 513. As the core component of the attitude adjustment operation, pushing the connecting rods 514 can drive the positioning frame 513 to produce parallelogram deformation, which in turn drives the positioning shaft 51 and the elliptical plate 52 to move synchronously through the connecting plate 511, realizing the raising and angle adjustment of the discharge end side of the etching part 1.

[0034] The core advantages of the special design of the guide component 5 are its simple structure and convenient operation. It does not require a complex electronic lifting mechanism and can achieve the posture adjustment of the discharge end through mechanical linkage. It is cost-effective and highly reliable. The design of the parallelogram positioning frame 513 makes the posture adjustment process smooth and impact-free. It can flexibly adjust the tilt angle according to the characteristics of the substrate to adapt to the residual liquid drainage needs of different substrates. The curved surface design of the elliptical plate 52 effectively protects the safety of substrate discharge and avoids damage to the plate edge. The gravity drainage of residual liquid is achieved through posture adjustment, which can completely solve the problem of residual liquid retention. At the same time, the structure is durable, not easy to fail, and suitable for long-term continuous mass production operations.

[0035] After the preliminary preparations are completed, the equipment is started and enters normal operation. The PCB substrate is fed into the feeding end of the equipment at a uniform speed from the previous process and gradually enters the working area of ​​the correction mechanism 4. If the substrate has a lateral offset, the edge of the substrate will first contact the arc plate 452 of the limiting member 45. Since the arc plate 452 adopts a streamlined design with a gradual arc shape, the substrate will gradually slide towards the center along the gentle slope of the arc plate 452. The process is smooth and impact-free, avoiding hard collisions between the substrate edge and the limiting member 45. At the same time, the substrate edge will fit against the arc-shaped outer wall of the correction plate 421, pushing the correction plate 421 to make adaptive position fine adjustments along the sliding groove 425 outside the fixed shaft 426 via the slider 424. The circular groove 423 slides smoothly along the outer wall of the fixed shaft 426, ensuring that the movement trajectory of the correction plate 421 is regular and there will be no offset or jamming, until the correction plate 421 is completely in contact with the side of the substrate, realizing the initial correction of the substrate.

[0036] During the initial alignment of the substrate, the L-shaped alignment plate 441 of the alignment component 44, under the elastic action of spring 442, adaptively conforms to the upper and lower sides of the substrate, automatically adjusting the spacing according to the substrate thickness to achieve vertical constraint on the substrate. Spring 444 provides lateral elastic support to the overall alignment plate 441, effectively dissipating the lateral thrust caused by the spray airflow and vacuum negative pressure fluctuations inside the etching chamber, and suppressing the offset and shaking of the substrate during operation. If the substrate specifications change, the operator can manually fine-tune the reference position of the alignment plate 441 by rotating the crank 445. After the fine-tuning is completed, the crank 445 automatically locks its position by the knob spring in the middle, ensuring that the alignment reference will not shift on its own and maintaining the alignment accuracy. After multi-dimensional alignment by the alignment mechanism 4, the substrate is precisely positioned on the center track of the conveyor belt 2 and smoothly conveyed into the etching section 1.

[0037] After being aligned by the calibration mechanism 4, the substrate is fed uniformly into the core working area inside the etching section 1 by the conveyor belt 2. At this time, the vacuum negative pressure system of the etching section 1 is activated to maintain a stable negative pressure environment. Simultaneously, the spraying element 3 starts working, uniformly spraying premixed gas-liquid mixture droplets onto the substrate surface to perform vacuum two-fluid etching on the outer copper foil circuitry of the substrate. Because the substrate maintains a stable, neutral position throughout the process, the spraying distance and angle between each area of ​​the board and the spraying element 3 remain consistent. The etching solution droplets can uniformly cover the entire board surface. Combined with the vacuum negative pressure inside the etching section 1, waste liquid and excess mist are promptly removed, effectively suppressing the pooling effect, reducing lateral etching of the circuitry, and ensuring a uniform and stable etching process. During the etching operation, the calibration mechanism 4 constantly constrains and limits the operating posture of the substrate to prevent it from shifting or shaking due to airflow disturbances, ensuring etching accuracy.

[0038] After the substrate completes the etching process, it continues to be conveyed by conveyor belt 2 to the outlet of etching section 1, entering the working area of ​​guide member 5. The operator can adjust the substrate thickness and residual liquid adhesion by pushing connecting rod 514 to cause the positioning frame 513 to deform into a parallelogram. The positioning frame 513, through connecting plate 511, drives the positioning shaft 51 to move synchronously with the elliptical plate 52, thereby achieving a gentle lift on the discharge end of etching section 1, resulting in a gentle tilt angle when the substrate is sent out. While the substrate is tilted, residual etching liquid remaining on the board surface and in the line gaps will naturally flow and converge towards a lower position under gravity. Dripping residual liquid is collected and treated uniformly by the equipment's preset collection structure, preventing it from randomly scattering and contaminating conveyor belt 2, equipment frame, and subsequent substrates. The substrate smoothly transitions through the smooth curved surface of elliptical plate 52 and is successfully sent out of etching section 1, completing a single etching cycle.

[0039] The unique design of this device first and foremost completely solves the problems of substrate entry misalignment and unstable centering operation, effectively improving etching accuracy and product consistency. Through the adaptive alignment, flexible limiting, and full-process attitude constraint design of the correction mechanism 4, the substrate can be precisely aligned before entering the etching section 1, maintaining stable centering operation throughout the process. This avoids problems such as uneven spraying, severe side etching of circuits, and excessive linewidth deviation caused by substrate misalignment. The etching liquid droplets sprayed by the spraying component 3 can evenly cover the entire substrate surface, resulting in a more consistent etching rate across different areas. The etching uniformity of the outer layer circuits is significantly improved, the circuit sidewalls are steeper, effectively suppressing side etching, and the linewidth dimension control accuracy is greatly optimized. This can reliably meet the production requirements of high-end precision circuit boards, significantly reducing product scrap and rework rates caused by insufficient etching accuracy.

[0040] Secondly, it solves the problem of scratching the substrate caused by traditional rigid limiting structures, effectively protecting the substrate surface quality. The alignment plate 421 and limiting component 45 of the calibration mechanism 4 both adopt an arc-shaped design, combined with the flexible material of the rubber strip 454, achieving smooth and flexible contact between the substrate and the limiting component. This avoids problems such as edge scratches, dry film damage, and circuit extrusion deformation caused by traditional rigid limiting structures, ensuring the substrate surface remains intact and further improving product yield. At the same time, the flexible contact design reduces frictional loss between components, extends the service life of each component of the calibration mechanism 4, and reduces equipment maintenance costs.

[0041] Third, it solves the problem of poor equipment adaptability, greatly improving the equipment's versatility and production flexibility. The elastic adjustable structure and sliding correction design of the correction mechanism 4 can adaptively adapt to various PCB substrates of different widths and thicknesses. It can achieve continuous production of multiple specifications of substrates without changing tooling parts or frequently adjusting equipment parameters, greatly improving the equipment's versatility. The adjustable posture design of the guide component 5 can flexibly adjust the tilt angle of the discharge end according to the residual liquid adhesion of different substrates, adapting to the residual liquid drainage requirements of different substrates, further improving production flexibility and reducing the time and labor costs of production changeover.

[0042] Fourth, it completely solves the problem of residual liquid retention during substrate unloading, avoiding the risks of secondary corrosion and equipment contamination. Through the attitude adjustment design of the guide component 5, the substrate is tilted at a gentle angle during unloading, relying on gravity to achieve directional flow and recycling of etching residue, eliminating the retention of residue on the substrate surface and in the gaps of the circuit, avoiding secondary chemical corrosion of the circuit by the residue, and ensuring the forming quality of the outer layer circuit; at the same time, the residue is collected and treated uniformly, and will not drip onto the conveyor belt 2 or the equipment frame, effectively avoiding corrosion of equipment components and cross-contamination in production, improving the production environment, and extending the service life of the entire etching equipment.

[0043] In addition, the system also solves the problem of substrate jumping and hitting the inner wall of the cavity caused by airflow disturbance in traditional etching equipment. Relying on the double spring elastic buffer structure of the straightener 44, the external force brought by airflow disturbance is effectively eliminated, the running posture of the substrate is constrained, and the probability of the substrate being damaged and scrapped is reduced. At the same time, the self-locking reset design of the crank 445 reduces the frequency of manual repeated calibration, further reduces the workload of operators, and improves the convenience of equipment operation and maintenance.

[0044] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum two-fluid etching system for outer layer circuitry, characterized in that, include: An etching section (1) is provided with a spraying component (3) for spraying etching liquid at the top inside the etching section (1), a conveyor belt (2) for transporting substrates is provided at the middle of the bottom inside the etching section (1), a correction mechanism (4) for limiting the side of the substrate entering the etching section (1) is provided on the inlet side of the conveyor belt (2), and a guide component (5) is provided on the outlet side of the conveyor belt (2). The correction mechanism (4) includes a fixing plate (41) disposed on the inner wall of the etching part (1), a positioning plate (43) is fixedly connected to the side of the fixing plate (41), and an adjusting component (42) is disposed on the inner wall of the fixing plate (41). The adjusting component (42) includes a fixing shaft (426) fixedly disposed on the inner wall of the fixing plate (41). A groove (425) is provided circumferentially on the outer wall of the fixing shaft (426). A slider (424) is slidably connected to the inner wall of the groove (425). A correction plate (421) is fixedly connected to one end of the slider (424) away from the groove (425). The positioning plate (43) is provided with a corrective element (44) on its inner wall. A limiting element (45) is provided at the end of the corrective element (44) away from the adjusting element (42). The limiting element (45) is flush with the outer wall of the positioning plate (421). The corrective component (44) includes a corrective plate (441) that fits against the limiting plate (451). The corrective plate (441) adopts an L-shaped design and is symmetrical and stacked vertically. The short rods of the two corrective plates (441) are elastically connected by a spring (442). A positioning block (443) is fixedly connected to the outside of the corrective plate (441). A spring (444) is elastically connected to the end of the positioning block (443) away from the spring (442). The spring (444) is connected to the inner wall of the etched part (1). The corrective component (44) also includes a crank (445), which has a knob spring in the middle and is symmetrically designed.

2. The vacuum two-fluid etching system for outer layer circuits according to claim 1, characterized in that: The outer wall of the correction plate (421) is designed with an arc shape. A circular groove (423) is provided at one end of the correction plate (421) near the fixed shaft (426). The inner wall of the circular groove (423) is slidably connected to the outer wall of the fixed shaft (426). The inner wall of the circular groove (423) is fixedly connected to one end of the slider (424).

3. The vacuum two-fluid etching system for outer layer circuits according to claim 2, characterized in that: The correction plate (421) has a limiting groove (422) at one end away from the fixed shaft (426), and the inner wall of the limiting groove (422) is in contact with the limiting member (45).

4. The vacuum two-fluid etching system for outer layer circuits according to claim 1, characterized in that: The limiting component (45) includes a limiting plate (451) with an arc-shaped design that fits against the inner wall of the limiting groove (422). A rubber strip (454) is fixedly connected to the other end of the limiting plate (451), and the rubber strip (454) is fixedly connected to another limiting plate (451).

5. The vacuum two-fluid etching system for outer layer circuits according to claim 4, characterized in that: An arc plate (452) is fixedly connected to the middle of one end of the limiting plate (451) near the rubber strip (454). The arc plate (452) adopts a gradient arc design, and a groove (453) is opened in the middle of the rubber strip (454).

6. The vacuum two-fluid etching system for outer layer circuits according to claim 1, characterized in that: The guide (5) includes an elliptical plate (52) disposed at the bottom center of the outlet of the etching section (1). A positioning shaft (51) is fixedly connected to the inner wall of the elliptical plate (52). A connecting plate (511) is fixedly connected to both ends of the positioning shaft (51). The end of the connecting plate (511) away from the positioning shaft (51) is embedded in the inner wall of the positioning frame (513). The positioning frame (513) is designed as a parallelogram. A connecting rod (514) is provided at both ends of the outer wall of the positioning frame (513).

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